JP5493791B2 - Manufacturing method of electro-optical device - Google Patents

Description

  The present invention relates to a method for manufacturing an electro-optical device.

  As one of the electro-optical devices, for example, there is an organic EL (electroluminescence) device having a structure in which an organic film such as a light emitting layer is sandwiched between an anode and a cathode. As a method for manufacturing an organic EL device, first, an organic EL layer is formed in a plurality of regions on a glass substrate (mother substrate) in order to form a plurality of organic EL devices. Next, a sealing material is applied to each region of each organic EL layer, and then each organic EL layer is sealed using another glass substrate (mother substrate). Next, a cutting process (for example, dicing) as described in Patent Document 1 is performed on a pair of glass substrates along a cutting line that is an outer shape (rectangular shape) of the organic EL device, and a plurality of organic ELs are thus obtained. Separate into equipment.

JP 2003-223111 A

  However, when the thickness of the glass substrate is reduced, the corner strength of the organic EL device is particularly weakened, and when the cutting process is performed, the corner is likely to be chipped or cracked due to the cutting stress. In other words, there was a problem that the cutting process could not be performed stably.

  Further, in handling the organic EL device as a finished product, there is a problem that the corners are easily cracked or chipped.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A method of manufacturing an electro-optical device according to this application example includes a first substrate on which an electro-optical element is provided, and a second substrate that is disposed opposite to the first substrate and seals the first substrate. A method of manufacturing an electro-optical device having an electro-optical panel, wherein a sealing material is applied in a lattice shape including a region of a corner portion of the second substrate on a first mother glass substrate on which the first substrate is imposed. An applying step, an attaching step of attaching the second mother glass substrate with the second substrate imposed on the first mother glass substrate through the sealing material, the first mother glass substrate and the first mother glass substrate, And a cutting step of cutting the second mother glass substrate along a cutting line corresponding to the shape of the electro-optic panel.

  According to this method, since the sealing material is applied in a lattice shape including the corner area of the second substrate in the application process, when the electro-optical panel is cut in the cutting process, the first substrate and the second substrate A sealing material can be interposed in the corner portion where the two overlap. In other words, by applying the sealing material in a lattice shape, the sealing material can be interposed also in the corner portion where the strength is relatively weak in the electro-optical panel. Therefore, when cutting into the shape of the electro-optical panel in the cutting step, the strength of the corner portion can be increased, and the cutting can be stably performed. Thereby, it can suppress that a corner part is cracked or chipped. Further, even when stress is applied when the electro-optical panel that is a finished product is handled, it is possible to prevent the corner portion from being damaged.

  Application Example 2 In the method of manufacturing an electro-optical device according to the application example, the application step applies the sealing material in a lattice shape sequentially from one end to the other end of the first mother glass substrate. Is preferred.

  According to this method, since the sealing material is applied in a grid pattern in order from one end to the other end of the first mother glass substrate, it can be performed without changing the direction in which the sealing material is applied many times. Moreover, since it coats in order, the coating amount can be made relatively stable. In addition, since the sealing material is applied from one end to the other, even when cut into the shape of the electro-optic panel, it is possible to keep the broken materials connected together, and to prevent the broken materials from being separated. Can do.

  Application Example 3 In the method of manufacturing an electro-optical device according to the application example, the first substrate has a terminal area that does not overlap the second substrate in a planar manner, It is preferable to apply the sealing material to the first mother glass substrate so as not to protrude from the sides of the two substrates to the terminal portion side.

  According to this method, since the coating is performed so as not to protrude from the side of the second substrate to the terminal portion side, in the cutting step, when cutting the region of the terminal portion in the second mother glass substrate, along the edge of the sealing material. Can be cut. Therefore, the cut portion can be removed without being affected by the sealing material. In addition, it becomes possible to leave a sealing material on the outer peripheral edge of the electro-optical panel after cutting, and impurities can be prevented from entering the electro-optical panel.

  Application Example 4 In the method of manufacturing an electro-optical device according to the application example, the application step applies the sealing material along a surface shape of a corner portion excluding the terminal portion region in the electro-optical panel. Is preferred.

  According to this method, since the sealing material is applied to the corner portion along the surface shape, the sealing material can be interposed along the surface shape of the corner portion when cut into the shape of the electro-optical panel. Therefore, compared with the case where there is a gap between the substrates in the corner portion, the strength of the corner portion can be improved.

  Application Example 5 In the method of manufacturing the electro-optical device according to the application example, the application step is such that the application amount of the seal material is equal to the application amount of the other portions in the portion where the seal material intersects. It is preferable to change the application amount or the application timing.

  According to this method, since the application amount or application timing of the sealing material is changed at the intersection, it is possible to suppress the excessive application of the sealing material to the intersection. Thereby, it can suppress that a sealing material protrudes in the display area of an electro-optical panel.

  Application Example 6 In the method of manufacturing an electro-optical device according to the application example described above, the first mother glass substrate has a plurality of first substrates faced in a matrix, and the coating process includes the plurality of application steps. It is preferable to apply the sealing material in a lattice shape so as to straddle the first substrate.

  According to this method, it is possible to efficiently manufacture a plurality of electro-optical panels, and it is possible to improve the productivity of multi-cavity processing.

  Application Example 7 In the method of manufacturing the electro-optical device according to the application example, it is preferable that the cutting step is performed so that a corner portion of the terminal portion region of the first substrate is chamfered.

  According to this method, since the corner portion in the region of the terminal portion is chamfered, the strength of the corner portion can be improved.

  Application Example 8 In the electro-optical device manufacturing method according to the application example, the cutting step includes cutting the first mother glass substrate and the second mother glass substrate using a dicing method or a laser cutting method. Is preferred.

