CN107734215A - Camera module and its molding photosensory assembly and manufacture method and electronic equipment - Google Patents
Camera module and its molding photosensory assembly and manufacture method and electronic equipment Download PDFInfo
- Publication number
- CN107734215A CN107734215A CN201610668807.1A CN201610668807A CN107734215A CN 107734215 A CN107734215 A CN 107734215A CN 201610668807 A CN201610668807 A CN 201610668807A CN 107734215 A CN107734215 A CN 107734215A
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- Prior art keywords
- wiring board
- chip
- photo
- sensitive cell
- connecting portion
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 63
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- 238000005516 engineering process Methods 0.000 claims abstract description 37
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 99
- 238000005253 cladding Methods 0.000 claims description 20
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The present invention provides a camera module and its molding photosensory assembly and manufacture method and electronic equipment, the molding photosensory assembly of wherein described camera module, it includes an at least supporting member, at least a photo-sensitive cell, at least a wiring board, at least one set of lead and an at least molded base.The both ends of lead described in every group are connected to the non-photo-sensing region of each photo-sensitive cell and each wiring board respectively, each module pedestal includes a molded body and has an optical window respectively, wherein when having progress moulding technology so that the molded body is molded by a molding, each supporting member is respectively used to prevent the inner surface of the mould to apply pressure to the lead, wherein the photosensitive region of the photo-sensitive cell corresponds to the optical window.
Description
Technical field
The present invention relates to optical imaging field, a more particularly to camera module and its molding photosensory assembly and manufacture method with
And electronic equipment.
Background technology
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Car field, medical domain etc., such as camera module have become the portable electric appts such as smart mobile phone, tablet personal computer
One of standard fitting.Image can not only be obtained by being applied to the camera module of portable electric appts, but also can be helped
Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts and
User requires more and more higher, the imaging to the overall dimensions and camera module of camera module for the image quality of camera module
Ability is proposed harsher requirement.That is, the development trend of portable electric appts requires that camera module is subtracting
Further improved on the basis of few size and strengthen imaging capability.
It is well known that the raising of the imaging capability of camera module is built upon has more great achievement for camera module configuration
On the basis of the passive electronic component such as the photo-sensitive cell of image planes product and more driving resistance, electric capacity, just because of camera module needs
It is to be configured that there is the more photo-sensitive cell of big imaging area and more passive electronic components, it is desirable to which that camera module can only be by changing
The size of camera module can be reduced by entering packaging technology.The camera module packaging technology generally used now is COB (Chip
On Board) packaging technology, i.e. the wiring board of camera module, photo-sensitive cell, support etc. are made into respectively, then successively will be by
Dynamic electronic component, photo-sensitive cell and support are encapsulated in the circuit board, in order to ensure the image quality of camera module, it is necessary to every
Glue is filled between two parts, such as glue is filled so that support to be encapsulated in the circuit board between support and wiring board, and
And the leveling of support and wiring board is realized by glue, therefore, COB packaging technologies cause the size of camera module can not be effective
Ground is reduced, and the packaging efficiency of camera module is than relatively low.
In order to solve this problem, moulding technology is introduced into camera module field, and moulding technology allows camera module in quilt
Make support integrally formed in the circuit board during making, by such mode, shooting can not only be efficiently reduced
The size of module, but also the assembly error of camera module can be reduced, to improve the image quality of camera module.Although such as
This, is introduced directly into camera module field by moulding technology and remains the defects of a lot.
First, the photo-sensitive cell of camera module is mounted on wiring board and electrically connects photo-sensitive cell and circuit by lead
Plate, it is generally the case that lead both ends are respectively welded in photo-sensitive cell and wiring board, and are limited to routing technique and lead in itself
Attribute, the both ends of lead are after photo-sensitive cell and line plate is welded in, its upper table presented radian and protrude from photo-sensitive cell
Face, in the moulding process of camera module, the stitching surface of the mold of mould can be contacted and led with the ledge of lead
Cause lead to be pressurized and situation about deforming occur, once and lead deforms, after the mold of mould is removed, lead
It is difficult to recover to original state.Secondly, when being added into the molding space of mould simultaneously for forming the moulding material of support
And when support is formed by curing in molding space, the lead of deformation is covered by the inside of support and keeps shape after deformation
State, and the ability that the lead deformed transmits electric signal between photo-sensitive cell and wiring board can be reduced significantly, so that right
The imaging capability and imaging efficiency of camera module cause bigger influence.What is more important, when lead is by mold
The extruding of stitching surface and when being deformed, the deformation direction and deformation extent of lead are uncontrollable, and therefore, adjacent lead exists
It is possible that contacting with each other and causing short circuit after deformation, and then the product fraction defective of camera module is caused to increase.In addition, feeling
Optical element is mounted on after wiring board, and gap, in moulding process, flow-like can be produced between photo-sensitive cell and wiring board
Moulding material can enter and form gap between photo-sensitive cell and wiring board so that causing photo-sensitive cell and wiring board
Attaching relation is changed, and necessarily causes inclining for photo-sensitive cell if the attaching relation of photo-sensitive cell and wiring board is changed
Tiltedly, so that influenceing the image quality of camera module.
The content of the invention
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the molding photosensory assembly provides a supporting member, when carrying out moulding technology, the supporting member can avoid
The lead that one mold of a molding tool applies pressure to for connecting photo-sensitive cell and wiring board, so as to prevent the lead to be pressurized
And deform.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein when carrying out moulding technology, the mold of the mould makes the mold with mould matched moulds once
Stitching surface when being contacted with the top surface of the supporting member, the supporting member can support the mold upwards, to keep away
Exempt from the mold and directly apply pressure to the lead, deformed so as to prevent the lead to be pressurized.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein when carrying out moulding technology, the mold of the mould with the lower mould matched moulds and make described
When the stitching surface of mold contacts with the top surface of the supporting member, the supporting member can support the upper mould upwards
Tool, to reserve safe distance between the stitching surface of the lead and the mold, so as to avoid the pressing of the mold
Face directly contacts the lead.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is formed by flexible material, applied pressure to the mold in the mould
During the top surface of the supporting member, the stitching surface that the supporting member can absorb the mold is contacting the supporting member
Impulsive force caused by the top surface of part, so as to be damaged when avoiding the mold of the mould and the lower mould matched moulds
Bad photo-sensitive cell, the wiring board, the lead and the electronic component.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is formed by flexible material, applied pressure to the mold in the mould
During the supporting member, the top surface of the supporting member can be avoided by way of producing deformation in the supporting member
Gap is produced between the stitching surface of top surface and the mold, so as to be molded in a molded base of the module photosensory assembly
When avoid the phenomenon that " overlap " occurs in an optical window position of the mold base, and then advantageously ensure that the camera module exists
The image quality of yield and the guarantee camera module when packed.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is formed by the material with flexibility, applied pressure to the mold in the mould
During the supporting member, the top surface of the supporting member can be avoided by way of being deformed in the supporting member
Gap is produced between the stitching surface of top surface and the mold, so as to avoid the moulding material for forming the molded base
Entered by the contact position of the top surface of the supporting member and the stitching surface of the mold pollute or damage described in
The photosensitive region of photo-sensitive cell.That is, when carrying out moulding technology, the supporting member makes the photosensitive of the photo-sensitive cell
Region is in enclosed environment.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is formed by hard material, the stitching surface of the mold of the mould covers provided with one
Epiphragma, when the stitching surface of the mold applies pressure to the top surface of the supporting member, the cover layer is located at the upper mould
Between the top surface of the stitching surface of tool and the supporting member, on the one hand, the cover layer can be prevented in the mold
Gap is formed between stitching surface and the supporting member, on the other hand, the cover layer can avoid the mould
The photo-sensitive cell, the wiring board, the lead and electronic component are damaged when the mold and the lower mould matched moulds.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is formed by hard material, the stitching surface of the mold of the mould covers provided with one
Epiphragma, with the stitching surface in the mold of the mould apply pressure to the top surface of the supporting member when, the branch
Holding element will not be deformed, so as to prevent the lead from producing deformation to protect the good electrical of the lead.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein non-photo-sensing region of the supporting member along the photo-sensitive cell is set, with when carrying out moulding technology, institute
The moulding material connecing by the non-photo-sensing region of the supporting member and the photo-sensitive cell can be prevented by stating supporting member
Position is touched to enter the photosensitive region of the photo-sensitive cell and pollute or damage the photosensitive region of the photo-sensitive cell.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the link position for coating the lead and the photo-sensitive cell and the lead and institute is set in the supporting member
The link position of wiring board is stated, so that when carrying out moulding technology, the supporting member isolates each link position and the shaping
Material, so that each link position is more reliable.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is located at the shaping sky for forming the mold and the lower mould in the mould
In, when being formed by curing the molded base to be added into the molding space in the moulding material, the supporting member
It can stop that the moulding material of flow-like impacts the lead.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member pre-fixes the wiring board and the photo-sensitive cell, to be added into institute in the moulding material
When stating molding space and being formed by curing the molded base, the supporting member can keep the photo-sensitive cell and the circuit
Plate does not shift.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein at least a portion non-photo-sensing region for coating the photo-sensitive cell is set in the supporting member, to carry out mould
When moulding technique, the moulding material and the photosensitive region of the photo-sensitive cell is avoided to contact, to prevent the sense of the photo-sensitive cell
Light region is contaminated or is damaged.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is set while coats at least a portion of the photo-sensitive cell and the wiring board, with by
Gap between the photo-sensitive cell and the wiring board is formed at by supporting member closing, so as to carry out moulding technology
When, avoid the moulding material of flow-like from entering between the photo-sensitive cell and the wiring board.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the cladding lead is set in the supporting member, so that when carrying out moulding technology, the supporting member makes described
Lead is maintained at default optimum state.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the cladding lead is set in the supporting member, when subsequently using the camera module, can avoid miscellaneous
Astigmatism produces in the inside of the camera module and influences the image quality of the camera module.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member has viscosity, before molded base shaping, the supporting member can adhere to attachment electricity
Sub- component is in the pollutant such as welding powder caused by the wiring board, to prevent the sense of photo-sensitive cell described in these contaminants
Light region and there is dirty bad point.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the both ends of the lead are connected to the chip contacts of the photo-sensitive cell and the circuit of the wiring board respectively
Plate connector, the top surface of the supporting member is higher than the chip contacts of the photo-sensitive cell, so as to by described
When mould carries out moulding technology, the chip contacts of the photo-sensitive cell will not be damaged.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member coats the chip contacts of the photo-sensitive cell, when carrying out moulding technology, to avoid
The moulding material contacts the chip contacts of the photo-sensitive cell, so as to protect the chip of the photo-sensitive cell to connect
Fitting.
It is an object of the present invention to provide a camera module and its molding photosensory assembly and manufacture method and electronics
Equipment, wherein the supporting member is arranged on the outside of the chip contacts of the photo-sensitive cell, to carry out molding work
During skill, the moulding material is avoided to contact the chip contacts of the photo-sensitive cell, so as to protect the photo-sensitive cell
The chip contacts.
One side under this invention, the present invention provide the molding photosensory assembly of a camera module, and it includes：
At least supporting member formed by first medium；
An at least photo-sensitive cell；
An at least wiring board；
At least one set of lead, wherein the both ends of lead described in every group are connected to the chip of each photo-sensitive cell respectively
The wiring board connector of connector and each wiring board；And
At least molded base formed by second medium, wherein each molded base includes a molded body respectively
With with an at least optical window, wherein by a molding have carry out moulding technology so that the molded body be molded when, each
The supporting member is respectively used to prevent the stitching surface of the mould to apply pressure to the lead, wherein the photo-sensitive cell
Photosensitive region corresponds to the optical window.
According to one embodiment of present invention, each supporting member includes the supporting main body of a frame shape and had respectively
One through hole, the supporting main body coat at least a portion in the non-photo-sensing region of the photo-sensitive cell, the sense of the photo-sensitive cell
Light region corresponds to the through hole, wherein the supporting main body has a top surface, a medial surface and a lateral surface, the branch
The top surface for holding main body is inwardly or outwardly each extended over to be connected to the medial surface and the lateral surface, the medial surface
The through hole is formed, wherein when carrying out moulding technology, the stitching surface of the mould and the institute of the supporting main body
State top surface contact.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell include a chip inside portion,
One chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip
Connecting portion, the chip inside portion and the chip outside portion are located at the inner side and outer side of the chip connecting portion respectively, wherein
The supporting main body coats at least a portion of the chip inside portion of the photo-sensitive cell.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell include a chip inside portion,
One chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip
Connecting portion, the chip inside portion and the chip outside portion are located at the inner side and outer side of the chip connecting portion respectively, wherein
At least a portion of the chip inside portion of the supporting main body cladding photo-sensitive cell and the chip connecting portion are extremely
A few part.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell include a chip inside portion,
One chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip
Connecting portion, the chip inside portion and the chip outside portion are located at the inner side and outer side of the chip connecting portion respectively, wherein
The supporting main body coats at least a portion of the chip inside portion of the photo-sensitive cell, the chip connecting portion and described
At least a portion of chip exterior.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell include a chip inside portion,
One chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip
Connecting portion, the chip inside portion and the chip outside portion are located at the inner side and outer side of the chip connecting portion respectively, wherein
At least a portion of the chip connecting portion of the supporting main body cladding photo-sensitive cell and the chip outside portion are extremely
A few part.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell include a chip inside portion,
One chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip
Connecting portion, the chip inside portion and the chip outside portion are located at the inner side and outer side of the chip connecting portion respectively, wherein
The supporting main body coats at least a portion of the chip outside portion of the photo-sensitive cell.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell include a chip inside portion,
One chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip
Connecting portion, the chip inside portion and the chip outside portion are respectively formed in the inner side and outer side of the chip connecting portion, its
Described in support at least a portion that main body coats the chip connecting portion of the photo-sensitive cell.
