CN207382411U - Camera module and the electronic equipment with camera module - Google Patents

Camera module and the electronic equipment with camera module Download PDF

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Publication number
CN207382411U
CN207382411U CN201720557166.2U CN201720557166U CN207382411U CN 207382411 U CN207382411 U CN 207382411U CN 201720557166 U CN201720557166 U CN 201720557166U CN 207382411 U CN207382411 U CN 207382411U
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CN
China
Prior art keywords
substrate
camera module
photo
sensitive cell
molded
Prior art date
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Active
Application number
CN201720557166.2U
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Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201720557166.2U priority Critical patent/CN207382411U/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to US16/613,571 priority patent/US11233079B2/en
Priority to EP22169710.5A priority patent/EP4072120A3/en
Priority to EP18801348.6A priority patent/EP3627814B1/en
Priority to PCT/CN2018/087488 priority patent/WO2018210337A1/en
Application granted granted Critical
Priority to CN201880032867.1A priority patent/CN110637456A/en
Publication of CN207382411U publication Critical patent/CN207382411U/en
Priority to US17/550,733 priority patent/US11721709B2/en
Priority to US18/207,357 priority patent/US12119361B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a camera module and the electronic equipment with camera module, wherein the camera module includes an at least optical lens, at least a back side molded section, at least a photo-sensitive cell and a circuit board.The circuit board includes an at least substrate and is connected to an at least electronic component for the substrate switched only, the part in the non-photo-sensing region of the photo-sensitive cell is mounted on the substrate back of the substrate, and the photosensitive region of the photo-sensitive cell and the another part in non-photo-sensing region correspond to the substrate channel of the substrate, the back side molded section is integrally incorporated at least a portion region of the substrate back of the substrate, and the optical lens is maintained at the photosensitive path of the photo-sensitive cell.

Description

Camera module and the electronic equipment with camera module
Technical field
The utility model is related to optical imaging field, a more particularly to camera module and the electronics with camera module are set It is standby.
Background technology
At present, portable electric appts thin down, this causes the camera shooting mould for being configured in portable electric appts The camera end of group is forced to protrude from the surface of portable electric appts, such as postposition camera module, camera module Camera end is forced to protrude from the back side of portable electric appts, and has the camera shooting mould of long-focus and big zooming range Group, camera end are protruded more apparent.Since the portable electric appts such as smart mobile phone, tablet computer use now is flat Board-like designing scheme, camera end protrude from the surface of portable electric appts, can not only influence the outer of portable electric appts It sees, and the camera end for also resulting in camera module is easily touched, so that camera module is caused easily to be damaged.
Present camera module includes circuit board, the photo-sensitive cell being mounted on the circuit board and bearing and by institute The optical lens that bearing is maintained on the photosensitive path of the photo-sensitive cell is stated, is mounted in addition, the camera module further includes In Passive components such as the resistance of the circuit board, capacitance, driver, relay, processor, memory, inductors.It is existing The camera module have it is more the defects of.
First, these described Passive components, the photo-sensitive cell and the bearing are mounted on the circuit board The same side, and either in the horizontal direction or in short transverse, between the adjacent Passive components, the passive member Between device and the photo-sensitive cell, between the photo-sensitive cell and the bearing and the Passive components and the bearing Between be required to reserved safe distance, this cause camera module size in the horizontal direction and short transverse size all It can not be lowered.
Secondly, the photo-sensitive cell is being mounted on after the circuit board, it is necessary to by routing technique described photosensitive At least one side of element forms one group of gold thread, conductively to connect the photo-sensitive cell and the circuit board, and in order to ensure The good of the gold thread is electrically also required to reserved safe distance between the Passive components and the gold thread, this is further Cause the length and width dimensions of the camera module can not be reduced.
3rd, these described Passive components and the photo-sensitive cell are located at same space, this causes the passive member What the cast or the link position of the Passive components and the circuit board that the surface of device generates due to oxidation generated Cast, be easily adhered the photo-sensitive cell photosensitive region or be adhered to and be maintained at the photosensitive of the photo-sensitive cell On the filter element in path, and the bad phenomenon of dirty bad point is caused to generate.
4th, the adhesives of the fluid states such as the glue of the bearing by being applied in the circuit board is mounted on described On circuit board, in this process, the glue of fluid state may flow to the photosensitive region of the photo-sensitive cell, and cause institute The photosensitive region for stating photo-sensitive cell is contaminated.
In addition, the present camera module is the surface that the photo-sensitive cell is mounted on to the substrate, this causes institute State the distance between photo-sensitive cell and the optical lens and be limited in smaller scope, the present camera module in order to The height dimension of the camera module is reduced, is merely able to by reducing the distance between the photo-sensitive cell and the optical lens Mode realize that this causes the focal length of the camera module and zooming range to be reduced, so that having severely impacted described The performance and development space of camera module.
Utility model content
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The photo-sensitive cell for stating camera module is mounted on the substrate back of substrate, and the photosensitive region of the photo-sensitive cell corresponds to institute The substrate channel of substrate is stated, mode in this way can make described while the height dimension of the camera module is reduced Camera module has smaller back focal length and big zooming range.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein logical Cross the mode for the substrate back that the photo-sensitive cell is mounted on to the substrate, can ensure the focal length of the camera module and While zooming range, the height dimension of the camera module is further reduced.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Stating the substrate front side of substrate can be only applied to mount the bearing, mode in this way, be conducive to reduce the camera shooting mould The length and width dimensions of group, so that the camera module is especially suitable for being applied to pursue lightening electronic equipment.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The electronic component for stating camera module is connected to the substrate with being switched in the substrate back of the substrate.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein extremely A few electronic component is connected to the substrate with being switched in the substrate front side of the substrate, in this way, being conducive to carry The flexibility of the layout of the high electronic component.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute State at least a portion in the non-photo-sensing region of photo-sensitive cell can correspond to the substrate substrate front side it is at least one At least a portion of the electronic component, mode in this way enable to each component layouts of the camera module more To be compact, to be conducive to further reduce the volume of the camera module, especially further reduce the length of the camera module Wide size.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Stating need not be switched between photo-sensitive cell and the substrate by routing technique, but the photo-sensitive cell is being mounted on institute While stating the substrate back of substrate, the photo-sensitive cell and the substrate are conductively connected to, mode in this way, not only The manufacturing step of the camera module can be reduced and reduce manufacture cost, and be conducive to reduce the body of the camera module Product especially reduces the length and width dimensions of the camera module.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein The mounting position of the photo-sensitive cell and the substrate is filled with filler, to be prevented by the filler described photosensitive The mounting position of element and the substrate generates gap, so as to which fluid media (medium) in moulding technology, be avoided to pollute the photosensitive member The photosensitive region of part.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The photosensitive region of the photo-sensitive cell and at least a portion electronic component can be isolated by stating substrate, to avoid the electronics The cast on the surface of component pollutes the photosensitive region of the photo-sensitive cell, and generates the bad phenomenons such as dirty bad point, so as to have Beneficial to the product yield for ensureing the camera module.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute It states camera module and one sealing space is provided, the photosensitive region of the photo-sensitive cell is located in the sealing space, so as to avoid The cast for stating the surface of electronic component pollutes the photosensitive region of the photo-sensitive cell.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein In moulding technology, the fluid media (medium) is prevented from entering the sealing space, to avoid there is the sense for polluting the photo-sensitive cell The bad phenomenon in light region.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute State camera module back side molded section be integrally incorporated into the substrate substrate back at least a portion region, it is and described Back side molded section embeds at least a portion region of the photo-sensitive cell, so that the back side molded section, the substrate and described Photo-sensitive cell integrally combines.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute At least a portion that back side molded section embeds the mounting position of the photo-sensitive cell and the substrate is stated, to prevent the photosensitive member The substrate back of part from the substrate comes off.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute At least a portion that back side molded section embeds the mounting position of the photo-sensitive cell and the substrate is stated, to avoid the photosensitive member The substrate connection part of the chip contacts of part and the substrate is aoxidized, so as to ensure leading for the photo-sensitive cell and the substrate The reliability of logical position.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute At least a portion that back side molded section embeds the mounting position of the photo-sensitive cell and the substrate is stated, with by the back side mould The intensity of substrate described in the reinforcement of modeling portion and the flatness for ensureing the substrate.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute At least a portion that back side molded section embeds the mounting position of the photo-sensitive cell and the substrate is stated, with by the back side mould Modeling portion ensures the flatness of the photo-sensitive cell, and the substrate is no longer limited by so as to the flatness of the photo-sensitive cell, so that The substrate can be selected thinner plate, and then further reduce the height dimension of the camera module.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Stating back side molded section by way of embedding the electronic component, can isolate surface and the external rings of the electronic component Border is aoxidized to avoid the surface of the electronic component, so as to ensure the good electrical of the electronic component.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Back side molded section is stated by way of embedding the electronic component, isolates the adjacent electronic component, it is described so as to avoid Such as there are interfering with each other at the bad phenomenons in electronic component.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute State back side molded section and isolate the adjacent electronic component, this cause the distance between adjacent described electronic component can by into One step reduces, in order to mount the more and larger-sized electronic component on limited attachment area.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The module connecting side for stating the connecting plate of camera module is connected to the substrate back of the substrate, and the back side molded section can wrap The module connecting side of the connecting plate is buried, in a manner of by being integrally incorporated into the substrate and the connecting plate, avoids institute It states connecting plate to come off from the substrate, so as to ensure the reliability of the camera module.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Stating back side molded section will not be deformed when heated, to advantageously ensure that the flatness of the photo-sensitive cell.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Back side molded section is stated with good heat-sinking capability, the heat that the photo-sensitive cell is generated rapidly is radiated the camera shooting The external environment of module, so as to ensure reliability of the camera module when being used for a long time.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein During assembling the camera module to the electronic equipment, the electronic component is needed not worry about because being set with the electronics Standby build-up member collides and scratches the electronic component or the electronic component is caused to come off from the substrate, To ensure the reliability of the camera module when in use.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The substrate back that back side molded section covers the substrate is stated, so as to avoid the substrate back of the substrate exposed, in assembling institute During stating camera module to the electronic equipment, prevent from scratching the substrate back of the substrate, so as to ensure the substrate It is electrical.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Back side molded section is stated with an at least assembly space, for accommodating the build-up member of the electronic equipment, in this way, in the camera shooting The circumferential direction of module, the camera module can be corresponded with the build-up member of the electronic equipment.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Stating quantity, size and the position of the assembly space of back side molded section can be provided as needed, to improve the camera shooting Flexibility of the module when being assembled.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The electronic component can be embedded after the substrate back of the substrate is incorporated by stating back side molded section, so as to when the camera shooting When module is accidentally shaken, the electronic component can prevent the substrate back of back side molded section from the substrate from taking off Fall.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute At least a portion region of substrate front side of the substrate can be integrally incorporated by stating the molded base of camera module, thus Glue need not be applied between the substrate front side of the molded base and the substrate, to reduce the manufacture of camera module step Height dimension that is rapid and reducing the camera module.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The non-photo-sensing region of the photo-sensitive cell can be embedded by stating molded base, so that the module pedestal and the substrate and the sense Optical element integrally combines.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The electronic component for the substrate front side that molded base can be embedded positioned at the substrate is stated, so as in the electronic component Safe distance need not be reserved between the molded base, mode in this way can further reduce the camera shooting mould The size of group.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Molded base and the back side molded section are stated respectively in combination in the substrate front side and substrate back of the substrate.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Molded base and the back side molded section are stated by secondary moulding technology respectively in connection in the substrate front side and substrate of the substrate The back side.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The filter element for stating camera module is mounted on the substrate front side of the substrate, in the filter element, the substrate and institute It states and forms the sealing space between photo-sensitive cell, and in subsequent moulding technology, the fluid media (medium) is prevented to enter institute State sealing space.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The transparent protection element for stating camera module is overlappingly arranged at the substrate front side of the substrate, with the protection element, The sealing space is formed between the substrate and the photo-sensitive cell, and in subsequent moulding technology, prevents the stream Body medium enters the sealing space.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute The substrate front side and molding die of the substrate can be isolated by stating protection element, thus in moulding technology, the protection element The substrate front side of the substrate can be avoided to be scraped off, to ensure the product yield of the camera module.
One of the utility model is designed to provide a camera module and the electronic equipment with camera module, wherein institute Stating protection element has elasticity, to absorb the impact force that the molding die is generated when being molded, and avoids the impact force straight It connects and acts on the substrate, mode in this way can be further ensured that the product yield of the camera module.
According to the one side of the utility model, the utility model provides a camera module, including an at least optical lens, An at least back side molded section, at least a photo-sensitive cell and an at least circuit board, and the camera module is close at least one Seal space；
Wherein described photo-sensitive cell has a photosensitive region and is looped around a non-photo-sensing region of the photosensitive region surrounding；
Wherein described circuit board includes an at least substrate, and the substrate has a substrate front side, a substrate back and extremely A few substrate channel, the substrate front side and the substrate back correspond, and the substrate channel prolongs from the substrate front side The substrate back is extended, it is empty that the camera module forms the sealing in the corresponding position of the substrate channel of the substrate Between, wherein the part in the non-photo-sensing region of the photo-sensitive cell is mounted on the substrate back of the substrate, and And the photo-sensitive cell is connected to the substrate, the photosensitive region of the photo-sensitive cell and the non-photo-sensing area with being switched on The another part in domain corresponds to the substrate channel of the substrate and positioned at the sealing space, wherein the optical lens quilt The photosensitive path of the photo-sensitive cell is maintained at, wherein the back side molded section is integrally incorporated into the substrate of the substrate At least a portion region at the back side.
One embodiment according to the present utility model, the camera module further comprise an at least filter element, wherein The filter element is arranged at the substrate front side of the substrate, and in the filter element, the substrate and described The sealing space is formed between photo-sensitive cell.
One embodiment according to the present utility model, the camera module further comprise a buffer part, wherein described slow At least a portion for rushing portion is maintained between the filter element and the substrate front side of the substrate.
One embodiment according to the present utility model, the camera module further comprise a transparent protection element, Described in protection element be overlappingly arranged at the substrate front side of the substrate, and in the protection element, the base The sealing space is formed between plate and the photo-sensitive cell.
One embodiment according to the present utility model, the camera module further comprise an at least molded base, wherein The molded base has an at least optical window, wherein the molded base is integrally incorporated into the substrate front side of the substrate At least a portion region, the molded base is looped around the surrounding of the photosensitive region of the photo-sensitive cell, so that described The part in the photosensitive region of photo-sensitive cell and the non-photo-sensing region corresponds to the optical window.
One embodiment according to the present utility model, the camera module further comprise an at least molded base, wherein The molded base has an at least optical window, wherein the molded base is integrally incorporated into the substrate front side of the substrate At least a portion region, and the molded base embeds the outer edge of the filter element, and the molded base is looped around The surrounding of the photosensitive region of the photo-sensitive cell, so that the photosensitive region of the photo-sensitive cell and the non-photo-sensing area The part in domain corresponds to the optical window.
One embodiment according to the present utility model, the camera module further comprise an at least molded base, wherein The molded base has an at least optical window, wherein the molded base is integrally incorporated into the substrate front side of the substrate At least a portion region, and the molded base embeds the outer edge of the filter element, and the molded base is looped around The surrounding of the photosensitive region of the photo-sensitive cell, so that the photosensitive region of the photo-sensitive cell and the non-photo-sensing area The part in domain corresponds to the optical window.
One embodiment according to the present utility model, a part for the buffer part are maintained at the molded base and institute Between the substrate front side for stating substrate.
One embodiment according to the present utility model, the camera module further comprise the supporting member of an at least frame shape Part, wherein the supporting member is arranged at the outer edge of the filter element or the supporting member is formed at the filter The outer edge of optical element, the molded base embed at least a portion of the supporting member.
One embodiment according to the present utility model, the photo-sensitive cell have a chip back, the back side molded section Embed at least a portion region of the chip back of the photo-sensitive cell.
One embodiment according to the present utility model, the camera module further comprise a protective element, wherein described Photo-sensitive cell has a chip back, and the protective element is overlappingly arranged at the chip back of the photo-sensitive cell, Wherein described protective element has an exposed region and is centered around an embedding region of the exposed region surrounding, the back side mould Modeling portion embeds the embedding region of the protective element.
One embodiment according to the present utility model, the circuit board further comprises an at least electronic component, described Electronic component protrudes from the substrate front side of the substrate.
One embodiment according to the present utility model, the circuit board further comprises an at least electronic component, described Electronic component protrudes from the substrate back of the substrate.
One embodiment according to the present utility model, the circuit board further comprise an at least electronic component, at least One electronic component protrudes from the substrate front side of the substrate, and the other electronic component protrudes from described The substrate front side of substrate.
One embodiment according to the present utility model, the circuit board further comprise an at least connecting plate, the connection Plate has a module connecting side, wherein the module connecting side of the connecting plate is being mounted on the substrate of the substrate just Face.
One embodiment according to the present utility model, the circuit board further comprise an at least connecting plate, the connection Plate has a module connecting side, wherein the module connecting side of the connecting plate is mounted on the substrate back of the body of the substrate Face.
One embodiment according to the present utility model, the molded base embedding are protruding from the substrate of the substrate just At least a portion of at least one electronic component in face.
One embodiment according to the present utility model, the back side molded section embedding protrude from the substrate of the substrate At least a portion of at least one electronic component at the back side.
One embodiment according to the present utility model, the molded base embed the module connection of the connecting plate Side.
One embodiment according to the present utility model, the back side molded section embed the module connection of the connecting plate Side.
One embodiment according to the present utility model, the shape of the back side molded section is in " mouth " font；Or the back of the body The shape of face molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or the back side molding The shape in portion is in " I " font；Or the shape of the back side molded section is in " II " font；Or the shape of the back side molded section In " III " font；Or the shape of the back side molded section is in " X " font；Or the shape of the back side molded section is in " L " Shape；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " font；Or The shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants shape；Or the back of the body The shape of face molded section is in latticed；Or the shape of the back side molded section is square；Or the back side molded section Shape is rectangle；Or the shape of the back side molded section is trapezoidal；Or the shape of the back side molded section is rounded；Or The shape of back side molded section is oval described in person.
One embodiment according to the present utility model, the camera module further comprise an at least driver, wherein institute It states optical lens and is driveably arranged at the driver, the driver is mounted on the top surface of the molded base； Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel is mounted on institute State the top surface of molded base；Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, The lens barrel integrally extends the molded base；Or further comprise a lens barrel, wherein the lens barrel and the optics Camera lens is mounted on the top surface of the molded base respectively, and the lens barrel is looped around the surrounding of the optical lens；Or Person further comprises an at least lens barrel, wherein the lens barrel integrally extends the molded base, the optical lens is pasted Top surface loaded on the molded base, and the lens barrel is looped around the surrounding of the optical lens；Or the optical frames Head is mounted on the surrounding of the molded base.
According to the other side of the utility model, the utility model further provides for an electronic equipment, including：
One apparatus body；With
An at least camera module, wherein the camera module is arranged at the apparatus body, wherein the camera module Further comprise an at least optical lens, at least a back side molded section, at least a photo-sensitive cell and an at least circuit board, and The camera module has an at least sealing space；
Wherein described photo-sensitive cell has a photosensitive region and is looped around a non-photo-sensing region of the photosensitive region surrounding；
Wherein described circuit board includes an at least substrate, and the substrate has a substrate front side, a substrate back and extremely A few substrate channel, the substrate front side and the substrate back correspond, and the substrate channel prolongs from the substrate front side The substrate back is extended, it is empty that the camera module forms the sealing in the corresponding position of the substrate channel of the substrate Between, wherein the part in the non-photo-sensing region of the photo-sensitive cell is mounted on the substrate back of the substrate, and And the photo-sensitive cell is connected to the substrate, the photosensitive region of the photo-sensitive cell and the non-photo-sensing area with being switched on The another part in domain corresponds to the substrate channel of the substrate and positioned at the sealing space, wherein the optical lens quilt The photosensitive path of the photo-sensitive cell is maintained at, wherein the back side molded section is integrally incorporated into the substrate of the substrate At least a portion region at the back side.
Description of the drawings
Fig. 1 is the section view signal according to one of the manufacturing step of a camera module of a preferred embodiment of the utility model Figure.
Fig. 2A and Fig. 2 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step two Schematic cross-sectional view.
Fig. 3 is shown according to three section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.
Fig. 4 is shown according to four section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.
Fig. 5 is shown according to five section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.
Fig. 6 is shown according to six section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.
Fig. 7 A and Fig. 7 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step seven Schematic cross-sectional view.
Fig. 8 is shown according to eight section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.
Fig. 9 is shown according to nine section view of the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model It is intended to.
Figure 10 is ten section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 11 is after being splitted according to the camera module of the above-mentioned preferred embodiment of the utility model along centre position Internal structure schematic diagram.
Figure 12 is the stereoscopic schematic diagram according to the camera module of the above-mentioned preferred embodiment of the utility model.
Figure 13 is the application state schematic diagram according to the camera module of the above-mentioned preferred embodiment of the utility model.
Figure 14 is a variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 15 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 16 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 17 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 18 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 19 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 20 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 21 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 22 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Stereoscopic schematic diagram.
Figure 23 is a variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram after being splitted along centre position.
Figure 24 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 25 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 26 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 27 A are to be splitted according to the camera module of the above-mentioned preferred embodiment of the utility model along centre position Internal structure schematic diagram afterwards.
Figure 27 B are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention One of stereoscopic schematic diagram, which illustrate the process that a protection element is overlappingly attached to a substrate.
Figure 27 C are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention One of stereoscopic schematic diagram, which illustrate the state that the protection element is overlappingly attached to the substrate.
Figure 27 D are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Two stereoscopic schematic diagram, which illustrate the process that a photo-sensitive cell is mounted on to the substrate.
Figure 27 E are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Two stereoscopic schematic diagram, which illustrate the state that the photo-sensitive cell is mounted on to the substrate.
