JP2008176204A - Manufacturing method of liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a liquid crystal display device capable of precisely dividing attached substrate base material together with a seal member and capable of preventing attached substrates from being damaged upon the manufacturing of the liquid crystal display device. <P>SOLUTION: The manufacturing method of the liquid crystal display device comprises a division process of dividing the attached substrate base material A together with the seal member 14, wherein the division process includes: a first process of forming division grooves 18, 19 which are communicated with the seal member 14 side from the outside of the attached substrate base material A with respect to at least one of a first substrate base material 15 and a second substrate base material 16 and are extended along the seal member 14; and a second process of removing a part of the seal member 14 by causing an etching solution to penetrate from the division grooves 18, 19 into the seal member 14 side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a liquid crystal display device.

  Conventionally, a liquid crystal display device in which a liquid crystal layer is sealed between two substrates by a sealing member is widely known, and the liquid crystal display device is widely used in displays of mobile phones, game machines, audio players, and the like. Yes.

  A liquid crystal display device is disposed between a TFT substrate on which a TFT or the like is formed, a counter substrate that is disposed opposite to the TFT substrate and on which a color filter, a common electrode, or the like is formed, and the TFT substrate and the counter substrate. And a liquid crystal layer sealed by a sealing member, and applying a voltage to the liquid crystal layer controls the orientation of the liquid crystal molecules to perform a desired display.

  Regarding the manufacture of a liquid crystal display device, in general, a method is known in which a plurality of bonded substrates are formed by dividing a bonded substrate base material in order to improve productivity. Here, the bonded substrate base material is a base material formed by integrally forming a plurality of bonded substrates in a matrix. The bonded substrate base material includes a TFT substrate base material having a plurality of regions for forming TFT substrates (hereinafter also referred to as TFT substrate regions) and a counter member having a plurality of regions for forming counter substrates (hereinafter also referred to as counter substrate regions). The substrate base material is formed by bonding a plurality of frame-shaped seal members.

  In this method of manufacturing a liquid crystal display device, first, a TFT substrate base material is formed by forming a TFT or the like for each TFT substrate region on one large glass substrate, and a counter substrate region on the other large glass substrate. A counter substrate base material is formed by forming a color filter, a common electrode, and the like every time.

  Next, the TFT substrate base material and the counter substrate base material are bonded together so that the TFT substrate region and the counter substrate region face each other through the seal member, thereby forming a bonded substrate base material. As a result, the bonded substrate base material has a plurality of bonded substrate regions in which the TFT substrate region and the counter substrate region are bonded through the seal member. Thereafter, the bonded substrate base material is divided into each bonded substrate region to form a plurality of bonded substrates.

  As a method for dividing the bonded substrate base material, a so-called scribe break method is generally known. In the scribe break method, first, a scribe groove is formed in a dividing region of one substrate base material (TFT substrate base material or counter substrate base material) using a cutter wheel. Next, by applying pressure to the divided region of the bonded substrate base material, a crack is generated starting from the scribe groove, and the crack is grown to divide one substrate base material. Thereafter, the other substrate base material is divided in the same manner to divide the bonded substrate base material.

  By the way, it is preferable that the frame area in the bonded substrate is relatively small in terms of reducing the non-display area of the liquid crystal display device. Here, the frame region is a region composed of a region where the seal member is formed on the bonded substrate and a region outside the seal member.

  However, since the substrate base material and the seal member are different from each other, cracks cannot be continuously grown from the substrate base material to the seal member by the scribe break method. Therefore, since the bonded substrate base material cannot be divided together with the seal member, the bonded substrate base material is usually divided outside the seal member. If it does so, since a part of both board | substrate base materials will remain outside a sealing member in a bonded substrate, the frame area | region of a bonded substrate will become comparatively large.

  On the other hand, as disclosed in Patent Document 1 and Patent Document 2, it is known to divide a bonded substrate base material together with a seal member.

