CN107833907B - Flexible OLED display device and glue sealing method - Google Patents
Flexible OLED display device and glue sealing method Download PDFInfo
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- CN107833907B CN107833907B CN201711167173.2A CN201711167173A CN107833907B CN 107833907 B CN107833907 B CN 107833907B CN 201711167173 A CN201711167173 A CN 201711167173A CN 107833907 B CN107833907 B CN 107833907B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention provides a flexible OLED display device and a sealing method, wherein the device comprises: the flexible substrate comprises a display area and a non-display area, wherein the non-display area comprises a first connecting area; the chip on film is arranged at the edge of the flexible substrate corresponding to the first connecting area; the connecting terminal is positioned between the flexible substrate and the chip on film and is used for electrically connecting the chip on film and the flexible substrate; the flexible substrate is provided with a non-display area, a flexible substrate is arranged in the non-display area, a flip chip film at least covers one part of the non-display area of the flexible substrate, a first sealing area and a concave area are further arranged in the covering area of the flexible substrate, and the first sealing area and the concave area are sequentially arranged on one side, away from the display area, of the first connecting area in parallel. The problems that glass cannot be normally peeled off and connection is unstable due to glass cullet are solved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible OLED display device and a sealing method.
Background
The AMOLED has the characteristics of high resolution, large wide viewing angle, quick response, self-luminescence and the like. In a flexible AMOLED connection (Bonding) process, in order to prevent a connection terminal from being corroded, a molding process is often performed after the connection process, so as to protect the connection terminal structure from being corroded and improve connection stability. However, there is a risk in applying a glue to the back side of a Chip On Film (COF) connection, because the glue cannot be applied to a large thickness, the glue may contact the backplane glass, and may remain on the backplane glass after curing, and when the glass backplane is subsequently laser-stripped, the glass may not be normally stripped, resulting in product rejection.
In summary, the flexible OLED connection process and the sealing process in the prior art have the problems of abnormal laser peeling of glass and unstable connection due to glass residue.
Disclosure of Invention
The invention provides a flexible OLED display device and a sealing method, which can improve the connection stability and avoid connecting sealing glue from remaining back plate glass, so that the back plate glass can be normally stripped by laser.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the present invention provides a flexible OLED display device, comprising: the flexible substrate comprises a display area for displaying and a non-display area on the periphery of the display area, wherein the non-display area comprises a first connecting area;
the chip on film is arranged at a preset position of the flexible substrate corresponding to the first connecting area; and
the connecting terminals are positioned between the flexible substrate and the chip on film, are arranged at intervals and in parallel along the extending direction of the first connecting area and are used for electrically bonding the chip on film and the flexible substrate;
the flexible substrate is provided with a first sealing area and a concave area close to the first sealing area in the covering area, and the first sealing area and the concave area are sequentially arranged on one side, far away from the display area, of the first connecting area in parallel.
According to a preferred embodiment of the present invention, a second connection region is disposed at a corresponding position of the flip chip on film corresponding to the first connection region, a second sealant region is disposed at a corresponding position of the flip chip on film corresponding to the first sealant region, and the first sealant region and the second sealant region penetrate through the flip chip on film.
According to a preferred embodiment of the present invention, the distance between the connection terminal and the side of the flexible substrate covered with the flip-chip film is 2mm to 3 mm.
According to a preferred embodiment of the present invention, the first encapsulant region has a boundary with a distance of 1mm to 1.5mm from the side of the flexible substrate covered with the flip chip.
According to a preferred embodiment of the present invention, the width of the first sealing compound area is 0.5mm-1 mm.
According to a preferred embodiment of the present invention, a gap of 80nm-120nm is formed between the chip on film and the flexible substrate for forming a capillary.
According to a preferred embodiment of the present invention, the device further includes a sealant disposed between the first sealant region and the second sealant region, and the recessed region is disposed on a side of the first sealant region away from the display region for storing the overflowing sealant.
According to a preferred embodiment of the present invention, the recessed region is provided with a recess parallel to the molding compound, and the recess extends to two ends of the molding compound.
