TW201521195A - Active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof - Google Patents

Active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof Download PDF

Info

Publication number
TW201521195A
TW201521195A TW102147110A TW102147110A TW201521195A TW 201521195 A TW201521195 A TW 201521195A TW 102147110 A TW102147110 A TW 102147110A TW 102147110 A TW102147110 A TW 102147110A TW 201521195 A TW201521195 A TW 201521195A
Authority
TW
Taiwan
Prior art keywords
cover glass
amoled
ocr
oca optical
module structure
Prior art date
Application number
TW102147110A
Other languages
Chinese (zh)
Inventor
jun-jun Chen
Original Assignee
Everdisplay Optronics Shanghai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everdisplay Optronics Shanghai Ltd filed Critical Everdisplay Optronics Shanghai Ltd
Publication of TW201521195A publication Critical patent/TW201521195A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

An active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof, the module structure is orderly provided with a display module, an optically clear adhesive layer, an ink layer and a cover lens. The ink layer is disposed at a back end of the cover lens so as to form an enclosed space. The module structure further comprises an optical clear resin layer that is filled in the enclosed space, and the optically clear adhesive layer glues the back of the cover lens and the display module together, so as to reduce the thickness of the AMOLED module structure effectively.

Description

一種AMOLED模組結構及其組裝方法 AMOLED module structure and assembly method thereof

本發明涉及一種AMOLED顯示技術領域,尤指一種AMOLED模組結構及其組裝方法。 The invention relates to the field of AMOLED display technology, in particular to an AMOLED module structure and an assembly method thereof.

AMOLED(Active Matrix Organic Light Emitting Diode,主動式有機發光二極體面板)相比傳統的液晶面板,具有反應速度快、對比度高、視角廣等特點。另外AMOLED還具有自發光的特色,不需使用背光板,因此比傳統的液晶面板更輕薄,還可以省去背光模組的成本。多方面的優勢使其具有良好的應用前景。 Compared with the conventional liquid crystal panel, the AMOLED (Active Matrix Organic Light Emitting Diode) has the characteristics of high response speed, high contrast, and wide viewing angle. In addition, AMOLED also has the characteristics of self-illumination, no need to use the backlight board, so it is lighter and thinner than the traditional liquid crystal panel, and the cost of the backlight module can be omitted. The advantages of many aspects make it have a good application prospect.

現有技術中封裝AMOLED模組時一般採用OCA(Optically Clear Adhesive)光學膠,而不能使用OCR(Optical Clear Resin)水膠,因為OCR水膠需要使用UV(Ultraviolet Rays,紫外光線)固化,但是AMOLED的顯示模組中的發光材料對UV光敏感,如果採用UV照射,會導致發光材料失效,造成顯示幕不亮。所以,在AMOLED模組封裝時不採用OCR水膠。當採用OCA光學膠將顯示模組(Display Moduel)與蓋板玻璃(Cover Lens)全貼合時,由於OCA光學膠對蓋板玻璃上的油墨厚度的吸收率有限,致使需使用較厚的OCA膠,最終導 致AMOLED模組厚度增加。 In the prior art, an OCA (Optically Clear Adhesive) optical adhesive is generally used for packaging an AMOLED module, and an OCR (Optical Clear Resin) water gel cannot be used because an OCR water gel needs to be cured using UV (Ultraviolet Rays), but the AMOLED The luminescent material in the display module is sensitive to UV light. If UV irradiation is used, the luminescent material will be ineffective and the display screen will not be bright. Therefore, OCR water gel is not used in the packaging of AMOLED modules. When the display module (Display Moduel) and the cover glass (Cover Lens) are fully bonded by OCA optical glue, the OCA optical adhesive has a limited absorption rate of the ink on the cover glass, so that a thick OCA is required. Glue, final guide The thickness of the AMOLED module is increased.

