CN111584745A - Display panel and method for manufacturing the same - Google Patents
Display panel and method for manufacturing the same Download PDFInfo
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- CN111584745A CN111584745A CN202010402009.0A CN202010402009A CN111584745A CN 111584745 A CN111584745 A CN 111584745A CN 202010402009 A CN202010402009 A CN 202010402009A CN 111584745 A CN111584745 A CN 111584745A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The embodiment of the application provides a display panel and a manufacturing method thereof, wherein the display panel comprises a first barrier layer, a flexible substrate, an array layer, a light emitting layer, a packaging layer and a second barrier layer which are sequentially stacked. The packaging layer is coated on the luminous layer and comprises at least one first inorganic layer, at least one second inorganic layer and at least one organic layer, and the organic layer is arranged between the first inorganic layer and the second inorganic layer. The scheme can improve the packaging effect of the display panel.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to a display panel and a manufacturing method thereof.
Background
Organic Light-Emitting diodes (OLEDs) have been replacing conventional liquid crystal displays due to their characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, and low power consumption, and are widely used in mobile phone screens, computer monitors, and full-color televisions. However, the encapsulation of OLEDs is particularly important because the light-emitting layers of OLEDs are very sensitive to water and oxygen.
At present, the encapsulation method of the OLED mainly includes alternately stacking organic layers and inorganic layers to form an encapsulation layer, so as to encapsulate the OLED. However, although the encapsulation layer has a good water and oxygen barrier capability, the inorganic layer forms inevitable pinholes during the film formation process, and becomes a water and oxygen intrusion channel. In addition, the inorganic layer has a large thickness, and is prone to generating cracks in the bending process, thereby reducing the packaging effect.
Disclosure of Invention
The embodiment of the application provides a display panel and a manufacturing method thereof, which can improve the packaging effect of the display panel.
In a first aspect, an embodiment of the present application provides a display panel, including:
a first barrier layer;
a flexible substrate disposed on the first barrier layer;
an array layer disposed on the flexible substrate;
a light emitting layer disposed on the array layer;
the packaging layer is coated on the luminous layer and comprises at least one first inorganic layer, at least one second inorganic layer and at least one organic layer, and the organic layer is arranged between the first inorganic layer and the second inorganic layer;
and the second barrier layer is coated on the packaging layer.
In the display panel provided in the embodiment of the present application, the first inorganic layer includes a first metal oxide layer and a second metal oxide layer, and the first metal oxide layer is located between two of the second metal oxide layers or the second metal oxide layer is located between two of the first metal oxide layers.
In the display panel provided by the embodiment of the application, the material of the first metal oxide layer comprises aluminum oxide, and the material of the second metal oxide layer comprises zinc oxide or zirconium oxide.
In the display panel provided in the embodiment of the present application, the second inorganic layer includes a third metal oxide layer and a fourth metal oxide layer, where the third metal oxide layer is located between two fourth metal oxide layers or the fourth metal oxide layer is located between two third metal oxide layers.
In the display panel provided in the embodiment of the present application, a material of the third metal oxide layer includes aluminum oxide, and a material of the fourth metal oxide layer includes zinc oxide or zirconium oxide.
In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, including:
providing a glass substrate;
sequentially forming a flexible substrate, an array layer and a light emitting layer on the glass substrate;
forming an encapsulation layer coated on the light-emitting layer, wherein the encapsulation layer comprises at least one first inorganic layer, at least one second inorganic layer and at least one organic layer, and the organic layer is arranged between the first inorganic layer and the second inorganic layer;
forming a second barrier layer wrapping the packaging layer on the packaging layer;
and separating the glass substrate and the flexible substrate, and forming a first barrier layer on one side of the flexible substrate close to the array layer.
In the method for manufacturing a display panel provided in the embodiment of the present application, the first inorganic layer includes a first metal oxide layer and a second metal oxide layer, and the first metal oxide layer is located between the two second metal oxide layers or the second metal oxide layer is located between the two first metal oxide layers.
In the method for manufacturing a display panel provided in the embodiment of the present application, the second inorganic layer includes a third metal oxide layer and a fourth metal oxide layer, and the third metal oxide layer is located between two fourth metal oxide layers or the fourth metal oxide layer is located between two third metal oxide layers.