  In Patent Document 1, first, the bonded substrate base material is heated by irradiating a laser to a divided region overlapping with the seal member when viewed from the normal direction of the surface of the bonded substrate base material. Subsequently, an internal stress is generated in the divided region of the substrate base material by locally cooling the divided region irradiated with the laser. A crack is generated in the substrate base material by the internal stress to divide the substrate base material, and an attempt is made to divide the bonded substrate base material by laser cutting the sealing member.

In Patent Document 2, when the sealing member is cured by irradiating ultraviolet rays, a light shielding mask that overlaps the sealing member in the divided region as viewed from the normal direction of the surface of the bonded substrate base material is provided. The seal member is in an uncured state. Thus, the bonded substrate matrix is divided by dividing the opposing substrate matrix via the uncured seal member in the segmented region.
JP 2001-75064 A JP 2001-183675 A

  However, Patent Document 1 does not show in detail a specific method for laser cutting the seal member. As a method of laser cutting the sealing member, assuming that the sealing member is irradiated with laser from the gap between the divided surfaces of the substrate base material after dividing the substrate base material, the gap between the divided surfaces is larger than the laser spot. Since it is small, the laser cannot be sufficiently irradiated to the seal member. Therefore, in practice, it is difficult to divide the seal member with high accuracy only by the laser.

  Furthermore, even in Patent Document 2, a seal member that is not divided in the divided region remains. That is, generally, since the sealing member cannot be completely cured only by curing by irradiation with ultraviolet rays, the sealing member usually has both ultraviolet curing properties and thermosetting properties. In other words, since the seal member is temporarily cured by ultraviolet irradiation and then cured by heat treatment, even if a light shielding mask is provided on the seal member in the divided region, the seal member in the divided region is also cured by the heat treatment. . If it does so, even if both board | substrate base materials are parted, it will become difficult to part | separate a sealing member, and a bonded substrate base material cannot be parted accurately.

  In addition, it is conceivable to divide the seal member together with the bonded substrate base material by applying a relatively large pressure to the bonded substrate base material. A part of the laminated substrate is easily damaged. Since the damaged bonded substrate is easily broken even by a small impact, the strength of the liquid crystal display device is lowered.

  The present invention has been made in view of such various points, and an object of the present invention is to sever the bonded substrate base material together with the sealing member with high accuracy and to prevent the bonded substrate from being damaged. It is in.

  In order to achieve the above object, in the present invention, after forming a dividing groove that communicates from the outside of the bonded substrate base material to the seal member in at least one of the first substrate base material and the second substrate base material. The etching solution was allowed to enter the sealing member side from the dividing groove to remove a part of the sealing member.

  Specifically, the method for manufacturing a liquid crystal display device according to the present invention includes a first substrate base material, a second substrate base material disposed opposite to the first substrate base material, and the first substrate base material. A method of manufacturing a plurality of liquid crystal display devices by dividing a bonded substrate matrix provided with a frame-shaped sealing member disposed between the second substrate matrix and the bonded substrate matrix A dividing step of dividing the material together with the sealing member to form a plurality of bonded substrates, wherein the dividing step is performed by applying the bonding to at least one of the first substrate base material and the second substrate base material. A first step of forming a dividing groove that communicates with the sealing member side from the outside of the laminated substrate base material and extends along the sealing member; and an etching solution is introduced from the dividing groove to the sealing member side, Second to remove a part of the seal member And a degree.

  The bonded substrate board includes a cell region including a region where the seal member is formed and a region surrounded by the seal member, and a terminal region provided outside the seal member, and the cell region. It is preferable that the sealing member is integrally formed with the sealing member in the other cell region adjacent to the cell region without the terminal region interposed therebetween.

  The seal member may be an epoxy resin or an acrylic resin.

  Preferably, the first substrate base material and the second substrate base material are glass substrates, and the etching solution is any one of nitric acid, sulfuric acid, a mixed solution of nitric acid and sulfuric acid.

