JP2008046446A - Electro-optical device, electronic apparatus and method for electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device that can reliably prevent a device substrate from being cracked at a portion overlapping a corner of a counter substrate, and to provide an electronic apparatus and a method for manufacturing the electro-optical device. <P>SOLUTION: In a liquid crystal device 1, a device substrate 10 of a liquid crystal device 1 has an overhang region 15 overhanging from a substrate edge 201 of a counter substrate 20, therefore, three substrate edges 202, 203, 204 of the counter substrate 20 overlap with the substrate edges 102, 103, 104 of the device substrate 10, while the substrate edge 201 overlaps with the substrate surface of the device substrate 10. The counter substrate 20 has a C-chamfered shape at a corner portion to be formed when the substrate edge 201 is extended orthogonal to the substrate edges 202, 203 and both ends of the substrate edge 201 are served as chamfered portions 210. Therefore, the substrate edge 201 and the substrate edges 202, 203 form intersections 50 crossing at an angle of 135°. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electro-optical device in which two substrates are bonded, an electronic apparatus, and a method for manufacturing the electro-optical device.

  Among various electro-optical devices, for example, an active matrix liquid crystal device includes an element substrate 10 on which pixel switching elements and pixel electrodes are formed, and a counter substrate 20 on which counter electrodes are formed, as shown in FIG. Has a structure of bonding. In addition, the element substrate 10 includes an overhang area 15 that protrudes from the counter substrate 20. The overhang area 15 includes an IC mounting area 1 s where a driving IC is mounted and a substrate mounting area 1 t where a flexible substrate is connected. Is formed.

  With respect to such a liquid crystal device, it is an object to reduce the thickness of the liquid crystal device by thinning the element substrate 10 and the counter substrate 20. However, if a thin substrate is used from the beginning, the substrate may be broken when a pixel transistor, a pixel electrode, a counter electrode, or the like is formed using a semiconductor process.

Therefore, a technique has been proposed in which after the element substrate 10 and the counter substrate 20 are bonded together, the outer surface is mechanically polished to form a thin plate. Further, when the element substrate 10 and the counter substrate 20 are mechanically polished, the corner 160 of the overhanging region 15 of the element substrate 10 is lifted, and the amount of polishing varies, so that C corner 110 is applied to the corner 160. Has been proposed. Here, unlike the corner 160 of the overhanging region 15, the four corners of the counter substrate 20 are not lifted, and therefore do not need to be chamfered and remain at 90 ° (see, for example, Patent Document 1). ).
JP 2004-101741 A

  The C chamfer 110 as shown in FIG. 11 is effective not only in suppressing variation in the polishing amount, but also in preventing the corner portion 160 of the element substrate 10 from cracking.

  However, the crack of the element substrate 10 is not limited to the corner portion 160 but also occurs in the element substrate 10 in the portion 150 that overlaps the corner portion 240 of the counter substrate 20 at the end of the overhang region 15. Even if the corner portion 160 of the substrate 10 is chamfered, it cannot be prevented.

  Here, the inventor of the present application pursued the cause of the occurrence of cracking in the portion 150 overlapping the corner portion 240 of the counter substrate 20 in the element substrate 10, and as a result, when mounting the driving IC or the flexible substrate, Is applied, the force to bend the overhanging region 15 around the portion 150 that overlaps the corner portion 240 of the counter substrate 20 is concentrated and a crack occurs in the portion 150 that overlaps the corner portion 240 of the counter substrate 20. I got the knowledge.

  An object of the present invention is to provide an electro-optical device, an electronic apparatus, and a method of manufacturing an electro-optical device capable of reliably preventing a crack from occurring in a portion of an element substrate that overlaps a corner portion of a counter substrate. It is to provide.

  In order to solve the above-described problems, in the present invention, a first substrate and a second substrate are bonded together, and a flexible substrate is provided on the first substrate in an overhang region that projects from the second substrate. In the electro-optical device on which at least one of the IC is mounted, the second substrate includes a first substrate edge that overlaps a substrate surface of the first substrate on a side where the projecting region is located, and the first substrate A second substrate edge overlapping the substrate edge of the substrate, and an intersection point where the first substrate edge and the second substrate edge intersect, wherein the first substrate edge and the second substrate edge The substrate edge intersects with an angle larger than 90 °. In the present invention, “the first substrate edge and the second substrate edge intersect at an angle larger than 90 °” is an intersection when the end portion of the first substrate edge is curved. This means that the angle formed between the tangent to the first substrate edge and the second substrate edge is greater than 90 °.