  According to this method, since the dicing method or the laser cutting method is used, the portion of the glass substrate including the sealing material can be cut. Moreover, it becomes possible to interpose a sealing material on the outer periphery which becomes the electro-optical panel, and the strength of the electro-optical panel can be improved.

  Application Example 9 In the method of manufacturing an electro-optical device according to the application example, the electro-optical panel is laminated with a thickness of the electro-optical panel being 100 μm or less and at least one of which is transparent. It is preferable to have a laminating process.

  According to this method, since the first substrate and the second substrate made of the glass substrate constituting the electro-optical panel are laminated with the resin film, the impact on the corner portion of the electro-optical panel can be reduced. Further, when the glass substrate is damaged, it is possible to prevent the glass substrate from being scattered outside, and safety can be improved.

1 is a schematic plan view illustrating a configuration of an organic EL device as an electro-optical device according to a first embodiment. The schematic cross section which follows the AA 'line of the organic electroluminescent apparatus shown in FIG. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the organic EL device. The schematic cross section which shows the structure of the display panel which comprises an organic electroluminescent apparatus. The flowchart which shows the manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic diagram which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows a part of manufacturing method of the organic EL apparatus of 2nd Embodiment. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows the modification of the manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows the modification of the manufacturing method of an organic electroluminescent apparatus.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

(First embodiment)
<Configuration of electro-optical device>
FIG. 1 is a schematic plan view showing a configuration of an organic EL device as an electro-optical device. FIG. 2 is a schematic cross-sectional view taken along the line AA ′ of the organic EL device shown in FIG. Hereinafter, the configuration of the organic EL device will be described with reference to FIGS. 1 and 2.

  As shown in FIG. 1, the organic EL device 11 includes a display unit 13 including a display panel 12 as an electro-optical panel having a rectangular outer shape. The display panel 12 has a display area 15 provided with a plurality of pixels 14 capable of displaying three colors, R (red), G (green), B (blue). The plurality of pixels 14 have a so-called stripe arrangement in which pixels 14 of the same color among the three colors are arranged in the direction along the short side in the display region 15. Note that the arrangement of the pixels 14 is not limited to this.

  A plurality of (for example, three) terminal portions 16 provided along the long side of the display panel 12 are connected to a display control unit (not shown) for driving and controlling the display panel 12. Relay boards 17a, 17b, and 17c are mounted. The relay boards 17a, 17b, and 17c are, for example, flexible circuit boards (FPC), and have a surface on which an electronic component such as a driver IC that constitutes a part of a drive circuit that drives the display panel 12 is mounted. Can be adopted.

  As shown in FIG. 2, the display unit 13 of the organic EL device 11 has a structure in which the display panel 12 on which the relay substrate 17 a is mounted is sandwiched between a resin film 21 and a resin film 22.

  The display panel 12 includes a first substrate 31 having an organic electroluminescence element 23 (hereinafter, referred to as “organic EL element 23”) as an electro-optic element provided corresponding to each pixel 14, and also for each pixel 14. A second substrate 32 having a color filter 24 having a colored layer provided corresponding thereto is joined by a sealing material 26 with a sealing resin 25 having visible light permeability. The organic EL element 23 emits white light, and has a so-called top emission structure that enables color display when the white light passes through the color filter 24 and is emitted from the second substrate 32 side.

  The first substrate 31 is provided with a drive circuit (not shown) for driving the organic EL element 23 for each pixel 14, and the organic EL element 23 is formed on the drive circuit. The driving circuit includes a switching element such as a thin film transistor, wiring connected to the switching element, and the like, and a known configuration can be adopted.

  Thus, in the self-luminous display panel 12 having the organic EL element 23, the first substrate 31 can be a transparent glass substrate. On the other hand, a transparent glass substrate can also be used as the second substrate 32 on the side from which light emission from the organic EL element 23 is extracted.

  In this embodiment, after joining the 1st board | substrate 31 and the 2nd board | substrate 32, the process which makes the thickness of each board | substrate thin is performed by giving the surface mechanically or chemically. For example, the original thickness of each substrate is approximately 0.5 mm. And it grind | polishes so that the total thickness after a process may be set to about 100 micrometers or less (for example, about 80 micrometers). Therefore, the display panel 12 itself has a certain degree of flexibility.

  Therefore, it is necessary for the display panel 12 itself to be weak against an external impact and to prevent scattering when it is damaged by the impact. In addition, the organic EL element 23 is sealed to prevent the intrusion of moisture or the like from the outside, and is laminated with the flexible resin films 21 and 22 for the purpose of ensuring a longer light emission life. ing.

  The resin film 21 used for laminating has an adhesive layer 21b formed by uniformly applying an adhesive on one surface of a transparent base film 21a having low gas permeability. Similarly, the resin film 22 has an adhesive layer 22b formed by uniformly applying a transparent adhesive on one surface of a transparent base film 22a having low gas permeability.

  Examples of the base films 21a and 22a include a PET (polyethylene terephthalate) film and a polycarbonate film. For the adhesive layers 21b and 22b, for example, a thermosetting epoxy resin can be used. Moreover, it is good also as an adhesive which has adhesiveness. Repair properties can be realized by using an adhesive.

  Lamination is performed with two resin films 21 and 22 with the display panel 12 sandwiched so that the adhesive layers 21b and 22b face each other. Further, in order to ensure moisture resistance of the organic EL element 23, in other words, sealing performance, spaces 27 and 28 that may be generated around the display panel 12 during lamination are filled with a sealing resin. . That is, the display panel 12 is laminated together with the sealing resin, and a part 29 of the protruding sealing resin is raised on the end surfaces of the resin films 21 and 22.