  In the first step, the dividing groove may be formed by a cutter wheel.

  In the first step, the dividing groove may be formed by a laser.

-Action-
Next, the operation of the present invention will be described.

  The dividing step forms a dividing groove that communicates from the outside of the bonded substrate base material to the seal member side and extends along the seal member with respect to at least one of the first substrate base material and the second substrate base material. And a second step of removing a part of the sealing member by allowing the etching solution to enter the sealing member side from the dividing groove, and thus applying a relatively large pressure to the first substrate base material and the second substrate base material. Without adding, the sealing member can be accurately divided. Therefore, it is possible to cut the bonded substrate base material together with the sealing member with high accuracy and to prevent the bonded substrate from being damaged.

  Furthermore, when the seal member in the cell region is formed integrally with the seal member in another cell region adjacent to the cell region without the terminal region, the terminal region is not interposed in the bonded substrate base material. Since no extra region is formed between the sealing members in the cell regions adjacent to each other, the number of bonded substrates that can be formed from one bonded substrate base material can be increased.

  Further, the sealing member is an epoxy resin or an acrylic resin, the first substrate base material and the second substrate base material are glass substrates, and the etching solution is any one of nitric acid, sulfuric acid, nitric acid and sulfuric acid mixed liquid. In this case, it is possible to remove the sealing member with almost no removal of the first substrate base material and the second substrate base material, so that it is possible to suppress the strength of the bonded substrate from being lowered. It becomes possible.

  According to the present invention, the dividing step includes a first step of forming a dividing groove communicating with at least one of the first substrate base material and the second substrate base material from the outside of the bonded substrate base material to the seal member side. And a second step of removing a part of the seal member by allowing an etching solution to enter the seal member side from the dividing groove, and applying a relatively large pressure to the first substrate base material and the second substrate base material. Therefore, the seal member can be accurately divided. As a result, the bonded substrate base material can be accurately divided together with the seal member, and the bonded substrate can be prevented from being damaged.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

Embodiment 1 of the Invention
1 to 9 show Embodiment 1 of the present invention. FIG. 1 is a front view schematically showing a bonded substrate matrix A. FIG. FIG. 2 is a front view schematically showing the TFT substrate base material 15. FIG. 3 is a front view schematically showing the counter substrate base material 16. 4-7 is a figure for demonstrating a parting process. FIG. 8 is a front view schematically showing the liquid crystal display device S. FIG. FIG. 9 is a diagram schematically showing a cross section taken along line IX-IX in FIG.

  As shown in FIGS. 8 and 9, the liquid crystal display device S of Embodiment 1 includes a TFT substrate 10 that is a first substrate, and a counter substrate 11 that is a second substrate disposed so as to face the TFT substrate 10. A bonded substrate having a liquid crystal layer 12 formed between the TFT substrate 10 and the counter substrate 11 is provided. The bonded substrate board has a cell region 17 and a terminal region 13.

  The TFT substrate 10 is, for example, a rectangular glass substrate. Although not shown, the TFT substrate 10 is provided with a plurality of pixels on the surface on the liquid crystal layer 12 side, and a TFT (thin film transistor) and a pixel electrode are formed in each pixel. The TFT substrate 10 is provided with an alignment film (not shown) that covers the TFT and the pixel electrode on the surface on the liquid crystal layer 12 side.

  The counter substrate 11 is, for example, a rectangular glass substrate. Although not shown, the counter substrate 11 is provided with a color filter, a common electrode made of ITO (transparent electrode), and the like on the surface on the liquid crystal layer 12 side. Further, the counter substrate 11 is provided with an alignment film (not shown) covering the color filter and the common electrode on the surface on the liquid crystal layer 12 side.