The invention also comprises a sealing method of the flexible OLED display device, which comprises the following steps:
step S101, providing a flexible substrate and a chip on film, and carrying out plasma cleaning on a first sealing area of the flexible substrate and a second sealing area of the chip on film;
step S102, after the chip on film is connected to the flexible substrate, a dispensing process is carried out on a dispensing position corresponding to one side of the first sealing area, the sealing glue width of the dispensing process is 0.5mm-1mm, and the sealing glue is automatically filled between the whole first sealing area and the second sealing area from the dispensing position;
step S103, irradiating the sealing adhesive by using ultraviolet rays, and curing the sealing adhesive.
According to a preferred embodiment of the present invention, the sealant is a solvent-based sealant.
The invention has the beneficial effects that: compared with the conventional flexible OLED display device and the sealing method, the flexible OLED display device has the advantages that the connecting terminal is moved forwards by 2mm-3mm, the sealing glue and the connecting terminal are arranged on the same plane and are arranged on one side of the connecting area far away from the display area in parallel, namely one side close to the boundary of the flexible substrate, so that the connecting stability is improved, and the capillary phenomenon is formed in the sealing glue area, so that the whole sealing glue area can be automatically filled by dispensing glue on one side of the sealing glue area, and the manufacturing process is optimized; the side, close to the boundary, of the sealing adhesive is provided with a depression in parallel along the extending direction of the sealing adhesive, and the depression area can be used for storing the overflowing sealing adhesive, so that the problem that the back plate glass cannot be normally stripped by laser due to the fact that the back plate glass is remained by the connecting sealing adhesive is further solved. After the dispensing process is finished, the sealing glue is subjected to UV curing, so that the waterproof and moisture-resistant performance and the product stability of the device are greatly improved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a side view of a flexible OLED display device according to the present invention;
FIG. 2 is a partially enlarged view of a flexible OLED display device according to the present invention;
FIG. 3 is a schematic flow chart of a sealing method for a flexible OLED display device according to the present invention;
fig. 4 is a schematic view of a dispensing process of the flip chip film and the flexible substrate provided by the present invention;
FIG. 5 is a schematic diagram of a connection terminal and a molding compound of an OLED display device in the prior art.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
As shown in fig. 5, which is a schematic diagram of a connection terminal and a sealant of an OLED display device in the prior art, the display device includes: an array substrate 501, a buffer layer 502 and an orientation film 503; the array substrate 501 is provided with a connecting terminal 506, the array substrate 501 is connected with a chip on film 505 through the connecting terminal 506, the connecting terminal 506 is close to the boundary position of the array substrate 501, a sealant 504 is positioned on the side surface of the array substrate 501, the chip on film 505 is close to one end of the array substrate 501, the side surface of the array substrate 501 extends to the position covering the orientation film 503, the thickness of the sealant 504 is minimum and can only be controlled to be about 70um, the connection is unstable, and the glass can not be peeled off normally due to the residual glass.
The invention aims at the technical problems that the glass cannot be normally stripped and the connection is unstable due to the residual glass in the flexible OLED connection process and the sealing process in the prior art, and the defect can be solved by the embodiment.
