CN109192707A - Optical chip mould group and preparation method thereof - Google Patents
Optical chip mould group and preparation method thereof Download PDFInfo
- Publication number
- CN109192707A CN109192707A CN201811047652.5A CN201811047652A CN109192707A CN 109192707 A CN109192707 A CN 109192707A CN 201811047652 A CN201811047652 A CN 201811047652A CN 109192707 A CN109192707 A CN 109192707A
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- Prior art keywords
- glue
- fixing layer
- line
- optical
- optical chip
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- 230000003287 optical effect Effects 0.000 title claims abstract description 184
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 238000000034 method Methods 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004840 adhesive resin Substances 0.000 claims description 3
- 229920006223 adhesive resin Polymers 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 31
- 239000010410 layer Substances 0.000 description 82
- 239000000853 adhesive Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
A kind of optical chip mould group provided by the invention and preparation method thereof, optical chip mould group includes optical filter, optical chip, glue-line and fixing layer, optical chip includes first surface, first surface includes photosensitive region and non-photo-sensing region, optical filter includes first plane opposite with first surface, first plane is Nian Jie by glue-line with the non-photo-sensing region of first surface, fixing layer is set to the predeterminable area range of the first plane, the position of glue-line is corresponding with fixing layer, fixing layer is Nian Jie with glue-line to prevent glue-line from flowing, it is connected to make glue-line and fixing layer support optical filter, keep glue-line firm, to avoid being filled between optical filter and the photosensitive region of optical chip by glue, ensure the optical property of optical chip.
Description
Technical field
The present invention relates to optical chip mould technical group fields, in particular to optical chip mould group and preparation method thereof.
Background technique
In the optical-chip encapsulation technique for camera or optical finger print, it is sometimes desirable to which optical filter and chip is direct
The structure or function requirement for coming together to meet product is fitted to, existing manufacturing process is directly to use high transmittance optical cement
Water is bonded, i.e., first glue spots in chip surface, optical filter is then fitted to chip surface, this process and structure exists
The problem of be that chip and optical filter are directly fitted with glue, cause between chip and optical filter that there are one layer of glue separation layers.
For having the sensitive chip of microlens, if there is optical adhesive layer filling between optical filter and chip photosensitive area,
Although being able to satisfy light transmittance requirement, if after due to being filled between the curved surface of microlens by glue, microlens is original convex
Lens arrangement is filled and changed by glue, can weaken or lose the original spotlight effect of microlens and effect.
Summary of the invention
In view of this, the embodiment of the present invention is designed to provide a kind of optical chip mould group and preparation method thereof, to change
It is apt to fill the problems such as glue-line will affect optical effect in existing optical-chip encapsulation technique.
The technical solution adopted by the invention is as follows:
The embodiment of the invention provides a kind of optical chip mould group, the optical chip mould group includes optical filter, optical core
Piece, glue-line and fixing layer, the optical chip include first surface, and the first surface includes photosensitive region and non-photo-sensing area
Domain, the optical filter include first plane opposite with the first surface, and first plane is non-with the first surface
Photosensitive region is bonded by glue-line, and the fixing layer is set to the predeterminable area range of first plane, the position of the glue-line
Set corresponding with the fixing layer, the fixing layer is Nian Jie with the glue-line to prevent glue-line from flowing.
Further, first plane include the first area opposite with the photosensitive region and with the non-photo-sensing area
The corresponding second area in domain；The fixing layer is set to the predeterminable area range of the second area, and the glue-line is set to institute
It states between fixing layer and the non-photo-sensing region of first plane.
Further, the fixing layer is set to the outside of the first area.
Further, the fixing layer is continuously arranged.
Further, the fixing layer interval setting.
Further, the fixing layer includes one of ink layer or mask layer.
Further, the material of the glue-line includes ultraviolet cured adhesive or epoxy resin.
