CN107734227A - Image sensor package structure, camera module and preparation method thereof - Google Patents
Image sensor package structure, camera module and preparation method thereof Download PDFInfo
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- CN107734227A CN107734227A CN201711026873.XA CN201711026873A CN107734227A CN 107734227 A CN107734227 A CN 107734227A CN 201711026873 A CN201711026873 A CN 201711026873A CN 107734227 A CN107734227 A CN 107734227A
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- image sensor
- sensor chip
- pcb board
- support
- adhesive
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000012790 adhesive layer Substances 0.000 claims abstract description 39
- 238000000465 moulding Methods 0.000 claims abstract description 27
- 238000009434 installation Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims description 29
- 239000003292 glue Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- 238000003384 imaging method Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 8
- 125000004122 cyclic group Chemical group 0.000 abstract description 5
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 101001031591 Mus musculus Heart- and neural crest derivatives-expressed protein 2 Proteins 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
Abstract
The invention discloses a kind of image sensor package structure, camera module and preparation method thereof, first in the pcb board upper surface correspondence image sensor chip not position extension supporting thing with adhesive-layer contact portion, then image sensor chip is passed through in the viscous installation region located in the middle part of pcb board of adhesive-layer again；The supporter can be the dots structure of the correspondence image sensor chip endpoint location on pcb board；It can also be the cyclic structure that correspondence image sensor chip edge inner line is interrupted on pcb board, with during Molding pressing molds, part for not contacted to image sensor chip with adhesive-layer provides support, warpage is produced during Molding pressing molds so as to solve image sensor chip, lifts the properties of product of camera module.Using the camera module of the encapsulating structure, while effectively reducing camera module size, it is thus also avoided that image sensor chip caused warpage in moulding process, so as to improve camera module properties of product.
Description
Technical field
The present invention relates to camera technical field, in particular to a kind of image sensor package structure, camera module
And preparation method thereof.
Background technology
At present, camera module generally includes imaging sensor, pcb board, support, optical filter and the lens group provided with camera lens
Part.Imaging sensor is by gluing crystalline substance (Die Bond；D/B gold thread (Wire Bond), are beaten；W/B) process Installation is on pcb board, branch
Frame is installed on pcb board, and covers on the top of imaging sensor, and lens assembly is installed on support, and optical filter is located at lens group
Between part and imaging sensor, and installed in the middle part of support.But the size of the camera module of this structure is larger, no
Meet light, thin, the small development trend of current electronic product (mobile phone, tablet personal computer etc.), and product reliability also needs further
Strengthen.Therefore, present applicant has proposed the image sensor package technique of mould model, i.e., first image sensor chip is mounted
Onto pcb board, (Molding) pressing mold is then molded again, makes capsulation material by image sensor chip non-photo-sensing area and four
Passive device, the gold thread in week are all cast on together, and form overall structure, and the encapsulating structure is combined with conventional stent with pcb board
Compare, reduce space shared by support, so as to reach the purpose for reducing camera module size, and enhance the reliable of product
Property.
But during image sensor chip is bonded on pcb board, because the glue put on pcb board is not complete
Equably it is coated on entirely between pcb board and image sensor chip, typically occurs that image sensor chip local location does not have
The phenomenon that glue contacts with PCB plates, typically, easily in image sensor chip edge or in image sensor chip
Four endpoint locations there is the phenomenon of no glue, thus when upper and lower mould during molding pressing molds presses, image sensing
Device chip is local because the support of no colloid can produce warpage, so as to cause the quality of image to decline.
The content of the invention
In order to solve the above-mentioned technical problem, the present invention proposes a kind of image sensor chip that solves in molding pressing mold mistakes
The image sensor package structure of warpage is produced in journey, there is its camera module and preparation method.
The technical proposal of the invention is realized in this way：
A kind of image sensor package structure, including pcb board, it has upper surface and relative lower surface；Image sensing
Device chip and plastic-sealed body, it is characterised in that：Wherein, described image sensor chip is mounted on the pcb board by adhesive-layer
On upper surface, and it is provided with and is used for described image sensor chip not between the pcb board and described image sensor chip
The part contacted with adhesive-layer provides one or more supporters of support, and described image sensor chip has photosensitive area and enclosed
Around the non-photo-sensing area of the photosensitive area, multiple first weld pads are provided with the non-photo-sensing area, are surrounded on the pcb board described
Multiple second weld pads, first weld pad corresponding with the pcb board second are provided with the periphery of image sensor chip
Weld pad is electrically connected with by routing mode；The plastic-sealed body molds to be formed by capsulation material, and the plastic-sealed body coats image biography
The non-photo-sensing area of sensor chip, and light hole of the plastic-sealed body formed with the exposure photosensitive area.