According to one embodiment of present invention, each supporting member includes the supporting main body of a frame shape and had respectively
One through hole, the supporting main body coat at least a portion of the fringe region of the wiring board, the photosensitive area of the photo-sensitive cell
Domain corresponds to the through hole, wherein the supporting main body has a top surface, a medial surface and a lateral surface, the supporting master
The top surface of body is inwardly or outwardly each extended over to be connected to the medial surface and lateral surface, and the medial surface forms described
Through hole, wherein when carrying out moulding technology, the top surface of the stitching surface of the mould and the supporting main body
Contact.
According to one embodiment of present invention, at least one for supporting main body and further coating the photo-sensitive cell
Point.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of road plate inside portion and at least a portion of the chip outside portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of at least a portion of road plate inside portion, the chip outside portion and the chip connecting portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of road plate inside portion, the chip outside portion, at least the one of the chip connecting portion and the chip inside portion
Part.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of at least a portion of road plate connecting portion, the wiring board inside portion and the chip outside portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of road plate outside portion, the wiring board connecting portion, the wiring board inside portion and the chip outside portion are extremely
A few part.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of road plate connecting portion, the wiring board inside portion, the chip outside portion and the chip connecting portion are at least
A part.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of road plate connecting portion, the wiring board inside portion, the chip outside portion, the chip connecting portion and the core
At least a portion of piece inside portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
At least a portion of road plate outside portion, the wiring board connecting portion, the wiring board inside portion, the chip outside portion and described
At least a portion of chip connecting portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector of the wiring board is arranged at the line
Road plate connecting portion, the wiring board inside portion and the wiring board outside portion respectively positioned at the wiring board connecting portion inner side and
Outside, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connecting portion and a chip
Outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, the chip inside portion
It is located at the inner side and outer side of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the line
It is at least a portion of road plate outside portion, the wiring board connecting portion, the wiring board inside portion, the chip outside portion, described
Chip connecting portion and at least a portion of the chip inside portion.
According to one embodiment of present invention, the lateral surface of the molded body cladding supporting main body.
According to one embodiment of present invention, the molded body further coats the top surface of the supporting main body
At least a portion.
According to one embodiment of present invention, the height of the supporting member is upward greater than the lead
Height.
According to one embodiment of present invention, the height of the supporting member height upward less than the lead.
According to one embodiment of present invention, the supporting member is flexible.
According to one embodiment of present invention, the supporting member has viscosity.
According to another aspect of the present invention, the present invention further provides the molding photosensory assembly of a camera module, it is wrapped
Include：
An at least photo-sensitive cell；
An at least wiring board；
At least one set of lead, wherein the chip that the both ends of lead described in every group are connected to each photo-sensitive cell connects
The wiring board connector of fitting and each wiring board；
An at least supporting member, wherein at least one of lead described in every group of cladding is set in each supporting member
Point；And
An at least molded base, wherein each molded base includes a molded body and has an at least light respectively
Window, wherein the molded body coat after shaping the wiring board fringe region and at least one of the supporting member
Point, the photosensitive region of each photo-sensitive cell corresponds respectively to the optical window of each molded base.
According to one embodiment of present invention, the supporting member includes a supporting main body and a through hole, the supporting master
Body has a top surface, a medial surface and a lateral surface, and the top surface of the supporting main body inwardly or outwardly prolongs respectively
Stretch to be connected to the medial surface and the lateral surface, the medial surface forms the through hole, wherein the supporting main body is set
At least a portion for coating the lead is put, the photo-sensitive cell corresponds to the through hole, and the molded body coats the branch
Hold the lateral surface of main body.
According to one embodiment of present invention, the molded base further comprises the top surface of the supporting main body
At least a portion.
According to another aspect of the present invention, the camera module for molding photosensory assembly is carried the present invention further provides one,
It includes：
An at least optical lens；With
At least one molding photosensory assembly, wherein each molding photosensory assembly further comprises respectively：
The supporting member formed by first medium；
One photo-sensitive cell；
One wiring board；
One group of lead, wherein the both ends of each lead be connected to respectively the photo-sensitive cell chip contacts and
The wiring board connector of the wiring board；And
The molded base formed by second medium, wherein the molded base includes a molded body and has a light
Window, wherein when having progress moulding technology so that the molded body is molded by a molding, the supporting member is used to hinder
Only the stitching surface of the mould applies pressure to the lead, wherein the photosensitive region of the photo-sensitive cell corresponds to the light
Window, wherein each optical lens is arranged at the photosensitive road of the photo-sensitive cell of each molding photosensory assembly respectively
Footpath.
According to one embodiment of present invention, the camera module further comprises an at least driver, wherein each institute
State optical lens and be assembled in each driver respectively, each driver is assembled in each molding sense respectively
The top surface of the molded body of optical assembly.
According to one embodiment of present invention, the camera module further comprises an at least filter element, wherein each
The filter element is arranged at the photo-sensitive cell of each optical lens and each molding photosensory assembly respectively
Between.
According to one embodiment of present invention, each filter element is assembled in each photosensitive group of molding respectively
The top surface of the molded body of part.
According to one embodiment of present invention, the top surface of the molded body has an inner surface and an outside table
Face, wherein the plane where the inner surface is less than the plane where the outer surface, so that the molded body is formed
One groove, the filter element are assembled in the inner surface of the molded body and are located at the groove, the drive
Dynamic device is assembled in the outer surface of the module main body.
According to another aspect of the present invention, the camera module for molding photosensory assembly is carried the present invention further provides one,
It includes：
An at least optical lens；With
At least one molding photosensory assembly, wherein each molding photosensory assembly further comprises respectively：
One photo-sensitive cell；
One wiring board；
One group of lead, wherein the both ends of each lead are connected to chip contacts and the institute of the photo-sensitive cell
State the wiring board connector of wiring board；
One supporting member, wherein at least a portion of each lead of cladding is set in the supporting member；And
One molded base, wherein the molded base includes a molded body and has an optical window, wherein the molding master
Body coats the fringe region of the wiring board and at least a portion of the supporting member after shaping, each photo-sensitive cell
Photosensitive region correspond respectively to the optical window of the molded base, wherein each optical lens is arranged at often respectively
The photosensitive path of the photo-sensitive cell of the individual molding photosensory assembly.
According to one embodiment of present invention, the camera module is to focus camera module.
According to one embodiment of present invention, the camera module is zoom camera module.
According to another aspect of the present invention, the present invention further provides an electronic equipment, it includes：
One electronic equipment body；With
An at least camera module, wherein each camera module is arranged at the electronic equipment body respectively, with
In obtaining image, wherein each camera module further comprises an at least optical lens and at least one photosensitive group of molding respectively
Part, the molding photosensory assembly include a supporting member, a photo-sensitive cell, a wiring board, one group of lead and a molded base, its
In the both ends of each lead be connected to the chip contacts of the photo-sensitive cell and the wiring board of the wiring board respectively
Connector, wherein the molded base includes a molded body and has an optical window, wherein carrying out mould having by a molding
When moulding technique so that the molded body is molded, the supporting member is used to prevent the stitching surface of the mould from applying pressure to institute
Lead is stated, wherein the photosensitive region of the photo-sensitive cell corresponds to the optical window, wherein each optical lens is set respectively
It is placed in the photosensitive path of the photo-sensitive cell of each molding photosensory assembly.
According to another aspect of the present invention, the present invention further provides the manufacture method of a molding photosensory assembly, wherein
The manufacture method comprises the following steps：
(a) photo-sensitive cell and a wiring board are connected by one group of lead；
(b) photo-sensitive cell and the wiring board are positioned over to the mold or once mould of a molding tool；
(c) during the mold and the lower mould matched moulds, supported upwards on described by a supporting member
Mould, to prevent the stitching surface of the mold from applying pressure to lead described in every group；And
(d) forming material of flow-like is added into the molding space formed between the mold and the lower mould
Material, to form a molded base after the mold material cures, wherein the molded base includes a molding body and had
One optical window, wherein at least a portion of the fringe region of the molded body cladding wiring board and the supporting member are extremely
A few part.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
Piece inside portion is glued, to form the supporting main body and a through hole of a frame shape of the supporting member, the sense after glue curing
The photosensitive region of optical element corresponds to the through hole, wherein the stitching surface of the mold and the top table of the supporting main body
Face contacts, so that the supporting main body supports the mold upwards, wherein in the step (d), the molded body exists
Coated after formation the fringe region of the wiring board, the photo-sensitive cell the non-photo-sensing region chip outside portion and
The lateral surface of chip connecting portion and the supporting main body.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
Piece connecting portion is glued, to form the supporting main body and a through hole of a frame shape of the supporting member, the sense after glue curing
The photosensitive region of optical element corresponds to the through hole, wherein the stitching surface of the mold and the top table of the supporting main body
Face contacts, so that the supporting main body supports the mold upwards, wherein in the step (d), the molded body exists
Coated after formation the fringe region of the wiring board, the photo-sensitive cell the non-photo-sensing region chip outside portion with
And the lateral surface of the supporting main body.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
Piece outside portion is glued, to form the supporting main body and a through hole of a frame shape of the supporting member, the sense after glue curing
The photosensitive region of optical element corresponds to the through hole, wherein the stitching surface of the mold and the top table of the supporting main body
Face contacts, so that the supporting main body supports the mold upwards, wherein in the step (d), the molded body exists
The fringe region of the wiring board and the lateral surface of the supporting main body are coated after formation.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
Piece inside portion and the applying glue of chip connecting portion, to form the supporting main body and one of a frame shape of the supporting member after glue curing
Through hole, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the stitching surface of the mold and the branch
The top surface contact of main body is held, so that the supporting main body supports the mold upwards, wherein in the step (d), institute
State the non-photo-sensing region that molded body coats the fringe region of the wiring board, the photo-sensitive cell after its formation
Chip outside portion and the lateral surface of the supporting main body.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
Piece connecting portion and the applying glue of chip outside portion, to form the supporting main body and one of a frame shape of the supporting member after glue curing
Through hole, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the stitching surface of the mold and the branch
The top surface contact of main body is held, so that the supporting main body supports the mold upwards, wherein in the step (d), institute
State molded body and coat the fringe region of the wiring board and the lateral surface of the supporting main body after its formation.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
Piece inside portion, chip connecting portion and chip outside portion applying glue, to form a frame of the supporting member after glue curing
The supporting main body and a through hole of shape, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the institute of the mold
The top surface contact of stitching surface and the supporting main body is stated, so that the supporting main body supports the mold upwards, wherein
In the step (d), the molded body coats the fringe region of the wiring board and the supporting main body after its formation
Lateral surface.
According to one embodiment of present invention, in the step (c), in the line of the fringe region of the wiring board
Road plate inside portion is glued, described to form the supporting main body and a through hole of a frame shape of the supporting member after glue curing
The photosensitive region of photo-sensitive cell corresponds to the through hole, wherein the top of the stitching surface of the mold and the supporting main body
Surface contacts, so that the supporting main body supports the mold upwards, wherein in the step (d), the molded body
Wiring board outside portion, wiring board connecting portion and the supporting master of the fringe region of the wiring board are coated after its formation
The lateral surface of body.
According to one embodiment of present invention, in the step (c), in the line of the fringe region of the wiring board
Road plate connecting portion applying glue, it is described to form the supporting main body and a through hole of a frame shape of the supporting member after glue curing
The photosensitive region of photo-sensitive cell corresponds to the through hole, wherein the top of the stitching surface of the mold and the supporting main body
Surface contacts, so that the supporting main body supports the mold upwards, wherein in the step (d), the molded body
The wiring board outside portion of the fringe region of the wiring board and the lateral surface of the supporting main body are coated after its formation.
According to one embodiment of present invention, in the step (c), in the line of the fringe region of the wiring board
Road plate outside portion is glued, described to form the supporting main body and a through hole of a frame shape of the supporting member after glue curing
The photosensitive region of photo-sensitive cell corresponds to the through hole, wherein the top of the stitching surface of the mold and the supporting main body
Surface contacts, so that the supporting main body supports the mold upwards, wherein in the step (d), the molded body
The wiring board outside portion of the fringe region of the wiring board and the lateral surface of the supporting main body are coated after its formation.
According to one embodiment of present invention, in the step (c), in the line of the fringe region of the wiring board
Road plate inside portion and the applying glue of wiring board connecting portion, to form the supporting main body of a frame shape of the supporting member after glue curing
With a through hole, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the stitching surface of the mold and institute
The top surface contact of supporting main body is stated, so that the supporting main body supports the mold upwards, wherein in the step (d)
In, the molded body coats the wiring board outside portion of the fringe region of the wiring board and the supporting master after its formation
The lateral surface of body.
