JP2009294602A - Method of manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily form a substrate constituting a display device extremely thin. <P>SOLUTION: The method of manufacturing display device includes: a first substrate forming process of applying a resin onto a support substrate 25, curing the resin and, thereby, forming a first substrate 21 made of layer of the resin; a bonding process of bonding a second substrate 22 to the first substrate 21 formed on the support substrate 25 so as to oppose the first substrate 21; and a removal process of removing the support substrate 25 from the first substrate 21 bonded to the second substrate 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a thin display device.

  It is known that a liquid crystal display device or an EL display device is used as a small display device used for a mobile device such as a cellular phone. In recent years, there has been a strong demand for reduction in thickness and weight.

  For example, a liquid crystal display device has a structure in which a TFT substrate on which a plurality of TFTs (thin film transistors), wirings, and the like are formed and a counter substrate on which a color filter, a common electrode, and the like are formed are bonded via a liquid crystal layer. .

  A polarizing plate is attached to the TFT substrate and the counter substrate, and a backlight as an illumination device is disposed on the back side of the TFT substrate. In order to reduce the thickness of the entire apparatus, the thickness of the polarizing plate or the backlight is also reduced.

  Further, it is known that the TFT substrate and the counter substrate are made of glass substrates. Therefore, for example, when the thickness of the TFT substrate and the counter substrate is 0.2 mm, respectively, it is known that the counter substrate is thinned to 0.1 mm by chemical etching.

  However, in general, it is difficult to keep the etching degree constant over the entire glass substrate. Therefore, if the glass substrate is processed too thinly, holes are partially formed in the glass substrate or cracked. Is likely to occur. As a result, there is a problem that the yield decreases in the glass substrate thinning process.

On the other hand, in Patent Document 1, after a relatively thin final substrate is attached to a support substrate via an adhesive layer, TFTs, wirings, and the like are formed on the final substrate, and then the support substrate is etched. And removing it. This makes it possible to form TFTs and the like on a highly rigid support substrate in the TFT formation process, while making the final substrate thinner.
JP 2003-66858 A

  However, in the method of Patent Document 1, it must be said that it is extremely difficult to attach an ultra-thin final substrate of, for example, about 0.05 mm to the support substrate with high accuracy without unevenness. In addition, even if such an ultra-thin final substrate is bonded to a support substrate through an adhesive layer, the support substrate and the final substrate may be displaced due to heat treatment in the manufacturing process. For this reason, it is difficult to form a desired pattern with high accuracy without misalignment.

  The present invention has been made in view of such a point, and an object of the present invention is to reduce the thickness of the entire display device by forming the substrate constituting the display device extremely thinly and easily. .

  In order to achieve the above object, in the present invention, the first substrate constituting the display device is formed by applying and curing a resin on the support substrate.

  Specifically, a method for manufacturing a display device according to the present invention is a method for manufacturing a display device in which a first substrate and a second substrate are arranged to face each other with a display medium layer interposed therebetween. By applying and curing, the first substrate forming step of forming the first substrate made of the resin layer and the second substrate facing the first substrate formed on the support substrate And a removing step of removing the support substrate from the first substrate bonded to the second substrate.

  In the removing step, it is preferable to reduce the thickness of the second substrate simultaneously with the removal of the support substrate by etching.

  The support substrate is preferably a glass substrate.

  The resin is preferably a UV photosensitive resin.

  The second substrate may be a glass substrate.

  A first barrier film forming step of forming a first barrier film having water repellency on the surface of the support substrate, wherein the resin layer is formed on the surface of the first barrier film in the first substrate forming step; It may be.

  A second barrier film forming step of forming a second barrier film having water repellency on the surface of the first substrate; and in the bonding step, the first substrate on which the second barrier film is formed is formed on the first substrate. Two substrates may be bonded together.

  A flattening film forming step of forming a flattening film on the first substrate on the support substrate; and in the bonding step, the second substrate is bonded to the first substrate on which the flattening film is formed. You may make it match.

  The support substrate is preferably colored.

