CN205959984U - Module of making a video recording and photosensitive assembly and electronic equipment are moulded to mould thereof - Google Patents

Module of making a video recording and photosensitive assembly and electronic equipment are moulded to mould thereof Download PDF

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Publication number
CN205959984U
CN205959984U CN201620875381.2U CN201620875381U CN205959984U CN 205959984 U CN205959984 U CN 205959984U CN 201620875381 U CN201620875381 U CN 201620875381U CN 205959984 U CN205959984 U CN 205959984U
Authority
CN
China
Prior art keywords
wiring board
photo
sensitive cell
main body
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620875381.2U
Other languages
Chinese (zh)
Inventor
王明珠
郭楠
陈振宇
田中武彦
赵波杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201620875381.2U priority Critical patent/CN205959984U/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to JP2018550699A priority patent/JP7025345B2/en
Priority to PCT/CN2016/103247 priority patent/WO2017166798A1/en
Priority to KR1020187031125A priority patent/KR102152516B1/en
Priority to US16/088,435 priority patent/US11289521B2/en
Priority to EP23176877.1A priority patent/EP4231653A3/en
Priority to EP16896568.9A priority patent/EP3468165B1/en
Publication of CN205959984U publication Critical patent/CN205959984U/en
Application granted granted Critical
Priority to TW108117229A priority patent/TWI706213B/en
Priority to TW106110048A priority patent/TWI661258B/en
Priority to TW108117228A priority patent/TWI706212B/en
Priority to TW106204228U priority patent/TWM555960U/en
Priority to KR1020217022035A priority patent/KR20210091363A/en
Priority to KR1020187034256A priority patent/KR102147896B1/en
Priority to EP17788772.6A priority patent/EP3481046A4/en
Priority to KR1020207019834A priority patent/KR102281383B1/en
Priority to PCT/CN2017/082000 priority patent/WO2017186120A2/en
Priority to JP2018556877A priority patent/JP6865232B2/en
Priority to PCT/CN2017/097425 priority patent/WO2018028718A1/en
Priority to JP2021060338A priority patent/JP7344924B2/en
Priority to US17/678,347 priority patent/US11824071B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The utility model provides a module of making a video recording and photosensitive assembly and electronic equipment are moulded to mould thereof, wherein the mould of module of making a video recording moulds that photosensitive assembly includes an at least photosensitive element, an at least circuit board, at least a set of lead wire, the at least supporting member that is formed by first medium and mould base, wherein every group by the at least mould that the second medium formed the both ends of lead wire are connected in every respectively the chip connecting piece of photosensitive element and every the circuit board connection spare of circuit board, every supporting member respectively the cladding every the non - photosensitive region of photosensitive element partly at least and every the fringe region of circuit board partly at least, every the mould is moulded the base and is included respectively that a mould moulds the main part and have an at least optical window, the main part cladding is moulded to the mould the circuit board the fringe region with supporting member's is partly at least, every the photosensitive region of photosensitive element is corresponding to every the main part is moulded to the mould the optical window.

Description

Camera module and its molding photosensory assembly and electronic equipment
Technical field
This utility model is related to optical imaging field, particularly to a camera module and its molding photosensory assembly and electronics Equipment.
Background technology
In recent years, the camera module for obtaining image becomes increasingly popular to be applied to such as personal electric product, vapour Car field, medical domain etc., such as camera module have become the portable electric appts such as smart mobile phone, panel computer One of standard fitting.The camera module being applied to portable electric appts can not only obtain image, but also can help Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts and User requires more and more higher, the overall dimensions to camera module and the imaging of camera module for the image quality of camera module Ability is proposed harsher requirement.That is, the development trend of portable electric appts requires camera module subtracting Improve further on the basis of few size and strengthening imaging capability.
It is well known that the raising of the imaging capability of camera module is built upon thering is more great achievement for camera module configuration On the basis of the long-pending photo-sensitive cell of image planes and the passive electronic devices and components such as more driving resistance, electric capacity, just because of camera module needs To be configured have the more photo-sensitive cell of big imaging area and more passive electronic devices and components it is desirable to camera module can only be by changing Enter the size that packaging technology can reduce camera module.Now commonly used camera module packaging technology is COB (Chip On Board) packaging technology, i.e. the wiring board of camera module, photo-sensitive cell, support etc. are made into respectively, then successively will be by Dynamic electronic devices and components, photo-sensitive cell and support encapsulate in the circuit board, in order to ensure the image quality of camera module, need every Fill glue between two parts, such as fill glue between support and wiring board to encapsulate in the circuit board support, and And the leveling of support and wiring board is realized by glue, therefore, COB packaging technology leads to the size of camera module cannot be effective Ground reduces, and the packaging efficiency of camera module is than relatively low.
In order to solve this problem, moulding technology is introduced into camera module field, and moulding technology allows camera module in quilt Make support integrally formed in the circuit board during making, by such mode, shooting can not only be efficiently reduced The size of module, but also the assembly error of camera module can be reduced, to improve the image quality of camera module.Although such as This, moulding technology is introduced directly into camera module field and remains a lot of defects.
First, the photo-sensitive cell of camera module is mounted on wiring board and electrically connects photo-sensitive cell and circuit by lead Plate is it is generally the case that lead two ends are respectively welded in photo-sensitive cell and wiring board, and is limited to routing technique and lead itself Attribute, the two ends of lead after being welded in photo-sensitive cell and line plate, its upper table presented radian and protrude from photo-sensitive cell Face, in the moulding process of camera module, the stitching surface of the mold of mould can be contacted with the ledge of lead and lead Cause lead pressurized occur deformation situation, once and lead occur deformation, after the mold of mould is removed, lead It is difficult to recover to original state.Secondly, the molding space being added into mould when the moulding material for forming support is simultaneously And when solidifying to form support in molding space, the lead of deformation is covered by the inside of support and keeps shape after deformation State, and the ability that the lead deforming transmits the signal of telecommunication between photo-sensitive cell and wiring board can significantly reduce, so that right The imaging capability of camera module and imaging efficiency cause to compare large effect.What is more important, when lead is subject to mold The extruding of stitching surface and when being deformed, the deformation direction of lead and deformation extent are uncontrollable, and therefore, adjacent lead exists It is possible that contacting with each other and leading to short circuit after deformation, and then the product fraction defective of camera module is led to increase.In addition, in sense After optical element is mounted on wiring board, gap, in moulding process, flow-like can be produced between photo-sensitive cell and wiring board Moulding material can enter the gap being formed between photo-sensitive cell and wiring board, so that leading to photo-sensitive cell and wiring board Attaching relation is changed, once and the attaching relation of photo-sensitive cell and wiring board is changed, necessarily cause inclining of photo-sensitive cell Tiltedly, so that affecting the image quality of camera module.
Utility model content
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in molding photosensory assembly one supporting member is provided, when carrying out moulding technology, described supporting member is it can be avoided that a molding The lead that one mold of mould applies pressure to for connecting photo-sensitive cell and wiring board, thus preventing described lead pressurized and becoming Shape.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its In when carrying out moulding technology, the mold of described mould makes the stitching surface of described mold with mould matched moulds once When contacting with the top surface of described supporting member, described supporting member can support described mold upwards, to avoid on described Mould directly applies pressure to described lead, thus preventing described lead pressurized and deforming.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its In when carrying out moulding technology, the described mold of described mould makes described mold with described lower mould matched moulds When stitching surface is contacted with the top surface of described supporting member, described supporting member can support described mold upwards, with institute State and reserve safe distance between lead and the stitching surface of described mold, thus avoiding the stitching surface directly contact of described mold Described lead.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member formed by having resilient material, described supporting is applied pressure to the described mold in described mould During the top surface of element, described supporting member can absorb the stitching surface of described mold in the top table contacting described supporting member The impulsive force producing during face, thus avoid damaging described sense when the described mold of described mould and described lower mould matched moulds Optical element, described wiring board, described lead and described electronic devices and components.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member formed by having resilient material, described supporting is applied pressure to the described mold in described mould During element, the top surface of described supporting member can be avoided by way of producing deformation described supporting member top surface and Gap is produced, thus avoiding in a molded base molding of described module photosensory assembly between the stitching surface of described mold The phenomenon of " overlap " in one smooth window position of described mold base, and then advantageously ensures that described camera module when packed Yield and ensure described camera module image quality.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member formed by the material with flexibility, described supporting is applied pressure to the described mold in described mould During element, the top surface of described supporting member can be avoided by way of being deformed described supporting member top surface and Gap is produced, thus avoiding for the moulding material forming described molded base by described between the stitching surface of described mold The contact position of the stitching surface of the top surface of supporting member and described mold enters and pollutes or damage described photo-sensitive cell Photosensitive region.That is, when carrying out moulding technology, described supporting member makes the photosensitive region of described photo-sensitive cell be in Enclosed environment.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member formed by hard material, apply pressure to described with the stitching surface in the described mold of described mould Hold element top surface when, described supporting member will not be deformed, thus it is described to protect to prevent described lead from producing deformation Lead good electrical.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member be set along the non-photo-sensing region of described photo-sensitive cell, with when carrying out moulding technology, described supporting Element can stop described moulding material by the contact position in the non-photo-sensing region of described supporting member and described photo-sensitive cell Enter the photosensitive region of described photo-sensitive cell and pollute or damage the photosensitive region of described photo-sensitive cell.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member the link position that coat described lead and described photo-sensitive cell and described lead and described circuit are set The link position of plate, so that when carrying out moulding technology, described supporting member isolates each link position and described moulding material, from And make each link position more reliable.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member be located at be formed in the described mold of described mould and a molding space of described lower mould, with When described moulding material is added into described molding space and solidify to form described molded base, described supporting member can stop The described moulding material of flow-like impacts described lead.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member pre-fix described wiring board and described photo-sensitive cell, empty to be added into described molding in described moulding material Between and when solidifying to form described molded base, described supporting member can keep described photo-sensitive cell and described wiring board not to move Position.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member at least a portion non-photo-sensing region that coat described photo-sensitive cell is set, to carry out moulding technology When, it is to avoid described moulding material is contacted with the photosensitive region of described photo-sensitive cell, to prevent the photosensitive region of described photo-sensitive cell Contaminated or damaged.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member at least a portion of simultaneously coating described photo-sensitive cell and described wiring board are set, with by described Hold the gap that element closing is formed between described photo-sensitive cell and described wiring board, thus when carrying out moulding technology, it is to avoid The described moulding material of flow-like enters between described photo-sensitive cell and described wiring board.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member cladding described lead is set, with when carrying out moulding technology, described supporting member makes described lead protect Hold in default optimum state.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member cladding described lead is set, with when subsequently using described camera module, it can be avoided that veiling glare exists The inside of described camera module produces and affects the image quality of described camera module.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member there is viscosity, before described molded base molding, described supporting member can adhere to mount electronic unit device The pollutant such as the welding powder that part produces when described wiring board, to prevent the photosensitive region of photo-sensitive cell described in these contaminants And dirty bad point occurs.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in the two ends of lead be connected to the chip contacts of described photo-sensitive cell respectively and the wiring board of described wiring board connects Part, the top surface of described supporting member is higher than the described chip contacts of described photo-sensitive cell, thus by described shaping mould When tool carries out moulding technology, the described chip contacts of described photo-sensitive cell will not be damaged.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member coat described photo-sensitive cell described chip contacts, with when carrying out moulding technology, it is to avoid described one-tenth The described chip contacts of photo-sensitive cell described in type material, thus protect the described chip contacts of described photo-sensitive cell.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and electronic equipment, its Described in supporting member be arranged on described photo-sensitive cell described chip contacts outside, when carrying out moulding technology, to keep away Exempt from the described chip contacts that described moulding material contacts described photo-sensitive cell, thus protecting the described chip of described photo-sensitive cell Connector.