  The liquid crystal layer 12 is sealed by a sealing member 14 formed between the TFT substrate 10 and the counter substrate 11 and having a rectangular frame shape, for example. A region in the bonded substrate including a region where the seal member 14 is formed and a region surrounded by the seal member 14 is a cell region 17. The seal member 14 is, for example, an epoxy resin or an acrylic resin, and is formed between the entire periphery of the outer edge portion of the counter substrate 11 and the TFT substrate 10.

  A part of one side of the TFT substrate 10 is exposed to the outside of the bonded substrate from the counter substrate 11 when viewed from the normal direction of the surface of the bonded substrate on the counter substrate 11 side, and is outside the seal member 14. It extends to. Here, the outside means a direction from the center in the frame of the seal member 14 toward the outside of the frame of the seal member 14.

  The region of the TFT substrate 10 extending outward from the seal member 14 is a terminal region 13 in which a terminal portion (not shown) for applying a voltage to the liquid crystal layer 12 is formed. That is, the terminal region 13 is provided outside the sealing member 14 and is exposed to the outside of the bonded substrate, and the terminal portion formed in the terminal region 13 is connected to the pixel electrode via the wiring (not shown). ing.

  The seal member 14 has outer end portions on three sides excluding one side on the terminal region 13 side at substantially the same positions as the outer end portions of the TFT substrate 10 and the counter substrate 11 when viewed from the normal direction of the surface of the bonded substrate. Is formed. That is, the TFT substrate 10 and the counter substrate 11 are hardly formed outside the three sides of the seal member 14. As described above, the bonded substrate has the sealing member 14 that seals the liquid crystal layer 12 between the TFT substrate 10 and the counter substrate 11.

  Furthermore, the liquid crystal display device S has a polarizing plate (not shown) on the surface of the bonded substrate. That is, the polarizing plates are disposed on the surfaces of the TFT substrate 10 and the counter substrate 11 opposite to the liquid crystal layer 12, respectively. Although not shown, a backlight unit and a liquid crystal driving IC are mounted on the bonded substrate. Thus, the liquid crystal display device S performs desired display by controlling the alignment state of the liquid crystal molecules in the liquid crystal layer 12 by TFT.

-Manufacturing method-
The manufacturing method of the liquid crystal display device S includes a bonded substrate base material forming step and a dividing step.

  In the bonded substrate matrix forming step, as shown in FIG. 1, a bonded substrate matrix A is formed in which the bonded substrates are arranged in a matrix and are integrally formed. The bonded substrate base material forming step includes a TFT substrate base material forming step, a counter substrate base material forming step, and a bonding step.

  In the TFT substrate base material forming step, as shown in FIG. 2, the TFT substrate base material 15 in which the TFT substrate 10 is arranged in a matrix and integrally formed is formed. That is, for example, a TFT and a pixel electrode are formed for each TFT substrate region 20 on one surface of a large glass substrate having a plurality of regions 20 (hereinafter also referred to as TFT substrate regions) for forming a TFT substrate 10 having a rectangular shape or the like. At the same time, an alignment film is provided after forming the wiring and the terminal portion, whereby the TFT substrate base material 15 is formed with each TFT substrate region 20 having the structure of the TFT substrate 10. The TFT substrate regions 20 in the TFT substrate base material 15 are adjacent to each other with no space between adjacent TFT substrate regions 20.

  In the counter substrate base material forming step, as shown in FIG. 3, the counter substrate base material 16 is formed in which the counter substrate 11 is arranged in a matrix and integrally formed. That is, for example, a color filter and a common electrode are provided for each counter substrate region 21 on one surface of a large-sized glass substrate having a plurality of regions 21 (hereinafter also referred to as counter substrate regions) in which a counter substrate 11 having a rectangular shape or the like is formed. By providing an alignment film after the formation, the counter substrate base material 16 is formed with each counter substrate region 21 having the structure of the counter substrate 11.

