TWI838209B - Light-emitting device - Google Patents

Abstract

A light-emitting device includes a circuit substrate, plural light-emitting elements, an encapsulation block and an encapsulation layer. The light-emitting elements are disposed on the circuit substrate. The encapsulation block is disposed at a marginal area of the circuit substrate. The encapsulation layer is disposed between the light-emitting elements and between the light-emitting elements and the encapsulation block, and the encapsulation layer contacts the encapsulation block.

Description

Light emitting device

The present invention relates to a photoelectric device, and in particular to a light-emitting device.

Micro-LED displays have the advantages of power saving, high efficiency, high brightness and fast response time. At present, the packaging structure of non-transmissive Micro-LED displays uses inkjet printing to spray a low-viscosity packaging liquid, and then solidifies the packaging liquid to form a light-shielding packaging layer. However, since the packaging liquid will spread at the edge of the display and the thickness is insufficient, the edge thickness of the packaging layer after curing is thin, resulting in edge light leakage of the display.

The present invention provides a light-emitting device that can improve the problem of light leakage at the edge.

An embodiment of the present invention provides a light-emitting device, comprising: a circuit substrate, a plurality of light-emitting elements, a packaging block, and a packaging layer. The plurality of light-emitting elements are located on the circuit substrate. The packaging block is located on the edge area of the circuit substrate. The packaging layer is located between the plurality of light-emitting elements and between the plurality of light-emitting elements and the packaging block, and the packaging layer contacts the packaging block.

In one embodiment of the present invention, there is an interface between the above-mentioned packaging layer and the packaging block.

In one embodiment of the present invention, the above-mentioned packaging block extends along the edge area of the circuit substrate and surrounds the packaging layer.

In one embodiment of the present invention, the above-mentioned packaging layer extends along the side surface of the light-emitting element and protrudes from the horizontal upper surface of the packaging layer.

In one embodiment of the present invention, the viscosity of the above-mentioned packaging block before solidification is greater than the viscosity of the packaging layer before solidification.

In one embodiment of the present invention, the above-mentioned light-emitting device also includes a sealant covering the side surface of the circuit substrate and the bottom surface of the package block.

In one embodiment of the present invention, the upper surface of the sealant is higher than the upper surface of the circuit substrate.

In one embodiment of the present invention, the viscosity of the above-mentioned sealant is greater than the viscosity of the packaging block before curing.

An embodiment of the present invention provides a light-emitting device, comprising: a circuit substrate, a plurality of light-emitting elements, a first packaging layer and a second packaging layer. The plurality of light-emitting elements are located on the circuit substrate. The first packaging layer is located on the circuit substrate and between the plurality of light-emitting elements. The second packaging layer is located on the first packaging layer and between the plurality of light-emitting elements. The second packaging layer extends along the side surfaces of the plurality of light-emitting elements and protrudes from the horizontal upper surface of the second packaging layer.

In one embodiment of the present invention, the shortest distance between the side surface of the first packaging layer and the light-emitting element is greater than the shortest distance between the side surface of the circuit substrate and the light-emitting element.

In one embodiment of the present invention, the viscosity of the first packaging layer after heating is greater than the viscosity of the second packaging layer before curing.

In one embodiment of the present invention, the height of the horizontal upper surface of the second packaging layer is lower than the height of the upper surface of the light-emitting element.

In one embodiment of the present invention, the light transmittance of the first packaging layer is 99% to 99.5%.

In one embodiment of the present invention, the light transmittance of the second packaging layer is less than or equal to 1%.

In one embodiment of the present invention, the above-mentioned light-emitting device also includes a sealant covering the side surface of the circuit substrate and the lower surface of the first packaging layer.

In one embodiment of the present invention, the upper surface of the sealant is flush with the upper surface of the circuit substrate.

In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.