According to one embodiment of present invention, in the step (c), in the line of the fringe region of the wiring board
Road plate connecting portion and the applying glue of wiring board outside portion, to form the supporting main body of a frame shape of the supporting member after glue curing
With a through hole, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the stitching surface of the mold and institute
The top surface contact of supporting main body is stated, so that the supporting main body supports the mold upwards, wherein in the step (d)
In, the molded body coats the wiring board outside portion of the fringe region of the wiring board and the branch after its formation
Hold the lateral surface of main body.
According to one embodiment of present invention, in the step (c), in the line of the fringe region of the wiring board
Road plate inside portion, wiring board connecting portion and the applying glue of wiring board outside portion, to form the one of the supporting member after glue curing
The supporting main body and a through hole of frame shape, the photosensitive region of the photo-sensitive cell correspond to the through hole, wherein the mold
The top surface contact of the stitching surface and the supporting main body, so that the supporting main body supports the mold upwards, wherein
In the step (d), the molded body coats the wiring board of the fringe region of the wiring board after its formation
Outside portion and the lateral surface of the supporting main body.
According to one embodiment of present invention, in the step (c), the fringe region and institute in the wiring board
The chip outside portion applying glue in the non-photo-sensing region of photo-sensitive cell is stated, to form a frame shape of the supporting member after glue curing
Supporting main body and a through hole, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the mold is described
The top surface contact of stitching surface and the supporting main body, so that the supporting main body supports the mold upwards, wherein in institute
State in step (d), the molded body coats the fringe region of the wiring board and the supporting main body after its formation
Lateral surface.
According to one embodiment of present invention, in the step (c), the fringe region and institute in the wiring board
Chip outside portion and the applying glue of chip connecting portion in the non-photo-sensing region of photo-sensitive cell are stated, to form the supporting after glue curing
The supporting main body and a through hole of one frame shape of element, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein described
The top surface contact of the stitching surface of mold and the supporting main body, so that the supporting main body supports the upper mould upwards
Tool, wherein in the step (d), the molded body coats the fringe region of the wiring board and described after its formation
Support the lateral surface of main body.
According to one embodiment of present invention, in the step (c), the fringe region and institute in the wiring board
Chip outside portion, chip connecting portion and the applying glue of chip inside portion in the non-photo-sensing region of photo-sensitive cell are stated, with after glue curing
The supporting main body and a through hole of a frame shape of the supporting member are formed, the photosensitive region of the photo-sensitive cell corresponds to described lead to
Hole, wherein the top surface contact of the stitching surface of the mold and the supporting main body, so that the supporting main body is upward
The mold is supported, wherein in the step (d), the molded body coats the side of the wiring board after its formation
Edge region and the lateral surface of the supporting main body.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
Apply the wiring board inside portion of the fringe region of piece inside portion, chip connecting portion and chip outside portion and the wiring board
Glue, to form the supporting main body and a through hole of a frame shape of the supporting member, the sense of the photo-sensitive cell after glue curing
Light region corresponds to the through hole, wherein the top surface contact of the stitching surface of the mold and the supporting main body, with
The supporting main body is set to support the mold upwards, wherein in the step (d), the molded body coats after its formation
Wiring board outside portion, wiring board connecting portion and the lateral surface for supporting main body of the fringe region of the wiring board.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
The wiring board inside portion of the fringe region of piece inside portion, chip connecting portion and chip outside portion and the wiring board and line
Road plate connecting portion applying glue, it is described to form the supporting main body and a through hole of a frame shape of the supporting member after glue curing
The photosensitive region of photo-sensitive cell corresponds to the through hole, wherein the top of the stitching surface of the mold and the supporting main body
Surface contacts, so that the supporting main body supports the mold upwards, wherein in the step (d), the molded body
The wiring board outside portion of the fringe region of the wiring board and the lateral surface of the supporting main body are coated after its formation.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
The wiring board inside portion of the fringe region of piece inside portion, chip connecting portion and chip inside portion and wiring board, wiring board
Connecting portion and the applying glue of wiring board outside portion, to form the supporting main body and one of a frame shape of the supporting member after glue curing
Through hole, the photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the stitching surface of the mold and the branch
The top surface contact of main body is held, so that the supporting main body supports the mold upwards, wherein in the step (d), institute
State molded body and coat the fringe region of the wiring board and the lateral surface of the supporting main body after its formation.
According to one embodiment of present invention, in the step (c), the core in the non-photo-sensing region of the photo-sensitive cell
The wiring board connecting portion of the fringe region of piece connecting portion and chip outside portion and the wiring board and wiring board inside portion
Applying glue, to form the supporting main body and a through hole of a frame shape of the supporting member after glue curing, the photo-sensitive cell
Photosensitive region corresponds to the through hole, wherein the top surface contact of the stitching surface of the mold and the supporting main body,
So that the supporting main body supports the mold upwards, wherein in the step (d), the molded body is wrapped after its formation
Cover the wiring board outside portion of the fringe region of the wiring board and the lateral surface of the supporting main body.
According to one embodiment of present invention, in the step (c), the molded body further coats after its formation
At least a portion of the top surface of the supporting main body.
According to one embodiment of present invention, in the step (c), the height of the supporting main body is made to draw higher than described
The upward height of line, to reserve safe distance between the lead and the stitching surface of the mold.
According to one embodiment of present invention, in the step (c), the height of the supporting main body is made to draw higher than described
The upward height of line, to reserve safe distance between the lead and the stitching surface of the mold.
According to one embodiment of present invention, in the step (c), when the stitching surface of the mold applies pressure to
During the top surface of the supporting main body, the top surface of the supporting main body produces deformation so that the pressure of the mold
Conjunction face is brought into close contact in the top surface of the supporting main body, so that the photosensitive region of the photo-sensitive cell is in a sealing
Environment, wherein in the step (d), the supporting main body prevents the moulding material from entering the sealed environment, so that institute
The molded body that moulding material forms the lateral surface for coating the supporting main body after hardening is stated, and in the supporting
The medial surface of main body forms the optical window.
According to one embodiment of present invention, in the step (c), when the stitching surface of the mold applies pressure to
During the top surface of the supporting main body, the top surface of the supporting main body produces deformation so that the pressure of the mold
Conjunction face is brought into close contact in the top surface of the supporting main body, so that the photosensitive region of the photo-sensitive cell is in a sealing
Environment, wherein in the step (d), the supporting main body prevents the moulding material from entering the sealed environment, so that institute
State moulding material formed after hardening coat it is described supporting main body the lateral surface and the top surface it is at least one of
The molded body, and form the optical window in the medial surface of the supporting main body.
In the step (c), the mold the stitching surface and it is described supporting main body the top surface it
Between a cover layer is set, with prevent the mold the stitching surface and it is described supporting main body the top surface between produce
Raw gap, so that the photosensitive region of the photo-sensitive cell is in a sealed environment, wherein in the step (d), the branch
Holding main body prevents the moulding material from entering the sealed environment, so that the moulding material forms the cladding branch after hardening
The molded body of the lateral surface of main body is held, and the optical window is formed in the medial surface of the supporting main body.
According to another aspect of the present invention, the present invention further provides the manufacture method of a molding photosensory assembly, wherein
The manufacture method comprises the following steps：
(A) photo-sensitive cell and a wiring board are connected by one group of lead；
(B) lead is coated at least in part by a supporting member, to form a molding photosensory assembly semi-finished product；
(C) the molding photosensory assembly semi-finished product are positioned over to the mold or once mould of a molding tool, its
During the mold and the lower mould matched moulds, the supporting member supports the mold to prevent upwards
The stitching surface for stating mold applies pressure to the lead；And
(D) forming material of flow-like is added into the molding space formed between the mold and the lower mould
Material, to form a molded base after the mold material cures, wherein the molded base includes a molded body and had
One optical window, the molded body coat the fringe region of the wiring board and at least a portion of the supporting member, the sense
The photosensitive region of optical element corresponds to the optical window.
According to one embodiment of present invention, in the step (D), the molded body cladding supporting main body
At least a portion of lateral surface and top surface.
According to another aspect of the present invention, the present invention further provides the manufacture method of a molding photosensory assembly, wherein
The manufacture method comprises the following steps：
(h) photo-sensitive cell is mounted on a wiring board；
(i) photo-sensitive cell and the wiring board are pre-fixed by a supporting member, so that a molding photosensory assembly is made
Semi-finished product, and the supporting member prevents to produce gap between the photo-sensitive cell and the wiring board；
(j) the molding photosensory assembly semi-finished product are positioned over to the mold or once mould of a molding tool, with
In the mold and the lower mould matched moulds, the shaping that a ring-type is formed between the mold and the lower mould is empty
Between；And
(k) moulding material of flow-like is added into the molding space, to form institute after the mold material cures
Molded base is stated, wherein the molded base includes a molded body and has an optical window, the molded body coats the line
At least a portion of the fringe region of road plate and the supporting member, the photosensitive region of the photo-sensitive cell correspond to the light
Window.
According to another aspect of the present invention, the present invention further provides the manufacture method of a molding photosensory assembly, wherein
The manufacture method comprises the following steps：
(H) chip contacts of a photo-sensitive cell and the wiring board connector of a wiring board are connected to by one group of lead；
(I) photo-sensitive cell and the wiring board are positioned over to the mold or once mould of a molding tool,
With the mold and the lower mould matched moulds when, formed between the mold and the lower mould ring-type into
Type space；；
(J) when adding the moulding material of flow-like to the molding space, by positioned at one of the molding space
Hold element and reduce impulsive force caused by the moulding material by way of stopping the moulding material to caused by the lead
Influence；And
(K) molded base is formed after the mold material cures, wherein the molded base includes a molded body
With with an optical window, wherein the molded body coats the fringe region of the wiring board, the supporting member and described photosensitive
At least a portion in the non-photo-sensing region of element.
Brief description of the drawings
Fig. 1 is the schematic diagram of one of the manufacturing step of a camera module of a preferred embodiment under this invention, wherein institute
The photo-sensitive cell for stating camera module is mounted on wiring board, and the non-photo-sensing region of the photo-sensitive cell and the wiring board lead to
Cross one group of lead connection.
Fig. 2A and Fig. 2 B are showing for the two of the manufacturing step of the camera module of above-mentioned preferred embodiment under this invention
It is intended to, wherein a supporting member of the camera module is arranged at the non-photo-sensing region of the photo-sensitive cell.
Fig. 3 A are three schematic diagrames of the manufacturing step of the camera module of above-mentioned preferred embodiment under this invention, its
Described in wiring board, the photo-sensitive cell and the supporting member be placed on the mold and once mould of a molding tool
Between, and the mold applies pressure to the supporting member.
Fig. 3 B are the deformations of the three of the manufacturing step of the camera module of above-mentioned preferred embodiment under this invention
The schematic diagram of embodiment, wherein the wiring board, the photo-sensitive cell and the supporting member are placed on a molding tool
A mold and once between mould, and a covering is provided between the stitching surface and the supporting member of the mold
Film.
Fig. 4 is four schematic diagram of the manufacturing step of the camera module of above-mentioned preferred embodiment under this invention, its
In the moulding material of a molded base that is used to form the camera module be added into be formed in the mold and the lower mould
A molding space between tool.
Fig. 5 is five schematic diagram of the manufacturing step of the camera module of above-mentioned preferred embodiment under this invention, its
Described in form the molded base after mold material cures.
Fig. 6 is six schematic diagram of the manufacturing step of the camera module of above-mentioned preferred embodiment under this invention, its
Described in a filter element of camera module be assembled into the molded base.
Fig. 7 is seven schematic diagram of the manufacturing step of the camera module of above-mentioned preferred embodiment under this invention, its
Described in an optical lens of camera module be assembled in a driver, the driver is assembled in the molded base, with
The camera module is made.
Fig. 8 is the signal of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention
Figure.
Fig. 9 A are first of a molding photosensory assembly of the camera module of above-mentioned preferred embodiment under this invention
The schematic diagram of variant embodiment.
Fig. 9 B are the second of the molding photosensory assembly of the camera module of above-mentioned preferred embodiment under this invention
The schematic diagram of individual variant embodiment.
Fig. 9 C are the 3 of the molding photosensory assembly of the camera module of above-mentioned preferred embodiment under this invention
The schematic diagram of individual variant embodiment.
Figure 10 A are the 4 of the molding photosensory assembly of the camera module of above-mentioned preferred embodiment under this invention
The schematic diagram of individual variant embodiment.
Figure 10 B are the 5 of the molding photosensory assembly of the camera module of above-mentioned preferred embodiment under this invention
The schematic diagram of individual variant embodiment.
Figure 11 is the 6 of the module photosensory assembly of the camera module of above-mentioned preferred embodiment under this invention
The schematic diagram of individual variant embodiment.
Figure 12 is the signal of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention
Figure.
Figure 13 is showing for another variant embodiment of the camera module of above-mentioned preferred embodiment under this invention
It is intended to.
Figure 14 is the block diagram representation of the electronic equipment of above-mentioned camera module one with the present invention.
Embodiment
Describe to be used to disclose the present invention below so that those skilled in the art can realize the present invention.It is excellent in describing below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Define in the following description
General principle of the invention can apply to other embodiments, deformation program, improvement project, equivalent and do not carry on the back
From the other technologies scheme of the spirit and scope of the present invention.