  In the present invention, when a driving IC or a flexible substrate is mounted on the overhanging region of the first substrate, if a load is applied to the overhanging region, the first substrate edge of the second substrate and the second substrate in the first substrate. The force to bend the overhanging area is concentrated on the portion that overlaps the intersection with the substrate edge, but at the intersection, the first substrate edge and the second substrate edge intersect at an angle greater than 90 °, The second substrate is not sharp. Therefore, compared with the case where the first substrate edge and the second substrate edge intersect at a small angle of 90 ° or less at the intersection, the force is distributed and applied to the first substrate. In the substrate, no crack is generated at the portion of the second substrate that overlaps the intersection of the first substrate edge and the second substrate edge.

  In the present invention, the first substrate edge includes a linear portion extending linearly at the center in the length direction, and the first substrate edge intersects the second substrate edge to form the intersection point. It is preferable that the end portion to be connected to the straight line portion is connected via an exit angle portion having a larger angle than 90 ° or a curved portion. If comprised in this way, since an excessive force will not be applied to a 1st board | substrate also with respect to a board | substrate surface, it can prevent more reliably that a crack generate | occur | produces in a 1st board | substrate.

  In the present invention, the second substrate is configured such that the first substrate edge and the second substrate edge intersect each other at an angle larger than 90 °. A configuration in which a corner portion formed when extending so as to be orthogonal to the edge can be adopted. Further, as the configuration in which the first substrate edge and the second substrate edge intersect at an angle larger than 90 °, the second substrate has the first substrate edge as the second substrate edge. On the other hand, it is possible to adopt a configuration in which corner portions formed when extending so as to be orthogonal to each other are C-chamfered or R-chamfered.

  The present invention is effectively applied when the thickness of the first substrate and the second substrate is 0.5 mm or less, and further 0.25 mm or less.

  In the present invention, a bonding step of bonding the first substrate and the second substrate, and an overhanging region protruding from the second substrate with respect to the first substrate by cutting the second substrate. In the method of manufacturing an electro-optical device, which includes a substrate cutting step to be formed and a mounting step in which at least one of a flexible substrate and an IC is mounted on the overhanging region, in the substrate cutting step, the second substrate is moved to the overhanging region. On the side where the first substrate is located, the first substrate edge overlapping the substrate surface of the first substrate, the second substrate edge overlapping the substrate edge of the first substrate, the first substrate edge and the second substrate edge Characterized in that the second substrate is cut so that the first substrate edge and the second substrate edge intersect at an angle greater than 90 ° at the intersection point. To do. If comprised in this way, since the shape of the intersection of a 1st board | substrate edge and a 2nd board | substrate edge is adjusted at a board | substrate cutting process, it is not necessary to perform a chamfering process etc. to a 2nd board | substrate at another process.

In the present invention, in the substrate cutting step, the first substrate edge includes a linear portion extending linearly on the center side in the length direction, and the second substrate is provided at the first substrate edge. It is preferable that the second substrate is cut into a shape in which an end portion that intersects an edge and constitutes the intersection point and the linear portion are connected via an outgoing angle portion or a curved portion having an angle larger than 90 °.

  In the present invention, after the bonding step and before the substrate cutting step, the first substrate and the second substrate are etched or polished on the outer surfaces of the first substrate and the second substrate. Is preferably made thin.

  The electro-optical device to which the present invention is applied is used in an electronic apparatus such as a mobile computer or a mobile phone.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings used for the following description, the scales are different for each layer and each member in order to make each layer and each member large enough to be recognized on the drawing. Moreover, in the following description, the same code | symbol is attached | subjected to the part which has a function common to the part shown in FIG.

[Embodiment 1]
(Overall configuration of liquid crystal device)
1A and 1B are plan views of the liquid crystal device (electro-optical device) according to Embodiment 1 of the present invention, as viewed from the counter substrate side, together with the components formed thereon, and It is the HH 'sectional view. FIG. 2 is an explanatory diagram schematically showing a state in which the liquid crystal device shown in FIG. 1 is viewed from an oblique direction.

  1A, 1B, and 2, the liquid crystal device 1 according to the present embodiment is a transmissive active type in a TN (Twisted Nematic) mode, an ECB (Electrically Controlled Birefringence) mode, or a VAN (Vertical Aligned Nematic) mode. It is a matrix type liquid crystal device. In this liquid crystal device 1, a rectangular element substrate 10 (first substrate) and a rectangular counter substrate 20 (second substrate) are bonded together via a sealing material 22, and the liquid crystal 1 f is held therebetween. The base material of the element substrate 10 is a glass substrate 11 having a thickness of 0.5 mm or less, further thinned to 0.25 mm or less, and the base material of the counter substrate 20 is also 0.5 mm or less in thickness. Is a glass substrate 21 thinned to 0.25 mm or less.

