CN114822287A - Display module and manufacturing method thereof - Google Patents
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- CN114822287A CN114822287A CN202210358747.9A CN202210358747A CN114822287A CN 114822287 A CN114822287 A CN 114822287A CN 202210358747 A CN202210358747 A CN 202210358747A CN 114822287 A CN114822287 A CN 114822287A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention discloses a display module and a manufacturing method thereof. The display module comprises a display panel, a supporting back plate, a buffering heat dissipation component and a leveling layer; the supporting back plate is positioned on one side of the display panel, which is far away from the light-emitting surface; the buffer heat dissipation component is positioned on one side of the support backboard far away from the display panel; the leveling layer is positioned between the support back plate and the buffering heat dissipation member and is used for filling up the deformation position of the buffering heat dissipation member so as to keep the display panel flat. The leveling layer is arranged between the buffer heat dissipation component and the support back plate, so that deformation generated by the buffer heat dissipation component is not transmitted to the display panel, and the display panel is kept flat, reflected light can be eliminated without a polaroid, and the effect that the display panel does not have marks can be achieved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a manufacturing method thereof.
Background
In order to improve display brightness and bending degree, a POL loss technology is adopted in an existing OLED (Organic Light-Emitting Diode) display, that is, a polarizer is removed in the process of manufacturing an OLED display device.
However, since no polarizer is provided, the external reflected light cannot be effectively eliminated, and the deformation generated by the buffer heat dissipation layer is transmitted to the display panel, which causes the display panel to generate marks.
Disclosure of Invention
Based on the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a display module and a method for manufacturing the same, which can alleviate the problem of the display panel having the impression.
To achieve the above object, the present invention first provides a display module comprising:
a display panel;
the supporting back plate is positioned on one side of the display panel, which is far away from the light-emitting surface;
the buffer heat dissipation component is positioned on one side of the support back plate far away from the display panel;
and the leveling layer is positioned between the support back plate and the buffering heat dissipation component and is used for filling up the deformation position of the buffering heat dissipation component so as to keep the display panel flat.
Optionally, the buffer heat dissipation member includes a foam buffer layer and a heat dissipation metal layer, one surface of the foam buffer layer is covered with a leveling layer, and the other surface is connected with the heat dissipation metal layer.
Optionally, the planarization layer includes an optical adhesive layer formed by curing the liquid optical adhesive.
Optionally, the curing rate of the liquid optical cement in the leveling layer is 94% to 99%.
Optionally, a ratio of a thickness of the planarization layer to a thickness of the buffer heat-dissipating member is 1/2 to 1/11.
Optionally, the material of the support back plate comprises at least one of polyethylene terephthalate and cyclic olefin polymer.
The invention also provides a manufacturing method of the display module, which comprises the following steps:
providing a display panel, a buffer heat dissipation component and a support backboard;
coating the liquid optical cement on the buffering heat dissipation component to enable the liquid optical cement to fill up the deformation of the buffering heat dissipation component;
attaching one side of the support back plate to the liquid optical cement, and carrying out primary curing on the liquid optical cement so as to form a leveling layer between the support back plate and the buffer heat dissipation component;
and attaching the other side of the support back plate to one side of the display panel, which is deviated from the light emergent surface, so as to obtain the display module.
Optionally, after the step of applying the liquid optical cement on the buffer heat dissipation member to fill the liquid optical cement in the deformation of the buffer heat dissipation member, the method further includes:
and precuring the liquid optical cement on the buffering heat dissipation member to obtain the precured optical cement.
Optionally, the step of pre-curing the liquid optical cement on the buffer heat dissipation member includes:
passing through 100mJ/cm 2 To 700mJ/cm 2 The liquid optical cement on the buffering heat dissipation component is pre-cured by the curing energy.
Optionally, the step of performing the curing on the liquid optical cement includes:
passing through 3000mJ/cm 2 To 6000mJ/cm 2 The curing energy of (2) is to substantially cure the liquid optical cement on the buffer heat-dissipating member.