It will be understood by those skilled in the art that the present invention exposure in, term " longitudinal direction ", " transverse direction ", " on ",
" under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instruction such as " outer " or position close
System is to be based on orientation shown in the drawings or position relationship, and it is for only for ease of the description present invention and simplifies description, without referring to
Show or imply that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, therefore above-mentioned art
Language is not considered as limiting the invention.
It is understood that term " one " be interpreted as " at least one " or " one or more ", i.e., in one embodiment,
The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no
It is understood that as the limitation to quantity.
With reference to Fig. 1 to Fig. 7 of the Figure of description of the present invention, the camera module of a preferred embodiment under this invention is explained
It is bright, wherein the camera module includes an at least optical lens 10 and at least one molding photosensory assembly 20.Each molding sense
Optical assembly 20 further comprises a photo-sensitive cell 21, a wiring board 22, a molded base 23 and one group of lead 24 respectively, each
The both ends of the lead 24 are each extended over to be connected to the non-photo-sensing region of each photo-sensitive cell 21 and each line
Road plate 22, each molded base 23 is at least integrally formed in each wiring board 22 respectively, so that the molding base
Seat 23 and the wiring board 22 form integral structure, and each optical lens 10 is arranged at each molding sense respectively
The photosensitive path of the photo-sensitive cell 21 of optical assembly 20.The light being reflected by the object enters institute from each optical lens 10
The inside of camera module is stated, subsequently to receive and carry out photoelectric conversion by each photo-sensitive cell 21, so as to obtain and thing
The image of body phase association.
It is noted that the photo-sensitive cell 21 has one group of chip contacts 211, the wiring board 22 has one group
Wiring board connector 221, wherein the both ends of each lead 24 can be connected to each of the photo-sensitive cell 21 respectively
Each wiring board connector 221 of the chip contacts 211 and the wiring board 22, is made by above-mentioned such mode
The photo-sensitive cell 21 and the wiring board 22 are connected.The present invention an example in, the photo-sensitive cell 21 it is each
Each wiring board connector 221 of the chip contacts 211 and the wiring board 22 can be terminal pad, i.e. described
Each wiring board connector 221 of each chip contacts 211 and the wiring board 22 of photo-sensitive cell 21 can be with
It is disc-shaped respectively, for making the both ends of each lead 24 be connected to each chip of the photo-sensitive cell 21
Each wiring board connector 221 of connector 211 and the wiring board 22.It is described in another example of the present invention
Each wiring board connector 221 of each chip contacts 211 and the wiring board 22 of photo-sensitive cell 21 can be with
Spherical, for example, by tin cream or other welding materials point in the photo-sensitive cell 21 and the wiring board 22 to be formed respectively
The chip contacts 211 of the photo-sensitive cell 21 and the wiring board connector 221 of the wiring board 22.Although such as
This, the shape of the chip contacts 211 of the photo-sensitive cell 21 and the wiring board connector 221 of the wiring board 22
It is not intended to limit present disclosure and scope.
The photo-sensitive cell 21 includes a photosensitive region 212 and a non-photo-sensing region 213, wherein the photo-sensitive cell 21
The photosensitive region 212 and the non-photo-sensing region 213 are integrally formed, and the photosensitive region 212 is positioned at described photosensitive
The middle part of element 21, the non-photo-sensing region 213 are located at the outside of the photo-sensitive cell 21, and the non-photo-sensing region 213
Around the photosensitive region 212 1 weeks.The light being reflected by the object enters in the camera module from the optical lens 10
Behind portion, photoelectric conversion can be received and carried out by the photosensitive region 212 of the photo-sensitive cell 21, it is related to object to obtain
The image of connection.
It will be appreciated by those skilled in the art that each quilt of chip contacts 211 of the photo-sensitive cell 21
It is arranged at the non-photo-sensing region 213 of the photo-sensitive cell 21.In addition, the non-photo-sensing region of the photo-sensitive cell 21
213 have a chip inside portion 2131, a chip connecting portion 2132 and a chip outside portion 2133, wherein on the inside of the chip
Portion 2131 surrounds the photosensitive region 212 1 weeks, and the both sides of the chip connecting portion 2132 each extend over and are connected to the core
Piece inside portion 2131 and the chip outside portion 2132.That is, by the non-photo-sensing region 213 from the core is set
The region of the position of piece connector 211 to the position at the edge of the photosensitive region 212 is defined as the chip inside portion 2131,
The region that the chip contacts 211 are set in the non-photo-sensing region 213 is defined as the chip connecting portion 2132, will
The non-photo-sensing region 213 from the positions of the chip contacts 211 is set to the outer edge of the photo-sensitive cell 21
The region of position is defined as the chip outside portion 2132.In other words, it is described from the point of view of the vertical view visual angle of the photo-sensitive cell 21
Photo-sensitive cell 21 is the chip outside portion 2133, the chip connecting portion 2132, the chip inside portion successively from outside to inside
2131 and the photosensitive region 212.
In addition, the wiring board 22 includes a smooth fringe region 223 of chip attachment region 222 and one, wherein described
Fringe region 223 is integrally formed with the chip attachment region 222, and the fringe region 223 is located at chip patch
Fill around region 222.The chip attachment region 222 be used to mount the photo-sensitive cell 21, the wiring board connector
221 are arranged at the fringe region 223.The fringe region 223 of the wiring board 22 has a wiring board inside portion
2231st, a wiring board connecting portion 2232 and a wiring board outside portion 2233, wherein the wiring board inside portion 2231 surrounds institute
State chip attachment region 222 1 weeks, the both sides of the wiring board connecting portion 2232 each extend over and are connected in the wiring board
Sidepiece 2231 and the wiring board outside portion 2233.That is, by the fringe region 223 from the wiring board is set
The region of the position of connector 221 to the position at the edge in the chip attachment region 222 is defined as the wiring board inside portion
2231, the region that the wiring board connector 221 is set of the fringe region 223 is defined as the wiring board connecting portion
2232, by the fringe region 223 from the position of the wiring board connector 221 is set to the fringe region 223
The region of the position of outer edge is defined as the wiring board outside portion 2233.In other words, from the vertical view visual angle of the wiring board 22
From the point of view of, the wiring board 22 is the wiring board outside portion 2233 successively from inside to outside, the wiring board connecting portion 2232, described
Wiring board inside portion 2231 and the chip attachment region 222A.The camera module of the type of the lead 24 in the present invention
In it is unrestricted, such as in a specific example, the lead 24 may be implemented as gold thread, i.e. by the side for beating gold thread
Formula can link together the photo-sensitive cell 21 and the wiring board 22, so as to which the photo-sensitive cell 21 turns by optical signal
After turning to electric signal, the electric signal can be further transmitted to the wiring board 22 by the lead 24.This area
Technical staff it is understood that in other examples of the camera module, the lead 24 can also be implemented as silver wire,
Any material that can realize that the electric signal transmits between the photo-sensitive cell 21 and the wiring board 22 such as copper cash is made.
In addition, in one example, the camera module may be implemented as one and focus camera module, wherein described take the photograph
As module by being assembled in a microscope base of the molded base 23 makes the optical lens 10 be maintained at the photosensitive member
The photosensitive path of part 21.
In another example, the camera module may be implemented as a zoom camera module, wherein the shooting
Module adjusts the focal length of the camera module by changing the distance of the optical lens 10 and the photo-sensitive cell 21.Specifically
Ground is said, in this example shown in Fig. 7, the camera module further comprises an at least driver 30, wherein each described
Optical lens 10 is arranged in correspondence with each driver 30 respectively, and each driver 30 is assembled in each respectively
The molded base 23, and each driver 30 is electrically connected to each wiring board 22 respectively, with the line
Road plate 22 transmits electric energy and control signal to the driver 30, and the driver 30 can drive the optical lens 10
Photosensitive path along the photo-sensitive cell 21 moves back and forth, so as to adjust the focal length of the camera module.It is that is, described
Optical lens 10 is driveably arranged at the driver 30.
It is noted that the type of the driver 30 is unrestricted in the camera module of the present invention, such as
In a specific example, the driver 30 may be implemented as that voice coil motor etc. is any can to drive the optical frames
First 10 produce the driver of displacement along the photosensitive path of the photo-sensitive cell 21, wherein the driver 30 can receive electric energy
With control signal with running order.
Further, with reference to shown in figure 7, the camera module further comprises an at least filter element 40, wherein each
The filter element 40 is assembled in each molded base 23 respectively, and each filter element 40 is respectively positioned at every
The photosensitive path of the individual photo-sensitive cell 21.The light being reflected by the object enters the camera module from the optical lens 10
Inside, and can receive and carry out photoelectric conversion by the photo-sensitive cell 21 after being filtered by the filter element 40.Also
It is to say, the filter element 40 can filter being reflected by the object from the optical lens 10 into the inside of the camera module
Light in veiling glare, such as infrared part, by such mode, the image quality of the camera module can be changed.
It will be appreciated by those skilled in the art that in the different examples of the camera module, the filter element
40 can be implemented as different types, such as the filter element 40 can be implemented as cutoff filter, full impregnated light
The combination of spectrum filter piece and other optical filters or multiple optical filters, for example, the filter element 40 can be implemented as it is red
The combination of outer edge filter and full impregnated spectral filter, i.e., described cutoff filter and the full impregnated spectral filter energy
Enough it is switched to be optionally situated on the photosensitive path of the photo-sensitive cell 21, such as in the more sufficient ring of the light such as daytime
When the camera module is used under border, the cutoff filter can be switched to the photosensitive road of the photo-sensitive cell 21
Footpath, to filter the infrared ray in the light being reflected by the object for entering the camera module by the cutoff filter,
When using the camera module in the environment of the darks such as night, the full impregnated spectral filter can be switched to described
The photosensitive path of photo-sensitive cell 21, it is saturating to allow access into the infrared part in the light being reflected by the object of the camera module
Cross.
With reference to shown in figure 7, the molding photosensory assembly 20 of the camera module further comprises a supporting member 25, its
In before the molded base 23 is formed, the supporting member 25 is arranged at the non-photo-sensing of the photo-sensitive cell 21
Region 213, so that after the molded base 23 shaping, the molded base 23 coats the wiring board 22, the photosensitive member
The non-photo-sensing region 213 of part 21 and a part for the supporting member 25, to form the molding photosensory assembly 20, wherein
The supporting member 25 can effectively improve the product yield of the camera module, and improve the imaging product of the camera module
Matter, in following description, it will the feature and advantage of the supporting member 25 are further illustrated and disclosed.
Further, the supporting member 25 has a top surface 2501, a medial surface 2502 and a lateral surface 2503,
The both sides of wherein described top surface 2501 are connected to the medial surface 2502 and the lateral surface 2503.It is worth mentioning
It is that the side of the direction photo-sensitive cell 21 of the supporting member 25 is defined as the medial surface of the supporting member 25
2502, the side of the direction wiring board 22 of the supporting member 25 is defined as the lateral surface of the supporting member 25
2503。
Shown in refer to the attached drawing 7, the molding photosensory assembly 20 of the camera module further comprises multiple electronics member devices
Part 26, wherein each electronic component 26 can pass through such as SMT (Surface Mount Technology) technique quilt
It is mounted on the fringe region 223 of the wiring board 22.Preferably, each electronic component 26 is mounted on the side
The wiring board outside portion 2233 in edge region 223.The photo-sensitive cell 21 and each electronic component 26 can be pasted
The same side or opposite side loaded on the wiring board 22, such as in a specific example, the photo-sensitive cell 21 and each
The electronic component 26 is mounted on the same side of the wiring board 22, and the photo-sensitive cell 21 is mounted on the line
The chip attachment region 222 of road plate 22, each electronic component 26 are mounted on the side of the wiring board 22
Edge region 223.Integrally formed after the wiring board 22 in the molded base 23, the molded base 23 coats each institute
Electronic component 26 is stated, to isolate the adjacent electronic component 26 by the molded base 23 and isolate the electronics member
Device 26 and the photo-sensitive cell 21, so as to, in the camera module of the present invention, the even adjacent electronic component
26 it is closer to the distance when, the molded base 23 can also avoid the adjacent electronic component 26 from contacting with each other or disturb,
And the mode that the molded base 23 coats the electronic component 26 can also avoid resulting from the electronic component 26
Surface contaminants described in photo-sensitive cell 21 the photosensitive region 212, and then reduce the volume of the camera module
With the image quality for improving the camera module.That is, the camera module of the present invention passes through the molded base 23
The mode of the electronic component 26 is coated, enables the wiring board 22 of small area by the more electronics member devices of attachment
Part 26.It is noted that the type of the electronic component 26 includes but is not limited to resistance, electric capacity, driving element etc..
In addition, it will be appreciated by those skilled in the art that, although Fig. 1 into Fig. 7 by taking monomer camera module as an example
The manufacturing step of manufacturing step and the molding photosensory assembly 20 to the camera module discloses, in this shown in Fig. 8
In individual example, the camera module can also be implemented as twin-lens camera module or array camera module, and the present invention is at this
Aspect is unrestricted.
The manufacturing step of the camera module and the molding photosensory assembly are described in the example shown in Fig. 1 to Fig. 7
20 manufacturing step.