According to one side of the present utility model, this utility model provides the molding photosensory assembly of a camera module, and it includes：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, described in wherein every group, the two ends of lead are connected to the chip of each described photo-sensitive cell respectively Connector and the wiring board connector of each described wiring board；
At least one supporting member being formed by first medium, wherein each described supporting member are respectively coated by each described sense At least a portion in non-photo-sensing region of optical element and at least a portion of the marginal area of each described wiring board；And
At least one molded base being formed by second medium, wherein each described molded base include a molded body respectively With there is at least one optical window, described molded body coats the described marginal area of described wiring board and described supporting member at least A part, the photosensitive region of each described photo-sensitive cell corresponds to the described optical window of each described molded body.
According to an embodiment of the present utility model, described supporting member includes the supporting main body of a shaped as frame and has at least One through hole, at least a portion in described non-photo-sensing region of the described supporting main body described photo-sensitive cell of cladding and described wiring board At least a portion of described marginal area, the described photosensitive region of described photo-sensitive cell corresponds to described through hole, wherein said institute State at least a portion of molded body cladding described supporting main body.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least the one of the chip lateral part of at least a portion of described wiring board medial part of described wiring board and described photo-sensitive cell Part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding The described chip lateral part of at least a portion of described wiring board medial part of described wiring board and described photo-sensitive cell and institute State at least a portion of chip connecting portion.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding The described chip lateral part of at least a portion of described wiring board medial part of described wiring board and described photo-sensitive cell, described Chip connecting portion and at least a portion of described chip medial part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least a portion of described wiring board connecting portion of described wiring board and described wiring board medial part and described photo-sensitive cell At least a portion of described chip lateral part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least a portion of described wiring board connecting portion of described wiring board and described wiring board medial part and described photo-sensitive cell Described chip lateral part and at least a portion of described chip connecting portion.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least a portion of described wiring board connecting portion of described wiring board and described wiring board medial part and described photo-sensitive cell At least a portion of described chip lateral part, described chip connecting portion and described chip medial part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding A part for described wiring board lateral part for described wiring board, described wiring board connecting portion and described wiring board medial part and institute State at least a portion of the described chip lateral part of photo-sensitive cell.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding A part for described wiring board lateral part for described wiring board, described wiring board connecting portion and described wiring board medial part and institute State the described chip lateral part of photo-sensitive cell and at least a portion of described chip connecting portion.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding A part for described wiring board lateral part for described wiring board, described wiring board connecting portion and described wiring board medial part and institute State at least a portion of the described chip exterior, described chip connecting portion and described chip medial part of photo-sensitive cell.
According to an embodiment of the present utility model, described supporting main body has a top surface, outside a medial surface and Side, described top surface inwardly or outwardly each extends over to be connected to described medial surface and described lateral surface, described medial surface shape Become described through hole, the described lateral surface of described molded body cladding described supporting main body.
According to an embodiment of the present utility model, described molded body coats the described top of described supporting main body further At least a portion on surface.
According to an embodiment of the present utility model, the height of described supporting main body is greater than described lead upwards The height of projection.
According to an embodiment of the present utility model, the height of described supporting main body is less than described lead upwardly Height.
According to an embodiment of the present utility model, described supporting main body has elasticity.
According to an embodiment of the present utility model, described supporting main body has viscosity.
According to other side of the present utility model, this utility model further provides for a shooting carrying molding photosensory assembly Module is it is characterised in that include：
At least one optical lens；With
At least one molding photosensory assembly, wherein each described molding photosensory assembly include respectively：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, described in wherein every group, the two ends of lead are connected to the chip of each described photo-sensitive cell respectively Connector and the wiring board connector of each described wiring board；
At least one supporting member being formed by first medium, wherein each described supporting member are respectively coated by each described sense At least a portion in non-photo-sensing region of optical element and at least a portion of the marginal area of each described wiring board；And
At least one molded base being formed by second medium, wherein each described molded base include a molded body respectively With there is at least one optical window, described molded body coats the described marginal area of described wiring board and described supporting member at least A part, the photosensitive region of each described photo-sensitive cell corresponds to the described optical window of each described molded body, wherein each institute State the photosensitive path that optical lens are arranged at each described photo-sensitive cell respectively, with by described optical window for described optical lens There is provided a passage of light with described photo-sensitive cell.
According to an embodiment of the present utility model, described camera module further includes at least one driver, wherein often Individual described optical lens are assembled in each described driver respectively, and each described driver is assembled in each described mould respectively The top surface of group main body.
According to an embodiment of the present utility model, described camera module further includes at least one filter element, wherein Each described filter element is assembled in the top surface of each described molded body respectively, so that described filter element is positioned at described Between optical lens and described photo-sensitive cell.
According to an embodiment of the present utility model, the top surface of described molded body has outside an inner surface and one Surface, described filter element is assembled in the described inner surface of described molded body, and described driver is assembled in described mould Mould the described outer surface of main body.
According to an embodiment of the present utility model, the plane that the described inner surface of described molded body is located is less than institute State the plane at outer surface place, to form a groove of described molded body, wherein said filter element is located at described groove.
According to an embodiment of the present utility model, described supporting member includes the supporting main body of a shaped as frame and has at least One through hole, at least a portion in described non-photo-sensing region of the described supporting main body described photo-sensitive cell of cladding and described wiring board At least a portion of described marginal area, the described photosensitive region of described photo-sensitive cell corresponds to described through hole, wherein said institute State at least a portion of molded body cladding described supporting main body.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least the one of the chip lateral part of at least a portion of described wiring board medial part of described wiring board and described photo-sensitive cell Part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding The described chip lateral part of at least a portion of described wiring board medial part of described wiring board and described photo-sensitive cell and institute State at least a portion of chip connecting portion.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding The described chip lateral part of at least a portion of described wiring board medial part of described wiring board and described photo-sensitive cell, described Chip connecting portion and at least a portion of described chip medial part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least a portion of described wiring board connecting portion of described wiring board and described wiring board medial part and described photo-sensitive cell At least a portion of described chip lateral part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least a portion of described wiring board connecting portion of described wiring board and described wiring board medial part and described photo-sensitive cell Described chip lateral part and at least a portion of described chip connecting portion.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding At least a portion of described wiring board connecting portion of described wiring board and described wiring board medial part and described photo-sensitive cell At least a portion of described chip lateral part, described chip connecting portion and described chip medial part.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding A part for described wiring board lateral part for described wiring board, described wiring board connecting portion and described wiring board medial part and institute State at least a portion of the described chip lateral part of photo-sensitive cell.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding A part for described wiring board lateral part for described wiring board, described wiring board connecting portion and described wiring board medial part and institute State the described chip lateral part of photo-sensitive cell and at least a portion of described chip connecting portion.
According to an embodiment of the present utility model, the described marginal area of described wiring board is included inside a wiring board Portion, a wiring board connecting portion and a wiring board lateral part, the described wiring board connector of wherein said wiring board is arranged at Described wiring board connecting portion, described wiring board medial part and described wiring board lateral part are located at described wiring board connecting portion respectively Inner side and outer side, the described non-photo-sensing region of wherein said photo-sensitive cell include a chip medial part, a chip connecting portion and One chip lateral part, the described chip contacts of wherein said photo-sensitive cell are arranged at described chip connecting portion, described chip Medial part and described chip lateral part are respectively positioned at the inner side and outer side of described chip connecting portion, wherein said supporting main body cladding A part for described wiring board lateral part for described wiring board, described wiring board connecting portion and described wiring board medial part and institute State at least a portion of the described chip exterior, described chip connecting portion and described chip medial part of photo-sensitive cell.
According to an embodiment of the present utility model, described supporting main body has a top surface, outside a medial surface and Side, described top surface inwardly or outwardly each extends over to be connected to described medial surface and described lateral surface, described medial surface shape Become described through hole, the described lateral surface of described molded body cladding described supporting main body.
According to an embodiment of the present utility model, described molded body coats the described top of described supporting main body further At least a portion on surface.
According to other side of the present utility model, this utility model further provides for an electronic equipment, and it includes：
One electronic equipment body；With
At least one camera module, wherein each described camera module are arranged at described electronic equipment body respectively, with In obtaining image, wherein each described camera module further includes respectively：
At least one optical lens；With
At least one molding photosensory assembly, wherein each described molding photosensory assembly include respectively：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, described in wherein every group, the two ends of lead are connected to the chip of each described photo-sensitive cell respectively Connector and the wiring board connector of each described wiring board；
At least one supporting member being formed by first medium, wherein each described supporting member are respectively coated by each described sense At least a portion in non-photo-sensing region of optical element and at least a portion of the marginal area of each described wiring board；And
At least one molded base being formed by second medium, wherein each described molded base include a molded body respectively With there is at least one optical window, described molded body coats the described marginal area of described wiring board and described supporting member at least A part, the photosensitive region of each described photo-sensitive cell corresponds to the described optical window of each described molded body, wherein each institute State the photosensitive path that optical lens are arranged at each described photo-sensitive cell respectively, with by described optical window for described optical lens There is provided a passage of light with described photo-sensitive cell.