In the method for manufacturing a display panel provided in the embodiment of the present application, the first inorganic layer and the second inorganic layer are nanomaterial film layers.
By last, the display panel that this application embodiment provided includes first barrier layer, flexible substrate, array layer, luminescent layer, packaging layer and the second barrier layer of range upon range of setting in proper order. The packaging layer is coated on the luminous layer and comprises at least one first inorganic layer, at least one second inorganic layer and at least one organic layer, and the organic layer is arranged between the first inorganic layer and the second inorganic layer. The scheme can improve the packaging effect of the display panel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel provided in an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a first inorganic layer provided in an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a second inorganic layer provided in an embodiment of the present application.
Fig. 4 is a schematic flowchart of a manufacturing method of a display panel according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a first intermediate product of a display panel provided in an embodiment of the present application.
Fig. 6 is a schematic structural diagram of a second intermediate product of a display panel provided in an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a third intermediate product of a display panel provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Embodiments of the present application provide a display panel and a method of manufacturing the same, which will be described in detail below.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure. The display panel 100 may include a first barrier layer 10, a flexible substrate 20, an array layer 30, a light emitting layer 40, an encapsulation layer 50, and a second barrier layer 60, which are sequentially stacked.
Wherein, the first barrier layer 10 has better water oxygen barrier property and bending resistance. The first barrier layer 10 may serve to prevent the intrusion of water and oxygen from the flexible substrate 20.
Wherein the flexible substrate 20 may be disposed on the first barrier layer 10. The material of the flexible substrate 10 may be a flexible material such as Polyimide (PI).
Wherein the array layer 30 is disposed on the flexible substrate 20. The array layer 30 may be a thin film transistor array layer. The array layer 30 may be used primarily to drive the light-emitting layer 40 to emit light.
The light emitting layer 40 is disposed on the array layer 30. The light emitting layer 40 may be formed by evaporation or inkjet printing.
The encapsulation layer 50 is coated on the light emitting layer 40. The encapsulation layer 50 may include at least one first inorganic layer 51, at least one organic layer 52, and at least one second inorganic layer 53. Wherein the organic layer 52 is disposed between the first inorganic layer 51 and the second inorganic layer 53. The first inorganic layer 51, the organic layer 52, and the second inorganic layer 53 are all made of a nanomaterial film.
The material of the organic layer 52 may be silicon-based organic material, polymer such as polymethyl methacrylate, or organic resin. The organic layer 52 may have a thickness of more than 100 nm to cover the inevitable pinholes of the first inorganic layer 51 and/or the second inorganic layer 53 and improve the bending resistance thereof. It is understood that the size of the organic layer 52 is smaller than the size of the first and second inorganic layers 51 and 53. The size of the first inorganic layer 51 is the same as that of the second inorganic layer 53.
In some embodiments, as shown in fig. 2, the first inorganic layer 51 may include a first metal oxide layer 511 and a second metal layer 512 disposed to overlap. It should be noted that the number of overlapping layers of the first metal oxide layer 511 and the second metal layer 512 is at least three. That is, the first metal oxide layer 511 is located between the two second metal layers 512 or the second metal layer 512 is located between the two first metal oxide layers 511. The material of the first metal oxide layer 511 may include aluminum oxide. The material of the second metal oxide layer 512 may include zinc oxide or zirconium oxide. The thickness of the first metal oxide layer 511 is equal to the thickness of the second metal oxide layer 512. The first and second metal oxide layers 511 and 512 may have a thickness of 3 nm to 10 nm.
In some embodiments, as shown in fig. 3, the second inorganic layer 53 may include a third metal oxide layer 531 and a fourth metal oxide layer 532 disposed to overlap. Note that the number of overlapping layers of the third metal oxide layer 531 and the fourth metal oxide layer 532 is at least three. That is, the third metal oxide layer 531 is located between the two fourth metal oxide layers 532 or the fourth metal oxide layer 532 is located between the two third metal oxide layers 531. The material of the third metal oxide layer 531 may include aluminum oxide. The material of the fourth metal oxide layer 532 may include zinc oxide or zirconium oxide. The thickness of the third metal oxide layer 531 is equal to the thickness of the fourth metal oxide layer 532. The thickness of the third metal oxide layer 531 and the thickness of the fourth metal oxide layer 532 may be 3 nm to 10 nm.