The present invention also provides a kind of optical chip mould group production methods, for connecting optical filter and optical chip, the light
Learning chip includes first surface, and the first surface includes photosensitive region and non-photo-sensing region, the optical filter include with it is described
The first opposite plane of first surface, which comprises
Fixing layer is set in the preset range of first plane；The preset range is that the first plane corresponds to described the
The non-photo-sensing region on one surface；
In first surface position corresponding with the fixing layer, glue-line is set；
The glue-line is Nian Jie with the fixing layer to prevent glue-line from flowing.
Compared with the prior art, the invention has the following advantages:
A kind of optical chip mould group provided by the invention and preparation method thereof, optical chip mould group includes optical filter, optics
Chip, glue-line and fixing layer, optical chip include first surface, and first surface includes photosensitive region and non-photo-sensing region, are filtered
Piece includes first plane opposite with first surface, and the first plane is Nian Jie by glue-line with the non-photo-sensing region of first surface, Gu
Given layer is set to the predeterminable area range of the first plane, and the position of glue-line is corresponding with fixing layer, fixing layer it is Nian Jie with glue-line to prevent
Only glue-line flows, and connects so that glue-line and fixing layer be made to support optical filter, keeps glue-line firm, to keep away optical filter and light
It learns and is filled between chip by glue, ensure the optical property of optical chip.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of embodiment of the present invention
Attached drawing be briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not to be seen as
It is the restriction to range, it for those of ordinary skill in the art, without creative efforts, can be with root
Other relevant attached drawings are obtained according to these attached drawings.
Fig. 1 shows existing optical chip mould group schematic diagram.
Fig. 2 shows the structural schematic diagrams for the optical chip mould group that first embodiment of the invention provides.
Fig. 3 shows the schematic diagram of optical chip provided in an embodiment of the present invention.
Fig. 4 shows the floor map of the first optical filter provided in an embodiment of the present invention.
Fig. 5 shows the floor map of second of optical filter provided in an embodiment of the present invention.
Fig. 6 shows the floor map of the third optical filter provided in an embodiment of the present invention.
Fig. 7 shows the flow chart of optical chip mould group production method provided by the invention.
Icon: 110- sensitive chip；1111- photosensitive region；130- glue-line；150- optical filter；20- optical chip mould group；
210- optical chip；211- first surface；2111- photosensitive region；2112- non-photo-sensing region；233- fixing layer；234- glue-line；
The first adhesive surface of 232-；The second adhesive surface of 231-；250- gas chamber；270- optical filter；The first plane of 271-；The first area 2711-；
2712- second area.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "left", "right", "inner", "outside"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when usually put
Orientation or positional relationship, be merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning
Or element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.
In the description of the present invention, it is also necessary to explanation, herein, such as first and second or the like relationship art
Language is only used to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying this
There are any actual relationship or orders between a little entities or operation.The terms "include", "comprise" or its it is any its
He is intended to non-exclusive inclusion by variant, so that the process, method, article or equipment including a series of elements is not
Only include those elements, but also including other elements that are not explicitly listed, or further include for this process, method,
Article or the intrinsic element of equipment.In the absence of more restrictions, being wanted by what sentence "including a ..." limited
Element, it is not excluded that there is also other identical elements in the process, method, article or apparatus that includes the element.For
For those skilled in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
In the video sensing chip package process for camera or optical finger print, it is sometimes desirable to 150 He of optical filter
Sensitive chip 110 is directly attached to the structure or function requirement for coming together to meet product, referring to Fig. 1, existing manufacturing process,
It is directly to be bonded using high transmittance optical adhesive layer 130, i.e., first 130 points of optical adhesive layer on 110 surface of sensitive chip, then
Optical filter 150 is fitted into 110 surface of sensitive chip, this process and structure the problem is that, sensitive chip 110 and filter
Piece 150 is directly fitted with optical adhesive layer 130, is caused there are one layer of separation layer between sensitive chip 110 and optical filter 150, this
Structure and technique can only meet photosensitive region 1111 without the chip structure with microlens, for having the sense of microlens
Optical chip 110, if having the filling of optical adhesive layer 130 between optical filter 150 and the photosensitive area of sensitive chip 110, although being able to satisfy
Light transmittance requirement, if but due to being filled between the curved surface of microlens by glue after, the original convex lens structures quilt of microlens
Optical adhesive layer 130 changes, and can weaken or lose the original spotlight effect of microlens and effect, influence its optical property.
First embodiment
Referring to Fig. 2, a kind of optical chip mould group 20 is present embodiments provided, to improve existing 210 envelope of optical chip
The problems such as filling glue-line 234 will affect optical effect in dress technique.
Optical chip mould group 20 provided in this embodiment is bonded optical chip 210 is carried out glue with optical filter 270
When, glue is fixed by the way that fixing layer 233 is arranged, glue is avoided to be flowed into the photosensitive region 2111 of optical chip 210.Energy
Enough make to form gas chamber 250 between the photosensitive region 2111 of optical chip 210 and optical filter 270, to ensure the light of optical chip 210
Learn performance.
Optical chip mould group 20 provided in this embodiment includes optical filter 270, fixing layer 233, glue-line 234 and optical chip
210.For connecting the optical filter 270 and the optical chip 210, fixing layer 233 is set on optical filter 270 glue-line 234,
The fixing layer 233 is used to limit the mobility of the glue of glue-line 234, and glue is avoided to flow to the photosensitive area of optical chip 210
Domain 2111, to ensure the optical property of optical chip 210.For example, in this present embodiment, fixing layer 233 passes through ink for screen printing shape
At, on the one hand, the surface of ink is more coarse, can adsorb to glue, on the other hand, the fixing layer that ink for screen printing is formed
233 rough surface and have certain thickness, when optical filter 270 is bonded with optical chip 210, fixing layer 233 and optics
Form several small gaps between chip 210, the glue of glue-line 234 can be adsorbed on fixing layer 233 and light due to siphonic effect
Between the chip 210 and two sides of fixing layer 233, so that the mobility of glue is limited, convenient for consolidating glue.It can be
Gas chamber is formed between the photosensitive region 2111 and optical filter 270 of optical chip 210, ensures the optical property of optical chip 210.
Referring to Fig. 3, the optical chip 210 includes first surface 211, first surface 211 is optical chip 210 and filter
The opposite one side of mating plate 270.The first surface 211 includes photosensitive region 2111 and non-photo-sensing region 2112, generally, described
Photosensitive region 2111 forms the center with the first surface 211, and non-photo-sensing region 2112 is formed in the four of photosensitive region 2111
Week.In section Example of the invention, lenticule (micro has been can be set in the photosensitive region 2111 of the optical chip 210
Lens), for optical chip 210, if there are glue, the original convex lens knots of micro lens for the photosensitive region 2111
Structure is filled by glue to be changed, and can be weakened or be lost the original spotlight effect of micro lens and effect, influence micro lens's
Optical property.
The shape of photosensitive region 2111 can be the shape of rule, such as: rectangle, circle etc..It can also be others not
Regular shape determines, the present embodiment does not illustrate excessively with specific reference to micro lens.
Optical filter 270 is Nian Jie with optical chip 210.Optical filter 270 is the optical device for choosing filtering particular light ray,
Optical filter 270 can make light optionally through so that the photosensitive region 2111 for making light reach optical chip 210 carries out phase
The conversion answered.Referring to Fig. 4, the optical filter 270 includes the first plane 271, first plane 271 and the optical chip
210 first surface 211 is opposite.
First plane 271 includes the first area 2711 opposite with photosensitive region 2111 and right with non-photo-sensing region 2112
The second area 2712 answered.In this present embodiment, first area 2711 is formed in the inside of second area 2712, second area
2712 are formed in the surrounding of the first area 2711.
Fixing layer 233 is set within the scope of the predeterminable area of the second area 2712 of the first plane 271.For example, according to light
The form and dimension for learning the photosensitive region 2111 of chip 210, presets a figure in the second area 2712 of the first plane 271
Shape, pre-set figure is located at the outside of first area 2711 corresponding with photosensitive region 2111, then in preset figure
Region forms fixing layer 233.
In this present embodiment, it should be noted that the shape of fixing layer 233 include it is a variety of, the fixing layer 233 can be set
It is placed in two sides or the surrounding of the photosensitive region 2111.For example, please referring to Fig. 5 and Fig. 6, the fixing layer 233 can be set in parallel
The two sides of the photosensitive region 2111 are placed in, the photosensitive region 2111 can also be surround by the fixing layer 233, the fixation
The shape of layer 233 can be continuously, be also possible to discontinuous, and the present embodiment is not construed as limiting this, need to will not influence sense
Light region 2111 works normally.
Preferably, the fixing layer 233 may include one of mask layer or ink layer, but not limited to this.For example, institute
Ink for screen printing can be passed through within the scope of the predeterminable area of the first plane 271 of optical filter 270 by ink material by stating fixing layer 233
Technique is made, and the predeterminable area range refers to the non-sense in the first plane 271 of optical filter 270 with the optical chip 210
The preset range of the corresponding second area 2712 in light region 2112.In this present embodiment, fixing layer 233 can also be by other materials
It is made, the present embodiment is not construed as limiting this.
Referring to Fig. 2, glue-line 234 be set to fixing layer 233 and optical chip 210 non-photo-sensing region 2112 it
Between.Glue-line 234 is used for optical filter 270 is glued Nian Jie with optical chip 210.Glue-line 234 includes the first adhesive surface 232 and second
Adhesive surface 231, the first adhesive surface 232 of glue-line 234 bonding corresponding with fixing layer 233, the second adhesive surface 231 of glue-line 234 with
The non-photo-sensing region 2112 of optical chip 210 is bonded.
It should be noted that the fixing layer of position and the first plane 271 that optical filter 270 is arranged in that glue-line 234 is arranged
233 position is corresponding.For example, the surrounding of first area 2711 in the first plane 271 is arranged in fixing layer 233, then glue-line 234 is answered
When the surrounding for being correspondingly arranged at photosensitive region 2111 on optical chip 210.If the shape of fixing layer 233 is continuous, glue-line
234 shape should also be as being continuous.Similarly, if the shape of fixing layer 233 is discontinuous, the shape of glue-line 234 is also discontinuous.
First adhesive surface 232 of glue-line 234 bonding corresponding with fixing layer 233, fixing layer 233 limit the glue of glue-line 234
Flowing, prevents the glue of glue-line 234 from flowing to the photosensitive region 2111 of optical chip 210, influences the photosensitive area of optical chip 210
The optical property in domain 2111.For example, in this present embodiment, fixing layer 233 is formed using ink for screen printing, on the one hand, the table of ink
Face is more coarse, can adsorb to glue, on the other hand, the rough surface and tool of the fixing layer 233 that ink for screen printing is formed
There is certain thickness, when optical filter 270 is bonded with optical chip 210, is formd between fixing layer 233 and optical chip 210
Several small gaps, the glue of glue-line 234 can be adsorbed between fixing layer 233 and optical chip 210 due to siphonic effect and
The two sides of fixing layer 233, so that the mobility of glue is limited, convenient for consolidating glue.It can be in the photosensitive of optical chip 210
Gas chamber is formed between region 2111 and optical filter 270, ensures the optical property of optical chip 210.
The glue-line 234 can be ultraviolet cured adhesive or epoxy resin, but not limited to this.It can be solid using thermosetting, light
Etc. modes the glue-line 234 is configured.
Second embodiment
The embodiment of the invention provides a kind of 20 production method of optical chip mould group, method provided in an embodiment of the present invention is used
In the optical chip mould group 20 that production first embodiment provides.
20 production method of optical chip mould group is for connecting optical filter 270 and optical chip 210, the optical chip
210 include first surface 211, and the first surface 211 includes photosensitive region 2111 and non-photo-sensing region 2112, the optical filter
270 include first plane 271 opposite with the first surface 211.
Referring to Fig. 7,20 production method of optical chip mould group provided by the invention includes:
Step S10: 211 non-photo-sensing region 2,112 first plane, 271 photosensitive region of first surface, 2111 optical filter 270 is in institute
It states and fixing layer 233 is set in the preset range of first plane 271.
Optical chip 210 includes first surface 211, and first surface 211 includes photosensitive region 2111 and non-photo-sensing region
2112.First plane 271 be the one side opposite with the first surface 211 of optical chip 210, the first plane 271 include with it is photosensitive
The opposite first area 2711 in region 2111 and second area 2712 corresponding with non-photo-sensing region 2112.In the present embodiment
In, first area 2711 forms the inside with second area 2712, and second area 2712 is formed and the first area 2711
Surrounding.Fixing layer 233 is set in the preset range of the first plane 271, is to be set in the second area 2712 of the first plane 271
Set fixing layer 233.The shape of fixing layer 233 can be arranged according to the form and dimension of photosensitive region 2111.
The fixing layer 233 can be led within the scope of the predeterminable area of the first plane 271 of optical filter 270 by ink material
Ink for screen printing technique is crossed to be made, the predeterminable area range refer in the first plane 271 of optical filter 270 with the optical chip
The preset range of the corresponding second area 2712 in 210 non-photo-sensing region 2112.In this present embodiment, fixing layer 233 can also be by
Other materials are made, and the present embodiment is not construed as limiting this.
In this present embodiment, it should be noted that the shape of fixing layer 233 include it is a variety of, the fixing layer 233 can be set
It is placed in two sides or the surrounding of the photosensitive region 2111.For example, the fixing layer 233 can be arranged in parallel in the photosensitive region
The photosensitive region 2111 can also be surround by 2111 two sides, the fixing layer 233, and the shape of the fixing layer 233 can be with
Be it is continuous, be also possible to discontinuous, the present embodiment is not construed as limiting this, need to only will not influence the normal work of photosensitive region 2111
Work.
Step S20: glue-line 234 is set in the first surface 211 position corresponding with the fixing layer 233.
First surface 211 includes photosensitive region 2111 and non-photo-sensing region 2112, the corresponding optical filter 270 of photosensitive region 2111
The first plane 271 first area 2711, the secondth area of the first plane 271 of the corresponding optical filter 270 in non-photo-sensing region 2112
Domain 2712.Fixing layer 233 is set to the second area 2712 of the first plane 271, correspondingly, in the non-sense of first surface 211
Glue-line 234 is arranged in the position corresponding with the fixing layer 233 of light region 2112.
It should be noted that the fixing layer of position and the first plane 271 that optical filter 270 is arranged in that glue-line 234 is arranged
233 position is corresponding.For example, the surrounding of first area 2711 in the first plane 271 is arranged in fixing layer 233, then glue-line 234 is answered
When the surrounding for being correspondingly arranged at photosensitive region 2111 on optical chip 210.If the shape of fixing layer 233 is continuous, glue-line
234 shape should also be as being continuous.Similarly, if the shape of fixing layer 233 is discontinuous, the shape of glue-line 234 is also discontinuous.
Setting glue-line 234 can pass through the modes such as coating, dispensing.The material of glue-line 234 can be epoxy resin, ultraviolet light
Solid glue etc. can also be other glue materials with same or similar function.
Step S30: the glue-line 234 is Nian Jie with the fixing layer 233 to prevent glue-line 234 from flowing.
By the bonding corresponding with fixing layer 233 of glue-line 234, the assembling of optical chip mould group 20 is completed.Glue-line 234 includes first
Adhesive surface 232 and the second adhesive surface 231, the second adhesive surface 231 is Nian Jie with the first surface 211 of optical chip 210, by glue-line
234 the first adhesive surface 232 bonding corresponding with fixing layer 233 is to bond together optical filter 270 and optical chip 210.
Fixing layer 233 can limit the mobility of the glue of glue-line 234, prevent the glue of glue-line 234 optical filter 270 with
It is flowed between optical chip 210, influences the optical property of the photosensitive region 2111 of optical chip 210.After glue-line 234 solidifies,
Glue-line 234 and fixing layer 233 play the role of support between optical filter 270 and optical chip 210, can be in optical filter 270
Gas chamber 250 is formed between the photosensitive region 2111 of optical chip 210, ensures the optical property of optical chip 210.
In conclusion the embodiment of the invention provides a kind of optical chip mould group and preparation method thereof, the optical chip
Mould group includes optical filter, optical chip and supporting element, and the optical chip includes first surface, and the first surface includes photosensitive
Region and non-photo-sensing region, the optical filter include first plane opposite with the first surface, and the supporting element is set to
Between the non-photo-sensing region and first plane of the first surface so that the photosensitive region and the optical filter it
Between form stable gas chamber, to avoid glue that from being filled between optical filter and optical chip by glue, ensure optical chip
Optical property.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of optical chip mould group, which is characterized in that the optical chip mould group include optical filter, optical chip, glue-line and
Fixing layer, the optical chip include first surface, and the first surface includes photosensitive region and non-photo-sensing region, the optical filtering
Piece includes first plane opposite with the first surface, and first plane and the non-photo-sensing region of the first surface pass through
Glue-line bonding, the fixing layer are set to the predeterminable area range of first plane, the position of the glue-line and the fixation
Layer is corresponding, and the fixing layer is Nian Jie with the glue-line to prevent glue-line from flowing.
2. optical chip mould group as described in claim 1, which is characterized in that first plane includes and the photosensitive region
Opposite first area and second area corresponding with the non-photo-sensing region；The fixing layer is set to the second area
Predeterminable area range, the glue-line are set between the fixing layer and the non-photo-sensing region of first plane.
3. optical chip mould group as claimed in claim 2, which is characterized in that the fixing layer is set to the first area
Outside.
4. optical chip mould group as claimed in claim 3, which is characterized in that the fixing layer is continuously arranged.
5. optical chip mould group as claimed in claim 3, which is characterized in that the fixing layer interval setting.
6. optical chip mould group as described in claim 1, which is characterized in that the fixing layer includes in ink layer or mask layer
One kind.
7. optical chip mould group as claimed in claim 3, which is characterized in that the material of the glue-line includes ultraviolet cured adhesive
Or epoxy resin.
8. a kind of optical chip mould group production method, for connecting optical filter and optical chip, the optical chip includes first
Surface, the first surface include photosensitive region and non-photo-sensing region, and the optical filter includes opposite with the first surface
First plane, which is characterized in that the described method includes:
Fixing layer is set in the preset range of first plane；The preset range is that the first plane corresponds to first table
The non-photo-sensing region in face；
In first surface position corresponding with the fixing layer, glue-line is set；
The glue-line is Nian Jie with the fixing layer to prevent glue-line from flowing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811047652.5A CN109192707A (en) | 2018-09-07 | 2018-09-07 | Optical chip mould group and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811047652.5A CN109192707A (en) | 2018-09-07 | 2018-09-07 | Optical chip mould group and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109192707A true CN109192707A (en) | 2019-01-11 |
Family
ID=64915420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811047652.5A Pending CN109192707A (en) | 2018-09-07 | 2018-09-07 | Optical chip mould group and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109192707A (en) |
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