CN103730067A - AMOLED module structure and assembly method thereof - Google Patents
AMOLED module structure and assembly method thereof Download PDFInfo
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- CN103730067A CN103730067A CN201310595812.0A CN201310595812A CN103730067A CN 103730067 A CN103730067 A CN 103730067A CN 201310595812 A CN201310595812 A CN 201310595812A CN 103730067 A CN103730067 A CN 103730067A
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- amoled
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Adhesives Or Adhesive Processes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Planar Illumination Modules (AREA)
- Adhesive Tapes (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Electroluminescent Light Sources (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to the technical field of AMOLED display, in particular to an AMOLED module structure and an assembly method thereof. The AMOLED module structure comprises a display module, an OCA layer, an ink layer and a glass cover plate, the display module, the OCA layer, the ink layer and the glass cover plate are arranged in sequence, the ink layer is arranged on the end portion of the back face of the glass cover plate, a defined space is formed by the ink layer and the glass cover plate in a defined mode, the AMOLED module structure further comprises an OCR glue layer which is arranged in the defined space, and the OCA layer is used for bonding the back face of the glass cover plate and the display module. The thickness of the AMOLED module structure can be effectively reduced.
Description
Technical field
The present invention relates to a kind of AMOLED display technique field, espespecially a kind of AMOLED modular structure and assemble method thereof.
Background technology
AMOLED (Active Matrix Organic Light Emitting Diode, active matrix organic LED panel) compares traditional liquid crystal panel, has the features such as reaction velocity is fast, contrast is high, visual angle is wide.AMOLED also has self luminous characteristic in addition, does not need to use backlight, therefore more frivolous than traditional liquid crystal panel, can also save the cost of backlight module.Many-sided advantage makes it have good application prospect.
General OCA (the Optically Clear Adhesive) optical cement that adopts while encapsulating AMOLED module in prior art, and can not use OCR (Optical Clear Resin) glue, because OCR glue need to be used UV (Ultraviolet Rays, ultraviolet light) solidify, but the luminescent material in the display module of AMOLED is to UV photaesthesia, if adopt UV to irradiate, can cause luminescent material to lose efficacy, cause display screen not work.So, when AMOLED module packaging, do not adopt OCR glue.When adopting OCA optical cement that display module (Display Moduel) and cover-plate glass (Cover Lens) are fitted entirely, because OCA optical cement is limited to the absorptivity of the ink thickness on cover-plate glass, cause and need to use thicker OCA glue, finally cause AMOLED module thickness to increase.
Fig. 1 has shown that available technology adopting OCA optical cement carries out the explosive view of full laminating, and Fig. 2 has shown that available technology adopting OCA optical cement carries out the view of full laminating.As depicted in figs. 1 and 2, the back side of cover-plate glass 10 is fitted with ink layer 20, ink layer 20 is located at the end of cover-plate glass 10 and cover-plate glass 10 and is enclosed and be formed with an enclosed space 101, while adopting OCA optics glue-line 30 that cover-plate glass 10 is fit together with demonstration module 40, OCA optics glue-line 30 need be filled and led up enclosed space 101, when ink layer 20 thickness of selecting are 30 microns, need to adopt 0.3 millimeter of OCA optics glue-line 30 more than thickness just can handle the air bubble problem in laminating process well.So adopt OCA optical cement to carry out full laminating, can cause AMOLED module thickness to increase.
Summary of the invention
The object of the invention is to overcome the defect of prior art, a kind of AMOLED modular structure and assemble method thereof are provided, the problem that the AMOLED module that solution OCA optical cement brings thickens.
The technical scheme that realizes above-mentioned purpose is:
A kind of AMOLED modular structure of the present invention, comprises the display module, OCA optics glue-line, ink layer and the cover-plate glass that set gradually, and described ink layer is arranged at the end at the described cover-plate glass back side, encloses and is formed with an enclosed space with described cover-plate glass; Described AMOLED modular structure also comprises an OCR gelatine layer, and described OCR gelatine layer is filled out and is overlying in described enclosed space, and described OCA optics glue-line is bonded together the back side of described cover-plate glass and described display module.
Adopt OCR glue to fill and lead up the enclosed space on cover-plate glass, can be so that the OCA optics glue-line attenuate of follow-up use, only need to use the OCA optical cement of 0.025 millimeters thick just can well fit cover-plate glass and display module, thereby realize the reduced thickness effect of AMOLED modular structure.
The further improvement of a kind of AMOLED modular structure of the present invention is, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
The assemble method of a kind of AMOLED modular structure of the present invention, comprises the steps:
Adopt OCR glue by cover-plate glass and be arranged at the enclosed space forming between the ink layer of described cover-plate glass end and fill up, make the back side of described cover-plate glass smooth;
Adopt OCA optical cement that the back side of described cover-plate glass and display module are bonded together.
