CN105845709B - Display device and its manufacturing method - Google Patents
Display device and its manufacturing method Download PDFInfo
- Publication number
- CN105845709B CN105845709B CN201610284142.4A CN201610284142A CN105845709B CN 105845709 B CN105845709 B CN 105845709B CN 201610284142 A CN201610284142 A CN 201610284142A CN 105845709 B CN105845709 B CN 105845709B
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- Prior art keywords
- frame
- display device
- led panel
- organic led
- glue material
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention discloses a kind of display device and its manufacturing method.Display device includes a frame, an organic LED panel, a translucent element and a glue material.Organic LED panel is set in frame.Translucent element is set on organic LED panel.Glue material is set between organic LED panel and translucent element or is set between organic LED panel and frame, and is not higher than the side wall of the frame.
Description
The present invention be Chinese invention patent application (application number: 201210072583.X, the applying date: on March 19th, 2012,
Denomination of invention: display device and its manufacturing method) divisional application.
Technical field
The present invention relates to a kind of display device and its manufacturing methods, and more particularly to a kind of organic light-emitting diode display
Device and its manufacturing method.
Background technique
With the development of display science and technology, various display device is continued to introduce new.Wherein Organic Light Emitting Diode has certainly
Photism, it is small in size, chroma is high the advantages that so that Organic Light Emitting Diode be known as display science and technology rising star.
During developing Organic Light Emitting Diode, researcher has found that Organic Light Emitting Diode is relatively easy by water
Point or oxygen destruction, and substantially detract the service life of Organic Light Emitting Diode.Researcher is organic to increase using various designs
The water preventing ability and oxygen barrier of light emitting diode, but slow down the manufacture craft speed of Organic Light Emitting Diode.Therefore, organic light emission
The bottleneck that diode front is developed just before a technology.
Summary of the invention
The purpose of the present invention is to provide a kind of display device and its manufacturing methods, insert organic light emission two using glue material
Design between pole pipe panel and frame, so that display device can achieve high water resistance, high oxygen barrier, and manufacture craft speed
Fast advantage.
In order to achieve the above object, according to an aspect of the invention, it is proposed that a kind of display device.Display device include a frame,
One organic LED panel, a translucent element and a glue material.Organic LED panel is set in frame.Light transmission member
Part is set on organic LED panel.Glue material is set between organic LED panel and translucent element, and
Not higher than the side wall of the frame.
According to another aspect of the present invention, display device includes a frame, an organic LED panel, light transmission member
Part and a glue material.Organic LED panel is set in frame.Translucent element be set to organic LED panel it
On.Glue material is set between organic LED panel and frame, and is not higher than the side wall of the frame.
For above content of the invention can be clearer and more comprehensible, special embodiment below, and cooperate appended attached drawing, make detailed
It is described as follows:
Detailed description of the invention
Fig. 1 is the schematic diagram of the display device of that present invention；
Fig. 2~Fig. 9 is the flow chart of the manufacturing method of the display device of that present invention.
Main element symbol description
100: display device
110: frame
120: organic LED panel
120a: upper surface
120b: side surface
121: thin film transistor base plate
122: light emitting diode
123: protective layer
124: frame glue
125: colored filter substrate
126: packing material
130: translucent element
140: glue material
D1: height
D2: sum total thickness
L1, L2: ultraviolet light
Specific embodiment
Various embodiments set forth below are described in detail, and use glue material filling organic LED panel and frame
Between design so that display device can achieve high water resistance, high oxygen barrier, and the fireballing advantage of manufacture craft.However,
Embodiment can't limit the range of the invention to be protected only to illustrate as example.In addition, the attached drawing in embodiment omits
Subelement, to clearly show that technical characterstic of the invention.