Other side under this invention, the present invention further provides a molding photosensory assembly, it includes：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, the two ends of lead described in wherein every group are connected to the chip of each described photo-sensitive cell even Fitting and the wiring board connector of each described wiring board；
At least one supporting member, wherein each described supporting member are set at least of lead described in every group of cladding respectively Part；And
At least one molded base, wherein each described molded base include a molded body respectively and have at least one light Window, wherein said molded body at least coats the marginal area of described wiring board and at least the one of described supporting member in molding Part, the photosensitive region of each described photo-sensitive cell corresponds respectively to each described optical window of each described molded base.
According to an embodiment of the present utility model, described supporting member include a supporting main body and have at least one lead to Hole, described supporting main body coats at least a portion of described lead, and the described photosensitive region of described photo-sensitive cell is corresponding to described Through hole, at least a portion of described molded body cladding described supporting main body.
According to an embodiment of the present utility model, described supporting main body coats the non-photo-sensing region of described photo-sensitive cell At least partially.
According to an embodiment of the present utility model, described supporting main body coats of the marginal area of described wiring board Point.
According to an embodiment of the present utility model, described supporting main body coats of the marginal area of described wiring board Divide at least a portion with the non-photo-sensing region of described photo-sensitive cell.
According to an embodiment of the present utility model, described supporting main body has a top surface, outside a medial surface and Side, described top surface inwardly or outwardly each extends over to be connected to described medial surface and described lateral surface, described medial surface shape Become described through hole, the described lateral surface of described molded body cladding described supporting main body.
According to an embodiment of the present utility model, described molded body coats the described top of described supporting main body further At least a portion on surface.
According to an embodiment of the present utility model, the height of described supporting main body is greater than described lead upwards The height of projection.
Other side under this invention, the present invention further provides one carries the camera module of molding photosensory assembly, its Including：
At least one optical lens；With
At least one molding photosensory assembly, wherein each described molding photosensory assembly further include respectively：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, the two ends of lead described in wherein every group are connected to the chip of each described photo-sensitive cell even Fitting and the wiring board connector of each described wiring board；
At least one supporting member, wherein each described supporting member are set at least of lead described in every group of cladding respectively Part；And
At least one molded base, wherein each described molded base include a molded body respectively and have at least one light Window, wherein said molded body at least coats the marginal area of described wiring board and at least the one of described supporting member in molding Part, the photosensitive region of each described photo-sensitive cell corresponds respectively to each described optical window of each described molded base, wherein Each described optical lens is arranged at the photosensitive path of each described sensitive chip respectively, with by described optical window for described light Learn camera lens and described sensitive chip provides a passage of light.
According to an embodiment of the present utility model, described camera module further includes at least one driver, wherein often Individual described optical lens are arranged at each described driver respectively, and each described driver is assembled in described molding master respectively The top surface of body.
According to an embodiment of the present utility model, described camera module further includes at least one filter element, each Described filter element is assembled in the top surface of described molded body respectively, so that described filter element is located at described sensitive chip And described optical lens between.
According to an embodiment of the present utility model, the top surface of described molded body has outside an inner surface and one Surface, described filter element is assembled in the described inner surface of described molded body, and described driver is assembled in described mould Mould the described outer surface of main body.
According to an embodiment of the present utility model, the plane that described inner surface is located is less than described outer surface and is located Plane, to form a groove of described molded body, described filter element is housed inside described groove.
Brief description
Fig. 1 is the schematic diagram of one of the manufacturing step of a camera module according to a preferred embodiment of the present utility model, its Described in the photo-sensitive cell of camera module be mounted on wiring board, and the non-photo-sensing region of described photo-sensitive cell and described circuit Plate passes through one group of lead and connects.
Fig. 2A and Fig. 2 B is the two of the manufacturing step of the described camera module according to above-mentioned preferred embodiment of the present utility model Schematic diagram, a supporting member of wherein said camera module is arranged at the non-photo-sensing region of described photo-sensitive cell.
Fig. 3 is the signal of the three of the manufacturing step of the described camera module according to above-mentioned preferred embodiment of the present utility model Figure, wherein said wiring board, described photo-sensitive cell and described supporting member are placed on a mold and of a molding tool Between lower mould, and described mold applies pressure to described supporting member.
Fig. 4 is the signal of the four of the manufacturing step of the described camera module according to above-mentioned preferred embodiment of the present utility model Figure, the moulding material of the molded base being wherein used for forming described camera module is added into and is formed at described mold and described A molding space between lower mould.
Fig. 5 is the signal of the five of the manufacturing step of the described camera module according to above-mentioned preferred embodiment of the present utility model Figure, forms described molded base after wherein said mold material cures.
Fig. 6 is the signal of the six of the manufacturing step of the described camera module according to above-mentioned preferred embodiment of the present utility model Figure, a filter element of wherein said camera module is assembled into described molded base.
Fig. 7 is the signal of the seven of the manufacturing step of the described camera module according to above-mentioned preferred embodiment of the present utility model Figure, optical lens of wherein said camera module are assembled in a driver, and described driver is assembled in described molding base Seat, to be obtained described camera module.
Fig. 8 is showing of a variant embodiment of the described camera module according to above-mentioned preferred embodiment of the present utility model It is intended to.
Fig. 9 A is the of a molding photosensory assembly of the described camera module according to above-mentioned preferred embodiment of the present utility model The schematic diagram of one variant embodiment.
Fig. 9 B is the described molding photosensory assembly of the described camera module according to above-mentioned preferred embodiment of the present utility model The schematic diagram of second variant embodiment.
Fig. 9 C is the described molding photosensory assembly of the described camera module according to above-mentioned preferred embodiment of the present utility model The schematic diagram of the 3rd variant embodiment.
Figure 10 A is the described molding photosensory assembly of the described camera module according to above-mentioned preferred embodiment of the present utility model The schematic diagram of the 4th variant embodiment.
Figure 10 B is the described molding photosensory assembly of the described camera module according to above-mentioned preferred embodiment of the present utility model The schematic diagram of the 5th variant embodiment.
Figure 11 is the described module photosensory assembly of the described camera module according to above-mentioned preferred embodiment of the present utility model The schematic diagram of the 6th variant embodiment.
Figure 12 is the signal of a variant embodiment of the described camera module of above-mentioned preferred embodiment under this invention Figure.
Figure 13 is showing of another variant embodiment of described camera module of above-mentioned preferred embodiment under this invention It is intended to.
Figure 14 is the block diagram representation with above-mentioned camera module one electronic equipment of the present utility model.
Specific embodiment
Hereinafter describe for disclosing this utility model so that those skilled in the art are capable of this utility model.Hereinafter retouch Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Retouch following The ultimate principle of the present utility model defining in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that of the present utility model disclose in, term " longitudinal ", " horizontal ", " on ", The orientation of instruction such as D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position are closed System is based on orientation shown in the drawings or position relationship, and it is for only for ease of description this utility model and simplifies description, and not Be instruction or the hint device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore go up State term it is not intended that to restriction of the present utility model.
It is understood that term " " is interpreted as " at least one " or " one or more ", that is, in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of this element can be multiple, and term " " is no It is understood that to be the restriction to quantity.
With reference to Fig. 1 to Fig. 7 of Figure of description of the present utility model, according to the shooting of a preferred embodiment of the present utility model Module is elucidated with, and wherein said camera module includes at least one optical lens 10 and at least one molding photosensory assembly 20.Each institute State molding photosensory assembly 20 and further include that a photo-sensitive cell 21, a wiring board 22, a molded base 23 and one group draw respectively Line 24, the two ends of each described lead 24 each extend over non-photo-sensing region to be connected to each described photo-sensitive cell 21 and every Individual described wiring board 22, each described molded base 23 respectively at least integrally formed in each described wiring board 22 so that institute State molded base 23 and described wiring board 22 forms integral structure, each described optical lens 10 is arranged at each institute respectively State the photosensitive path of the described photo-sensitive cell 21 of molding photosensory assembly 20.The light being reflected by the object is from optical lens each described The inside of the 10 described camera modules of entrance, with subsequently being received by photo-sensitive cell each described 21 and carry out photoelectric conversion, thus Obtain the image being associated with object.
It is noted that described photo-sensitive cell 21 has one group of chip contacts 211, described wiring board 22 has one group Wiring board connector 221, the wherein two ends of each described lead 24 can be connected to each of described photo-sensitive cell 21 respectively Each described wiring board connector 221 of described chip contacts 211 and described wiring board 22, is made by above-mentioned such mode Described photo-sensitive cell 21 and described wiring board 22 are connected.In an example of the present utility model, described photo-sensitive cell 21 Each described wiring board connector 221 of each described chip contacts 211 and described wiring board 22 can be terminal pad, i.e. Each described chip contacts 211 of described photo-sensitive cell 21 and each described wiring board connector 221 of described wiring board 22 Can be disc-shaped respectively, the two ends for making each described lead 24 be connected to described photo-sensitive cell 21 each described in Each described wiring board connector 221 of chip contacts 211 and described wiring board 22.In another example of the present utility model In, each described chip contacts 211 of described photo-sensitive cell 21 and each described wiring board connector of described wiring board 22 221 can be spherical, for example by tin cream or other welding material point described photo-sensitive cell 21 and described wiring board 22 with Form the described chip contacts 211 of described photo-sensitive cell 21 and the described wiring board connector 221 of described wiring board 22 respectively. Even so, the described wiring board connector 221 of the described chip contacts 211 of described photo-sensitive cell 21 and described wiring board 22 Shape be not intended to limit content of the present utility model and scope.
Described photo-sensitive cell 21 includes a photosensitive region 212 and a non-photo-sensing region 213, wherein said photo-sensitive cell 21 Described photosensitive region 212 and described non-photo-sensing region 213 are integrally formed, and described photosensitive region 212 is positioned at described photosensitive The middle part of element 21, described non-photo-sensing region 213 is located at the outside of described photo-sensitive cell 21, and described non-photo-sensing region 213 Around described photosensitive region 212 1 weeks.The light being reflected by the object enters in described camera module from described optical lens 10 Behind portion, can be received by the described photosensitive region 212 of described photo-sensitive cell 21 and carry out photoelectric conversion, related to object to obtain The image of connection.