  A relay substrate 17 a is mounted on the terminal portion 16 of the element substrate 36 using an anisotropic conductive film (ACF) 33. The surface excluding the connection portion of the relay substrate 17a is insulative and is covered with a protective film such as polyimide or solder resist, for example, and the adhesion between the adhesive layers 21b and 22b of the resin films 21 and 22 and the protective film is improved. In order to ensure, intermediate adhesive layers 34 and 35 showing adhesiveness are provided at both interfaces.

  The display unit 13 having such a configuration is a so-called sheet shape (plate shape), and the display surface can be curved by following external stress to some extent.

  Since the display panel 12 includes the organic EL element 23 having a top emission structure, it is not necessary to extract light from the first substrate 31 side. Therefore, the resin film 22 covering the first substrate 31 does not have to be transparent, and may be an opaque resin film provided with a heat conductor such as a metal thin film that can be laminated. The heat conductor can dissipate heat generated by the light emission of the organic EL element 23.

  FIG. 3 is an equivalent circuit diagram showing an electrical configuration of the organic EL device. Hereinafter, the electrical configuration of the organic EL device will be described with reference to FIG.

  As shown in FIG. 3, the organic EL device 11 includes a plurality of scanning lines 41, a plurality of signal lines 42 extending in a direction intersecting the scanning lines 41, and a plurality of power supply lines 43 extending in parallel to the signal lines 42. Are wired in a grid pattern. An area partitioned by the scanning line 41 and the signal line 42 is configured as a pixel area. The signal line 42 is connected to the signal line drive circuit 44. The scanning line 41 is connected to the scanning line driving circuit 45.

  Each pixel region holds a switching TFT (Thin Film Transistor) 46 to which a scanning signal is supplied to the gate electrode via the scanning line 41 and a pixel signal supplied from the signal line 42 via the switching TFT 46. And a driving TFT 48 (hereinafter referred to as “TFT element 48”) to which a pixel signal held by the holding capacitor 47 is supplied to the gate electrode is provided. Further, in each pixel region, when electrically connected to the power supply line 43 via the TFT element 48, an anode 51 and a cathode 52 into which a drive current flows from the power supply line 43, and the anode 51 and the cathode 52 are connected. A functional layer 53 sandwiched therebetween is provided.

  The organic EL device 11 includes a plurality of organic EL elements 23 including an anode 51, a cathode 52, and a functional layer 53. The organic EL device 11 includes a display area composed of a plurality of organic EL elements 23.

  According to this configuration, when the scanning line 41 is driven and the switching TFT 46 is turned on, the potential of the signal line 42 at that time is held in the holding capacitor 47, and the TFT element 48 depends on the state of the holding capacitor 47. ON / OFF state is determined. Then, a current flows from the power supply line 43 to the anode 51 through the channel of the TFT element 48, and further a current flows to the cathode 52 through the functional layer 53. The functional layer 53 emits light with a luminance corresponding to the amount of current flowing therethrough.

  FIG. 4 is a schematic cross-sectional view showing the structure of the display panel constituting the organic EL device. Hereinafter, the structure of the display panel will be described with reference to FIG. In addition, in order to show the configuration in an easy-to-understand manner, the layer thickness, dimensional ratio, angle, and the like of each component are appropriately changed.

  As shown in FIG. 4, the display panel 12 in this embodiment has a so-called top emission structure in which light emitted from the functional layer 53 is emitted from the cathode 52 side. The display panel 12 includes a first substrate 31 and a second substrate 32 disposed to face the first substrate 31.

  Examples of the first substrate 31 include a glass substrate. In the present embodiment, non-alkali glass is used as the material of the first substrate 31. The thickness of the first substrate 31 is, for example, about 30 μm. In the present embodiment, a glass substrate having a thickness of, for example, about 0.5 mm is used as the material of the first substrate 31, and after being bonded to the second substrate 32, the first substrate 31 is processed to the above-described thickness by etching.

  In addition, since the display panel 12 is a top emission type, as the material of the first substrate 31, either a light transmissive material or a non-light transmissive material may be used.

  A circuit element layer 61 is provided on the first substrate 31. The circuit element layer 61 includes a base protective film (not shown), a TFT element 48, wiring, and the like. The TFT element 48 is provided corresponding to the pixel 14.

  A planarizing layer 62 is provided on the circuit element layer 61. The flattening layer 62 relaxes unevenness on the surface due to the TFT element 48 and wiring. The planarizing layer 62 includes a reflective layer 63 so as to overlap the anode 51 in a planar manner. The reflective layer 63 is made of a metal material having light reflectivity, and is made of, for example, an aluminum alloy.

  An anode 51 is provided on the planarization layer 62. The anode 51 is made of a metal oxide conductive film having optical transparency such as ITO (Indium Thin Oxide). The material of the anode 51 may be IZO (Indium Zinc Oxide) (registered trademark). The anode 51 is electrically connected to the drain terminal of the TFT element 48 of the circuit element layer 61 for each pixel 14.

  In addition, since the display panel 12 is a top emission type, the material of the anode 51 does not necessarily have light transmittance. For example, a metal electrode made of aluminum or the like may be used. In addition, when a material that does not have optical transparency is used as the material of the anode 51, the reflective layer 63 need not be provided.

  A partition wall 64 is provided on the planarization layer 62. The partition wall 64 is made of, for example, acrylic resin and partitions the region of the pixel 14.

  A functional layer 53 is provided on the anode 51 and the partition wall 64. The functional layer 53 of the present embodiment is configured by sequentially stacking a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer (in FIG. 4, one layer is illustrated). The hole injection layer is formed of, for example, a triarylamine (ATP) multimer. The hole transport layer is made of, for example, a triphenylamine derivative (TPD).