Fig. 1 is please referred to, the schematic diagram of display device 100 is painted.Display device 100 includes a frame 110, an organic hair
Optical diode panel 120, a translucent element 130 and a glue material 140.Frame 110 is to carry and protect in display device 100
Portion's element, e.g. an iron frame.Organic LED panel 120 is, for example, active or passive type.Organic Light Emitting Diode
Panel 120 is set in frame 110.Translucent element 130 is, for example, a panel or an optical diaphragm, wherein above-mentioned panel such as one
Touch panel or a 2D/3D switch panel, an above-mentioned optical diaphragm such as polaroid, a phase delay chip, a lenticular lenses
(barrier) or a cylindrical lenses piece (lenticular lens).Translucent element 130 is set to organic LED panel
On 120, wherein translucent element 130 can be set to simultaneously in frame 110 with organic LED panel 120, also light-permeable
Element 130 is partly or entirely exposed to outside frame 110.Glue material 140 is filled in organic LED panel 120 and translucent element
Between 130, to bond organic LED panel 120 and translucent element 130.In addition, glue material 140 is more filled in organic hair
Between optical diode panel 120 and frame 110.
Wherein organic LED panel 120 is easy the destruction by moisture or oxygen and detracts the service life.The present embodiment
Glue material 140 be not only filled between organic LED panel 120 and translucent element 130 with bind translucent element 130 with
Organic LED panel 120 is more filled between organic LED panel 120 and frame 110, so that organic light emission
The upper surface 120a and side surface 120b of diode panel 120 can be by further protections.
Glue material 140 is filled between Organic Light Emitting Diode 120 and frame 110, on the one hand, it has bonded organic light emission two
Pole pipe panel 120 and frame 110 avoid because of display so that organic LED panel 120 can be fixedly arranged in frame 110
The shaking of device 100 causes organic LED panel 120 to move in frame and hits frame 110 and be damaged.On the other hand,
Its side encapsulation region for covering organic LED panel 120.Since the aqueous vapor in air is easy with oxygen by organic hair
The service life is caused to detract in the side encapsulation region intrusion organic LED panel 120 of optical diode panel 120, therefore glue material
The 140 side encapsulation regions for covering organic LED panel 120 can more effectively stop invading for aqueous vapor and oxygen in air
Enter.
In the present embodiment, in order to allow the side surface 120b of organic LED panel 120 by enough protections, glue
Filling rate of the material 140 between organic LED panel 120 and frame 110 is e.g. greater than 70% at least more than 50%
Or it is greater than 90%.Designer can design according to considering for the selection of 140 material of glue material and manufacture craft speed.
For the manufacturing method of display device 100, referring to figure 2.~Fig. 9 is painted the manufacturer of display device 100
The flow chart of method.Firstly, providing organic LED panel 120 (being illustrated in Fig. 5) as shown in Fig. 2~Fig. 5.It is being provided with
In the step of machine light-emitting-diode panel 120, first as shown in Fig. 2, providing a thin film transistor base plate 121.Thin film transistor (TFT)
Substrate 121 is to provide one drive circuit.
Then, as shown in Fig. 2, several Organic Light Emitting Diodes 122 are arranged on thin film transistor base plate 121.These have
Machine light emitting diode 122 can be white light or colour (e.g. red, green, blue).In the present embodiment, these shine
Diode 122 is white light.These Organic Light Emitting Diodes 122 can be array arrangement, to form the picture of matrix arrangement one by one
Element.
Then, as shown in Fig. 2, these Organic Light Emitting Diodes 122 are covered with a protective layer 123, to avoid subsequent production
Processing damage has light emitting diode 122.
Then, as shown in figure 3, one frame glue 124 of setting is around thin film transistor base plate 121.The height D1 of frame glue 124
Greater than Organic Light Emitting Diode 122 and the sum total thickness D2 of protective layer 123.
Then, as shown in figure 3, in the environment of vacuumizing, with manufacture craft of dripping (one drop filling, ODF)
One packing material 126 is set on thin film transistor base plate 121.In general, Organic Light Emitting Diode 122 has height not
The case where flat situation, the protective layer 123 being arranged on also is uneven.It may insure to fill using manufacture craft of dripping
Material 126 can be covered in rugged protective layer 123.
Then, as shown in figure 4, in the environment of vacuumizing, a colored filter substrate 125 is set in frame glue 124.?