With reference to shown in figure 1, the photo-sensitive cell 21 is mounted on to the chip attachment region 222 of the wiring board 22,
And each chip contacts 211 and the wiring board 22 in the non-photo-sensing region 213 of the photo-sensitive cell 21
Each the wiring board connector 221 is connected the fringe region 223 by lead 24 described in one group.It is in addition, each described
Electronic component 26 is mounted on the wiring board outside portion 2233 of the fringe region 223 of the wiring board 22.Also
It is to say, the both ends of lead 24 described in one group are connected to the photo-sensitive cell 21 and the wiring board 22 respectively, wherein each institute
State the upper surface that lead 24 protrudes from the photo-sensitive cell 21 with presenting arcuation.It is understood that it is limited to using described
Lead 24 connects the routing technique and the lead 24 characteristic of itself of the photo-sensitive cell 21 and the wiring board 22, described to draw
The both ends of line 24 are respectively in each chip contacts in the non-photo-sensing region 213 for being connected to the photo-sensitive cell 21
211 and the perimeter 223 each after the wiring board connector 221 of the wiring board 22, the lead 24 need be in
Protrude from the upper surface of the photo-sensitive cell 21 upper arcuation.In addition, it is maintained at the radian of the bending of each lead 24
Round and smooth state, advantageously ensure that the lead 24 transmits the telecommunications between the photo-sensitive cell 21 and the wiring board 22
Number ability.Wherein, each lead 24 is arranged between the photo-sensitive cell 21 and the wiring board 22, such as each
The lead 24 can be equidistant.It will be appreciated by those skilled in the art that manufactured in the camera module
During and during the camera module is by use, each lead 24 is maintained at original state and be advantageous to protect
The ability that the lead 24 transmits the electric signal between the photo-sensitive cell 21 and the wiring board 22 is demonstrate,proved, so that it is guaranteed that institute
State the image quality of camera module.
It will be appreciated by those skilled in the art that although mounted in fig. 1 with a photo-sensitive cell 21
The manufacturing step of the camera module and the institute of the camera module of the present invention is illustrated exemplified by a wiring board 22
The manufacturing step of molding photosensory assembly 20 is stated, in another example, multiple photo-sensitive cells 21 can also be mounted on
The diverse location of one wiring board 22, subsequently to make twin-lens camera module or array camera module, in addition
In one example, multiple wiring boards 22 can also be stitched together to form a wiring board layout, then by each institute
The wiring board 22 that photo-sensitive cell 21 is mounted on the correspondence position of the wiring board layout respectively is stated, with subsequently by the line
Road plate layout separation.The present invention is unrestricted in this regard.
With reference to shown in figure 2A and Fig. 2 B, the supporting member 25 is arranged on the non-photo-sensing area of the photo-sensitive cell 21
Domain 213, with by the photo-sensitive cell 21, the wiring board 22 and the supporting member 25 formed a molding photosensory assembly half into
Product, wherein the supporting member 25 is set in the chip in the non-photo-sensing region 213 for coating the photo-sensitive cell 21
Sidepiece 2131, the chip connecting portion 2232 and the chip outside portion 2233.That is.The supporting member 25 can wrap
A part for each lead 24 is covered, to mold photosensory assembly 20 with described during the camera module is subsequently made
During, the supporting member 25 can coat the lead 24, to improve the image quality of the camera module.This area
Technical staff it is understood that the present invention the camera module this embodiment in, the supporting member 25 wraps
Cover the chip contacts 211 of the photo-sensitive cell 21.Further, the supporting member 25 includes the supporting master of a frame shape
Body 251 and there is a through hole 252, wherein the supporting main body 251 is arranged at the non-photo-sensing area of the photo-sensitive cell 21
Domain 213, so that the photosensitive region 212 of the photo-sensitive cell 21 corresponds to the through hole 252 of the supporting member 25, from
And when carrying out moulding technology, the supporting main body 251 can protect the photosensitive region 212 of the photo-sensitive cell 21.Institute
State that molded base 23 coats the lateral surface 2503 of the supporting main body 251 after shaping and at least a portion described determines surface
2501.It is noted that the medial surface 2502 of the supporting member 25 is used to form the described of the supporting member 25
Through hole 252.
Preferably, the supporting main body 251 coats the chip inside portion 2131 of the photo-sensitive cell 21, the chip
Connecting portion 2131 and the chip outside portion 2133, that is to say, that the supporting main body 251 can coat the chip contacts
211, so as to which the supporting main body 251 can avoid the link position of the lead 24 and the chip contacts 211 with being used for
The moulding material contact of the molded base 23 is formed, to avoid the lead 24 from being come off from the chip contacts 211.Can
With understanding, when the supporting main body 251 coats the link position of the lead 24 and the chip contacts 211, institute
The link position of the lead 24 and the chip contacts 211 and the moulding material can be isolated by stating supporting main body 251, from
And when carrying out moulding technology, avoid the moulding material cause the lead 24 be used for connect the chip contacts 211
Leading Edge Deformation or the lead 24 come off from the chip contacts 211.In one embodiment, the supporting main body
251 can form by the way that glue to be arranged on to the non-photo-sensing region 213 of the photo-sensitive cell 21 and after glue curing,
So that the supporting main body 251 is flexible, wherein after the supporting main body 251 is formed, it is described to support the described of main body 251
Medial surface 2502 forms the through hole 252, and the photosensitive region 212 of the photo-sensitive cell 21 corresponds to the through hole 252.Separately
Outside, the supporting main body 251 formed by glue can also have viscosity, for being polluted in subsequent adhesion dust etc.
Thing, make the photo-sensitive cell 21 so as to prevent the photosensitive region 212 of photo-sensitive cell 21 described in these contaminants
There is dirty bad point in the photosensitive region 212, to further ensure that the image quality of the camera module.For example, the supporting master
Body 251 is arranged between the photosensitive region 212 and the electronic component 26 of the photo-sensitive cell 21, so as to mount
The electronic component 26 can be adhered in the pollutant such as welding powder caused by the wiring board 22 by the supporting main body 251, from
And prevent the photosensitive region 212 of photo-sensitive cell 21 described in the contaminants such as these welding powders.
Preferably, the supporting main body 251 can be coated in the institute of the photo-sensitive cell 21 by the glue in deadlocked state
State non-photo-sensing region 213 and formed after glue curing, to avoid glue from being applied to described in the photo-sensitive cell 21
The situation for occurring flowing and polluting the photosensitive region 212 of the photo-sensitive cell 21 behind non-photo-sensing region 213 occurs.Change speech
It, glue has good plasticity before the supporting main body 251 is formed by curing, to avoid glue from being applied to the sense
The non-photo-sensing region 213 of optical element 21 and it is deformed during solidification.It will be appreciated by those skilled in the art that
, can make by way of by the non-photo-sensing region 213 of the glue of deadlocked state coated in the photo-sensitive cell 21
The supporting main body 251 that glue is formed coats the lead 24, and in the institute that glue is coated in the photo-sensitive cell 21
Avoid that the lead 24 is caused to damage during stating non-photo-sensing region 213.
Shown in refer to the attached drawing 3A, when carrying out moulding technology, solidifying the moulding material by a molding tool 100
At least integrally formed molded base 23 in the wiring board 22 is formed afterwards, by such mode, can reduce institute
State the size of camera module and reduce the assembly error of the camera module, so that the structure of the camera module is compacter
With the image quality for improving the camera module.
Specifically, the mould 100 includes a mold 101 and once mould 102, wherein the mold
101 and the lower mould 102 at least one mould can be moved so that the mold 101 and the lower mould 102
Can be by carry out die closing operation, and an at least molding space 103 is formed between the mold 101 and the lower mould 102,
Wherein described molded base 23 is added into the molding space 103 by the moulding material and formed after hardening.Such as
In one embodiment, the lower mould 102 is usually fixed, and the mold 101 can be done along guide pillar relative under described
The movement of mould 102, with the matched moulds when the mold 101 is moved towards the lower mould 102, so as in the mold
The molding space 103 is formed between 101 and the lower mould 102, and in the mold 102 away from the lower mould 102
Withdrawing pattern when mobile.Or in another example, the mold 101 is fixed, the lower mould 102 can be done along guide pillar
Relative to the movement of the mold 101, with the lower mould 102 towards the mold 101 by it is mobile when matched moulds, so as to
The molding space 103 is formed between the lower mould 102 and the mold 101, and in the lower mould 102 away from institute
State withdrawing pattern when mold 101 moves.
It is connected by lead 24 described in one group in the photo-sensitive cell 21 and the wiring board 22 and is led in the supporting
Body 251 is formed at the non-photo-sensing region 213 of the photo-sensitive cell 21 to form institute after coating a part for the lead 24
Molding photosensory assembly semi-finished product are stated, the molding photosensory assembly semi-finished product are positioned over to the lower mould of the mould 100
Tool 102, operates the mold 101 of the mould 100 and/or the lower mould 101, so that the mold 101
With the lower matched moulds of mould 102, so as to forming the molding space between the mold 101 and the lower mould 102
103, and the photo-sensitive cell 21, the wiring board 22 and the supporting member 25 respectively partially mould 100
The molding space 103, wherein the stitching surface 1011 of the mold 101 with it is described supporting main body 251 the top surface
2501 contact and support the mold 101 upwards by the supporting main body 251, to avoid described in the mold 101
Stitching surface 1011 applies pressure to the lead 24.Such as in this specific example shown in such as accompanying drawing 7 in the present invention, the line
The non-photo-sensing region of outside, the described photo-sensitive cell 21 of road plate 22 and a part for the supporting member 25 are located at the shaping mould
The molding space 103 of tool 100, so that after the molded base 23 is molded in the molding space 103, the molding base
The non-photo-sensing region of outside, the described photo-sensitive cell 21 of the cladding of seat 23 wiring boards 22 and one of the supporting member 25
Point.
Therefore, it will be appreciated by those skilled in the art that, the molding space 103 of the mould 100 can
To be the space of a ring-type, to be added into the institute that ring-type is formed after the molding space 103 and solidification in the moulding material
State molded base 23.
It is noted that the supporting main body 251 is flexible, so that in the mould 100 by carry out matched moulds
During operation, the stitching surface 1011 of the mold 101 of the mould 100 is contacting the supporting main body 251
The impulsive force caused in a flash of the top surface 2501 is absorbed by the supporting main body 251 and prevents the impulsive force from further passing
The photo-sensitive cell 21 is delivered to, so as to avoid the photo-sensitive cell 21 from being damaged or avoid the photo-sensitive cell 21 because of stress
And produce the displacement relative to the photo-sensitive cell 22.It will be appreciated by those skilled in the art that led by the supporting
Body 251 absorbs the impulsive force and prevents the impulsive force from being further transferred to the mode of the photo-sensitive cell 21, additionally it is possible to ensures institute
State flatness when photo-sensitive cell 21 is mounted on the wiring board 22 to be not affected, so that it is guaranteed that the imaging of the camera module
Quality.
It is noted that the scope of the shore hardness of the supporting main body 251 is A50-A80, modulus of elasticity scope is
0.1Gpa-1Gpa。
Preferably, in this all as shown in Figure 7 example of the present invention, the height of the supporting main body 251 can be by
Be embodied as greater than the upward height of the lead 24, with the mould 100 by carry out die closing operation
When, the top table of the stitching surface 1011 of the mold 101 of the mould 100 and the supporting main body 251
When face 2501 contacts, the supporting main body 251 can support the mold 101 upwards and prevent the mold 101 from pressing
In the lead 24.Such as in one example, the height of the supporting main body 251 is equal to the upward height of the lead 24
Degree, so that when the mold 101 of the mould 100 and the lower mould 102 are by carry out die closing operation, the branch
Hold main body 251 and support the mold 101 upwards, although so that the stitching surface 1011 of the mold 101 can be with institute
State lead 24 to contact, but the stitching surface 1011 of the mold 101 can not apply pressure to the lead 24.Another
In individual example, the height of the supporting main body 251 is higher than the upward height of the lead 24, so as in the mould
When 100 mold 101 and the lower mould 102 are by carry out die closing operation, the supporting main body 251 is upwards described in support
Mold 101, so that the stitching surface 1011 of the mold 101 does not contact with the lead 24, so as to avoid on described
The stitching surface 1011 of mould 101 applies pressure to the lead 24.That is, the supporting main body 251 can support upwards
The mold 101 is with the reserved safe distance between the stitching surface 1011 and the lead 24 of the mold 101.
In addition, it is described supporting main body 251 it is flexible, the mould 100 the mold 101 and it is described under
Mould 102 is by after carry out die closing operation, and the stitching surface 1011 of the mold 101 described in the supporting main body 251 with pushing up
Surface 2501 contact and apply pressure to it is described supporting main body 251 the top surface 2501, wherein the pressure of the mold 101
The pressure that conjunction face 1011 puts on the top surface 2501 of the supporting main body 251 can cause the supporting main body 251 to be produced
Raw slight deformation, for preventing described in the stitching surface 1011 of the mold 101 and the supporting main body 251
Top surface 2501 produces gap.That is, the mold 101 of the forming module 100 can be with the supporting main body
251 are brought into close contact, so that at corresponding to the photosensitive region of the photo-sensitive cell 21 of the through hole 252 of the supporting member 25
In sealed environment, to avoid when carrying out moulding technology, the moulding material enters the sealed environment and polluted described photosensitive
The photosensitive region of element 21.