  The plurality of counter substrate regions 21 in the counter substrate base material 16 are each except for the exposed terminal region when viewed from the normal direction of the surface of the bonded substrate base material A when the bonded substrate base material A is formed later. The TFT substrate region 20 is disposed so as to overlap. That is, in the counter substrate base material 16, regions facing the exposed terminal regions are provided outside one side in each counter substrate region 21. Here, the exposed terminal region is a terminal region 13 exposed from the counter substrate 11 to the outside of the bonded substrate when viewed from the normal direction of the surface of the bonded substrate when the bonded substrate is formed later.

  The plurality of counter substrate regions 21 are arranged in a row adjacent to each other without providing a space between the adjacent counter substrate regions 21 without passing through the region of the counter substrate base material 16 facing the exposed terminal region, respectively. The counter substrate region 21 as a whole is provided in a strip shape.

  In the subsequent bonding step, the TFT substrate base material 15 and the counter substrate base material 16 are bonded together via a plurality of frame-shaped seal members 14. First, an uncured seal member 14 made of, for example, an epoxy resin or an acrylic resin is supplied to the counter substrate base material 16 for each counter substrate region 21. The seal member 14 is supplied to the outer edge portion of each counter substrate region 21 in, for example, a rectangular frame shape. At this time, the seal member 14 in the counter substrate region 21 is supplied integrally with the seal member 14 in another counter substrate region 21 adjacent to the counter substrate region 21 without providing a space therebetween.

  Next, a predetermined amount of liquid crystal material is dropped inside each sealing member 14 of the counter substrate base material 16. The dropping of the liquid crystal material is performed, for example, by dropping a liquid crystal material while a dropping device having a function of dropping the liquid crystal material moves over the entire counter substrate base material 16. This dripping device includes, for example, a cylinder filled with a liquid crystal material, a piston for pushing out the liquid crystal material in the cylinder, and a dripping nozzle formed at the tip of the cylinder, and the dripping nozzle that pushes out the liquid crystal material in the cylinder by the piston. A liquid crystal material is dripped from.

  Subsequently, the TFT substrate base material 15 and the counter substrate base material 16 are bonded together so that the TFT substrate region 20 and the counter substrate region 21 face each other with the seal member 14 therebetween, thereby forming a bonded substrate base material A. To do.

  First, the surfaces of the TFT substrate base material 15 and the counter substrate base material 16 provided with the alignment film are opposed to each other. Next, the positions of both the substrates 15 and 16 are aligned by using alignment marks provided in advance for diagonal alignment of the first substrate base material 15 and the second substrate base material 16. That is, after rough alignment is performed in a non-contact state, the TFT substrate base material 15 and the counter substrate base material 16 are made to have a plurality of positions by aligning fine positions in a state where the opposing surfaces of the substrates 15 and 16 are substantially in contact with each other. Bonding is performed via the seal member 14. The TFT substrate base material 15 and the counter substrate base material 16 are bonded together in a vacuum environment such as a vacuum chamber.

  Thereafter, the seal member 14 is cured. First, the sealing member 14 is temporarily cured by irradiating the bonded substrate base material A with ultraviolet rays. Next, the sealing member 14 is fully cured by subjecting the bonded substrate base material A to heat treatment. At this time, a region surrounded by the sealing member 14 between the TFT substrate region 20 and the counter substrate region 21 becomes the liquid crystal layer 12.

  In this way, the TFT substrate region 20 and the counter substrate region 21 are bonded together via the seal member 14, and the cell region 17 including the region where the seal member 14 is formed and the region surrounded by the seal member 14, A bonded substrate matrix A having a plurality of bonded substrate regions 22 having terminal regions 13 provided outside one side of the seal member 14 is formed. As shown in FIG. 4, the sealing member 14 in the cell region 17 in the bonded substrate base material A is adjacent to the cell region 17 in which the sealing member 14 is formed without interposing the terminal region 13. Are formed integrally with the sealing member 14.