It will be appreciated by those skilled in the art that, each described chip contacts 211 quilt of described photo-sensitive cell 21 It is arranged at the described non-photo-sensing region 213 of described photo-sensitive cell 21.In addition, the described non-photo-sensing region of described photo-sensitive cell 21 213 have a chip medial part 2131, a chip connecting portion 2132 and a chip lateral part 2133, inside wherein said chip Around described photosensitive region 212 1 weeks, the both sides of described chip connecting portion 2132 each extended over and connect to described core in portion 2131 Piece medial part 2131 and described chip lateral part 2132.That is, by described non-photo-sensing region 213 from described core is set The region of the position at the edge to described photosensitive region 212 for the position of piece connector 211 is defined as described chip medial part 2131, The region that described chip contacts 211 are set in described non-photo-sensing region 213 is defined as described chip connecting portion 2132, will Described non-photo-sensing region 213 from the position of described chip contacts 211 being set to the outer edge of described photo-sensitive cell 21 The region of position is defined as described chip lateral part 2132.In other words, from the point of view of the vertical view visual angle of described photo-sensitive cell 21, described Photo-sensitive cell 21 is described chip lateral part 2133, described chip connecting portion 2132, described chip medial part from outside to inside successively 2131 and described photosensitive region 212.
In addition, described wiring board 22 includes a smooth chip attachment region 222 and a marginal area 223, wherein said Marginal area 223 is formed with described chip attachment region 222, and described marginal area 223 is located at described chip patch Dress region 222 is around.Described chip attachment region 222 is used for mounting described photo-sensitive cell 21, described wiring board connector 221 are arranged at described marginal area 223.The described marginal area 223 of described wiring board 22 has a wiring board medial part 2231st, a wiring board connecting portion 2232 and a wiring board lateral part 2233, wherein said wiring board medial part 2231 is around institute State chip attachment region 222 1 weeks, the both sides of described wiring board connecting portion 2232 each extend over and connect to described wiring board Sidepiece 2231 and described wiring board lateral part 2233.That is, by described marginal area 223 from described wiring board is set The region of the position at the edge to described chip attachment region 222 for the position of connector 221 is defined as described wiring board medial part 2231, the region that described wiring board connector 221 is set of described marginal area 223 is defined as described wiring board connecting portion 2232, by described marginal area 223 from the position of described wiring board connector 221 being set to described marginal area 223 The region of the position of outer edge is defined as described wiring board lateral part 2233.In other words, from the vertical view visual angle of described wiring board 22 From the point of view of, described wiring board 22 is described wiring board lateral part 2233, described wiring board connecting portion 2232, described from inside to outside successively Wiring board medial part 2231 and described chip attachment region 222A.The type of described lead 24 is in described shooting of the present utility model Unrestricted in module, such as, in a specific example, described lead 24 may be implemented as gold thread, i.e. by beating gold thread Mode described photo-sensitive cell 21 and described wiring board 22 can be linked together, thus light is being believed by described photo-sensitive cell 21 After number being converted into the signal of telecommunication, the described signal of telecommunication can be further transmitted to described wiring board 22 by described lead 24.Ability The technical staff in domain is it is understood that in other examples of described camera module, described lead 24 can also be implemented as Silver wire, copper cash etc. are any to be capable of the material that the described signal of telecommunication transmits between described photo-sensitive cell 21 and described wiring board 22 Make.
In addition, in one example, described camera module may be implemented as one and focuses camera module, wherein said takes the photograph As module makes described optical lens 10 be maintained at described photosensitive unit by being assembled in a microscope base of described molded base 23 The photosensitive path of part 21.
In another example, described camera module may be implemented as a zoom camera module, wherein said shooting Module adjusts the focal length of described camera module by the distance changing described optical lens 10 and described photo-sensitive cell 21.Specifically Ground says, in this example shown in Fig. 7, described camera module further includes at least one driver 30, wherein described in each Optical lens 10 are arranged in correspondence with each described driver 30 respectively, and each described driver 30 is assembled in each respectively Described molded base 23, and each described driver 30 is electrically connected to each described wiring board 22 respectively, with described line Road plate 22 transmits electric energy and control signal to described driver 30, and described driver 30 can drive described optical lens 10 Photosensitive path along described photo-sensitive cell 21 moves back and forth, thus adjusting the focal length of described camera module.That is, it is described Optical lens 10 are driveably arranged at described driver 30.
It is noted that the type of described driver 30 is unrestricted in described camera module of the present utility model, For example in a specific example, described driver 30 may be implemented as that voice coil motor etc. is any can to drive described light Learn camera lens 10 and produce, along the photosensitive path of described photo-sensitive cell 21, the driver shifting, wherein said driver 30 can receive Electric energy and control signal are with running order.
Further, with reference to shown in Fig. 7, described camera module further includes at least one filter element 40, wherein each Described filter element 40 is assembled in each described molded base 23 respectively, and each described filter element 40 is located at often respectively The photosensitive path of individual described photo-sensitive cell 21.The light being reflected by the object enters described camera module from described optical lens 10 Inside, and can be received by described photo-sensitive cell 21 and carry out photoelectric conversion after filtering by described filter element 40.Also It is to say, described filter element 40 can filter being reflected by the object of inside entering described camera module from described optical lens 10 Light in veiling glare, such as infrared part, by such mode, the image quality of described camera module can be changed.
It will be appreciated by those skilled in the art that, in the different examples of described camera module, described filter element 40 can be implemented as different types, and for example described filter element 40 can be implemented as cutoff filter, full impregnated light Spectrum filter piece and the combination of other optical filters or multiple optical filter, for example described filter element 40 can be implemented as red Outer edge filter and the combination of full impregnated spectral filter, i.e. described cutoff filter and described full impregnated spectral filter energy Enough it is switched on the photosensitive path to be optionally situated at described photo-sensitive cell 21, such as in the ring that the light such as daytime are more sufficient When under border using described camera module, described cutoff filter can be switched to the photosensitive road of described photo-sensitive cell 21 Footpath, to filter the infrared ray in the light being reflected by the object entering described camera module by described cutoff filter, When in the environment of the dark such as night using described camera module, described full impregnated spectral filter can be switched to described The photosensitive path of photo-sensitive cell 21, saturating to allow access into the infrared part in the light being reflected by the object of described camera module Cross.
With reference to shown in Fig. 7, the described molding photosensory assembly 20 of described camera module further includes a supporting member 25, its In before described molded base 23 is formed, described supporting member 25 is arranged at the described non-photo-sensing of described photo-sensitive cell 21 Region 213, so that, after the molding of described molded base 23, described molded base 23 coats described wiring board 22, described photosensitive unit The described non-photo-sensing region 213 of part 21 and a part for described supporting member 25, to form described molding photosensory assembly 20, wherein Described supporting member 25 can effectively improve the product yield of described camera module, and improves the imaging product of described camera module Matter, in following description, it will the feature and advantage of described supporting member 25 is further illustrated and discloses.
Further, described supporting member 25 has a top surface 2501, a medial surface 2502 and a lateral surface 2503, The both sides of wherein said top surface 2501 are connected to described medial surface 2502 and described lateral surface 2503.It is worth mentioning It is that the side towards described photo-sensitive cell 21 of described supporting member 25 is defined as the described medial surface of described supporting member 25 2502, the side towards described wiring board 22 of described supporting member 25 is defined as the described lateral surface of described supporting member 25 2503.
Shown in refer to the attached drawing 7, the described molding photosensory assembly 20 of described camera module further includes multiple electronics units device Part 26, wherein each described electronic devices and components 26 can pass through such as SMT (Surface Mount Technology) technique quilt It is mounted on the described marginal area 223 of described wiring board 22.Preferably, each described electronic devices and components 26 is mounted on described side The described wiring board lateral part 2233 in edge region 223.Described photo-sensitive cell 21 and each described electronic devices and components 26 can be pasted Be loaded on the same side or the opposition side of described wiring board 22, such as in a specific example, described photo-sensitive cell 21 and each Described electronic devices and components 26 are mounted on the same side of described wiring board 22, and described photo-sensitive cell 21 is mounted on described line The described chip attachment region 222 of road plate 22, each described electronic devices and components 26 is mounted on the described side of described wiring board 22 Edge region 223.Described molded base 23 integrally formed after described wiring board 22, described molded base 23 coats each institute State electronic devices and components 26, to isolate adjacent described electronic devices and components 26 and isolation described electronics unit by described molded base 23 Device 26 and described photo-sensitive cell 21, thus, in described camera module of the present utility model, even adjacent described electronics unit Device 26 close together when, described molded base 23 can also avoid adjacent described electronic devices and components 26 to contact with each other or dry Disturb, and described molded base 23 coats the mode of described electronic devices and components 26 and can also avoid resulting from described electronic devices and components The described photosensitive region 212 of photo-sensitive cell 21 described in the contaminants on 26 surface, and then reduce the body of described camera module Image quality that is long-pending and improving described camera module.That is, described camera module of the present utility model passes through described molding Pedestal 23 coats the mode of described electronic devices and components 26, enables the described wiring board 22 of small area to be mounted more described electricity Sub- components and parts 26.It is noted that the type of described electronic devices and components 26 includes but is not limited to resistance, electric capacity, driving element Deng.
In addition, it will be appreciated by those skilled in the art that, although in Fig. 1 to Fig. 7 taking monomer camera module as a example The manufacturing step of the manufacturing step to described camera module and described molding photosensory assembly 20 discloses, this shown in Fig. 8 In individual example, described camera module can also be implemented as twin-lens camera module or array camera module, this utility model Unrestricted in this regard.
The manufacturing step of described camera module and described molding photosensory assembly is described in example shown in Fig. 1 to Fig. 7 20 manufacturing step.