Compared with the prior art, the invention has the beneficial effects that: the display module comprises a display panel, a supporting back plate, a buffering heat dissipation component and a leveling layer; the supporting back plate is positioned on one side of the display panel, which is far away from the light-emitting surface; the buffer heat dissipation component is positioned on one side of the support backboard far away from the display panel; the leveling layer is positioned between the support back plate and the buffering heat dissipation member and is used for filling up the deformation position of the buffering heat dissipation member so as to keep the display panel flat. The leveling layer is arranged between the buffer heat dissipation component and the support back plate, so that deformation generated by the buffer heat dissipation component is not transmitted to the display panel, and the display panel is kept flat, reflected light can be eliminated without a polaroid, and the effect that the display panel does not have marks can be achieved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art display module;
FIG. 2 is a schematic diagram of a prior art display module using POL less technology;
FIG. 3 is a schematic structural diagram of a display module according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram of a buffer heat dissipation member according to an embodiment of the present invention;
FIG. 5 is a flowchart illustrating a method for fabricating a display module according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments in which the invention may be practiced. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced module or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically, electrically or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
With the development of display technology, the OLED display has many advantages such as self-luminescence, wide viewing angle, wide color gamut, fast response speed, high luminous efficiency, low working voltage, thin thickness, capability of manufacturing large-size and flexible displays, and simple process, and is widely applied in the fields of display, illumination, intelligent wearing, and the like. At present, in order to prevent the display quality from being affected by the reflection of elements in the OLED display panel to ambient light, a polarizer with an anti-reflection function is generally required to be attached to the light emitting side of the OLED display panel, so that the display quality can be ensured, but the polarizer can cause certain loss to the light emitting side of the OLED display panel, the display brightness of the OLED display panel is reduced, and meanwhile, the polarizer is thick and is not beneficial to bending.
As shown in fig. 1, the conventional display module includes an OLED display panel 101, a support plate 102, a buffer heat dissipation layer 103, a polarizer 104, a glass cover plate 105, and an OCA (transparent optical adhesive) adhesive layer 106. Based on this, a POL (polar) less technology using a Color Filter instead of a POL (polar) is provided, and the POL less technology reduces a Polarizer, thereby improving the light-emitting efficiency of the OLED display panel 101 and reducing the overall thickness of the OLED display.
However, as shown in fig. 2, since the polarizer 104 is not provided, the external reflection light cannot be effectively eliminated, and the deformation generated by the buffer heat dissipation layer 103 is transmitted to the OLED display panel 101, resulting in the marking of the OLED display panel 101.
In view of the above problems and disadvantages, an embodiment of the present invention provides a display module, as shown in fig. 3, including a display panel 210, a supporting backplate 220, a buffering heat dissipation member 230, and a planarization layer 240; the supporting back plate 220 is located on a side of the display panel 210 away from the light emitting surface; the buffer heat dissipation member 230 is located on a side of the support backplate 220 away from the display panel 210; the planarization layer 240 is located between the support backplate 220 and the buffer heat dissipation member 230, and is used for filling up the deformation of the buffer heat dissipation member 230, so as to keep the display panel 210 flat.
In the embodiment of the invention, the leveling layer 240 is disposed between the buffering heat dissipation member 230 and the supporting backplate 220, so that the deformation generated by the buffering heat dissipation member 230 is not transmitted to the display panel 210, and the display panel 210 is kept flat, thereby eliminating the reflected light without a polarizer and achieving the effect of no mark on the display panel 210.
In this embodiment, the buffer heat dissipation member 230 may include an SCF (Super Clean Foam) including a copper foil. The functions of the buffer heat-dissipating member 230 include supporting, buffering, heat-dissipating, light-shielding, and the like.
Specifically, as shown in fig. 4, the buffer heat-dissipating member 230 includes a foam buffer layer 231 and a heat-dissipating metal layer 232, one surface of the foam buffer layer 231 is covered with a planarization layer 240, and the other surface is connected to the heat-dissipating metal layer 232.
In one embodiment, the heat dissipation metal layer 232 may preferably be a copper foil, which has good heat dissipation. The deformation of the buffering heat dissipation member 230 is mainly caused by the deformation of the copper foil, for example, the area of the copper foil is raised upwards, which causes the display panel 210 to be locally raised, so that the light reflected at the raised part is seen by human eyes, which causes the display panel 210 to be imprinted. In this embodiment, the protrusion is covered and leveled by the leveling layer, so that the display panel 210 is kept flat and no impression occurs.
In one embodiment, the planarization layer 240 includes an optical adhesive layer formed by curing a liquid optical adhesive (OCR). Specifically, the liquid optical cement may be cured by Ultraviolet (UV) light exposure. In this embodiment, since the OCR material is in a fluid state before being cured, and has good fluidity, the deformation of the copper foil in the SCF can be filled up, so that the deformation cannot be transmitted to the display panel 210, and the flatness of the display panel 210 is maintained.