  In the next dividing step, a plurality of bonded substrates are formed by dividing the bonded substrate base material A together with the seal member 14. The dividing step is a first step of forming a dividing groove 18 that extends from the outside of the bonded substrate base material A to the seal member 14 side and extends along the seal member 14 with respect to the TFT substrate base material 15; And a second step of removing a part of the seal member 14 by allowing the etching solution to enter from the dividing groove 18 to the seal member 14 side.

  In the first step, first, as shown in FIG. 5, a dividing groove 18 is formed in the TFT substrate base material 15 by, for example, a cutter wheel. That is, first, when viewed from the normal direction of the surface of the bonded substrate base material A, a scribe groove is formed by a cutter wheel in a divided region of the TFT substrate base material 15 that extends along the seal member 14 and overlaps the seal member 14. To do. Next, by applying pressure from the surface of the bonded substrate base material A on the counter substrate base material 16 side to the divided region where the scribe groove is formed, a crack is generated starting from the scribe groove and the crack is generated. And a dividing groove 18 is formed in the TFT substrate base material 15.

  In the second step performed thereafter, as shown in FIG. 6, for example, any one of nitric acid, sulfuric acid, nitric acid, and a mixed solution of sulfuric acid is used for the dividing groove 18 formed in the TFT substrate base material 15. A predetermined amount of an etching solution is applied or dropped. Then, a part of the seal member 14 is removed by infiltrating the etching solution from the dividing groove 18 to the seal member 14 side by utilizing capillary action. Reference numeral 25 in FIG. 6 indicates a direction in which the etching solution is introduced. In this way, after etching is performed on a part of the seal member 14 until the seal member 14 is divided, the bonded substrate base material A is washed with water to stop the etching reaction.

  Next, as shown in FIG. 7, the counter substrate is separated from the divided region where the seal member 14 in the counter substrate base material 16 is divided by the same method as the method of forming the dividing groove 18 in the TFT substrate base material 15. By forming the groove 23 penetrating the base material 16, the bonded substrate base material A is separated together with the seal member 14. In this way, the bonded substrate base material A is divided for each cell region 17 and the region of the counter substrate base material 16 facing the exposed terminal region is divided to separate the terminal region 13 from the counter substrate 11 to the outside of the bonded substrate. A plurality of bonded substrates are formed by exposing the substrate.

  Thereafter, with respect to each bonded substrate, a polarizing plate is disposed on the surface of the TFT substrate 10 and the counter substrate 11 opposite to the liquid crystal layer 12, and a backlight unit, a liquid crystal driving IC, and the like are mounted. As described above, the TFT substrate base material 15, the counter substrate base material 16 disposed to face the TFT substrate base material 15, and the TFT substrate base material 15 and the counter substrate base material 16 are disposed. A plurality of liquid crystal display devices S are manufactured by dividing the bonded substrate base material A provided with the frame-shaped sealing member 14.

-Effect of Embodiment 1-
Therefore, according to the first embodiment, the dividing step forms the dividing groove 18 that communicates with the TFT substrate base material 15 from the outside of the bonded substrate base material A to the sealing member 14 side and extends along the sealing member 14. And the second step of removing a part of the sealing member 14 by allowing the etching solution to enter the sealing member 14 side from the dividing groove 18, so that the TFT substrate base material 15 and the counter substrate base material 16 are included. It becomes possible to divide the seal member 14 with high accuracy without applying a relatively large pressure. As a result, the bonded substrate base material A can be divided with the sealing member 14 with high accuracy, and the bonded substrate can be prevented from being damaged.

  Further, since the seal member 14 in the cell region 17 is formed integrally with the seal member 14 in another cell region 17 adjacent to the cell region 17 without the terminal region 13 interposed therebetween, in the bonded substrate base material A No extra region is formed between the sealing members 14 in the adjacent cell regions 17 without the terminal region 13 interposed therebetween. Therefore, the area | region which can form the bonding board | substrate area | region 22 in the bonding board | substrate base material A expands. As a result, the number of bonded substrates that can be formed from one bonded substrate base material A can be increased.