第1圖顯示了現有技術中採用OCA光學膠進行全貼合的爆炸圖,第2圖顯示了現有技術中採用OCA光學膠進行全貼合的狀態示意圖。如第1圖和第2圖所示,蓋板玻璃10的背面貼合有油墨層20,油墨層20設於蓋板玻璃10的端部與蓋板玻璃10圍合形成有一圍合空間101,採用OCA光學膠層30將蓋板玻璃10與顯示模組40貼合在一起時,OCA光學膠層30需將圍合空間101填平,當選用的油墨層20厚度為30微米時,需要採用0.3毫米厚度以上的OCA光學膠層30才能處理好貼合過程中的氣泡問題。所以採用OCA光學膠進行全貼合會導致AMOLED模組厚度增加。 Fig. 1 shows an exploded view of the prior art using OCA optical glue for full bonding, and Fig. 2 is a schematic view showing the state of full bonding using OCA optical glue in the prior art. As shown in FIG. 1 and FIG. 2 , an ink layer 20 is adhered to the back surface of the cover glass 10 , and an ink layer 20 is disposed at an end of the cover glass 10 and encloses the cover glass 10 to form a surrounding space 101 . When the cover glass 10 and the display module 40 are bonded together by the OCA optical adhesive layer 30, the OCA optical adhesive layer 30 needs to fill the enclosed space 101. When the thickness of the selected ink layer 20 is 30 micrometers, it is necessary to adopt The OCA optical adhesive layer 30 of 0.3 mm or more thickness can handle the bubble problem in the bonding process. Therefore, full bonding using OCA optical glue will result in an increase in the thickness of the AMOLED module.

本發明的目的在於克服現有技術的缺陷,提供一種AMOLED模組結構及其組裝方法,解決OCA光學膠帶來的AMOLED模組增厚的問題。 The object of the present invention is to overcome the defects of the prior art, to provide an AMOLED module structure and an assembly method thereof, and to solve the problem of thickening of an AMOLED module from an OCA optical tape.

達成上述目的的技術手段是:本發明一種AMOLED模組結構,包括依次設置的顯示模組、OCA光學膠層、油墨層以及蓋板玻璃,該油墨層設置於該蓋板玻璃背面的端部,與該蓋板玻璃圍合形成有一圍合空間;該AMOLED模組結構還包括一OCR水膠層,該OCR水膠層填覆於該圍合空間內,該OCA光學膠層將該蓋板玻璃的背面與該顯示模組粘合在一起。 The technical means for achieving the above object is: an AMOLED module structure comprising a display module, an OCA optical adhesive layer, an ink layer and a cover glass disposed in sequence, the ink layer being disposed at an end of the back surface of the cover glass, Forming an enclosure space with the cover glass; the AMOLED module structure further includes an OCR water glue layer, the OCR water glue layer is filled in the enclosure space, and the OCA optical adhesive layer covers the cover glass The back side is bonded to the display module.

採用OCR水膠填平蓋板玻璃上的圍合空間,可以使得後續使用的OCA光學膠層減薄,僅需使用0.025毫米厚的OCA光學膠就可 以很好的貼合蓋板玻璃與顯示模組,從而實現AMOLED模組結構的厚度減薄效果。 The OCR water gel fills the enclosing space on the cover glass, which can make the subsequent OCA optical adhesive layer thinner, only need to use 0.025 mm thick OCA optical adhesive. The cover glass and the display module are well adhered to realize the thickness thinning effect of the AMOLED module structure.

本發明一種AMOLED模組結構的進一步改進在於,該OCA光學膠的厚度為0.025毫米至0.1毫米。 A further improvement of the structure of an AMOLED module of the present invention is that the thickness of the OCA optical adhesive is from 0.025 mm to 0.1 mm.

本發明一種AMOLED模組結構的組裝方法,包括如下步驟:採用OCR水膠將蓋板玻璃與設置於該蓋板玻璃端部的油墨層之間形成的圍合空間填滿,使得該蓋板玻璃的背面平整;採用OCA光學膠將該蓋板玻璃的背面與顯示模組粘合在一起。 The method for assembling an AMOLED module structure comprises the steps of: filling the enclosing space formed between the cover glass and the ink layer disposed at the end of the cover glass with OCR water glue, so that the cover glass The back side is flat; the back side of the cover glass is bonded to the display module using OCA optical glue.

本發明一種AMOLED模組結構的組裝方法的進一步改進在於,該OCA光學膠的厚度為0.025毫米至0.1毫米。 A further improvement of the assembly method of the AMOLED module structure of the present invention is that the OCA optical adhesive has a thickness of 0.025 mm to 0.1 mm.