The further improvement of the assemble method of a kind of AMOLED modular structure of the present invention is, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
Accompanying drawing explanation
Fig. 1 is the explosive view that available technology adopting OCA optical cement carries out full laminating;
Fig. 2 is the view that available technology adopting OCA optical cement carries out full laminating;
Fig. 3 is the explosive view of a kind of AMOLED modular structure of the present invention;
Fig. 4 is the schematic diagram of a kind of AMOLED modular structure of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Referring to shown in Fig. 3, is the explosive view of a kind of AMOLED modular structure of the present invention.The object of the invention is to solve the problem that thickens in AMOLED module packaging process, because of in full laminating process, OCA optical cement need be filled and led up the enclosed space forming on cover-plate glass, makes to need the OCA optics glue-line thickening of use, and then has increased the thickness of AMOLED module.Below in conjunction with accompanying drawing, a kind of AMOLED modular structure of the present invention is described.
As shown in Figure 3 and Figure 4, a kind of AMOLED modular structure of the present invention comprises a cover-plate glass 10, ink layer 20, OCR gelatine layer 50, OCA optics glue-line 30 and display module 40.
Because adopting OCR gelatine layer 50 to fill and lead up the enclosed space forming between ink layer 20 and cover-plate glass 10, can be so that cover-plate glass 10 and display module 40 while entirely fitting, be used ultra-thin OCA optical cement.Because the back side of cover-plate glass 10 is smooth, when bonding with OCA optical cement, can not produce air bubble problem, so that OCA optical cement can be accomplished is the thinnest.In contrast, in the prior art, if adopting OCA optical cement directly fits entirely, during the enclosed space at its filling cap glass sheet 10 back sides, can produce bubble because of this offset, this bubble can affect the caking ability of AMOLED modular structure, think the bubble get rid of producing, need to apply thicker OCA optical cement.When the thickness of ink layer 20 is 0.03 millimeter, at least need the OCA optical cement of 0.3 millimeters thick.
The thickness of the enclosed space forming between ink layer 20 and cover-plate glass 10 is 0.03 millimeter, i.e. the thickness of ink layer 20.Adopt OCR glue to fill and lead up this enclosed space, the thickness of the OCR gelatine layer 50 forming after OCR glue solidifies is also 0.03 millimeter.Then only needing to adopt thickness is that the OCA optical cement of 0.025 millimeter can be bonded together cover-plate glass 10 and display module 40.The OCA optical cement that at least needs 0.3 millimeters thick compared to existing technology, gross thickness of the present invention is the thickness sum of OCR gelatine layer 50 and OCA optics glue-line 30,0.055 millimeter, compared with prior art in the present invention, AMOLED module gross thickness can attenuate 0.245 millimeter.
The thickness of OCA optical cement can be 0.025 millimeter to 0.1 millimeter, and the thinnest is 0.025 millimeter.
Below the assemble method of a kind of AMOLED modular structure of the present invention is described:
First, adopt OCR glue by cover-plate glass 10 and be arranged at the enclosed space forming between the ink layer 20 of cover-plate glass 10 ends and fill up, make the back side of described cover-plate glass smooth.In the present embodiment, ink layer 20 is arranged at the end at cover-plate glass 10 back sides, i.e. the edge at cover-plate glass 10 back sides, and be formed with an enclosed space with cover-plate glass 10.Here, the thickness of ink layer 20 has determined the thickness of described enclosed space.In actual applications, the process of filling and leading up of OCR glue comprises: OCR glue is filled out and is overlying on described enclosed space; With UV, OCR glue is solidified, form OCR gelatine layer 50, described OCR gelatine layer 50 can flush with the ink layer 20 at cover-plate glass 10 back sides, thereby makes the back side of cover-plate glass 10 smooth.Above-mentioned steps can have been located in the production firm of cover-plate glass.
Then, then with OCA optical cement the back side of cover-plate glass 10 and display module 40 are bonded together.
So just completed the full laminating encapsulation of AMOLED modular structure.Because adopting OCR glue to fill and lead up the enclosed space forming between ink layer 20 and cover-plate glass 10, can, so that cover-plate glass 10 and display module 40 while entirely fitting, are used ultra-thin OCA optical cement, effectively reduce AMOLED module gross thickness.Because OCR glue is solidificated in display module installation with UV, complete before, can avoid the damaging influence of UV to display module.
Beneficial effect of the present invention is:
Adopt OCR glue to fill and lead up the enclosed space on cover-plate glass, the gross thickness of attenuate AMOLED module effectively, improves the competitive power of product.