  The sealing material 22 is an adhesive made of a photo-curing resin or a thermosetting resin for bonding the element substrate 10 and the counter substrate 20 around them, and is used for setting the distance between the substrates to a predetermined value. Gap materials such as glass fiber or glass beads are blended. A liquid crystal injection port 25 is formed in the sealing material 22 by the discontinuous portion, and after the liquid crystal 1f is injected, the sealing material 250 is sealed.

In the element substrate 10, the pixel transistors 1 c and the pixel electrodes 2 a are formed in a matrix shape in a region surrounded by the sealing material 22, and an alignment film 19 is formed on the surface thereof. On the counter substrate 20, a frame 26 (not shown in FIG. 1B) made of a light-shielding material is formed in an inner region of the sealing material 22, and an inner side thereof is an image display region 1 a (pixel region). . Although not shown, a light shielding film called a black matrix or black stripe is formed on the counter substrate 20 in a region facing the vertical and horizontal boundary regions of each pixel. An alignment film 29 is formed. In the counter substrate 20, an RGB color filter (not shown) is formed with a protective film in a region facing each pixel of the element substrate 10, so that the liquid crystal device 1 can be connected to a mobile computer, a mobile phone, It can be used as a color display device for electronic equipment such as a liquid crystal television. In addition,
As schematically shown in FIG. 1A, the element substrate 10 and the counter substrate 20 are formed on the element substrate 10 by the conductive material 23 for inter-substrate conduction blended in the sealing material 22. The common wiring and the counter electrode 28 of the counter substrate 20 are electrically connected.

(Structure of overhang area)
The element substrate 10 is larger than the counter substrate 20, and an end portion of the element substrate 10 on the substrate edge 101 side is provided with a protruding region 15 that protrudes from the substrate edge 201 of the counter substrate 20 outside the sealing material 22. An IC mounting region 1 s is formed in the overhanging region 15, and a driving IC 60 including a gate line driving circuit 66 and a source line driving circuit 67 is mounted in the IC mounting region 1 s by COG (Chip On Glass). ing. Further, a substrate connection region 1t is formed in the projecting region 15 of the element substrate 10 on the outer peripheral side of the IC mounting region 1s, and a flexible wiring substrate 70 is connected to the substrate connection region 1t. Accordingly, in the element substrate 10, the wiring lines 1x and 1y extend from the image display region 1a to the IC mounting region 1s through the outer region 1b of the image display region 1a, and the IC mounting region 1s and the substrate connection are connected. A wiring (not shown) is formed between the region 1t and the region 1t.

(About the shape of the counter substrate)
Since the element substrate 10 includes the protruding region 15 that protrudes from the substrate edge 201 (first substrate edge) of the counter substrate 20, three of the four substrate edges 201, 202, 203, and 204 of the counter substrate 20 are provided. The substrate edges 202, 203, and 204 (second substrate edges) overlap with the substrate edges 102, 103, and 104 of the element substrate 10, while the substrate edge 201 (the first substrate edge 201 positioned on the overhanging region 15 side in the counter substrate 20). (The substrate edge) overlaps the substrate surface of the element substrate 10. In the counter substrate 20, the substrate edge 201 and the substrate edges 202 and 203 intersect on the substrate edges 102 and 103 of the element substrate 10 (on the outline of the liquid crystal device 1) to form an intersection 50.

  In this embodiment, the substrate edge 201 and the substrate edges 202 and 203 intersect with the substrate edges 102 and 103 of the element substrate 10 (on the outline of the liquid crystal device 1) at an angle θ larger than 90 ° to form an intersection 50. is doing. That is, the counter substrate 20 has a shape in which corner portions formed when the substrate edge 201 is extended so as to be orthogonal to the substrate edges 202 and 203 are removed by C chamfering. Is a chamfered portion 210. Therefore, the substrate edge 201 and the substrate edges 202 and 203 intersect at an angle of about 135 ° to form an intersection point 50. In addition, the substrate edge 201 includes a straight portion linearly extending on the center side in the length direction, and this straight portion intersects the substrate edges 202 and 203 with respect to an end portion constituting the intersection 50. It is connected through a larger angle angle part.