As shown in fig. 1, the present invention provides a side view of a flexible OLED display device, including: an opposite substrate 101, an orientation film 102 arranged on the surface of the opposite substrate 101; a buffer layer 103 disposed on a surface of the alignment film 102; a flexible substrate 104 provided to face the counter substrate 101; an OLED light emitting layer is further arranged between the flexible substrate base plate 104 and the opposite base plate 101; a backlight plate 105 is further arranged on the flexible substrate 104; the touch panel 106 is disposed on the backlight 105; a polarizer 108 is further arranged on the touch panel 106, and the polarizer 108 is adhered to the touch panel 106 through a layer of adhesive 107; the flexible substrate 104 includes a display area for displaying and a non-display area at the periphery of the display area, the non-display area includes a first connection area, and connection terminals 110 are arranged at intervals and in parallel along the extending direction of the first connection area; a chip on film 109 disposed at a predetermined position of the flexible substrate 104 corresponding to the first connection region, wherein the predetermined position is a circuit lead region of the flexible substrate 104; the connection terminal 110 is located between the flexible substrate 104 and the chip on film 109 for electrically connecting the chip on film 109 and the flexible substrate 104. The chip on film 109 at least covers a part of the non-display area of the flexible substrate 104, the flexible substrate 104 is further provided with a first sealant area and a recess area near the first sealant area in the covering area, and the first sealant area and the recess area are both arranged in parallel on one side of the first connection area away from the display area. The first encapsulant region is used for forming an encapsulant 111, the encapsulant 111 is located between the chip on film 109 and the flexible substrate 104 and penetrates through the chip on film 109 along an encapsulant direction, the encapsulant 111 is parallel to an extending direction of the first encapsulant region, a gap exists between the encapsulant 111 and the connection terminal 110, and the encapsulant 111 can effectively isolate water vapor from the connection terminal 110 and protect the connection terminal 110 from external damage.
Specifically, the thickness of flexible OLED display device's oriented film 102 is 15 ~ 20um, the thickness of buffer layer 103 is 2 ~ 3um, the thickness of flexible substrate base plate 104 is 5um, the thickness of board 105 in a poor light is 0.21um, the thickness of touch panel 106 is 4um, the thickness of adhesive 107 is 50um, the thickness of polaroid 108 is 67 um.
As shown in fig. 2, for the flexible OLED display device according to the present invention, a flexible substrate includes: a first gate insulating layer 206; a second gate insulating layer 205, the second gate insulating layer 205 being disposed on the first gate insulating layer 206; an interlayer insulating layer 204, the interlayer insulating layer 204 being disposed on the second gate insulating layer 205; a planarization layer 208, the planarization layer 208 disposed on the inter-insulating layer 204; the planarization layer 208 covers a portion of the inter-insulating layer 204, a connection terminal 207 is disposed on a non-covered portion of the planarization layer 208, and the connection terminal 207 penetrates through the second gate insulating layer 205 and the inter-insulating layer 204 and partially extends from the inter-insulating layer 204. The flip chip 201 is connected to the flexible substrate through the connection terminal 207. The position of the chip on film 201 is located at a preset position of the flexible substrate, and is partially overlapped with the flexible substrate, and the overlapped part is located at one side of the non-display area of the flexible substrate, which is provided with a circuit lead.
The boundary of the connecting terminal 207, which is away from the flexible substrate and covered with the flip-chip film 201, is 2mm-3 mm. The flexible substrate has a first connection region in the non-display region, and a plurality of connection terminals 207 are provided in the first connection region at intervals in the extending direction of the first connection region and in parallel with each other. A second connection region is disposed at a corresponding position of the chip on film 201 corresponding to the first connection region, and the second connection region of the chip on film 201 faces and is right opposite to the first connection region of the flexible substrate for performing a connection process. After the connection process is completed, a gap of 80nm to 120nm is formed between the chip on film 201 and the flexible substrate, and the gap is preferably 100 nm. The flexible substrate is characterized in that a first sealing glue area is further arranged in the area covered by the chip on film 201, the first sealing glue area is arranged on one side, away from the display area, of the first connection area in parallel, a gap exists between the first sealing glue area and the first connection area, the distance between the first sealing glue area and the side, covered by the chip on film 201, of the flexible substrate is 1mm-1.5mm, and the width of the first sealing glue area is 0.5mm-1 mm. A second sealant region is disposed at a corresponding position of the chip on film 201 corresponding to the first sealant region, and the lengths of the second sealant region and the first sealant region penetrate through the chip on film 201.