In other embodiments, when Organic Light Emitting Diode 122 is colored, one transparent protective substrate of setting can be changed in this step
(not being painted) is in frame glue 124.
Then, as shown in figure 5, in the environment of vacuumizing, with the combination of colored filter substrate 125 and frame glue 124,
Packing material 126 is spread on protective layer 123, until packing material 126 is filled up completely in colored filter substrate 125, frame glue
Between 124 and thin film transistor base plate 121, remain on colored filter substrate 125, frame glue without any moisture content or oxygen
Between 124 and thin film transistor base plate 121.
Then, as shown in figure 5, with a ultraviolet light L1 (or a heat source) curing filler material 126 and frame glue 124.So far, i.e.,
Complete organic LED panel 120.At this point, Organic Light Emitting Diode 122 has been protected layer 123 and packing material 126
Complete protection.
In one embodiment, can also frame glue 124 be only set to assemble colored filter substrate 125 and thin film transistor base plate
121, without the packing material 126 using manufacture craft (ODF) of dripping.
In one embodiment, it is possible to use optical adhesive film (optically clear adhesive film, OCA film)
(not being painted) is mounted directly on Organic Light Emitting Diode 122, without the packing material 126 using manufacture craft (ODF) of dripping.
Only the embodiment of setting frame glue 124 can be stayed between colored filter substrate 125 and thin film transistor base plate 121
Lower gap, and moisture or oxygen is made to easily infiltrate into this gap.It also, is the water preventing ability and oxygen barrier for ensuring frame glue 124, it is necessary to volume
It is outer that each frame glue is reinforced solidifying one by one using laser (not being painted), and increase manufacturing cost and slow down manufacture craft speed
Degree.
Embodiment using optical adhesive film (OCA film) still can between rugged Organic Light Emitting Diode 122
There are minim gaps, and moisture or oxygen is made to easily infiltrate into this minim gap.
It in comparison, can be to avoid moisture or oxygen using the embodiment of the packing material 126 of manufacture craft of dripping (ODF)
Gas remains between colored filter substrate 125, frame glue 124 and thin film transistor base plate 121, to extend Organic Light Emitting Diode
122 service life and the optical appearance for ensuring Organic Light Emitting Diode 122.Also, using the filling material for manufacture craft (ODF) of dripping
The embodiment of material 126 can be used ultraviolet light L1 (or heat source) and do to be solidified by entire surface, so that manufacturing cost is able to cheap and makes
It is quick to make process speed.
By it is above-mentioned it is various in a manner of provide organic LED panel 120 after, then enter Fig. 6 and Fig. 7 the step of.
In Fig. 6 and Fig. 7, glue material 140 is coated on organic LED panel 120.This glue material 140 is, for example, light
It learns glue rouge (OCR).In Fig. 6, some regions first can be fifty-fifty coated with, then these glue materials 140 brush is opened and is covered in organic
On light-emitting-diode panel 120.In Fig. 7, glue material 140 can be coated with directly doing whole face.
In this step, since the upper surface 120a of organic LED panel 120 is quite smooth, glue material 140
It can be coated on very close to each otherly on organic LED panel 120.
In this step, the penetration by water rate (water vapor transmission rate, WVTR) of glue material 140 is less than
20 grams/every square metre-daily (g/m2- day), to ensure the high water resistance of glue material 140.Oxygen penetrance (the oxygen of glue material 140
Transmission rate, OTR) less than 1 × 10-3Daily (the cc/m of milliliter/every square metre-2- day), to ensure glue material 140
High oxygen barrier.The optics penetrance of glue material 140 is greater than 90%, to ensure the high light transmittance of glue material 140.
Then, as shown in figure 8, setting organic LED panel 120 is in frame 110.
Then, as shown in figure 8, setting translucent element 130 is in glue material 140.
Then, as shown in figure 8, pressing translucent element 130 and organic LED panel 120, so that glue material 140 is filled
Between organic LED panel 120 and translucent element 130, and overflows glue material 140 and be filled in through capillary phenomenon
Between organic LED panel 120 and frame 110.