With reference to shown in Fig. 1, described photo-sensitive cell 21 is mounted on the described chip attachment region 222 of described wiring board 22, And each described chip contacts 211 in the described non-photo-sensing region 213 of described photo-sensitive cell 21 and described wiring board 22 Each described wiring board connector 221 of described marginal area 223 passes through lead 24 described in a group and is connected.In addition, described in each Electronic devices and components 26 are mounted on the described wiring board lateral part 2233 of the described marginal area 223 of described wiring board 22.Also It is to say, the two ends of lead 24 described in a group are connected to described photo-sensitive cell 21 and described wiring board 22 respectively, wherein each institute State the upper surface that lead 24 protrudes from described photo-sensitive cell 21 with all presenting arcuation.It is understood that being limited to using described Lead 24 connects routing technique and described lead 24 characteristic of itself of described photo-sensitive cell 21 and described wiring board 22, described draws The two ends of line 24 are respectively in each described chip contacts in the described non-photo-sensing region 213 being connected to described photo-sensitive cell 21 211 and described wiring board 22 each described wiring board connector 221 of described perimeter 223 after, described lead 24 need be in Protrude from the upper surface of described photo-sensitive cell 21 upper arcuation.In addition, making the radian of the bending of each described lead 24 be maintained at Round and smooth state, advantageously ensures that described lead 24 transmits described telecommunications between described photo-sensitive cell 21 and described wiring board 22 Number ability.Wherein, each described lead 24 is arranged between described photo-sensitive cell 21 and described wiring board 22, for example each Described lead 24 can be equidistant.It will be appreciated by those skilled in the art that, manufactured in described camera module During and during described camera module is used, make each described lead 24 be maintained at original state be conducive to protect Demonstrate,prove the ability that described lead 24 transmits the described signal of telecommunication between described photo-sensitive cell 21 and described wiring board 22, so that it is guaranteed that institute State the image quality of camera module.
It will be appreciated by those skilled in the art that, although being mounted with a described photo-sensitive cell 21 in fig. 1 The manufacturing step of described camera module of the present utility model and described camera module is illustrated as a example a described wiring board 22 Described molding photosensory assembly 20 manufacturing step, in another one example, multiple described photo-sensitive cells 21 can also be pasted It is loaded on the diverse location of a described wiring board 22, to make twin-lens camera module or array camera module follow-up, In another one example, multiple described wiring boards 22 can also be stitched together to form a wiring board layout, then will be every Individual described photo-sensitive cell 21 is mounted on the described wiring board 22 of the correspondence position of described wiring board layout respectively, with subsequently by institute State wiring board layout to separate.This utility model is unrestricted in this regard.
With reference to shown in Fig. 2A and Fig. 2 B, described supporting member 25 is arranged on the described non-photo-sensing area of described photo-sensitive cell 21 Domain 213, is become with forming a molding photosensory assembly half by described photo-sensitive cell 21, described wiring board 22 and described supporting member 25 Product, wherein said supporting member 25 is set in the described chip in described non-photo-sensing region 213 coating described photo-sensitive cell 21 Sidepiece 2131, described chip connecting portion 2232 and described chip lateral part 2233.That is.Described supporting member 25 can wrap Cover a part for each described lead 24, to mold photosensory assembly 20 with described during the described camera module of follow-up making During, described supporting member 25 can coat described lead 24, to improve the image quality of described camera module.This area Technical staff it is understood that in this embodiment of described camera module of the present utility model, described supporting member The described chip contacts 211 of the 25 described photo-sensitive cells 21 of cladding.Further, described supporting member 25 includes propping up of a shaped as frame Hold main body 251 and there is a through hole 252, wherein said supporting main body 251 is arranged at the described non-sense of described photo-sensitive cell 21 Light region 213, so that the described photosensitive region 212 of described photo-sensitive cell 21 corresponds to the described through hole of described supporting member 25 252, thus when carrying out moulding technology, described supporting main body 251 can protect the described photosensitive region of described photo-sensitive cell 21 212.Described molded base 23 coats described in described lateral surface 2503 and at least a portion of described supporting main body 251 after shaping Determine surface 2501.It is noted that the described medial surface 2502 of described supporting member 25 is used for forming described supporting member 25 Described through hole 252.
Preferably, described supporting main body 251 coats the described chip medial part 2131 of described photo-sensitive cell 21, described chip Connecting portion 2131 and described chip lateral part 2133 are that is to say, that described supporting main body 251 can coat described chip contacts 211, thus described supporting main body 251 it can be avoided that the link position of described lead 24 and described chip contacts 211 be used for Form the moulding material contact of described molded base 23, to avoid described lead 24 to come off from described chip contacts 211.Can To be understood by, when described supporting main body 251 coats the link position of described lead 24 and described chip contacts 211, institute State supporting main body 251 and can isolate the link position of described lead 24 and described chip contacts 211 and described moulding material, from And when carrying out moulding technology, it is to avoid described moulding material cause described lead 24 for connecting described chip contacts 211 Leading Edge Deformation or described lead 24 come off from described chip contacts 211.In one embodiment, described supporting main body 251 can form by glue is arranged on the described non-photo-sensing region 213 of described photo-sensitive cell 21 and after glue curing, So that described supporting main body 251 there is elasticity, wherein described supporting main body 251 formed after, described supporting main body 251 described Medial surface 2502 forms described through hole 252, and the described photosensitive region 212 of described photo-sensitive cell 21 corresponds to described through hole 252.Separately Outward, viscosity can also be had by the described supporting main body 251 that glue is formed, in the pollution such as subsequent adhesion dust Thing, thus preventing the described photosensitive region 212 of photo-sensitive cell 21 described in these contaminants and making described photo-sensitive cell 21 Dirty bad point in described photosensitive region 212, to further ensure that the image quality of described camera module.For example, described supporting master Body 251 is arranged between described photosensitive region 212 and the described electronic devices and components 26 of described photo-sensitive cell 21, thus in attachment The pollutant such as the welding powder that described electronic devices and components 26 produce when described wiring board 22 can be adhered to by described supporting main body 251, from And prevent the described photosensitive region 212 of photo-sensitive cell 21 described in the contaminants such as these welding powders.
Preferably, described supporting main body 251 can be coated in the institute of described photo-sensitive cell 21 by the glue in deadlocked state State non-photo-sensing region 213 and formed, to avoid glue being applied to described in described photo-sensitive cell 21 after glue curing Situation flowing behind non-photo-sensing region 213 and polluting the described photosensitive region 212 of described photo-sensitive cell 21 occurs.Change speech It, glue had good plasticity before solidifying to form described supporting main body 251, to avoid glue to be applied to described sense The described non-photo-sensing region 213 of optical element 21 and solidification during be deformed.It will be appreciated by those skilled in the art that , can be made by way of the glue in deadlocked state is coated in the described non-photo-sensing region 213 of described photo-sensitive cell 21 The described supporting main body 251 that glue is formed coats described lead 24, and glue is being coated in the institute of described photo-sensitive cell 21 Avoid during stating non-photo-sensing region 213 described lead 24 being caused damage.
Shown in refer to the attached drawing 3, when carrying out moulding technology, described moulding material is made in solidification by a molding tool 100 Form at least integrally formed described molded base 23 in described wiring board 22 afterwards, by such mode, institute can be reduced State the size of camera module and the assembly error reducing described camera module, so that the structure of described camera module is compacter With the image quality improving described camera module.
Specifically, described mould 100 includes a mold 101 and once mould 102, wherein said mold At least one of 101 and described lower mould 102 mould can be moved, so that described mold 101 and described lower mould 102 Die closing operation can be carried out, and be formed at least one molding space 103 between described mold 101 and described lower mould 102, Wherein said molded base 23 is added into described molding space 103 and is formed after hardening by described moulding material.For example exist In one embodiment, described lower mould 102 is usually fixed, and described mold 101 can do with respect under described along guide pillar The movement of mould 102, with the matched moulds when described mold 101 is moved towards described lower mould 102, thus in described mold Form described molding space 103 between 101 and described lower mould 102, and in described mold 102 away from described lower mould 102 Withdrawing pattern when mobile.Or in another example, described mold 101 is fixed, described lower mould 102 can do along guide pillar With respect to the movement of described mold 101, with the matched moulds when described lower mould 102 is moved towards described mold 101, thus Form described molding space 103 between described lower mould 102 and described mold 101, and in described lower mould 102 away from institute State withdrawing pattern when mold 101 moves.
Pass through lead 24 described in a group in described photo-sensitive cell 21 and described wiring board 22 to be connected and in described supporting master Body 251 is formed at the described non-photo-sensing region 213 of described photo-sensitive cell 21 and forms institute to coat after the part of described lead 24 State molding photosensory assembly semi-finished product, described molding photosensory assembly semi-finished product are positioned over the described lower mould of described mould 100 Tool 102, operates the described mold 101 of described mould 100 and/or described lower mould 101, so that described mold 101 With described lower mould 102 matched moulds, thus forming described molding space between described mold 101 and described lower mould 102 103, and described photo-sensitive cell 21, described wiring board 22 and described supporting member 25 respectively partially described mould 100 Described molding space 103, the described top surface of the stitching surface 1011 of wherein said mold 101 and described supporting main body 251 2501 contact and support described mold 101 upwards by described supporting main body 251, to avoid described in described mold 101 Stitching surface 1011 applies pressure to described lead 24.In this specific example shown in for example in such as accompanying drawing 7 of the present utility model, institute State the non-photo-sensing region of outside, described photo-sensitive cell 21 of wiring board 22 and a part for described supporting member 25 be located at described become The described molding space 103 of pattern tool 100, thus after described molded base 23 is in described molding space 103 molding, described mould Mould pedestal 23 and coat the non-photo-sensing region of outside, described photo-sensitive cell 21 of described wiring board 22 and the one of described supporting member 25 Part.
Therefore, it will be appreciated by those skilled in the art that, the described molding space 103 of described mould 100 can To be the space of a ring-type, to form the institute of ring-type after described moulding material is added into described molding space 103 and solidification State molded base 23.
It is noted that described supporting main body 251 has elasticity, thus being carried out matched moulds in described mould 100 During operation, the described stitching surface 1011 of the described mold 101 of described mould 100 is contacting described supporting main body 251 The impulsive force producing in a flash of described top surface 2501 is absorbed by described supporting main body 251 and stops this impulsive force from passing further It is delivered to described photo-sensitive cell 21, thus avoiding described photo-sensitive cell 21 to be damaged or avoiding described photo-sensitive cell 21 because of stress And produce the displacement with respect to described photo-sensitive cell 22.It will be appreciated by those skilled in the art that, by described supporting master Body 251 absorbs this impulsive force and stops this impulsive force from being further transferred to the mode of described photo-sensitive cell 21 additionally it is possible to guarantee institute State the flatness that photo-sensitive cell 21 is mounted on during described wiring board 22 to be not affected, so that it is guaranteed that the imaging of described camera module Quality.It is noted that the scope of the shore hardness of described supporting main body 251 is A50-A80, elastic modelling quantity scope is 0.1Gpa-1Gpa.