  In the first substrate forming step, a first substrate base material including a plurality of the first substrates is formed on the support substrate, and in the bonding step, a plurality of the first substrate base materials are formed on the first substrate base material. The second substrate base material including two substrates is bonded, and in the removing step, the support substrate is removed from the first substrate base material bonded to the second substrate base material, and the first substrate is bonded to each other. You may make it have a cutting process which divides | segments a base material and a 2nd board | substrate base material, and forms a some display apparatus.

  In the first substrate forming step, a wall member having a height lower than the thickness of the first substrate is disposed on the surface of the support substrate so as to surround each first substrate, and then the wall member is covered. The resin may be applied to the surface of the support substrate, and the wall member may be removed together with the support substrate in the removal step.

  The display medium layer may be a liquid crystal layer.

-Action-
Next, the operation of the present invention will be described.

  When manufacturing the display device, first, a first substrate forming step is performed, and a first substrate made of the resin layer is formed by applying and curing a resin on the support substrate. Therefore, the first substrate can be formed by a thin resin layer. For example, a UV photosensitive resin can be applied to the resin. Further, for example, a glass substrate can be applied to the support substrate.

  Next, a bonding process is performed, and the second substrate is bonded to the first substrate formed on the support substrate so as to face the first substrate. For example, a glass substrate can be applied to the second substrate. Note that a display medium layer such as a liquid crystal layer may be supplied onto the first substrate before the bonding step, and between the first substrate and the second substrate after the subsequent removal step. You may make it supply.

  Next, a removal step is performed to remove the support substrate from the first substrate bonded to the second substrate. In the removing step, for example, etching can be performed, and it is preferable to reduce the thickness of the second substrate simultaneously with the removal of the support substrate.

  Further, if the support substrate is colored, the remaining amount of the support substrate is easily visually recognized, so that the support substrate can be easily and reliably removed.

  Also, a first barrier film forming step is performed in advance to form a first barrier film having water repellency on the surface of the support substrate, and a resin layer is formed on the surface of the first barrier film in the subsequent first substrate forming step. You may make it do. If it does so, a 1st barrier film will be provided in the outer surface of the 1st board | substrate in a display apparatus, and it will become possible to prevent an external water | moisture content etc. to permeate | transmit a 1st board | substrate.

  Alternatively, a second barrier film forming step may be performed in advance to form a second barrier film having water repellency on the surface of the first substrate. Then, the second barrier film is provided on the inner surface of the first substrate in the display device, and it becomes possible to prevent external moisture and the like from entering the display medium layer.

  In addition, a planarization film forming process may be performed before the bonding process to form a planarization film on the first substrate on the support substrate. If the first substrate is very thin, the film thickness of the resin applied on the support substrate may vary, but if a flattening film is formed, the display medium layer side surface of the first substrate is flattened. This is preferable.

  It is also possible to manufacture a plurality of display devices from a large substrate base material. That is, in this case, in the first substrate forming step, a first substrate base material including a plurality of first substrates is formed on the support substrate. In the bonding step, a second substrate base material including a plurality of second substrates is bonded to the first substrate base material. In the removing step, the support substrate is removed from the first substrate base material bonded to the second substrate base material. Thereafter, a dividing step is performed to divide the first substrate base material and the second substrate base material bonded together to form a plurality of display devices.

  At this time, in the first substrate forming step, a wall member having a height lower than the thickness of the first substrate is disposed so as to surround each first substrate with respect to the surface of the support substrate, and then the wall member is covered. While the resin is applied to the surface of the support substrate, the wall member may be removed together with the support substrate in the removal step. Accordingly, the first substrate base material can be divided for each first substrate simultaneously with the removal of the support substrate. As a result, man-hours are reduced and manufacturing costs are reduced.

  According to the present invention, the first substrate is formed by applying and curing a resin on the support substrate, and then the support substrate is removed, so that the first substrate is formed extremely thin and easily. be able to. Therefore, it is possible to easily reduce the thickness of the entire display device while reducing the thickness of the entire display device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

Embodiment 1 of the Invention
1 to 5 show Embodiment 1 of the present invention.