Fig. 3 B show a variant embodiment of the molding photosensory assembly 20 of the present invention in this process, its
Described in supporting member 25 can be made up of hard material, that is to say, that when the supporting main body 251 of the supporting member 25
Be formed at least a portion in the non-photo-sensing region 213 of the photo-sensitive cell 21, and the mould 100 it is described on
The stitching surface 1011 of mould 101 apply pressure to it is described supporting main body 251 the top surface 2501 when, the supporting main body
251 will not be deformed, to ensure the good electrical of the lead 24, so as to ensure the camera module in subsequent technique
Yield and the image quality for being further ensured that the camera module.
It is noted that the shore hardness of the supporting main body 251 is more than D70, modulus of elasticity is more than 1Fpa.
The mould 100 further comprises a cover layer 106, so as in the mold 101 and the lower mould
During 102 progress matched moulds, the cover layer 106 is located at the stitching surface 1011 of the mold 101 and the supporting main body 251
The top surface 2501 between, it is preferable that in the mold 101 and the lower mould 102 by between matched moulds, can first by
The cover layer 106 is arranged at the stitching surface 1011 of the mold 101.In the stitching surface of the mold 101
The cover layer 106 is set between 1011 and the supporting main body 251, on the one hand can prevent the institute in the mold 101
State and produce gap between stitching surface 1011 and the supporting main body 251, on the other hand the cover layer 106 can be absorbed described
Mold 101 and the lower mould 102 carry out impulsive force caused by matched moulds, so as to avoid the mold 101 and it is described under
The photo-sensitive cell 21, the wiring board 22 and the lead 24 are damaged during 102 matched moulds of mould.
Shown in refer to the attached drawing 4, the moulding material of flow-like is added to the molding space of the mould 100
After 103, the moulding material can fill the whole molding space 103, wherein being formed in the described non-of the photo-sensitive cell 21
The supporting main body 251 of photosensitive region 213 can prevent the moulding material in the supporting main body 251 and the photosensitive member
The contact position in the non-photo-sensing region 213 of part 21 enters the photosensitive region 212 of the photo-sensitive cell 21, in addition, institute
State supporting main body 251 and prevent the stitching surface 1011 in the mold 101 and the supporting main body by producing deformation
251 top surface 2501 produces the mode in gap, can prevent the moulding material described in the supporting main body 251
The contact position of the stitching surface 1011 of top surface 2501 and the mold 101 enters the sealed environment, and can keep away
Exempt from the phenomenon of the generation " overlap " after the mold material cures.
It is noted that the moulding material of flow-like of the present invention can be fluent material or solid
Grain material or liquid and solid particle mixing material, it is to be understood that no matter the moulding material is implemented as liquid material
Material is also implemented as solid particulate materials or is implemented as liquid and solid particle mixing material, its be added into it is described into
After the molding space 103 of pattern tool 100, the molded base 23 can be cured to form.Such as the present invention this
In individual specific example, the moulding material of flow-like is implemented as the thermoplastic of such as liquid, wherein the forming material
Expect in the solidify afterwards of the molding space 103 for being added into the mould 100 to form the molded base 23.It is worth mentioning
, after the moulding material of flow-like is added into the molding space 103 of the mould 100, flow-like
The curing mode of the moulding material does not limit present disclosure and scope.
Shown in refer to the attached drawing 5, the supporting main body 251 is by along the non-photo-sensing region 213 of the photo-sensitive cell 21
Set, after the moulding material is added into the molding space 103 of the mould 100, the supporting energy of main body 251
The moulding material is enough prevented to enter the photosensitive region 212 of the photo-sensitive cell 21, so as in the mold material cures
After forming the molded base 23, the molded base 23 is set further to form an optical window 231, with corresponding to the photosensitive member
The photosensitive region 212 of part 21, so as to which follow-up, the optical window 231 of the molded base 23 allows light to pass through with quilt
The photosensitive region 212 of the photo-sensitive cell 21 receives and carried out photoelectric conversion.That is, it is added into the mould
The moulding material of 100 molding space 103 forms the He of a molded body 232 of the molded base 23 after hardening
The optical window 231 is formed at the middle part of the molded base 23.In other words, the molded base 23 includes the molded body
232 and there is the optical window 231, the optical window 231 provides a light to the optical lens 10 and the photo-sensitive cell 21 and led to
Road, so as to which the light that is reflected by the object is from after the optical lens 10 enters the inside of the camera module, light passes through described
The optical window 231 of molded base 23 receives and carried out photoelectric conversion by the photosensitive region 212 of the photo-sensitive cell 21.
It is noted that after the molded base 23 formation, the molded base 23 coats each electronics
Component 26, so as to by the molded base 23 isolate each electronic component 26 and by the molded base 23 every
From the electronic component 26 and the photo-sensitive cell 21, by such mode, the even adjacent electronic component 26
The molded base 23 can also prevent the adjacent electronic component 26 from contacting when closer to the distance, and the molded base 23
The photosensitive region of photo-sensitive cell 21 described in contaminants caused by the electronic component 26 can also be prevented, with described in improvement
The image quality of camera module.
Shown in refer to the attached drawing 6, the filter element 40 is assembled in the top surface of the molded base 23, so that the filter
Optical element 40 closes the optical window 231 of the molded base 23, so as to subsequently enter the shooting from the optical lens
The light of the inside of module can be filtered further to improve the image quality of the camera module by the filter element 40.
Further, the top surface of the molded base 23 forms an inner surface 233 and an outer surface 234, wherein
In one example, the inner surface 233 of the molded base 23 and the outer surface 234 are in approximately the same plane
It is interior, so that the top surface of the molded base 23 forms a smooth plane, wherein the filter element 40 is assembled in institute
The inner surface 233 of molded base 23 is stated, the driver 30 or the microscope base are assembled in the molded base 23
The outer surface 234, or the optical lens 10 by direct-assembling in the outer surface of the molded base 23
234.In another example, the plane where the inner surface 233 of the molded base 23 can be less than the outside
Plane where surface 234, so that the top surface of the molded base 23 forms a step-like surface, i.e., described molding
Plane where the inner surface 233 of pedestal 23 is less than the plane where the outer surface 234 to form the molding
One groove 235 of pedestal 23, wherein being assembled in the filter element 40 of the inner surface 233 of the molded base 23
It is housed inside in the groove 235 of the molded base 23, the driver 30 is assembled in the institute of the molded base 23
State outer surface 234 so that the optical lens 10 for being assembled in the driver 30 be further maintained at it is described photosensitive
The photosensitive path of element 21, such as Fig. 7, so as to which the camera module be made.
It is first variant embodiment of the camera module of the present invention shown in refer to the attached drawing 9A, with institute of the invention
State the above-mentioned embodiment difference of camera module, each institute of the molding photosensory assembly 20 of the camera module of the invention
State the inside that lead 24 is all covered by the supporting main body 251.
Specifically, the supporting main body 251 coats at least a portion of the chip inside portion 2131, the chip connects
Socket part 2132, the chip outside portion 2133, the wiring board inside portion 2231, the wiring board connecting portion 2232 and the line
At least a portion of road plate outside portion 2233, so as to which the supporting main body 251 not only coats the expression in the eyes part of the lead 24, and
And the supporting main body 251 also coats the connection position of the chip contacts 211 of the lead 24 and the photo-sensitive cell 21
The link position of the wiring board connector 221 of the lead 24 and the wiring board 22 is put and coats, with by described
Supporting main body 251 pre-fixes the lead 24.During so as to form the molded base 23 in follow-up progress moulding technology,
During the mold 101 of the mould 100 and the lower mould 102 are by matched moulds, the institute of the mold 101
Stitching surface 1011 is stated to contact with the top surface 2501 of the supporting main body 251 and avoid the pressure of the mold 101
Conjunction face 1011 directly applies pressure to the lead 24, so as to prevent the lead 24 from deforming or damaging because of stress.
In addition, the lead 24 is all covered by the inside of the supporting main body 251, enable the supporting main body 251
Enough shapings for preventing to be added into the molding space 103 to be formed between the mold 101 and the lower mould 102
Material directly contacts with the lead 24, to prevent the higher moulding material of temperature from damaging the lead 24.Preferably, institute
Stating supporting main body 251 has good thermal insulation, to avoid the supporting main body 251 from being transferred to the temperature of the moulding material
The lead 24.It is highly preferred that height of the height of the supporting main body 251 higher than the ledge of the lead 24, so as to
When carrying out moulding technology, the supporting main body 251 supports the mold 101 with described in the mold 101 upwards
Safe distance is reserved between the ledge of stitching surface 1011 and the lead 24.
Also, the supporting main body 251 coats the chip outside portion 2133 of the photo-sensitive cell 21 and the circuit
The wiring board inside portion 2231 of plate 22, to coat the photo-sensitive cell 21 and the circuit by the supporting main body 251
The mounting position of plate 22, by such mode, the supporting main body 251 can not only pre-fix the photo-sensitive cell 21 and institute
Wiring board 22 is stated, so that when carrying out moulding technology, the supporting main body 251 can prevent the photo-sensitive cell 21 and the circuit
Each position of plate 22 produces displacement because of unbalance stress, also, the supporting main body 251 can also prevent the moulding material
The mounting position of the photo-sensitive cell 21 and the wiring board 22 is contacted, is improved with ensureing the flatness of the photo-sensitive cell 21
The image quality of the camera module.
It will be appreciated by those skilled in the art that the supporting main body 251 is by along the photo-sensitive cell 21 and institute
The mounting position for stating wiring board 22 is set, so that the supporting main body 251 is in square frame-shaped, so that when carrying out moulding technology, institute
The photosensitive region 212 that supporting main body 251 can prevent the moulding material from entering the photo-sensitive cell 21 is stated, so that institute
State the institute that moulding material forms the fringe region 223 for coating the wiring board 22 and the supporting main body 251 after hardening
The molded body 232 of lateral surface 2503 is stated, and the optical window 231. wherein institute is formed at the middle part of the molded body 232
The photosensitive region 212 for stating photo-sensitive cell 21 corresponds to the optical window 231 of the molded base 23, so that the optical window
231 provide a passage of light to the optical lens 10 and the photo-sensitive cell 21.He preferably, the molded body 232 exists
The fringe region 223 of the wiring board 22, the supporting lateral surface 2503 of main body 251 and described are coated after shaping
At least a portion of top surface 2501.
In second variant embodiment of the camera module of the invention shown in accompanying drawing 9B, the supporting main body
The chip outside portion 2133 of the 251 cladding photo-sensitive cells 21, the wiring board inside portion 2231 of the wiring board 22,
The wiring board connecting portion 2232 and at least a portion of the wiring board outside portion 2233.That is, shown in accompanying drawing 9B
The camera module this example in, the supporting main body 251 can not coat the chip of the photo-sensitive cell 21
Connecting portion 2132.In the 3rd embodiment of the camera module of the invention shown in accompanying drawing 9C, the supporting main body
The chip connecting portion 2132 and the chip outside portion 2133 and the wiring board 22 of the 251 cladding photo-sensitive cells 21
The wiring board inside portion 2231 and the wiring board connecting portion 2232.That is, of the invention shown in accompanying drawing 9C
In this embodiment of the camera module, the supporting main body 251 can not coat the chip of the photo-sensitive cell 21
Inside portion 2131 and the wiring board outside portion 2233 of the wiring board 22.That is, show in accompanying drawing 9A, Fig. 9 B and Fig. 9 C
In these variant embodiments of the camera module gone out, the supporting main body 251 can coat the photosensitive member simultaneously
The mounting position of part 21 and the wiring board 22, to pre-fix the photo-sensitive cell 21 and described by the supporting main body 251
Wiring board 22, and prevent mounting position in the photo-sensitive cell 21 and the wiring board 22 by the supporting main body 251
Gap is produced, so as to which when carrying out moulding technology, the supporting main body 251 can prevent the photo-sensitive cell 21 and the circuit
Each position of plate 22 produces displacement because of unbalance stress, and the supporting main body 251 can prevent the moulding material
Into between the photo-sensitive cell 21 and the wiring board 22, to ensure the flatness of the photo-sensitive cell 21.
It is the 4th variant embodiment of the camera module of the present invention shown in refer to the attached drawing 10A, wherein the branch
Hold main body 251 coat the wiring board 22 the fringe region 22 the wiring board inside portion 2231 at least a portion,
The wiring board connecting portion 2232 and at least a portion of the wiring board outside portion 2233, i.e. the supporting main body 251 coats
The wiring board connector 221 of the wiring board 22, with when carrying out moulding technology, on the one hand by the supporting main body
251 pre-fix the lead 24, on the other hand prevent the lead 24 from being connected with the wiring board by the supporting main body 251
Part 221 contacts with the moulding material, so as to avoid the lead 24 from being come off from the wiring board connector 221.
It is the 5th variant embodiment of the camera module of the present invention shown in refer to the attached drawing 10B, wherein the branch
The chip inside portion 2131 that main body 251 only coats the photo-sensitive cell 21 is held, with when carrying out moulding technology, the supporting
Main body 251 prevents the moulding material into the photosensitive region 212 of the photo-sensitive cell 21, so as in the moulding material
The chip outside portion of the fringe region 223 and the photo-sensitive cell 21 that coat the wiring board 22 is formed after solidification
2133 and the molded body 232 of the chip connecting portion 2132, and the photosensitive region 212 in the photo-sensitive cell 21
Corresponding position forms the optical window 231.