Preferably, in all this examples as shown in Figure 7 of the present utility model, the height of described supporting main body 251 can To be implemented as the height upwardly greater than described lead 24, to be carried out matched moulds in described mould 100 During operation, the described stitching surface 1011 of the described mold 101 of described mould 100 is described with described supporting main body 251 During top surface 2501 contact, described supporting main body 251 can support described mold 101 to stop described mold 101 upwards Apply pressure to described lead 24.For example in one example, the height of described supporting main body 251 is equal to described lead 24 upwardly Height, thus when the described mold 101 of described mould 100 and described lower mould 102 are carried out die closing operation, institute State supporting main body 251 and support described mold 101 upwards, although so that the described stitching surface 1011 of described mold 101 can Contact with described lead 24, but the described stitching surface 1011 of described mold 101 can not apply pressure to described lead 24.? In another example, the height of described supporting main body 251 is higher than described lead 24 height upwardly, thus in described molding When the described mold 101 of mould 100 and described lower mould 102 are carried out die closing operation, described supporting main body 251 supports upwards Described mold 101, so that the described stitching surface 1011 of described mold 101 is not contacted with described lead 24, thus avoid institute The described stitching surface 1011 stating mold 101 applies pressure to described lead 24.That is, described supporting main body 251 can be upwards Support described mold 101 with safety reserved between the described stitching surface 1011 and described lead 24 of described mold 101 away from From.
In addition, described supporting main body 251 there is elasticity, described mould 100 described mold 101 and described under Mould 102 is carried out after die closing operation, and the described stitching surface 1011 of described mold 101 pushes up with described in described supporting main body 251 Surface 2501 contact and apply pressure to described supporting main body 251 described top surface 2501, the described pressure of wherein said mold 101 The pressure that conjunction face 1011 puts on the described top surface 2501 of described supporting main body 251 can cause described supporting main body 251 to produce The slight deformation of life, for stoping described in the described stitching surface 1011 of described mold 101 and described supporting main body 251 Top surface 2501 produces gap.That is, the described mold 101 of described forming module 100 can be with described supporting main body 251 fit tightly, so that at corresponding to the photosensitive region of described photo-sensitive cell 21 of described through hole 252 of described supporting member 25 In sealed environment, to avoid when carrying out moulding technology, described moulding material enters this this sealed environment and pollutes described photosensitive The photosensitive region of element 21.
It is noted that the described moulding material of flow-like that this utility model is related to can be fluent material or solid Body granular materialss or liquid and solid particle mixing material are it is to be understood that no matter described moulding material is implemented as liquid Body material is also implemented as solid particulate materials or is implemented as liquid and solid particle mixing material, and it is being added into After stating the described molding space 103 of mould 100, all can be cured to form described molded base 23.For example in this practicality In this new specific example, the described moulding material of flow-like is implemented as the thermoplastic of such as liquid, wherein institute State moulding material and be added into described molding space 103 solidify afterwards of described mould 100 to form described molded base 23. It is noted that after the described moulding material of flow-like is added into described molding space 103 of described mould 100, The curing mode of the described moulding material of flow-like does not limit content of the present utility model and scope.
Shown in refer to the attached drawing 5, described supporting main body 251 is by the described non-photo-sensing region 213 along described photo-sensitive cell 21 Setting, after described moulding material is added into the described molding space 103 of described mould 100, described supporting main body 251 energy Described moulding material is enough stoped to enter the described photosensitive region 212 of described photo-sensitive cell 21, thus in described mold material cures To be formed after described molded base 23, described molded base 23 is made to form an optical window 231 further, with corresponding to described photosensitive unit The described photosensitive region 212 of part 21, thus follow-up, the described optical window 231 of described molded base 23 allows light to pass through with quilt The described photosensitive region 212 of described photo-sensitive cell 21 receives and carries out photoelectric conversion.That is, being added into described mould The described moulding material of 100 described molding space 103 forms a molded body 232 He of described molded base 23 after hardening Form described optical window 231 at the middle part of described molded base 23.In other words, described molded base 23 includes described molded body 232 and have described optical window 231, described optical window 231 provides a light to lead to described optical lens 10 and described photo-sensitive cell 21 Road, thus the light being reflected by the object enters behind the inside of described camera module from described optical lens 10, light passes through described The described optical window 231 of molded base 23 is received by the described photosensitive region 212 of described photo-sensitive cell 21 and carries out photoelectric conversion.
It is noted that after described molded base 23 is formed, described molded base 23 coats each described electronics Components and parts 26, thus by described molded base 23 isolate each described electronic devices and components 26 and by described molded base 23 every From described electronic devices and components 26 and described photo-sensitive cell 21, by such mode, even adjacent described electronic devices and components 26 When close together, described molded base 23 also can stop adjacent described electronic devices and components 26 from contacting, and described molded base 23 The photosensitive region of the photo-sensitive cell 21 described in contaminants of described electronic devices and components 26 generation can also be stoped, described to improve The image quality of camera module.
Shown in refer to the attached drawing 6, described filter element 40 is assembled in the top surface of described molded base 23, so that described filter Optical element 40 closes the described optical window 231 of described molded base 23, thus entering described shooting follow-up from described optical lens The light of the inside of module can be filtered by described filter element 40 to improve the image quality of described camera module further.
Further, the top surface of described molded base 23 forms an inner surface 233 and an outer surface 234, wherein In one example, the described inner surface 233 of described molded base 23 and described outer surface 234 are in approximately the same plane Interior, so that the top surface of described molded base 23 forms a smooth plane, wherein said filter element 40 is assembled in institute State the described inner surface 233 of molded base 23, described driver 30 or described microscope base are assembled in described molded base 23 Described outer surface 234, or described optical lens 10 by direct-assembling in the described outer surface of described molded base 23 234.In another example, the plane that the described inner surface 233 of described molded base 23 is located can be less than described outside The plane that surface 234 is located, so that the top surface of described molded base 23 forms a step-like surface, i.e. described molding The plane that the described inner surface 233 of pedestal 23 is located is less than the plane at described outer surface 234 place to form described molding One groove 235 of pedestal 23, is wherein assembled in the described filter element 40 of the described inner surface 233 of described molded base 23 It is housed inside in the described groove 235 of described molded base 23, described driver 30 is assembled in the institute of described molded base 23 State outer surface 234 so that the described optical lens 10 being assembled in described driver 30 be maintained at further described photosensitive The photosensitive path of element 21, such as Fig. 7, thus be obtained described camera module.
It is first variant embodiment of described camera module of the present utility model shown in refer to the attached drawing 9A, with this practicality The above-mentioned embodiment of new described camera module is different, photosensitive group of the described molding of described camera module of the present utility model Each described lead 24 of part 20 is all covered by the inside of described supporting main body 251.
Specifically, described supporting main body 251 coats at least a portion of described chip medial part 2131, described chip even Socket part 2132, described chip lateral part 2133, described wiring board medial part 2231, described wiring board connecting portion 2232 and described line At least a portion of road plate lateral part 2233, thus described supporting main body 251 not only coats the expression in the eyes part of described lead 24, and And described supporting main body 251 also coat described lead 24 and described photo-sensitive cell 21 described chip contacts 211 connection position Put and coat the link position of the described wiring board connector 221 of described lead 24 and described wiring board 22, with by described Described lead 24 is pre-fixed by supporting main body 251.Thus when subsequently carrying out moulding technology and forming described molded base 23, The described mold 101 of described mould 100 and described lower mould 102 by during matched moulds, the institute of described mold 101 State the described pressure that stitching surface 1011 is contacted with the described top surface 2501 of described supporting main body 251 and avoids described mold 101 Conjunction face 1011 directly applies pressure to described lead 24, thus preventing described lead 24 from deforming because of stress or damaging.
In addition, described lead 24 is all covered by the inside of described supporting main body 251, enable described supporting main body 251 Enough preventions are added into the described molding of the described molding space 103 being formed between described mold 101 and described lower mould 102 Material and described lead 24 directly contact, damage described lead 24 with the described moulding material preventing temperature higher.Preferably, institute State supporting main body 251 and there is good thermal insulation, to avoid described supporting main body 251 by the temperature transfer of described moulding material extremely Described lead 24.It is highly preferred that the height of described supporting main body 251 is higher than the height of the ledge of described lead 24, thus When carrying out moulding technology, described supporting main body 251 supports described mold 101 upwards with described in described mold 101 Safe distance is reserved between the ledge of stitching surface 1011 and described lead 24.
And, described supporting main body 251 coats the described chip lateral part 2133 of described photo-sensitive cell 21 and described circuit The described wiring board medial part 2231 of plate 22, to coat described photo-sensitive cell 21 and described circuit by described supporting main body 251 The mounting position of plate 22, by such mode, described supporting main body 251 can not only pre-fix described photo-sensitive cell 21 and institute State wiring board 22, so that when carrying out moulding technology, described supporting main body 251 can stop described photo-sensitive cell 21 and described circuit Each position of plate 22 produces displacement because of unbalance stress, and, described supporting main body 251 can also stop described moulding material Contact the mounting position of described photo-sensitive cell 21 and described wiring board 22, to ensure that the flatness of described photo-sensitive cell 21 improves The image quality of described camera module.
It will be appreciated by those skilled in the art that, described supporting main body 251 is by along described photo-sensitive cell 21 and institute State the mounting position setting of wiring board 22, so that described supporting main body 251 is in square frame-shaped, thus when carrying out moulding technology, institute Stating supporting main body 251 can stop described moulding material from entering the described photosensitive region 212 of described photo-sensitive cell 21, so that institute State moulding material and form the described marginal area 223 coating described wiring board 22 and the institute of described supporting main body 251 after hardening State the described molded body 232 of lateral surface 2503, and form described optical window 231. wherein institute at the middle part of described molded body 232 The described photosensitive region 212 stating photo-sensitive cell 21 corresponds to the described optical window 231 of described molded base 23, so that described optical window 231 provide a passage of light to described optical lens 10 and described photo-sensitive cell 21.He preferably, described molded body 232 exists The described marginal area 223 of described wiring board 22, the described supporting described lateral surface 2503 of main body 251 and described is coated after molding At least a portion of top surface 2501.