(Manufacturing method of the liquid crystal device 1)
FIG. 3 is an explanatory view showing a method of manufacturing a liquid crystal device from a large substrate. FIG. 4 is an explanatory diagram showing a method of mounting a driving IC on the element substrate of the liquid crystal device.

  In the liquid crystal device 1 of this embodiment, both the element substrate 10 and the counter substrate 20 have a substrate thickness of 0.5 mm or less, and further 0.25 mm or less. However, if a thin substrate is used from the beginning, the substrate may be broken if the pixel transistor 1c, the pixel electrode 2a, the counter electrode 28, and the like are formed using a semiconductor process. Further, if each of the element substrate 10 and the counter substrate 20 is manufactured one by one, the productivity is low.

  Therefore, in this embodiment, as shown in FIG. 3A, a thick first large substrate 100 that can take a large number of single-sized element substrates 10 and a thick second large size that can take a large number of single-sized counter substrates 20. A substrate 200 is prepared, and a component such as a pixel switching element, a pixel electrode, and a counter electrode is formed on the large substrates 100 and 200 by using a semiconductor process or the like for a plurality of substrates. .

  Next, in the bonding step, the sealing material 22 (FIG. 1A) is applied to each of the regions cut out as the element substrate 10 or the counter substrate 20 with respect to the first large substrate 100 or the second large substrate 200. , (B)) is applied or printed, and then, as shown in FIG. 3B, the large substrates 100 and 200 are bonded to each other with the sealing material 22 to form a large panel structure 300.

  Next, in the thinning process, the panel structure is immersed in an etching solution containing hydrofluoric acid in a state where the gap between the large substrates 100 and 200 opened at the outer peripheral edge of the panel structure 300 is covered with a coating material such as epoxy resin or pitch paint. The body 300 is immersed, and as shown in FIG. 3C, the outer surface of the panel structure 300 (the outer surface of the large substrates 100 and 200) is etched to make the large substrates 100 and 200 0.5 mm or less, Thin plate to 0.25 mm or less. Next, the panel structure 300 is cleaned. The epoxy resin or pitch paint used as the coating material may be removed with a solvent or the like, but the portion to which the coating material is attached may be removed by a cutting process described below. In addition to wet etching, dry etching may be employed for etching the substrate. Further, the large substrates 100 and 200 may be polished and thinned.

  Next, a substrate cutting process is performed. In this substrate cutting step, first, the panel structure 300 (the first large substrate 100 and the second large substrate 200) is cut along the planned cutting lines 301 and 302 to obtain a strip-shaped panel structure. Here, the substrate edges 101 and 104 of the element substrate 10 are formed by cutting the large substrate 100 along the planned cutting line 301, and the substrate edge 204 of the counter substrate 20 is formed by cutting along the planned cutting line 302. In this state, the discontinuous portion of the sealing material 22 shown in FIG. 1 is opened as the liquid crystal injection port 25 at the outer peripheral edge of the strip-shaped panel structure. The inlet 25 is sealed with a sealing material 250.

  Next, a single-size panel structure is obtained along the planned cutting lines 303 and 304. Here, the substrate edges 102 and 103 of the element substrate 10 are formed by cutting the large substrate 100 along the planned cutting line 303, and the substrate edges 202 and 203 of the counter substrate 20 are formed by cutting along the planned cutting line 304. The

  Next, the counter substrate 20 is cut along the planned cutting line 305 to remove the portion of the counter substrate 20 that covers the projecting region 15 of the element substrate 10, and the IC mounting region 1 s formed in the projecting region 15. And the upper part of the board connection region 1t is opened.

  Here, the substrate edge 201 of the counter substrate 20 is formed by cutting the counter substrate 20 along the planned cutting line 305. Further, in this embodiment, the planned cutting line 305 is a hatched portion 306 at a portion where the planned cutting line 304 intersects as shown in an enlarged view in FIG. Accordingly, the counter substrate 20 is cut into a shape in which corner portions formed when the substrate edge 201 is extended so as to be orthogonal to the substrate edges 202 and 203 are removed by chamfering, and are formed at both ends of the substrate edge 201. A chamfered portion 210 is formed. For this reason, the substrate edge 201 and the substrate edges 202 and 203 intersect at an angle of 135 ° to form the intersection point 50. In addition, the substrate edge 201 includes a straight portion linearly extending on the center side in the length direction, and this straight portion intersects the substrate edges 202 and 203 with respect to an end portion constituting the intersection 50. It is connected through a larger angle angle part.