《習知技術》 "Knowledge Technology"

10‧‧‧蓋板玻璃 10‧‧‧ Cover glass

101‧‧‧圍合空間 101‧‧‧Enclosed space

20‧‧‧油墨層 20‧‧‧Ink layer

30‧‧‧OCA光學膠層 30‧‧‧OCA optical adhesive layer

40‧‧‧顯示模組 40‧‧‧Display module

《本發明》 "this invention"

10‧‧‧蓋板玻璃 10‧‧‧ Cover glass

20‧‧‧油墨層 20‧‧‧Ink layer

30‧‧‧OCA光學膠層 30‧‧‧OCA optical adhesive layer

40‧‧‧顯示模組 40‧‧‧Display module

50‧‧‧OCR水膠層 50‧‧‧OCR water layer

第1圖 為現有技術中採用OCA光學膠進行全貼合的爆炸圖;第2圖 為現有技術中採用OCA光學膠進行全貼合的狀態示意圖;第3圖 為本發明一種AMOLED模組結構的爆炸圖;第4圖 為本發明一種AMOLED模組結構的示意圖。 1 is an exploded view of the prior art using OCA optical glue for full bonding; FIG. 2 is a schematic view showing a state in which the OCA optical glue is fully bonded in the prior art; and FIG. 3 is a structure of an AMOLED module according to the present invention; Exploded view; Fig. 4 is a schematic view showing the structure of an AMOLED module according to the present invention.

為使貴審查委員對本發明之目的、特徵及功效能夠有更進一步之瞭解與認識,以下茲請配合【圖式簡單說明】詳述如後:請參閱第3圖所示,為本發明一種AMOLED模組結構的 爆炸圖。本發明的目的是解決AMOLED模組封裝過程中的增厚問題,因在全貼合過程中,OCA光學膠需填平蓋板玻璃上形成的圍合空間,使得需要使用的OCA光學膠層變厚,進而增加了AMOLED模組的厚度。下面結合附圖對本發明一種AMOLED模組結構進行說明。 In order to enable the review committee to have a better understanding and understanding of the purpose, features and effects of the present invention, please refer to the following [detailed description of the drawings] as follows: Please refer to FIG. 3, which is an AMOLED of the present invention. Modular structure Explosion map. The purpose of the invention is to solve the problem of thickening in the packaging process of the AMOLED module, because in the full bonding process, the OCA optical glue needs to fill the enclosing space formed on the cover glass, so that the OCA optical adhesive layer to be used is changed. Thick, which in turn increases the thickness of the AMOLED module. The structure of an AMOLED module of the present invention will be described below with reference to the accompanying drawings.

如第3圖和第4圖所示,本發明一種AMOLED模組結構包括一蓋板玻璃10、油墨層20、OCR水膠層50、OCA光學膠層30以及顯示模組40。 As shown in FIG. 3 and FIG. 4, an AMOLED module structure of the present invention includes a cover glass 10, an ink layer 20, an OCR water layer 50, an OCA optical adhesive layer 30, and a display module 40.

油墨層20設置於蓋板玻璃10背面的端部,即蓋板玻璃10背面的四周邊緣處,與蓋板玻璃10形成有一圍合空間,OCR水膠層50置於油墨層20與蓋板玻璃10之間形成的圍合空間內,並填平該圍合空間,使得蓋板玻璃10的背面平整。該OCR水膠填平過程與蓋板玻璃10和油墨層20在同一製程中完成,可選擇在製作蓋板玻璃的廠商處完成OCR水膠的填平操作,因OCR水膠需用UV固化,而UV會對AMOLED的顯示模組40有破壞性影響,所以上述OCR水膠固化過程需先行完成,避免UV對顯示模組40的影響。接著,用OCA光學膠將顯示模組40粘結於OCR水膠層50和油墨層20之上即蓋板玻璃10的背面,形成了OCA光學膠層30置於顯示模組40與OCR水膠層50之間的結構。 The ink layer 20 is disposed at the end of the back surface of the cover glass 10, that is, at the peripheral edge of the back surface of the cover glass 10, and forms a space with the cover glass 10, and the OCR water layer 50 is placed on the ink layer 20 and the cover glass. The enclosed space formed between the 10 is filled with the enclosed space so that the back surface of the cover glass 10 is flat. The OCR water-filling process is completed in the same process as the cover glass 10 and the ink layer 20. The OCR water-filling operation can be completed at the manufacturer of the cover glass, and the OCR water-based glue needs to be cured by UV. The UV will have a destructive effect on the display module 40 of the AMOLED. Therefore, the above OCR water gel curing process needs to be completed first to avoid the influence of the UV on the display module 40. Next, the display module 40 is bonded to the OCR water-based layer 50 and the ink layer 20, that is, the back surface of the cover glass 10 by OCA optical glue, and the OCA optical adhesive layer 30 is formed on the display module 40 and the OCR water gel. The structure between layers 50.