Figure 27 F are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Two schematic cross-sectional view.
Figure 27 G are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Three schematic cross-sectional view.
Figure 27 H are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Four schematic cross-sectional view.
Figure 27 I are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Five schematic cross-sectional view.
Figure 27 J are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Six schematic cross-sectional view.
Figure 27 K are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Seven schematic cross-sectional view.
Figure 27 L are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Eight schematic cross-sectional view.
Figure 27 M are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Nine schematic cross-sectional view.
Figure 27 N are the manufacturing steps of the above embodiment of the camera module of above-mentioned preferred embodiment under this invention Ten schematic cross-sectional view.
Figure 28 is the section view according to one of the manufacturing step of the camera module of another preferred embodiment of the utility model Schematic diagram.
Figure 29 A and Figure 29 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step it Two schematic cross-sectional view.
Figure 30 is three section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 31 is four section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 32 is five section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 33 is six section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 34 A and Figure 34 B be according to the camera module of the above-mentioned preferred embodiment of the utility model manufacturing step it Seven schematic cross-sectional view.
Figure 35 is eight section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 36 is nine section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 37 is ten section view according to the manufacturing step of the camera module of the above-mentioned preferred embodiment of the utility model Schematic diagram.
Figure 38 is after being splitted according to the camera module of the above-mentioned preferred embodiment of the utility model along centre position Internal structure schematic diagram.
Figure 39 is the stereoscopic schematic diagram according to the camera module of the above-mentioned preferred embodiment of the utility model.
Figure 40 is a variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Internal structure schematic diagram after being splitted along centre position.
Figure 41 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 42 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 43 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 44 A are another variant embodiments according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 44 B are another variant embodiments according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 45 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 46 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 47 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 48 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 49 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 50 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 51 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 52 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 53 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 54 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 55 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 56 is another variant embodiment according to the camera module of the above-mentioned preferred embodiment of the utility model Splitted along centre position after internal structure schematic diagram.
Figure 57 is a reality according to an optical lens of the camera module of the above-mentioned preferred embodiment of the utility model Apply the schematic top plan view of mode.
Figure 58 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.
Figure 59 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.
Figure 60 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.
Figure 61 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.
Figure 62 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.
Figure 63 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.
Figure 64 be according to the camera module of the above-mentioned preferred embodiment of the utility model the optical lens it is another The schematic top plan view of a variant embodiment.
Specific embodiment
It is described below to disclose the utility model so that those skilled in the art can realize the utility model.It retouches below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following The basic principle of the utility model defined in stating can be applied to other embodiments, deformation scheme, improvement project, etc. Tongfangs The other technologies scheme of case and spirit and scope without departing from the utility model.
It will be understood by those skilled in the art that in the exposure of the utility model, term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instructions such as " outer " or position close System is based on orientation shown in the drawings or position relationship, is for only for ease of description the utility model and simplifies description, without It is instruction or implies that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that limitation to the utility model.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no It is understood that as the limitation to quantity.
With reference to the utility model Figure of description attached drawing 1 to Figure 13, according to a preferred embodiment of the utility model The application of one camera module 100 and its camera module 100 is set forth in following description, described in wherein at least one Camera module 100 can be assemblied in an apparatus body 200, so that the camera module 100 and the apparatus body 200 can Form an electronic equipment, refer to the attached drawing 13.
In other words, the electronic equipment includes the apparatus body 200 and is arranged at the apparatus body 200 at least One camera module 100, wherein the camera module 100 can be used for obtaining image (such as video or image).
It is noted that although in the example of the electronic equipment shown in Figure 13, the camera module 100 It is arranged at the back side (one side that facing away from the display screen of the apparatus body 200) of the apparatus body 200, it is possible to understand that , the camera module 100 can also be arranged at the positive side (display of the apparatus body 200 of the apparatus body 200 One side where screen) or at least one camera module 100 be arranged at the back side and extremely of the apparatus body 200 A few camera module 100 is arranged at the back side of the apparatus body 200, the i.e. back side in the apparatus body 200 At least one camera module 100 is equipped with positive side.Nevertheless, it will be appreciated by those skilled in the art that, In other examples of the electronic equipment, one or more described camera module 100 is arranged on the apparatus body 200 Side is also possible that.
In addition, although the apparatus body 200 of the electronic equipment shown in Figure 13 is smart mobile phone, and In other examples, the apparatus body 200 can also be implemented as but be not limited to tablet computer, electric paper book, MP3/4/5, a Any electronic product that can be configured the camera module 100 such as personal digital assistant, camera, television set, washing machine, refrigerator.
Attached drawing 11 show the camera module 100 splitted along centre position after internal structure schematic diagram, it is attached Figure 12 shows the stereoscopic-state of the camera module 100.Specifically, the camera module 100 includes an at least optical frames First 10, at least one photo-sensitive cell 20 and a circuit board 30, wherein the photo-sensitive cell 20 is connected to the circuit switched only Plate 30, the optical lens 10 are maintained at the photosensitive path of the photo-sensitive cell 20.
Inside of the light being reflected by the object from the optical lens 10 into the camera module 100, it is then described Photo-sensitive cell 20 receives and carries out photoelectric conversion and be imaged, and the photo-sensitive cell 20 carries out the shadow with object that photoelectric conversion obtains As relevant electric signal can be transmitted by the circuit board 30, for example, the circuit board 30 can be by the correction of image with object The electric signal transmission to the apparatus body 200 for being connected to the circuit board 30.That is, the circuit board 30 The apparatus body 200 can be connected to switched only, the camera module 100 is assemblied in the apparatus body 200 and Form the electronic equipment.
Further, refer to the attached drawing 11, the circuit board 30 include an at least substrate 31 and an at least electronic component 32, Wherein each electronic component 32 is connected to the substrate 31 respectively switched only.
Specifically, the substrate 31 has a substrate front side 311, a substrate back 312 and an at least substrate channel 310, wherein the substrate front side 311 and the substrate back 312 correspond, the substrate channel 310 is from the substrate 31 The substrate front side 311 extend to the substrate back 312.That is, the substrate channel 310 can connect the base The substrate front side 311 of plate 31 and the substrate back 312.In other words, the substrate channel 310 is a perforation, such as The substrate channel 310 can be but not limited to a central hole.
Under normal conditions, the substrate 31 is plate-like, and the substrate front side 311 of the substrate 31 and the substrate The back side 312 is mutually parallel, so as to the distance between the substrate front side 311 of the substrate 31 and the substrate back 312 energy Enough it is used for the thickness for defining the substrate 31.Nevertheless, it will be appreciated by those skilled in the art that, it is new in this practicality In other examples of the camera module 100 of type, the substrate front side 311 of the substrate 31 and the substrate back 312 In it is at least one can be equipped with bulge-structure or groove, the camera module 100 of the utility model in this respect from Limitation.
In addition, the substrate channel 310 of the substrate 31 is typically what is be square, such as square or rectangle, It will be understood by those skilled in the art that in other examples of the camera module 100, the institute of the substrate 31 Other any possible shapes can also be had by stating substrate channel 310, such as, but not limited to circular, ellipse.Nevertheless, in order to Reduce the length and width dimensions of the camera module 100, the shape and size of the substrate channel 310 of the substrate 31 are arranged to It is corresponded with the shape and size of the photo-sensitive cell 20.
It is noted that the type of the substrate 31 can not also in the camera module 100 of the utility model It is restricted, such as the substrate 31 can be selected but be not limited to hardboard, soft board, Rigid Flex, ceramic wafer etc..
In this example of the camera module 100 shown in attached drawing 11, at least one electronic component 32 exists The substrate front side 311 of the substrate 31 is connected to the substrate 31 switched only, and the electronic component 32 in addition exists The substrate back 312 of the substrate 31 is connected to the substrate 31, mode in this way, the electronics member switched only The layout of device 32 can be more flexible.
It, can will be described in whole nevertheless, in another example of the camera module 100 shown in attached drawing 23 Electronic component 32 is conductively connected to the substrate 31 or in attached drawing 24 in the substrate front side 311 of the substrate 31 It, can also be by whole electronic components 32 in the substrate in another example of the camera module 100 shown 31 substrate back 312 is conductively connected to the substrate 31.
It is noted that the type of the electronic component 32 in the camera module 100 of the utility model not Be restricted, for example, the electronic component 32 may be implemented as but be not limited to processor, relay, memory, driver, sense Answer device, resistance, capacitance etc..
Further, in a specific example of the camera module 100 of the utility model, the electronic component 32 can make institute by way of being mounted on the substrate front side 311 of the substrate 31 and/or the substrate back 312 State electronic component 32 the substrate 31 the substrate front side 311 and/or the substrate back 312 it is switched on be connected to The substrate 31.
In another specific example of the camera module 100 of the utility model, the electronic component 32 also may be used To be partly embedded to the substrate 31, and institute in the substrate front side 311 of the substrate 31 and/or the substrate back 312 It states electronic component 32 and is connected to the substrate 31 switched only, i.e. a part for the electronic component 32 protrudes from described The substrate front side 311 of substrate 31 and/or the substrate back 312, mode in this way can be reduced further described The height dimension of camera module 100.Optionally, the electronic component 32 can also be wholly embedded into the substrate 31 Portion.
With continued reference to attached drawing 11, the circuit board 30 further comprises a connecting plate 33, wherein the connecting plate 33 has One module connecting side 331 and an equipment connecting side 332, wherein the module connecting side 331 of the connecting plate 33 is connected to The substrate back 312 of the substrate 31, such as the module connecting side 331 of the connecting plate 33 can pass through a connection Portion 34 is connected to the substrate back 312 of the substrate 31 switched only, wherein the connecting portion 34 can be but not limited to Anisotropy conductiving glue water or anisotropy conductiving glue band.In addition, the equipment connecting side 332 of the connecting plate 33 can The apparatus body 200 is connected to, such as the equipment connecting side 332 of the connecting plate 33 can be provided with or be formed A connector 333 of the connecting plate 33, for being connected to the apparatus body 200.
Nevertheless, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 In, the module connecting side 331 of the connecting plate 33 is conductively connected in the substrate front side 311 of the substrate 31 The substrate 31 is also possible that.In some other examples of the camera module 100, by the institute of the connecting plate 33 Module connecting side 331 is stated to be connected to the side of the substrate 31 or make 331 He of module connecting side of the connecting plate 33 The substrate 31 is integrally formed what is be possible to.
It is noted that the connecting plate 33 is deformable, so as to which the connecting plate 33 can be delayed by way of deformation Rush the electronic equipment during by use due to vibrations and caused by the camera module 100 displacement, so as to ensure The reliability of the electronic equipment when in use.
Further, the substrate 31 has at least one set of substrate connection part 315, wherein the substrate of the substrate 31 Connector 315 is located at and protrudes from the substrate back 312 of the substrate 31.Preferably, the base of the substrate 31 Plate connector 315 is looped around the surrounding of the substrate channel 310.Optionally, the substrate connection part 315 of the substrate 31 can To be disposed in the one side of the substrate channel 310 either both sides or three sides.For example, when the substrate of the substrate 31 connects When fitting 315 is disposed in the both sides of the substrate channel 310, the substrate connection part 315 can be disposed in the substrate The adjacent both sides of passage 310 can also be disposed in the opposite sides of the substrate channel 310.
The photo-sensitive cell 20 has at least one set of 21 and one photosensitive region 22 of chip contacts and is looped around the sense One non-photo-sensing region 23 of 22 surrounding of light region, wherein the chip contacts 21 are located at and protrude from the photo-sensitive cell 20 The non-photo-sensing region 23.The chip contacts 21 of the photo-sensitive cell 20 can be looped around the photosensitive region 22 Surrounding.Optionally, the chip contacts 21 of the photo-sensitive cell 20 can by positioned at the one side of the photosensitive region 22 or Person both sides or three sides.For example, when the chip contacts 21 of the photo-sensitive cell 20 are located at the two of the photosensitive region 22 During side, the chip contacts 21 can be located at the adjacent both sides of the photosensitive region 22, can also be located at the photosensitive region 22 opposite sides.
At least a portion in the non-photo-sensing region 23 of the photo-sensitive cell 20 is mounted on the described of the substrate 31 Substrate back 312, so that the chip contacts 21 of the photo-sensitive cell 20 are connected to the institute of the substrate 31 switched only It states substrate connection part 315 and the photosensitive region 22 of the photo-sensitive cell 20 is made to correspond to the substrate of the substrate 31 Passage 310.Preferably, the part in the non-photo-sensing region 23 of the photo-sensitive cell 20 also corresponds to the institute of the substrate 31 State substrate channel 310.
It is noted that in the camera module 100 of the utility model, it is mounted on by the photo-sensitive cell 20 While the substrate back 312 of the substrate 31, the chip contacts 21 of the photo-sensitive cell 20 connect switched only It is connected to the substrate connection part 315 of the substrate 31, mode in this way can reduce the system of the camera module 100 Step is made, with the production efficiency for advantageously reducing the manufacture cost of the camera module 100 and improving the camera module 100. In addition, the photo-sensitive cell 20 is mounted on the mode of the substrate back 312 of the substrate 31 by the utility model, be conducive to While the height dimension of the camera module 100 is controlled, make focal length and bigger of the camera module 100 with bigger Zooming range or in the focal length and the mode of zooming range for controlling the camera module 100, makes the camera module 100 Height dimension is lower.
It's also worth mentioning that the chip contacts 21 of the photo-sensitive cell 20 shape and arrangement with it is described The shape and arrangement of the substrate connection part 315 of substrate 31 in the camera module 100 of the utility model from Limitation.For example, the chip contacts 21 of the photo-sensitive cell 20 can be disc-shaped, spherical etc., and correspondingly, the substrate 31 The substrate connection part 315 can also be disc-shaped, spherical etc..
Preferably, in the thickness direction of the substrate 31, positioned at least the one of the substrate front side 311 of the substrate 31 At least a portion of a electronic component 32 can correspond to the non-photo-sensing region 23 of the photo-sensitive cell 20.Also It is to say, from the point of view of visual angle is overlooked, positioned at least one electronic component 32 of the substrate front side 311 of the substrate 31 At least a portion and the non-photo-sensing region 23 of the photo-sensitive cell 20 can be overlapped, mode in this way, energy Enough reduce the length and width dimensions of the camera module 100.
It will be appreciated by those skilled in the art that the substrate connection part 315 of the substrate 31 protrude from it is described The substrate back 312 of substrate 31, the chip contacts 21 of the photo-sensitive cell 20 protrude from the photo-sensitive cell 20 The non-photo-sensing region 23, so as to when the part in the non-photo-sensing region 23 of the photo-sensitive cell 20 be mounted on it is described The substrate back 312 of substrate 31, and make the photo-sensitive cell 20 the chip contacts 21 be conductively connected to it is described After the substrate connection part 315 of substrate 31, in the non-photo-sensing region 23 of the photo-sensitive cell 20 and the substrate 31 An at least gap 24 is formed between the substrate back 312.In the camera module 100 of the utility model, by described in A part for photo-sensitive cell 20 is mounted on the substrate back 312 of the substrate 31, and makes the described of the photo-sensitive cell 20 After chip contacts 21 are conductively connected to the substrate connection part 315 of the substrate 31, the photo-sensitive cell is being formed at One filler of filling in the 20 non-photo-sensing region 23 and the gap 24 of the substrate back 312 of the substrate 31 5000, to fill the gap 24.
Preferably, the filler 5000 is being filled in the non-photo-sensing region 23 that is formed at the photo-sensitive cell 20 The photo-sensitive cell 20 is formed at before the gap 24 of the substrate back 312 of the substrate 31 and being filled in The non-photo-sensing region 23 and the substrate 31 the substrate back 312 the gap 24 when in fluid state, and The filler 500 is filled in and is formed at described in the non-photo-sensing region 23 of the photo-sensitive cell 20 and the substrate 31 The solidify afterwards in the gap 24 of substrate back 312, to seal the gap 24.
It is noted that the material of the filler 5000 in the camera module 100 of the utility model from Limitation, such as the filler 5000 may be implemented as but be not limited to glue or resin etc..
In the camera module 100 of the utility model, on the one hand, the filler 5000 can be used in described in connection Substrate 31 and the photo-sensitive cell 20, so that the photo-sensitive cell 20 is securely mounted on the substrate back of the substrate 31 312, on the other hand, the filler 5000 is by being maintained at the substrate back 312 of the substrate 31 and described photosensitive Mode between the non-photo-sensing region 23 of element 20, filling are formed at the substrate back 312 and the institute of the substrate 31 The gap 24 between the non-photo-sensing region 23 of photo-sensitive cell 20 is stated, in another aspect, the filler 5000 can hinder Only the substrate connection part 32 of the chip contacts 21 of the photo-sensitive cell 20 and the substrate 31 connects with external environment It touches, so as to by avoiding the chip contacts 21 of the photo-sensitive cell 20 and the substrate connection part 31 of the substrate 31 The mode aoxidized ensures the chip contacts 21 of the photo-sensitive cell 20 and the substrate connection part of the substrate 31 The reliability of 31 connection relation.The camera module 100 includes a molding unit 40, wherein the molding unit 40 includes one Back side molded section 41, wherein the back side molded section 41 is integrally incorporated into the substrate back 312 of the substrate 31 extremely Few a part of region.For example, in this preferable examples of the camera module 100 shown in attached drawing 11 and Figure 12, the back of the body Face molded section 41 is integrally incorporated at least a portion region of the substrate back 312 of the substrate 31, and the back of the body Face molded section 41 embeds the whole region of the chip back 25 of the photo-sensitive cell 20, so that the back side molded section 41, described Photo-sensitive cell 20 and the substrate 31 integrally combine, to form a molded circuit board component 2000.It will of course be understood that It is that in other examples of the camera module 100, the back side molded section 41 can also be only embedded the photo-sensitive cell 20 At least a portion region of the chip back 25.
That is, according to the other side of the utility model, the utility model further provides for the molded circuit board Component 2000, wherein the molded circuit board component 2000 includes the substrate 31, the electronic component 32, the photosensitive member Part 20 and the back side molded section 41, wherein the electronic component 32 is connected to the substrate of the substrate 31 switched only Front 311 and/or the substrate back 312, wherein the photo-sensitive cell 20 is connected to the described of the substrate 31 switched only Substrate back 312, and the part in the photosensitive region 22 of the photo-sensitive cell 20 and the non-photo-sensing region 23 is corresponding In the substrate channel 310 of the substrate 31, wherein the back side molded section 41 is integrally incorporated into the institute of the substrate 31 At least a portion region for stating substrate back 312 and at least a portion for the chip back 25 for embedding the photo-sensitive cell 20 Region.
In other words, the back side molded section 41 can embed the mounting position of the photo-sensitive cell 20 and the substrate 31 It at least partially, can so as to ensure the camera module 100 to prevent the photo-sensitive cell 20 from coming off from the substrate 31 By property.Also, the back side molded section 41 is by embedding the mounting position of the photo-sensitive cell 20 and the substrate 31 at least The mode of a part, additionally it is possible to isolate described in the chip contacts 21 of the photo-sensitive cell 20 and external environment and isolation The substrate connection part 315 and external environment and the isolation chip contacts 21 of substrate 31 and the substrate connection part 315 link position and external environment, to avoid the chip contacts 21, the substrate connection part 315 and the chip The mode that the link position of connector 21 and the substrate connection part 315 is aoxidized, ensures the photo-sensitive cell 20 and the base The reliability of the conduction position of plate 31.
It is understood that the filler 5000 can also isolate the chip contacts 21 of the photo-sensitive cell 20 It is connected with the substrate connection part 315 of external environment and the isolation substrate 31 with external environment and the isolation chip The link position and external environment of part 21 and the substrate connection part 315 connect to avoid the chip contacts 21, the substrate The link position of fitting 315 and the chip contacts 21 and the substrate connection part 315 is aoxidized, so as to ensure the sense The reliability of the conduction position of optical element 20 and the substrate 31.
In addition, the back side molded section 41 embeds at least the one of the mounting position of the photo-sensitive cell 20 and the substrate 31 Part, additionally it is possible to by the intensity of substrate 31 described in 41 reinforcement of back side molded section and the flatness of the guarantee substrate 31. Preferably, by make the back side molded section 41 embed the photo-sensitive cell 20 the chip back 25 it is at least part of Mode, additionally it is possible to ensure the flatness of the photo-sensitive cell 20 by the back side molded section 41, so that the photosensitive member The flatness of part 20 is limited to the back side molded section 41, in this way, on the one hand can ensure the flatness of the photo-sensitive cell 20, On the other hand, the substrate 31 can select thinner plate, to advantageously reduce the height dimension of the camera module 100.
The back side molded section 41 will not be deformed when heated, so as to when the camera module 100 is by for a long time In use, when the heat that the photo-sensitive cell 20 generates acts on the back side molded section 41, the back side molded section 41 will not It is deformed, to advantageously ensure that the flatness of the photo-sensitive cell 20.Preferably, the back side molded section 41 has good Heat-sinking capability, wherein the heat that the photo-sensitive cell 20 generates can be rapidly radiated described take the photograph by the back side molded section 41 As the external environment of module 100, so as to ensure reliability of the camera module 100 when being used for a long time.
In addition, the back side molded section 41 is by being integrally incorporated into the side of the substrate back 312 of the substrate 31 Formula, the substrate back 312 that can avoid the substrate 31 is exposed, thus described the back side molded section 41 is assemblied in Apparatus body 200 and when forming the electronic equipment, other build-up members of the apparatus body 200 will not be because touching the base The substrate back 312 of plate 31 and scratch the substrate 31, so as to advantageously ensure that the substrate 31 it is good electrically.
