CN108600598B - Camera module and assembling method thereof - Google Patents
Camera module and assembling method thereof Download PDFInfo
- Publication number
- CN108600598B CN108600598B CN201810814622.6A CN201810814622A CN108600598B CN 108600598 B CN108600598 B CN 108600598B CN 201810814622 A CN201810814622 A CN 201810814622A CN 108600598 B CN108600598 B CN 108600598B
- Authority
- CN
- China
- Prior art keywords
- light
- image sensor
- sensor chip
- camera module
- transmitting sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000003384 imaging method Methods 0.000 claims abstract description 59
- 230000003287 optical effect Effects 0.000 claims abstract description 59
- 239000011521 glass Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 18
- 230000007547 defect Effects 0.000 abstract description 12
- 230000005540 biological transmission Effects 0.000 abstract description 5
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 16
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 5
- 230000004304 visual acuity Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The invention provides a camera module and an assembly method thereof, and relates to the field of camera modules. The camera module comprises an image sensor chip, an optical filter, a lens assembly and a light transmission sheet, wherein the optical filter is arranged between the image sensor chip and the lens assembly, and the light transmission sheet is arranged between the image sensor chip and the lens assembly and is used for enabling light to be imaged on a curved imaging surface formed by warping of the image sensor chip. The camera module can make up the defect of bending of the imaging surface caused by the warpage of the image sensor chip, so that light is imaged on the bent imaging surface, and the image quality is improved.
Description
Technical Field
The invention relates to the field of camera modules, in particular to a camera module and an assembly method thereof.
Background
At present, in the preparation process of the camera module, when the image sensor chip is adhered to the PCB, as glue on the PCB is not completely and uniformly coated between the PCB and the image sensor chip, the phenomenon that no glue is contacted with the PCB at the local position of the image sensor chip generally occurs, and the phenomenon that no glue is easily generated at the peripheral edge of the image sensor chip or at the four end positions of the image sensor chip is common, so that the image sensor chip is locally warped due to no glue support in the process of molding and pressing, and the upper and lower mold pressing is performed. In addition, the surface of the PCB may be uneven, and after the image sensor chip is adhered to the surface of the PCB, the image sensor chip naturally warps along with the PCB. The image sensor chip is warped to deviate the imaging surface from the normal imaging surface to form a curved imaging surface, and at this time, the focusing point of the original normal imaging light does not finally fall on the curved imaging surface due to the bending of the actual imaging surface, so that a clear image point cannot be formed by the camera module, and the imaging quality is reduced.
Therefore, designing a camera module can make up the defect of bending of the imaging surface caused by the warpage of the image sensor chip, so that light is imaged on the bending imaging surface, and the image quality is improved, which is a technical problem to be solved in the prior art.
Disclosure of Invention
The embodiment of the invention provides a camera module and an assembly method thereof, which can make up for the defect of bending of an imaging surface caused by the warpage of an image sensor chip, so that light is imaged on the bending imaging surface, and the image quality is improved.
The embodiment of the invention provides a technical scheme that:
the camera module comprises an image sensor chip, an optical filter, a lens assembly and a light transmission sheet, wherein the optical filter is arranged between the image sensor chip and the lens assembly, the light transmission sheet is arranged between the image sensor chip and the lens assembly, and the light transmission sheet is used for enabling light to be imaged on a curved imaging surface formed by warping of the image sensor chip.
Further, the light-transmitting sheet is disposed between the image sensor chip and the optical filter, or between the optical filter and the lens assembly.
Further, the light-transmitting sheet is adhered to the surface of the optical filter.
Further, the transparent sheet and the optical filter are made of the same material, and the transparent sheet and the optical filter are integrally formed.
Further, the light-transmitting sheet is any one of resin, white glass, blue glass and optical glue.
Further, the camera module further comprises a PCB, and the image sensor chip is adhered to the surface of the PCB.
Further, the camera module further comprises a light filter support, the light filter support is arranged between the PCB and the lens assembly, and the light filter is installed on the light filter support.
Further, the camera module further comprises a lens support, the lens support is arranged on one side, far away from the PCB, of the optical filter support, and the lens assembly is mounted on the lens support.