  FIG. 1 is a cross-sectional view showing a first substrate base material formed on a support substrate. FIG. 2 is a cross-sectional view showing the second substrate base material bonded to the first substrate base material on the support substrate. FIG. 3 is a cross-sectional view showing the first substrate base material and the second substrate base material from which the support substrate has been removed by etching. FIG. 4 is a cross-sectional view showing the structure of the divided liquid crystal display device. FIG. 5 is a cross-sectional view showing the structure of the liquid crystal display device.

  First, the configuration of the liquid crystal display device 1 as the display device of Embodiment 1 will be described.

  As shown in FIG. 5, the liquid crystal display device 1 includes a TFT substrate 12, a counter substrate 11 disposed to face the TFT substrate 12, and a display medium layer provided between the counter substrate 11 and the TFT substrate 12. As a liquid crystal layer 13. The liquid crystal layer 13 is sealed between the counter substrate 11 and the TFT substrate 12 by an annular seal member 14.

  The counter substrate 11 includes a first substrate 21 made of a transparent resin, a color filter layer 15 formed on the liquid crystal layer 13 side of the first substrate 21, a light shielding film 16, a common electrode (not shown), and the first substrate 21. The polarizing plate 17 is laminated on the surface opposite to the liquid crystal layer 13.

  On the other hand, the TFT substrate 12 includes a second substrate 22 made of a glass substrate, a thin film device layer (not shown) formed on the liquid crystal layer 13 side of the second substrate 22, and the liquid crystal layer 13 of the second substrate 22. Has a polarizing plate 18 laminated on the opposite surface, and is configured as a so-called active matrix substrate.

  Although not shown, a plurality of gate wirings and source wirings constituting the thin film device layer are formed in a grid pattern on the TFT substrate 12. For example, pixels are respectively formed in regions partitioned in the grid pattern. Yes. Each pixel is formed with a pixel electrode constituting the thin film device layer, a TFT (thin film transistor) as a switching element, and the like.

  A region on one side of the TFT substrate 12 is a terminal region 19 projecting laterally from the counter substrate 11 when viewed from the normal direction of the substrate surface. In the terminal region 19, lead wires (not shown) are drawn from the thin film device layer, and terminals (not shown) are formed at the ends thereof. An FPC (flexible printed circuit board) 20 is mounted on the terminals in the terminal area 19.

  Then, the liquid crystal display device 1 drives and controls the liquid crystal layer 13 for each pixel by supplying a predetermined signal from the FPC 20 to the TFT of each pixel through the gate wiring and the source wiring, and performs a desired display. Is configured to do.

  Here, the second substrate 22 of the TFT substrate 12 is constituted by a glass substrate having a thickness of 0.2 mm, and the first substrate 21 of the counter substrate 11 is constituted by a transparent organic resin layer having a thickness of 0.05 mm. ing. Thereby, the thickness of the liquid crystal display device 1 is about 0.25 mm.

-Manufacturing method-
Next, a method for manufacturing the liquid crystal display device 1 will be described.

  In the present embodiment, a plurality of liquid crystal display devices 1 are manufactured by dividing a large pair of substrates.

  First, a first substrate forming step is performed to form a first substrate base material 31 including a plurality of first substrates 21 on a large support substrate 25. The plurality of first substrates 21 are formed on the first substrate base material 31 so as to be arranged in a matrix at predetermined intervals.

  That is, for example, a liquid transparent organic resin such as a UV photosensitive resin is uniformly applied in a thin film shape on a support substrate 25 made of, for example, a transparent glass substrate, and the thin film resin layer is irradiated with ultraviolet rays. Cured by etc. The thickness of the organic resin is preferably about 0.01 mm to 0.2 mm. Then, the first substrate 21 is formed on the support substrate 25 by a thin film resin layer made of UV photosensitive resin.