The device further includes a sealant 202 disposed between the first sealant region and the second sealant region, wherein the sealant 202 penetrates the flip chip 201. At the edge of the flexible substrate, a recessed area is arranged in parallel near the sealant 202, and the recessed area is located on one side of the first sealant area, which is far away from the display area, and is used for storing the overflowing sealant 202. The recessed area is provided with a recess, and the recess can extend to two ends of the sealant 202 to prevent the sealant 202 from overflowing to affect the display device. The depressions may be formed in a plurality of spaced or staggered positions in the depression area, and the depressions may be in the shape of rectangular grooves, circles, or other shapes.
The invention also provides a sealing method of the flexible OLED display device, as shown in FIG. 3, which is a flow diagram of the sealing method of the flexible OLED display device provided by the invention, and the method comprises the following steps:
step S101, providing a flexible substrate and a chip on film, and carrying out plasma cleaning on a first sealing area of the flexible substrate and a second sealing area of the chip on film;
step S102, after the chip on film is connected to the flexible substrate, a dispensing process is carried out on a dispensing position corresponding to one side of the first sealing area, the sealing glue width of the dispensing process is 0.5mm-1mm, and the sealing glue is automatically filled between the whole first sealing area and the second sealing area from the dispensing position;
step S103, irradiating the sealing adhesive by using ultraviolet rays, and curing the sealing adhesive.
Specifically, as shown in fig. 4, which is a schematic diagram of a dispensing process of a chip on film and a flexible substrate provided by the present invention, a flexible substrate 401 includes a display area 402 and a non-display area 403, one end of the flexible substrate 401 is connected to a chip on film 405 through a connection terminal 408, wherein the chip on film 405 is further loaded with a chip 406; after the COF 405 is connected with the flexible substrate 401, a gap of about 100nm exists between the COF 405 and the flexible substrate 401, so that a capillary is formed at the gap. A sealant region 407 is disposed on a side of the connection terminal 408 away from the display region 402, that is, on a side of the connection terminal 408 close to the boundary of the flexible substrate 401, parallel to the extending direction of the connection terminal 408, where the sealant region 407 includes a first sealant region located on the flexible substrate 401 and a second sealant region located on a side of the flip chip film 405 facing the flexible substrate. The sealant region 407 is spaced from the connection terminal 408, the dispensing site 404 is located at one end of the first sealant region, after the flip chip 405 is connected, a dispensing process is performed at the dispensing site 404, the width of the dispensing site 404 is in the range of 0.5-1 mm, that is, the sealant width of the dispensing process is in the range of 0.5-1 mm, since a capillary is formed between the flip chip 405 and the flexible substrate 401, the sealant can be automatically filled from the dispensing site 404 to the other end of the sealant region 407, that is, between the whole first sealant region and the second sealant region, thereby completing the sealant operation. After the completion, UV curing is used for the sealing glue, so that the waterproof and moisture-resistant performance and the stability of the product are enhanced. Meanwhile, when the product falls from a high place, the flip chip film 405 can not fall off by the process, so that the falling resistance is enhanced.
In order to enhance the capillary phenomenon, the first encapsulant region and the second encapsulant region may be plasma cleaned before the flip chip 405 is connected, so as to improve the wettability of the surfaces of the first encapsulant region and the second encapsulant region. Meanwhile, the sealing glue is preferably solvent sealing glue, so that the wettability of the first sealing glue area and the second sealing glue area and the flowability of the sealing glue can be enhanced, and the purpose of enhancing the capillary phenomenon is achieved.