In one embodiment, the curing of the OCR material may be divided into two steps. Firstly, a layer of OCR material is coated on the surface of the SCF, and then pre-UV curing is carried out to preliminarily set the OCR material. And then after the supporting back plate 220 is attached, the copper foil is completely cured by UV light so as to cover the deformation of the copper foil and further achieve the purpose of improving the impression.
In one embodiment, the curing rate of the liquid optical adhesive in the planarization layer 240 is 94% to 99%. This further ensures that deformation of the buffer heat dissipation member 230 is masked and filled by the planarization layer 240.
In one embodiment, the ratio of the thickness of the planarization layer 240 to the thickness of the buffer heat dissipation member 230 is 1/2 to 1/11. For example, it may be preferable that the ratio of the thickness of the planarization layer 240 to the thickness of the buffer heat dissipation member 230 is 1/3, 1/4, or 1/5. This can maintain the functions of buffering, pressure resistance, heat dissipation, support, etc. of the buffer heat-dissipating member 230 in a normal state.
In one embodiment, the material of the support back plate 220 includes at least one of polyethylene terephthalate (PET) and Cyclic Olefin Polymer (COP).
In the prior art, the material of the supporting backplane 220 is mainly yellow PI (polyimide), which has a strong absorption peak in the ultraviolet band, and the transmittance of yellow PI is generally 40% to 50%, which all affect the exposure and curing of the OCR material. Therefore, in the present embodiment, the material of the supporting back plate 220 may be preferably polyethylene terephthalate, and the support filtering of the polyethylene terephthalate is more than 90%, which can improve the curing efficiency of the OCR material. On the other hand, the application of the CUP (under screen camera) technology is now wide, and in order to reduce the influence on the phase difference of the under screen camera, the material of the supporting back plate 220 may also be a cyclic olefin polymer, the filtering rate of which is also above 90%, and the influence on the phase difference of the camera is small.
In an embodiment, the display module further includes a cover glass 250 located on a light emitting surface side of the display panel 210, and the cover glass and the display panel 210 are bonded by a transparent optical adhesive 260.
An embodiment of the present invention provides a method for manufacturing a display module, as shown in fig. 5, including step S1, step S2, step S3, and step S4, which includes the following steps:
in step S1, the display panel 210, the buffer heat sink 230 and the supporting backplate 220 are provided.
In step S2, the liquid optical cement is coated on the buffer heat dissipation member 230 to fill up the deformation of the buffer heat dissipation member 230. Wherein a layer of OCR material may be sprayed on the surface of the buffer heat-dissipating member 230 by an IJP (inkjet printing) spraying apparatus.
Step S3, one side of the supporting backplate 220 is attached to the liquid optical cement, and the liquid optical cement is cured, so that the planarization layer 240 is formed between the supporting backplate 220 and the buffer heat dissipation member 230.
Step S4, the other side of the supporting back plate 220 is attached to the side of the display panel 210 departing from the light emitting surface, so as to obtain the display module.
The display module obtained through the above steps includes a display panel 210, a supporting backplate 220, a buffer heat dissipation member 230, and a planarization layer 240; the supporting back plate 220 is located on a side of the display panel 210 away from the light emitting surface; the buffer heat dissipation member 230 is located on a side of the support backplate 220 away from the display panel 210; the planarization layer 240 is located between the support backplate 220 and the buffer heat dissipation member 230, and is used for filling up the deformation of the buffer heat dissipation member 230, so as to keep the display panel 210 flat.
In the embodiment of the invention, the leveling layer 240 is disposed between the buffering heat dissipation member 230 and the supporting backplate 220, so that the deformation generated by the buffering heat dissipation member 230 is not transmitted to the display panel 210, and the display panel 210 is kept flat, thereby eliminating the reflected light without a polarizer and achieving the effect of no mark on the display panel 210.
In one embodiment, after step S2, the method further includes:
the liquid optical cement on the buffer heat dissipation member 230 is pre-cured to obtain the pre-cured optical cement.
Specifically, in the above steps, the step of pre-curing the liquid optical cement on the buffering heat dissipation member 230 includes:
passing through 100mJ/cm 2 To 700mJ/cm 2 The liquid optical cement on the buffer heat dissipation member 230 is pre-cured by the curing energy. This allows the OCR material to be initially sized.