  Thereafter, a common electrode made of ITO or the like (not shown) is formed for each first substrate 21 on the surface of the first substrate base 31 opposite to the support substrate 25, and the color filter layer 15 and the light shielding film 16. Etc. The color filter layer 15 is formed by regularly arranging three primary color layers of R, G, and B, and a light shielding film 16 is formed in a frame shape along the four sides around the first substrate 21. An alignment film (not shown) is formed on the surface in contact with the liquid crystal layer 13.

  At this time, the thickness of the support substrate 25 is 0.45 mm, for example, and the thickness of the first substrate base material 31 (first substrate 21) is 0.05 mm, for example.

  Next, a bonding step is performed to bond the second substrate base material 32 including the plurality of second substrates 22 to the first substrate base material 31. The plurality of second substrates 22 are formed on the second substrate base material 32 so as to be arranged in a matrix at predetermined intervals.

  That is, for the second substrate base material 32 made of a glass substrate having a relatively large thickness, for example, a thin film device layer (not shown) (that is, TFT, pixel electrode, gate wiring, source wiring, etc.) is provided for each second substrate 22. Is formed in advance. An alignment film (not shown) is formed on the surface of the thin film device layer that is in contact with the liquid crystal layer 13.

  Thereafter, a rectangular frame-shaped sealing member 14 is formed on the second substrate base material 32 by drawing with a syringe or the like for each second substrate 22. Subsequently, a liquid crystal material is dropped and supplied inside each seal member 14 (ODF method). The liquid crystal material may be dropped on the color filter layer 15 of each first substrate 21. For example, a UV photosensitive resin can be applied to the seal member 14.

  Subsequently, the second substrate base material 32 is bonded to the first substrate base material 31 so that each of the second substrates 22 faces the first substrate 21 formed on the support substrate 25. Thereafter, the sealing member 14 is cured, so that the liquid crystal material is sealed between the first substrate 21 and the second substrate 22 by the sealing member 14.

  It is preferable to provide a sealing material on the outer edge portions of the first substrate base material 31 and the second substrate 22 bonded together so that the etching solution does not enter the entire periphery.

  At this time, the thickness of the second substrate base material 32 (second substrate 22) is, for example, 0.7 mm.

  Next, a support substrate 25 is removed from the first substrate 21 bonded to the second substrate 22 by removing the support substrate 25 from the first substrate preform 31 bonded to the second substrate matrix 32 by performing a removing step. Remove.

  In this removal step, the second substrate 22 is thinned simultaneously with the removal of the support substrate 25 by etching. That is, the entire first substrate base material 31 and second substrate base material 32 bonded together on the support substrate 25 are immersed in hydrofluoric acid as an etching solution for about 100 minutes, for example. The outer portion is removed by etching, for example, by a thickness of 0.5 mm. As a result, as shown in FIG. 3, the thickness of the second substrate base material 32 is reduced to 0.2 mm, and the support substrate 25 having a thickness of 0.45 mm is all removed by etching, whereby the first substrate The entire surface of the base material 31 is exposed. After the etching process, the first substrate base material 31 and the second substrate base material 32 are sufficiently washed with water so that the etching solution does not remain on the substrate base materials 31 and 32.

  Next, a dividing step is performed, and the first substrate base material 31 and the second substrate base material 32 bonded to each other are divided for each first substrate 21 (for each second substrate 22) with a wheel cutter or the like, As shown in FIG. 4, a plurality of liquid crystal display devices 1 are formed. In this case, it is preferable to first divide the first substrate base material 31 and then sever the second substrate base material 32.

  Polarizing plates 17 and 18 are attached to the outer surfaces of the first substrate 21 and the second substrate 22 to form the TFT substrate 12 and the counter substrate 11. As shown in FIG. 5, the FPC 20 is mounted on the terminal area of the TFT substrate 12. The liquid crystal display device 1 is manufactured as described above.

  Therefore, according to the first embodiment, the first substrate base material 31 (first substrate 21) is formed by applying and curing the UV photosensitive resin on the support substrate 25, and then the support substrate 25 is attached to the first substrate. Since it is removed from the substrate base material 31 (first substrate 21), the first substrate 21 can be formed extremely thin and easily. Therefore, it is possible to easily reduce the thickness of the entire liquid crystal display device 1 while reducing the thickness of the entire liquid crystal display device 1.