In second variant embodiment of the of the present utility model described camera module shown in accompanying drawing 9B, described supporting Main body 251 coats the described wiring board medial part of the described chip lateral part 2133 of described photo-sensitive cell 21, described wiring board 22 2231st, at least a portion of described wiring board connecting portion 2232 and described wiring board lateral part 2233.That is, in accompanying drawing 9B In this example of the described camera module illustrating, described supporting main body 251 can not coat the described of described photo-sensitive cell 21 Chip connecting portion 2132.In 3rd embodiment of the of the present utility model described camera module shown in accompanying drawing 9C, described Supporting main body 251 coats the described chip connecting portion 2132 of described photo-sensitive cell 21 and described chip lateral part 2133 and described The described wiring board medial part 2231 of wiring board 22 and described wiring board connecting portion 2232.That is, shown in accompanying drawing 9C In this embodiment of described camera module of the present utility model, described supporting main body 251 can not coat described photo-sensitive cell 21 described chip medial part 2131 and the described wiring board lateral part 2233 of described wiring board 22.That is, accompanying drawing 9A, In these variant embodiment of described camera module shown in Fig. 9 B and Fig. 9 C, described supporting main body 251 can be wrapped simultaneously Cover the mounting position of described photo-sensitive cell 21 and described wiring board 22, described photosensitive to pre-fix by described supporting main body 251 Element 21 and described wiring board 22, and stop in described photo-sensitive cell 21 and described wiring board by described supporting main body 251 22 mounting position produces gap, thus when carrying out moulding technology, described supporting main body 251 can stop described photo-sensitive cell 21 and each position of described wiring board 22 produce displacement because of unbalance stress, and described supporting main body 251 can stop Described moulding material enters between described photo-sensitive cell 21 and described wiring board 22, to ensure the smooth of described photo-sensitive cell 21 Degree.
It is the 4th variant embodiment of described camera module of the present utility model shown in refer to the attached drawing 10A, wherein institute State at least that supporting main body 251 coats the described wiring board medial part 2231 of described marginal area 22 of described wiring board 22 Point, at least a portion of described wiring board connecting portion 2232 and described wiring board lateral part 2233, i.e. described supporting main body 251 Coat the described wiring board connector 221 of described wiring board 22, with when carrying out moulding technology, on the one hand by described supporting master Body 251 pre-fixes described lead 24, on the other hand stops described lead 24 and described wiring board even by described supporting main body 251 Fitting 221 is contacted with described moulding material, thus avoiding described lead 24 to come off from described wiring board connector 221.
It is the 5th variant embodiment of described camera module of the present utility model shown in refer to the attached drawing 10B, wherein institute State the described chip medial part 2131 that supporting main body 251 only coats described photo-sensitive cell 21, with when carrying out moulding technology, described Supporting main body 251 stops described moulding material from entering the described photosensitive region 212 of described photo-sensitive cell 21, thus in described molding Formed after material solidification outside the described marginal area 223 coating described wiring board 22 and the described chip of described photo-sensitive cell 21 Sidepiece 2133 and the described molded body 232 of described chip connecting portion 2132, and the described photosensitive area in described photo-sensitive cell 21 The corresponding position in domain 212 forms described optical window 231.
It is the 6th variant embodiment of described camera module of the present utility model shown in refer to the attached drawing 11, with this practicality Unlike new above-mentioned embodiment, described molded body 232 does not coat the institute of described supporting main body 251 after shaping State top surface 2501.In this specific example shown in for example in accompanying drawing 11, described molded body 232 coats institute after shaping State the described marginal area 223 of wiring board 22 and the described lateral surface 2503 of described supporting main body 251.
Although it is noted that the height all illustrating described supporting main body 251 in accompanying drawing 1 to Figure 11 is higher than each The scheme of the height of ledge of described lead 24, in other examples of described camera module of the present utility model, institute State supporting main body 251 height can also be equal to each described lead 24 ledge height, or in other some In example, the height of described supporting main body 251 can also be less than the height of the ledge of each described lead 24, as long as entering During row moulding technology, the described stitching surface 1011 of the described mold 101 of described mould 100 supports main body 251 with described Top surface contact and the stitching surface of described mold 101 does not directly apply pressure to each described lead 24.
Shown in refer to the attached drawing 12, this utility model further provides for an electronic equipment, wherein said electronic equipment one electronics Apparatus body 200 and at least one camera module, wherein each described camera module are arranged at described electronic equipment body respectively 200, for obtaining figure, wherein each described camera module 200 further includes at least one optical lens 10 and extremely respectively A few molding photosensory assembly 20, described molding photosensory assembly 20 includes a supporting member 25, a photo-sensitive cell 21, a wiring board 22, one group of lead 24 and a molded base 23, the two ends of wherein each described lead 24 are connected to described photo-sensitive cell respectively 21 chip contacts 211 and the wiring board connector 221 of described wiring board 22, wherein said molded base 23 includes a molding Main body 232 and have an optical window 231, is wherein carrying out moulding technology by a molding tool 100 so that described molded body 232 During molding, described supporting member 25 is used for stoping the stitching surface 1011 of described mould 100 from applying pressure to described lead 24, wherein The photosensitive region 212 of described photo-sensitive cell 21 corresponds to described optical window 231, and wherein each described optical lens 10 are set respectively Photosensitive path in the described photo-sensitive cell 21 of each described molding photosensory assembly 20.
Accompanying drawing 12 shows a variant embodiment of described camera module, and wherein said filter element 40 is not straight Connect and be assembled in described module main body 232, but provide at least one supporter 70, described filter element 40 quilt by described camera module It is assembled in described supporter 70, then described supporter 70 is assembled in the top surface of described molded body 232, so that described filter Optical element 40 is maintained between described optical lens 10 and described photo-sensitive cell 21, by such mode, can reduce institute State the size of filter element 40, to reduce the height of described camera module.
Further, the top surface of described molded body 232 can be a plane, thus becoming in described molded base 23 After type, first described supporter 70 is assembled in the top surface of described molded body 232, then again by described driver 30 or institute State lens barrel 60 and be assembled in described supporter 70.That is, described driver 30 or described lens barrel 60 can be not direct It is assembled in the top surface of described molded body 232, but be assembled on described supporter 70.
Accompanying drawing 13 shows another variant embodiment of described camera module, the top of wherein said molded body 232 Surface forms a described groove 235, and the described supporter 70 being assembled in the top surface of described molded body 232 is housed inside In described groove 235, to reduce the height dimension of described camera module further, now, described driver 30 or described mirror Cylinder 60 can be by direct-assembling in the top surface of described molded body 232.
Even so, it will be appreciated by those skilled in the art that, other in the described camera module of the present invention show In example, described optical lens 10 can also be by direct-assembling in the top surface of described molded body 232 or described optical lens 10 can also be by direct-assembling in the top surface of described supporter 70.
It will be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as lifting Example and be not intended to limit this utility model.
The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are in reality Apply and show in example and illustrate, without departing under described principle, embodiment of the present utility model can have and any deform or repair Change.

Claims (32)

1. the molding photosensory assembly of a camera module is it is characterised in that include：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, the chip that the two ends of lead described in wherein every group are connected to each described photo-sensitive cell respectively connects Part and the wiring board connector of each described wiring board；
At least one supporting member being formed by first medium, wherein each described supporting member are respectively coated by each described photosensitive unit At least a portion in non-photo-sensing region of part and a part for the marginal area of each described wiring board；And
At least one molded base being formed by second medium, wherein each described molded base include a molded body and tool respectively There is at least one optical window, described molded body coats the described marginal area of described wiring board and at least one of described supporting member Point, the photosensitive region of each described photo-sensitive cell corresponds to the described optical window of each described molded body.
2. molding photosensory assembly according to claim 1, wherein said supporting member include a shaped as frame supporting main body and There is at least one through hole, described supporting main body coats at least a portion in described non-photo-sensing region of described photo-sensitive cell and described A part for the described marginal area of wiring board, the described photosensitive region of described photo-sensitive cell corresponds to described through hole, wherein institute State at least a portion of molded body cladding described supporting main body.
3. molding photosensory assembly according to claim 2, wherein said supporting main body have a top surface, a medial surface with And a lateral surface, described top surface inwardly or outwardly each extends over to be connected to described medial surface and described lateral surface, described interior Side forms described through hole, the described lateral surface of described molded body cladding described supporting main body.
4. molding photosensory assembly according to claim 3, wherein said molded body coats described supporting main body further Described top surface at least a portion.
5. according to described molding photosensory assembly arbitrary in claim 2 to 4, the height of wherein said supporting main body be higher than or Equal to described lead height upwardly.
6., according to described molding photosensory assembly arbitrary in claim 2 to 4, wherein said supporting main body has elasticity.
7., according to described molding photosensory assembly arbitrary in claim 2 to 4, wherein said supporting main body has viscosity.
8. one carry the camera module of molding photosensory assembly it is characterised in that including：
At least one optical lens；With
At least one molding photosensory assembly, wherein each described molding photosensory assembly include respectively：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, the chip that the two ends of lead described in wherein every group are connected to each described photo-sensitive cell respectively connects Part and the wiring board connector of each described wiring board；
At least one supporting member being formed by first medium, wherein each described supporting member are respectively coated by each described photosensitive unit At least a portion in non-photo-sensing region of part and at least a portion of the marginal area of each described wiring board；And
At least one molded base being formed by second medium, wherein each described molded base include a molded body and tool respectively There is at least one optical window, described molded body coats the described marginal area of described wiring board and at least one of described supporting member Point, the photosensitive region of each described photo-sensitive cell corresponds to the described optical window of each described molded body, wherein each described light Learn camera lens and be arranged at the photosensitive path of each described photo-sensitive cell respectively, with by described optical window for described optical lens and institute Stating photo-sensitive cell provides a passage of light.
9. camera module according to claim 8, further includes at least one driver, wherein each described optical lens It is assembled in each described driver respectively, each described driver is assembled in the top table of each described module main body respectively Face.
10. camera module according to claim 9, further includes at least one filter element, wherein each described optical filtering Element is assembled in the top surface of each described molded body respectively, so that described filter element is located at described optical lens and institute State between photo-sensitive cell.
11. camera modules according to claim 10, further include at least one supporter, wherein each described unit that filters Part is assembled in each described supporter respectively, and each described supporter is assembled in the top table of each described molded body respectively Face, so that described filter element is located between described optical lens and described photo-sensitive cell.
12. camera modules according to claim 10, the top surface of wherein said molded body have an inner surface and One outer surface, described filter element is assembled in the described inner surface of described molded body, and described driver is assembled in The described outer surface of described molded body.