With continued reference to attached drawing 11, the back side molded section 41 can embed the substrate back for protruding from the substrate 31 At least a portion of 312 at least one electronic component 32, mode in this way, on the one hand, the back side molding Portion 41 can isolate surface and the external environment of the electronic component 32, with the surface by avoiding the electronic component 32 The mode aoxidized ensures the good electrical of the electronic component 32, and on the other hand, the back side molded section 41 can pass through The mode for isolating the adjacent electronic component 32 prevents the adjacent electronic component 32 from the bad phenomenons such as occurring interfering with each other, Thus can be by attachment greater number and bigger ruler on the limited attachment area of the substrate back 312 of the substrate 31 The very little electronic component 32, to be conducive to improve the performance and image quality of the camera module 100, in another aspect, institute State back side molded section 41 avoids the electronic component 32 exposed by way of embedding the electronic component 32, so as to incite somebody to action During the camera module 100 is assemblied in the apparatus body 200, need not worry about the electronic component 32 because with institute Other build-up members for stating apparatus body 200 touch and scratch the electronic component 32 or cause the electronic component 32 come off from the substrate 31, to ensure reliability of the camera module 100 when being assembled and being used, and it is described Electronic component 32 can also prevent the substrate back 312 of the back side molded section 41 from the substrate 31 from coming off, to protect The back side molded section 41 is demonstrate,proved to be securely joined in the substrate back 312 of the substrate 31.
With further reference to attached drawing 11, in this preferable examples of the camera module 100 of the utility model, the back of the body The height that face molded section 41 protrudes from the substrate back 312 of the substrate 31 is more than or equal to the electronic component 32 Protrude from the height of the substrate back 312 of the substrate 31.Specifically, the back side molded section 41 has a free side Face 4111 and one combines side 4112, wherein the free side 4111 of the back side molded section 41 and the combination side 4112 correspond, and the combination side 4112 of the back side molded section 41 is integrally incorporated into the institute of the substrate 31 State at least a portion region of substrate back 312 and at least a portion area of the chip back 25 of the photo-sensitive cell 20 Domain.
If the back side molded section 41 protrudes from the height dimension parameter of the substrate back 312 of the substrate 31 as H, That is, the distance between the free side 4111 of described back side molded section 41 and the combination side 4112 parameter are H, if institute The height dimension parameter for stating the substrate back 312 that electronic component 32 protrudes from the substrate 31 is h, wherein parameter H's Numerical value is more than or equal to the numerical value of parameter h, in this way, when assembling the camera module 100 to the apparatus body 200, energy Enough prevent other build-up members of the apparatus body 200 from touching the electronic component 32, to ensure the camera module 100 reliability.
Attached drawing 25 shows a variant embodiment of the camera module 100, and the back side molded section 41 is further The module connecting side 331 of the connecting plate 33 is embedded, so that the back side molded section 41, the substrate 31, the electronics Component 32, the connecting plate 33 and the photo-sensitive cell 20 integrally with reference to and form the molded circuit board component 2000. It is understood that in a manner that the back side molded section 41 embeds the module connecting side 331 of the connecting plate 33, energy The substrate back 312 of the module connecting side 331 from the substrate 31 of the connecting plate 33 is enough avoided to come off, to ensure The link position of the module connecting side 331 of the connecting plate 33 and the substrate back 312 of the substrate 31 it is reliable Property.
Attached drawing 14 shows the schematic cross-sectional view of a variant embodiment of the camera module 100, wherein the back of the body Face molded section 41 has an at least assembly space 410, wherein the module connecting side 331 of the connecting plate 33 is in the substrate 31 substrate back 312 is connected to the assembling that the back side molded section 41 can be housed inside after the substrate 31 Space 410, mode in this way can avoid the module connecting side 331 of the connecting plate 33 from protruding, with described in guarantee The reliability of the link position of the module connecting side 331 of connecting plate 33 and the substrate back 312 of the substrate 31.
It is understood that the assembly space 410 of the back side molded section 41 can be in the back side molded section 41 Middle part, can also be in the surrounding of the back side molded section 41.
In some other feasible examples of the camera module 100, do not embedded by the back side molded section 41 The electronic component 32 can also be housed inside the assembly space 410 of the back side molded section 41, in this way Mode when moving or assembling the camera module 100, can avoid the electronic component 32 from being touched, so as to avoid The surface of the electronic component 32 or the electronic component 32 and the conduction position of the substrate 31 are destroyed, with into one Step ensures the reliability of the camera module 100.Optionally, a part of surface of the electronic component 32 can be exposed in institute State the assembly space 410 of back side molded section 41.
In addition, when the camera module 100 is assembled to the electronic equipment, the protrusion of the apparatus body 200 Build-up member can also be housed inside the assembly space 410 of the back side molded section 41, mode in this way, Neng Gouyou Effect ground utilizes the inner space of the apparatus body 200, to be conducive to the lightening of the electronic equipment and miniaturization.
It is noted that quantity, size and the position of the assembly space 410 can be chosen as needed, to carry Flexibility of the high camera module 100 when being assembled.
Attached drawing 15 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The back side molded section 41 is integrally incorporated at least one side of the substrate back 312 of the substrate 31, that is, It says, the back side molded section 41 can be not bound in the middle part of the substrate back 312 of the substrate 31, such as in attached drawing In this specific example of the camera module 100 shown in 15, the back side molded section 41 can integrally be incorporated into described Four sides of the substrate back 312 of substrate 31, so that the back side molded section 41 is in " mouth " font.And show in attached drawing 16 In another variant embodiment of the camera module 100 gone out, the back side molded section 41 can integrally be incorporated into institute Three sides of the substrate back 312 of substrate 31 are stated, so that the back side molded section 41 is in " Π " font or in " C " word Shape.And in another variant embodiment of the camera module 100 shown in attached drawing 17, the back side molded section 41 can be with Two sides of the substrate back 312 of the substrate 31 are integrally incorporated into, so that the back side molded section 41 is in " Γ " Font or in " L " font.And in another variant embodiment of the camera module 100 shown in attached drawing 18, it is described The quantity of back side molded section 41 can be two, and each back side molded section 41 is integrally incorporated into the substrate respectively One side of 31 substrate back 312, back side molded section 41 described in two of which symmetrically or two back ofs the body Face molded section 41 is mutually parallel.For example, two back side molded sections 41 can be in " II " font.And in the institute shown in attached drawing 19 In another variant embodiment for stating camera module 100, the back side molded section 41 only can also integrally be incorporated into described One side of the substrate back 312 of substrate 31.For example, the back side molded section 41 can be in " I " font.
It is noted that it will be appreciated by those skilled in the art that, the back side molded section 41 can also be in it His shape, such as " X " font or " well " font.
Attached drawing 20 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The back side molded section 41 is only integrally incorporated into the middle part of the substrate back 312 of the substrate 31, at this point, the back side Molded section 41 and the photo-sensitive cell 20 are maintained at the both sides of the substrate 31 with corresponding, on the one hand, the back side mould Modeling portion 41 can substrate 31 described in reinforcement the part of the pasting area 313 intensity, with ensure be mounted on the substrate On the other hand the flatness of the photo-sensitive cell 20 of 31 pasting area 313, can generate the photo-sensitive cell 20 Heat be radiated outside environment, to help to radiate.
It is noted that the shape of the back side molded section 41 in the camera module 100 of the utility model not Be restricted, for example, the back side molded section 41 can square, rectangle, trapezoidal, circular, oval and other are irregular Shape.
Attached drawing 21 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The back side molded section 41 can be equipped with or be formed multiple assembly spaces 410, so that the back side molded section 41 is in net Either the back side molded section 41 is in sphere of movements for the elephants shape to trellis or the back side molded section 41 is in " well " font.
Attached drawing 22 shows another variant embodiment of the camera module 100, wherein the molding unit 40 The quantity of the back side molded section 41 can also be implemented as four, and each back side molded section 41 is integrally tied respectively Together in four corners of the substrate back 312 of the substrate 31.Nevertheless, each back side molded section 41 is distinguished It is integrally incorporated into the middle part of four sides of the substrate back 312 of the substrate 31 and is also possible that.In addition, ability The technical staff in domain is it is understood that the quantity of the back side molded section 41 can also be implemented as more or less, sheet The camera module 100 of utility model is unrestricted in this regard.
It is noted that it will be appreciated by those skilled in the art that, the back side mould of the molding unit 40 Modeling portion 41 can also have other any possible shapes, the utility model another citing in portion in following description.
Further refer to the attached drawing 11, the camera module 100 includes an at least bearing 4000, wherein the bearing 4000 With an at least light hole 4100, wherein the bearing 4000 is mounted on the substrate front side 311 of the substrate 31, so that The bearing 4000 is looped around the surrounding of the photosensitive region 22 of the photo-sensitive cell 20, and the photo-sensitive cell 20 The photosensitive region 22 correspond to the bearing 4000 the light hole 4100.The bearing 4000 be used to make the light The photosensitive path that camera lens 10 is maintained at the photo-sensitive cell 20 is learned, institute is formed so as to the light hole 4100 of the bearing 4000 State the thang-kng path of optical lens 10 and the photo-sensitive cell 20.
It is understood that in this example of the camera module 100 shown in attached drawing 11, positioned at the substrate 31 The substrate back 312 at least one electronic component 32 at least a portion can correspond to be mounted on it is described The bearing 4000 of the substrate front side 311 of substrate 31, that is to say, that from the point of view of visual angle is overlooked, the bearing 4000 At least a portion positioned at least one electronic component 32 of the substrate back 312 of the substrate 31 can be mutual It overlaps, to be conducive to reduce the length and width dimensions of the camera module 100.
In this example of the camera module 100 shown in attached drawing 23, the substrate front side 311 of the substrate 31 Can be only applied to mount the bearing 4000, mode in this way, the length and width dimensions of the camera module 100 can by into One step reduces.
With further reference to attached drawing 11, the camera module 100 further comprises an at least filter element 50, wherein the filter Optical element 50 is mounted on the bearing 4000, by the bearing 4000 filter element 50 to be made to be maintained at the light It learns between camera lens 10 and the photo-sensitive cell 20, so as to enter the inside of the camera module 100 from the optical lens 10 Light by the photosensitive region 22 of the photo-sensitive cell 20 through being received after the filter element 50 again, side in this way Formula can ensure the image quality of the camera module 100.
Specifically, the filter element 50, which can be filtered from the optical lens 10, enters the camera module 100 Veiling glare in internal light, mode in this way can improve the image quality of the camera module 100.It is worth mentioning , the type of the filter element 50 is unrestricted in the camera module 100 of the utility model, such as the optical filtering Element 50 can be but not limited to IR cut filter element, visible spectrum filter element etc..
With further reference to attached drawing 11, the camera module 100 includes an at least driver 60, wherein the optical lens 10 Driveably be arranged at the driver 60, the driver 60 is mounted on the top surface of the bearing 4000, with by The driver 60 makes the optical lens 10 be maintained at the photosensitive path of the photo-sensitive cell 20.Also, the driver 60 can drive the photosensitive path of the optical lens 10 along the photo-sensitive cell 20 to do compared with the photo-sensitive cell 20 Movement, so as to which the camera module 100 is by adjusting the optical lens 10 and the side of the relative position of the photo-sensitive cell 20 Formula realizes auto-focusing and the autozoom of the camera module 100.
It is noted that the type of the driver 60 is unrestricted in the camera module 100 of the utility model System, as long as the photosensitive path of the optical lens 10 along the photo-sensitive cell 20 can be driven to do compared with the photosensitive member The relative motion of part 20, such as the driver 60 may be implemented as but unlimited in the specific example of the utility model In voice coil motor.
Preferably, the driver 60 has a driving pin 61, wherein described drive pin 61 from the bearing 4000 Top surface extend to binding face, and the driving pin 61 of the driver 60 can be connected to the substrate switched only 31。
In another variant embodiment of the camera module 100 shown in attached drawing 26, the camera module 100 can To be a fixed-focus camera module, specifically, the camera module 100 includes an at least lens barrel 90, wherein the optical frames First 10 are arranged at the lens barrel 90, and the lens barrel 90 is mounted on the bearing 4000, described to make by the lens barrel 90 Optical lens 10 is maintained on the photosensitive path of the photo-sensitive cell 20.And in the camera module 100 shown in attached drawing 27A Another variant embodiment in, the lens barrel 90 can also be integrally formed with the bearing 4000.
With reference to the utility model Figure of description attached drawing 1 to Figure 10, the manufacturing process of the camera module 100 is connecing It is set forth in the description got off.
In the stage shown in attached drawing 1, by least one electronic component 32 the substrate 31 the substrate just Face 311 be conductively connected to the substrate 31 and by the other electronic component 32 the substrate 31 the substrate The back side 312 is conductively connected to the substrate 31, and two of which or more than two substrates 31 are arranged to form a spelling Version unit 3000.It is noted that the arrangement mode of multiple substrates 31 of the layout unit 3000 is formed in this reality With unrestricted in the new camera module 100, it is chosen as needed.
For example, in this specific example of the camera module 100 of the utility model, it is provided in the substrate 31 Or after being made into, at least one electronic component 32 can be mounted on the substrate 31 by way of attachment The substrate front side 311, so that these described electronic components 32 are led in the substrate front side 311 of the substrate 31 The substrate 31 is connected to logically, and the other electronic component 32 is mounted on the substrate 31 by way of attachment The substrate back 312 so that the substrate back 312 quilt of these described electronic components 32 in the substrate 31 Conductively it is connected to the substrate 31.
In addition, the electronic component 32 is mounted on the substrate front side 311 of the substrate 31 and the substrate back of the body The position in face 312 can not also be restricted, and be adjusted according to the concrete application of the camera module 100, such as in this practicality In the other example of the new camera module 100, multiple electronic components 32 can be disposed in the base The substrate front side 311 of plate 31 and/or the whole region of the substrate back 312, and in the camera shooting of the utility model In the other example of module 100, multiple electronic components 32 can also be disposed in the base of the substrate 31 Plate front 311 and/or the specific region of the substrate back 312, such as corner either certain one side or certain both sides etc..This practicality The new camera module 100 is unrestricted in this regard.
It is noted that in the other example of the camera module 100 of the utility model, can also only by The electronic component 32 is conductively connected to the substrate 31 in the substrate front side 311 of the substrate 31, so as to hold The camera module 100 as shown in attached drawing 23 is obtained after row moulding technology and subsequent technique.Described in the utility model In the other example of camera module 100, can also only by the electronic component 32 the substrate 31 the substrate The back side 312 is conductively connected to the substrate 31, is shown so as to obtain attached drawing 24 such as after moulding technology and subsequent technique is performed The camera module 100.
In addition, with continued reference to attached drawing 1, the substrate back 312 of the photo-sensitive cell 20 in the substrate 31 is mounted In the substrate 31 so that positioned at the non-photo-sensing region 23 of the photo-sensitive cell 20 the chip contacts 21 and be located at The substrate connection part 315 of the substrate back 312 of the substrate 31 is switched on and makes the described of the photo-sensitive cell 20 Photosensitive region 22 and 23 part of the non-photo-sensing region correspond to the substrate channel 310 of the substrate 31, so that The photo-sensitive cell 20 is connected to the substrate 31 switched only.
It will be appreciated by those skilled in the art that one in the non-photo-sensing region 23 of the photo-sensitive cell 20 Divide and be mounted on the substrate back 312 of the substrate 31, and make the chip contacts 21 of the photo-sensitive cell 20 After being switched on the substrate connection part 315 of the substrate 31, in 23 He of non-photo-sensing region of the photo-sensitive cell 20 The gap 24 is formed between the substrate back 312 of the substrate 31.Then, it is filled in institute using the filler 5000 It states in gap 24, to prevent the substrate back 312 of the photosensitive region 22 of the photo-sensitive cell 20 and the substrate 31 It is connected by the gap 24, so as to which in subsequent molding process, the filler 5000 can prevent a fluid media (medium) 400 photosensitive areas for passing through the gap 24 entrance photo-sensitive cell 20 from the substrate back 312 of the substrate 31 Domain 22, it is contaminated to avoid the photosensitive region 22 of the photo-sensitive cell 20.
It is understood that the substrate 31 can isolate at least one electronic component 32 and the photo-sensitive cell 20 photosensitive region 22, to avoid the cast and the electronic component 32 on the surface of the electronic component 32 and institute The cast for stating the link position of substrate 31 pollutes the photosensitive region 22 of the photo-sensitive cell 20.For example, in the electronics In the example for the substrate back 312 that component 32 is all arranged in the substrate 31, the substrate 31 can isolate whole The electronic component 32 and the photo-sensitive cell 20 the photosensitive region 22, so as to manufacture the camera module 100 During, the cast on the surface of the electronic component 32 and the electronic component 32 and the substrate 31 can be avoided The cast of link position pollute the photosensitive region 22 of the photo-sensitive cell 20.
It is noted that in some examples of the camera module 100 of the utility model, it can be first by the electricity Sub- component 32 is conductively connected to the substrate 31, and the photo-sensitive cell 20 is conductively then connected to the substrate again 31.In other examples of the camera module 100 of the utility model, can also first by the photo-sensitive cell 20 conductively The substrate 31 is connected to, the electronic component 32 is conductively then connected to the substrate 31 again.Nevertheless, ability The technical staff in domain, can also it is understood that in the other example of the camera module 100 of the utility model First the substrate 31 will be conductively connected to positioned at the electronic component 32 of the substrate back 312 of the substrate 31, The substrate 31 is conductively connected to by the photo-sensitive cell 20, it then again will be positioned at the substrate front side of the substrate 31 311 electronic component 32 is conductively connected to the substrate 31 or first will be positioned at the substrate of the substrate 31 The electronic component 32 in front 311 is conductively connected to the substrate 31, then again will be positioned at described in the substrate 31 The electronic component 32 of substrate back 312 be conductively connected to the substrate 31 and by the photo-sensitive cell 20 conductively It is connected to the substrate 31.The camera module 100 of the utility model is unrestricted in this regard.
In the stage shown in attached drawing 2A and Fig. 2 B, the layout unit 3000 is put into a molding tool 300, with by Moulding technology is performed by the molding die 300.
Specifically, the molding die 300 includes a mold 301 and once mold 302, wherein the mold 301 and the lower mold 302 at least one mold can be operated so that the molding die 300 be performed molding and Draft operates.For example, in one example, the layout unit 3000 can be positioned over to the lower mold 302 and to described After molding die 300 performs die closing operation, the shape between the lower mold 302 and the substrate back 312 of the substrate 31 Into an at least molding space 303.
Preferably, when the quantity of the molding space 303 is for two or more than two, in lower 302 He of mold An at least communicating passage 304 can also be formed between the substrate back 312 of the substrate 31, wherein the communicating passage 304 for connecting the adjacent molding space 303, in this way, being added into the fluid media (medium) of a molding space 303 400 can fill full all molding spaces 303 by the communicating passage 304.
It is noted that the pressure surface of the mold 301 can be a plane, wherein in the molding die After 300 are performed die closing operation, the pressure surface of the mold 301 can directly apply pressure to the substrate 31 the substrate just Face 311.
Preferably, the mold 301 can be formed an at least safe space 30122 by way of indent and described The surrounding of molding space 30122 forms a mold pressure unit 30123, wherein when the molding die 300 is performed molding behaviour When making, the mold pressure unit 30123 of the mold 301 can apply pressure to the substrate front side of the substrate 31 311, for example, the mold 301 the mold pressure unit 30123 can apply pressure to the substrate 31 the substrate just Can applying pressure to without the region of cabling or the mold pressure unit 30123 of the mold 301 for face 311 is described Layout unit 3000 is used for the region of substrate 31 or component described in support, so that the substrate front side of the substrate 31 311 routing region corresponds to the safe space 30122 of the mold 301, in such manner, it is possible to avoid the mold The 301 mold pressure unit 30123 scratches or damages by pressure the substrate 31, to ensure the good electrical of the substrate 31.
It will be appreciated by those skilled in the art that the mold 301 is by providing the safe space 30122 Mode is particularly advantageous to the electronic component 32 that protection protrudes from the substrate front side 311 of the substrate 31.Namely Say, when the molding die 300 is performed die closing operation, the substrate front side 311 of the substrate 31 it is switched on even The electronic component 32 for being connected to the substrate 31 is housed inside the safe space 30122 of the mold 301, to keep away Exempt from the electronic component 32 to be touched or pressed by the mold pressure unit 30123 of the mold 301, so as to ensure The reliability of the electronic component 32 and the electronic component 32 and the link position of the substrate 31.
With continued reference to attached drawing 2A and Fig. 2 B, the lower mold 302 further comprises being molded guide portion 3021 and at least One support portion 3022 and with being at least once molded guiding groove 3023, wherein the support portion 3022 integrally extend it is described Guide portion 30221 is molded, is drawn with forming the lower shaping between the support portion 3022 and the lower shaping guide portion 3021 Guide groove 3023 forms the lower shaping guiding groove 3023 between the adjacent support portion 3022.
When performing die closing operation to the molding die 300, in the lower shaping guiding groove of the lower mold 302 3023 corresponding positions form the molding space 303.Also, lower shaping 3021 energy of guide portion of the lower mold 302 It enough applies pressure to the substrate back 312 of the substrate 31 and the support portion 3022 of the lower mold 302 can apply pressure to The substrate back 312 of the substrate 31.
Preferably, it is convex to be more than the electronic component 32 for the height dimension of the support portion 3022 of the lower mold 302 For the height dimension of the substrate back 312 of the substrate 31, mode in this way, when the lower mold 302 presses When the substrate back 312 of the substrate 31, the inner surface of the surface of the electronic component 32 and the lower mold 302 Between there is safe distance, with by the way that the surface of the electronic component 32 is avoided to contact the inner surface of the lower mold 302 Mode protects the surface of the electronic component 32 not to be scraped off.In addition, by the surface of the electronic component 32 and institute Stating has the mode of safe distance between the inner surface of lower mold 302, additionally it is possible to make integrally to be incorporated into the substrate subsequently The back side molded section 41 of 31 substrate back 312 embeds the electronic component 32.