  Further, since the first substrate base material 31 (first substrate 21) made of a transparent organic resin is in close contact with the surface of the support substrate 25 and hardened, pattern displacement or pattern due to positional displacement in the formation of the color filter layer 15 or the like. Can be prevented. In addition, since the support substrate 25 is formed of the same glass substrate as the second substrate base material 32 and has the same thermal expansion coefficient, misalignment in the bonding process can be suitably prevented.

  Thus, according to the first embodiment, it is possible to manufacture a thin liquid crystal display device that is difficult to realize with glass or a normal plastic substrate. In addition, since the resin layer can be easily processed into a free shape, a condensing lens, a scattering layer, and the like can be formed on the first substrate 21.

  For example, by forming an uneven surface mold on the surface of the support substrate 25, the uneven surface can be easily formed on the support substrate 25 side of the first substrate 21. Therefore, the condensing lens can be easily formed on the first substrate 21 itself. Moreover, the 1st board | substrate 21 itself can be formed as a scattering layer by mixing a scattering material in transparent organic resin.

  In addition, when a pair of glass substrates is etched and thinned as in the prior art, there is a problem that excessive etching, uneven etching in which dimple holes are formed, and chipping of the glass are likely to occur. However, according to the manufacturing method of the first embodiment, such a problem can be prevented in advance. Further, as compared with the conventional case where the plastic substrate is bonded to a glass substrate or the like, the first embodiment can be made extremely thin and the pattern deviation can be significantly reduced.

  In the first embodiment, the color filter layer 15 is formed on the surface of the transparent resin layer, which is the first substrate 21, but the first substrate 21 itself is dyed by dyeing the transparent resin layer itself. A color filter may be formed. Accordingly, it is not necessary to separately form the color filter layer 15, so that the thickness can be further reduced.

<< Embodiment 2 of the Invention >>
6 and 7 show Embodiment 2 of the present invention.

  FIG. 6 is a cross-sectional view showing the structure of the divided liquid crystal display device according to the second embodiment. FIG. 7 is a cross-sectional view showing the first substrate base material formed on the support substrate in the second embodiment. In the following embodiments, the same portions as those in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the second embodiment, the first barrier film 26 is formed on the first substrate 21 in the first embodiment.

  That is, in the liquid crystal display device 1, the first barrier film 26 having water repellency is formed on the surface of the first substrate 21 opposite to the liquid crystal layer 13. The first barrier film 26 is preferably formed of, for example, a fluorine resin.

  When manufacturing the liquid crystal display device 1 of the second embodiment, first, a first barrier film forming step is performed to form a first barrier film 26 such as a fluororesin on the surface of a large support substrate 25. Thereafter, in the same manner as in the first embodiment, a first substrate forming step is performed, and a transparent organic resin such as a UV photosensitive resin is applied to the surface of the first barrier film 26 to form a resin layer. Form. Subsequent manufacturing steps are the same as those in the first embodiment.

  Therefore, according to the second embodiment, the first barrier film 26 is provided on the outer surface of the first substrate 21 in the liquid crystal display device 1, so that external moisture, ions, and the like are not transmitted through the first substrate 21. be able to. As a result, deterioration of the liquid crystal layer 13 can be prevented, and display quality can be maintained high.

<< Embodiment 3 of the Invention >>
8 and 9 show Embodiment 3 of the present invention.

  FIG. 8 is a cross-sectional view showing the structure of the divided liquid crystal display device according to the third embodiment. FIG. 9 is a cross-sectional view showing the first substrate base material formed on the support substrate in the third embodiment.

  In the third embodiment, the second barrier film 27 is formed on the first substrate 21 in the first embodiment.

That is, in the liquid crystal display device 1, the second barrier film 27 having water repellency is formed on the surface of the first substrate 21 on the liquid crystal layer 13 side. The second barrier film 27 is preferably formed of an inorganic film such as SiO ₂ .