  Further, the seal member 14 is an epoxy resin or an acrylic resin, the TFT substrate base material 15 and the counter substrate base material 16 are glass substrates, and the etching solution is any one of nitric acid, sulfuric acid, nitric acid and sulfuric acid mixed liquid. Therefore, the seal member 14 can be removed without substantially removing the TFT substrate base material 15 and the counter substrate base material 16. As a result, it is possible to suppress the strength of the bonded substrate from being lowered.

<< Embodiment 2 of the Invention >>
10 and 11 show Embodiment 2 of the present invention. In the following embodiments, the same portions as those in FIGS. 1 to 9 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In Embodiment 1 described above, in the dividing step, a part of the seal member 14 is removed after the dividing groove 18 is formed in the TFT substrate base material 15. In Embodiment 2, however, the TFT substrate base material 15 and the opposing surface are opposed to each other. After the dividing groove 18 is formed on both the substrates 15 and 16 of the substrate base material 16, a part of the seal member 14 is removed.

  That is, first, as shown in FIG. 10, the dividing groove 18 is formed in the dividing region with respect to the TFT substrate base material 15. Subsequently, the TFT substrate base material 16 is viewed from the normal direction of the surface of the bonded substrate base material A by a method similar to the method in which the dividing groove 18 is formed in the TFT substrate base material 15 with respect to the counter substrate base material 16. A dividing groove 19 that overlaps the dividing groove 18 formed in the material 15 is formed. Alternatively, the dividing groove 18 may be formed in the TFT substrate base material 15 after the dividing groove 19 is formed in the counter substrate base material 16.

  Thereafter, as shown in FIG. 11, an etching solution is applied or dropped onto the dividing grooves 18 and 19 formed on both the substrates 15 and 16 of the TFT substrate base material 15 and the counter substrate base material 16. By allowing the etching solution to enter the seal member 14 side, a part of the seal member 14 is removed and the seal member 14 is divided. Then, the bonded substrate matrix A is divided for each bonded substrate region 22.

-Effect of Embodiment 2-
Therefore, also in the second embodiment, the bonded substrate can be divided together with the seal member 14 without applying a relatively large pressure to the TFT substrate base material 15 and the counter substrate base material 16, and thus the first embodiment described above. The same effect can be obtained.

<< Other Embodiments >>
In Embodiment 1 described above, the slicing groove is formed by the cutter wheel, and then the split groove 18 is formed by growing a crack generated from the scribe groove as a starting point. However, the present invention is not limited to this, and the cutter wheel is used. A scribe groove that communicates from the outside of the bonded substrate base material A to the seal member 14 side may be formed, and the scribe groove itself may be used as the dividing groove 18. For example, the dividing groove 18 may be formed by a laser such as a CO ₂ laser, and the dividing groove 18 can be formed by a known method.

  In the first embodiment, the seal member 14 is supplied to the counter substrate base material 16. However, the present invention is not limited to this, and the seal member 14 may be supplied to the TFT substrate base material 15.

  In the first embodiment, a so-called dropping injection method in which the liquid crystal layer 12 is formed by bonding the TFT substrate base material 15 and the counter substrate base material 16 after the liquid crystal material is dropped inside the seal member 14 in the counter substrate region 21. However, the present invention is not limited to this, and the liquid crystal layer 12 is formed by attaching the liquid crystal material to the inside of the seal member 14 after the TFT substrate base material 15 and the counter substrate base material 16 are bonded together. You may form by the vacuum injection method which forms the liquid-crystal layer 12 by injecting.

  In the first embodiment, after the dividing groove 18 is formed only in the TFT substrate base material 15, a part of the seal member 14 is removed. In the second embodiment, the dividing grooves 18 and 19 are formed in both the substrates 15 and 16 of the TFT substrate base material 15 and the counter substrate base material 16 and then a part of the seal member 14 is removed. However, the present invention is not limited to this, and after forming the dividing groove 19 only in the counter substrate base material 16, an etching solution is allowed to enter the sealing member 14 side from the dividing groove 19, thereby removing a part of the sealing member 14 and sealing member. 14 may be divided.