Refer to the attached drawing 2A and Fig. 2 B, the molding die 300 further comprise an at least film layer 305, such as in this practicality In this new specific example, the quantity of the film layer 305 may be implemented as two, one of them described 305 quilt of film layer The inner surface of the mold 301 is overlappingly arranged at, another described film layer 305 is overlappingly arranged at the lower mold 302 inner surface.For example, in a feasible example, it can be by the way that the film layer 305 be attached at the mold 301 Inner surface mode, the film layer 305 is made overlappingly to be arranged at the inner surface of the mold 301 and by by the film Layer 305 is attached at the mode of the inner surface of the lower mold 302, and the film layer 305 is made overlappingly to be arranged at the lower mold 302 Inner surface.
It will be appreciated by those skilled in the art that when the molding die 300 is performed die closing operation, the film Layer 305 is maintained at the mold pressure unit 30123 of the mold 301 and the substrate front side of the substrate 31 Between 311, thus it is possible, on the one hand, the film layer 305 can absorb the molding die 300 in quilt by way of being deformed The impact force generated during molding directly acts on the substrate 31 to avoid the impact force, and on the other hand, the film layer 305 can also Enough isolate the mold pressure unit 30123 of the mold 301 and the substrate front side 311 of the substrate 31, to keep away Exempt from the substrate front side 311 that the mold 301 scratches the substrate 31, so as to ensure the good electrical of the substrate 31. It is understood that the film layer 305 can also isolate the inner surface of the mold 301 and positioned at described in the substrate 31 The electronic component 32 of substrate front side 311.
Correspondingly, after die closing operation is performed to the molding die 300, the lower shaping of the lower mold 302 is drawn Lead portion 3021 and the support portion 3022 apply pressure to respectively the substrate 31 the substrate back 312 different position, so as to Be maintained at it is described it is lower shaping guide portion 3021 and the substrate 31 the substrate back 312 between the film layer 305 with And it is maintained at the film layer 305 between the support portion 3022 and the substrate back 312 of the substrate 31, a side Face, can absorb the impact force that the molding die 300 generates when being molded directly acted on to avoid the impact force it is described The substrate back 312 of substrate 31, on the other hand, the film layer 305 can also isolate lower shaping 3021 He of guide portion The substrate back 312 of the substrate 31 and the substrate back of the isolation support portion 3022 and the substrate 31 312, so as to which the substrate back 312 for preventing the substrate 31 is scraped off and ensures the good electrical of the substrate 31.In addition, The film layer 305 can also prevent the institute in the lower shaping guide portion 3021 and the substrate 31 by way of being deformed It states and gap is generated between substrate back 312 and is prevented in the support portion 22 and the substrate back 312 of the substrate 31 Between generate gap.
In this stage shown in attached drawing 3 and Fig. 4, it is empty that the fluid media (medium) 400 is added at least one shaping Between in 303, since the adjacent molding space 303 is connected by the communicating passage 304, so as to the fluid media (medium) 400 Completely all molding spaces 303 can be filled.
It is noted that the fluid media (medium) 400 can be mixture of liquid, solid or liquid and solid etc., So that the fluid media (medium) 400 can flow.In addition, the fluid media (medium) 400 may be implemented as but be not limited to thermosetting material Material.Certainly, it will be appreciated by those skilled in the art that, in other possible examples, the fluid media (medium) 400 is carried out It is also possible that for light thermoset material or from thermoset material.
After the fluid media (medium) 400 fills the full molding space 303, the fluid can be made by way of heating Medium 400 cures in the molding space 303, and draft operation, refer to the attached drawing 5 can be performed to the molding die 300 The stage shown, wherein the cured fluid media (medium) 400 can form and integrally be incorporated into institute in the molding space 303 State the back side molded section 41 of the substrate back 312 of substrate 31.Also, the back side molded section 41 can embed protrusion In at least a portion of at least one electronic component 32 of the substrate back 312 of the substrate 31, the lower die The 3022 corresponding position of the support portion of tool 302 can form the assembly space 410 of the back side molded section 41.It is preferred that Ground, the back side molded section 41 can embed all electronics for the substrate back 312 for protruding from the substrate 31 Component 32.
In this stage shown in attached drawing 6, after draft operation is performed to the molding die 300, can be formed described The semi-finished product of molded circuit board component 2000.It is understood that after draft operation is performed to the molding die 300, it is more A molded circuit board component 2000 in the state being connected with each other, with formed the half of the molded circuit board component 2000 into Product.Then in this stage shown in attached drawing 7A and Fig. 7 B, the semi-finished product of the molded circuit board component 2000 can be split, with Form the molded circuit board component 2000.The mode for splitting the semi-finished product of the molded circuit board component 2000 is new in this practicality It is unrestricted in the camera module 100 of type, such as the molded circuit board component can be split by way of cutting 2000 semi-finished product can also lead to overetched mode and split the molding circuit to form the molded circuit board component 2000 The semi-finished product of plate component 2000 are to form the molded circuit board component 2000.
In addition, in some examples of the camera module 100 of the utility model, such as attached drawing 7A, splitting the mould When moulding the semi-finished product of circuit board assemblies 2000, segmentation direction can be the side where the substrate front side 311 from institute's substrate 31 To the direction to 312 place of substrate back.In other examples of the camera module 100 of the utility model, such as Attached drawing 7B, when splitting the semi-finished product of the molded circuit board component 2000, segmentation direction can also be from the substrate 31 The direction where direction to the substrate front side 311 where the substrate back 312.
In this stage shown in attached drawing 8, by the connecting portion 34 by the module connecting side of the connecting plate 33 331 are mounted on the substrate back 312 of the substrate 31, conductively to connect the connecting plate 33 and the substrate 31.It is excellent Selection of land, the module connecting side 331 of the connecting plate 33 are housed inside the assembly space 410 of the back side molded section 41 It is interior, it is protruded to avoid the module connecting side 331 of the connecting plate 33.It is understood that in the camera module 100 In other examples, can also the module connecting side 331 of the connecting plate 33 be mounted on by institute by the connecting portion 34 State the substrate front side 311 of substrate 31.
Optionally, the stage shown in attached drawing 8 can also be before the stage shown in attached drawing 7A and Fig. 7 B, so as to pass through first The module connecting side 331 of the connecting plate 33 is mounted on the substrate back of the substrate 31 by the connecting portion 34 312, then split the semi-finished product of the molded circuit board component 2000 again to form the molded circuit board component 2000.
Also optionally, the stage shown in attached drawing 8 can also be before the stage shown in attached drawing 2A and Fig. 2 B, so as to perform During moulding technology, the molding die 300 can apply pressure to the connecting plate 33 the module connecting side 331 and the substrate 31 link position, can with ensure the link position of the module connecting side 331 of the connecting plate 33 and the substrate 31 By property or make the module connecting side 331 of the connecting plate 33 and the link position of the substrate 31 be housed inside it is described In molding space 303, with after execution moulding technology forms the back side molded section 41, the back side molded section 41 can wrap The module connecting side 331 of the connecting plate 33 is buried, to form the camera module 100 shown in attached drawing 25.
In the stage shown in attached drawing 9, the bearing 4000 for being pasted with the filter element 50 is mounted on the base The substrate front side 311 of plate 31, and make the photosensitive region 22 of the photo-sensitive cell 20 and the non-photo-sensing region 23 A part correspond to the bearing 4000 the light hole 4100 and the filter element 50 is made to be located at the photo-sensitive cell On 20 photosensitive path.Alternatively it is also possible to the bearing 4000 is first mounted on to the substrate front side of the substrate 31 311, the filter element 50 is then mounted on the bearing 4000 again.
Then, the driver 60 for being assembled with the optical lens 10 is mounted on the bearing 4000, so that described Optical lens 10 is maintained at the photosensitive path of the photo-sensitive cell 20 and the filter element 50 is made to be maintained at the optics Between camera lens 10 and the photo-sensitive cell 20, and the driving pin 61 and the substrate 31 of the driver 60 are turned on Ground connects, to form the camera module 100.
Alternatively it is also possible to the lens barrel 90 for being assembled with the optical lens 10 is mounted on the bearing 4000, with Form the camera module 100 as shown in attached drawing 26.
Also optionally, the bearing 4000 and the lens barrel 90 can also be integrally formed, wherein first by the optical filtering Element 50 is mounted on the bearing 4000 and the optical lens 10 is assembled in the lens barrel 90, then again by the bearing 4000 are mounted on the substrate front side 311 of the substrate 31 or the bearing 4000 are mounted on the substrate 31 first The substrate front side 311, the filter element 50 is then mounted on the bearing 4000 and by the optical lens 10 again The lens barrel 90 is assembled in, to form the camera module 100 as shown in attached drawing 27A.
With reference to the attached drawing 27B to Figure 27 N of the Figure of description of the present invention, another manufacturing process of the camera module 100 It is set forth in following description.
In the stage shown in attached drawing 27B and Figure 27 C, by least one electronic component 32 the substrate 31 institute It states substrate back 312 and is conductively connected to the substrate 31, two of which or more than two substrates 31 are arranged shape Into a layout unit 3000.It is noted that form the arrangement mode of multiple substrates 31 of the layout unit 3000 It is unrestricted in the camera module 100 of the present invention, it is chosen as needed.
In addition, a protection element 9000 is overlappingly attached to the substrate front side 311 of the substrate 31, so that described Protection element 9000 closes opening of the substrate channel 310 in the substrate front side 311 of the substrate 31.
It is noted that in the other example of the camera module 100 of the present invention, it can also be first in the base The substrate front side 311 of plate 31 overlappingly attaches the protection element 9000, then again in the substrate of the substrate 31 The back side 312 conductively connects at least one electronic component 32.
In addition, the type of the protection element 9000 is unrestricted, such as the protection element 9000 can be transparent member Part or opaque element, if the substrate front side 311 of the substrate 31 can be overlappingly attached at, and Close opening of the substrate channel 310 in the substrate front side 311.Citing ground but be not limited to, the protection element 9000 may be implemented as high temperature gummed tape.
It is understood that overlappingly it is attached at the substrate front side of the substrate 31 in the protection element 9000 After 311, the protection element 9000 can also form a part for the layout unit 3000.It is then possible to the spelling Version unit 3000 is cleaned, and is adhered to avoid pollutants such as dust, solid particles on the layout unit 3000.
In the stage shown in attached drawing 27D, Figure 27 E and Figure 27 F, by the photo-sensitive cell 20 the substrate 31 the base Back 312 is mounted on the substrate 31, so that the chip positioned at the non-photo-sensing region 23 of the photo-sensitive cell 20 The substrate connection part 315 of connector 21 and the substrate back 312 positioned at the substrate 31 is switched on and makes the sense The part in the photosensitive region 22 of optical element 20 and the non-photo-sensing region 23 corresponds to the substrate of the substrate 31 Passage 310, so that the photo-sensitive cell 20 is connected to the substrate 31 switched only.
Specifically, can be formed by planting ball technique in the non-photo-sensing region 23 of the photo-sensitive cell 20 plant ball The chip contacts 21 positioned at the non-photo-sensing region 23 of the photo-sensitive cell 20, then again by the photo-sensitive cell 20 The substrate back 312 of the substrate 31 is mounted on, so that positioned at the non-photo-sensing region of the photo-sensitive cell 20 The substrate connection part 315 of 23 chip contacts 21 and the substrate back 312 positioned at the substrate 31 is led It is logical.It will be appreciated by those skilled in the art that the chip contacts 21 of the photo-sensitive cell 20 can also have other Generation type, the camera module 100 of the invention is unrestricted in this regard.
In addition, after the photo-sensitive cell 20 is mounted on the substrate back 312 of the substrate 31, it is described photosensitive Element 20 can close opening of the substrate channel 310 in the substrate back 312 of the substrate 31, so as in the sense A sealing space 8000 is formed between optical element 20, the substrate 31 and the protection element 9000, wherein the photo-sensitive cell 20 photosensitive region 22 is located at the sealing space 8000, and mode in this way can avoid the photo-sensitive cell 20 The photosensitive region 22 by contaminants such as dust, solid particulate matters, so as to ensure that the product of the camera module 100 is good Rate.Preferably, the part in the non-photo-sensing region 23 of the photo-sensitive cell 20 can also be located at the sealing space 8000 It is interior.
It will be appreciated by those skilled in the art that one in the non-photo-sensing region 23 of the photo-sensitive cell 20 Divide and be mounted on the substrate back 312 of the substrate 31, and make the chip contacts 21 of the photo-sensitive cell 20 After being switched on the substrate connection part 315 of the substrate 31, in 23 He of non-photo-sensing region of the photo-sensitive cell 20 The gap 24 is formed between the substrate back 312 of the substrate 31.Then, it is filled in institute using the filler 5000 It states in gap 24, to prevent the substrate back 312 of the photosensitive region 22 of the photo-sensitive cell 20 and the substrate 31 It is connected by the gap 24, so as to which in subsequent molding process, the filler 5000 can prevent a fluid media (medium) 400 enter the sealing space 8000 from the substrate back 312 of the substrate 31 by the gap 24, to avoid quilt It is contaminated to be maintained at the photosensitive region 22 of the photo-sensitive cell 20 of the sealing space 8000, so as to avoid the camera shooting There are the bad phenomenons such as dirty bad point in module 100.
It is noted that after the photo-sensitive cell 20 is mounted on the substrate back 312 of the substrate 31, The photo-sensitive cell 20 can also form a part for the layout unit 3000.
Nevertheless, it will be appreciated by those skilled in the art that, the stage shown in attached drawing 27D to Figure 27 F can also Before the stage shown in attached drawing 27B and Figure 27 C, i.e. the photo-sensitive cell 20 is mounted on described in the substrate 31 first Then the protection element 9000 is attached at the substrate front side 311 of the substrate 31, to obtain by substrate back 312 again The layout unit 3000.It is then also possible to the layout unit 3000 is cleaned.The camera module of the present invention 100 is unrestricted in this regard.
In the stage shown in attached drawing 27G, Figure 27 H, Figure 27 I and Figure 27 J, the layout unit 3000 is put into described In molding die 300, to perform moulding technology by the molding die 300.After the completion of moulding technology, to the shaping mould Tool 300 performs draft technique, to obtain the semi-finished product of the molded circuit board component 2000 shown in attached drawing 27K.It is appreciated that , after draft operation is performed to the molding die 300, multiple molded circuit board components 2000 are in interconnection State, to form the semi-finished product of the molded circuit board component 2000.It is noted that in moulding technology, the protection Element 9000 can also isolate the mold 301 of the molding die 300 and the substrate front side of the substrate 31 311, so as to which the substrate front side 311 for avoiding the substrate 31 is scratched by the mold 301, to protect the substrate 31 It is good electrical.Preferably, the protection element 9000 can also be deformable, so as in the upper mold of the molding die 300 When tool 301 and the lower mold 302 mold, the protection element 9000 can be absorbed described by way of generating flexible deformation Mold 301 acts on the impact force of the substrate 31, is damaged to avoid the substrate 31.
In the stage shown in attached drawing 27L and Figure 27 M, the semi-finished product of the molded circuit board component 2000 can be divided It cuts, the mode of segmentation is unrestricted in the camera module 100 of the present invention, such as can split institute by way of cutting The semi-finished product of molded circuit board component 2000 are stated, overetched mode can also be led to and split the molded circuit board component 2000 Semi-finished product.
In addition, split the camera module of the mode in the present invention of the semi-finished product of the molded circuit board component 2000 It can not also be restricted in 100, such as in the example shown in attached drawing 27L, split the molded circuit board component 2000 During semi-finished product, segmentation direction can be from the direction at 311 place of the substrate front side of the substrate 31 to the substrate back Direction where 312.And in the example shown in attached drawing 27M, when splitting the semi-finished product of the molded circuit board component 2000, Segmentation direction can be the direction to 311 place of substrate front side where the substrate back 312 from the substrate 31 Direction.
In the stage shown in attached drawing 27N, the substrate front side 311 of the protection element 9000 from the substrate 31 is gone It removes, to obtain the molded circuit board component 2000.
It is noted that stage shown in attached drawing 27N can also before the stage shown in attached drawing 27L and Figure 27 M, from And first remove the substrate front side 311 of the protection element 9000 from the substrate 31, then split the molding again The semi-finished product of circuit board assemblies 2000, to obtain the molded circuit board component 2000.The camera module 100 of the present invention exists This respect is unrestricted.
In subsequent steps, the connecting plate 33 and the substrate 31 can conductively be connected, by the optical frames First 10 are maintained on the photosensitive path of the photo-sensitive cell 20 and the filter element 50 are made to be maintained at the optical lens 10 Between the photo-sensitive cell 20, to obtain the camera module 100 shown in attached drawing 27A.
With reference to the utility model Figure of description attached drawing 28 to Figure 39, according to another preferred embodiment of the utility model A camera module 100 be set forth in following description, wherein the camera module 100 include an at least optical lens 10 ', an at least photo-sensitive cell 20 ' and a circuit board 30 ', wherein the photo-sensitive cell 20 ' is connected to the electricity switched only Road plate 30 ', the optical lens 10 ' are maintained at the photosensitive path of the photo-sensitive cell 20 '.
Inside of the light being reflected by the object from the optical lens 10 ' into the camera module 100, it is then described Photo-sensitive cell 20 ' receives and carries out photoelectric conversion and be imaged, the photo-sensitive cell 20 ' carry out that photoelectric conversion obtains with object The electric signal of the correction of image can be transmitted by the circuit board 30 ', for example, the circuit board 30 ' can be by the image with object The relevant electric signal transmission is to the apparatus body 200 for being connected to the circuit board 30 '.That is, the electricity Road plate 30 ' can be connected to the apparatus body 200 switched only, and the camera module 100 is assemblied in the equipment sheet Body 200 and form the electronic equipment.
Further, refer to the attached drawing 38, the circuit board 30 ' include at least a substrate 31 ' and an at least electronic component 32 ', wherein each electronic component 32 ' is connected to the substrate 31 ' respectively switched only.
Specifically, the substrate 31 ' has a substrate front side 311 ', a substrate back 312 ' and at least a substrate leads to Road 310 ', wherein the substrate front side 311 ' and the substrate back 312 ' correspond, the substrate channel 310 ' is described in The substrate front side 311 ' of substrate 31 ' extends to the substrate back 312 '.That is, the substrate channel 310 ' can Connect the substrate front side 311 ' of the substrate 31 ' and the substrate back 312 '.In other words, the substrate channel 310 ' can To be implemented as a perforation, so that the substrate channel 310 ' can connect the substrate front side 311 ' of the substrate 31 ' With the substrate back 312 ', such as the substrate channel 310 ' can be a central hole.
Under normal conditions, the substrate 31 ' is plate-like, and the substrate front side 311 ' of the substrate 31 ' and described Substrate back 312 ' is mutually parallel, so as between the substrate front side 311 ' of the substrate 31 ' and the substrate back 312 ' Distance can be used for the thickness for defining the substrate 31 '.Nevertheless, it will be appreciated by those skilled in the art that, In other examples of the camera module 100 of the utility model, the substrate front side 311 ' of the substrate 31 ' and described In substrate back 312 ' it is at least one can be equipped with bulge-structure or groove, the camera module 100 of the utility model It is unrestricted in this regard.
In addition, the substrate channel 310 ' of the substrate 31 ' is typically what is be square, such as square or rectangular Shape, it will be understood by those skilled in the art that in other examples of the camera module 100, the substrate 31 ' The substrate channel 310 ' can also have other any possible shapes, such as, but not limited to circle.Nevertheless, in order to subtract The length and width dimensions of the small camera module 100, the shape and size of the substrate channel 310 ' of the substrate 31 ' are arranged to It is corresponded with the shape and size of the photo-sensitive cell 20 '.
It is noted that the type of the substrate 31 ' can not also in the camera module 100 of the utility model It is restricted, such as the substrate 31 ' can be selected but be not limited to hardboard, soft board, Rigid Flex, ceramic wafer etc..
In this example of the camera module 100 shown in attached drawing 38, at least one electronic component 32 ' exists The substrate front side 311 ' of the substrate 31 ' is connected to the substrate 31 ' switched only, the electronic component in addition 32 ' the substrate 31 ' the substrate back 312 ' it is switched on be connected to the substrate 31 ', mode in this way, institute The layout for stating electronic component 32 ' can be more flexible.
Nevertheless, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 In, whole electronic components 32 ' can also be conductively connected in the substrate front side 311 ' of the substrate 31 ' The substrate 31 ', and in the other example of the camera module 100, it can also be by whole electronic components 32 ' are conductively connected to the substrate 31 ' in the substrate back 312 ' of the substrate 31 '.The described of the utility model is taken the photograph As module 100 is unrestricted in this regard.
It is noted that the type of the electronic component 32 ' in the camera module 100 of the utility model not Be restricted, for example, the electronic component 32 ' may be implemented as but be not limited to processor, relay, memory, driver, Inductor, resistance, capacitance etc..
Further, in a specific example of the camera module 100 of the utility model, the electronic component 32 ' can by way of the substrate front side 311 ' for being mounted on the substrate 31 ' and/or the substrate back 312 ', The electronic component 32 ' is made to be switched in the substrate front side 311 ' of the substrate 31 ' and/or the substrate back 312 ' Ground is connected to the substrate 31 '.It is understood that when the electronic component 32 ' is mounted on the described of the substrate 31 ' After substrate front side 311 ' and/or the substrate back 312 ', the electronic component 32 ' protrudes from the described of the substrate 31 ' Substrate front side 311 ' and/or the substrate back 312 '.
In another specific example of the camera module 100 of the utility model, the electronic component 32 ' also may be used To be partly embedded to the substrate 31 ' in the substrate front side 311 ' of the substrate 31 ' and/or the substrate back 312 ', and And the electronic component 32 ' is connected to the substrate 31 ' switched only, i.e. the part protrusion of the electronic component 32 ' The substrate front side 311 ' and/or the substrate back 312 ' in the substrate 31 ', mode in this way can be into one Step reduces the height dimension of the camera module 100.Optionally, the electronic component 32 ' can also be wholly embedded into described The inside of substrate 31 '.