The emission color of the light emitting layer is white. As the white light-emitting material, styrylamine-based light-emitting material, anthracene-based dopamine (blue), styrylamine-based light-emitting material, rubrene-based dopamine (yellow), or the like is used. The electron transport layer is formed of, for example, an aluminum quinolinol complex (Alq ₃ ). Each layer of the functional layer 53 is sequentially formed using, for example, a vacuum deposition method.

  A cathode 52 is provided on the functional layer 53. When the cathode 52 has a top emission structure as in the present embodiment, a transparent conductive material such as ITO, which is a material having optical transparency, is used. Moreover, you may make it comprise the cathode 52 with the alloy (Mg-Ag alloy) of magnesium and silver. An electron injection buffer layer made of lithium fluoride (LiF) or the like may be provided below the cathode 52.

  An electrode protective layer 65 is provided on the cathode 52 and the partition wall 64. The electrode protective layer 65 is made of, for example, a silicon compound such as silicon oxide or silicon oxynitride in consideration of light transmittance, adhesion, water resistance, gas barrier properties, and the like. Moreover, the thickness of the electrode protective layer 65 is preferably 100 nm or more, and the upper limit of the thickness is preferably 200 nm or less in order to prevent the occurrence of cracks due to the stress generated by covering the partition walls 64. The electrode protective layer 65 is formed using PVD (physical vapor deposition), CVD (chemical vapor deposition), ion plating, or the like.

  An organic buffer layer 66 is formed on the electrode protective layer 65. The organic buffer layer 66 is provided so as to fill the uneven portion of the electrode protection layer 65 formed in an uneven shape due to the influence of the shape of the partition wall 64, and the upper surface thereof is formed substantially flat.

  The organic buffer layer 66 is made of, for example, a thermosetting epoxy resin. The organic buffer layer 66 has a function of relieving stress generated by warping or deposition expansion of the first substrate 31 and the circuit element layer 61 and preventing the electrode protective layer 65 from peeling from the unstable partition wall 64. Have.

  Further, since the upper surface of the organic buffer layer 66 is substantially flattened, a gas barrier layer 67, which will be described later, made of a hard film formed on the organic buffer layer 66 is also flattened. Therefore, there is no portion where stress is concentrated, and thereby, the generation of cracks in the gas barrier layer 67 is prevented.

  The thickness of the organic buffer layer 66 is preferably about 3 μm to 5 μm. The organic buffer layer 66 is formed using, for example, a vacuum screen printing method, a slit coating method, an ink jet method, or the like.

  On the organic buffer layer 66, a gas barrier layer 67 is formed in a wide range so as to cover the organic buffer layer 66 and cover the terminal portion of the electrode protective layer 65. The gas barrier layer 67 is for preventing intrusion of oxygen and moisture, thereby suppressing deterioration of the organic EL element 23 due to oxygen and moisture. In consideration of transparency, gas barrier properties, and water resistance, the gas barrier layer 67 is preferably formed of a silicon compound containing nitrogen, that is, silicon nitride or silicon oxynitride. In the present embodiment, the first substrate 31 to the gas barrier layer 67 are referred to as “element substrate 36”. The second substrate 32 and the color filter 24 are collectively referred to as a “sealing substrate 37”.

  On the surface side of the element substrate 36 on which the organic EL element 23 is formed, that is, on the surface side on which the gas barrier layer 67 is formed, a sealing substrate 37 is disposed so as to face. The sealing substrate 37 is bonded to the gas barrier layer 67 of the element substrate 36 through the sealing material 26 and the sealing resin 25. The second substrate 32 that constitutes the sealing substrate 37 is made of, for example, inorganic glass having optical transparency. In the present embodiment, non-alkali glass is used as the material of the second substrate 32.

  The thickness of the second substrate 32 is, for example, about 30 μm. In the display panel 12, a glass substrate having a higher gas barrier property than the plastic substrate is used for the first substrate 31 and the second substrate 32, and flexibility is imparted by reducing the thickness of these glass substrates. Yes.

  The sealing material 26 is disposed in a non-display area between the first substrate 31 and the second substrate 32, and is provided in a frame shape along the outer periphery of the first substrate 31 (second substrate 32). The sealing material 26 is made of a material having a low moisture permeability. As the material of the sealing material 26, for example, a highly adhesive adhesive in which an acid anhydride is added as a curing agent to an epoxy resin and a silane coupling agent is added as an accelerator can be used.

  The sealing resin 25 is provided so as to fill the region surrounded by the element substrate 36, the sealing substrate 37, and the sealing material 26 without any gap. The sealing resin 25 is made of a highly light-transmitting resin such as acrylic, epoxy, or urethane. In view of heat resistance and water resistance, it is preferable to use an epoxy resin as the material of the sealing resin 25.

  The color filter 24 is provided on the organic EL element 23 side of the second substrate 32. The color filter 24 includes a color filter 24R corresponding to red (R) light, a color filter 24G corresponding to green (G) light, and a color filter 24B corresponding to blue (B) light. If the colors to be used are not distinguished, they are also simply called color filters 24). The color filter 24 is provided so as to overlap the organic EL element 23 in plan view.

  A light shielding layer 68 is provided so as to partition the color filters 24R, 24G, and 24B. The light shielding layer 68 is disposed so as to correspond to the partition wall 64. The light shielding layer 68 is made of a material having a light shielding property, and is made of, for example, Cr (chromium). An overcoat layer may be provided so as to cover the color filter 24 and the light shielding layer 68.

  The display panel 12 includes a pixel 14R that emits red light, a pixel 14G that emits green light, and a pixel 14B that emits blue light. Call). The color filters 24R, 24G, 24B are arranged corresponding to the pixels 14R, 14G, 14B.