因採用OCR水膠層50填平油墨層20與蓋板玻璃10之間形成的圍合空間,可以使得蓋板玻璃10與顯示模組40進行全貼合時,使用超薄的OCA光學膠即可。因為蓋板玻璃10的背面已經平整,用OCA光學膠粘合時,不會產生氣泡問題,所以OCA光學膠可以做到最薄。與之相對地,在現有技術中,如果採用OCA光學膠直接進行全貼合, 其填充蓋板玻璃10背面的圍合空間時,會因該斷差產生氣泡,該氣泡會影響AMOLED模組結構的粘結度,所以為排除產生的氣泡,需要塗覆較厚的OCA光學膠。當油墨層20的厚度為0.03毫米時,至少需要0.3毫米厚的OCA光學膠。 By using the OCR water layer 50 to fill the enclosing space formed between the ink layer 20 and the cover glass 10, the cover glass 10 and the display module 40 can be fully bonded, and the ultra-thin OCA optical glue is used. can. Since the back surface of the cover glass 10 has been flattened, there is no bubble problem when bonded with OCA optical glue, so the OCA optical glue can be made the thinnest. In contrast, in the prior art, if the OCA optical glue is used for direct fitting, When filling the enclosed space on the back surface of the cover glass 10, bubbles will be generated due to the gap, which will affect the adhesion of the AMOLED module structure. Therefore, in order to eliminate the generated bubbles, it is necessary to apply a thick OCA optical adhesive. . When the thickness of the ink layer 20 is 0.03 mm, at least 0.3 mm thick OCA optical glue is required.

油墨層20與蓋板玻璃10之間形成的圍合空間的厚度為0.03毫米,即油墨層20的厚度。採用OCR水膠填平該圍合空間,OCR水膠固化後形成的OCR水膠層50的厚度也為0.03毫米。接著僅需採用厚度為0.025毫米的OCA光學膠即可將蓋板玻璃10與顯示模組40粘合在一起。相比現有技術中至少需要0.3毫米厚的OCA光學膠,本發明所採用的總厚度為OCR水膠層50與OCA光學膠層30的厚度之和,即0.055毫米,與現有技術相比本發明中AMOLED模組總厚度可以減薄0.245毫米。 The thickness of the enclosed space formed between the ink layer 20 and the cover glass 10 is 0.03 mm, that is, the thickness of the ink layer 20. The OCR water gel is used to fill the enclosed space, and the thickness of the OCR water layer 50 formed by curing the OCR water gel is also 0.03 mm. Then, the cover glass 10 and the display module 40 can be bonded together by using an OCA optical glue having a thickness of 0.025 mm. Compared with the prior art, at least 0.3 mm thick OCA optical glue is required, the total thickness used in the present invention is the sum of the thicknesses of the OCR water subbing layer 50 and the OCA optical adhesive layer 30, that is, 0.055 mm, compared with the prior art. The total thickness of the AMOLED module can be reduced by 0.245 mm.

OCA光學膠的厚度可以為0.025毫米至0.1毫米,最薄為0.025毫米。 The OCA optical adhesive may have a thickness of 0.025 mm to 0.1 mm and a minimum thickness of 0.025 mm.