Next, in the mounting process, as schematically shown in FIG. 4, after applying or covering an anisotropic conductive material to the IC mounting region 1 s of the element substrate 10 placed on the stage 510, the driving IC 60. After that, while driving the anisotropic conductive material, the driving I is driven by the head 520.
Press C60. As a result, the pads of the element substrate 10 and the bumps of the driving IC 60 are connected by the conductive particles contained in the anisotropic conductive material. After or before such an IC mounting process, the flexible substrate 70 is connected to the substrate connection region 1t using an anisotropic conductive material or the like.

(Main effects of this form)
As described above, in the liquid crystal device 1 of this embodiment, in the counter substrate 20, the substrate edge 201 and the substrate edges 202 and 203 intersect at an intersection 50 at an angle larger than 90 °, and in this embodiment, an angle of 135 °. Yes. For this reason, when the driving IC 60 and the flexible substrate 70 are mounted on the overhanging region 15 of the element substrate 10, if a load is applied to the overhanging region 15, the substrate edge 201 and the substrate edges 202 and 203 of the counter substrate 20 in the element substrate 10. The force to bend the overhanging region 15 is concentrated on the portion 150 that overlaps the intersection 50 with the substrate 50, but at the intersection 50, the substrate edge 201 and the substrate edges 202 and 203 intersect at an angle θ greater than 90 ° The counter substrate 20 is not sharp. For this reason, compared with the case where the substrate edge 201 and the substrate edges 202 and 203 intersect at a small angle of 90 ° or less at the intersection 50, force is applied to the element substrate 10 in a distributed manner. Therefore, even when the element substrate 10 and the counter substrate 20 are thinned to 0.5 mm or less, and further to 0.25 mm or less, the intersection 50 between the substrate edge 201 of the counter substrate 20 and the substrate edges 202 and 203 in the element substrate 10. Cracks do not occur in the overlapping portion 150.

  In addition, the substrate edge 201 includes a straight portion linearly extending on the center side in the length direction, and this straight portion intersects the substrate edges 202 and 203 with respect to an end portion constituting the intersection 50. It is connected through a larger angle angle part. For this reason, since no excessive force is applied to the element substrate 10 even on the substrate surface, the element substrate 10 is not cracked.

  In addition, since the shape of the intersection 50 between the substrate edge 201 of the counter substrate 20 and the substrate edges 202 and 203 is adjusted in the substrate cutting process, it is not necessary to chamfer the second substrate in a separate process.

[Embodiment 2]
FIG. 5 is an explanatory view schematically showing a state in which the liquid crystal device according to Embodiment 2 of the present invention is viewed from the counter substrate side. Since the basic configuration of the present embodiment and the embodiment described later is the same as that of the first embodiment, common portions are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 5, also in the liquid crystal device 1 of the present embodiment, the element substrate 10 includes the protruding region 15 protruding from the substrate edge 201 (first substrate edge) of the counter substrate 20. Of the two substrate edges, three substrate edges 202, 203, and 204 (second substrate edges) overlap the substrate edges 102, 103, and 104 of the element substrate 10, while the counter substrate 20 faces the overhanging region 15. The positioned substrate edge 201 (first substrate edge) overlaps the substrate surface of the element substrate 10.

  Also in this embodiment, as in the first embodiment, the substrate edge 201 and the substrate edges 202 and 203 are at an angle θ larger than 90 ° at a position overlapping the substrate edges 102 and 103 of the element substrate 10 (on the outline of the liquid crystal device 1). To form an intersection 50. That is, the counter substrate 20 has a shape in which corner portions formed when the substrate edge 201 is extended so as to be orthogonal to the substrate edges 202 and 203 are linearly removed in a shape other than C chamfering. Both end portions of the substrate edge 201 are chamfered portions 210. For this reason, the substrate edge 201 and the substrate edges 202 and 203 intersect at an angle of about 100 ° to form an intersection point 50.

Even in such a configuration, when the driving IC 60 and the flexible substrate 70 are mounted on the overhanging region 15 of the element substrate 10 as in the first embodiment, if a load is applied to the overhanging region 15, The force to bend the overhang region 15 is concentrated and applied to the portion 150 overlapping the intersection 50 between the substrate edge 201 and the substrate edges 202 and 203 of the substrate 20, but the opposite substrate 20 is not sharp at the intersection 50. A force is distributed and applied to the element substrate 10. Therefore, even when the element substrate 10 and the counter substrate 20 are thinned, the portion 150 of the element substrate 10 that overlaps the intersection 50 between the substrate edge 201 and the substrate edges 202 and 203 of the counter substrate 20 does not crack.