10,20: Light-emitting device

110: Circuit board

110B, 140B, 230B: Lower surface

110E: Borderland

110S: Side surface

110T, 120T, 260T: Upper surface

120: Light-emitting element

120S: Side surface

130,260: Sealant

130T: Top

140:Package block

140S: Side surface

150: Packaging layer

150P, 240P: protrusion

150T, 240T: Horizontal upper surface

160,250: Optical layer

161,251: Adhesive layer

230: First packaging layer

230’: Initial first packaging layer

230T: Upper surface

240: Second packaging layer

CT: cutting process

D1,D2: Shortest distance

IF: Interface

L1, L3, L4: Length

PD: pad

S11,S12,S31,S32,S41,S42,S51,S52: side surface

W1,W2,W3:Width

Figures 1A to 1F are cross-sectional schematic diagrams of the steps of the manufacturing method of the light-emitting device 10 of an embodiment of the present invention.

Figures 2A to 2G are cross-sectional schematic diagrams of the steps of the manufacturing method of the display panel 20 of an embodiment of the present invention.

In the accompanying drawings, the thickness of layers, films, panels, regions, etc., is exaggerated for clarity. Throughout the specification, the same figure reference numerals represent the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or an intermediate element may also exist. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, there is no intermediate element. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrically connected" or "coupled" may be the presence of other elements between two elements.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and/or parts, these elements, components, regions, layers and/or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, the first "element", "component", "region", "layer" or "part" discussed below can be referred to as the second element, component, region, layer or part without departing from the teachings of this article.

The terms used herein are for the purpose of describing specific embodiments only and are not limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms, including "at least one" or to mean "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the relevant listed items. It should also be understood that when used in this specification, the terms "include" and/or "include" specify the presence of the features, regions, wholes, steps, operations, elements and/or parts, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, parts and/or combinations thereof.

Additionally, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is flipped, the elements described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" can include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one figure is flipped, the elements described as being "lower" or "below" the other elements will be oriented as being "above" the other elements. Thus, the exemplary term "lower" or "below" can include both "upper" and "lower" orientations.

Taking into account the measurement in question and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system), "about", "approximately", or "substantially" as used herein includes the stated value and the average value within an acceptable deviation range of the specific value determined by a person of ordinary skill in the art. For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, "about", "approximately", or "substantially" as used herein can select a more acceptable deviation range or standard deviation based on the optical properties, etching properties, or other properties, and can apply to all properties without a single standard deviation.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by ordinary technicians in the field to which the present invention belongs. It will be further understood that those terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present invention, and will not be interpreted as an idealized or overly formal meaning unless expressly defined as such in this document.

Exemplary embodiments are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments. Therefore, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and/or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as limited to the particular shapes of the regions as shown herein, but rather include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat may typically have rough and/or nonlinear features. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

FIG. 1A to FIG. 1F are cross-sectional schematic diagrams of the step flow of the manufacturing method of the light-emitting device 10 of an embodiment of the present invention. First, please refer to FIG. 1A to provide a circuit substrate 110. In some embodiments, the circuit substrate 110 includes components or circuits required by the light-emitting device 10, such as driving components, switching components, storage capacitors, power lines, driving signal lines, timing signal lines, current compensation lines, detection signal lines, etc. In some embodiments, the circuit substrate 110 includes a switching component array. In some embodiments, the circuit substrate 110 includes a plurality of pads PD for electrically connecting the circuit substrate 110 to the outside. In some embodiments, the plurality of pads PD are disposed on the upper surface 110T of the circuit substrate 110.

Next, multiple light-emitting elements 120 are arranged on the circuit substrate 110. In some embodiments, multiple light-emitting elements 120 formed on a growth substrate (e.g., a sapphire substrate) can be transferred to a temporary carrier (not shown) by a mass transfer process, and the light-emitting elements 120 can be fixed to the temporary carrier by, for example, an adhesive material. Afterwards, multiple light-emitting elements 120 on the temporary carrier can be placed on the circuit substrate 110 respectively by, for example, pick-up bonding or direct bonding. The light-emitting element 120 can be electrically connected to the circuit substrate 110. In some embodiments, the light-emitting element 120 can be electrically connected to the circuit substrate 110 through a pad PD on the circuit substrate 110.