下面對本發明一種AMOLED模組結構的組裝方法進行說明:首先,採用OCR水膠將蓋板玻璃10與設置於蓋板玻璃10端部的油墨層20之間形成的圍合空間填滿,使得該蓋板玻璃的背面平整。在本實施例中,油墨層20設置於蓋板玻璃10背面的端部,即蓋板玻璃10背面的四周邊緣處,並與蓋板玻璃10形成有一圍合空間。在這裡,油墨層20的厚度決定了該圍合空間的厚度。在實際應用中,OCR水膠的填平過程包括:將OCR水膠填覆於該圍合空間;用UV將OCR水膠固化,形成OCR水膠層50,該OCR水膠層50可與蓋板玻璃10背面的油 墨層20齊平,從而使得蓋板玻璃10的背面平整。上述步驟可在蓋板玻璃的生產廠商處完成。 The following is an explanation of the assembly method of the AMOLED module structure of the present invention. First, the enclosing space formed between the cover glass 10 and the ink layer 20 disposed at the end of the cover glass 10 is filled with OCR water glue, so that the The back side of the cover glass is flat. In the present embodiment, the ink layer 20 is disposed at the end of the back surface of the cover glass 10, that is, at the peripheral edge of the back surface of the cover glass 10, and forms an enclosed space with the cover glass 10. Here, the thickness of the ink layer 20 determines the thickness of the enclosed space. In practical applications, the filling process of the OCR water gel comprises: filling the OCR water gel in the enclosure space; curing the OCR water gel with UV to form an OCR water glue layer 50, the OCR water glue layer 50 and the cover Oil on the back of the plate glass 10 The ink layer 20 is flush so that the back surface of the cover glass 10 is flat. The above steps can be performed at the manufacturer of the cover glass.

然後,再用OCA光學膠將蓋板玻璃10的背面與顯示模組40粘結在一起。 Then, the back surface of the cover glass 10 is bonded to the display module 40 by OCA optical glue.

這樣就完成了AMOLED模組結構的全貼合封裝。因採用OCR水膠填平油墨層20與蓋板玻璃10之間形成的圍合空間,可以使得蓋板玻璃10與顯示模組40進行全貼合時,使用超薄的OCA光學膠即可,有效地減小了AMOLED模組總厚度。因OCR水膠用UV固化在顯示模組安裝之前已經完成,可以避免UV對顯示模組的破壞性影響。 This completes the full-fit package of the AMOLED module structure. By using the OCR water gel to fill the enclosing space formed between the ink layer 20 and the cover glass 10, the cover glass 10 and the display module 40 can be fully bonded, and the ultra-thin OCA optical glue can be used. The total thickness of the AMOLED module is effectively reduced. Since the OCR water gel is cured by UV curing before the display module is installed, the damaging effect of the UV on the display module can be avoided.

本發明的有益效果為:採用OCR水膠填平蓋板玻璃上的圍合空間,可有效地減薄AMOLED模組的總厚度,提高產品的競爭力。 The invention has the beneficial effects that the OCR water glue is used to fill the enclosing space on the cover glass, which can effectively reduce the total thickness of the AMOLED module and improve the competitiveness of the product.

接著,將OCR水膠用UV先行固化在蓋板玻璃上,後續在貼合顯示模組,可以避免AMOLED中的顯示模組對UV光敏感的特性,避免產生因UV光造成的顯示模組中發光材料失效的現象。再有,可將OCR水膠的固化轉嫁於蓋板玻璃的廠商提供,可以減少OCR固化設備的投入成本。 Then, the OCR water gel is first cured on the cover glass by UV, and then the display module is attached, which can avoid the characteristic of the display module in the AMOLED being sensitive to UV light, and avoiding the display module caused by the UV light. The phenomenon of failure of luminescent materials. Furthermore, the manufacturer of the OCR water gel can be transferred to the cover glass to reduce the input cost of the OCR curing equipment.

以上結合附圖實施例對本發明進行了詳細說明,本領域中普通技術人員可根據上述說明對本發明做出種種變化例。因而,實施例中的某些細節不應構成對本發明的限定,本發明將以所附申請專利範圍界定的範圍作為本發明的保護範圍。 The present invention has been described in detail above with reference to the embodiments of the drawings, and various modifications of the invention can be made by those skilled in the art in light of the above description. Therefore, some of the details of the embodiments should not be construed as limiting the scope of the invention, which is defined by the scope of the appended claims.