Then, OCR glue is solidificated on cover-plate glass in advance with UV, follow-uply at laminating display module, can avoids display module in AMOLED to the light activated characteristic of UV, avoid producing the phenomenon that in the display module causing because of UV light, luminescent material lost efficacy.Have again, curing the marrying again in the manufacturer of cover-plate glass of OCR glue can be provided, can reduce the input cost of OCR curing apparatus.
Below embodiment has been described in detail the present invention by reference to the accompanying drawings, and those skilled in the art can make many variations example to the present invention according to the above description.Thereby some details in embodiment should not form limitation of the invention, the present invention will be usingd scope that appended claims defines as protection scope of the present invention.
Claims (5)
1. an AMOLED modular structure, comprises the display module, OCA optics glue-line, ink layer and the cover-plate glass that set gradually, and described ink layer is arranged at the end at the described cover-plate glass back side, encloses and is formed with an enclosed space with described cover-plate glass; It is characterized in that, described AMOLED modular structure also comprises an OCR gelatine layer, and described OCR gelatine layer is filled out and is overlying in described enclosed space, and described OCA optics glue-line is bonded together the back side of described cover-plate glass and display module.
2. a kind of AMOLED modular structure as claimed in claim 1, is characterized in that, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
3. an assemble method for AMOLED modular structure, the method comprises the steps:
Adopt OCR glue by cover-plate glass and be arranged at the enclosed space forming between the ink layer of described cover-plate glass end and fill up, make the back side of described cover-plate glass smooth;
Adopt OCA optical cement that the back side of described cover-plate glass and display module are bonded together.
4. the assemble method of a kind of AMOLED modular structure as claimed in claim 3, is characterized in that: described OCR glue is cured with UV after filling out and being overlying in described enclosed space, forms OCR gelatine layer.
5. the assemble method of a kind of AMOLED modular structure as claimed in claim 3, is characterized in that, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310595812.0A CN103730067A (en) | 2013-11-22 | 2013-11-22 | AMOLED module structure and assembly method thereof |
TW102147110A TW201521195A (en) | 2013-11-22 | 2013-12-19 | Active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof |
JP2014123645A JP2015103519A (en) | 2013-11-22 | 2014-06-16 | Kind of amoled module structure and method for assembling the same |
KR1020140088419A KR20150059586A (en) | 2013-11-22 | 2014-07-14 | Structure of amoled module and method for assembling the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310595812.0A CN103730067A (en) | 2013-11-22 | 2013-11-22 | AMOLED module structure and assembly method thereof |
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CN103730067A true CN103730067A (en) | 2014-04-16 |
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CN201310595812.0A Pending CN103730067A (en) | 2013-11-22 | 2013-11-22 | AMOLED module structure and assembly method thereof |
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JP (1) | JP2015103519A (en) |
KR (1) | KR20150059586A (en) |
CN (1) | CN103730067A (en) |
TW (1) | TW201521195A (en) |
Cited By (14)
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CN104269499A (en) * | 2014-09-22 | 2015-01-07 | 上海和辉光电有限公司 | Amoled structure and manufacturing method thereof |
CN105529352A (en) * | 2015-12-08 | 2016-04-27 | 北京橙鑫数据科技有限公司 | AMOLED (active-matrix organic light emitting diode) display screen and terminal |
CN105528031A (en) * | 2015-12-08 | 2016-04-27 | 北京橙鑫数据科技有限公司 | Wearable terminal |
CN106782094A (en) * | 2017-01-12 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of motherboard and preparation method thereof, cover plate and preparation method thereof, display device |
CN107545848A (en) * | 2017-08-25 | 2018-01-05 | 武汉华星光电半导体显示技术有限公司 | Flexible cover plate and preparation method thereof, flexible OLED display |
CN107807468A (en) * | 2017-11-29 | 2018-03-16 | 武汉天马微电子有限公司 | Display module and display device |
CN110164302A (en) * | 2018-02-13 | 2019-08-23 | 元太科技工业股份有限公司 | Flexible display device and its manufacturing method |
CN110571351A (en) * | 2019-08-14 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel structure and manufacturing method |
CN110611016A (en) * | 2019-09-07 | 2019-12-24 | 东莞阿尔泰显示技术有限公司 | OCR film packaging process of display module |