With continued reference to attached drawing 38, the circuit board 30 ' further comprises a connecting plate 33 ', wherein the connecting plate 33 ' has There are a module connecting side 331 ' and an equipment connecting side 332 ', wherein the 331 ' quilt of module connecting side of the connecting plate 33 ' It is connected to the substrate back 312 ' of the substrate 31 ', such as the module connecting side 331 ' of the connecting plate 33 ' can be with By a connecting portion 34 ' it is switched on be connected to the substrate back 312 ' of the substrate 31 ', wherein the connecting portion 34 ' It can be but not limited to anisotropy conductiving glue water or anisotropy conductiving glue band.
Nevertheless, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 In, the module connecting side 331 ' of the connecting plate 33 ' is conductively connected in the substrate front side 311 ' of the substrate 31 ' The substrate 31 ' is connected to be also possible that.In some other examples of the camera module 100, by the connecting plate 33 ' the module connecting side 331 ' is connected to the side of the substrate 31 ' or makes the module of the connecting plate 33 ' Connecting side 331 ' and the substrate 31 ' are integrally formed what is be possible to.
In addition, the equipment connecting side 332 ' of the connecting plate 33 ' can be connected to the apparatus body 200, example The equipment connecting side 332 ' such as the connecting plate 33 ' can be provided with or be formed a connector of the connecting plate 33 ' 333 ', for being connected to the apparatus body 200.
It is noted that the connecting plate 33 ' is deformable, so as to which the connecting plate 33 ' can be by way of deformation Buffer the electronic equipment during by use due to vibrations and caused by the camera module 100 displacement, so as to protect Demonstrate,prove the reliability of the electronic equipment when in use.
Further, the substrate 31 ' has at least one set of substrate connection part 315 ', wherein the substrate 31 ' is described Substrate connection part 315 ' is located at and protrudes from the substrate back 312 ' of the substrate 31 '.Preferably, the substrate 31 ' The substrate connection part 315 ' be looped around the edge of the substrate channel 310 '.
The photo-sensitive cell 20 ' has at least one set of chip contacts 21 ' and a photosensitive region 22 ' and is looped around described One non-photo-sensing region 23 ' of 22 ' surrounding of photosensitive region, wherein the chip contacts 21 ' are located at and are protruded from described photosensitive The non-photo-sensing region 23 ' of element 20 '.
The photo-sensitive cell 20 ' is mounted on the substrate back 312 ' of the substrate 31 ', so that the photo-sensitive cell 20 ' the chip contacts 21 ' are connected to the substrate connection part 315 ' of the substrate 31 ' and make described switched only The photosensitive region 22 ' of photo-sensitive cell 20 ' corresponds to the substrate channel 310 ' of the substrate 31 '.Preferably, the sense The part in the non-photo-sensing region 23 ' of optical element 20 ' also corresponds to the substrate channel 310 ' of the substrate 31 '.Example Such as, in this specific example of the camera module 100 of the utility model, the non-photo-sensing of the photo-sensitive cell 20 ' The part in region 23 ' is mounted on the substrate back 312 ' of the substrate 31 ', the sense of the photo-sensitive cell 20 ' The another part in light region 22 ' and the non-photo-sensing region 23 ' corresponds to the substrate channel 310 ' of the substrate 31 '.
It is noted that in the camera module 100 of the utility model, mounted by the photo-sensitive cell 20 ' While the substrate back 312 ' of the substrate 31 ', the chip contacts 21 ' of the photo-sensitive cell 20 ' are led The substrate connection part 315 ' of the substrate 31 ' is connected to logically, and mode in this way can reduce the camera module 100 manufacturing step, so as to advantageously reduce the manufacture cost of the camera module 100 and improve the camera module 100 Production efficiency.
It's also worth mentioning that the shape and arrangement of the chip contacts 21 ' of the photo-sensitive cell 20 ' and institute State the substrate connection part 315 ' of substrate 31 ' shape and arrangement in the camera module 100 of the utility model It is unrestricted.For example, the chip contacts 21 ' of the photo-sensitive cell 20 ' can be disc-shaped, spherical etc., it is correspondingly, described The substrate connection part 315 ' of substrate 31 ' can also be disc-shaped, spherical etc..
Preferably, in the thickness direction of the substrate 31 ', positioned at the substrate 31 ' the substrate front side 311 ' extremely At least a portion of a few electronic component 32 ' can correspond to the non-photo-sensing region of the photo-sensitive cell 20 ' A 23 ' part.That is, from the point of view of visual angle is overlooked, positioned at least the one of the substrate front side 311 ' of the substrate 31 ' At least a portion of a electronic component 32 ' and a part of energy in the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' Enough overlapped, modes in this way can reduce the length and width dimensions of the camera module 100, so that the camera shooting Module 100 is especially suitable for pursuing the lightening electronic equipment.
It will be appreciated by those skilled in the art that the substrate connection part 315 ' of the substrate 31 ' protrudes from institute State the substrate back 312 ' of substrate 31 ', the chip contacts 21 ' of the photo-sensitive cell 20 ' protrude from described photosensitive The non-photo-sensing region 23 ' of element 20 ', so as to be mounted on the substrate of the substrate 31 ' when the photo-sensitive cell 20 ' The back side 312 ', and the chip contacts 21 ' of the photo-sensitive cell 20 ' is made conductively to be connected to the described of the substrate 31 ' After substrate connection part 315 ', in the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' and the substrate of the substrate 31 ' An at least gap 24 ' is formed between the back side 312 '.In the camera module 100 of the utility model, by the photosensitive member Part 20 ' is mounted on the substrate back 312 ' of the substrate 31 ', and makes the chip contacts of the photo-sensitive cell 20 ' After 21 ' are conductively connected to the substrate connection part 315 ' of the substrate 31 ', the institute of the photo-sensitive cell 20 ' is being formed at State one filler of filling in the gap 24 ' of the substrate back 312 ' of non-photo-sensing region 23 ' and the substrate 31 ' 5000 ', to fill the gap 24 '.
It is understood that in other examples of the camera module 100, it can also be first by the filler 5000 ' It is arranged on the substrate back 312 ' of the substrate 31 ' and/or the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' At least partially, the part in the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' is then mounted on the substrate again After the 31 ' substrate back 312 ', the substrate back 312 ' of the substrate 31 ' and/or the photosensitive member are arranged on The filler 5000 ' in the non-photo-sensing region 23 ' of part 20 ' can be maintained at the substrate back of the body of the substrate 31 ' Between face 312 ' and the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ', formed with being filled by the filler 5000 ' It is described between the substrate back 312 ' of the substrate 31 ' and the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' Gap 24 '.For example, can by apply the filler 5000 ' in the substrate back 312 ' of the substrate 31 ' and/or The mode in the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ', makes the filler 5000 ' be arranged on the substrate 31 ' The substrate back 312 ' and/or the photo-sensitive cell 20 ' the non-photo-sensing region 23 '.
Preferably, the filler 5000 ' is being filled in the non-photo-sensing region that is formed at the photo-sensitive cell 20 ' 23 ' and the substrate 31 ' the substrate back 312 ' the gap 24 ' before and be filled in be formed at it is described photosensitive The non-photo-sensing region 23 ' of element 20 ' and the 24 ' Shi Chengliu of the gap of the substrate back 312 ' of the substrate 31 ' Figure, and the filler 500 is being filled in the non-photo-sensing region 23 ' and the institute that are formed at the photo-sensitive cell 20 ' The solidify afterwards in the gap 24 ' of the substrate back 312 ' of substrate 31 ' are stated, to seal the gap 24 '.
The camera module 100 includes a molding unit 40 ', wherein the molding unit 40 ' includes a back side molded section 41 ' and a molded base 42 ', wherein the back side molded section 41 ' is integrally incorporated into the substrate back of the substrate 31 ' 312 ' at least a portion region, the molded base 42 ' are integrally incorporated into the substrate front side 311 ' of the substrate 31 ' At least a portion region.For example, in this preferable examples of the camera module 100 shown in attached drawing 38 and Figure 39, institute State the substrate back 312 ' that back side molded section 41 ' is integrally incorporated into the substrate 31 ', and the back side molded section The whole region of the chip back 25 ' of 41 ' the embedding photo-sensitive cells 20 ', wherein the molded base 42 ' has an at least light Window 420 ', the molded base 42 ' are integrally incorporated into a part of region of the substrate front side 311 ' of the substrate 31 ', And the molded base 42 ' is looped around the surrounding of the photosensitive region 22 ' of the photo-sensitive cell 20 ', so that described photosensitive The part in the photosensitive region 22 ' of element 20 ' and the non-photo-sensing region 23 ' corresponds to the institute of the molded base 42 ' Optical window 420 ' is stated, wherein the light that the optical window 420 ' is formed between the optical lens 10 ' and the photo-sensitive cell 20 ' leads to Road.The back side molded section 41 ', the molded base 42 ', the photo-sensitive cell 20 ', the substrate 31 ' and electronics member Device 32 ' integrally combines, to form a molded circuit board component 2000 '.
That is, according to the other side of the utility model, the utility model further provides for the molded circuit board Component 2000 ', wherein the molded circuit board component 2000 ' includes the substrate 31 ', the electronic component 32 ', the sense Optical element 20 ', the back side molded section 41 ' and the molded base 42 ', wherein the electronic component 32 ' connects switched only The substrate front side 311 ' of the substrate 31 ' and/or the substrate back 312 ' are connected to, the photo-sensitive cell 20 ' is switched on Ground is connected to the substrate back 312 ' of the substrate 31 ', and the photosensitive region 22 ' of the photo-sensitive cell 20 ' and The part in the non-photo-sensing region 23 ' corresponds to the substrate channel 310 ' of the substrate 31 ', wherein the back side molds Portion 41 ' is integrally incorporated at least a portion region of the substrate back 312 ' of the substrate 31 ' and embeds described photosensitive At least a portion region of the chip back 25 ' of element 20 ', wherein the molded base 42 ' be integrally incorporated into it is described At least a portion region of the substrate front side 311 ' of substrate 31 ', and the molded base 42 ' is looped around the photosensitive member The surrounding of the photosensitive region 22 ' of part 20 ', so that the photosensitive region 22 ' of the photo-sensitive cell 20 ' and the non-photo-sensing The part in region 23 ' corresponds to the optical window 420 ' of the molded base 42 '.
In other words, the back side molded section 41 ' can embed the attachment position of the photo-sensitive cell 20 ' and the substrate 31 ' At least a portion put, to prevent the photo-sensitive cell 20 ' from coming off from the substrate 31 ', so as to ensure the camera module 100 reliability.Also, the back side molded section 41 ' is by embedding the attachment of the photo-sensitive cell 20 ' and the substrate 31 ' At least part of mode of position, additionally it is possible to isolate the chip contacts 21 ' and external environment of the photo-sensitive cell 20 ' And the isolation substrate 31 ' the substrate connection part 315 ' and external environment and the isolation chip contacts 21 ' and The link position and external environment of the substrate connection part 315 ', to avoid the chip contacts 21 ', the substrate connection part 315 ' and the mode that is aoxidized of link position of the chip contacts 21 ' and the substrate connection part 315 ', described in guarantee The reliability of the conduction position of photo-sensitive cell 20 ' and the substrate 31 '.
It is understood that the filler 5000 ' can also isolate the chip contacts of the photo-sensitive cell 20 ' 21 ' and the substrate connection part 315 ' and external environment of external environment and the isolation substrate 31 ' and the isolation core The link position and external environment of piece connector 21 ' and the substrate connection part 315 '.
In addition, the mounting position of the embedding of the back side molded section 41 ' photo-sensitive cell 20 ' and the substrate 31 ' is extremely A few part, additionally it is possible to by the intensity of substrate 31 ' described in the 41 ' reinforcement of back side molded section and ensure the substrate 31 ' Flatness.Preferably, by the way that the back side molded section 41 ' is made to embed the chip back 25 ' of the photo-sensitive cell 20 ' extremely At least part of mode, additionally it is possible to ensure the flatness of the photo-sensitive cell 20 ' by the back side molded section 41 ', so that The flatness for obtaining the photo-sensitive cell 20 ' is limited to the back side molded section 41 ', in this way, on the one hand can ensure described photosensitive The flatness of element 20 ', on the other hand, the substrate 31 ' can select thinner plate, to advantageously reduce the camera shooting mould The height dimension of group 100.
The back side molded section 41 ' will not be deformed when heated, so as to when the camera module 100 is by for a long time In use, when the heat that the photo-sensitive cell 20 ' generates acts on back side molded section 41 ', the back side molded section 41 ' is not It can be deformed, to advantageously ensure that the flatness of the photo-sensitive cell 20 '.Preferably, the back side molded section 41 ' has good Good heat-sinking capability, wherein the heat that the photo-sensitive cell 20 ' generates can be rapidly radiated by the back side molded section 41 ' The external environment of the camera module 100, so as to ensure reliability of the camera module 100 when being used for a long time.
In addition, the back side molded section 41 ' is by being integrally incorporated into the substrate back 312 ' of the substrate 31 ' Mode, the substrate back 312 ' that can avoid the substrate 31 ' is exposed, so as to be assemblied in by the camera module 100 The apparatus body 200 and when forming the electronic equipment, other build-up members of the apparatus body 200 will not be because touching It states the substrate back 312 ' of substrate 31 ' and scratches the substrate 31 ', so as to advantageously ensure that the good of the substrate 31 ' Electrically.
With continued reference to attached drawing 38, the back side molded section 41 ' can embed the substrate back of the body for protruding from the substrate 31 ' At least a portion of at least one electronic component 32 ' in face 312 ', mode in this way, on the one hand, the back side Molded section 41 ' can isolate surface and the external environment of the electronic component 32 ', with by avoiding the electronic component The mode that 32 ' surface is aoxidized ensures the good electrical of the electronic component 32 ', on the other hand, the back side molded section 41 ' can prevent the adjacent electronic component 32 ' from occurring mutually doing by way of isolating the adjacent electronic component 32 ' The bad phenomenons such as disturb, so as to can be by attachment greater number and the larger sized electronics member device on limited attachment area Part 32 ', to be conducive to improve the performance and image quality of the camera module 100, in another aspect, the back side molded section 41 ' Avoid the electronic component 32 ' exposed by way of embedding the electronic component 32 ', so as to by the camera module During 100 are assemblied in the apparatus body 200, need not worry about the electronic component 32 ' because with the apparatus body 200 other build-up members touch and scratch the electronic component 32 ' or cause the electronic component 32 ' from described It comes off on substrate 31 ', to ensure reliability of the camera module 100 when being assembled and being used, and electronics member Device 32 ' can also prevent the back side molded section 41 from coming off from the substrate back 312 ' of the substrate 31 ', to ensure It states back side molded section 41 and is securely joined with the substrate back 312 ' in the substrate 31 '.
With further reference to attached drawing 38, in this preferable examples of the camera module 100 of the utility model, the back of the body The height that face molded section 41 ' protrudes from the substrate back 312 ' of the substrate 31 ' is more than or equal to the electronics member device Part 32 ' protrudes from the height of the substrate back 312 ' of the substrate 31 '.Specifically, the back side molded section 41 ' has One free side 4111 ' and one combines side 4112 ', wherein the free side 4111 ' of the back side molded section 41 ' and institute It states and is corresponded with reference to side 4112 ', and the combination side 4112 ' of the back side molded section 41 ' is integrally incorporated into At least a portion region of the substrate back 312 ' of the substrate 31 ' and the chip back of the photo-sensitive cell 20 ' 25 ' at least a portion.
If the back side molded section 41 ' protrudes from the height dimension parameter of the substrate back 312 ' of the substrate 31 ' For H, i.e. the distance between the free side 4111 ' of the back side molded section 41 ' and the combination side 4112 ' parameter For H, if the electronic component 32 ' protrudes from the height dimension parameter of the substrate back 312 ' of the substrate 31 ' as h, Wherein the numerical value of parameter H is more than or equal to the numerical value of parameter h, in this way, assembling the camera module 100 to the equipment sheet During body 200, it can prevent other build-up members of the apparatus body 200 from touching the electronic component 32 ', to ensure State the reliability of camera module 100.
With continued reference to attached drawing 38, the embedding of molded base 42 ' is positioned at the substrate front side 311 ' of the substrate 31 ' At least a portion of at least one electronic component 32 '.Preferably, the embedding of molded base 42 ' is located at the substrate Whole electronic components 32 ' of the 31 ' substrate front side 311 '.
The molded base 42 ' can isolate the electronic component by way of embedding the electronic component 32 ' 32 ' surface and external environment in a manner of by the way that the surface of the electronic component 32 ' is avoided to be aoxidized, ensure the electricity Sub- component 32 ' it is good electrically.Also, the molded base 42 ' can prevent the surface of the electronic component 32 ' from occurring There is cast in the surface of cast and the substrate front side 311 ' of the prevention electronic component 32 ' and the substrate 31 ', The photosensitive region 22 ' of the photo-sensitive cell 20 ' is polluted to avoid these casts, so as to ensure the camera module 100 Product yield and reliability.
In addition, the molded base 42 ' makes the adjacent electronics member device by way of embedding the electronic component 32 ' It is mutually isolated between part 32 ', so as to which the adjacent electronic component 32 ' be avoided the bad phenomenon interfered with each other occur.Also, On the limited area of the substrate front side 311 ' of the substrate 31 ', greater number and bigger can also be connected switched only The electronic component 32 ' of size, to be conducive to improve the performance of the camera module 100.
In addition, safe distance to be reserved is not required in the molded base 42 ' and the electronic component 32 ', so as to have Beneficial to the length and width dimensions and the height dimension of the reduction camera module 100 for reducing the camera module 100.
With further reference to attached drawing 38, the camera module 100 includes an at least filter element 50 ', wherein the member that filters Part 50 ' is mounted on the top surface of the molded base 42 ', to make the 50 ' quilt of filter element by the molded base 42 ' It is maintained between the optical lens 10 ' and the photo-sensitive cell 20 ', so as to enter the camera shooting from the optical lens 10 ' The light of the inside of module 100 through after the filter element 50 ' again by the photosensitive region of the photo-sensitive cell 20 ' 22 ' receive, mode in this way, can ensure the image quality of the camera module 100.
Specifically, the filter element 50 ', which can be filtered from the optical lens 10 ', enters the camera module 100 Inside light in veiling glare, mode in this way can improve the image quality of the camera module 100.It is worth one It is mentioned that, the type of the filter element 50 ' is unrestricted such as described in the camera module 100 of the utility model Filter element 50 ' can be but not limited to IR cut filter element, visible spectrum filter element etc..
With further reference to attached drawing 38, the camera module 100 includes an at least driver 60 ', wherein the optical lens 10 ' are driveably arranged at the driver 60 ', and the driver 60 ' is mounted on the top table of the molded base 42 ' Face, by the driver 60 ' optical lens 10 to be made to be maintained at the photosensitive path of the photo-sensitive cell 20 '.Also, The driver 60 ' can drive the optical lens 10 ' to be done along the photosensitive path of the photo-sensitive cell 20 ' compared with described The movement of photo-sensitive cell 20 ', so as to which the camera module 100 is by adjusting the optical lens 10 ' and the photo-sensitive cell 20 ' Relative position mode, realize auto-focusing and the autozoom of the camera module 100.
It is noted that the type of the driver 60 ' is unrestricted in the camera module 100 of the utility model System, as long as the optical lens 10 ' can be driven to be done along the photosensitive path of the photo-sensitive cell 20 ' compared with described photosensitive The relative motion of element 20 ', for example, the driver 60 ' may be implemented as in the specific example of the utility model but It is not limited to voice coil motor.
Further, the driver 60 ' has at least one driving pin 61 ', wherein the driving pin 61 ' is electrically connected It is connected to the substrate 31 '.Preferably, the molded base 42 ' has an at least pin slot 421 ', wherein the molded base The top surface of 42 ' pin slot 421 ' from the molded base 42 ' extends to the substrate front side of the substrate 31 ' 311 ', in this way, after the driver 60 ' is mounted on the top surface of the molded base 42 ', the institute of the driver 60 ' The substrate 31 ' can be extended in the pin slot 421 ' from the top surface of the molded base 42 ' by stating driving pin 61 ' The substrate front side 311 ', and the driving pin 61 ' of the driver 60 ' can be electrically connected to the substrate 31’。
Preferably, the pin slot 421 ' is along the outer surface of the molded base 42 ' from the table of the molded base 42 ' Face extends to the substrate front side 311 ' of the substrate 31 ', consequently facilitating the driver 60 ' is being mounted on the molding After the top surface of pedestal 42 ', then the driving pin 61 ' of the driver 60 ' and the substrate 31 ' be electrically connected.It can be with Understand, be housed inside the driving pin of the driver 60 ' of the pin slot 421 ' of the molded base 42 ' 61 ' do not protrude from the outer surface of the molded base 42 ', in this way, can not only ensure the beauty of the camera module 100 Property, but also can prevent occurring touching the driver when assembling the camera module 100 in the apparatus body 200 The bad phenomenon of 60 ' the driving pin 61 ', to ensure the reliability and product yield of the camera module 100.
Further, the top surface of the molded base 42 ' has at least an inner surface 422 ' and an at least outside table Face 423 ', wherein the driver 60 ' is mounted on the outer surface 423 ' of the molded base 42 ', so that the light The photosensitive path that camera lens 10 ' is maintained at the photo-sensitive cell 20 ' is learned, wherein the filter element 50 ' is mounted on the mould The inner surface 422 ' of pedestal 42 ' is moulded, so that the filter element 50 ' is maintained at the optical lens 10 ' and described Between photo-sensitive cell 20 '.