It is the 6th variant embodiment of the camera module of the present invention shown in refer to the attached drawing 11, it is upper with the present invention
State unlike embodiment, the molded body 232 is after shaping without the top surface for coating the supporting main body 251
2501.Such as in this specific example shown in accompanying drawing 11, the molded body 232 coats the wiring board after shaping
The lateral surface 2503 of 22 fringe region 223 and the supporting main body 251.
It is noted that although the height of the supporting main body 251 is all illustrated into Figure 11 higher than each in accompanying drawing 1
The scheme of the height of the ledge of the lead 24, in other examples of the camera module of the present invention, the branch
The height of ledge of each lead 24 can also be equal to by holding the height of main body 251, or in some other examples
In, the height of the supporting main body 251 can also be less than the height of the ledge of each lead 24, as long as carrying out mould
When moulding technique, the stitching surface 1011 of the mold 101 of the mould 100 and the top of the supporting main body 251
Surface contacts and the stitching surface of the mold 101 does not apply pressure to each lead 24 directly.
Accompanying drawing 12 shows a variant embodiment of the camera module, wherein the filter element 40 is not straight
Connect and be assembled in the module main body 232, but an at least supporter 70, the quilt of filter element 40 are provided by the camera module
The supporter 70 is assembled in, then the supporter 70 is assembled in the top surface of the molded body 232, so that the filter
Optical element 40 is maintained between the optical lens 10 and the photo-sensitive cell 21, by such mode, can reduce institute
The size of filter element 40 is stated, to reduce the height of the camera module.
Further, the top surface of the molded body 232 can be a plane, so as to the molded base 23 into
After type, the supporter 70 is first assembled in the top surface of the molded body 232, then again by the driver 30 or institute
State lens barrel 60 and be assembled in the supporter 70.That is, the driver 30 or the lens barrel 60 can be not direct
The top surface of the molded body 232 is assembled in, but is assembled on the supporter 70.
Accompanying drawing 13 shows another variant embodiment of the camera module, wherein the top of the molded body 232
Surface forms a groove 235, and the supporter 70 for being assembled in the top surface of the molded body 232 is housed inside
In the groove 235, further to reduce the height dimension of the camera module, now, the driver 30 or the mirror
Cylinder 60 can be by direct-assembling in the top surface of the molded body 232.
Nevertheless, it will be appreciated by those skilled in the art that, other in the camera module of the present invention show
In example, the optical lens 10 can also be by top surface of the direct-assembling in the molded body 232 or the optical lens
10 can also be by direct-assembling in the top surface of the supporter 70.According to another aspect of the present invention, the present invention is further
The manufacture method of a molding photosensory assembly 20 is provided, wherein the manufacture method comprises the following steps：
(a) photo-sensitive cell 21 and a wiring board 22 are connected by one group of lead 24；
(b) by the photo-sensitive cell 21 and the wiring board 22 be positioned over a molding tool 100 a mold 101 or
Mould 102 once；
(c) during the mold 101 and the matched moulds of lower mould 102, propped up upwards by a supporting member 25
The mold 101 is supportted, to prevent the stitching surface 1011 of the mold 101 from applying pressure to lead 24 described in every group；And
(d) fluid is added into the molding space 103 formed between the mold 101 and the lower mould 102
The moulding material of shape, to form a molded base 23 after the mold material cures, wherein the molded base 23 includes one
Mold body 232 and there is an optical window 231, wherein the molded body 232 coats the fringe region 223 of the wiring board 22
At least a portion of at least a portion and the supporting member 25.
According to another aspect of the present invention, the present invention further provides one molding photosensory assembly 20 manufacture method, its
Described in manufacture method comprise the following steps：
(A) photo-sensitive cell 21 and a wiring board 22 are connected by one group of lead 24；
(B) coat the lead 24 at least in part by a supporting member 25, with formed a molding photosensory assembly half into
Product；
(C) the molding photosensory assembly semi-finished product are positioned over to the mold 101 or once mould of a molding tool 100
Tool 102, wherein during the mold 101 and the matched moulds of lower mould 102, the supporting member 25 supports institute upwards
Mold 101 is stated to prevent the stitching surface 1011 of the mold 101 from applying pressure to the lead 24；And
(D) fluid is added into the molding space 103 formed between the mold 101 and the lower mould 102
The moulding material of shape, to form a molded base 23 after the mold material cures, wherein the molded base 23 includes one
Molded body 232 and there is an optical window 231, the molded body 232 coats the fringe region 223 of the wiring board 22 and described
At least a portion of supporting member 25, the photosensitive region 212 of the photo-sensitive cell 21 correspond to the optical window 231.
According to another aspect of the present invention, the present invention further provides the manufacture method of a molding photosensory assembly, wherein
The manufacture method comprises the following steps：
(h) photo-sensitive cell 21 is mounted on a wiring board 22；
(i) photo-sensitive cell 21 and the wiring board 22 are pre-fixed by a supporting member 25, felt so that a molding is made
Optical assembly semi-finished product, and the supporting member 25 prevents to produce seam between the photo-sensitive cell 21 and the wiring board 22
Gap；
(j) the molding photosensory assembly semi-finished product are positioned over to the mold 101 or once mould of a molding tool 100
Tool 102, with the mold 101 and lower 102 matched moulds of mould, the mold 101 and the lower mould 102 it
Between form the molding space 103 of a ring-type；And
(k) moulding material of flow-like is added into the molding space 103, to be formed after the mold material cures
The molded base 23, wherein the molded base 23 includes a molded body 232 and has an optical window 231, the molding master
Body 23 coats the fringe region 223 of the wiring board 22 and at least a portion of the supporting member 25, the photo-sensitive cell 21
Photosensitive region 212 correspond to the optical window 231.
According to another aspect of the present invention, the present invention further provides the manufacture method of a molding photosensory assembly, wherein
The manufacture method comprises the following steps：
(H) circuit of the wiring board 22 of chip contacts 211 and one of a photo-sensitive cell 21 is connected to by one group of lead 24
Plate connector 221；
(I) by the photo-sensitive cell 21 and the wiring board 22 be positioned over a molding tool 100 a mold 101 or
Mould 102 once, with the mold 101 and the matched moulds of lower mould 102 when, the mold 101 and it is described under
The molding space 103 of a ring-type is formed between mould 102；
(J) when adding the moulding material of flow-like to the molding space 103, by positioned at the molding space 103
A supporting member 25 reduce impulsive force caused by the moulding material by way of stopping the moulding material and draw to described
Influence caused by line 24；And
(K) molded base 23 is formed after the mold material cures, wherein the molded base 23 includes a molding
Main body 232 and there is an optical window 231, wherein the molded body 232 coats the fringe region 223, described of the wiring board 22
At least a portion in the non-photo-sensing region 213 of supporting member 25 and the photo-sensitive cell 21.
Shown in refer to the attached drawing 14, the present invention further provides an electronic equipment, wherein the electronic equipment of the electronic equipment one
Body 200 and at least a camera module, wherein each camera module is arranged at the electronic equipment body 200 respectively,
For obtaining figure, wherein each camera module 200 further comprises an at least optical lens 10 and at least one respectively
Photosensory assembly 20 is molded, the molding photosensory assembly 20 includes a supporting member 25, a photo-sensitive cell 21, a wiring board 22, and one
The group molded base 23 of lead 24 and one, wherein the both ends of each lead 24 are connected to the core of the photo-sensitive cell 21 respectively
The wiring board connector 221 of piece connector 211 and the wiring board 22, wherein the molded base 23 includes a molded body
232 and there is an optical window 231, wherein carrying out moulding technologies so that the molded body 232 is molded by a molding tool 100
When, the supporting member 25 is used to prevent the stitching surface 1011 of the mould 100 from applying pressure to the lead 24, wherein described
The photosensitive region 212 of photo-sensitive cell 21 corresponds to the optical window 231, wherein each optical lens 10 is arranged at often respectively
The photosensitive path of the photo-sensitive cell 21 of the individual molding photosensory assembly 20.
It will be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing be only used as citing and
It is not intended to limit the present invention.
The purpose of the present invention completely and effectively realizes.The function and structural principle of the present invention is opened up in embodiment
Show and illustrate, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (43)
1. the molding photosensory assembly of a camera module, it is characterised in that including：
At least supporting member formed by first medium；
An at least photo-sensitive cell；
An at least wiring board；
At least one set of lead, wherein the both ends of lead described in every group are connected to the chip connection of each photo-sensitive cell respectively
The wiring board connector of part and each wiring board；And
At least molded base formed by second medium, wherein each molded base includes a molded body and tool respectively
There is an at least optical window, wherein when having progress moulding technology so that the molded body is molded by a molding, the supporting
Element is used to protect the photo-sensitive cell and the lead, wherein the photosensitive region of the photo-sensitive cell corresponds to the optical window.
2. molding photosensory assembly according to claim 1, wherein each supporting member includes the branch of a frame shape respectively
Hold main body and there is a through hole, the supporting main body coats at least a portion in the non-photo-sensing region of the photo-sensitive cell, described
The photosensitive region of photo-sensitive cell corresponds to the through hole, wherein the supporting main body has a top surface, a medial surface and one
Lateral surface, the top surface of the supporting main body are inwardly or outwardly each extended over to be connected to the medial surface and the outside
Face, the medial surface form the through hole, wherein when carrying out moulding technology, the stitching surface of the mould with it is described
Support the top surface contact of main body.
3. molding photosensory assembly according to claim 2, wherein the non-photo-sensing region of the photo-sensitive cell includes one
Chip inside portion, a chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are set
The chip connecting portion is placed in, the chip inside portion and the chip outside portion are located at the inner side of the chip connecting portion respectively
And outside, wherein the supporting main body coats at least a portion of the chip inside portion of the photo-sensitive cell.
4. molding photosensory assembly according to claim 2, wherein the non-photo-sensing region of the photo-sensitive cell includes one
Chip inside portion, a chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are set
The chip connecting portion is placed in, the chip inside portion and the chip outside portion are located at the inner side of the chip connecting portion respectively
And outside, wherein the supporting main body coats at least a portion of the chip inside portion of the photo-sensitive cell and the chip
At least a portion of connecting portion.
5. molding photosensory assembly according to claim 2, wherein the non-photo-sensing region of the photo-sensitive cell includes one
Chip inside portion, a chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are set
The chip connecting portion is placed in, the chip inside portion and the chip outside portion are located at the inner side of the chip connecting portion respectively
And outside, wherein the supporting main body coats at least a portion of the chip inside portion of the photo-sensitive cell, the chip
At least a portion of connecting portion and the chip exterior.
6. molding photosensory assembly according to claim 2, wherein the non-photo-sensing region of the photo-sensitive cell includes one
Chip inside portion, a chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are set
The chip connecting portion is placed in, the chip inside portion and the chip outside portion are located at the inner side of the chip connecting portion respectively
And outside, wherein the supporting main body coats at least a portion of the chip connecting portion of the photo-sensitive cell and the chip
At least a portion of outside portion.
7. molding photosensory assembly according to claim 2, wherein the non-photo-sensing region of the photo-sensitive cell includes one
Chip inside portion, a chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are set
The chip connecting portion is placed in, the chip inside portion and the chip outside portion are located at the inner side of the chip connecting portion respectively
And outside, wherein the supporting main body coats at least a portion of the chip outside portion of the photo-sensitive cell.
8. molding photosensory assembly according to claim 2, wherein the non-photo-sensing region of the photo-sensitive cell includes one
Chip inside portion, a chip connecting portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are set
The chip connecting portion is placed in, the chip inside portion and the chip outside portion are respectively formed in the interior of the chip connecting portion
Side and outside, wherein the supporting main body coats at least a portion of the chip connecting portion of the photo-sensitive cell.
9. molding photosensory assembly according to claim 1, wherein each supporting member includes the branch of a frame shape respectively
Hold main body and there is a through hole, the supporting main body coats at least a portion of the fringe region of the wiring board, described photosensitive
The photosensitive region of element corresponds to the through hole, wherein the supporting main body has a top surface, a medial surface and an outside
Face, the top surface of the supporting main body is inwardly or outwardly each extended over to be connected to the medial surface and lateral surface, described
Medial surface forms the through hole, wherein when carrying out moulding technology, the stitching surface of the mould and the supporting master
The top surface contact of body.
10. molding photosensory assembly according to claim 9, wherein the supporting main body further coats the photo-sensitive cell
At least a portion.
11. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
Body coats at least a portion of the wiring board inside portion and at least a portion of the chip outside portion.
12. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
Body coats at least one of at least a portion of the wiring board inside portion, the chip outside portion and the chip connecting portion
Point.
13. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
Body is coated at least a portion, the chip outside portion, the chip connecting portion and the chip of the wiring board inside portion
At least a portion of sidepiece.
14. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
Body coats at least one of at least a portion of the wiring board connecting portion, the wiring board inside portion and the chip outside portion
Point.
15. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
Body coats at least a portion, the wiring board connecting portion, the wiring board inside portion and the core of the wiring board outside portion
At least a portion of piece outside portion.
16. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
Body coats at least a portion, the wiring board inside portion, the chip outside portion and the chip of the wiring board connecting portion
At least a portion of connecting portion.
17. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
At least a portion of the body cladding wiring board connecting portion, the wiring board inside portion, the chip outside portion, the chip connect
Socket part and at least a portion of the chip inside portion.
18. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
At least a portion of the body cladding wiring board outside portion, the wiring board connecting portion, the wiring board inside portion, the chip
Outside portion and at least a portion of the chip connecting portion.
19. molding photosensory assembly according to claim 9, wherein the fringe region of the wiring board includes a circuit
Plate inside portion, a wiring board connecting portion and a wiring board outside portion, wherein the wiring board connector quilt of the wiring board
The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively
The inner side and outer side of socket part, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a chip connects
Portion and a chip outside portion, wherein the chip contacts of the photo-sensitive cell are arranged at the chip connecting portion, institute
The inner side and outer side that chip inside portion and the chip outside portion are located at the chip connecting portion respectively is stated, wherein the supporting master
At least a portion of the body cladding wiring board outside portion, the wiring board connecting portion, the wiring board inside portion, the chip
At least a portion of outside portion, the chip connecting portion and the chip inside portion.
20. according to any described molding photosensory assembly in claim 2-19, wherein the molded body coats the supporting
The lateral surface of main body.
21. the molding photosensory assembly described in as requested 20, wherein the molded body further coats the supporting main body
At least a portion of the top surface.
22. according to any described molding photosensory assembly in claim 1-19, wherein the height of the supporting member be higher than or
Person is equal to the upward height of the lead.
23. according to any described molding photosensory assembly in claim 1-19, wherein the height of the supporting member is less than institute
State the upward height of lead.
24. according to any described molding photosensory assembly in claim 1-19, wherein the supporting member is flexible.
25. according to any described molding photosensory assembly in claim 1-19, wherein the supporting member has viscosity.
26. molding photosensory assembly according to claim 24, wherein the scope of the shore hardness of the supporting member is
A50-A80, modulus of elasticity scope are 0.1Gpa-1Gpa.
27. the molding photosensory assembly of a camera module, it is characterised in that including：
An at least photo-sensitive cell；
An at least wiring board；
At least one set of lead, wherein the both ends of lead described in every group are connected to the chip contacts of each photo-sensitive cell
With the wiring board connector of each wiring board；
An at least supporting member, wherein at least a portion of lead described in every group of cladding is set in each supporting member；With
And
An at least molded base, wherein each molded base includes a molded body and has an at least optical window respectively, its
Described in molded body coat the fringe region of the wiring board and at least a portion of the supporting member after shaping, each
The photosensitive region of the photo-sensitive cell corresponds respectively to the optical window of each molded base.
28. molding photosensory assembly according to claim 27, lead to wherein the supporting member includes a supporting main body and one
Hole, the supporting main body have a top surface, a medial surface and a lateral surface, it is described support main body the top surface it is inside
With outwards each extend over to be connected to the medial surface and the lateral surface, the medial surface forms the through hole, wherein described
At least a portion for coating the lead is set in supporting main body, and the photo-sensitive cell corresponds to the through hole, the molding master
The lateral surface of the body cladding supporting main body.
29. molding photosensory assembly according to claim 28, wherein the molded base further comprises the supporting master
At least a portion of the top surface of body.
A 30. camera module with molding photosensory assembly, it is characterised in that including：
An at least optical lens；With
At least one molding photosensory assembly, wherein each molding photosensory assembly further comprises respectively：
The supporting member formed by first medium；
One photo-sensitive cell；
One wiring board；
One group of lead, wherein the both ends of each lead are connected to the chip contacts of the photo-sensitive cell and described respectively
The wiring board connector of wiring board；And
The molded base formed by second medium, wherein the molded base includes a molded body and has an optical window, its
In when carrying out moulding technology so that the molded body is molded, the supporting member is used to preventing described having by a molding
The stitching surface of mould applies pressure to the lead, wherein the photosensitive region of the photo-sensitive cell corresponds to the optical window, wherein
Each optical lens is arranged at the photosensitive path of the photo-sensitive cell of each molding photosensory assembly respectively.
31. camera module according to claim 30, further comprise an at least driver, wherein each optical frames
Head is assembled in each driver respectively, and each driver is assembled in each molding photosensory assembly respectively
The top surface of the molded body.
32. the camera module according to claim 30 or 31, further comprise an at least filter element, wherein each described
Filter element is arranged between the photo-sensitive cell of each optical lens and each molding photosensory assembly respectively.
33. camera module according to claim 32, wherein each filter element be assembled in respectively it is each described
Mold the top surface of the molded body of photosensory assembly.
34. camera module according to claim 33, wherein the top surface of the molded body have an inner surface and
One outer surface, wherein the plane where the inner surface is less than the plane where the outer surface, so that the molding
Main body forms a groove, and the filter element is assembled in the inner surface of the molded body and positioned at described recessed
Groove, the driver are assembled in the outer surface of the module main body.
35. camera module according to claim 32, wherein further comprising an at least supporter, wherein each filter
Optical element is assembled in each supporter, and each supporter is assembled in the top surface of the molded body, so that
Each filter element is arranged at each optical lens and molds the described photosensitive of photosensory assembly with each described respectively
Between element.
A 36. camera module with molding photosensory assembly, it is characterised in that including：
An at least optical lens；With
At least one molding photosensory assembly, wherein each molding photosensory assembly further comprises respectively：
One photo-sensitive cell；
One wiring board；
One group of lead, wherein the both ends of each lead are connected to the chip contacts of the photo-sensitive cell and the line
The wiring board connector of road plate；
One supporting member, wherein at least a portion of each lead of cladding is set in the supporting member；And
One molded base, wherein the molded base includes a molded body and has an optical window, wherein the molded body exists
The fringe region of the wiring board and at least a portion of the supporting member are coated after shaping, the sense of each photo-sensitive cell
Light region corresponds respectively to the optical window of the molded base, wherein each optical lens is arranged at each institute respectively
State the photosensitive path of the photo-sensitive cell of molding photosensory assembly.
37. camera module according to claim 36, wherein the camera module is to focus camera module or zoom camera
Module.
A 38. electronic equipment, it is characterised in that including：
One electronic equipment body；With
An at least camera module, wherein each camera module is arranged at the electronic equipment body respectively, for obtaining
Image is taken, wherein each camera module further comprises an at least optical lens and at least one molding photosensory assembly respectively,
The molding photosensory assembly includes a supporting member, a photo-sensitive cell, a wiring board, one group of lead and a molded base, wherein
The wiring board of chip contacts and the wiring board that the both ends of each lead are connected to the photo-sensitive cell respectively connects
Fitting, wherein the molded base includes a molded body and has an optical window, wherein being molded by a molding tool
When technique is so that the molded body is molded, the supporting member is described for preventing the stitching surface of the mould from applying pressure to
Lead, wherein the photosensitive region of the photo-sensitive cell corresponds to the optical window, wherein each optical lens is set respectively
In the photosensitive path of the photo-sensitive cell of each molding photosensory assembly.
39. the manufacture method of a molding photosensory assembly, it is characterised in that the manufacture method comprises the following steps：
(a) photo-sensitive cell and a wiring board are connected by one group of lead；
(b) photo-sensitive cell and the wiring board are positioned over to the mold or once mould of a molding tool；
(c) during the mold and the lower mould matched moulds, the mold is supported by a supporting member upwards,
To prevent the stitching surface of the mold from applying pressure to lead described in every group；And
(d) moulding material of flow-like is added into the molding space formed between the mold and the lower mould,
To form a molded base after the mold material cures, wherein the molded base includes a molding body and with least
One optical window, wherein at least a portion of the fringe region of the molded body cladding wiring board and the supporting member are extremely
A few part.
40. the manufacture method according to claim 39, wherein in the step (c), when the pressure of the mold
Conjunction face apply pressure to it is described supporting main body the top surface when, it is described supporting main body top surface produce deformation so that the upper mould
The stitching surface of tool is brought into close contact in the top surface of the supporting main body, so that the photosensitive region of the photo-sensitive cell
In a sealed environment, wherein in the step (d), the supporting main body prevents the moulding material from entering the sealing ring
Border, so that the moulding material forms the molded body for the lateral surface for coating the supporting main body after hardening, and
The optical window is formed in the medial surface of the supporting main body.
41. the manufacture method of a molding photosensory assembly, it is characterised in that the manufacture method comprises the following steps：
(A) photo-sensitive cell and a wiring board are connected by one group of lead；
(B) lead is coated at least in part by a supporting member, to form a molding photosensory assembly semi-finished product；
(C) the molding photosensory assembly semi-finished product are positioned over to the mold or once mould of a molding tool, wherein
During the mold and the lower mould matched moulds, the supporting member supports the mold to prevent on described upwards
The stitching surface of mould applies pressure to the lead；And
(D) moulding material of flow-like is added into the molding space formed between the mold and the lower mould,
To form a molded base after the mold material cures, wherein the molded base includes a molded body and has a light
Window, the molded body coat the fringe region of the wiring board and at least a portion of the supporting member, the photosensitive member
The photosensitive region of part corresponds to the optical window.
42. the manufacture method of a molding photosensory assembly, it is characterised in that the manufacture method comprises the following steps：
(h) photo-sensitive cell is mounted on a wiring board；
(i) photo-sensitive cell and the wiring board are pre-fixed by a supporting member, be made a molding photosensory assembly half into
Product, and the supporting member prevents to produce gap between the photo-sensitive cell and the wiring board；
(j) the molding photosensory assembly semi-finished product are positioned over to the mold or once mould of a molding tool, with institute
When stating mold and the lower mould matched moulds, the molding space of a ring-type is formed between the mold and the lower mould；
And
(k) moulding material of flow-like is added into the molding space, to form the mould after the mold material cures
Pedestal is moulded, wherein the molded base includes a molded body and has an optical window, the molded body coats the wiring board
Fringe region and the supporting member at least a portion, the photosensitive region of the photo-sensitive cell corresponds to the optical window.
43. the manufacture method of a molding photosensory assembly, it is characterised in that the manufacture method comprises the following steps：
(H) chip contacts of a photo-sensitive cell and the wiring board connector of a wiring board are connected to by one group of lead；
(I) photo-sensitive cell and the wiring board are positioned over to the mold or once mould of a molding tool, with
The mold and the lower mould matched moulds when, the shaping that a ring-type is formed between the mold and the lower mould is empty
Between；；
(J) when adding the moulding material of flow-like to the molding space, by the supporting member positioned at the molding space
Part reduces impulsive force caused by the moulding material by way of stopping the moulding material to be influenceed to caused by the lead；
And
(K) molded base is formed after the mold material cures, wherein the molded base includes a molded body and tool
There is an optical window, wherein the molded body coats fringe region, the supporting member and the photo-sensitive cell of the wiring board
Non-photo-sensing region at least a portion.
Priority Applications (22)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610668807.1A CN107734215B (en) | 2016-08-12 | 2016-08-12 | Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment |
| EP16896568.9A EP3468165B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| KR1020187031125A KR102152516B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device |
| EP23176877.1A EP4231653A3 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| JP2018550699A JP7025345B2 (en) | 2016-03-28 | 2016-10-25 | Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices |
| PCT/CN2016/103247 WO2017166798A1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| US16/088,435 US11289521B2 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| TW108117228A TWI706212B (en) | 2016-03-28 | 2017-03-25 | Camera module and manufacturing method of moulded photosensitive component |
| TW108117229A TWI706213B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW106110048A TWI661258B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW106204228U TWM555960U (en) | 2016-03-28 | 2017-03-26 | Photographing module and its molded photosensitive component and electronic equipment |
| EP17788772.6A EP3481046A4 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020217022035A KR20210091363A (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020187034256A KR102147896B1 (en) | 2016-04-28 | 2017-04-26 | Photographic module and molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly and manufacturing method and electronic device |
| JP2018556877A JP6865232B2 (en) | 2016-04-28 | 2017-04-26 | Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices. |
| PCT/CN2017/082000 WO2017186120A2 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020207019834A KR102281383B1 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| PCT/CN2017/097425 WO2018028718A1 (en) | 2016-08-12 | 2017-08-14 | Camera module based on integral encapsulation technique and array camera module |
| CN202110534866.0A CN113992818A (en) | 2016-08-12 | 2017-08-14 | Camera module and array camera module based on integrated packaging technology |
| CN201780049556.1A CN109891870B (en) | 2016-08-12 | 2017-08-14 | Camera module and array camera module based on integrated packaging technology |
| JP2021060338A JP7344924B2 (en) | 2016-04-28 | 2021-03-31 | Imaging module manufacturing method |
| US17/678,347 US11824071B2 (en) | 2016-03-28 | 2022-02-23 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610668807.1A CN107734215B (en) | 2016-08-12 | 2016-08-12 | Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107734215A true CN107734215A (en) | 2018-02-23 |
| CN107734215B CN107734215B (en) | 2023-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610668807.1A Active CN107734215B (en) | 2016-03-28 | 2016-08-12 | Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment |
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| Country | Link |
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| CN (1) | CN107734215B (en) |
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