  The white light emitted by the organic EL element 23 passes through the color filters 24R, 24G, and 24B, so that light of three different colors R, G, and B is emitted from the pixels 14R, 14G, and 14B. One pixel group is configured by the pixels 14R, 14G, and 14B, and various colors can be displayed by appropriately changing the luminance of the pixels 14R, 14G, and 14B in each pixel group. Therefore, a display panel capable of full color display or full color light emission can be provided.

  In the display panel 12, light emitted from the functional layer 53 to the cathode 52 side is emitted to the observation side. Further, the light emitted from the functional layer 53 to the anode 51 side is reflected by the reflective layer 63 and emitted to the observation side. Hereinafter, a method for manufacturing the organic EL device will be described.

<Method of manufacturing electro-optical device>
FIG. 5 is a flowchart showing a method for manufacturing an organic EL device as a method for manufacturing an electro-optical device. 6 to 8 are schematic plan views illustrating a part of the method for manufacturing the organic EL device. FIG. 9 is a schematic view showing a part of the method for manufacturing the organic EL device. Hereinafter, a method for manufacturing the organic EL device will be described with reference to FIGS.

  As shown in FIG. 5, in step S <b> 11 (electro-optic layer forming step), the pixels 14 are formed on the first substrate 31. Specifically, as shown in FIG. 4, a circuit element layer 61, a partition wall 64, an anode 51, a functional layer 53 including a light emitting layer, a cathode 52, and the like are formed on the first substrate 31. In FIG. 4, some of these components are omitted.

  In step S12, thin film sealing is performed on the pixels 14 on the first substrate 31 (see FIG. 4). Specifically, an electrode protective layer 65, an organic buffer layer 66, and a gas barrier layer 67 are formed so as to cover the pixels 14. This step can be performed using various film forming methods and patterning methods such as plasma CVD, sputtering, vapor deposition, droplet discharge, and various etching methods.

  In step S13 (application process), the sealing material 26 is formed in a lattice shape on the side of the first substrate 31 where the pixels 14 are formed. Specifically, this will be described with reference to FIG. The above-described pixels 14 and the like are formed on a mother substrate 12a 'serving as a first mother glass substrate. First, as illustrated in FIG. 6, for example, the first side 81 (one end) to the second side 82 (the other end) of the mother substrate 12 a ′ so as to include the first outer shape line 71 that becomes the display panel 12. One sealing material 26a is applied. In addition, the broken line in FIG. 6 has shown the shape used as the display panel 12 later.

  Next, the second sealing material 26 b is applied from the first side 81 to the second side 82 so as to include the second outer shape line 72. Thereafter, the third sealing material 26 c is applied from the third side 83 (one end) to the fourth side 84 (the other end) so as to include the third outer shape line 73. In the fourth outline line 74 that is the outline line of the second substrate 32 (sealing substrate 37), the fourth seal extends from the third side 83 to the fourth side 84 along the inner surface of the second substrate 32. The material 26d is applied. It is preferable that the width | variety of the 4th sealing material 26d is thin compared with the other sealing materials 26a-26c by apply | coating inside a surface. In this way, the sealing materials 26a to 26d are applied in a lattice shape along the first outer shape line 71 to the fourth outer shape line 74. The width of the sealing material 26 is, for example, 0.3 to 0.4 mm.

  In addition, when apply | coating the sealing materials 26a-26d in a grid | lattice form, it is possible that the application quantity of the sealing material 26 of the crossing part 38 (refer FIG. 6) increases. Therefore, it is desirable to adjust the application amount and application timing of the sealing material 26 in the vicinity of the intersecting portion 38. For example, one first sealing material 26a is applied as usual, and the application of the other third sealing material 26c is stopped. Further, for example, the amount of the sealing materials 26a and 26c is reduced only in the intersecting portion 38 as compared with the application amount of other lines (lines that do not intersect). The same adjustment is made for other intersecting portions. Thereby, it can suppress that the sealing material 26 is apply | coated excessively in an intersection part, and it can suppress that the sealing material 26 protrudes into the display area 15 of the display panel 12. FIG.

  As the sealing material 26, for example, an epoxy adhesive is used. As a method of forming the sealing material 26, for example, the sealing material 26 made of an ultraviolet curable resin is applied onto the mother substrate 12a 'by a dispenser application method (screen printing method) or the like. In addition, a spacer is mixed in the sealing material 26.

  In step S14, the sealing resin 25 is applied to the area surrounded by the sealing material 26 on the mother substrate 12a '. Specifically, the sealing resin 25 made of a thermosetting resin is applied onto the mother substrate 12a 'by a dispenser application method or a droplet discharge method. Further, as the sealing resin 25, a resin that becomes transparent after curing is used. Thus, the element substrate 36 side is completed.

  In step S21, the color filter 24 and the light shielding layer 68 are formed on the mother substrate (second mother glass substrate) on which the second substrate 32 is provided, and the sealing substrate 37 side is completed.

  In step S31 (sticking step), the element substrate 36 (mother substrate) and the sealing substrate 37 (mother substrate) are bonded together with the sealing material 26 and the sealing resin 25 interposed therebetween. Specifically, contact and pressure bonding are performed in a state where the element substrate 36 and the sealing substrate 37 are aligned (positioned) in a reduced pressure environment. At this time, the element substrate 36 and the sealing substrate 37 are supported by a spacer included in the sealing material 26 and are bonded together with a certain interval. The width of the sealing material 26 at this time is, for example, 1.5 mm.

  In step S32, the sealing material 26 is cured. Specifically, the sealing material 26 is cured by irradiating the sealing material 26 made of an ultraviolet curable resin with ultraviolet rays from the sealing substrate 37 side.