Wherein the second barrier layer 60 has good water and oxygen barrier properties and bending resistance. The second barrier layer 60 may serve to further prevent the ingress of water oxygen. It is understood that the size of the second barrier layer 60 is larger than the size of the first and second inorganic layers 51 and 53.
In some embodiments, in order to further improve the water and oxygen barrier property of the display panel 100, a third barrier layer may be further laminated on the side edges of the flexible substrate 20 and the array layer 30 by a roller or vacuum bonding method, so that the first barrier layer 10, the second barrier layer 60, and the third barrier layer may form a sealing ring. In some embodiments, to reduce the process sequence, the first barrier layer 10, the second barrier layer 60, and the third barrier layer may be formed through the same process flow.
In some embodiments, in order to reduce the probability of the first barrier layer 10 cracking when being bent, an organic layer may be disposed between the first barrier layer 10 and the flexible substrate 20, and the organic layer may buffer the stress generated when the first barrier layer 10 is bent, thereby reducing the probability of the first barrier layer 10 cracking when being bent.
Similarly, the second barrier layer 60 and the encapsulation layer 50 may also be provided with an organic layer to reduce the possibility of cracking of the first barrier layer 10 when it is bent.
In the embodiment of the present application, by forming the encapsulation layer 50 using the nano-scale first inorganic layer 51, the organic layer 52, and the second inorganic layer 53, the thickness of the encapsulation layer 50 is reduced, and thus the thickness of the display panel 100 is reduced. In addition, the first inorganic layer 51 and the second inorganic layer 53 are specially arranged in the embodiment of the application, at least three overlapped and stacked nano inorganic layers are formed, and the complexity of a water vapor invasion channel can be increased on the premise of reducing the thicknesses of the first inorganic layer 51 and the second inorganic layer 53, so that water and oxygen are difficult to invade, and the water and oxygen barrier property of the display panel 100 is improved. In addition, in the embodiment of the present invention, the first barrier film 10 and the second barrier film 60 which are specially disposed are respectively attached to the flexible substrate 10 and the encapsulation layer 50, so that the bending resistance of the display panel 100 is further increased on the premise of further increasing the water and oxygen barrier property of the display panel 100.
Referring to fig. 4, fig. 4 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure. The specific manufacturing process of the display panel 100 may be as follows:
101. a glass substrate 70 is provided.
102. A flexible substrate 20, an array layer 30, and a light emitting layer 40 are sequentially formed on the glass substrate 70.
Specifically, as shown in fig. 5, a flexible material such as Polyimide (PI) may be coated on the glass substrate 70 to form the flexible substrate 20. Then, an array layer 30 is deposited on the flexible substrate 20. Finally, a light emitting layer 40 is formed on the array layer 30 by ink jet printing or evaporation.
103. An encapsulation layer 50 is formed on the light-emitting layer 40, wherein the encapsulation layer 50 includes at least one first inorganic layer 51, at least one second inorganic layer 53 and at least one organic layer 52, and the organic layer 52 is disposed between the first inorganic layer 51 and the second inorganic layer 53.
Specifically, as shown in fig. 6, the first metal oxide layer 511 and the second metal layer 512 stacked in an overlapping manner may be formed on the light-emitting layer 40 by an atomic layer deposition method or a plasma-enhanced atomic layer deposition method to form the first inorganic layer 51. Then, an organic layer 52 is formed on the first inorganic layer 51 by spin coating or printing. Finally, an overlapped stack of a third metal oxide layer 531 and a fourth metal oxide layer 532 is formed on the organic layer 52 by an atomic layer deposition method or a plasma-enhanced atomic layer deposition method to form a second inorganic layer 53.
104. A second barrier layer 60 is formed on the encapsulation layer 50 to cover the encapsulation layer 50.
Specifically, as shown in fig. 7, a liquid water oxygen barrier film may be coated on the encapsulation layer 50 and the array layer 30 by inkjet printing or spin coating, and then, the liquid water oxygen barrier film may be cured by uv irradiation or heating to form the second barrier layer 60.