Further, the height of above support is equal to the thickness of the adhesive-layer.
Further, above support is ink or colloid.
Further, above support is that described image sensor chip terminals position is corresponded on the pcb board
Dots structure.
Further, above support is that described image sensor chip edge inside cord is corresponded on the pcb board
The loop configuration of bar interruption.
Further, the annular of the photosensitive area is surrounded in the non-photo-sensing area of described image sensor chip formed with a circle
Rib, mold to form the plastic-sealed body by capsulation material in the non-photo-sensing area outside the annular rib and on the pcb board, institute
State in first weld pad, second weld pad and routing be coated on by plastic-sealed body.
A kind of camera module, including image sensor package structure, in addition to optical filter, lens assembly and support,
The optical filter is arranged in support, and the lens assembly is arranged on the upside of the support, the support for being provided with optical filter
It is arranged between the lens assembly and described image sensor chip.
Further, the support includes rack body and the through hole being formed in the middle part of the rack body, the through hole
Periphery is arrived in the subsidence trough of the bore periphery formed with subsidence trough, the optical filter attachment；In on the upside of the plastic-sealed body
Formed with storage tank, the support attachment with optical filter is arrived in the storage tank, the optical filter is sensed with described image in portion
The photosensitive area of device chip is relative；The lens assembly is installed on the upside of the support.
A kind of camera module preparation method, comprises the following steps：
1) pcb board is provided, the pcb board has upper surface and relative lower surface, and the pcb board upper surface has pre-
The installation region of image sensor chip is installed, the pcb board upper surface is provided with multiple the around the installation region periphery
Two weld pads；The part for being provided for not contacting described image sensor chip with adhesive-layer on the installation region provides branch
One or more supporters of support；One layer of adhesive-layer is coated with the installation region；
2) image sensor chip is provided, described image sensor chip has photosensitive area and around the photosensitive area
Non-photo-sensing area, multiple first weld pads are provided with the non-photo-sensing area；Described image sensor chip is mounted by adhesive-layer
In installation region after to step 1, the part for making described image sensor chip not contacted with adhesive-layer is supported in the support
On thing, and first weld pad the second weld pad corresponding with the pcb board is electrically connected with by routing mode；
3) by the pcb board after step 2 be positioned over one be used for mold mould in, using capsulation material molding method,
A plastic-sealed body is formed on the pcb board, the plastic-sealed body coats the non-photo-sensing area of described image sensor chip, and the plastic-sealed body
On the light hole formed with the exposure photosensitive area；
4) optical filter, support and a lens assembly are provided, the optical filter is installed on the support, the mirror
Head assembly is installed on the upside of the support, and the support for being provided with optical filter is arranged at the lens assembly and described image passes
Between sensor chip.
Further, the height of above support is equal to the thickness of the adhesive-layer.
The beneficial effects of the invention are as follows：The present invention provides a kind of image sensor package structure, wherein, first on pcb board
The surface correspondence image sensor chip not position extension supporting thing with adhesive-layer contact portion, the supporter is set to be embedded in for will
In the adhesive-layer that image sensor chip connects with pcb board, then image sensor chip is set by the way that adhesive-layer is viscous again
In installation region in the middle part of the pcb board；The height of the supporter is equal to the height of adhesive-layer, for imaging sensor not with it is viscous
The part of glue-line contact provides a supporting role.The supporter can be ink or colloid.The supporter can be located at pcb board
The dots structure of upper correspondence image sensor chip endpoint location；The supporter can also be that correspondence image passes on pcb board
The cyclic structure of lines interruption on the inside of sensor chip edge.With positioned at the dots structure of image sensor chip endpoint location
Exemplified by ink, the ink of four endpoint locations has certain height, during molding pressing molds, this four endpoint locations
Ink can play a part of supporting image sensor chip corner, to solve corner without glue vacant state, so as to solve to scheme
As sensor chip produces warpage during Molding pressing molds, the properties of product of camera module are lifted；Using the encapsulation knot
The camera module of structure, while effectively reducing camera module size, it is thus also avoided that image sensor chip is in moulding process
In caused warpage, so as to improve camera module properties of product.The present invention also proposes a kind of camera module preparation method,
The preparation method by moulding process in the installation region of pcb board extension supporting thing, for forming the small-sized of warpage preventing
Change camera module.