Further, the camera module further comprises a motor, the motor is arranged on one side, far away from the PCB, of the optical filter support, the motor is sleeved on the lens assembly, and the motor is used for driving the lens assembly.
The embodiment of the invention provides another technical scheme that:
the assembly method of the camera module comprises the following steps:
bonding an image sensor chip on the PCB;
a filter is arranged on one side of the image sensor chip;
a light transmitting sheet is arranged on one side of the image sensor chip;
and arranging a lens assembly on the other side of the optical filter opposite to the image sensor chip, so that the optical filter and the light-transmitting sheet are arranged between the image sensor chip and the lens assembly, wherein the light-transmitting sheet is used for imaging light rays on a curved imaging surface formed by warping of the image sensor chip.
Compared with the prior art, the camera module and the assembling method thereof have the beneficial effects that:
by arranging the light-transmitting sheet between the image sensor chip and the lens assembly, the defect of bending of the imaging surface caused by the warping of the image sensor chip can be overcome, light can be imaged on the bent imaging surface, and the image quality is improved. In addition, the optical design of the lens component and the packaging process of the image sensor chip are not required to be changed, the cost is low, and the resolving power and the process yield of the camera module are ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a camera module according to a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a camera module according to a first embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a camera module according to a second embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a camera module according to a third embodiment of the present invention.
Fig. 5 is a flowchart of a method for assembling a camera module according to a fourth embodiment of the present invention.
Icon: 10-a camera module; 11-a PCB board; 12-an image sensor chip; 13-an optical filter support; 14-an optical filter; 15-transmitting sheet; 16-a lens holder; 17-a lens assembly; 18-motor.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships based on those shown in the drawings, or those conventionally put in place when the inventive product is used, or those conventionally understood by those skilled in the art, merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the preparation process of the camera module, the process of packaging the image sensor chip can lead to the image sensor chip not reaching an ideal plane state, so that the image sensor chip is warped, the imaging surface of the packaged camera module is also bent, and the bending of the imaging surface refers to the problem that the periphery of the imaging surface is protruded or recessed relative to the center, namely the imaging surface is uneven. According to the embodiment of the invention, the light transmitting sheet is arranged between the lens assembly and the image sensor chip, so that the problem of bending of the imaging surface caused by the warping of the image sensor chip can be solved, light can be imaged on the bent imaging surface, and the image quality is improved.
First embodiment
Referring to fig. 1, the present embodiment provides a camera module 10, and the camera module 10 includes an image sensor chip 12, an optical filter 14, a lens assembly 17 and a light-transmitting sheet 15. The optical filter 14 is disposed between the image sensor chip 12 and the lens assembly 17, and the light-transmitting sheet 15 is disposed between the image sensor chip 12 and the lens assembly 17.
In the imaging process of the camera module 10, the optical path around the light is larger than the optical path around the center, a light transmitting sheet 15 is arranged between the image sensor chip 12 and the optical filter 14, and the light transmitting sheet 15 can enable the light to move at the focus position around relative to the center focus, so that the light can be imaged on a curved imaging surface, and the defect of the curved imaging surface caused by the warping of the image sensor chip 12 is overcome.
In this embodiment, the light-transmitting sheet 15 is only required to be disposed between the image sensor chip 12 and the lens assembly 17, and referring to fig. 2, the light-transmitting sheet 15 is disposed between the optical filter 14 and the lens assembly 17, which can also compensate the defect of bending of the imaging surface caused by the warpage of the image sensor chip 12, so that the light is imaged on the bent imaging surface, and the effect of improving the image quality is achieved.
The mounting form of the light-transmitting sheet 15 may be selected in various ways, and the light-transmitting sheet 15 may be supported by a bracket, or the light-transmitting sheet 15 may be adhered to the surface of the optical filter 14. The light-transmitting sheet 15 is any one of resin, white glass, blue glass, and optical glue.
Of course, in other embodiments, the transparent sheet 15 and the optical filter 14 may be made of the same material, and the two may be integrally formed. The integrally formed light-transmitting sheet 15 and the optical filter 14 have a larger thickness than the conventional optical filter, and not only can function as the optical filter 14, but also can function as the light-transmitting sheet 15.