In one embodiment, the step of curing the liquid optical cement includes:
passing through 3000mJ/cm 2 To 6000mJ/cm 2 The curing energy of (2) is used to cure the liquid optical cement on the buffer heat-dissipating member 230. Thus, the OCR material is completely cured to cover the deformation of the buffering heat dissipation member 230 and prevent the display panel 210 from being marked.
In the prior art, the production process of the flexible display module generally sequentially comprises the following process steps:
IC & FPC Bonding: the chip is connected with the flexible circuit board;
IC Tape Lami: bonding the chip substrate;
bending MLC: dispensing technology for the chip and the flexible circuit board;
LLO: carrying out laser stripping on the flexible substrate and the glass substrate;
BP Lami: attaching a back support plate (BP);
2 nd cut: secondary cutting;
OCA Lami Panel: transparent optical cement is sprayed on the surface of a display panel (panel);
CG Lami Panel: the glass cover plate is attached to the display panel;
PF Lami: coating a protective film on the glass cover plate;
SCF Lami: attaching the SCF;
and (3) Pad bonding: the flexible panel is bent.
In this embodiment, considering that the OCR material is a light-curing material and the SCF has a light-shielding property, process changes are required in the conventional OLED module production, which is specifically as follows:
firstly, the following steps are carried out:
IC&FPC Bonding, IC Tape Lami, Bonding MLC, LLO and 2 nd Cut。
Simultaneously carrying out:
SCF coating OCR: coating OCR on the surface of the SCF;
UV pre-curing: passing through 100mJ/cm 2 To 700mJ/cm 2 Ultraviolet light of curing energy enables OCR to be pre-cured;
SCF BP Lami: SCF and BP are bonded;
UV curing: passing through 3000mJ/cm 2 To 6000mJ/cm 2 Curing the OCR by ultraviolet light with curing energy, and completely molding the leveling layer;
then, carrying out:
SCF & BP Lami Panel: attaching SCF & BP to Panel;
and finally, carrying out:
OCA Lami Panel, CG Lami Panel, PF Lami and Pad binding.
The display module of this embodiment may be a Flexible OLED display, and the Flexible OLED display is a Flexible display device made of a Flexible Substrate (Flexible Substrate), and generally adopts a Flexible Polyimide (PI) Substrate. After an Array (Array) and a light emitting Layer (Emission Layer) are manufactured on a glass substrate, the OLED display panel starts to enter an LLO (Laser Lift Off) working section.
The principle of the LLO process is as follows: the Glass surface is irradiated by a 308nm laser, and Van der Waals force between the Glass and the PI layer is broken through the energy, so that the viscosity is lost, and the separation between the Glass and the PI is realized.
In one embodiment, the display panel 210 is a flexible display panel, as shown in fig. 6, and includes a flexible substrate 211 and a display function layer 212 disposed on the flexible substrate 211; the flexible substrate 211 contains ultraviolet light absorbing particles of Metal-organic framework (MOF) for absorbing ultraviolet light, the Metal-organic framework is a porous polymer material with an ultra-large specific surface area, so that the ultra-large specific surface area of the MOF material enables the ultraviolet light absorbing particles to provide a huge contact surface to contact with laser, and thus, the ultraviolet light absorbing particles of the Metal-organic framework are doped in the flexible substrate 211 less, and simultaneously, the redundant ultraviolet light in the LLO process can be effectively absorbed.
Specifically, the UV-absorbing particles of the metal-organic framework compound have a specific surface area (BET) of greater than 1000m 2 (ii) in terms of/g. The maximum absorption light wavelength of the metal-organic framework compound is 280-320 nm. The material of the ultraviolet light absorbing particles is titanium-containing metal-organic framework compound (Ti-MOF).
The titanium-containing metal organic framework compound is obtained by reacting bis (acetylacetone) diisopropyl titanate with terephthalic acid under proper conditions. The particle size of the titanium-containing metal organic framework compound particle is 500-700nm, and the specific surface area can be up to 1364m 2 And due to the existence of titanium (Ti), the titanium-containing metal organic framework compound has excellent ultraviolet absorption capacity at about 300nm and is matched with the laser wavelength (308nm) used by the LLO process.
In one embodiment, the flexible substrate 211 is a Polyimide (PI) substrate.