Brief description of the drawings
Fig. 1 is the image sensor package structural representation that first embodiment provides in the present invention；
Fig. 2 be in Fig. 1 A-A to profile；
Fig. 3 is the decomposing schematic representation of image sensor package structure in Fig. 1；
Fig. 4 is the schematic diagram that pcb board, supporter and adhesive-layer coordinate in first embodiment of the invention；
Fig. 5 is the schematic diagram that pcb board, supporter and adhesive-layer coordinate in second embodiment of the invention；
Fig. 6 is the preferred embodiment decomposition texture schematic diagram of camera module one of the present invention.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention
Embodiment elaborate.Many details are elaborated in the following description to fully understand the present invention.
But the invention can be embodied in many other ways as described herein, those skilled in the art can be without prejudice to originally
Similar improvement is done in the case of invention intension, therefore, this hair is not limited by following public specific implementation.
Term as used herein " upper surface ", " lower surface " " on " and similar statement simply to illustrate that mesh
, it is unique embodiment to be not offered as.
First embodiment
Fig. 1 is the image sensor package structural representation that first embodiment provides in the present invention；Fig. 2 be Fig. 1 in A-A to
Profile；Fig. 3 is the decomposing schematic representation of the image sensor package structure shown in Fig. 1；Fig. 4 is in first embodiment of the invention
The schematic diagram that pcb board, supporter and adhesive-layer coordinate；As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4, the present invention provides a kind of image and passed
Sensor encapsulating structure, it includes pcb board 1, one or more supporters 2, image sensor chip 3 and plastic-sealed body 4.
Pcb board 1 also known as prints pcb board, has upper surface and relative lower surface, is carrying for electronic component electrical connection
Donor, can use rigid pcb board, flexible PCB and Rigid Flex, and the present embodiment is preferably Rigid Flex, including camera lens
Hardboard portion 101, connector hardboard portion 102 and connection middle soft board portion 103 therebetween, in the camera lens hardboard portion 101 of pcb board
Surface middle part is the installation region of pre-installation image sensor chip, and the upper surface periphery of camera lens hardboard portion 101 of pcb board is with more
Individual second weld pad, the upper surface periphery of camera lens hardboard portion 101 of pcb board are additionally provided with multiple passive devices 104；Connector hardboard portion
102 are used for installs connector, to realize the quick electric connection of the other parts such as pcb board and mainboard.
One or more supporters 2 are arranged on pcb board 1, are corresponded generally to image sensor chip and are pasted by adhesive-layer
It is attached to and easily occurs position of the part without glue when on pcb board, there is certain altitude and supporting role, with Molding pressing mold mistakes
Cheng Zhong, the part for not contacted to image sensor chip with adhesive-layer provide support, solve no glue vacant state.Support
Thing can be arranged at correspondence image sensor chip endpoint location on pcb board.
Preferably, supporter 2 can be ink or colloid.
In the present embodiment, referring to Fig. 1 and Fig. 3, the supporter is arranged to dots structure, and correspondence image passes on pcb board
The position at four angles of sensor chip, preferably four ink points or four glue points.Four ink points can be by way of printing
The position of the corner of corresponding fitting image sensor chip on pcb board is printed on, four glue points can be set by mode for dispensing glue
The position of the corner of corresponding fitting image sensor chip on pcb board.It will be appreciated by persons skilled in the art that supporter
Structure can be any other shape in addition to dots structure, such as can be convex structure or beveled structure etc.
Deng.
Image sensor chip 3 can be charge coupled cell imaging sensor (CCD), or complementary metal
Oxide semiconductor image sensor (CMOS) etc..
Plastic-sealed body 4 is molded by capsulation material, and capsulation material can use epoxy resin etc. all available for molded
Capsulation material.
Referring to Fig. 3 and Fig. 1, in the present embodiment, image sensor chip arrives the installation of pcb board using the attachment of adhesive-layer 5
On region and four ink round dots.Image sensor chip 3 has photosensitive area 301 and around the non-photo-sensing area 302 of photosensitive area, non-
Multiple first weld pad (not shown), the first weld pad and the second weld pad corresponding on PCB plates 1 are provided with photosensitive area 302
(not shown) is electrically connected with by gold thread (not shown) in a manner of routing.