10‧‧‧蓋板玻璃 10‧‧‧ Cover glass

20‧‧‧油墨層 20‧‧‧Ink layer

30‧‧‧OCA光學膠層 30‧‧‧OCA optical adhesive layer

40‧‧‧顯示模組 40‧‧‧Display module

50‧‧‧OCR水膠層 50‧‧‧OCR water layer

Claims (5)

一種AMOLED模組結構,包括依次設置的顯示模組、OCA光學膠層、油墨層以及蓋板玻璃,該油墨層設置於該蓋板玻璃背面的端部,與該蓋板玻璃圍合形成有一圍合空間;其特徵在於,該AMOLED模組結構還包括一OCR水膠層,該OCR水膠層填覆於該圍合空間內,該OCA光學膠層將該蓋板玻璃的背面與顯示模組粘合在一起。 An AMOLED module structure comprises a display module arranged in sequence, an OCA optical adhesive layer, an ink layer and a cover glass. The ink layer is disposed at an end of the back surface of the cover glass, and is surrounded by the cover glass to form a circumference. The space of the AMOLED module further includes an OCR water layer, the OCR water layer is filled in the enclosure space, and the back surface of the cover glass and the display module are formed by the OCA optical adhesive layer. Bonded together. 如申請專利範圍第1項所述的一種AMOLED模組結構,其特徵在於,該OCA光學膠的厚度為0.025毫米至0.1毫米。 An AMOLED module structure according to claim 1, wherein the OCA optical adhesive has a thickness of 0.025 mm to 0.1 mm. 一種AMOLED模組結構的組裝方法,該方法包括如下步驟:採用OCR水膠將蓋板玻璃與設置於該蓋板玻璃端部的油墨層之間形成的圍合空間填滿,使得該蓋板玻璃的背面平整;採用OCA光學膠將該蓋板玻璃的背面與顯示模組粘合在一起。 A method for assembling an AMOLED module structure, the method comprising the steps of: filling an enclosing space formed between a cover glass and an ink layer disposed at an end of the cover glass with OCR water glue, so that the cover glass The back side is flat; the back side of the cover glass is bonded to the display module using OCA optical glue. 如申請專利範圍第3項所述的一種AMOLED模組結構的組裝方法,其特徵在於:該OCR水膠填覆於該圍合空間內後,用UV進行固化,形成OCR水膠層。 The method for assembling an AMOLED module structure according to claim 3, wherein the OCR water gel is filled in the enclosure space and then cured by UV to form an OCR water gel layer. 如申請專利範圍第3項所述的一種AMOLED模組結構的組裝方法,其特徵在於,該OCA光學膠的厚度為0.025毫米至0.1毫米。 The method for assembling an AMOLED module structure according to claim 3, wherein the OCA optical adhesive has a thickness of 0.025 mm to 0.1 mm.
TW102147110A 2013-11-22 2013-12-19 Active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof TW201521195A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310595812.0A CN103730067A (en) 2013-11-22 2013-11-22 AMOLED module structure and assembly method thereof

Publications (1)

Publication Number Publication Date
TW201521195A true TW201521195A (en) 2015-06-01

Family

ID=50454117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102147110A TW201521195A (en) 2013-11-22 2013-12-19 Active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof

Country Status (4)