  When manufacturing the liquid crystal display device 1 of the third embodiment, first, as in the first embodiment, a first substrate forming step is performed, and a transparent organic resin such as a UV photosensitive resin is formed on the large support substrate 25. Is applied to form a first substrate base material 31 including the first substrate 21.

Next, a second barrier film forming step is performed to form a second barrier film 27 made of an inorganic film such as SiO ₂ on the surface of the first substrate base material 31 opposite to the support substrate 25. Thereafter, the common electrode, the color filter layer 15 and the light shielding film 16 are formed on the surface of the second barrier film 27 in the same manner as in the first embodiment.

  Thereafter, in the bonding step, the second substrate base material 32 is bonded to the first substrate base material 31 on which the second barrier film 27 is formed. Subsequent manufacturing steps are the same as those in the first embodiment.

  Therefore, according to the third embodiment, the second barrier film 27 is provided on the inner surface of the first substrate 21 in the liquid crystal display device 1 so that external moisture, ions, and the like do not enter the liquid crystal layer 13. Can do. As a result, deterioration of the liquid crystal layer 13 can be prevented, and display quality can be maintained high.

<< Embodiment 4 of the Invention >>
10 and 11 show Embodiment 4 of the present invention.

  FIG. 10 is a cross-sectional view illustrating the structure of the divided liquid crystal display device according to the fourth embodiment. FIG. 11 is a cross-sectional view showing the first substrate base material formed on the support substrate in the fourth embodiment.

  In the fourth embodiment, a plurality of wall members 28 are provided on the first substrate base material 31 in the first embodiment.

  As shown in FIG. 10, the liquid crystal display device 1 is different from the liquid crystal display device 1 according to the first embodiment in that a cutout portion 29 is formed on the outer periphery of the four sides of the first substrate 21 over the entire periphery. Is different.

  When manufacturing the liquid crystal display device 1 of Embodiment 4, first, in the first substrate forming step, the wall member 28 having a height lower than the thickness of the first substrate base material 31 with respect to the surface of the support substrate 25. Is disposed so as to surround each first substrate 21, and the transparent organic resin is applied to the surface of the support substrate 25 so as to cover the wall member 28.

  The wall member 28 is formed of a material that is etched together with the support substrate 25. In the fourth embodiment, since the support substrate 25 is made of a glass substrate and the etching solution is hydrofluoric acid, the wall member 28 can be made of glass, metal, resin, or the like. The wall member 28 has a rectangular cross section perpendicular to its length direction. The wall members 28 may be formed in a rectangular frame shape, and may be formed in a lattice shape as a whole.

  Thus, as shown in FIG. 11, the first substrate base material 31 in which the wall member 28 is embedded is formed on the support substrate 25.

  Thereafter, as in the first embodiment, the common electrode, the color filter layer 15 and the light shielding film 16 are formed on the surface of the first substrate base material 31 as in the first embodiment. Next, as in the first embodiment, a bonding step is performed to bond the second substrate base material 32 to the first substrate base material 31.

  Next, in the removing step, the wall member 28 is removed together with the support substrate 25. That is, the first substrate base material 31 and the second substrate base material 32 bonded together are immersed in an etching solution to remove the entire support substrate 25. At this time, since the wall member 28 is exposed, the wall member 28 is also etched away. Thereby, in the dividing step, each liquid crystal display device is easily formed by dividing the second substrate base material 32.

  Therefore, according to the fourth embodiment, since the first substrate base material 31 can be divided for each first substrate 21 simultaneously with the removal of the support substrate 25, the liquid crystal display device 1 is formed extremely thin. However, the manufacturing cost can be reduced by reducing the man-hours.

<< Embodiment 5 of the Invention >>
12 and 13 show Embodiment 5 of the present invention.

  FIG. 12 is a cross-sectional view showing the structure of the divided liquid crystal display device according to the fifth embodiment. FIG. 13 is a cross-sectional view showing the first substrate base material formed on the support substrate in the fifth embodiment.

  In the fifth embodiment, the planarizing film 30 is provided on the first substrate 21 in the first embodiment.