  In step S33, the sealing resin 25 is cured. Specifically, the sealing resin 25 is cured by performing a heat treatment on the sealing resin 25 made of a thermosetting resin. As a heat treatment method, for example, a method of heating the element substrate 36 and the sealing substrate 37 after bonding in a baking furnace can be used.

  In step S34, the first substrate 31 and the second substrate 32 are etched to reduce the thickness to a predetermined thickness, for example, about 30 μm. As the etchant, for example, an aqueous solution in which hydrofluoric acid (hydrofluoric acid) is diluted is used. The etching solution may be an aqueous solution of hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid or the like. As the etching method, the first substrate 31 and the second substrate 32 may be immersed in an etching solution, or the etching solution may be shower irradiated. Note that the substrate in this state is referred to as a display panel precursor 12a.

  In step S35 (cutting step), the display panel precursor 12a is cut along a cutting line corresponding to the shape of the display panel 12 and separated into pieces (cut out the display panel 12). Specifically, this will be described with reference to FIG. First, as shown in FIG. 7, for example, the first outline line 71, the third outline line 73, and the second outline line 72 are cut. As a cutting method, for example, a laser cutting method is used. In addition, it is not limited to the laser cutting method, You may make it cut | disconnect by performing a dicing method, and scribing and breaking. Thereafter, the fifth outer shape line 75 including the first surface 76 and the second surface 77 at both ends of the terminal portion 16 is cut.

  Thereafter, an area corresponding to the area of the terminal portion 16 in the second substrate 32 is cut along the fourth outer shape line 74. In addition, the 4th external shape line 74 is a line edge in the 4th sealing material 26d.

  The cutting conditions by the laser cutting method are as follows, for example. The frequency is 50 kHz. The laser output is 1W. The scanning speed is 30 mm / s. Note that when only the region corresponding to the terminal portion 16 in the second substrate 32 is cut, the laser output is, for example, 0.75 W. Thus, the display panel 12 as shown in FIG. 8 is cut out from the display panel precursor 12a.

  Thus, since the sealing material 26 is applied in a lattice shape along the cutting lines (the first outer shape line 71 to the fourth outer shape line 74), the sealing material 26 is provided between the element substrate 36 and the sealing substrate 37. In this state, a part of the display panel 12 can be cut. Thereby, the first corner 85 to the fourth corner 88 which are weak portions in the display panel 12 are cut without a gap between the element substrate 36 and the sealing substrate 37 via the sealing material 26. Can be cut in a stable state. Therefore, it can suppress that the 1st corner 85-the 4th corner 88 are cracked or chipped.

  Further, since the first surface 76 and the second surface 77 are formed on the terminal portion 16 of the first substrate 31, the strength of the terminal portion 16 in the display panel 12 can be improved. Further, the surface can be easily formed as compared with the case where the imposition work is performed later.

  Further, the sealing material 26 is interposed along the first corner 85 to the fourth corner 88 and the first outer shape line 71 to the fourth outer shape line 74 between the element substrate 36 and the sealing substrate 37 of the display panel 12. Therefore, when the display panel 12 and further the organic EL device 11 are handled, it is possible to suppress the occurrence of cracks and chips. In addition, since there is no gap between the element substrate 36 and the sealing substrate 37 on the outer periphery of the display panel 12, impurities such as dust can be prevented from entering the display panel 12.

  In step S36, the relay substrate 17 (17a, 17b, 17c) is connected to the terminal portion 16 of the first substrate 31 of the display panel 12 (see FIGS. 1 and 2). The connection between the first substrate 31 and the relay substrate 17 is performed using a known method using a conductive adhesive such as an anisotropic conductive film.

  In step S37, the display panel 12 is laminated. Specifically, for example, as shown in FIG. 9A, the respective members are overlapped and set in the laminating apparatus 91. Specifically, the display panel 12 and the resin film 21 (see FIG. 2) are overlapped on the resin film 22 and set in the laminating apparatus 91. In FIG. 9, only the pressure roller 92 of the laminating apparatus 91 is illustrated.

  Next, as shown in FIG.9 (b), it pressurizes from the side shown by the arrow, and it heats and crimps | bonds it in the range of 80 to 120 degreeC. In the portion sandwiched between the pressure rollers 92, the resin films 21 and 22 are dissolved by the heat of the rollers, and are further pressurized and bonded to each other. As a method of thermocompression bonding, a method using a hot plate type parallel plate or a pair of heat and pressure rollers is preferable. Further, a vacuum pressure bonding apparatus may be used. Thus, the organic EL device 11 is completed.

  As described above in detail, according to the first embodiment, the following effects can be obtained.

  (1) According to the first embodiment, since the sealing material 26 is applied in a lattice shape including the regions of the corners 85 to 88 of the sealing substrate 37 (second substrate 32), the display panel precursor 12a is used as the display panel 12. When cutting into the shape, the sealing material 26 can be interposed in the corners 85 to 88 where the element substrate 36 and the sealing substrate 37 overlap. That is, by applying the sealing material 26 in a lattice shape, it is possible to leave the sealing material 26 in the corners 85 to 88 where the strength is relatively weak in the display panel 12. Therefore, when cutting into the shape of the display panel 12, the strength of the corners 85 to 88 can be increased, and the corners 85 to 88 can be stably cut. Thereby, it can suppress that the corners 85-88 are cracked or chipped. Further, even when stress is applied to the corners 85 to 88 when the organic EL device 11 that is a finished product is handled, it is possible to suppress damage. Further, since the sealing material 26 is provided along the entire outer periphery of the sealing substrate 37, there is no gap between the peripheral substrates 36 and 37, and impurities enter the display panel 12 (such as the organic EL element 23). Can be prevented.