After the light-transmitting sheet 15 is arranged between the image sensor chip 12 and the lens assembly 17, if the imaging surface of the image sensor chip 12 is still convex, the light-transmitting sheet 15 with larger thickness or the light-transmitting sheet 15 with larger refractive index is selected to image light on the curved imaging surface; if the imaging surface of the image sensor chip 12 is still concave, the light-transmitting sheet 15 with smaller thickness is selected, or the light-transmitting sheet 15 with smaller refractive index is selected, so that light is imaged on the curved imaging surface.
The beneficial effect of camera module 10 that this embodiment provided:
by arranging the light-transmitting sheet 15 between the image sensor chip 12 and the lens assembly 17, the light-transmitting sheet 15 can make up for the defect of bending of the imaging surface caused by the warpage of the image sensor chip 12, so that light is imaged on the bending imaging surface, and the image quality of the camera module 10 is ensured. In addition, the optical design of the lens assembly 17 and the packaging process of the image sensor chip 12 are not required to be changed, the cost is low, and the resolving power and the process yield of the camera module 10 are ensured.
Second embodiment
Referring to fig. 3, the present embodiment provides a camera module 10, and the camera module 10 is a fixed focus module. The camera module 10 includes a PCB 11, an image sensor chip 12, a filter holder 13, a filter 14, a light-transmitting sheet 15, a lens holder 16, and a lens assembly 17. The lens assembly 17, the light-transmitting sheet 15, the optical filter 14, and the image sensor chip 12 are disposed in this order.
The PCB 11 is arranged on one side of the image sensor chip 12 far away from the optical filter 14, the image sensor chip 12 is adhered to the surface of the PCB 11, and the image sensor chip 12 and the PCB 11 are electrically connected by gold wires.
The PCB 11, also called a printed circuit board, has an upper surface and an opposite lower surface, is a provider of electrical connection of electronic components, and may be a rigid PCB, a flexible PCB, and a flexible-rigid board, which is preferred in this embodiment. The image sensor chip 12 may be a Charge Coupled Device (CCD) image sensor, a Complementary Metal Oxide Semiconductor (CMOS) image sensor, or the like.
The optical filter bracket 13 is arranged between the PCB 11 and the lens assembly 17, and the PCB 11 and the optical filter bracket 13 are bonded. The filter 14 is mounted on the filter holder 13 such that the filter 14 is disposed in parallel with the image sensor chip 12 at a distance.
The light transmitting sheet 15 is adhered to the upper surface of the optical filter 14, and the imaging surface is curved due to the warpage of the image sensor chip 12, but the light transmitting sheet 15 can image light on the curved imaging surface, and the effect of improving the image quality is improved. The light-transmitting sheet 15 is any one of resin, white glass, blue glass, and optical glue.
In other embodiments, the light-transmitting sheet 15 may be adhered to the lower surface of the optical filter 14, that is, the light-transmitting sheet 15 is disposed between the image sensor chip 12 and the optical filter 14, so that light can be imaged on the curved imaging surface, and the effect of improving the image quality can be improved.
The lens support 16 is arranged on one side of the optical filter support 13 far away from the PCB 11, and the optical filter support 13 and the lens support 16 are bonded. The lens assembly 17 is mounted on the lens holder 16.
The beneficial effect of camera module 10 that this embodiment provided:
by arranging the light-transmitting sheet 15 between the image sensor chip 12 and the lens assembly 17, the light-transmitting sheet 15 can make up for the defect of bending of the imaging surface caused by the warpage of the image sensor chip 12, so that light is imaged on the bending imaging surface, and the image quality of the camera module 10 is ensured. In addition, the optical design of the lens assembly 17 and the packaging process of the image sensor chip 12 are not required to be changed, the cost is low, and the resolving power and the process yield of the camera module 10 are ensured.
Third embodiment
Referring to fig. 4, the present embodiment provides a camera module 10, and the camera module 10 is an auto-focus module. The camera module 10 includes a PCB 11, an image sensor chip 12, a filter holder 13, a filter 14, a light-transmitting sheet 15, a motor 18, and a lens assembly 17. The lens assembly 17, the light-transmitting sheet 15, the optical filter 14, and the image sensor chip 12 are disposed in this order.
The PCB 11 is arranged on one side of the image sensor chip 12 far away from the optical filter 14, the image sensor chip 12 is adhered to the surface of the PCB 11, and the image sensor chip 12 is connected with the PCB 11 by gold wires.