The display function layer 212 in one embodiment includes a buffer layer 2121, a TFT layer 2122, an OLED layer 2123, and a thin film encapsulation layer 2124 sequentially stacked on the flexible substrate 211.
Specifically, the buffer layer 2121 is a silicon nitride (SiNx) layer, a silicon oxide (SiOx) layer, or a stacked combination of the two.
Specifically, the TFT layer 2122 is used for driving the OLED layer 2123, and includes a plurality of TFT devices arranged in an array, where the TFT devices are Low Temperature Polysilicon (LTPS) type or Metal-Oxide Semiconductor (MOS) type, such as indium-gallium-zinc-Oxide (IGZO) type.
Specifically, the OLED layer 2123 includes a first electrode layer provided on the TFT layer 2122, a pixel defining layer provided on the TFT layer 2122 and the first electrode layer, an organic functional layer provided on the first electrode layer, and a second electrode layer (not shown) provided on the pixel defining layer and the organic functional layer. The pixel definition layer surrounds a plurality of pixel openings which are arranged in an array on the first electrode layer; the organic functional layer is arranged in the pixel opening; the organic functional layer in each pixel opening, the first electrode layer corresponding to the lower part of the organic functional layer and the second electrode layer corresponding to the upper part of the organic functional layer form an OLED device together.
Specifically, the first electrode layer and the second electrode layer are respectively used as an Anode (Anode) and a Cathode (Cathode) of the OLED device; the organic functional layer comprises a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer which are sequentially arranged from bottom to top.
In summary, in the embodiment of the invention, the planarization layer 240 is disposed between the buffering heat dissipation member 230 and the supporting backplane 220, so that the deformation generated by the buffering heat dissipation member 230 is not transmitted to the display panel 210, and the display panel 210 is kept flat, thereby eliminating the reflected light without using a polarizer and achieving the effect of no mark on the display panel 210.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A display module, comprising:
a display panel;
the supporting back plate is positioned on one side of the display panel, which is far away from the light-emitting surface;
the buffering heat dissipation component is positioned on one side of the supporting backboard far away from the display panel;
and the leveling layer is positioned between the support backboard and the buffering heat dissipation component and is used for filling up the deformation position of the buffering heat dissipation component so as to keep the display panel flat.
2. The display module assembly according to claim 1, wherein the buffer heat dissipation member comprises a foam buffer layer and a heat dissipation metal layer, one surface of the foam buffer layer is covered with the leveling layer, and the other surface of the foam buffer layer is connected with the heat dissipation metal layer.
3. The display module of claim 1, wherein the planarization layer comprises an optical glue layer formed by curing a liquid optical glue.
4. The display module of claim 3, wherein the curing rate of the liquid optical adhesive in the planarization layer is 94-99%.
5. The display module of claim 1, wherein a ratio of a thickness of the planarization layer to a thickness of the buffer heat sink member is 1/2-1/11.
6. The display module of claim 1, wherein the material of the supporting backplane comprises at least one of polyethylene terephthalate and cyclic olefin polymer.
7. A manufacturing method of a display module is characterized by comprising the following steps:
providing a display panel, a buffer heat dissipation component and a support backboard;
coating liquid optical cement on the buffering heat dissipation component so as to enable the liquid optical cement to fill up the deformation position of the buffering heat dissipation component;
attaching one side of the supporting back plate to the liquid optical cement, and carrying out primary curing on the liquid optical cement so as to form a leveling layer between the supporting back plate and the buffering heat dissipation component;
and attaching the other side of the support back plate to one side of the display panel, which is far away from the light-emitting surface, so as to obtain the display module.
8. The method for manufacturing a display module according to claim 7, further comprising, after the step of applying the liquid optical cement to the buffer heat dissipation member to fill the deformation of the buffer heat dissipation member with the liquid optical cement, the step of:
and precuring the liquid optical cement on the buffer heat dissipation member to obtain the precured optical cement.
9. The method for manufacturing a display module according to claim 8, wherein the step of pre-curing the liquid optical cement on the buffer heat dissipation member comprises:
passing through 100mJ/cm 2 To 700mJ/cm 2 The liquid optical cement on the buffer heat dissipation component is pre-cured by the curing energy.
10. The method of claim 7, wherein the step of curing the liquid optical adhesive comprises:
passing through 3000mJ/cm 2 To 6000mJ/cm 2 The curing energy of (a) is to substantially cure the liquid optical cement on the buffer heat-dissipating member.
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