  (2) According to the first embodiment, since the display panel 12 is laminated with the resin films 21 and 22, the impact on the corners 85 to 88 of the display panel 12 can be reduced. Further, when the first substrate 31 and the second substrate 32 made of a glass substrate are damaged, it is possible to prevent the glass substrate from being scattered outside, and safety can be improved.

  (3) According to the first embodiment, since the imposition (the first surface 76 and the second surface 77) is performed on both ends of the terminal portion 16 in the display panel 12, the strength of the element substrate 36 can be improved.

  (4) According to the first embodiment, the sealing material 26 is applied in a lattice form from the first side 81 to the second side 82 and from the third side 83 to the fourth side 84 of the mother substrate 12a ′. Even when it is cut into the shape of the panel 12, the broken materials can be held together, and the broken materials can be prevented from being separated.

(Second Embodiment)
<Method of manufacturing electro-optical device>
10 to 12 are schematic plan views illustrating a part of the method for manufacturing the organic EL device as the method for manufacturing the electro-optical device according to the second embodiment. Hereinafter, a method for manufacturing the organic EL device will be described with reference to FIGS. 5 and 10 to 12.

  The manufacturing method of the organic EL device (111) of the second embodiment is different from that of the first embodiment in that a plurality of display panels 112 are formed from one display panel precursor 112a (mother substrate 112a '). Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified here.

  First, in the flowchart shown in FIG. 5, Steps S11 and S12 are performed as in the first embodiment. Next, in step S <b> 13, the sealing material 126 is formed in a lattice shape so as to straddle the regions of the plurality of display panels 112 on the element substrate 36 (mother substrate 112 a ′) where the pixels 14 are formed. Specifically, this will be described with reference to FIG. First, as shown in FIG. 10, for example, a plurality of first lines extending from the first side 181 to the second side 182 of the mother substrate 112 a ′ so as to include the first outline line 171 straddling the plurality of display panels 112. Sealing material 126a is applied. Note that the alternate long and short dash line in FIG. 10 indicates the shape that will be the outer shape of the display panel 112 later.

  Next, a plurality of second sealing materials 126 b are applied from the first side 181 to the second side 182 so as to include the second outer shape line 172. Thereafter, a plurality of third sealing materials 126 c are applied from the third side 183 to the fourth side 184 so as to include the third outer shape line 173. And in the 4th external shape line 174 used as the external shape line of the 2nd board | substrate 32 (sealing board | substrate 37), along the surface inner side of the 2nd board | substrate 32, several pieces are extended over the 4th side 184 from the 3rd side 183. A fourth sealing material 126d is applied. Therefore, the width of the fourth sealing material 126d is preferably narrower than the other sealing materials 126a to 126c. As described above, the sealing materials 126a to 126d are applied in a lattice shape along the first outer shape line 171 to the fourth outer shape line 174.

  As in the first embodiment, when the sealing materials 126a to 126d are applied in a lattice shape, the amount of the sealing material 126 at the intersecting portion may be increased. Therefore, it is desirable to adjust the application amount of the sealing material 126 in the vicinity of the intersecting portion.

  Next, step S14 and step S21 are performed as in the first embodiment (see FIG. 5). Thereby, the element substrate 36 and the sealing substrate 37 are completed. Thereafter, steps S31 to S34 are performed.

  Next, as shown in FIG. 11 (step S35), the display panel precursor 112a in which the element substrate 36 and the sealing substrate 37 are bonded together is cut and separated into individual display panels 112 (display panel). 112 is cut out). First, for example, the first outline line 171, the third outline line 173, and the second outline line 172 in one display panel 112 are cut. The method for cutting is the same as in the first embodiment. Thereafter, the fifth outer shape line 175 including the first surface 76 and the second surface 77 at both ends of the terminal portion 16 is cut.

  Thereafter, the region corresponding to the region of the terminal portion 16 in the second substrate 32 is cut along the fourth outer shape line 174. In addition, the 4th external shape line 174 is along the edge of the 4th sealing material 126d.

  Thus, since the sealing material 126 is applied in a lattice shape along the cutting lines (first outer shape line 171 to fourth outer shape line 174), the sealing material 126 is provided between the element substrate 36 and the sealing substrate 37. In this state, a part of the display panel 112 can be cut. Thus, the first corner 85 to the fourth corner 88, which are weak portions in the display panel 112, are cut with no gap between the element substrate 36 and the sealing substrate 37 via the sealing material 126. And can be cut stably. Therefore, it can suppress that the 1st corner 85-the 4th corner 88 are cracked or chipped.

  Further, since the first surface 76 and the second surface 77 are formed on the terminal portion 16 of the first substrate 31, the strength of the terminal portion 16 in the display panel 112 can be improved. Further, the surface can be easily formed as compared with the case where the imposition work is performed later.

  Thus, a plurality of display panels 112 as shown in FIG. 12 are cut out. Subsequently, Step S36 and Step S37 are performed to complete the organic EL device (111).

  As described above in detail, according to the second embodiment, the following effects can be obtained in addition to the effects (1) to (4) of the first embodiment.

  (5) According to the second embodiment, from the first side 181 to the second side 182 and from the third side 183 to the fourth side 184 of the mother substrate 112a ′ so as to straddle the regions of the plurality of display panels 112, Since the sealing material 126 is applied in a lattice shape, the sealing material 126 can be efficiently applied, and the productivity of multi-piece machining can be improved.

  In addition, embodiment is not limited above, It can also implement with the following forms.