In the step of pressing, it can control in the environment of depressurizing pumping (e.g. 50~1Pa), to help glue material
140 penetrate between organic LED panel 120 and frame 110.
Then, as shown in figure 9, solidifying glue material 140 with a ultraviolet light L2 (or a heat source).So far, that is, display device is completed
100。
As described above, Organic Light Emitting Diode 122 is at least by four layers of protection: first layer is the protection of protective layer 123,
The second layer is the protection of encapsulating material 126, and third layer is the protection of glue material 140, and the 4th layer is the protection of frame 110, so that having
The destruction of moisture and oxygen can be effectively avoided in machine light emitting diode 122.
Although being not intended to limit the invention in conclusion disclosing the present invention in conjunction with above embodiments.This hair
Skilled person in bright technical field can make various change and profit without departing from the spirit and scope of the present invention
Decorations.Therefore, protection scope of the present invention should be subject to what the appended claims were defined.
Claims (8)
1. a kind of display device, comprising:
Frame；
Organic LED panel is set in the frame；
Translucent element is set on the organic LED panel；And
Glue material is set between the organic LED panel and the frame, and is not higher than the side wall of the frame；
Wherein, the upper surface of the translucent element is higher than the side wall of the frame.
2. display device as described in claim 1, wherein penetration by water rate (the water vapor transmission of the glue material
Rate, WVTR) less than 20 grams/every square metre-daily (g/m2- day) or the glue material oxygen penetrance (oxygen
Transmission rate, OTR) less than 1 × 10-3Daily (the mL/m of milliliter/every square metre-2-day)。
3. display device as described in claim 1, wherein the optics penetrance of the glue material is greater than 90%.
4. display device as described in claim 1, wherein the translucent element is that a touch panel or a 2D/3D switch panel.
5. display device as described in claim 1, wherein the translucent element is an optical diaphragm.
6. display device as described in claim 1, wherein the glue material is between the organic LED panel and the frame
Filling rate be greater than 90%.
7. display device as described in claim 1, wherein the glue material is ultraviolet photocureable material or thermosetting material.
8. display device as described in claim 1, wherein the organic LED panel includes:
Thin film transistor base plate；
Multiple Organic Light Emitting Diodes are set on the thin film transistor base plate；And
Protective layer covers those Organic Light Emitting Diodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610284142.4A CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610284142.4A CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
| CN201210072583.XA CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210072583.XA Division CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105845709A CN105845709A (en) | 2016-08-10 |
| CN105845709B true CN105845709B (en) | 2019-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210072583.XA Active CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
| CN201610284142.4A Active CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210072583.XA Active CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI505009B (en) * | 2013-09-16 | 2015-10-21 | E Ink Holdings Inc | Manufacturing method for display module |
| CN103730067A (en) * | 2013-11-22 | 2014-04-16 | 上海和辉光电有限公司 | AMOLED module structure and assembly method thereof |
| JP6383548B2 (en) * | 2014-03-10 | 2018-08-29 | 株式会社小糸製作所 | Lamp |
| CN104241332A (en) * | 2014-09-30 | 2014-12-24 | 深圳市华星光电技术有限公司 | White-light OLED (organic light-emitting diode) display and packaging method thereof |
| CN108538763B (en) * | 2018-04-24 | 2020-05-15 | 京东方科技集团股份有限公司 | Heating assembly, packaging device and packaging method |
| CN109860424A (en) * | 2019-02-26 | 2019-06-07 | 固安翌光科技有限公司 | A kind of flexible OLED screen body with outer protection structure |
| CN110048018B (en) * | 2019-04-02 | 2020-06-16 | 深圳市华星光电半导体显示技术有限公司 | Display packaging structure and manufacturing method thereof |
| CN111584745A (en) * | 2020-05-13 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method for manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105845709A (en) | 2016-08-10 |
| CN103325808B (en) | 2016-06-08 |
| CN103325808A (en) | 2013-09-25 |
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