Compared with the conventional flexible OLED display device and the sealing method, the flexible OLED display device has the advantages that the connecting terminal is moved forwards by 2mm-3mm, the sealing glue and the connecting terminal are arranged on the same plane and are arranged on one side of the connecting area far away from the display area in parallel, namely one side close to the boundary of the flexible substrate, so that the connecting stability is improved, and the capillary phenomenon is formed in the sealing glue area, so that the whole sealing glue area can be automatically filled by dispensing glue on one side of the sealing glue area, and the manufacturing process is optimized; and one side of the sealing adhesive close to the boundary is provided with a depression in parallel along the extending direction of the sealing adhesive, and the depression area can be used for storing the overflowing sealing adhesive, so that the problem of glass failure caused by residual back plate glass of the connecting sealing adhesive is further prevented. After the dispensing process is finished, the sealing glue is subjected to UV curing, so that the waterproof and moisture-resistant performance and the product stability of the device are greatly improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A flexible OLED display device, comprising:
the flexible substrate comprises a display area for displaying and a non-display area on the periphery of the display area, wherein the non-display area comprises a first connecting area;
the chip on film is arranged at a preset position of the flexible substrate corresponding to the first connecting area; and
the connecting terminals are positioned between the flexible substrate and the chip on film, are arranged at intervals and in parallel along the extending direction of the first connecting area and are used for electrically bonding the chip on film and the flexible substrate;
the flexible substrate is provided with a first sealing area and a concave area close to the first sealing area in the covering area, and the first sealing area and the concave area are sequentially arranged on one side, far away from the display area, of the first connecting area in parallel.
2. The flexible OLED display device of claim 1, wherein the flip chip on film has a second connection region corresponding to the first connection region, the flip chip on film has a second encapsulant region corresponding to the first encapsulant region, and the first encapsulant region and the second encapsulant region penetrate the flip chip on film.
3. The flexible OLED display device claimed in claim 1, wherein the connection terminal is 2mm to 3mm from a boundary of a side of the flexible substrate covered with the flip-chip film.
4. The flexible OLED display device of claim 1, wherein the first encapsulant region is 1mm to 1.5mm from the edge of the flexible substrate on the side covered with the flip-chip film.
5. The flexible OLED display device of claim 4, wherein the width of the first encapsulant region is 0.5mm-1 mm.
6. The flexible OLED display device claimed in claim 1, wherein a gap of 80nm to 120nm is formed between the flip-chip film and the flexible substrate for forming a capillary.
7. The flexible OLED display device claimed in claim 2, further comprising a sealant disposed between the first sealant region and the second sealant region, wherein the recessed region is disposed on a side of the first sealant region away from the display region for storing the sealant overflowing.
8. The flexible OLED display device of claim 7, wherein the recessed area is provided with a recess parallel to the encapsulant, the recess extending to two ends of the encapsulant.
9. The method of claim 1, comprising the steps of:
step S101, providing a flexible substrate and a chip on film, and carrying out plasma cleaning on a first sealing area of the flexible substrate and a second sealing area of the chip on film;
step S102, after the chip on film is connected to the flexible substrate, dispensing process is carried out at a corresponding dispensing position on one side of the first sealing area, the sealing width of the dispensing process is 0.5mm-1mm, and the sealing glue is automatically filled between the whole first sealing area and the second sealing area from the dispensing position;
step S103, irradiating the sealing adhesive by using ultraviolet rays, and curing the sealing adhesive.
10. The method of claim 9, wherein the sealant is a solvent-based sealant.
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| CN201711167173.2A CN107833907B (en) | 2017-11-21 | 2017-11-21 | Flexible OLED display device and glue sealing method |
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| CN201711167173.2A CN107833907B (en) | 2017-11-21 | 2017-11-21 | Flexible OLED display device and glue sealing method |
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| CN110364539B (en) * | 2018-03-26 | 2021-09-10 | 北京齐碳科技有限公司 | Separable conductive contact structure and preparation method thereof |
| US10522610B2 (en) | 2018-04-03 | 2019-12-31 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Display device with hemispherical particles on chip-on-film surface, and manufacturing method thereof |
| CN108614371B (en) * | 2018-04-03 | 2021-07-27 | 惠州市华星光电技术有限公司 | Display device and method for manufacturing the same |
| CN109229964B (en) * | 2018-08-23 | 2020-11-20 | 合肥京东方光电科技有限公司 | Protective bag and display panel |
| CN111987132A (en) * | 2020-09-02 | 2020-11-24 | 山东傲晟智能科技有限公司 | Display device |
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| KR101016284B1 (en) * | 2004-04-28 | 2011-02-22 | 엘지디스플레이 주식회사 | Chip On Glass Type Liquid Crystal Display Device And Method For Fabricating The Same |
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