In some examples of the camera module 100 of the utility model, the inside table of the molded base 42 ' Plane where face 422 ' is concordant with the plane where the outer surface 423 '.In the camera module of the utility model It is flat where the inner surface 422 ' and the outer surface 423 ' where the molded base 42 ' in 100 other examples Face has difference in height, such as in this specific example of the camera module 100 shown in attached drawing 38, the molded base Plane where the 42 ' inner surface 422 ' is less than the plane where the outer surface 423 ', so that the molding Pedestal 42 ' forms at least one attachment slot 424 ', and the attachment slot 424 ' of the molded base 42 ' is communicated in the optical window 420 ', wherein the filter element 50 ' for being mounted on the inner surface 422 ' of the molded base 42 ' is housed inside institute Attachment slot 424 ' is stated, further to reduce the height dimension of the camera module 100.
It is understood that the molded base 42 ' can be a holding seat 6000 ', wherein the holding seat 6000 ' has There are maintaining part 6100 ' and maintaining part 6200 ' once on one, wherein the filter element 50 ' and the driver 60 ' are protected respectively The upper maintaining part 6100 ' in the holding seat 6000 ' is held, the substrate 31 ' is maintained at the institute of the holding seat 6000 ' Lower maintaining part 6200 ' is stated, so that the optical lens 10 ' is maintained at the photosensitive path of the photo-sensitive cell 20 ' and makes described Filter element 50 ' is maintained between the optical lens 10 ' and the photo-sensitive cell 20 '.It is understood that the molding The upper maintaining part 6100 ' of the optical window 420 ' of pedestal 42 ' from the holding seat 6000 ' extends to the lower maintaining part 6200 ', so that the optical window 420 ' forms the passage of light between the optical lens 10 ' and the photo-sensitive cell 20 '.
The lower maintaining part 6200 ' for keeping seat 6000 ' is by being integrally incorporated into the base of the substrate 31 ' The mode in plate front 311 ' makes the substrate 31 ' be maintained at the lower maintaining part 6200 ' of the holding seat 6000 '.It is described Filter element 50 ' and the driver 60 ' are respectively by being mounted on the upper maintaining part 6100 ' of the holding seat 6000 ' Mode is maintained at the upper maintaining part 6100 ' of the holding seat 6000 '.
With reference to the utility model Figure of description attached drawing 28 to Figure 37, the manufacturing process of the camera module 100 exists It is set forth in following description.
In the stage shown in attached drawing 28, by least one electronic component 32 ' the substrate 31 ' the substrate Front 311 ' be conductively connected to the substrate 31 ' and by the other electronic component 32 ' the substrate 31 ' institute It states substrate back 312 ' and is conductively connected to the substrate 31 ', two of which or more than two substrates 31 ' are arranged Form a layout unit 3000 '.It is noted that form the arrangement of multiple substrates 31 ' of the layout unit 3000 ' Mode is unrestricted in the camera module 100 of the utility model, is chosen as needed.
For example, in this specific example of the camera module 100 of the utility model, carried in the substrate 31 ' For or after being made into, at least one electronic component 32 ' can be mounted on the substrate by way of attachment 31 ' the substrate front side 311 ' so that these described electronic components 32 ' the substrate 31 ' the substrate just Face 311 ' is connected to the substrate 31 ' switched only, and the other electronic component 32 ' is mounted by way of attachment In the substrate back 312 ' of the substrate 31 ', so that these described electronic components 32 ' are in the substrate 31 ' The substrate back 312 ' is connected to the substrate 31 ' switched only.
In addition, the electronic component 32 ' is mounted on the substrate front side 311 ' of the substrate 31 ' and the substrate The position at the back side 312 ' can not also be restricted, and be adjusted according to the concrete application of the camera module 100, such as in this reality In other example with the new camera module 100, multiple electronic components 32 ' can be disposed in described The substrate front side 311 ' of substrate 31 ' and/or the whole region of the substrate back 312 ', and described in the utility model In the other example of camera module 100, multiple electronic components 32 ' can also be disposed in the substrate 31 ' The specific region of the substrate front side 311 ' and/or the substrate back 312 ', such as corner either certain one side or certain both sides Deng.The camera module 100 of the utility model is unrestricted in this regard.
It is noted that in the other example of the camera module 100 of the utility model, can also only by The electronic component 32 ' the substrate front side 311 ' of the substrate 31 ' be conductively connected to the substrate 31 ' or The substrate back 312 ' of the electronic component 32 ' in the substrate 31 ' is conductively only connected to the substrate 31 '.
In addition, with continued reference to attached drawing 28, by the photo-sensitive cell 20 ' the substrate 31 ' the substrate back 312 ' The substrate 31 ' is mounted on, so that the chip contacts positioned at the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' 21 ' and positioned at the substrate 31 ' the substrate back 312 ' the substrate connection part 315 ' be switched on and make described photosensitive The photosensitive region 22 ' of element 20 ' and a part of non-photo-sensing region 23 ' correspond to the substrate of the substrate 31 ' Passage 310 ', so that the photo-sensitive cell 20 ' is connected to the substrate 31 ' switched only.
It will be appreciated by those skilled in the art that it is being mounted on the substrate 31 ' in the photo-sensitive cell 20 ' The substrate back 312 ', and make the chip contacts 21 ' of the photo-sensitive cell 20 ' and the base of the substrate 31 ' After plate connector 315 ' is switched on, in the described of the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' and the substrate 31 ' The gap 24 ' is formed between substrate back 312 '.Then, it is filled in using the filler 5000 ' in the gap 24 ', Passed through with the substrate back 312 ' for preventing the photosensitive region 22 ' of the photo-sensitive cell 20 ' and the substrate 31 ' described Gap 24 ' is connected, so as to which in subsequent molding process, the filler 5000 ' can prevent a fluid media (medium) 400 ' certainly The substrate back 312 ' of the substrate 31 ' enters the photosensitive region of the photo-sensitive cell 20 ' by the gap 24 ' 22 ', it is contaminated to avoid the photosensitive region 22 ' of the photo-sensitive cell 20 '.
It is understood that the substrate 31 ' can isolate at least one electronic component 32 ' and the photosensitive member The photosensitive region 22 ' of part 20 ', cast and the electronic component to avoid the surface of the electronic component 32 ' 32 ' and the cast of link position of the substrate 31 ' pollute the photosensitive region 22 ' of the photo-sensitive cell 20 '.For example, It is all arranged in the electronic component 32 ' in the example of the substrate back 312 ' of the substrate 31 ', the substrate 31 ' can isolate the photosensitive region 22 ' of whole electronic components 32 ' and the photo-sensitive cell 20 ', so as to make During making the camera module 100, the cast on the surface of the electronic component 32 ' and electronics member can be avoided The cast of the link position of device 32 ' and the substrate 31 ' pollutes the photosensitive region 22 ' of the photo-sensitive cell 20 '.
It is noted that in some examples of the camera module 100 of the utility model, it can be first by the electricity Sub- component 32 ' is conductively connected to the substrate 31 ', and the photo-sensitive cell 20 ' is conductively then connected to the base again Plate 31 '.In other examples of the camera module 100 of the utility model, first the photo-sensitive cell 20 ' can also be led The substrate 31 ' is connected to logically, and the electronic component 32 ' is conductively then connected to the substrate 31 ' again.Although such as This, it will be appreciated by those skilled in the art that, in the other example of the camera module 100 of the utility model In, first the electronic component 32 ' for the substrate back 312 ' for being located at the substrate 31 ' conductively can also be connected to The substrate 31 ' and the photo-sensitive cell 20 ' is conductively connected to the substrate 31 ', then will be located at the substrate again The electronic component 32 ' of the 31 ' substrate front side 311 ' is conductively connected to the substrate 31 ' or will first be located at The electronic component 32 ' of the substrate front side 311 ' of the substrate 31 ' is conductively connected to the substrate 31 ', then The electronic component 32 ' for the substrate back 312 ' for being located at the substrate 31 ' is conductively connected to the substrate again 31 ' and the photo-sensitive cell 20 ' is conductively connected to the substrate 31 '.The camera module 100 of the utility model exists This respect is unrestricted.
In the stage shown in attached drawing 29A and Figure 29 B, the layout unit 3000 ' is put into a molding tool 300 ', To perform moulding technology by the molding die 300 '.
Specifically, the molding die 300 ' includes a mold 301 ' and once mold 302 ', wherein the upper mold At least one mold in tool 301 ' and the lower mold 302 ' can be operated, so that the molding die 300 ' can be held Row molding and draft operation.For example, in one example, by the layout unit 3000 ' be positioned over the lower mold 302 ' and After performing die closing operation to the molding die 300 ', in the substrate front side of the mold 301 ' He the substrate 31 ' At least one first molding space 303a ' is formed between 311 ' and in the lower mold 302 ' and the substrate of the substrate 31 ' At least one second molding space 303b ' is formed between the back side 312 '.
In an optional example of the utility model, at least one first molding space 303a ' and at least one A second molding space 303b ' is interconnected, a fluid media (medium) 400 ' subsequently to be allowed to fill full first shaping Space 303a ' and the second molding space 303b ', the described of the substrate 31 ' is integrally incorporated into be formed simultaneously respectively The molded base 42 ' at least a portion region of substrate front side 311 ' and integrally it is incorporated into the described of the substrate 31 ' The back side molded section 41 ' at least a portion region of substrate back 312 '.Preferably, the back side molded section 41 ' into one Step embeds at least a portion region of the chip back 25 ' of the photo-sensitive cell 20 '.Optionally, first shaping is empty Between 303a ' and the second molding space 303b ' can also be without being interconnected, so as in subsequent moulding technology, individually Ground adds in the fluid media (medium) 400 ' to the first molding space 303a ' and the second molding space 303b ', with by institute State the full first molding space 303a ' and the second molding space 303b ' of the filling of fluid media (medium) 400 '.
Preferably, when the quantity of the first molding space 303a ' is two or during more than two, in the mold At least one first communicating passage 304a ' can also be formed between 301 ' and the substrate front side 311 ' of the substrate 31 ', for Connect the adjacent first molding space 303a '.Correspondingly, when the quantity of the second molding space 303b ' be two or During more than two, it can also be formed at least between the lower mold 302 ' and the substrate back 312 ' of the substrate 31 ' One second communicating passage 304b ', for connecting the adjacent second molding space 303b '.
With continued reference to attached drawing 29A and Figure 29 B, the mold 301 ' further comprise on one be molded guide portion 3011 ' and An at least optical window forming part 3012 ' and with guiding groove 3013 ' is molded at least one, wherein the optical window forming part 3012 ' The upper shaping guide portion 3011 ' is integrally extended, in the optical window forming part 3012 ' and the upper shaping guide portion The upper shaping guiding groove 3013 ' is formed between 3011 ' or between the adjacent optical window forming part 3012 ' described in formation Upper shaping guiding groove 3013 '.
Further, the upper shaping guide portion 3011 ' has pressure unit 30111 ' on one first, the optical window forming part 3012 ' have one second on pressure unit 30121 ', with the molding die 300 ' be performed molding technique after, the upper shaping Pressure unit in pressure unit 30111 ' and described the second of the optical window forming part 3012 ' on described the first of guide portion 3011 ' 30121 ' apply pressure to respectively the substrate 31 ' the substrate front side 311 ' different position, and on described be molded guiding The corresponding position of slot 3013 ' forms the first molding space 303a '.It is preferably located at the substrate of the substrate 31 ' just The electronic component 32 ' in face 311 ' is housed inside the first molding space 303a ', to be completed in follow-up moulding technology Afterwards, the molded base 42 ' of the substrate front side 311 ' for being integrally incorporated into the substrate 31 ' of formation can embed institute State electronic component 32 '.It is highly preferred that the height dimension of the first molding space 303a ' is more than the electronic component 32 ' The height dimension of the substrate front side 311 ' of the substrate 31 ' is protruded from, when the molding die 300 ' is molded, to keep away The inner surface for exempting from the mold 301 ' is contacted with the electronic component 32 ', and then avoids the table of the electronic component 32 ' Face scratches and avoids the electronic component 32 ' to be pressurized by the inner surface of the mold 301 '.
In addition, the molding die 300 ' further comprises an at least film layer 305 ', wherein the film layer 305 ' is overlappingly The inner surface of the mold 301 ' is arranged at, such as the film layer 305 ' can be by being attached at the interior of the mold 301 ' The mode on surface is overlappingly arranged at the inner surface of the mold 301 '.After the molding die 300 ' is molded, institute It states film layer 305 ' and is being located at the substrate of pressure unit 30111 ' and the substrate 31 ' on described the first of the mold 301 ' just Pressure unit 30121 ' and the substrate of the substrate 31 ' between face 311 ' and on described the second of the mold 301 ' Between front 311 ', mode in this way, on the one hand, the film layer 305 ' can absorb the shaping by way of deformation The impact force that mold 300 ' is generated when being molded directly acts on the substrate 31 ' to avoid the impact force, on the other hand, The film layer 305 ' can isolate the described of pressure unit 30111 ' and the substrate 31 ' on described the first of the mold 301 ' Pressure unit 30121 ' and the substrate front side 311 ' of the substrate 31 ' in substrate front side 311 ' and isolation described second, to keep away Exempt from described the first of the mold 301 ' pressure unit 30121 ' in pressure unit 30111 ' and described second and scratch the substrate 31 ' the substrate front side 311 ', on the other hand, the film layer 305 ' can be prevented by way of deformation in the mold On described the first of 301 ' between pressure unit 30111 ' and the substrate front side 311 ' of the substrate 31 ' and prevent described second Gap is generated between upper pressure unit 30121 ' and the substrate front side 311 ' of the substrate 31 ', can especially be prevented in institute It states and generates gap between pressure unit 30121 ' and the substrate front side 311 ' of the substrate 31 ' on second, in subsequent mould It moulds in technique, the fluid media (medium) 400 ' can not only be prevented to flow to the substrate 31 ' from the first molding space 303a ' The substrate channel 310 ' in and the photosensitive region 22 ' of the photo-sensitive cell 20 ' is polluted, but also can prevent Only there are bad phenomenons such as " overlaps ".
With continued reference to attached drawing 29A and Figure 29 B, the lower mold 302 ' further comprise being molded guide portion 3021 ' and An at least support portion 3022 ' and at least once be molded guiding groove 3023 ', wherein the support portion 3022 ' integrally prolongs The lower shaping guide portion 3021 ' is stretched in, to be formed between the support portion 3022 ' and the lower shaping guide portion 3021 ' The lower shaping guiding groove 3023 ' forms the lower shaping guiding groove 3023 ' between the adjacent support portion 3022 '.
When performing die closing operation to the molding die 300 ', in the lower shaping guiding groove of the lower mold 302 ' 3023 ' corresponding positions form the second molding space 303b '.Also, the lower shaping of the lower mold 302 ' is drawn The substrate back 312 ' of the substrate 31 ' and the support portion of the lower mold 302 ' can be applied pressure to by leading portion 3021 ' 3022 ' the substrate backs 312 ' that can apply pressure to the substrate 31 '.Preferably, the base of the substrate 31 ' is protruded from The electronic component 32 ' of back 312 ' is housed inside the second molding space 303b '.It is it is understood that described At least a portion of the link position of the substrate back 312 ' of photo-sensitive cell 20 ' and the substrate 31 ' can also be received In the second molding space 303b '.
Preferably, the height dimension of the second molding space 303b ' of the lower mold 302 ' is more than electronics member Device 32 ' protrudes from the height dimension of the substrate back 312 ' of the substrate 31 ', mode in this way, when described Lower mold 302 ' apply pressure to the substrate 31 ' the substrate back 312 ' when, protrude from the substrate 31 ' the substrate back of the body There is safe distance, with by avoiding between the inner surface of the electronic component 32 ' in face 312 ' and the lower mold 302 ' The surface of the electronic component 32 ' contacts the mode of the inner surface of the lower mold 302 ', protects the electronic component 32 ' Surface be not scraped off and avoid the electronic component 32 ' to be pressurized.In addition, by the surface of the electronic component 32 ' There is the mode of safe distance between the inner surface of the lower mold 302 ', additionally it is possible to described subsequently making integrally to be incorporated into The back side molded section 41 ' of the substrate back 312 ' of substrate 31 ' embeds the electronic component 32 '.
It is highly preferred that the film layer 305 ' can also overlappingly be arranged at the inner surface of the lower mold 302 ', such as institute The lower mold can be overlappingly arranged at by way of being attached at the inner surface of the lower mold 302 ' by stating film layer 305 ' 302 ' inner surface.After the molding die 300 ' is molded, the film layer 305 ' be located at the lower mold 301 it is described under It is molded between guide portion 3021 ' and the substrate back 312 ' of the substrate 31 ' and the support portion 3022 ' and the substrate Between the 31 ' substrate back 312 ', mode in this way, on the one hand, the film layer 305 ' can pass through the side of deformation Formula absorbs the impact force that the molding die 300 ' is generated when being molded, and the substrate is directly acted on to avoid the impact force 31 ', on the other hand, the film layer 305 ' can isolate the lower shaping guide portion 3021 ' and described of the lower mold 302 ' The substrate back 312 ' of substrate 31 ' and the substrate back for isolating the support portion 3022 ' and the substrate 31 ' 312 ', scratch the substrate to avoid the lower shaping guide portion 3021 ' of the lower mold 302 ' and the support portion 3022 ' 31 ' the substrate back 312 '.
Further it will be understood that the film layer 305 ' can also facilitate the mold of the molding die 300 ' 301 ' demould with the lower mold 302 ', and in this process, avoid the molded base 42 ' and the back side molded section 41 ' are damaged, and the optical window 420 ' of the molded base 42 ' is especially avoided to be damaged, so as to ensure the camera module 100 reliability.
In the stage shown in attached drawing 30 and Figure 31, the fluid media (medium) 400 ' is added at least one first shaping The fluid media (medium) 400 ' is either added at least one second molding space 303b ' or by institute by space 303a ' It states fluid media (medium) 400 ' and is added separately to the first molding space 303a ' and the second molding space 303b ', due to adjacent It is connected between the first molding space 303a ' by the first communicating passage 304a ' and adjacent second shaping is empty Between be connected by the second communicating passage 304b ' between 303b ', therefore, the fluid media (medium) 400 ' can fill completely all The first molding space 303a ' and all the second molding space 303b '.
It is noted that the fluid media (medium) 400 ' can be mixture of liquid, solid or liquid and solid etc., So that the fluid media (medium) 400 ' can flow.In addition, the fluid media (medium) 400 ' may be implemented as but be not limited to thermosetting property Material.Certainly, it will be appreciated by those skilled in the art that, in other possible examples, the 400 ' quilt of fluid media (medium) It is embodied as light thermoset material or is also possible that from thermoset material.
The full first molding space 303a ' and the second molding space 303b ' is filled in the fluid media (medium) 400 ' Afterwards, the fluid media (medium) 400 ' can be made by way of heating in the first molding space 303a ' and second shaping Cure in the 303b ' of space, and draft operation, the rank shown in refer to the attached drawing 32 can be subsequently being performed to the molding die 300 ' Section, wherein the cured formation of fluid media (medium) 400 ' is integrally incorporated into the base in the first molding space 303a ' The molded base 42 ' of the substrate front side 311 ' of plate 31 ', and in the optical window forming part of the mold 301 ' 3012 ' corresponding positions form the optical window 420 ' of the molded base 42 ', the photosensitive area of the photo-sensitive cell 20 ' The part in domain 22 ' and the non-photo-sensing region 23 ' corresponds to the optical window 420 ' of the molded base 42 ', wherein in institute It states the cured fluid media (medium) 400 ' in the second molding space 303b ' and can be formed and be integrally incorporated into the substrate 31 ' The back side molded section 41 ' of the substrate back 312 '.Preferably, the embedding of back side molded section 41 ' protrudes from the base The electronic component 32 ' of the substrate back 312 ' of plate 31 '.It is highly preferred that described in the embedding of back side molded section 41 ' The chip back 25 ' of photo-sensitive cell 20 '.Optionally, in the corresponding position of the support portion 3022 ' of the lower mold 302 ' Put at least assembly space 410 ' for being formed simultaneously the back side molded section 41 '.
In the stage shown in attached drawing 33, after draft operation is performed to the molding die 300 ', the mould can be formed Mould the semi-finished product of circuit board assemblies 2000 '.Then the molded circuit board component 2000 ' can be split in attached drawing 34A and Figure 34 B Semi-finished product, to form the molded circuit board component 2000 '.Split the semi-finished product of the molded circuit board component 2000 ' Mode is unrestricted in the camera module 100 of the utility model, such as can split the mould by way of cutting The semi-finished product of circuit board assemblies 2000 ' are moulded to form the molded circuit board component 2000 ', overetched mode point can also be led to The semi-finished product of the molded circuit board component 2000 ' are cut to form the molded circuit board component 2000 '.
In addition, in some examples of the camera module 100 of the utility model, such as attached drawing 34A, splitting the mould When moulding the semi-finished product of circuit board assemblies 2000 ', segmentation direction can be where the substrate front side 311 ' of institute's substrate 31 ' Direction where direction to the substrate back 312 '.In other examples of the camera module 100 of the utility model, Such as attached drawing 34B, when splitting the semi-finished product of the molded circuit board component 2000 ', segmentation direction can also be from the substrate The direction where direction to the substrate front side 311 ' where the 31 ' substrate back 312 '.
In this stage shown in attached drawing 35, the module of the connecting plate 33 ' is connected by the connecting portion 34 ' Side 331 ' is mounted on the substrate back 312 ' of the substrate 31 ', conductively to connect the connecting plate 33 ' and the substrate 31’.Preferably, the module connecting side 331 ' of the connecting plate 33 ' is housed inside the dress of the back side molded section 41 ' With in space 410 ', protruded to avoid the module connecting side 331 ' of the connecting plate 33 '.It is understood that described In other examples of camera module 100, the module of the connecting plate 33 ' can also be connected by the connecting portion 34 ' Connect the substrate front side 311 ' that side 331 ' is mounted on the substrate 31 '.