  That is, the planarizing film 30 that covers the color filter layer 15, the light shielding film 16, and the like is formed on the liquid crystal layer 13 side of the first substrate 21. The planarizing film 30 is made of, for example, a transparent epoxy resin and is formed to have a thickness of about 3 μm. The planarization film 30 is preferably thinner than the first substrate 21 and is formed so as to planarize the surface of the first substrate 21.

  Thus, the TFT substrate 12 is bonded to the planarizing film 30 of the counter substrate 11 via the seal member 14 and the liquid crystal layer 13, thereby forming the liquid crystal display device 1.

  When the liquid crystal display device 1 is manufactured, a planarization film forming step is performed on the first substrate base material 31 on which the color filter layer 15 and the light shielding film 16 are formed through the first substrate forming step in the first embodiment. The flattening film 30 made of an epoxy resin is uniformly applied so as to cover the color filter layer 15 and the like.

  After the planarization film 30 is cured, in a bonding process, the second substrate base material 32 is bonded to the first substrate base material 31 on which the planarization film 30 is formed. Thereafter, similarly to the first embodiment, the removing step and the dividing step are performed. Thereby, the liquid crystal display device 1 is manufactured.

  When the first substrate 21 is extremely thin, there is a possibility that the film thickness of the transparent organic resin applied on the support substrate 25 may vary. According to the fifth embodiment, the planarization film 30 is formed on the first substrate 21. Since the layers are stacked, the surface of the first substrate 21 on the liquid crystal layer 13 side can be planarized. As a result, the display quality can be kept high while the liquid crystal display device 1 is formed extremely thin.

<< Other Embodiments >>
In each of the above embodiments, the example in which the support substrate 25 is configured by a transparent glass substrate has been described. However, the support substrate 25 is not limited to being colorless and transparent, and as illustrated in FIG. 14 that is a cross-sectional view, It may be configured. In this way, since the remaining amount of the support substrate 25 to be etched can be easily visually recognized in the removing step, the entire support substrate 25 can be easily and reliably removed.

  In the fourth embodiment, the example in which the cross section orthogonal to the length direction of the wall member 28 is formed in a rectangular shape has been described. However, for example, as shown in FIG. Alternatively, it may be formed in a pentagonal cross section as shown in FIG. Thus, it is preferable that a portion of the cross section of the wall member 28 opposite to the support substrate 25 has an acute angle shape. Thus, after the wall member 28 is removed by etching, a groove having an acute cross section is formed in the first substrate base material 31, so that the first substrate base material 31 can be easily moved to each first substrate 21. It can be easily divided.

  Further, in each of the above embodiments, the example of the dropping injection method in which the liquid crystal material is dropped and supplied to the first substrate base material 31 or the second substrate base material 32 has been described. A layer may be formed.

  That is, after bonding the first substrate base material 31 and the second substrate base material 32 through a plurality of seal members having notches as injection ports, the first and second substrate base materials 31 and 32 are bonded together. Dividing is performed for each first substrate 21 (for each second substrate 22). Thereafter, a liquid crystal material may be injected between the paired first substrate 21 and second substrate 22 to form the liquid crystal layer 13.

  In each of the above embodiments, the liquid crystal display device has been described as an example. However, the display device manufacturing method according to the present invention is similarly applied to a display device having a pair of substrates facing each other with a display medium layer interposed therebetween. For example, it is also suitable for an EL display device in which the display medium layer is a light emitting layer.

  As described above, the present invention is useful for a method for manufacturing a thin display device.