(Modification 1)
As described above, the present invention is not limited to imposing only the corners of the terminal portions 16 in the display panels 12 and 112 (the first surface 76 and the second surface 77). For example, the display panel 212 shown in FIG. Surfaces (78, 79) may be formed. FIG. 13 is a schematic plan view showing a part of the method for manufacturing the organic EL device. The impositioned portions are the four corners of the display panel 212 in the panel precursor film 212a. Note that the width of each sealing material 126 is preferably set so that the sealing material 126 remains on the third surface 78 and the fourth surface 79. According to this, imposition processing is performed on the four corners of the display panel 12, and the sealing material 126 is present in the corners, so that the strength against bending stress can be improved.

(Modification 2)
Instead of setting the width of the sealing material 126 so that the sealing material 126 is interposed between the third surface 78 and the fourth surface 79 as in the first modification, for example, as shown in FIG. May be applied. FIG. 14 is a schematic plan view showing a part of the manufacturing method of the organic EL device. 14 is applied along the lines of the third surface 78 and the fourth surface 79 of the display panel 312 in addition to applying the sealing materials 126a to 126d in a lattice pattern to the mother substrate 312a ′. Then, seal materials 226a and 226b are applied. Accordingly, the structure in which the sealing materials 226 a and 226 b are provided along the third surface 78 and the fourth surface 79 can be obtained without increasing the width of the lattice-shaped sealing material 126. According to this, the strength of the corner of the display panel 312 can be improved.

(Modification 3)
As described above, the present invention is not limited to being applied to the top emission type organic EL devices 11 and 111, and may be applied to, for example, a bottom emission type organic EL device.

(Modification 4)
The electro-optical device described above is not limited to the organic EL devices 11 and 111, and may be a liquid crystal device, a plasma display, electronic paper, or the like.

  DESCRIPTION OF SYMBOLS 11, 111 ... Organic EL device as an electro-optical device, 12, 112 ... Display panel as an electro-optical panel, 12a, 112a ... Display panel precursor, 12a ', 112a' ... Mother substrate as a first mother glass substrate, DESCRIPTION OF SYMBOLS 13 ... Display part, 14, 14R, 14G, 14B ... Pixel, 15 ... Display area, 16 ... Terminal part, 17a, 17b, 17c ... Relay board, 21, 22 ... Resin film, 21a, 22a ... Base film, 21b , 22b ... adhesive layer, 23 ... organic EL element as an electro-optical element, 24, 24R, 24G, 24B ... color filter, 25 ... sealing resin, 26, 26a to 26d, 126, 126a to 126d ... sealing material, 27 , 28 ... space, 29 ... part of the sealing resin, 31 ... first substrate, 32 ... second substrate, 33 ... anisotropic conductive film, 34, 35 ... intermediate adhesive layer 36 ... element substrate, 37 ... sealing substrate, 38 ... intersecting part, 41 ... scanning line, 42 ... signal line, 43 ... power line, 44 ... signal line driving circuit, 45 ... scanning line driving circuit, 46 ... for switching TFT, 47 ... Retention capacity, 48 ... TFT element, 51 ... Anode, 52 ... Cathode, 53 ... Functional layer, 61 ... Circuit element layer, 62 ... Flattening layer, 63 ... Reflective layer, 64 ... Partition, 65 ... Electrode protection Layer, 66 ... organic buffer layer, 67 ... gas barrier layer, 68 ... light shielding layer, 71 to 75, 171 to 175 ... outer shape line, 76 to 79 ... plane, 81 to 84, 181 to 184 ... side, 85 to 88 ... Corner, 91 ... Laminating device, 92 ... Pressure roller.

Claims (6)

A method of manufacturing an electro-optical device that takes a large number of electro-optical panels having electro-optical elements from a pair of bonded mother glass substrates ,
An application step of applying a sealing material on one mother glass substrate of the pair of mother glass substrates ,
An attaching step of attaching the other mother glass substrate of the pair of mother glass substrates so as to face the one mother glass substrate through the sealing material,
Have a, and a cutting step of cutting the electro-optical panel along the cut lines overlaps the pair of mother glass substrates in the sealing material in a plan view,
And applying the sealing material in a lattice shape so as to surround the electro-optic element along a first direction and a second direction intersecting the first direction in a plan view. Including
The cutting step includes a step of cutting so that an intersecting portion where the first direction and the second direction of the sealing material overlap is a corner portion of the electro-optical panel, and chamfering the corner portion. A method of manufacturing an electro-optical device. A method of manufacturing the electro-optical device according to claim 1,
The electro-optical panel includes a first substrate and a second substrate,
In the cutting step, the electro-optical panel is cut out by cutting the first mother glass substrate to be the first substrate and the other mother glass substrate to be the second substrate . Production method. A method of manufacturing the electro-optical device according to claim 2 ,
The first substrate has an element region in which the electro-optic element is provided, and a terminal region in which a terminal portion is provided ,
The first substrate and the second substrate in the terminal region do not overlap in plan view,
In the application step , the sealing material is applied to the one mother glass substrate so that the sealing material is not formed in the terminal region of the first substrate ,
In the cutting step, the corner portion on the terminal region side of the first substrate is chamfered . A method for manufacturing an electro-optical device according to any one of claims 1 to 3 ,
In the electro-optical device, the application step may change the application amount or change the application timing so that the application amount of the sealing material is equal to the application amount of other portions at the intersection . Production method. A method for manufacturing an electro-optical device according to any one of claims 1 to 4 ,
The method of manufacturing an electro-optical device, wherein the cutting step includes cutting the pair of mother glass substrates using a dicing method or a laser cutting method. A method for manufacturing an electro-optical device according to any one of claims 1 to 5 ,
An etching step of etching the pair of mother glass substrates;
Have a, a laminating step of laminating a pair of resin films the electro-optical panel which is cut in the cutting step,
The etching process, a method of manufacturing an electro-optical device, each of the thickness of the pair of mother glass substrates, characterized in that the etching so as to 100μm or less.

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