  In the first embodiment, the seal member 14 in the cell region 17 is formed integrally with the seal member 14 in another cell region 17 adjacent to the cell region 17 without the terminal region 13 interposed therebetween. The invention is not limited to this, and the sealing member 14 in the cell region 17 may be formed separately from the sealing member 14 in another cell region 17 adjacent to the cell region 17 without the terminal region 13 interposed therebetween.

  In the first embodiment, the TFT substrate base material 15 and the counter substrate base material 16 are bonded together via a plurality of seal members 14, but the present invention is not limited to this, and the TFT substrate base material 15 and the counter substrate base material 16 are combined. May be bonded together via a single seal member 14 in which a plurality of frame-shaped seal members 14 are integrally formed.

  As described above, the present invention is useful for a method of manufacturing a liquid crystal display device, and particularly suitable for the case where the bonded substrate base material is divided with the sealing member with high accuracy and the bonded substrate is prevented from being damaged. ing.

It is a front view which shows a bonded substrate base material roughly. It is a front view which shows a TFT substrate base material roughly. It is a front view which shows a counter substrate base material roughly. It is sectional drawing which shows the IV-IV sectional view in FIG. FIG. 3 is a cross-sectional view showing a state in which a dividing groove is formed in the TFT substrate base material in Embodiment 1. It is sectional drawing which shows the state which has removed the sealing member in Embodiment 1. FIG. It is sectional drawing which shows the state which cut | disconnected the opposing board | substrate base material in Embodiment 1. FIG. It is a front view which shows a liquid crystal display device roughly. It is a figure which shows schematically the IX-IX line cross section in FIG. It is sectional drawing which shows the state which formed the dividing groove | channel in the TFT substrate base material in Embodiment 2, and a counter substrate base material. It is sectional drawing which shows the state which has removed the sealing member in Embodiment 2. FIG.

Explanation of symbols

S Liquid Crystal Display Device A Bonded Substrate Base Material 12 Liquid Crystal Layer 13 Terminal Region 14 Seal Member 15 TFT Substrate Base Material (First Substrate Base Material)
16 Counter substrate base material (second substrate base material)
17 Cell region 18, 19 Dividing groove

Claims (6)

A first substrate base material, a second substrate base material disposed opposite to the first substrate base material, and a frame-like shape disposed between the first substrate base material and the second substrate base material A method of manufacturing a plurality of liquid crystal display devices by dividing a bonded substrate base material provided with a seal member,
A dividing step of dividing the bonded substrate base material together with the sealing member to form a plurality of bonded substrates;
In the dividing step, at least one of the first substrate base material and the second substrate base material communicates from the outside of the bonded substrate base material to the seal member side and extends along the seal member. A first step of forming a groove;
And a second step of removing a part of the sealing member by allowing an etching solution to enter the sealing member from the dividing groove. In claim 1,
The bonded substrate has a cell region composed of a region where the seal member is formed and a region surrounded by the seal member, and a terminal region provided outside the seal member,
The method for manufacturing a liquid crystal display device, wherein the seal member in the cell region is formed integrally with the seal member in another cell region adjacent to the cell region without the terminal region interposed therebetween. In claim 1,
The said sealing member is an epoxy resin or an acrylic resin, The manufacturing method of the liquid crystal display device characterized by the above-mentioned. In claim 3,
The first substrate base material and the second substrate base material are glass substrates,
The method of manufacturing a liquid crystal display device, wherein the etching solution is any one of nitric acid, sulfuric acid, and a mixed liquid of nitric acid and sulfuric acid. In claim 1,
In the first step, the dividing groove is formed by a cutter wheel. In claim 1,
In the first step, the dividing groove is formed by a laser.

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