Next, a sealant 130 is formed on the side surface 110S of the circuit substrate 110. In some embodiments, the width W1 of the sealant 130 is about 200 μm to 300 μm. In some embodiments, the sealant 130 also extends to the upper surface 110T and the lower surface 110B of the circuit substrate 110. In some embodiments, the sealant 130 can be formed by dispensing. In some embodiments, the sealant 130 includes an acrylic resin or an epoxy resin, but the present invention is not limited thereto.

Next, referring to FIG. 1B , a package block 140 is formed on the edge region 110E of the circuit substrate 110, and then the package block 140 is cured. In some embodiments, the width W2 of the edge region 110E of the circuit substrate 110 is approximately 50 μm to 200 μm. The width W2 of the edge region 110E may be approximately the distance between the side surface 140S of the package block 140 adjacent to the light emitting element 120 and the side surface 110S of the circuit substrate 110. In some embodiments, the circuit substrate 110 has a rectangular profile, for example, and the edge region 110E of the circuit substrate 110 has a rectangular ring profile, and the package block 140 may extend along the entire edge region 110E of the circuit substrate 110, so that the package block 140 also has a rectangular ring profile. In some embodiments, the package block 140 is also formed on the sealant 130. In some embodiments, the package block 140 overlaps the edge region 110E of the circuit substrate 110 and the portion of the sealant 130 adjacent to the circuit substrate 110. In some embodiments, the width W3 of the package block 140 is approximately 150 μm to 300 μm. The material of the package block 140 may have the characteristics of high viscosity before curing and not easy to spread. In some embodiments, the package block 140 may include an organic material, such as an acrylic resin or an epoxy resin, but the present invention is not limited thereto. In some embodiments, the package block 140 may be formed using inkjet printing.

Next, referring to FIG. 1C , a packaging layer 150 is formed on the circuit substrate 110, between the plurality of light-emitting elements 120, and between the plurality of light-emitting elements 120 and the packaging block 140, and then the packaging layer 150 is cured. The height of the horizontal upper surface 150T of the packaging layer 150 may be lower than or equal to the height of the upper surface 120T (or light-emitting surface) of the light-emitting element 120. In some embodiments, an initial packaging layer may be formed on the circuit substrate 110 by, for example, inkjet printing, and the initial packaging layer may be disposed between the plurality of light-emitting elements 120 and between the plurality of light-emitting elements 120 and the packaging block 140, and the initial packaging layer may cover the plurality of light-emitting elements 120. Subsequently, the initial encapsulation layer is subjected to a planarization process to form an encapsulation layer 150, and the encapsulation layer 150 can at least expose the upper surface 120T (or the light emitting surface) of the light emitting element 120. Compared with the encapsulation block 140, the material of the encapsulation layer 150 (or the above-mentioned initial encapsulation layer) has the characteristics of low viscosity and easy flow before curing. In this way, in the process of forming the initial encapsulation layer, the encapsulation block 140 can prevent the edge of the initial encapsulation layer from being thinned due to flow, so that the initial encapsulation layer and the encapsulation layer 150 after curing can have improved thickness uniformity. In some embodiments, the encapsulation layer 150 before curing will also extend upward along the side surface 120S of the light-emitting element 120 to form a protrusion 150P protruding from the horizontal upper surface 150T of the encapsulation layer 150.

In some embodiments, the initial encapsulation layer may be planarized by plasma etching. In some embodiments, the encapsulation layer 150 includes an anti-reflection material or a light absorbing material. In some embodiments, the material of the encapsulation layer 150 may include an organic material, such as epoxy resin or silicone resin, but the present invention is not limited thereto.

Next, referring to FIG. 1D , an optical layer 160 is formed on the packaging layer 150, the packaging block 140, and the plurality of light-emitting elements 120. In some embodiments, the optical layer 160 can be disposed on the packaging layer 150, the packaging block 140, and the plurality of light-emitting elements 120 by lamination. In some embodiments, the optical layer 160 includes a polarizer, an anti-glare film, an anti-reflection film, etc. In some embodiments, the optical layer 160 is fixed to the packaging layer 150, the packaging block 140, and the plurality of light-emitting elements 120 by an adhesive layer 161.