The optical filter bracket 13 is arranged between the PCB 11 and the lens assembly 17, and the PCB 11 and the optical filter bracket 13 are bonded. The filter 14 is mounted on the filter holder 13 such that the filter 14 is disposed in parallel with the image sensor chip 12 at a distance.
The upper surface of the optical filter 14 is adhered with a light-transmitting sheet 15, and the light-transmitting sheet 15 can compensate the defect of bending of the imaging surface caused by the warpage of the image sensor chip 12, so that light is imaged on the bent imaging surface, and the effect of improving the image quality is achieved.
In other embodiments, the light-transmitting sheet 15 may be adhered to the lower surface of the optical filter 14, that is, the light-transmitting sheet 15 is disposed between the image sensor chip 12 and the optical filter 14. The image sensor chip 12 can also compensate for the defect of bending of the imaging surface caused by the warpage of the image sensor chip, so that light can be imaged on the bent imaging surface, and the effect of improving the image quality can be achieved.
The motor 18 is arranged on one side of the filter support 13 far away from the PCB 11, the motor 18 is sleeved on the lens assembly 17, and the motor 18 is used for driving the lens assembly 17.
The beneficial effect of camera module 10 that this embodiment provided:
by arranging the light-transmitting sheet 15 between the image sensor chip 12 and the lens assembly 17, the light-transmitting sheet 15 can make up for defects caused by warping of the image sensor chip 12, so that light is imaged on a curved imaging surface, and the image quality of the camera module 10 is ensured. In addition, the optical design of the lens assembly 17 and the packaging process of the image sensor chip 12 are not required to be changed, the cost is low, and the resolving power and the process yield of the camera module 10 are ensured.
Fourth embodiment
The embodiment provides a method for assembling a camera module, referring to fig. 5, the method includes the following steps:
step S1: an image sensor chip 12 is bonded on the PCB board 11.
Step S2: a filter 14 is provided on one side of the image sensor chip 12.
Before step S2, the filter support 13 may be adhered to the PCB 11, and then the filter 14 may be disposed on the filter support 13.
Step S3: a light transmitting sheet 15 is provided on one side of the image sensor chip 12. The light-transmitting sheet 15 may be disposed on a side of the optical filter 14 close to the image sensor chip 12, or may be disposed on a side of the optical filter 14 away from the image sensor chip 12.
Step S4: the lens assembly 17 is disposed on the other side of the filter 14 with respect to the image sensor chip 12 such that the filter 14 and the light transmitting sheet 15 are both disposed between the image sensor chip 12 and the lens assembly 17, wherein the light transmitting sheet 15 is used to image light on a curved imaging surface formed by warpage of the image sensor chip 12.
The lens holder 16 or the motor 18 may be provided on the filter holder 13 before step S4, and then the lens assembly 17 may be mounted on the lens holder 16 or the motor 18.
The form of providing the lens holder 16 on the filter holder 13 may specifically refer to the camera module 10 provided in the second embodiment. The form of providing the motor 18 on the filter holder 13 can be specifically referred to the camera module 10 provided in the third embodiment.
The method for assembling the camera module provided by the embodiment has the beneficial effects that:
by arranging the light-transmitting sheet 15 between the image sensor chip 12 and the lens assembly 17, the light-transmitting sheet 15 can make up for the defect of bending of the imaging surface caused by the warpage of the image sensor chip 12, so that light is imaged on the bending imaging surface, and the image quality of the camera module 10 is ensured. In addition, the optical design of the lens assembly 17 and the packaging process of the image sensor chip 12 are not required to be changed, the cost is low, and the resolving power and the process yield of the camera module 10 are ensured.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a camera module, its characterized in that, camera module includes image sensor chip (12), light filter (14), camera lens subassembly (17) and printing opacity piece (15), light filter (14) set up image sensor chip (12) with between camera lens subassembly (17), printing opacity piece (15) are used for making the light image on the crooked imaging surface that forms because of image sensor chip (12) warpage, printing opacity piece (15) can make the light move at focus position relative center focus all around, makes the light image on crooked imaging surface, when imaging surface of image sensor chip (12) is convex, then select for use first kind printing opacity piece (15), when imaging surface of image sensor chip (12) is concave, then select for use second kind printing opacity piece (15), first kind of printing opacity piece (15) thickness is greater than second kind of printing opacity piece (15) the refracting ratio of the second kind of printing opacity piece (15) is greater than the refracting ratio of first kind of printing opacity piece (15).