Referring to Fig. 1 and Fig. 2, plastic-sealed body 4 molds to be formed by capsulation material, is formed at the upper surface of pcb board 1, cladding figure
As the non-photo-sensing area of sensor chip 3, the middle part of plastic-sealed body 4 forms the light hole 401 of exposure photosensitive area 301.Specifically, plastic-sealed body
4 are formed on the upper surface periphery of pcb board 1, by the non-of the second weld pad on the upper surface periphery of pcb board 1 and image sensor chip 3
Photosensitive area 302 and the first weld pad thereon are coated in it, meanwhile, it will also be set on the PCB plates 1 on the periphery of image sensor chip 3
Multiple passive devices 104 put etc. are coated in it.Plastic-sealed body 4 is molded by capsulation material, can replace conventional package knot
Support in structure, space shared by support is reduced, so as to reach the purpose for reducing camera module size, and enhance product
Reliability.
Preferably, surrounded referring to Fig. 2 and Fig. 3, in the non-photo-sensing area 302 of image sensor chip 3 formed with a circle photosensitive
The annular rib 6 in area, pass through capsulation material in non-photo-sensing area 302 of the annular rib 6 away from the side of photosensitive area 301 and on pcb board 1
Molding forms plastic-sealed body 4, and plastic-sealed body is by second on first weld pad in the non-photo-sensing area 302 of image sensor chip 3, pcb board
Weld pad and gold thread, it is coated on interior.Preferably, annular rib 6 is formed by progress dry glue after drawing glue.By drawing glue and then being done
Glue forms annular rib 6, and simple operation is convenient to carry out.So, by the periphery non-photo-sensing area 302 1 of image sensor chip 3
Zhou Jinhang dispensings simultaneously carry out dry glue, form a ring shape rib 6, can stop that capsulation material enters image sensing in moulding process
The photosensitive area 301 of device chip, and can prevent mould in moulding process from weighing the photosensitive area 301 of image sensor chip 3 wounded.
The Making programme of image sensor package structure is as follows in the present embodiment：On the basis of conventional package, increase by four
Individual ink point, the corner of corresponding fitting image sensor chip installation region in is printed on PCB plates by way of printing
Position；Then by image sensor chip 3 by adhesive-layer 5 be adhered in the installation region of pcb board and four ink points on, then
Image sensor chip 3 is used to the second of gold thread and the upper surface periphery of pcb board 1 by COB (chip on board) technique routings
Weld pad is connected, then carries out capsulation material molding pressing mold, forms plastic-sealed body 4, that is, forms image sensor package structure of the present invention, this
Sample, by setting up four ink points between pcb board and image sensor chip, support image sensor chip four can be played
The effect at angle, to solve corner without glue vacant state, produced so as to solve image sensor chip during Molding pressing molds
Raw warpage, lift the properties of product of camera module.
Second embodiment
Fig. 5 is the schematic diagram that pcb board, supporter and adhesive-layer coordinate in second embodiment of the invention；Image in this implementation
Sensor-packaging structure equally includes pcb board 1, supporter 2, image sensor chip 3 and plastic-sealed body 4.Supported in the present embodiment
The cyclic structure that thing is interrupted for the lines on pcb board on the inside of correspondence image sensor chip edge, specifically, the supporter
2 one week on the outside of adhesive-layer 5, form discontinuous loop configuration.The present embodiment includes most of technology in first embodiment
Feature, its difference are that inner side forms what a lines were interrupted at pcb board upper surface correspondence image sensor chip edge
The holder of cyclic structure.Similarly, the supporter can be ink, and installing zone on pcb board is printed on by way of printing
In domain on the inside of the edge of corresponding fitting image sensor chip, the supporter can also be colloid, be set by mode for dispensing glue
It is bonded in corresponding in installation region on pcb board on the inside of the edge of image sensor chip.The supporter has certain height.
During molding pressing molds, the holder of the cyclic structure of this lines interruption can play support image sensor chip corner
Effect, to solve the image sensor chip periphery state hanging without glue, exist so as to solve image sensor chip
Warpage is produced during Molding pressing molds, lifts the properties of product of camera module.
In the various embodiments described above, the highly preferred thickness for equal to adhesive-layer of supporter, here and herein, " etc.