FIG. 1 is a cross-sectional view showing a first substrate base material formed on a support substrate. FIG. 2 is a cross-sectional view showing the second substrate base material bonded to the first substrate base material on the support substrate. FIG. 3 is a cross-sectional view showing the first substrate base material and the second substrate base material from which the support substrate has been removed by etching. FIG. 4 is a cross-sectional view showing the structure of the divided liquid crystal display device. FIG. 5 is a cross-sectional view showing the structure of the liquid crystal display device. FIG. 6 is a cross-sectional view showing the structure of the divided liquid crystal display device according to the second embodiment. FIG. 7 is a cross-sectional view showing the first substrate base material formed on the support substrate in the second embodiment. FIG. 8 is a cross-sectional view showing the structure of the divided liquid crystal display device according to the third embodiment. FIG. 9 is a cross-sectional view showing the first substrate base material formed on the support substrate in the third embodiment. FIG. 10 is a cross-sectional view illustrating the structure of the divided liquid crystal display device according to the fourth embodiment. FIG. 11 is a cross-sectional view showing the first substrate base material formed on the support substrate in the fourth embodiment. FIG. 12 is a cross-sectional view showing the structure of the divided liquid crystal display device according to the fifth embodiment. FIG. 13 is a cross-sectional view showing the first substrate base material formed on the support substrate in the fifth embodiment. FIG. 14 is a cross-sectional view illustrating a first substrate base material on a colored support substrate according to another embodiment. FIG. 15 is a cross-sectional view showing a first substrate base material on a support substrate in another embodiment. FIG. 16 is a cross-sectional view showing a first substrate base material on a support substrate in another embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 11 Opposite substrate 12 TFT substrate 13 Liquid crystal layer 14 Sealing member 15 Color filter layer 16 Light shielding film 21 First substrate 22 Second substrate 25 Support substrate 26 First barrier film 27 Second barrier film 28 Wall member 30 Flattening Film 31 First substrate base material 32 Second substrate base material

Claims (12)

A method of manufacturing a display device in which a first substrate and a second substrate are arranged to face each other via a display medium layer,
A first substrate forming step of forming the first substrate comprising the resin layer by applying and curing a resin on the support substrate;
A bonding step of bonding the second substrate so as to face the first substrate formed on the support substrate;
And a removing step of removing the support substrate from the first substrate bonded to the second substrate. In the manufacturing method of the display device according to claim 1,
In the removing step, the second substrate is thinned simultaneously with the removal of the support substrate by etching. In the manufacturing method of the display device according to claim 1,
The method for manufacturing a display device, wherein the support substrate is a glass substrate. In the manufacturing method of the display device according to claim 1,
The method for manufacturing a display device, wherein the resin is a UV photosensitive resin. In the manufacturing method of the display device according to claim 1,
The method for manufacturing a display device, wherein the second substrate is a glass substrate. In the manufacturing method of the display device according to claim 1,
A first barrier film forming step of forming a first barrier film having water repellency on the surface of the support substrate;
In the first substrate forming step, the resin layer is formed on the surface of the first barrier film. In the manufacturing method of the display device according to claim 1,
A second barrier film forming step of forming a second barrier film having water repellency on the surface of the first substrate;
In the bonding step, the second substrate is bonded to the first substrate on which the second barrier film is formed. In the manufacturing method of the display device according to claim 1,
A planarization film forming step of forming a planarization film on the first substrate on the support substrate;
In the bonding step, the second substrate is bonded to the first substrate on which the planarizing film is formed. In the manufacturing method of the display device according to claim 1,
The method for manufacturing a display device, wherein the support substrate is colored. In the manufacturing method of the display device according to claim 1,
In the first substrate forming step, a first substrate base material including a plurality of the first substrates is formed on the support substrate,
In the bonding step, a second substrate base material including a plurality of the second substrates is bonded to the first substrate base material,
In the removing step, the support substrate is removed from the first substrate base material bonded to the second substrate base material,
A method for manufacturing a display device, comprising: a dividing step of dividing the first substrate base material and the second substrate base material bonded together to form a plurality of display devices. In the manufacturing method of the display device according to claim 10,
In the first substrate forming step, a wall member having a height lower than the thickness of the first substrate is disposed on the surface of the support substrate so as to surround each first substrate, and then the wall member is covered. And applying the resin to the surface of the support substrate,
In the removing step, the wall member is removed together with the support substrate. In the manufacturing method of the display device according to claim 1,
The method for manufacturing a display device, wherein the display medium layer is a liquid crystal layer.

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