2. Camera module according to claim 1, characterized in that the light-transmitting sheet (15) is arranged between the image sensor chip (12) and the optical filter (14) or that the light-transmitting sheet (15) is arranged between the optical filter (14) and the lens assembly (17).
3. Camera module according to claim 1, characterized in that the light-transmitting sheet (15) is glued to the surface of the filter (14).
4. Camera module according to claim 1, characterized in that the light-transmitting sheet (15) and the optical filter (14) are made of the same material and are integrally formed.
5. The camera module according to claim 1, wherein the light-transmitting sheet (15) is any one of a resin, white glass, blue glass, optical glue.
6. Camera module according to claim 1, characterized in that the camera module further comprises a PCB board (11), the image sensor chip (12) being glued to the surface of the PCB board (11).
7. Camera module according to claim 6, characterized in that the camera module further comprises a filter holder (13), the filter holder (13) being arranged between the PCB-board (11) and the lens assembly (17), the filter (14) being mounted on the filter holder (13).
8. The camera module according to claim 7, further comprising a lens holder (16), wherein the lens holder (16) is disposed on a side of the filter holder (13) away from the PCB (11), and wherein the lens assembly (17) is mounted on the lens holder (16).
9. The camera module according to claim 7, further comprising a motor (18), wherein the motor (18) is disposed on a side of the filter support (13) away from the PCB board (11), the motor (18) is sleeved on the lens assembly (17), and the motor (18) is used for driving the lens assembly (17).
10. A method of assembling a camera module, the method comprising the steps of:
bonding an image sensor chip (12) on the PCB (11);
an optical filter (14) is arranged on one side of the image sensor chip (12);
a light-transmitting sheet (15) is arranged on one side of the image sensor chip (12);
the lens assembly (17) is arranged on the other side of the optical filter (14) opposite to the image sensor chip (12), so that the optical filter (14) and the light-transmitting sheet (15) are arranged between the image sensor chip (12) and the lens assembly (17), wherein the light-transmitting sheet (15) is used for imaging light on a curved imaging surface formed by warping of the image sensor chip (12), the light-transmitting sheet (15) can enable the light to move at the peripheral focal point position relative to the central focal point, imaging the light on the curved imaging surface, if the imaging surface of the image sensor chip (12) is convex, a first type of light-transmitting sheet (15) is selected, and if the imaging surface of the image sensor chip (12) is concave, a second type of light-transmitting sheet (15) is selected, and the thickness of the first type of light-transmitting sheet (15) is larger than the thickness of the second type of light-transmitting sheet (15) or the refractive index of the first type of light-transmitting sheet (15) is larger than the refractive index of the second type of light-transmitting sheet (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814622.6A CN108600598B (en) | 2018-07-23 | 2018-07-23 | Camera module and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814622.6A CN108600598B (en) | 2018-07-23 | 2018-07-23 | Camera module and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108600598A CN108600598A (en) | 2018-09-28 |
| CN108600598B true CN108600598B (en) | 2024-03-12 |
Family
ID=63618135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810814622.6A Active CN108600598B (en) | 2018-07-23 | 2018-07-23 | Camera module and assembling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108600598B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113726985B (en) * | 2020-05-21 | 2022-09-06 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module and terminal equipment |
| CN114500801A (en) * | 2022-01-19 | 2022-05-13 | 横店集团东磁有限公司 | Camera module and packaging method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2603523Y (en) * | 2003-01-17 | 2004-02-11 | 胜开科技股份有限公司 | Simplified image sensor module set |
| CN205067775U (en) * | 2015-09-22 | 2016-03-02 | 浙江水晶光电科技股份有限公司 | Electronic equipment and camera module thereof |