Next, referring to FIG. 1E , the optical layer 160, the adhesive layer 161, the package block 140, and the sealant 130 may be subjected to a cutting process CT to form the light emitting device 10 shown in FIG. 1F . In some embodiments, the optical layer 160, the adhesive layer 161, the package block 140, and the sealant 130 may be cut using a laser. For example, the optical layer 160, the adhesive layer 161, the package block 140, and the sealant 130 may be cut using an ultraviolet (UV) laser or an infrared (IR) laser. In some embodiments, the optical layer 160, the adhesive layer 161, the package block 140, and the sealant 130 may be subjected to a cutting process CT individually. In some embodiments, the optical layer 160, the adhesive layer 161, the package block 140 and the sealant 130 can be cut in the same cutting process CT.

FIG1F is a cross-sectional schematic diagram of a light-emitting device 10 according to an embodiment of the present invention. The light-emitting device 10 includes: a circuit substrate 110, a plurality of light-emitting elements 120, a package block 140, and a package layer 150. The plurality of light-emitting elements 120 are located on the circuit substrate 110. The package block 140 is located on the edge area 110E of the circuit substrate 110. The package layer 150 is located between the plurality of light-emitting elements 120 and between the plurality of light-emitting elements 120 and the package block 140, and the package layer 150 physically contacts the package block 140.

In some embodiments, the package block 140 extends along the edge area 110E of the circuit substrate 110. In some embodiments, the package block 140 surrounds the package layer 150, and the package block 140 has a rectangular ring profile, for example. In some embodiments, the package layer 150 has a different viscosity than the package block 140 before curing, and after curing, an interface IF is formed between the package layer 150 and the package block 140. In some embodiments, the viscosity of the package block 140 before curing is greater than the viscosity of the package layer 150 before curing. In some embodiments, the viscosity of the package layer 150 before curing is 15 centipoise (cp) to 20 cp. Since the encapsulation block 140 can prevent the edge of the encapsulation layer 150 from becoming thinner due to the ripples, it can prevent the light-emitting device 10 from leaking light from the edge.

In some embodiments, the horizontal upper surface 150T of the encapsulation layer 150 is lower than the upper surface 120T of the light-emitting element 120. In some embodiments, the protrusion 150P of the encapsulation layer 150 extends along the side surface 120S of the light-emitting element 120 and protrudes from the horizontal upper surface 150T of the encapsulation layer 150.

In some embodiments, the light emitting device 10 further includes a sealant 130, and the sealant 130 covers the side surface 110S of the circuit substrate 110 and the lower surface 140B of the package block 140. In some embodiments, the level of the top surface 130T of the sealant 130 is higher than the level of the upper surface 110T of the circuit substrate 110. In some embodiments, the viscosity of the sealant 130 is greater than the viscosity of the package block 140 before curing.

In some embodiments, the light-emitting device 10 further includes an optical layer 160, which is located on the plurality of light-emitting elements 120, the packaging layer 150, and the packaging block 140. In some embodiments, the light-emitting device 10 further includes an adhesive layer 161, which is located between the optical layer 160 and the plurality of light-emitting elements 120, the packaging layer 150, and the packaging block 140, and the optical layer 160 is fixed to the light-emitting elements 120, the packaging layer 150, and the packaging block 140 by the adhesive layer 161.

Below, other embodiments of the present invention are described using FIGS. 2A to 2G, and the component numbers and related contents of the embodiments of FIGS. 1A to 1F are used, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the embodiments of FIGS. 1A to 1F, which will not be repeated in the following description.