CN110649010A (en) * | 2019-09-07 | 2020-01-03 | 东莞阿尔泰显示技术有限公司 | OCA film packaging process of display module |
CN110853522A (en) * | 2019-11-29 | 2020-02-28 | 武汉天马微电子有限公司 | Display screen device |
CN111445790A (en) * | 2020-04-27 | 2020-07-24 | 武汉华星光电技术有限公司 | Display panel, preparation method thereof and display device |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3175653U (en) * | 2012-03-02 | 2012-05-24 | 志忠 林 | Touch control device |
CN102991092A (en) * | 2012-12-13 | 2013-03-27 | Tcl显示科技(惠州)有限公司 | Method for adhering touch screen and display panel |
CN103200798A (en) * | 2012-01-05 | 2013-07-10 | 宏达国际电子股份有限公司 | Cover plate, electronic device and manufacturing method of cover plate |
CN103294241A (en) * | 2012-03-05 | 2013-09-11 | 冠伟科技股份有限公司 | Method for substrate jointing |
CN103325808A (en) * | 2012-03-19 | 2013-09-25 | 群康科技(深圳)有限公司 | Display device and manufacturing method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8415695B2 (en) * | 2007-10-24 | 2013-04-09 | Switch Bulb Company, Inc. | Diffuser for LED light sources |
GB0821122D0 (en) * | 2008-11-19 | 2008-12-24 | Nanoco Technologies Ltd | Semiconductor nanoparticle - based light emitting devices and associated materials and methods |
JP2013178332A (en) * | 2012-02-28 | 2013-09-09 | Toppan Printing Co Ltd | Decorative scattering prevention film for image display panel, and image display panel |
-
2013
- 2013-11-22 CN CN201310595812.0A patent/CN103730067A/en active Pending
- 2013-12-19 TW TW102147110A patent/TW201521195A/en unknown
-
2014
- 2014-06-16 JP JP2014123645A patent/JP2015103519A/en active Pending
- 2014-07-14 KR KR1020140088419A patent/KR20150059586A/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103200798A (en) * | 2012-01-05 | 2013-07-10 | 宏达国际电子股份有限公司 | Cover plate, electronic device and manufacturing method of cover plate |
JP3175653U (en) * | 2012-03-02 | 2012-05-24 | 志忠 林 | Touch control device |
CN103294241A (en) * | 2012-03-05 | 2013-09-11 | 冠伟科技股份有限公司 | Method for substrate jointing |
CN103325808A (en) * | 2012-03-19 | 2013-09-25 | 群康科技(深圳)有限公司 | Display device and manufacturing method thereof |
CN102991092A (en) * | 2012-12-13 | 2013-03-27 | Tcl显示科技(惠州)有限公司 | Method for adhering touch screen and display panel |
Cited By (23)
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CN104269499A (en) * | 2014-09-22 | 2015-01-07 | 上海和辉光电有限公司 | Amoled structure and manufacturing method thereof |
CN105529352A (en) * | 2015-12-08 | 2016-04-27 | 北京橙鑫数据科技有限公司 | AMOLED (active-matrix organic light emitting diode) display screen and terminal |
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WO2018129901A1 (en) * | 2017-01-12 | 2018-07-19 | 京东方科技集团股份有限公司 | Mother board and preparation method therefor, cover board and preparation method therefor, and display device |
CN106782094A (en) * | 2017-01-12 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of motherboard and preparation method thereof, cover plate and preparation method thereof, display device |
US10643503B2 (en) | 2017-01-12 | 2020-05-05 | Boe Technology Group Co., Ltd. | Motherboard and manufacturing method thereof, cover plate and manufacturing method thereof, and display device |
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WO2019037220A1 (en) * | 2017-08-25 | 2019-02-28 | 武汉华星光电半导体显示技术有限公司 | Flexible cover plate and fabrication method therefor and flexible oled display device |
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US11404663B2 (en) | 2019-08-14 | 2022-08-02 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible display panel structure having optical clear resin in space formed by quadrilateral anti-flow barrier and cover plate and fabricating method thereof |
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CN110611016A (en) * | 2019-09-07 | 2019-12-24 | 东莞阿尔泰显示技术有限公司 | OCR film packaging process of display module |
CN110611016B (en) * | 2019-09-07 | 2020-09-11 | 东莞阿尔泰显示技术有限公司 | OCR film packaging process of display module |
CN110649010B (en) * | 2019-09-07 | 2020-08-11 | 东莞阿尔泰显示技术有限公司 | OCA film packaging process of display module |
CN110649010A (en) * | 2019-09-07 | 2020-01-03 | 东莞阿尔泰显示技术有限公司 | OCA film packaging process of display module |
CN110853522A (en) * | 2019-11-29 | 2020-02-28 | 武汉天马微电子有限公司 | Display screen device |
CN111445790A (en) * | 2020-04-27 | 2020-07-24 | 武汉华星光电技术有限公司 | Display panel, preparation method thereof and display device |
CN115527442A (en) * | 2022-01-26 | 2022-12-27 | 荣耀终端有限公司 | Display module, terminal device and manufacturing method of display module |
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Also Published As
Publication number | Publication date |
---|---|
JP2015103519A (en) | 2015-06-04 |
TW201521195A (en) | 2015-06-01 |
KR20150059586A (en) | 2015-06-01 |
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Application publication date: 20140416 |