105. Separating the glass substrate 70 and the flexible substrate 20, and forming a first barrier layer 10 on a side of the flexible substrate 20 close to the array layer 30.
Specifically, the glass substrate 70 and the flexible substrate 20 may be separated by cutting, and then the first barrier film 10 and the flexible substrate 20 are attached to the side close to the array layer 30 by a roller or vacuum attachment, so as to complete the encapsulation.
From the above, the display panel 100 manufactured by the manufacturing method of the display panel 100 according to the embodiment of the present application reduces the thickness of the encapsulation layer 50 by forming the encapsulation layer 50 by using the nanoscale first inorganic layer 51, the nanoscale organic layer 52, and the nanoscale second inorganic layer 53, thereby reducing the thickness of the display panel 100. In addition, the first inorganic layer 51 and the second inorganic layer 53 are specially arranged in the embodiment of the application, at least three overlapped and stacked nano inorganic layers are formed, and the complexity of a water vapor invasion channel can be increased on the premise of reducing the thicknesses of the first inorganic layer 51 and the second inorganic layer 53, so that water and oxygen are difficult to invade, and the water and oxygen barrier property of the display panel 100 is improved. In addition, in the embodiment of the present invention, the first barrier film 10 and the second barrier film 60 which are specially disposed are respectively attached to the flexible substrate 10 and the encapsulation layer 50, so that the bending resistance of the display panel 100 is further increased on the premise of further increasing the water and oxygen barrier property of the display panel 100.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the description of the embodiments above is only used to help understanding the technical solutions and the core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel, comprising:
a first barrier layer;
a flexible substrate disposed on the first barrier layer;
an array layer disposed on the flexible substrate;
a light emitting layer disposed on the array layer;
the packaging layer is coated on the luminous layer and comprises at least one first inorganic layer, at least one second inorganic layer and at least one organic layer, and the organic layer is arranged between the first inorganic layer and the second inorganic layer;
and the second barrier layer is coated on the packaging layer.
2. The display panel of claim 1, wherein the first inorganic layer comprises a first metal oxide layer and a second metal oxide layer, the first metal oxide layer being between the two second metal oxide layers or the second metal oxide layer being between the two first metal oxide layers.
3. The display panel according to claim 2, wherein a material of the first metal oxide layer comprises aluminum oxide, and a material of the second metal oxide layer comprises zinc oxide or zirconium oxide.
4. The display panel according to claim 1, wherein the second inorganic layer comprises a third metal oxide layer and a fourth metal oxide layer, and wherein the third metal oxide layer is located between the two fourth metal oxide layers or the fourth metal oxide layer is located between the two third metal oxide layers.
5. The display panel according to claim 4, wherein a material of the third metal oxide layer comprises aluminum oxide, and a material of the fourth metal oxide layer comprises zinc oxide or zirconium oxide.
6. The display panel of claim 1, wherein the first inorganic layer and the second inorganic layer are nanomaterial film layers.
7. A method of manufacturing a display panel, comprising:
providing a glass substrate;
sequentially forming a flexible substrate, an array layer and a light emitting layer on the glass substrate;
forming an encapsulation layer coated on the light-emitting layer, wherein the encapsulation layer comprises at least one first inorganic layer, at least one second inorganic layer and at least one organic layer, and the organic layer is arranged between the first inorganic layer and the second inorganic layer;
forming a second barrier layer wrapping the packaging layer on the packaging layer;
and separating the glass substrate and the flexible substrate, and forming a first barrier layer on one side of the flexible substrate close to the array layer.
8. The method according to claim 7, wherein the first inorganic layer comprises a first metal oxide layer and a second metal oxide layer, and wherein the first metal oxide layer is located between the second metal oxide layers or the second metal oxide layer is located between the first metal oxide layers.
9. The method according to claim 7, wherein a third metal oxide layer and a fourth metal oxide layer are formed, and the third metal oxide layer is located between the two fourth metal oxide layers or the fourth metal oxide layer is located between the two third metal oxide layers.
10. The method for manufacturing a display panel according to claim 7, wherein the first inorganic layer and the second inorganic layer are nanomaterial film layers.
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| CN202010402009.0A CN111584745A (en) | 2020-05-13 | 2020-05-13 | Display panel and method for manufacturing the same |
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