FIG. 2A to FIG. 2G are cross-sectional schematic diagrams of the step flow of the manufacturing method of the display panel 20 of an embodiment of the present invention. First, referring to FIG. 2A, a circuit substrate 110 is provided. Then, a plurality of light-emitting elements 120 are arranged on the circuit substrate 110. Then, an initial first packaging layer 230' is formed on the circuit substrate 110 and the plurality of light-emitting elements 120. In some embodiments, the semi-cured adhesive film of the initial first packaging layer 230' can be attached to the circuit substrate 110 and the plurality of light-emitting elements 120, and then heated to make the adhesive film flow and fill between the light-emitting elements 120 to form the initial first packaging layer 230'.

The initial first packaging layer 230' may completely cover the plurality of light-emitting elements 120, and the length L3 of the initial first packaging layer 230' is greater than the length L1 of the circuit substrate 110. The circuit substrate 110 may completely overlap the initial first packaging layer 230', and the orthographic projection of the circuit substrate 110 on the initial first packaging layer 230' may completely fall within the initial first packaging layer 230'. In some embodiments, the side surface S31 of the initial first packaging layer 230' extends beyond the side surface S11 of the circuit substrate 110, and the side surface S32 of the initial first packaging layer 230' extends beyond the side surface S12 of the circuit substrate 110. In other words, the shortest distance between the side surface S31 and the light-emitting element 120 is greater than the shortest distance between the light-emitting elements 120 on the side surface S11, and the shortest distance between the side surface S32 and the light-emitting element 120 is greater than the shortest distance between the light-emitting elements 120 on the side surface S12.

Next, referring to FIG. 2B , the initial first package layer 230' is planarized to expose the light-emitting element 120 and form the first package layer 230. In some embodiments, the initial first package layer 230' can be planarized by plasma etching. In some embodiments, the height of the upper surface 230T of the first package layer 230 is lower than the height of the upper surface 120T of the light-emitting element 120 to expose the upper surface 120T (or light-emitting surface) of the light-emitting element 120. In some embodiments, the first package layer 230 includes a transparent package material. For example, the first package layer 230 includes an organic adhesive, such as an epoxy resin material, but the present invention is not limited thereto.

Next, referring to FIG. 2C , the second encapsulation layer 240 may be formed on the first encapsulation layer 230 by, for example, inkjet printing, and then the second encapsulation layer 240 is cured. The height of the horizontal upper surface 240T of the second encapsulation layer 240 may be lower than the height of the upper surface 120T of the light-emitting element 120 to expose the upper surface 120T (or light-emitting surface) of the light-emitting element 120. In some embodiments, the second encapsulation layer 240 includes an anti-reflective material, such as a black light-absorbing material. In some embodiments, the viscosity of the first encapsulation layer 230 after heating is greater than the viscosity of the second encapsulation layer 240 before curing. In some embodiments, the second encapsulation layer 240 may be formed by inkjet printing. In some embodiments, the length L4 of the second packaging layer 240 is at least greater than the length L1 of the circuit substrate 110, and the length L4 of the second packaging layer 240 is less than the length L3 of the first packaging layer 230. In this way, the edge portion of the second packaging layer 240 with a thinner thickness due to the ripple can be located on the area of the first packaging layer 230 that does not overlap the circuit substrate 110, so that the portion of the second packaging layer 240 that overlaps the circuit substrate 110 can have improved thickness uniformity.

In some embodiments, the second packaging layer 240 before curing will also extend upward along the side surface 120S of the light-emitting element 120 to form a protrusion 240P protruding from the horizontal upper surface 240T of the second packaging layer 240. In some embodiments, the side surface S41 of the second packaging layer 240 extends beyond the side surface S11 of the circuit substrate 110, and the side surface S42 of the second packaging layer 240 extends beyond the side surface S12 of the circuit substrate 110. In other words, the circuit substrate 110 can completely overlap the second packaging layer 240, and the orthographic projection of the circuit substrate 110 on the second packaging layer 240 can completely fall into the second packaging layer 240.