In " implication refer to：Molding upper and lower moulds pressing after, supporter is in contact with image sensor chip, adhesive-layer also with figure
As sensor chip is in contact, the height for being now considered as supporter is equal to the thickness of adhesive-layer.It is any to realize molding
The height that upper and lower mould pressing rear support thing can be in contact with image sensor chip is within the scope of the present invention.This hair
Bright image sensor package structure is applied to all camera modules using Molding plastic packaging classes, the modeling formed after molding
Body over-assemble support, optical filter and camera lens are sealed, completes the assembling of camera module.
As the presently preferred embodiments, below in conjunction with accompanying drawing 6, the corresponding camera module with above-mentioned image sensor package structure
It is described in detail.
Fig. 6 shows a kind of camera module of the preferred embodiment of the present invention, applies the image sensing of above-described embodiment
Device encapsulating structure, including pcb board 1, multiple or single supporter 2, image sensor chip 3, plastic-sealed body 4, support 7, optical filter 8
With lens assembly 9.Support 7 includes rack body 71 and the light hole 72 being formed in the middle part of rack body, and light hole periphery is formed
There is lower deep gouge 73, the attachment of the periphery of optical filter 8 is arrived in the lower deep gouge 73 on the periphery of light hole 72；The non-photo-sensing area 302 of sensitive chip 3
On surrounded formed with a circle sensitive chip photosensitive area 301 annular rib 6, sensitive chip and pcb board 1 outside annular rib 6
It is upper by capsulation material formed with the plastic-sealed body 4 in being coated on passive device and gold thread, middle side part is formed with appearance on plastic-sealed body 4
Groove 41 is put, in the attachment of support 7 with optical filter 8 to storage tank 41, makes the phase of photosensitive area 301 of light hole 72 and sensitive chip 3
It is right；Lens assembly 9 is installed on the upside of support 7 and plastic-sealed body 4.Preferably, in said structure, between optical filter 8 and support 7
Attachment, the attachment between support 7 and plastic-sealed body 4, the attachment between lens assembly 9 and support 7 and plastic-sealed body 4 passes through viscose glue
Layer 10,11,12 is realized.So, by the extension supporting thing 2 between image sensor chip 3 and pcb board 1, can be effectively improved
Mold during pressing mold due to without image sensor chip warpage caused by glue, so as to lift camera module properties of product.It is logical
Cross and form a ring shape rib 6 within one week in 3 periphery non-photo-sensing area of image sensor chip, plastic packaging material in moulding process can be stopped
Material enters the photosensitive area of image sensor chip 3, and can prevent that mould weighs the photosensitive of image sensor chip wounded in moulding process
Area；The camera module compared with pcb board combines, reduces space shared by support with conventional stent, reduces so as to reach
The purpose of camera module size, and enhance the reliability of product.
The invention also provides a kind of camera module preparation method, comprise the following steps：
1) pcb board is provided, pcb board has upper surface and relative lower surface, and there is pre-installation to scheme for pcb board upper surface
As the installation region of sensor chip, pcb board upper surface periphery is provided with multiple second weld pads；It is provided on installation region
The part not contacted to image sensor chip with adhesive-layer provides one or more supporters of support, is applied in installation region
One layer of adhesive-layer of cloth；
2) image sensor chip is provided, image sensor chip has photosensitive area and the non-photo-sensing around photosensitive area
Area, multiple first weld pads are provided with non-photo-sensing area；The installation that image sensor chip is arrived after step 1 by adhesive-layer attachment
In region, the part that image sensor chip does not contact with adhesive-layer is set to be supported on supporter, and by the first weld pad and pcb board
Second weld pad corresponding to upper is electrically connected with by routing mode；
3) by the pcb board after step 2 be positioned over one be used for mold mould in, using capsulation material molding method,
A plastic-sealed body is formed on the pcb board, the plastic-sealed body coats the non-photo-sensing area of described image sensor chip, and the plastic-sealed body
On the light hole formed with the exposure photosensitive area；
4) optical filter, support and a lens assembly are provided, the optical filter is installed on the support, the mirror
Head assembly is installed on the upside of the support, and the support for being provided with optical filter is arranged at the lens assembly and described image passes
Between sensor chip.
Design of the present invention preferably can be applied on mobile phone or tablet personal computer, be it is a kind of using pcb board+plastic packaging+
The miniaturization camera module scheme that support thing+optical filter barbola work forms.