13. camera modules according to claim 12, the plane at the described inner surface place of wherein said molded body The plane being located less than described outer surface, to form a groove of described molded body, wherein said filter element is located at institute State groove.
14. arbitrary described camera modules in 13 according to Claim 8, wherein said supporting member includes the supporting of a shaped as frame Main body coats at least a portion in the described non-photo-sensing region of described photo-sensitive cell with having at least one through hole, described supporting main body With at least a portion of the described marginal area of described wiring board, the described photosensitive region of described photo-sensitive cell is corresponding to described logical Hole, at least a portion of wherein said molded body cladding described supporting main body.
15. camera modules according to claim 14, wherein said supporting main body have a top surface, a medial surface and One lateral surface, described top surface inwardly or outwardly each extends over to link Ei and described medial surface and described lateral surface, described interior Side forms described through hole, the described lateral surface of described molded body cladding described supporting main body.
16. camera modules according to claim 15, wherein said molded body coats described supporting main body further At least a portion of described top surface.
17. 1 electronic equipments are it is characterised in that include：
One electronic equipment body；With
According to Claim 8, arbitrary at least one described described camera module in 16, wherein each described camera module divides It is not arranged at described electronic equipment body.
The molding photosensory assembly of 18. 1 camera modules is it is characterised in that include：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, described in wherein every group, the two ends of lead are connected to the chip contacts of each described photo-sensitive cell Wiring board connector with wiring board each described；
At least one supporting member, wherein each described supporting member are set at least of lead described in every group of cladding respectively Point；And
At least one molded base, wherein each described molded base include a molded body respectively and have at least one optical window, its Described in molded body at least coat the marginal area of described wiring board and at least a portion of described supporting member in molding, The photosensitive region of each described photo-sensitive cell corresponds respectively to each described optical window of each described molded base.
19. molding photosensory assemblies according to claim 18, wherein said supporting member includes a supporting main body and has At least one through hole, described supporting main body coats at least a portion of described lead, the described photosensitive region pair of described photo-sensitive cell Through hole described in Ying Yu, at least a portion of described molded body cladding described supporting main body.
20. molding photosensory assemblies according to claim 19, wherein said supporting main body coats the non-of described photo-sensitive cell At least a portion of photosensitive region.
21. molding photosensory assemblies according to claim 19, wherein said supporting main body coats the edge of described wiring board The part in region.
22. molding photosensory assemblies according to claim 19, wherein said supporting main body coats the edge of described wiring board At least a portion in the non-photo-sensing region of the part in region and described photo-sensitive cell.
23. have a top table according to described molding photosensory assembly arbitrary in claim 19 to 22, wherein said supporting main body Face, a medial surface and a lateral surface, described top surface inwardly or outwardly each extends over to be connected to described medial surface and described Lateral surface, described medial surface forms described through hole, the described lateral surface of described molded body cladding described supporting main body.
24. molding photosensory assembly according to claim 23, wherein said molded body coats described supporting master further At least a portion of the described top surface of body.
25. according to described molding photosensory assembly arbitrary in claim 19 to 22, the height of wherein said supporting main body are higher than Or it is equal to described lead height upwardly.
26. 1 camera modules carrying molding photosensory assembly are it is characterised in that include：
At least one optical lens；With
At least one molding photosensory assembly, wherein each described molding photosensory assembly further include respectively：
At least one photo-sensitive cell；
At least one wiring board；
Least one set lead, described in wherein every group, the two ends of lead are connected to the chip contacts of each described photo-sensitive cell Wiring board connector with wiring board each described；
At least one supporting member, wherein each described supporting member are set at least of lead described in every group of cladding respectively Point；And
At least one molded base, wherein each described molded base include a molded body respectively and have at least one optical window, its Described in molded body at least coat the marginal area of described wiring board and at least a portion of described supporting member in molding, The photosensitive region of each described photo-sensitive cell corresponds respectively to each described optical window of each described molded base, wherein each institute State the photosensitive path that optical lens are arranged at each described sensitive chip respectively, with by described optical window for described optical lens There is provided a passage of light with described sensitive chip.
27. camera modules according to claim 26, further include at least one driver, wherein each described optical frames Head is arranged at each described driver respectively, and each described driver is assembled in the top surface of described molded body respectively.
28. camera modules according to claim 27, further include at least one filter element, each described filter element It is assembled in the top surface of described molded body respectively, so that described filter element is located at described sensitive chip and described optical frames Between head.
29. camera modules according to claim 28, further include at least one supporter, wherein each described unit that filters Part is assembled in each described supporter respectively, and each described supporter is assembled in the top table of each described molded body respectively Face, so that described filter element is located between described optical lens and described photo-sensitive cell.
30. camera modules according to claim 28 or 29, the top surface of wherein said molded body has an inner side table Face and an outer surface, described filter element is assembled in the described inner surface of described molded body, and described driver is by group It is loaded on the described outer surface of described molded body.
31. camera modules according to claim 30, the plane that wherein said inner surface is located is less than described outside table The plane that face is located, to form a groove of described molded body, described filter element is housed inside described groove.
32. 1 electronic equipments are it is characterised in that include：
One electronic equipment body；With
According at least one described described camera module arbitrary in claim 26 to 31, each described camera module respectively by It is arranged at described electronic equipment body, for obtaining image.
CN201620875381.2U 2016-03-28 2016-08-12 Module of making a video recording and photosensitive assembly and electronic equipment are moulded to mould thereof Active CN205959984U (en)

Priority Applications (20)

Application Number Priority Date Filing Date Title
CN201620875381.2U CN205959984U (en) 2016-08-12 2016-08-12 Module of making a video recording and photosensitive assembly and electronic equipment are moulded to mould thereof
PCT/CN2016/103247 WO2017166798A1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020187031125A KR102152516B1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device
US16/088,435 US11289521B2 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
JP2018550699A JP7025345B2 (en) 2016-03-28 2016-10-25 Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices
EP23176877.1A EP4231653A3 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
EP16896568.9A EP3468165B1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
TW108117229A TWI706213B (en) 2016-03-28 2017-03-25 Camera module and its molded photosensitive component
TW106110048A TWI661258B (en) 2016-03-28 2017-03-25 Camera module and its molded photosensitive component
TW108117228A TWI706212B (en) 2016-03-28 2017-03-25 Camera module and manufacturing method of moulded photosensitive component
TW106204228U TWM555960U (en) 2016-03-28 2017-03-26 Photographing module and its molded photosensitive component and electronic equipment
JP2018556877A JP6865232B2 (en) 2016-04-28 2017-04-26 Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices.
KR1020217022035A KR20210091363A (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
KR1020187034256A KR102147896B1 (en) 2016-04-28 2017-04-26 Photographic module and molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly and manufacturing method and electronic device
EP17788772.6A EP3481046A4 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
KR1020207019834A KR102281383B1 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
PCT/CN2017/082000 WO2017186120A2 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
PCT/CN2017/097425 WO2018028718A1 (en) 2016-08-12 2017-08-14 Camera module based on integral encapsulation technique and array camera module
JP2021060338A JP7344924B2 (en) 2016-04-28 2021-03-31 Imaging module manufacturing method
US17/678,347 US11824071B2 (en) 2016-03-28 2022-02-23 Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device

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WO2018028718A1 (en) * 2016-08-12 2018-02-15 宁波舜宇光电信息有限公司 Camera module based on integral encapsulation technique and array camera module
CN108807430A (en) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its combined type photosensory assembly
CN109286736A (en) * 2017-07-21 2019-01-29 宁波舜宇光电信息有限公司 Camera module and its support, photosensitive device and manufacturing method and electronic equipment
CN110637456A (en) * 2017-05-18 2019-12-31 宁波舜宇光电信息有限公司 Camera module, molded circuit board assembly thereof, array camera module and electronic equipment
CN110636185A (en) * 2018-06-21 2019-12-31 宁波舜宇光电信息有限公司 Photosensitive assembly, camera module and intelligent terminal equipment
CN111726483A (en) * 2019-03-21 2020-09-29 三赢科技（深圳）有限公司 Lens module and electronic device
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WO2018028718A1 (en) * 2016-08-12 2018-02-15 宁波舜宇光电信息有限公司 Camera module based on integral encapsulation technique and array camera module
CN108807430A (en) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its combined type photosensory assembly
US11721709B2 (en) 2017-05-18 2023-08-08 Ningbo Sunny Opotech Co., Ltd. Circuit board assembly with photosensitive element mounted to back side of circuit board
CN110637456A (en) * 2017-05-18 2019-12-31 宁波舜宇光电信息有限公司 Camera module, molded circuit board assembly thereof, array camera module and electronic equipment
CN113596313A (en) * 2017-07-21 2021-11-02 宁波舜宇光电信息有限公司 Camera module, support thereof, photosensitive device, manufacturing method and electronic equipment
CN110892702A (en) * 2017-07-21 2020-03-17 宁波舜宇光电信息有限公司 Camera module, support thereof, photosensitive device, manufacturing method and electronic equipment
CN112600998A (en) * 2017-07-21 2021-04-02 宁波舜宇光电信息有限公司 Camera module, support thereof, photosensitive device, manufacturing method and electronic equipment
CN109286736B (en) * 2017-07-21 2022-04-29 宁波舜宇光电信息有限公司 Camera module, support thereof, photosensitive device, manufacturing method and electronic equipment
CN114584690A (en) * 2017-07-21 2022-06-03 宁波舜宇光电信息有限公司 Camera module and photosensitive device
CN112600998B (en) * 2017-07-21 2022-06-24 宁波舜宇光电信息有限公司 Camera module, support thereof, photosensitive device, manufacturing method and electronic equipment
CN109286736A (en) * 2017-07-21 2019-01-29 宁波舜宇光电信息有限公司 Camera module and its support, photosensitive device and manufacturing method and electronic equipment
CN114584690B (en) * 2017-07-21 2024-04-09 宁波舜宇光电信息有限公司 Camera module and photosensitive device
CN110636185A (en) * 2018-06-21 2019-12-31 宁波舜宇光电信息有限公司 Photosensitive assembly, camera module and intelligent terminal equipment
CN111726483A (en) * 2019-03-21 2020-09-29 三赢科技（深圳）有限公司 Lens module and electronic device
CN111988496A (en) * 2019-05-24 2020-11-24 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof

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