Optionally, the stage shown in attached drawing 35 can also be before the stage shown in attached drawing 34A and Figure 34 B, so as to first The module connecting side 331 ' of the connecting plate 33 ' is mounted on to the base of the substrate 31 ' by the connecting portion 34 ' Back 312 ' then splits the semi-finished product of the molded circuit board component 2000 ' to form the molded circuit board component again 2000’。
In the stage shown in attached drawing 36, the filter element 50 ' is mounted on to the inside table of the molded base 42 ' Face 422 ' and in the stage shown in attached drawing 37, institute is mounted on by the driver 60 ' for being assembled with the optical lens 10 ' State the outer surface 423 ' of molded base 42 ', and conductively connect the driver 60 ' the driving pin 61 ' and The substrate 31 ', so that the optical lens 10 ' is maintained at the photosensitive path of the photo-sensitive cell 20 ' and makes the optical filtering Element 50 ' is maintained between the optical lens 10 ' and the photo-sensitive cell 20 ', so as to which the institute as shown in attached drawing 38 be made State camera module 100.
It is noted that although the utility model shows the back side molded section 41 ' and the molding base above-mentioned Seat 42 ' while is integrally incorporated into the substrate back 312 ' of the substrate 31 ' and the example of the substrate front side 311 ', In other examples of the camera module 100, the back side molded section 41 ' can also first be made integrally to be incorporated into the substrate 31 ' the substrate back 312 ', then the molded base 42 ' is made integrally to be incorporated into the substrate of the substrate 31 ' just Face 311 ' first makes the molded base 42 ' integrally be incorporated into the substrate front side 311 ' of the substrate 31 ', then makes The back side molded section 41 ' is integrally incorporated into the substrate front side 311 ' of the substrate 31 ', i.e. the back side molded section 41 ' are formed with the molded base 42 ' by different moulding technologies respectively, and the camera module 100 of the utility model is in side Face is unrestricted.
According to the other side of the utility model, the utility model further provides for the manufacturing method of a camera module 100, Wherein described manufacturing method includes the following steps：
An at least photo-sensitive cell 20 ' is mounted on to a substrate back 312 ' of a substrate 31 ', and makes the photo-sensitive cell A 20 ' photosensitive region 22 ' and the part in the non-photo-sensing region 23 ' for being looped around the 22 ' surrounding of photosensitive region correspond to One substrate channel 310 ' of the substrate 31 '；
Conductively connect at least an electronic component 32 ' and the substrate 31 '；
By moulding technology a back side molded section 41 ' is made integrally to be incorporated into the substrate back of the substrate 31 ' 312 ' at least a portion region；And
One optical lens 10 ' is maintained to the photosensitive path of the photo-sensitive cell 20 ', the camera module 100 is made.
It is noted that the step (b) can also be before the step (a), described in first conductively connecting The photo-sensitive cell 20 ' is then mounted on the substrate of the substrate 31 ' by electronic component 32 ' and the substrate 31 ' again The back side 312 '.
In addition, in the step (b), make the electronic component 32 ' in the substrate front side of the substrate 31 ' 311 ' are connected to the substrate 31 ' or make the electronic component 32 ' in the substrate of the substrate 31 ' switched only The back side 312 ' is connected to the substrate 31 ' or makes at least one electronic component 32 ' in the substrate switched only 31 ' the substrate front side 311 ' is connected to the substrate 31 ' and makes the other electronic component 32 ' in institute switched only The substrate front side 311 ' for stating substrate 31 ' is connected to the substrate 31 ' switched only.
Further, after the step (c), step can also be included：(e) molded base is made by moulding technology 42 ' are integrally incorporated at least a portion region of the substrate front side 311 ' of the substrate 31 ', so that the molded base 42 ' are looped around the surrounding of the photosensitive region 22 ' of the photo-sensitive cell 20 ' and make the described photosensitive of the photo-sensitive cell 20 ' The part in region 22 ' and the non-photo-sensing region 23 ' corresponds to the optical window 420 ' of the molded base 42 '.
Optionally, the step (e) can also be before the step (c), so as to first make the 42 ' one of molded base Ground is incorporated at least a portion region of the substrate front side 311 ' of the substrate 31 ', then makes the back side molded section again 41 ' are integrally incorporated at least a portion region of the substrate back 312 ' of the substrate 31 '.
Also optionally, the step (c) and the step (e) are completed together, i.e. while make the molded base 42 ' one At least a portion region of the substrate front side 311 ' of the substrate 31 ' is incorporated into body and makes the back side molded section 41 ' Integrally it is incorporated at least a portion region of the substrate back 312 ' of the substrate 31 '.
Attached drawing 40 shows a variant embodiment of the camera module 100, and the substrate 31 ' further has extremely A few shaping channel 319 ', wherein the shaping channel 319 ' extends to institute from the substrate front side 311 ' of the substrate 31 ' State substrate back 312 ', i.e. the shaping channel 319 ' is communicated in the substrate front side 311 ' of the substrate 31 ' and the base Back 312 '.In moulding technology, the shaping channel 319 ' can connect the first molding space 303a ' and described Two molding space 303b ', so as to be added into the first molding space 303a ' and/or described when the fluid media (medium) 400 ' During the second molding space 303b ', the fluid media (medium) 400 ' can equally be filled in the shaping channel 319 ', and consolidate in rear extended meeting Change in the shaping channel 319 '.It is appreciated that yes, the molded base 42 ' and the back side molded section 41 ' can pass through The shaping channel 319 ' of the substrate 31 ' is integrally formed, to avoid the molded base 42 ' and/or the back side mould Modeling portion 41 ' comes off from the substrate 31 ', so as to ensure the reliability of the molded circuit board component 2000 '.
Attached drawing 41 shows another variant embodiment of the camera module 100, and the molded base 42 ' can wrap Bury the part in the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ', i.e. the molded base 42 ' can be from the substrate 31 ' the substrate front side 311 ' and the part in the non-photo-sensing region 23 ' of the photo-sensitive cell 20 ' are integrally prolonged upwards It stretches, the inner surface 422 ' and the outer surface 423 ' is formed with the top surface in the molded base 42 ', and in institute It states the photosensitive region 23 of photo-sensitive cell 20 ' and a part of corresponding position in the non-photo-sensing region 23 ' forms the mould Mould the optical window 420 ' of pedestal 42 '.
Attached drawing 42 shows another variant embodiment of the camera module 100, and the camera module 100 is further Include the supporting member 70 ' of an at least frame shape, wherein the supporting member 70 ' is arranged at the described of the photo-sensitive cell 20 ' Non-photo-sensing region 23 ' or the supporting member 70 ' can be formed at the non-photo-sensing region of the photo-sensitive cell 20 ' 23 ', the molded base 42 ' embeds a part for the supporting member 70 ', so that the molded base 42 ', the supporting member Part 70 ', the photo-sensitive cell 20 ', the substrate 31 ' and the back side molded section 41 ' integrally combine.
Preferably, the supporting member 70 ' protrudes from the substrate front side 311 ' of the substrate 31 ', in this way, molding In technique, the mold 301 ' described second on pressure unit 30121 ' can directly apply pressure to the supporting member 70 ', with Avoid pressure unit 30121 ' and the substrate front side 311 ' of the substrate 31 ' on described the second of the mold 301 ' direct Contact.
It is highly preferred that the supporting member 70 ' has elasticity, such as the supporting member 70 ' can be by glue or tree It is formed after the media cures such as fat, is being closed thus it is possible, on the one hand, the supporting member 70 ' can absorb the molding die 300 ' The impact force generated during mould, on the other hand, the supporting member 70 ' can be prevented by way of being deformed in the upper mold Gap is generated between pressure unit 30121 ' and the supporting member 70 ' on described the second of tool 301 ', thus by the fluid When medium 400 ' is added to the first molding space 303a ', the fluid media (medium) 400 ' can be prevented from the described first shaping Space 303a ' enters the substrate channel 310 ' of the substrate 31 ', to avoid the described photosensitive of the photo-sensitive cell 20 ' Region 22 ' is contaminated, and can prevent the appearance of bad phenomenons such as " overlaps ".
Attached drawing 43 shows another variant embodiment of the camera module 100, and the camera module 100 is further Include the stent 80 ' of an at least frame shape, wherein the filter element 50 ' is mounted on the stent 80 ', the 80 ' quilt of stent The inner surface 422 ' of the molded base 42 ' is mounted on, so that the filter element 50 ' is maintained at the optical frames Between first 10 ' and the photo-sensitive cell 20 '.Preferably, the stent 80 ' is maintained at the patch of the molded base 42 ' In tankage 424 '.
The filter element 50 ' is maintained at by the optical lens 10 ' and the photo-sensitive cell by the stent 80 ' Mode between 20 ' can reduce the area of the filter element 50 ', to advantageously reduce the manufacture of the camera module 100 Cost.
Another variant embodiment of the camera module 100 shown in attached drawing 44A, the filter element 50 ' can be with The optical lens 10 ' is directly mounted on, so that the filter element 50 ' is maintained at the optical lens 10 ' and described Between photo-sensitive cell 20 '.
Attached drawing 44B shows another variant embodiment of the camera module 100, and the substrate 31 ' has at least One accommodation space 316 ', wherein the accommodation space 316 ' and the substrate channel 310 ' are interconnected, wherein described accommodate sky Between 316 ' extend from the substrate back 312 ' of the substrate 31 ' to the 311 ' direction of substrate front side.It is mounted on described The receiving that the photo-sensitive cell 20 ' of the substrate back 312 ' of substrate 31 ' can be housed inside the substrate 31 ' is empty Between 316 ', mode in this way can further reduce the height dimension of the camera module 100.
Attached drawing 45 shows another variant embodiment of the camera module 100, and the back side molded section 41 ' may be used also Further to embed the module connecting side 331 ' of the connecting plate 33 ', i.e. the back side molded section 41 ' can embed institute The mounting position of the module connecting side 331 ' of connecting plate 33 ' and the substrate back 312 ' of the substrate 31 ' is stated, to keep away The module connecting side 331 ' for exempting from the connecting plate 33 ' comes off from the substrate back 312 ' of the substrate 31 ', so as to protect Demonstrate,prove the reliability of the camera module 100.
Attached drawing 46 shows another variant embodiment of the camera module 100, the mould of the connecting plate 33 ' Group connecting side 331 ' can also be connected to the substrate front side 311 ' of the substrate 31 ' by the connecting portion 34 '.
Attached drawing 47 shows another variant embodiment of the camera module 100, and the molded base 42 ' can be with Further comprise the module connecting side 331 ' of the connecting plate 33 ', i.e. the molded base 42 ' can embed the company The mounting position of the module connecting side 331 ' of fishplate bar 33 ' and the substrate front side 311 ' of the substrate 31 ', to avoid institute The module connecting side 331 ' for stating connecting plate 33 ' comes off from the substrate front side 311 ' of the substrate 31 '.
Attached drawing 48 shows another variant embodiment of the camera module 100, and the camera module 100 is further Including an at least protective element 7000 ', wherein the protective element 7000 ' can be overlappingly arranged at the photo-sensitive cell 20 ' the chip back 25 ', wherein the protective element 7000 ' has an exposed region 7100 ' and is looped around described exposed One embedding region 7200 ' of 7100 ' surrounding of region, wherein the back side molded section 41 ' embeds the substrate of the substrate 31 ' At least a portion region at the back side 312 ' and the embedding region 7200 ' of the protective element 7000 ', so that the back side mould Modeling portion 41 ', the substrate 31 ', the photo-sensitive cell 20 ' and the protective element 7000 ' integrally combine.That is, institute It can be in surround to state back side molded section 41 ', to form the assembly space 410 ' at the middle part of the back side molded section 41 ', Described in protective element 7000 ' the exposed region 7100 ' correspond to the back side molded section 41 ' the assembly space 410’。
In an example of the camera module 100 of the utility model, the protective element 7000 ' can be but not It is limited to one layer of ink or layer protecting film, for protecting the chip back 25 ' of the photo-sensitive cell 20 '.In this reality In another example with the new camera module 100, the protective element 7000 ' can also be implemented as heat dissipation member Part, such as the protective element 7000 ' may be implemented as but be not limited to aluminium flake, copper sheet etc., is overlappingly arranged at described The chip back 25 ' of photo-sensitive cell 20 ', in this way, the heat that the photo-sensitive cell 20 ' generates can be rapidly transferred to The protective element 7000 ' and radiated by the protective element 7000 ', with ensure the camera module 100 by it is long when Between use when reliability.
Attached drawing 49 shows another variant embodiment of the camera module 100, and the camera module 100 is further Including an at least lens barrel 90 ', wherein the optical lens 10 ' is assembled in the lens barrel 90 ', the lens barrel 90 ' is mounted on The outer surface 423 ' of the molded base 42 ', be maintained at the optical lens 10 ' by the lens barrel 90 ' The photosensitive path of the photo-sensitive cell 20 '.
Attached drawing 50 shows another variant embodiment of the camera module 100, and the lens barrel 90 ' can be integrally Extend the top surface of the molded base 42 ', i.e. the lens barrel 90 ' and the molded base 42 ' by moulding technology integrally It is formed.
Attached drawing 51 shows another variant embodiment of the camera module 100, and the optical lens 10 ' can also The top surface of the molded base 42 ' is directly mounted on, so that the optical lens 10 ' is maintained at the photo-sensitive cell 20 ' photosensitive path.
Attached drawing 52 shows another variant embodiment of the camera module 100, is pasted by the optical lens 10 ' After top surface loaded on the molded base 42 ', the lens barrel 90 ' can also be mounted on to the top of the molded base 42 ' Surface, so that the lens barrel 90 ' is looped around the surrounding of the optical lens 10 ', so as to by avoiding the optical lens 10 ' naked The mode of dew protects the optical lens 10 '.Nevertheless, it will be appreciated by those skilled in the art that, the lens barrel 90 ' The top surface of the molded base 42 ' can also integrally be extended.
Attached drawing 53 shows another variant embodiment of the camera module 100, before moulding technology, the filter Optical element 50 ' can also be directly mounted on the substrate front side 311 ' of the substrate 31 ', in the institute of the substrate 31 ' The corresponding position of substrate channel 310 ' is stated, the shape between the substrate 31 ', the photo-sensitive cell 20 ' and the filter element 50 ' Into a sealing space 8000 ', wherein the photosensitive region 22 ' of the photo-sensitive cell 20 ' and the one of the non-photo-sensing region 23 ' Part is maintained at the sealing space 8000 ', mode in this way, in subsequent moulding technology, can avoid described Fluid media (medium) 400 ' pollutes the photosensitive region 22 ' of the photo-sensitive cell 20 ', to improve the product of the camera module 100 Yield.Preferably, the molded base 42 ' embeds the outer edge of the filter element 50 ', so that the molded base 42 ', institute Filter element 50 ', the substrate 31 ', the photo-sensitive cell 20 ' and the back side molded section 41 ' is stated integrally to combine.
Further, the buffer part 1 ' of the 100 further frame shape of camera module, wherein the buffer part 1 ' is set Between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ', the buffer part 1 ' is used for the filter Optical element 50 ' is mounted on the substrate front side 311 ' of the substrate 31 ' and for isolating the filter element 50 ' and described The substrate front side 311 ' of substrate 31 '.Preferably, the buffer part 1 ' has elasticity.It is noted that the buffer part 1 ' generation type is unrestricted in the camera module 100 of the utility model, such as can be first in the substrate 31 ' The substrate front side 311 ' applies such as, but not limited to substances such as resin or glue, then again by the filter element 50 ' weight The substrate front side 311 ' of the substrate 31 ' is arranged at foldedly, is applied over the substrate front side 311 ' of the substrate 31 ' Resin or glue can be formed and be maintained between the filter element 50 ' and the substrate front side 311 ' of substrate 31 ' The buffer part 1 '.It will be appreciated by those skilled in the art that the buffer part is first formed on the filter element 50 ' 1 ', the filter element 50 ' is then mounted on to the substrate front side 311 ' of the substrate 31 ' again, so that the buffer part 1 ' is maintained between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ' and is also possible that.
Attached drawing 54 shows another variant embodiment of the camera module 100, and the buffer part 1 ' can also weigh At least a portion region of the substrate front side 311 ' of the substrate 31 ' is covered foldedly, in the molded base 42 ' formation Afterwards, the buffer part 1 ' can be maintained at the molded base 42 ' and the substrate 31 ' the substrate front side 311 ' it Between.For example, in one embodiment of the utility model, can the substances such as resin or glue be first applied over the substrate At least a portion region of the 31 ' substrate front side 311 ', to form the substrate front side for being overlapped in the substrate 31 ' The buffer part 1 ' in 311 ' at least a portion region, then mounts the filter element 50 ' again, so that the buffer part 1 ' A part be maintained between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ', wherein described slow Portion 1 ' is rushed to prevent to generate gap between the filter element 50 ' and the substrate front side 311 ' of the substrate 31 ', thus The sealing space 8000 ' is formed between the substrate 31 ', the photo-sensitive cell 20 ' and the filter element 50 '.Overlappingly The substrate can be protected in moulding technology by being formed at the buffer part 1 ' of the substrate front side 311 ' of the substrate 31 ' 31 ' the substrate front side 311 ', and in subsequent baking process, the buffer part 1 ' can also be by generating deformation Mode compensates the difference of the amplitude of deformation of the molded base 42 ' and the amplitude of deformation of the substrate 31 ', to ensure the camera shooting The reliability of module 100.
Attached drawing 55 shows another variant embodiment of the camera module 100, and the supporting member 70 ' can also The outer edge of the filter element 50 ' is formed in, so as to which after the completion of moulding technology, the molded base 42 ' embeds the branch Hold at least a portion of element 70 '.
Attached drawing 56 shows another variant embodiment of the camera module 100, and the camera module 100 is further Including a transparent protection element 9000 ', before moulding technology, the protection element 9000 ' is overlappingly arranged at described The substrate front side 311 ' of substrate 31 ', it is exposed to avoid the substrate front side 311 ' of the substrate 31 '.For example, described After substrate 31 ' is provided or is made into, overlappingly set in the substrate front side 311 ' of the substrate 31 ' transparent described Protection element 9000 ', such as the protection element 9000 ' can be but not limited to hyaline membrane.
When the photo-sensitive cell 20 ' is mounted on the substrate back 312 ' of the substrate 31 ', in the substrate 31 ' the corresponding position of the substrate channel 310 ', in the substrate 31 ', the photo-sensitive cell 20 ' and the protection element The sealing space 8000 ', and the photosensitive region 20 of the photo-sensitive cell 20 ' and the non-sense are formed before 9000 ' The part in light region 23 ' is located at the sealing space 8000 ', in subsequent moulding technology, to avoid the photo-sensitive cell 20 ' the photosensitive region 22 ' is contaminated.
In addition, the protection element 9000 ' can also protect the substrate front side 311 ' of the substrate 31 ' to be scraped off, So as to ensure the good electrical of the substrate 31 ', to be conducive to improve the product yield of the camera module 100.
Attached drawing 57 shows the vertical view state of an embodiment of the optical lens 10 ' of the camera module 100, The plan view shape of wherein described optical lens 10 ' is rounded.Specifically, the optical lens 10 ' has one first camera lens side Face 11 ', one second camera lens side 12 ', a three-lens side 13 ', one the 4th camera lens side 14 ', one the 5th camera lens side 15 ', one the 6th camera lens side 16 ', one the 7th camera lens side 17 ' and one the 8th camera lens side 18 ', wherein being shown in attached drawing 57 The optical lens 10 ' this example in, the first camera lens side 11 ', the second camera lens side 12 ', described Three-lens side 13 ', the 4th camera lens side 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', institute It is cambered surface respectively to state the 7th camera lens side 17 ' and the 8th camera lens side 18 ', and end to end respectively, and forms circle Shape.Also, the optical lens 10 ' is respectively in the first camera lens side 11 ' and the second camera lens side 12 ', described the Three-lens side 13 ' and the 4th camera lens side 14 ', the 5th camera lens side 15 ' and the 6th camera lens side 16 ' with And the 7th camera lens side 17 ' and 18 ' the corresponding position of the 8th camera lens side form a cambered surface side 102 '.Namely It says, there are four the cambered surface sides 102 ' for the tool of optical lens 10 '.
Attached drawing 58 shows the vertical view of a variant embodiment of the optical lens 10 ' of the camera module 100 State, wherein the first camera lens side 11 ', the second camera lens side 12 ', the three-lens side 13 ', the described 4th Camera lens side 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', the 7th camera lens side 17 ' and institute It is cambered surface respectively to state the 8th camera lens side 18 ', and end to end respectively, and forms ellipse.Also, the optical lens 10 ' respectively in the first camera lens side 11 ' and the second camera lens side 12 ', the three-lens side 13 ' and described the Four camera lens sides 14 ', the 5th camera lens side 15 ' and the 6th camera lens side 16 ' and the 7th camera lens side 17 ' The cambered surface side 102 ' is formed with 18 ' the corresponding position of the 8th camera lens side.That is, the optical lens 10 ' has There are four the cambered surface sides 102 '.
Attached drawing 59 shows the vertical view of a variant embodiment of the optical lens 10 ' of the camera module 100 State, wherein the first camera lens side 11 ' and the second camera lens side 12 ' they are plane respectively, and first camera lens The plane where plane and the second camera lens side 12 ' where side 11 ' is approximately the same plane, so that the optical lens 10 ' form a planar side 101 ' in the first camera lens side 11 ' and 12 ' the corresponding position of the second camera lens side, wherein The three-lens side 13 ', the 4th camera lens side 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', the 7th camera lens side 17 ' and the 8th camera lens side 18 ' are cambered surface respectively, so that the optical lens 10 ' In the three-lens side 13 ' and 14 ' the corresponding position of the 4th camera lens side, the 5th camera lens side 15 ' and institute It states 16 ' corresponding position of the 6th camera lens side and the 7th camera lens side 17 ' and the 8th camera lens side 18 ' is corresponding Position is respectively formed the cambered surface side 102 '.That is, there are one the planar side 101 ' and three for the tool of optical lens 10 ' A cambered surface side 102 '.
Attached drawing 60 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein the first camera lens side 11 ' and the second camera lens side 12 ' they are plane respectively, and first mirror The plane where plane and the second camera lens side 12 ' where rostral face 11 ' is approximately the same plane, so that the optical frames First 10 ' form the planar side 101 ' in the first camera lens side 11 ' and 12 ' the corresponding position of the second camera lens side, Wherein described 5th camera lens side 15 ' and the 6th camera lens side 16 ' are plane respectively, and the 5th camera lens side The plane where plane and the 6th camera lens side 16 ' where 15 ' is approximately the same plane, so that the optical lens 10 ' The planar side 101 ' is formed in the 5th camera lens side 15 ' and 16 ' the corresponding position of the 6th camera lens side, wherein institute State three-lens side 13 ' and the 4th camera lens side 14 ' and the 7th camera lens side 17 ' and the 8th camera lens side Face 18 ' is cambered surface respectively, so that the optical lens 10 ' is in the three-lens side 13 ' and the 4th camera lens side 14 ' Corresponding position forms the cambered surface side 102 ' and is corresponded in the 7th camera lens side 17 ' and the 8th camera lens side 18 ' Position form the cambered surface side 102 '.That is, there are two the planar side 101 ' and two for the tool of optical lens 10 ' The cambered surface side 102 ', and two planar sides 101 ' of the optical lens 10 ' are symmetrically, two cambered surface sides 102 ' symmetrically.
Attached drawing 61 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein the first camera lens side 11 ', the second camera lens side 12 ', the three-lens side 13 ' and described 4th camera lens side 14 ' is plane respectively, and the plane where the first camera lens side 11 ' and the second camera lens side Plane where 12 ' is approximately the same plane, plane and the 4th camera lens side 14 ' where the three-lens side 13 ' The plane at place is approximately the same plane, so that the optical lens 10 ' is in the first camera lens side 11 ' and second camera lens It side 12 ' and is respectively formed in the three-lens side 13 ' and 14 ' the corresponding position of the 4th camera lens side described flat Surface side 101 ', and the second camera lens side 12 ' and the three-lens side 13 ' are mutually perpendicular to, wherein the 5th mirror Rostral face 15 ' and the 6th camera lens side 16 ' and the 7th camera lens side 17 ' and the 8th camera lens side 18 ' point It is not cambered surface, so that the optical lens 10 ' is corresponding in the three-lens side 13 ' and the 4th camera lens side 14 ' Position forms the cambered surface side 102 ' and in the 7th camera lens side 17 ' and 18 ' the corresponding position of the 8th camera lens side Form the cambered surface side 102 '.That is, there are two the planar side 101 ' and two arcs for the tool of optical lens 10 ' Surface side 102 ', and two planar sides 101 ' are adjacent and two cambered surface sides 102 ' are adjacent.
Attached drawing 62 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein the first camera lens side 11 ', the second camera lens side 12 ', the three-lens side 13 ', described Four camera lens sides 14 ', the 5th camera lens side 15 ' and the 6th camera lens side 16 ' they are plane respectively, and described The plane where plane and the second camera lens side 12 ' where one camera lens side 11 ' is approximately the same plane, the 3rd mirror The plane where plane and the 4th camera lens side 14 ' where rostral face 13 ' is approximately the same plane, the 5th camera lens side The plane where plane and the 6th camera lens side 16 ' where face 15 ' is approximately the same plane, wherein the second camera lens side Face 12 ' perpendicular to the three-lens side 13 ', the 4th camera lens side 14 ' perpendicular to the 5th camera lens side 15 ', So as to which the optical lens 10 ' is in the first camera lens side 11 ' and 12 ' the corresponding position of the second camera lens side, described Three-lens side 13 ' and 14 ' the corresponding position of the 4th camera lens side and the 5th camera lens side 15 ' and described the Six camera lens sides, 16 ' corresponding position is respectively formed the planar side 101 ', wherein the 7th camera lens side 17 ' and described the Eight camera lens sides 18 ' are cambered surface respectively, so as to which the optical lens 10 ' is in the 7th camera lens side 17 ' and the 8th mirror 18 ' corresponding position of rostral face forms the cambered surface side 102 '.That is, there are three described flat for the tool of optical lens 10 ' Surface side 101 ' and a cambered surface side 102 '.
Attached drawing 63 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein the first camera lens side 11 ', the second camera lens side 12 ', the three-lens side 13 ', described Four camera lens sides 14 ', the 5th camera lens side 15 ', the 6th camera lens side 16 ', the 7th camera lens side 17 ' and institute It is plane respectively to state the 8th camera lens side 18 ', and the plane where the first camera lens side 11 ' and the second camera lens side Plane where face 12 ' is approximately the same plane, plane and the 4th camera lens side where the three-lens side 13 ' Plane where 14 ' is approximately the same plane, plane and the 6th camera lens side 16 ' where the 5th camera lens side 15 ' The plane at place is approximately the same plane, where the plane and the 8th camera lens side 18 ' where the 7th camera lens side 17 ' Plane be approximately the same plane, wherein the second camera lens side 12 ' is perpendicular to the three-lens side 13 ', the described 4th Camera lens side 14 ' is perpendicular to the 5th camera lens side 15 ', and the 6th camera lens side 16 ' is perpendicular to the 7th camera lens side Face 17 ', the 8th camera lens side 18 ' is perpendicular to the first camera lens side 11 ', so as to which the optical lens 10 ' is described First camera lens side 11 ' and 12 ' the corresponding position of the second camera lens side, the three-lens side 13 ' and the described 4th 14 ' corresponding position of camera lens side, the 5th camera lens side 15 ' and the 6th camera lens side 16 ' and the 7th mirror Rostral face 17 ' and 18 ' the corresponding position of the 8th camera lens side are respectively formed the planar side 101 '.It is that is, described There are four the planar sides 101 ' for the tool of optical lens 10 '.
Attached drawing 64 shows bowing for another variant embodiment of the optical lens 10 ' of the camera module 100 Depending on state, wherein the first camera lens side 11 ', the three-lens side 13 ', the 5th camera lens side 15 ' and described 7th camera lens side 17 ' is plane respectively, so that the optical lens 10 ' is respectively in the first camera lens side 11 ', institute It states three-lens side 13 ', the 5th camera lens side 15 ' and 17 ' corresponding position of the 7th camera lens side and forms institute Planar side 101 ' is stated, and the first camera lens side 11 ' and the 5th camera lens side 15 ' are symmetrically, the 3rd mirror Rostral face 13 ' and the 7th camera lens side 17 ' symmetrically, wherein the second camera lens side 12 ', the 4th camera lens side Face 14 ', the 6th camera lens side 16 ' and the 8th camera lens side 18 ' are cambered surface respectively, so that the optical frames First 10 ' respectively in the second camera lens side 12 ', the 4th camera lens side 14 ', the 6th camera lens side 16 ' and institute It states 18 ' corresponding position of the 8th camera lens side and forms the cambered surface side 102 ', and the second camera lens side 12 ' and described the Symmetrically, the 4th camera lens side 14 ' and the 8th camera lens side 18 ' are symmetrical for six camera lens sides 16 '.Namely It says, the tool of optical lens 10 ' is there are four the planar side 101 ' and four cambered surface sides 102 ', and each plane Side 101 ' and each cambered surface side 102 ' are spaced.In other words, there are one described for tool between the adjacent planar side 101 ' Cambered surface side 102 ', there are one the planar sides 101 ' for tool between the adjacent cambered surface side 102 '.
It will be appreciated by those skilled in the art that above example is only for example, wherein the feature of different embodiments It can be mutually combined, not explicitly pointed out in the accompanying drawings with obtaining being readily conceivable that according to the content that the utility model discloses Embodiment.
It should be understood by those skilled in the art that the embodiment of foregoing description and attached the utility model shown in figure is only used as It illustrates and is not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.The work(of the utility model Energy and structural principle show and illustrate in embodiment, under without departing from the principle, the embodiment of the utility model Can there are any deformation or modification.

Claims (37)

  1. A 1. camera module, which is characterized in that including an at least optical lens, an at least back side molded section, at least one photosensitive yuan Part and at least a circuit board, and the camera module has an at least sealing space；
    Wherein described photo-sensitive cell has a photosensitive region and is looped around a non-photo-sensing region of the photosensitive region surrounding；
    Wherein described circuit board includes an at least substrate, and the substrate has a substrate front side, a substrate back and at least one Substrate channel, the substrate front side and the substrate back correspond, and the substrate channel is extended to from the substrate front side The substrate back, the camera module form the sealing space in the corresponding position of the substrate channel of the substrate, The part in the non-photo-sensing region of wherein described photo-sensitive cell is mounted on the substrate back of the substrate, and institute It states photo-sensitive cell be connected to the substrate with being switched on, the photosensitive region of the photo-sensitive cell and the non-photo-sensing region Another part corresponds to the substrate channel of the substrate and positioned at the sealing space, wherein the optical lens is kept In the photosensitive path of the photo-sensitive cell, wherein the back side molded section is integrally incorporated into the substrate back of the substrate At least a portion region.
  2. 2. camera module according to claim 1 further comprises an at least filter element, wherein the filter element quilt It is arranged at the substrate front side of the substrate, and the shape between the filter element, the substrate and the photo-sensitive cell Into the sealing space.
  3. 3. camera module according to claim 2 further comprises a buffer part, wherein at least one of the buffer part Divide and be maintained between the filter element and the substrate front side of the substrate.
  4. 4. camera module according to claim 1 further comprises a transparent protection element, wherein the protection element The substrate front side of the substrate is overlappingly arranged at, and in the protection element, the substrate and the photosensitive member The sealing space is formed between part.
  5. 5. camera module according to claim 2 further comprises an at least molded base, wherein the molded base has There is an at least optical window, wherein the molded base is integrally incorporated at least a portion area of the substrate front side of the substrate Domain, the molded base is looped around the surrounding of the photosensitive region of the photo-sensitive cell, so that the photo-sensitive cell is described The part in photosensitive region and the non-photo-sensing region corresponds to the optical window.
  6. 6. camera module according to claim 3 further comprises an at least molded base, wherein the molded base has There is an at least optical window, wherein the molded base is integrally incorporated at least a portion area of the substrate front side of the substrate Domain, the molded base is looped around the surrounding of the photosensitive region of the photo-sensitive cell, so that the photo-sensitive cell is described The part in photosensitive region and the non-photo-sensing region corresponds to the optical window.
  7. 7. camera module according to claim 4 further comprises an at least molded base, wherein the molded base has There is an at least optical window, wherein the molded base is integrally incorporated at least a portion area of the substrate front side of the substrate Domain, the molded base is looped around the surrounding of the photosensitive region of the photo-sensitive cell, so that the photo-sensitive cell is described The part in photosensitive region and the non-photo-sensing region corresponds to the optical window.
  8. 8. camera module according to claim 2 further comprises an at least molded base, wherein the molded base has There is an at least optical window, wherein the molded base is integrally incorporated at least a portion area of the substrate front side of the substrate Domain, and the molded base embeds the outer edge of the filter element, and the molded base is looped around the photo-sensitive cell The surrounding of the photosensitive region, so that the part in the photosensitive region of the photo-sensitive cell and the non-photo-sensing region is corresponding In the optical window.
  9. 9. camera module according to claim 3 further comprises an at least molded base, wherein the molded base has There is an at least optical window, wherein the molded base is integrally incorporated at least a portion area of the substrate front side of the substrate Domain, and the molded base embeds the outer edge of the filter element, and the molded base is looped around the photo-sensitive cell The surrounding of the photosensitive region, so that the part in the photosensitive region of the photo-sensitive cell and the non-photo-sensing region is corresponding In the optical window.
  10. 10. camera module according to claim 9 a, wherein part for the buffer part is maintained at the molded base Between the substrate front side of the substrate.
  11. 11. camera module according to claim 8 further comprises the supporting member of an at least frame shape, wherein the branch Hold the outside that element is arranged at the outer edge of the filter element or the supporting member is formed at the filter element Edge, the molded base embed at least a portion of the supporting member.
  12. 12. camera module according to claim 9 further comprises the supporting member of an at least frame shape, wherein the branch Hold the outside that element is arranged at the outer edge of the filter element or the supporting member is formed at the filter element Edge, the molded base embed at least a portion of the supporting member.
  13. 13. camera module according to claim 10 further comprises the supporting member of an at least frame shape, wherein the branch Hold the outside that element is arranged at the outer edge of the filter element or the supporting member is formed at the filter element Edge, the molded base embed at least a portion of the supporting member.
  14. 14. according to any camera module in claim 1 to 11, wherein the photo-sensitive cell has a chip back, The back side molded section embeds at least a portion region of the chip back of the photo-sensitive cell.
  15. 15. according to any camera module in claim 1 to 11, further comprise a protective element, wherein the sense Optical element has a chip back, and the protective element is overlappingly arranged at the chip back of the photo-sensitive cell, Described in protective element there is an exposed region and be centered around an embedding region of the exposed region surrounding, back side molding Portion embeds the embedding region of the protective element.
  16. 16. according to any camera module in claim 5 to 13, wherein the circuit board further comprises at least one electricity Sub- component, the electronic component protrude from the substrate front side of the substrate.
  17. 17. camera module according to claim 14, wherein the circuit board further comprises an at least electronic component, The electronic component protrudes from the substrate front side of the substrate.
  18. 18. camera module according to claim 15, wherein the circuit board further comprises an at least electronic component, The electronic component protrudes from the substrate front side of the substrate.
  19. 19. according to any camera module in claim 1 to 13, wherein the circuit board further comprises at least one electricity Sub- component, the electronic component protrude from the substrate back of the substrate.
  20. 20. camera module according to claim 14, wherein the circuit board further comprises an at least electronic component, The electronic component protrudes from the substrate back of the substrate.
  21. 21. camera module according to claim 15, wherein the circuit board further comprises an at least electronic component, The electronic component protrudes from the substrate back of the substrate.
  22. 22. according to any camera module in claim 1 to 13, wherein the circuit board further comprises at least one electricity Sub- component, at least one electronic component protrude from the substrate front side of the substrate, electronics member in addition Device protrudes from the substrate front side of the substrate.
  23. 23. camera module according to claim 14, wherein the circuit board further comprises an at least electronic component, At least one electronic component protrudes from the substrate front side of the substrate, and the electronic component in addition protrudes from The substrate front side of the substrate.
  24. 24. camera module according to claim 15, wherein the circuit board further comprises an at least electronic component, At least one electronic component protrudes from the substrate front side of the substrate, and the electronic component in addition protrudes from The substrate front side of the substrate.
  25. 25. according to any camera module in claim 5 to 13, wherein the circuit board further comprises at least one company Fishplate bar, the connecting plate has a module connecting side, wherein the module connecting side of the connecting plate is mounted on the base The substrate front side of plate.
  26. 26. camera module according to claim 14, wherein the circuit board further comprises an at least connecting plate, it is described Connecting plate has a module connecting side, wherein the module connecting side of the connecting plate is mounted on the base of the substrate Plate front.
  27. 27. camera module according to claim 15, wherein the circuit board further comprises an at least connecting plate, it is described Connecting plate has a module connecting side, wherein the module connecting side of the connecting plate is mounted on the base of the substrate Plate front.
  28. 28. according to any camera module in claim 1 to 13, wherein the circuit board further comprises at least one company Fishplate bar, the connecting plate has a module connecting side, wherein the module connecting side of the connecting plate is mounted on the base The substrate back of plate.
  29. 29. camera module according to claim 14, wherein the circuit board further comprises an at least connecting plate, it is described Connecting plate has a module connecting side, wherein the module connecting side of the connecting plate is mounted on the base of the substrate Back.
  30. 30. camera module according to claim 15, wherein the circuit board further comprises an at least connecting plate, it is described Connecting plate has a module connecting side, wherein the module connecting side of the connecting plate is mounted on the base of the substrate Back.
  31. 31. camera module according to claim 16, wherein molded base embedding protrudes from the described of the substrate At least a portion of at least one electronic component of substrate front side.
  32. 32. camera module according to claim 19, wherein back side molded section embedding protrudes from the institute of the substrate State at least a portion of at least one electronic component of substrate back.
  33. 33. camera module according to claim 25, wherein the molded base embeds the module of the connecting plate Connecting side.
  34. 34. camera module according to claim 28, wherein the back side molded section embeds the mould of the connecting plate Group connecting side.
  35. 35. according to any camera module in claim 1 to 13, wherein the shape of the back side molded section is in " mouth " word Shape；Or the shape of the back side molded section is in " Π " font；Or the shape of the back side molded section is in " Γ " font；Or The shape of the back side molded section is in " I " font；Or the shape of the back side molded section is in " II " font；Or the back side The shape of molded section is in " III " font；Or the shape of the back side molded section is in " X " font；Or the back side molded section Shape it is L-shaped；Or the shape of the back side molded section is in " C " font；Or the shape of the back side molded section is in " day " font；Or the shape of the back side molded section is in " well " font；Or the shape of the back side molded section is in sphere of movements for the elephants Shape；Or the shape of the back side molded section is in latticed；Or the shape of the back side molded section is square；It is or described The shape of back side molded section is rectangle；Or the shape of the back side molded section is trapezoidal；Or the back side molded section Shape is rounded；Or the shape of the back side molded section is oval.
  36. 36. according to any camera module in claim 1 to 13, further comprise an at least driver, wherein described Optical lens is driveably arranged at the driver, and the driver is mounted on the top surface of the molded base；Or Person further comprises an at least lens barrel, wherein the optical lens is assembled in the lens barrel, the lens barrel is mounted on described The top surface of molded base；Or further comprise an at least lens barrel, wherein the optical lens is assembled in the lens barrel, institute It states lens barrel and integrally extends the molded base；Or further comprise a lens barrel, wherein the lens barrel and the optical frames Head is mounted on the top surface of the molded base respectively, and the lens barrel is looped around the surrounding of the optical lens；Or Further comprise an at least lens barrel, wherein the lens barrel integrally extends the molded base, the optical lens is mounted In the top surface of the molded base, and the lens barrel is looped around the surrounding of the optical lens；Or the optical lens It is mounted on the surrounding of the molded base.
  37. A 37. electronic equipment, which is characterized in that including：
    One apparatus body；With
    According to any at least one camera module in claims 1 to 36, wherein the camera module is set In the apparatus body.
CN201720557166.2U 2017-05-18 2017-05-18 Camera module and the electronic equipment with camera module Active CN207382411U (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CN201720557166.2U CN207382411U (en) 2017-05-18 2017-05-18 Camera module and the electronic equipment with camera module
EP22169710.5A EP4072120A3 (en) 2017-05-18 2018-05-18 Camera module and molded circuit board assembly thereof, array camera module and electronic device
EP18801348.6A EP3627814B1 (en) 2017-05-18 2018-05-18 Camera module and molded circuit board assembly thereof, array camera module and electronic device
PCT/CN2018/087488 WO2018210337A1 (en) 2017-05-18 2018-05-18 Camera module and molded circuit board assembly thereof, array camera module and electronic device
US16/613,571 US11233079B2 (en) 2017-05-18 2018-05-18 Camera module and molded circuit board assembly thereof, array camera module and electronic device
CN201880032867.1A CN110637456A (en) 2017-05-18 2018-05-18 Camera module, molded circuit board assembly thereof, array camera module and electronic equipment
US17/550,733 US11721709B2 (en) 2017-05-18 2021-12-14 Circuit board assembly with photosensitive element mounted to back side of circuit board
US18/207,357 US12119361B2 (en) 2017-05-18 2023-06-08 Circuit board assembly with photosensitive element mounted to back side of circuit board

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018210337A1 (en) * 2017-05-18 2018-11-22 宁波舜宇光电信息有限公司 Camera module and molded circuit board assembly thereof, array camera module and electronic device
CN111866321A (en) * 2019-04-30 2020-10-30 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light
CN111866326A (en) * 2019-04-30 2020-10-30 宁波舜宇光电信息有限公司 Camera module, electronic component module thereof, photosensitive assembly, preparation method and preparation method of electronic component module
CN111866324A (en) * 2019-04-30 2020-10-30 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof, electronic equipment and preparation method
CN111988496A (en) * 2019-05-24 2020-11-24 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof
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US11233079B2 (en) 2017-05-18 2022-01-25 Ningbo Sunny Opotech Co., Ltd. Camera module and molded circuit board assembly thereof, array camera module and electronic device
US12119361B2 (en) 2017-05-18 2024-10-15 Ningbo Sunny Opotech Co., Ltd. Circuit board assembly with photosensitive element mounted to back side of circuit board
WO2018210337A1 (en) * 2017-05-18 2018-11-22 宁波舜宇光电信息有限公司 Camera module and molded circuit board assembly thereof, array camera module and electronic device
US11721709B2 (en) 2017-05-18 2023-08-08 Ningbo Sunny Opotech Co., Ltd. Circuit board assembly with photosensitive element mounted to back side of circuit board
US11871100B2 (en) 2019-04-02 2024-01-09 Ningbo Sunny Opotech Co., Ltd. Camera module and blocking-type photosensitive assembly, manufacturing method thereof, and electronic device
TWI728764B (en) * 2019-04-02 2021-05-21 大陸商寧波舜宇光電信息有限公司 Photographic module, resistive photosensitive component, manufacturing method thereof and electronic equipment
CN111866324A (en) * 2019-04-30 2020-10-30 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof, electronic equipment and preparation method
CN111866321B (en) * 2019-04-30 2022-03-29 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light
CN111866326B (en) * 2019-04-30 2022-03-29 宁波舜宇光电信息有限公司 Camera module, electronic component module thereof, photosensitive assembly, preparation method and preparation method of electronic component module
CN111866324B (en) * 2019-04-30 2022-03-29 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof, electronic equipment and preparation method
CN111866326A (en) * 2019-04-30 2020-10-30 宁波舜宇光电信息有限公司 Camera module, electronic component module thereof, photosensitive assembly, preparation method and preparation method of electronic component module
CN111866321A (en) * 2019-04-30 2020-10-30 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof, electronic equipment and method for reducing stray light
CN111988496A (en) * 2019-05-24 2020-11-24 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof

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