Above example is referring to the drawings, to a preferred embodiment of the present invention will be described in detail.Those skilled in the art
Member by above-described embodiment carry out various forms on modification or change, but without departing substantially from the present invention essence in the case of, all
Fall within the scope and spirit of the invention.
Claims (10)
1. a kind of image sensor package structure, including pcb board, it has upper surface and relative lower surface；Imaging sensor
Chip and plastic-sealed body, it is characterised in that：Wherein, described image sensor chip is mounted on the pcb board by adhesive-layer
On surface, and between the pcb board and described image sensor chip be provided be used for described image sensor chip not with
The part of adhesive-layer contact provides one or more supporters of support, and described image sensor chip has photosensitive area and surrounded
The non-photo-sensing area of the photosensitive area, multiple first weld pads are provided with the non-photo-sensing area, described image is surrounded on the pcb board
It is provided with multiple second weld pads on the periphery of sensor chip, first weld pad the second weld pad corresponding with the pcb board
It is electrically connected with by routing mode；The plastic-sealed body molds to be formed by capsulation material, and the plastic-sealed body coats the imaging sensor
The non-photo-sensing area of chip, and light hole of the plastic-sealed body formed with the exposure photosensitive area.
2. image sensor package structure according to claim 1, it is characterised in that：The height of above support is equal to institute
State the thickness of adhesive-layer.
3. image sensor package structure according to claim 1, it is characterised in that：Above support is ink or glue
Body.
4. image sensor package structure according to claim 1, it is characterised in that：Above support is located at described
The dots structure of described image sensor chip terminals position is corresponded on pcb board.
5. image sensor package structure according to claim 1, it is characterised in that：Above support is located at described
The loop configuration of described image sensor chip edge inner line interruption is corresponded on pcb board.
6. image sensor package structure according to claim 1, it is characterised in that：Described image sensor chip it is non-
Surround the annular rib of the photosensitive area on photosensitive area formed with a circle, it is in the non-photo-sensing area outside the annular rib and described
Mold to form the plastic-sealed body by capsulation material on pcb board, the plastic-sealed body by first weld pad, second weld pad and
In routing is coated on.
A kind of 7. camera module, it is characterised in that：Including the image sensor package knot described in claim any one of 1-6
Structure, in addition to optical filter, lens assembly and support, the optical filter are arranged in support, and the lens assembly is arranged at institute
State on the upside of support, the support for being provided with optical filter is arranged between the lens assembly and described image sensor chip.
8. camera module according to claim 7, it is characterised in that：The support includes rack body and is formed at institute
The through hole in the middle part of rack body is stated, the bore periphery arrives the bore periphery formed with subsidence trough, the optical filter attachment
Subsidence trough in；For middle side part formed with storage tank, the storage tank is arrived in the support attachment with optical filter on the plastic-sealed body
It is interior, make the optical filter relative with the photosensitive area of described image sensor chip；The lens assembly is installed on the support
Upside.
9. a kind of camera module preparation method, it is characterised in that comprise the following steps：
1) pcb board is provided, the pcb board has upper surface and relative lower surface, and the pcb board upper surface has pre-installation
The installation region of image sensor chip, the pcb board upper surface are provided with multiple second welderings around the installation region periphery
Pad；The part for being provided for not contacting described image sensor chip with adhesive-layer on the installation region provides support
One or more supporters；One layer of adhesive-layer is coated with the installation region；
2) image sensor chip is provided, described image sensor chip has photosensitive area and the non-sense around the photosensitive area
Light area, multiple first weld pads are provided with the non-photo-sensing area；Described image sensor chip is passed through into adhesive-layer attachment to step
In installation region after rapid 1, the part that described image sensor chip does not contact with adhesive-layer is set to be supported on above support,
And first weld pad the second weld pad corresponding with the pcb board is electrically connected with by routing mode；
3) by the pcb board after step 2 be positioned over one be used for mold mould in, using capsulation material molding method, described
A plastic-sealed body is formed on pcb board, the plastic-sealed body coats the non-photo-sensing area of described image sensor chip, and shape on the plastic-sealed body
Into the light hole for having the exposure photosensitive area；
4) optical filter, support and a lens assembly are provided, the optical filter is installed on the support, the lens group
Part is installed on the upside of the support, and the support for being provided with optical filter is arranged at the lens assembly and described image sensor
Between chip.
10. camera module preparation method according to claim 9, it is characterised in that the height of above support is equal to
The thickness of the adhesive-layer.
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