| CN105721641A (en) * | 2016-04-29 | 2016-06-29 | 信利光电股份有限公司 | Camera shooting module, assembling method of camera shooting module and electronic device |
| CN105842961A (en) * | 2015-01-15 | 2016-08-10 | 宁波舜宇光电信息有限公司 | Light filter, camera module and manufacturing method thereof |
| JPWO2016017791A1 (en) * | 2014-08-01 | 2017-06-01 | Jsr株式会社 | Optical filter |
| CN206348473U (en) * | 2016-12-21 | 2017-07-21 | 歌尔科技有限公司 | Camera module |
| CN107734227A (en) * | 2017-10-27 | 2018-02-23 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, camera module and preparation method thereof |
| CN107835351A (en) * | 2017-12-14 | 2018-03-23 | 信利光电股份有限公司 | A kind of dual camera module and terminal |
| CN208489921U (en) * | 2018-07-23 | 2019-02-12 | 昆山丘钛微电子科技有限公司 | Camera module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005043755A (en) * | 2003-07-24 | 2005-02-17 | Seiko Epson Corp | Optical multilayer filter, manufacturing method therefor, optical low-pass filter, and electronic equipment system |
-
2018
- 2018-07-23 CN CN201810814622.6A patent/CN108600598B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2603523Y (en) * | 2003-01-17 | 2004-02-11 | 胜开科技股份有限公司 | Simplified image sensor module set |
| JPWO2016017791A1 (en) * | 2014-08-01 | 2017-06-01 | Jsr株式会社 | Optical filter |
| CN105842961A (en) * | 2015-01-15 | 2016-08-10 | 宁波舜宇光电信息有限公司 | Light filter, camera module and manufacturing method thereof |
| CN205067775U (en) * | 2015-09-22 | 2016-03-02 | 浙江水晶光电科技股份有限公司 | Electronic equipment and camera module thereof |
| CN105721641A (en) * | 2016-04-29 | 2016-06-29 | 信利光电股份有限公司 | Camera shooting module, assembling method of camera shooting module and electronic device |
| CN206348473U (en) * | 2016-12-21 | 2017-07-21 | 歌尔科技有限公司 | Camera module |
| CN107734227A (en) * | 2017-10-27 | 2018-02-23 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, camera module and preparation method thereof |
| CN107835351A (en) * | 2017-12-14 | 2018-03-23 | 信利光电股份有限公司 | A kind of dual camera module and terminal |
| CN208489921U (en) * | 2018-07-23 | 2019-02-12 | 昆山丘钛微电子科技有限公司 | Camera module |
Non-Patent Citations (1)
| Title |
|---|
| 基于CCD的多浊度快速检测技术;王清泉;李旭宇;张茂林;;仪表技术与传感器(第01期);第101-105页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108600598A (en) | 2018-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20210203818A1 (en) | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | |
| CN109698894B (en) | Photosensitive assembly and camera module based on metal support | |
| CN110266974B (en) | Image pickup apparatus | |
| CN105847645B (en) | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof | |
| CN109510932B (en) | Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module | |
| JP4695993B2 (en) | Small camera and information terminal device including the same | |
| CN102738188B (en) | Solid state imaging unit, the method manufacturing solid state imaging unit, and electronic equipment | |
| US7988371B2 (en) | Camera module | |
| EP3544284A1 (en) | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | |
| US20190364184A1 (en) | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module | |
| EP3575844A1 (en) | Lens, camera module, and manufacturing method thereof | |
| KR20110022279A (en) | Camera module | |
| US8248514B1 (en) | Camera module having image sensing module with passive components | |
| CN110649047A (en) | Photosensitive chip packaging structure and forming method thereof | |
| JP2011015401A (en) | Imaging module | |
| EP3484139A1 (en) | Photosensitive component, and camera module and manufacturing method therefor | |
| CN108600598B (en) | Camera module and assembling method thereof | |
| CN107483792B (en) | Camera module and manufacturing method thereof | |
| TWI564610B (en) | Camera module and method for fabricating the same | |
| JP2011101385A (en) | Small-sized camera | |
| JP2006080597A (en) | Image pickup module and method of manufacturing the same | |
| US20200403017A1 (en) | Integrated photosensitive module, photosensitive assembly, camera module and preparation method therefor | |
| TWI555398B (en) | Camera Module And Method For Fabricating The Same | |
| KR100708940B1 (en) | Ir-filter and window one body type camera module apparatus | |
| US20220294943A1 (en) | Camera module and photosensitive assembly thereof, electronic device, and manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |