TW201516530A - Display device and assembling method of display device and adhesive - Google Patents

Abstract

The disclosure relates to a display device, an assembling method of the display device, and an adhesive structure. The assembling method of the display device includes providing and disposing a first glue including a center area and a periphery area located around the center area on a base; providing and disposing a shielding layer on the periphery area; providing and disposing a cover plate on the shielding layer and the first glue.

Description

Electronic device, assembly method of electronic device cover plate and bonding structure

The invention relates to an electronic device, an assembly method of an electronic device cover plate and a bonding structure.

Light leakage in the edge region of the electronic device sometimes occurs. If the touch panel of the touch mobile phone is attached to the display module, the light in the display module may be penetrated into the visible area by the edge region, which may cause a problem of light leakage at the edge of the screen when the screen is viewed at a large angle, thereby affecting the display effect.

In view of the above, it is necessary to provide an assembly method, an electronic device, and a bonding structure for an electronic device cover having less light leakage in an edge region.

A method for assembling an electronic device cover comprises: providing a first colloid, the first colloid being disposed on a substrate, the first colloid having an intermediate portion and a peripheral region disposed at an edge of the intermediate portion; providing a light shielding layer Providing a peripheral region of the first colloid corresponding to the first colloid to a side of the first colloid away from the substrate; providing a cover plate disposed on the side of the light shielding layer and the first colloid away from the substrate .

An electronic device includes a base body, a first colloid, a light shielding layer, a cover plate and a second colloid. The first colloid is disposed on the base body, and the first colloid has an intermediate portion and a periphery disposed at an edge of the intermediate portion And the second colloid is disposed on a side of the light shielding layer and the first intermediate portion of the first colloid away from the first substrate, and the cover is disposed on the side of the first colloid. The side of the second colloid is away from the first colloid.

An adhesive structure comprising a first release film, a first adhesive layer and a second release film, the adhesive structure further comprising a light shielding layer and a second gel layer, wherein the first gel layer is disposed on the first release layer On the film, the first colloid layer includes an intermediate portion and a peripheral region disposed at an edge of the intermediate portion, the light shielding layer is disposed on a side of the peripheral region of the first colloid layer away from the first release film, and the second colloid layer is disposed The second release film is disposed on a side of the second colloid layer away from the first colloid layer on an intermediate portion of the first colloid layer and a side of the light shielding layer away from the first colloid.

Compared with the prior art, the method for assembling the cover of the electronic device and the arrangement of the light shielding layer in the bonding structure can block the light leakage in the edge region of the electronic device, and improve the screen of the electronic device using the assembly method or the bonding structure. Display quality.

1 is a schematic side view of a first embodiment of an electronic device of the present invention.

2 is a flow chart of a method of assembling the electronic device cover of FIG. 1.

3 to 8 are schematic views showing the assembly steps of the electronic device cover plate shown in FIG. 1.

9 is a side elevational view of a second embodiment of an electronic device of the present invention.

FIG. 10 is a flow chart of the assembly method of the electronic device cover of FIG. 9.

11 to FIG. 12 are schematic diagrams showing the assembly steps of the electronic device cover plate shown in FIG. 9.

Figure 13 is a side elevational view of a third embodiment of an electronic device of the present invention.

14 is a flow chart of a method of assembling the electronic device cover of FIG.

15 to FIG. 16 are schematic diagrams showing the assembly steps of the electronic device cover plate shown in FIG.

Figure 17 is a side elevational view of the bonded structure of the present invention.

Referring to FIG. 1 , the electronic device 100 can be a liquid crystal display device, a touch device, or the like. The electronic device 100 includes a base 109, a first colloid 107, a light shielding layer 105, and a cover plate 101. The first colloid 107 is disposed on the base 109. The first colloid 107 has an intermediate portion 1071 and a peripheral region 1072 disposed at an edge of the intermediate portion 1071. The light shielding layer 105 corresponds to the peripheral region 1072 and is disposed on a surface of the first colloid 107 away from the substrate 109. The cover plate 101 is disposed on a side of the light shielding layer 105 away from the first colloid 107. In the present embodiment, the cover plate 101 is a transparent cover, such as a cover glass. The substrate 109 may be a touch sensing film or a component such as a liquid crystal panel, and includes a main functional area 1091 and a peripheral wiring area 1092 connected to an edge of the main functional area 1091. The main functional area 1091 corresponds to the first colloid 107. The intermediate region 1071 corresponds to the peripheral region 1072 of the first colloid 107 and the light shielding layer 105. When the base 109 is a touch sensing film, the main functional area 1091 is a touch area. When the substrate 109 is a liquid crystal panel, the main functional area 1091 is a display area.

Referring to FIG. 2 and FIG. 3 , the method for assembling the cover 101 of the electronic device 100 may include the following steps S11 to S13 .

In step S11, a first colloid 107 is provided, and the first colloid 107 is disposed on a substrate 109.

The first colloid 107 may be a photocurable adhesive such as an optical clear resin (OCR) or a solid optical adhesive such as an optical clear adhesive (OCA). The first colloid 107 has an intermediate portion 1071 and a peripheral region 1072 disposed at an edge of the intermediate portion 1071.

Referring to FIG. 4, step S12, a light shielding layer 105 is disposed. The peripheral region 1072 of the first colloid 107 corresponding to the light shielding layer 105 is disposed on a side of the first colloid 107 away from the substrate 109.

The material of the light shielding layer 105 may be a black ink, a white ink or other opaque resin (such as a polyethylene terephthalate (PET) film, preferably a black film).

In the first embodiment, the first colloid 107 is a photocurable adhesive, and the step S12 may specifically include: a step of curing the first colloid 107 of the peripheral region 1072; and coating or printing the light shielding layer 105 on the cured The step on the first colloid 107 of the peripheral region 1072. Specifically, as shown in FIG. 5, in step S12, a light source device 400 can be disposed on the side of the electronic device 100 adjacent to the peripheral region 1072. The light source device 400 emits ultraviolet light to make the peripheral region. The first colloid 107 of 1072 is cured, and a light-shielding layer 105 is applied or printed or attached to the first colloid 107 of the cured peripheral region 1072.

In the second embodiment, the first colloid 107 is a solid optical adhesive. In this case, the light shielding layer 105 is preferably a black light shielding film. The step S12 may specifically include: matching the black light shielding film to the first colloid. The peripheral region 1072 of the 107 is adhered to the surface of the first colloid 107 away from the surface of the substrate 109. Specifically, the shape of the light shielding layer 105 is the same as the shape of the peripheral region 1072, for example, a "mouth" shape, as shown in FIG. The light shielding layer 105 is attached to a protective film 700 before the peripheral region 1072 is disposed. The light shielding layer 105 is disposed on the peripheral region 1072 together with the protective film 700. When the protective film 700 is peeled off, the light shielding layer 105 is attached to the light shielding layer 105. The peripheral region 1072 of the first colloid 107 is on the surface. As shown in Figure 7.

Referring to FIG. 8 , in step S13 , a cover plate 101 is disposed on the side of the light shielding layer 105 and the first colloid 107 away from the base body 109 .

In the first embodiment, the first colloid 107 is a photocurable adhesive, and the cover 101 is a transparent cover. The step S13 further includes a curing step of providing a light source device 400, and the light source device 400 is disposed on the light source device 400. The cover plate 101 is away from the side of the first colloid 107, and the light source device 400 emits ultraviolet light to cure the first colloid 107 located in the intermediate portion 1071, whereby the cover plate 101 is assembled.

In the second embodiment, the first colloid 107 is a solid optical adhesive, and the cover 101 is disposed on a side of the light shielding layer 105 and the first colloid 107 away from the base 109, and passes through the light shielding layer 105. The first colloid 107 of the intermediate portion 1071 of the opening is adhesively fixed to the side of the light shielding layer 105 away from the first colloid 107, whereby the cover 101 is assembled.

The arrangement of the light shielding layer 105 in the method of assembling the cover 101 of the electronic device 100 can block light leakage in the edge region of the electronic device 100 and improve the screen display quality of the electronic device 100 using the above assembly method.

There are other modified embodiments of the present invention. Referring to FIG. 9 , the electronic device 200 includes a base 209 , a first colloid 207 , a light shielding layer 205 , a second colloid 203 , and a cover 201 . The first colloid 207 is disposed on the base 209. The first colloid 207 has an intermediate portion 2071 and a peripheral region 2072 disposed at an edge of the intermediate portion 2071. The light shielding layer 205 corresponds to the peripheral region 2072 disposed on the surface of the first colloid 207 away from the base 209. The second colloid 203 is disposed on the side of the light shielding layer 205 and the first colloid 207 away from the first substrate 209. The cover plate 201 is disposed on a side of the second colloid 203 away from the first colloid 207.

Referring to FIG. 10, the method of assembling the cover 201 of the electronic device 200 may include the following steps S21 to S24. Steps S21 to S22 are the same as steps S11 to S12 in the first and second embodiments, and are not described again.

Referring to FIG. 11, step S23, a second colloid 203 is disposed, and the second colloid 203 is disposed on a side of the light shielding layer 205 and the intermediate portion 207 of the first colloid 207 away from the base 209. In the third embodiment, The second colloid 203 is a photocurable adhesive. The step S23 may specifically include: disposing the second colloid 203 on the light shielding layer 205 and the intermediate portion 2071 of the first colloid 207. Preferably, the second colloid 203 and the first colloid 207 are selected from photocurable adhesives of the same material.

In a fourth embodiment, the second colloid 203 is a solid optical glue. The second colloid 203 is attached to the side of the intermediate portion 2071 of the first colloid 207 and away from the base 209. Preferably, the second colloid 203 and the first colloid 207 are selected from a colloid of the same material.

Referring to FIG. 12, step S24, a cover 201 is disposed on the side of the second colloid 203 away from the first colloid 207.

Specifically, in the third embodiment, as shown in FIG. 12, in step S24, a light source device 500 can be disposed, and the light source device 500 is disposed on a side of the cover plate 201 of the electronic device 200 facing away from the second colloid 203. The light source device 500 emits ultraviolet light to cure the first colloid 203 and the first colloid 207 of the intermediate portion 2071. After the curing, the cover 201 is attached to the second colloid 203, and the cover 201 is assembled.

In the fourth embodiment, the second colloid 203 is a solid optical adhesive, and the cover 201 is disposed on a side of the second colloid 203 away from the first colloid 207, and the cover 201 is adhesively fixed to the second The cover 203 is assembled on the colloid 203.

Referring to FIG. 13 , the electronic device 300 includes a base 309 , a first colloid 307 , a light shielding layer 305 , a second colloid 303 , and a cover plate 301 . The first colloid 307 is disposed on the base 309. The first colloid 307 has an intermediate portion 3071 and a peripheral region 3072 disposed at an edge of the intermediate portion 3071. The light shielding layer 305 corresponds to the peripheral region 3072 disposed on the surface of the first colloid 307 away from the base 309. The second colloid 303 is disposed on a side of the light shielding layer 305 away from the first base 309. The cover plate 301 is disposed on an intermediate portion 3071 of the second colloid 303 away from the first colloid 307 and the first colloid 307.

Referring to FIG. 14 , the method of assembling the cover 301 of the electronic device 300 may include the following steps S31 to S34 . Steps S31 to S32 are the same as steps S11 to S12 in the first and second embodiments, and are not described again.

Referring to FIG. 15, step S33, a second colloid 303 is disposed on the side of the light shielding layer 305 away from the base 309.

In a fifth embodiment, the second colloid 303 is a photocurable adhesive. Preferably, the second colloid 303 and the first colloid 307 are selected from the same material as the photocurable adhesive.

In a sixth embodiment, the second colloid 303 is a solid optical glue. The solid optical adhesive can be disposed in a manner similar to that of the black light-shielding film in the second embodiment, that is, the second colloid 303 having the same shape as the light-shielding layer 305 is attached to the release film, and the second colloid 303 is attached to the light-shielding film. After the layer 305 is peeled off from the release film, the second gel 303 is attached to the light shielding layer 305.

Referring to FIG. 16 and step S34, a cover plate 301 is disposed on the side of the second colloid 303 away from the first colloid 307 and the intermediate portion 3071 of the first colloid 307.

Specifically, in the fifth embodiment, as shown in FIG. 16, in step S34, a light source device 600 can be disposed, and the light source device 600 is disposed on a side of the cover plate 301 of the electronic device 300 facing away from the second colloid 303. The light source device 600 emits ultraviolet light to cure the second colloid 303. When the first colloid 307 is a photocurable adhesive, the ultraviolet light cures the intermediate portion 3071 of the first colloid 307. After the curing, the cover plate 301 is attached to the intermediate portion 3071 of the second colloid 303 and the first colloid 307, so that the cover plate 201 is assembled.

In the sixth embodiment, the second colloid 303 is a solid optical adhesive, and the cover plate 301 is disposed on a side of the second colloid 303 away from the first colloid 307, and the cover plate 301 is adhesively fixed to the second The colloid 303 and the intermediate portion 3071 of the first colloid 307 are placed. When the first colloid 307 is a photocurable adhesive, the step of curing the intermediate portion 3071 of the first colloid 307 by the light source device 600 is increased, whereby the cover plate 301 is assembled.

The invention also provides an adhesive structure for assembling a cover plate to an electronic device. Specifically, referring to FIG. 17 , the bonding structure 800 includes a first release film 809 , a first colloid layer 807 , a light shielding layer 805 , a second colloid layer 803 , and a second release film 801 . The first colloid layer 807 is disposed on the first release film 809 and includes an intermediate portion 8071 and a peripheral region 8072 disposed at an edge of the intermediate portion 8071. The light shielding layer 805 is disposed on a side of the peripheral region 8072 of the first colloid layer 807 away from the first release film 809. The second colloid layer 803 is disposed on an intermediate portion 8071 of the first colloid layer 807 and a side of the light shielding layer 805 away from the first colloid layer 807. The second release film 801 is disposed on a side of the second colloid layer 803 that is away from the first colloid layer 807. The material of the light shielding layer 805 may be a black ink, a white ink or other opaque resin (such as a polyethylene terephthalate (PET) film, preferably a black film). The first colloid layer 807 and the second colloid layer 803 are solid optical adhesives such as (optical clear adhesive (OCA)). The size of the intermediate portion 8071 and the peripheral region 8072 may be determined according to the size of the bases 109, 209, 309 and the size of the edge regions of the electronic devices 100, 200, 300 to which the bonding structure 800 is applied.

The step of assembling the bonding structure 800 for the cover plates 101, 201, 301 of the electronic device 100, 200, 300 is as follows: the first release film 809 is peeled off, and the first colloid layer 807 is away from the light shielding. The surface of the layer 805 is attached to the substrates 109, 209, 309 of the electronic devices 100, 200, 300. The second release film 801 is peeled off, and the cover plates 101, 201, and 301 are disposed on the side of the second colloid layer 803 away from the bases 109, 209, and 309, whereby the cover plates 101, 201, and 301 are assembled. .

Since the bonding structure 800 itself has a light shielding layer 805, when the cover plates 101, 201, and 301 are attached to the bases 109, 209, and 309 by the bonding structure 800, the light shielding layer 805 corresponds to the bases 109, 209, and 309. The peripheral wiring area 1092 does not require additional bit-shifting operations, and the manufacturing steps are relatively simple.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

400, 500, 600‧‧‧ light source devices

100, 200, 300‧‧‧ electronic devices

101, 201, 301‧ ‧ cover

103, 203, 303‧‧‧ second colloid

105, 205, 305‧‧ ‧ shading layer

107, 207, 307‧‧‧ first colloid

109, 209, 309‧‧‧ base

1071, 2071, 3071, 8071‧‧‧ intermediate areas

1072, 2072, 3072, 8072‧‧‧ surrounding wiring area

1091‧‧‧Main function area

1092‧‧‧Surrounded wiring area

700‧‧‧Protective film

800‧‧‧bonding structure

801‧‧‧Separate release film

803‧‧‧Second colloid layer

805‧‧‧Lighting layer

807‧‧‧First colloid layer

809‧‧‧First release film

no

100‧‧‧Electronic devices

101‧‧‧ cover

105‧‧‧Lighting layer

107‧‧‧First colloid

109‧‧‧Base

1071‧‧‧Intermediate area

1072‧‧‧ peripheral wiring area

1091‧‧‧Main function area

1092‧‧‧Surrounded wiring area

Claims (16)

A method for assembling an electronic device cover comprises: providing a first colloid, the first colloid being disposed on a substrate, the first colloid having an intermediate portion and a peripheral region disposed at an edge of the intermediate portion; providing a light shielding layer Providing a peripheral region of the first colloid corresponding to the first colloid to a side of the first colloid away from the substrate; providing a cover plate disposed on the side of the light shielding layer and the first colloid away from the substrate . The method of assembling an electronic device cover according to claim 1, wherein the base body comprises a main functional area and a peripheral wiring area connected to an edge of the main functional area, the main functional area corresponding to an intermediate area of the first colloid, The peripheral wiring area corresponds to the peripheral area of the first colloid and the light shielding layer. The method of assembling an electronic device cover according to claim 2, wherein the substrate is a touch sensing film, and the main functional area is a touch area. The method of assembling an electronic device cover according to claim 2, wherein the substrate is a liquid crystal panel, and the main functional area is a display area. The method of assembling an electronic device cover according to claim 1, wherein the first colloid is a photocurable adhesive, and the light shielding layer is disposed on the first colloid corresponding to the peripheral region of the first colloid. The step of moving away from the substrate side includes the steps of: curing the first colloid of the peripheral region; and coating or printing or attaching the light shielding layer to the first colloid of the cured peripheral region. The method of assembling an electronic device cover according to claim 1 or 4, wherein the shape of the light shielding layer is the same as the shape of the peripheral region, and the light shielding layer is attached to a protective film before the peripheral region is disposed, the light shielding layer is the same The protective film is disposed on the peripheral region together, and the light shielding layer is attached to the peripheral region of the first gel when the protective film is peeled off. The method of assembling an electronic device cover according to claim 1 or 4, wherein the first colloid is a photocurable adhesive, the cover is a transparent cover, and the cover is provided, and the cover is disposed on the light shielding layer And the step of the first colloid away from the substrate further includes a curing step of providing a light source device disposed on a side of the cover plate away from the first colloid, the light source device emitting light so as to be located The first colloid of the intermediate region solidifies. The method of assembling an electronic device cover according to claim 6, wherein a cover is provided, and the step of providing the cover on the side of the light shielding layer and the first colloid away from the base further comprises: providing a second a colloid, the second colloid is disposed on a side of the light shielding layer away from the substrate; and a cover plate is disposed on the side of the second colloid away from the substrate or the first colloid and the second colloid are away from the substrate One side. The method of assembling an electronic device cover according to claim 8, wherein the second colloid is disposed on the light shielding layer; the first colloid and the second colloid are photocurable adhesive, and the cover is disposed in an intermediate portion of the first colloid And the second colloid, the intermediate portion of the first colloid and the second colloid are cured. The method of assembling an electronic device cover according to claim 8, wherein the second colloid is disposed on the light shielding layer; the second colloid is a photocurable adhesive, the first colloid is a solid colloid, and the cover is disposed on the second colloid and The second colloid is cured on the intermediate portion of the first colloid. The method of assembling an electronic device cover according to claim 8, wherein the second colloid is disposed on the light shielding layer; the second colloid and the first colloid are solid optical adhesive, and the cover is disposed in an intermediate portion of the first colloid And on the second gel. The method of assembling an electronic device cover according to claim 8, wherein the second colloid is disposed on the middle portion of the light shielding layer and the first colloid; the first colloid and the second colloid are photocurable adhesive, and the cover is disposed On the second colloid, the intermediate portion of the first colloid and the second colloid are cured. The method of assembling an electronic device cover according to claim 8, wherein the second colloid is disposed on the middle portion of the light shielding layer and the first colloid; the second colloid is a photocurable adhesive, and the first colloid is a solid colloid, and the cover is a solid colloid. The plate is disposed on the second gel to cure the second gel. The method of assembling an electronic device cover according to claim 8, wherein the second colloid is disposed on the middle portion of the light shielding layer and the first colloid; the second colloid and the first colloid are solid optical glue, and the cover is disposed On the second gel. An electronic device, comprising: a base body, a first colloid, a light shielding layer, a cover plate and a second colloid, wherein the first colloid is disposed on the base body, the first colloid has an intermediate region and is disposed at an edge of the intermediate region The cover layer is disposed on a side of the first colloid away from the base body, and the second colloid is disposed on a side of the light shielding layer and the first intermediate portion of the first colloid away from the first base body, the cover The plate is disposed on a side of the second colloid away from the first colloid. An adhesive structure comprising a first release film, a first adhesive layer and a second release film, wherein the adhesive structure further comprises a light shielding layer and a second gel layer, wherein the first gel layer is disposed on the first On the release film, the first colloid layer includes an intermediate portion and a peripheral region disposed at an edge of the intermediate portion, the light shielding layer is disposed on a side of the peripheral region of the first colloid layer away from the first release film, the second colloid The layer is disposed on an intermediate portion of the first colloid layer and away from the first colloid layer, and the second release film is disposed on a side of the second colloid layer away from the first colloid layer.