Next, referring to FIG. 2D , an optical layer 250 is formed on the second packaging layer 240 and the plurality of light-emitting elements 120. In some embodiments, the side surfaces S51 and S52 of the optical layer 250 extend beyond the side surfaces S11 and S12 of the circuit substrate 110, respectively. In some embodiments, the side surfaces S51 and S52 of the optical layer 250 extend beyond the side surfaces S41 and S42 of the second packaging layer 240, respectively. In some embodiments, the optical layer 250 is fixed to the second packaging layer 240 and the plurality of light-emitting elements 120 by an adhesive layer 251.

Next, please refer to FIG. 2E to form a sealant 260 on the side surfaces S11 and S12 of the circuit substrate 110 and the lower surface 230B of the first packaging layer 230. In some embodiments, the upper surface 260T of the sealant 260 is flush with the upper surface 110T of the circuit substrate 110. In some embodiments, the sealant 260 can be formed by spraying or coating.

Next, referring to FIG. 2F , the optical layer 250 , the adhesive layer 251 , the second packaging layer 240 , the first packaging layer 230 , and the sealant 260 are subjected to a cutting process CT to form the light-emitting device 20 shown in FIG. 2G . In some embodiments, a laser may be used to cut the optical layer 250 , the adhesive layer 251 , the second packaging layer 240 , the first packaging layer 230 , and the sealant 260 . For example, a UV laser or an IR laser may be used to cut the optical layer 250 , the adhesive layer 251 , the second packaging layer 240 , the first packaging layer 230 , and the sealant 260 .

FIG2G is a cross-sectional schematic diagram of a light-emitting device 20 according to an embodiment of the present invention. The light-emitting device 20 includes: a circuit substrate 110, a plurality of light-emitting elements 120, a first packaging layer 230, and a second packaging layer 240. The plurality of light-emitting elements 120 are located on the circuit substrate 110. The first packaging layer 230 is located on the circuit substrate 110 and between the plurality of light-emitting elements 120. The second packaging layer 240 is located on the first packaging layer 230 and between the plurality of light-emitting elements 120. The second packaging layer 240 extends along the side surfaces 120S of the plurality of light-emitting elements 120 and protrudes from the horizontal upper surface 240T of the second packaging layer 240.

In some embodiments, the side surfaces S31 and S32 of the first packaging layer 230 protrude from the side surfaces S11 and S12 of the circuit substrate 110, respectively. In some embodiments, the shortest distance D1 between the side surface S31 of the first packaging layer 230 and the light-emitting element 120 is greater than the shortest distance D2 between the side surface S11 of the circuit substrate 110 and the light-emitting element 120. In some embodiments, the viscosity of the first packaging layer 230 after heating is greater than the viscosity of the second packaging layer 240 before curing. In some embodiments, the viscosity of the first packaging layer 230 after heating is 400cp to 1000cp. In some embodiments, the viscosity of the second packaging layer 240 before curing is 15cp to 20cp.

In some embodiments, the light transmittance of the first encapsulation layer 230 is greater than or equal to 99%, for example, 99% to 99.5%. In some embodiments, the second encapsulation layer 240 includes an anti-reflection material or a light absorbing material. In some embodiments, the light transmittance of the second encapsulation layer 240 is less than or equal to 1%. In some embodiments, the horizontal upper surface 240T of the second encapsulation layer 240 is lower than the upper surface 120T of the light-emitting element 120. In some embodiments, the protrusion 240P of the second encapsulation layer 240 extends along the side surface 120S of the light-emitting element 120 and protrudes from the horizontal upper surface 240T of the second encapsulation layer 240.

In some embodiments, since the side surfaces S31 and S32 of the first packaging layer 230 protrude from the side surfaces S11 and S12 of the circuit substrate 110, respectively, the side surfaces S41 and S42 of the second packaging layer 240 formed on the first packaging layer 230 can protrude from the side surfaces S11 and S12 of the circuit substrate 110, respectively. In this way, the edge portion of the second packaging layer 240 that may be thinner due to the spread can be located outside the orthographic projection of the circuit substrate 110 on the second packaging layer 240, thereby avoiding the problem of edge light leakage in the light-emitting device 20.