Country Link
JP (1) JP2015103519A (en)
KR (1) KR20150059586A (en)
CN (1) CN103730067A (en)
TW (1) TW201521195A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104269499A (en) * 2014-09-22 2015-01-07 上海和辉光电有限公司 Amoled structure and manufacturing method thereof
CN105529352A (en) * 2015-12-08 2016-04-27 北京橙鑫数据科技有限公司 AMOLED (active-matrix organic light emitting diode) display screen and terminal
CN105528031A (en) * 2015-12-08 2016-04-27 北京橙鑫数据科技有限公司 Wearable terminal
CN106782094A (en) 2017-01-12 2017-05-31 京东方科技集团股份有限公司 A kind of motherboard and preparation method thereof, cover plate and preparation method thereof, display device
KR20180098890A (en) * 2017-02-27 2018-09-05 삼성전자주식회사 Curved display and electronic device including thereof
CN107545848A (en) * 2017-08-25 2018-01-05 武汉华星光电半导体显示技术有限公司 Flexible cover plate and preparation method thereof, flexible OLED display
CN107807468A (en) * 2017-11-29 2018-03-16 武汉天马微电子有限公司 Display module and display device
CN110164302B (en) * 2018-02-13 2021-08-06 元太科技工业股份有限公司 Flexible display device and manufacturing method thereof
CN110571351B (en) * 2019-08-14 2021-01-15 武汉华星光电半导体显示技术有限公司 Flexible display panel structure and manufacturing method
CN110649010B (en) * 2019-09-07 2020-08-11 东莞阿尔泰显示技术有限公司 OCA film packaging process of display module
CN110611016B (en) * 2019-09-07 2020-09-11 东莞阿尔泰显示技术有限公司 OCR film packaging process of display module
CN110853522B (en) * 2019-11-29 2023-06-20 武汉天马微电子有限公司 Display screen device
CN111445790A (en) * 2020-04-27 2020-07-24 武汉华星光电技术有限公司 Display panel, preparation method thereof and display device
CN111653198B (en) * 2020-06-23 2022-02-01 武汉天马微电子有限公司 Display panel and display device
CN115527442B (en) * 2022-01-26 2023-08-01 荣耀终端有限公司 Display module, terminal device and manufacturing method of display module
CN114822287A (en) * 2022-04-06 2022-07-29 武汉华星光电半导体显示技术有限公司 Display module and manufacturing method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101896766B (en) * 2007-10-24 2014-04-23 开关电灯公司 Diffuser for LED light sources
GB0821122D0 (en) * 2008-11-19 2008-12-24 Nanoco Technologies Ltd Semiconductor nanoparticle - based light emitting devices and associated materials and methods
TWI524601B (en) * 2012-01-05 2016-03-01 宏達國際電子股份有限公司 Cover, electronic device and manufacturing method for cover
JP2013178332A (en) * 2012-02-28 2013-09-09 Toppan Printing Co Ltd Decorative scattering prevention film for image display panel, and image display panel
JP3175653U (en) * 2012-03-02 2012-05-24 志忠 林 Touch control device
CN103294241B (en) * 2012-03-05 2016-04-06 冠伟科技股份有限公司 The method of baseplate-laminating
CN105845709B (en) * 2012-03-19 2019-06-04 群康科技(深圳)有限公司 Display device and its manufacturing method
CN102991092B (en) * 2012-12-13 2015-07-08 Tcl显示科技(惠州)有限公司 Method for adhering touch screen and display panel

Also Published As

Publication number Publication date
CN103730067A (en) 2014-04-16
KR20150059586A (en) 2015-06-01
JP2015103519A (en) 2015-06-04

Similar Documents

Publication Publication Date Title
TW201521195A (en) Active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof
CN105938267B (en) Display device and method for manufacturing the same
JP5424964B2 (en) Display device
TWI459262B (en) Touch panel display and assembly process and touch sensing module for the same
US10916725B2 (en) Organic light-emitting diode display panel, method for fabricating the same and display device
US9581851B2 (en) Liquid crystal display device
US10429971B2 (en) Display panel, manufacturing method thereof and display device
KR102379458B1 (en) Liquid crystal display device
JP2005055641A (en) Liquid crystal display device
TWI581023B (en) Front light display device and manufacturing thereof
TW201509677A (en) Electronic device
WO2014123165A1 (en) Transparent surface material and display device using same
US8964150B2 (en) Liquid crystal display device and method of manufacturing the same
TW201516530A (en) Display device and assembling method of display device and adhesive
WO2016101358A1 (en) Touch display
JP2013073175A (en) Liquid crystal display device
CN111640370A (en) Bonding structure, display device, and bonding method for display device
JP6664229B2 (en) Display device having light guide block
KR20100096972A (en) Reflective display apparatus
JP2013231796A (en) Manufacturing method of liquid crystal display device
TWI530396B (en) Panel laminating method, panel assembly and electronic device
JP2014219437A (en) Display device
KR20150000100A (en) Flat display device and manufacturing method thereof
JP2011075718A (en) Display device and manufacturing method of the same
JP6001484B2 (en) Light source device and liquid crystal display device including the light source device