In some embodiments, the light emitting device 20 further includes a sealant 260, and the sealant 260 covers the side surfaces S11 and S12 of the circuit substrate 110 and the lower surface 230B of the first packaging layer 230. In some embodiments, the upper surface 260T of the sealant 260 is flush with the upper surface 110T of the circuit substrate 110.

In some embodiments, the light-emitting device 20 further includes an optical film 250, which is located on the plurality of light-emitting elements 120 and the second packaging layer 240. In some embodiments, the light-emitting device 20 further includes an adhesive layer 251, which is located between the optical film 250 and the plurality of light-emitting elements 120 and the second packaging layer 240, and the optical film 250 is fixed to the light-emitting elements 120 and the second packaging layer 240 by the adhesive layer 251.

In summary, the light-emitting device of the present invention prevents the edge of the packaging layer from becoming thinner due to the spreading of the light by setting a packaging block, thereby avoiding the edge light leakage of the light-emitting device. In addition, the light-emitting device of the present invention makes the side surfaces of the first packaging layer and the second packaging layer protrude from the side surface of the circuit substrate respectively, so that the edge of the second packaging layer that may be thinner due to the spreading of the light can be located outside the orthographic projection of the circuit substrate on the second packaging layer, thereby avoiding the edge light leakage of the light-emitting device.

Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.

10: Light-emitting device

110: Circuit board

110E: Borderland

110S: Side surface

110T,120T: Upper surface

120: Light-emitting element

120S: Side surface

130: Sealant

130T: Top

140:Package block

140B: Lower surface

150: Packaging layer

150P: protrusion

150T: horizontal upper surface

160: Optical layer

161: Adhesive layer

IF: Interface

Claims (14)

A light-emitting device comprises: a circuit substrate; a plurality of light-emitting elements located on the circuit substrate; a package block located on an edge region of the circuit substrate; and a package layer located between the plurality of light-emitting elements and between the plurality of light-emitting elements and the package block, and the package layer contacts the package block, wherein the package block extends along the edge region of the circuit substrate and surrounds the package layer. A light-emitting device as described in claim 1, wherein there is an interface between the packaging layer and the packaging block. A light-emitting device as described in claim 1, wherein the encapsulation layer extends along the side surface of the light-emitting element and protrudes from the horizontal upper surface of the encapsulation layer. A light-emitting device as described in claim 1, wherein the viscosity of the encapsulation block before curing is greater than the viscosity of the encapsulation layer before curing. The light-emitting device as described in claim 1 further includes a sealant covering the side surface of the circuit substrate and the bottom surface of the package block. A light-emitting device as described in claim 5, wherein the upper surface of the sealant is higher than the upper surface of the circuit substrate. A light-emitting device as described in claim 5, wherein the viscosity of the sealant is greater than the viscosity of the packaging block before curing. A light-emitting device comprises: a circuit substrate; a plurality of light-emitting elements located on the circuit substrate; a first packaging layer located on the circuit substrate and between the plurality of light-emitting elements; a second packaging layer located on the first packaging layer and between the plurality of light-emitting elements, wherein the second packaging layer extends along the side surfaces of the plurality of light-emitting elements and protrudes from the horizontal upper surface of the second packaging layer; and a sealing compound covering the side surface of the circuit substrate and the lower surface of the first packaging layer. A light-emitting device as described in claim 8, wherein the shortest distance between the side surface of the first packaging layer and the light-emitting element is greater than the shortest distance between the side surface of the circuit substrate and the light-emitting element. A light-emitting device as described in claim 8, wherein the viscosity of the first encapsulation layer after heating is greater than the viscosity of the second encapsulation layer before curing. A light-emitting device as described in claim 8, wherein the height of the horizontal upper surface of the second encapsulation layer is lower than the height of the upper surface of the light-emitting element. A light-emitting device as described in claim 8, wherein the light transmittance of the first encapsulation layer is 99% to 99.5%. A light-emitting device as described in claim 12, wherein the light transmittance of the second encapsulation layer is less than or equal to 1%. A light-emitting device as described in claim 8, wherein the upper surface of the sealant is flush with the upper surface of the circuit substrate.

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