  In addition, the substrate edge 201 includes a straight portion linearly extending on the center side in the length direction, and this straight portion intersects the substrate edges 202 and 203 with respect to an end portion constituting the intersection 50. It is connected through a larger angle angle part. For this reason, since no excessive force is applied to the element substrate 10 even on the substrate surface, the element substrate 10 is not cracked.

[Embodiment 3]
FIG. 6 is an explanatory view schematically showing a state in which the liquid crystal device according to Embodiment 3 of the present invention is viewed from the counter substrate side.

  As shown in FIG. 6, even in the liquid crystal device 1 of this embodiment, the element substrate 10 includes the protruding region 15 protruding from the substrate edge 201 (first substrate edge) of the counter substrate 20. Of the two substrate edges, three substrate edges 202, 203, and 204 (second substrate edges) overlap the substrate edges 102, 103, and 104 of the element substrate 10, while the counter substrate 20 faces the overhanging region 15. The positioned substrate edge 201 (first substrate edge) overlaps the substrate surface of the element substrate 10.

  Also in this embodiment, as in the first embodiment, the substrate edge 201 and the substrate edges 202 and 203 are at an angle θ larger than 90 ° at a position overlapping the substrate edges 102 and 103 of the element substrate 10 (on the outline of the liquid crystal device 1). To form an intersection 50. That is, the counter substrate 20 has a shape in which corner portions formed when the substrate edge 201 is extended so as to be orthogonal to the substrate edges 202 and 203 are removed by chamfering with a plurality of linear portions 211. For this reason, the substrate edge 201 and the substrate edges 202 and 203 intersect at an angle of about 150 ° to form an intersection point 50.

  Even in such a configuration, when the driving IC 60 and the flexible substrate 70 are mounted on the overhanging region 15 of the element substrate 10 as in the first embodiment, if a load is applied to the overhanging region 15, The force to bend the overhang region 15 is concentrated and applied to the portion 150 that overlaps the intersection 50 between the substrate edge 201 and the substrate edges 202 and 203 of the substrate 20, but the opposite substrate 20 is not sharp at the intersection 50. A force is distributed and applied to the element substrate 10. Therefore, even when the element substrate 10 and the counter substrate 20 are thinned, the portion 150 of the element substrate 10 that overlaps the intersection 50 between the substrate edge 201 and the substrate edges 202 and 203 of the counter substrate 20 does not crack.

  In this embodiment, the substrate edge 201 and the substrate edges 202 and 203 intersect at a larger angle (about 150 °) than in the first embodiment, so that the counter substrate 20 is not sharp at that intersection 50. Therefore, there is an advantage that force is distributed and applied to the element substrate 10.

  Further, the substrate edge 201 includes a straight portion linearly extending on the center side in the length direction, and this straight portion intersects the substrate edges 202 and 203 with respect to the end portion constituting the intersection 50 by 90 °. It is connected through three larger angled corners. For this reason, since no excessive force is applied to the element substrate 10 even on the substrate surface, the element substrate 10 is not cracked.

[Embodiment 4]
FIG. 7 is an explanatory view schematically showing a state in which the liquid crystal device according to Embodiment 4 of the present invention is viewed from the counter substrate side.

  As shown in FIG. 7, also in the liquid crystal device 1 of the present embodiment, the element substrate 10 includes the protruding region 15 protruding from the substrate edge 201 (first substrate edge) of the counter substrate 20. Of the two substrate edges, three substrate edges 202, 203, and 204 (second substrate edges) overlap the substrate edges 102, 103, and 104 of the element substrate 10, while the counter substrate 20 faces the overhanging region 15. The positioned substrate edge 201 (first substrate edge) overlaps the substrate surface of the element substrate 10.

  Also in this embodiment, as in the first embodiment, the substrate edge 201 and the substrate edges 202 and 203 are at an angle θ larger than 90 ° at a position overlapping the substrate edges 102 and 103 of the element substrate 10 (on the outline of the liquid crystal device 1). To form an intersection 50. That is, the counter substrate 20 has a shape in which corner portions formed when the substrate edge 201 is extended so as to be orthogonal to the substrate edges 202 and 203 are removed by R chamfering. Is a chamfered portion 212. For this reason, the substrate edge 201 and the substrate edges 202 and 203 intersect at an angle of about 160 ° to form an intersection point 50. In this embodiment, since the R chamfering is adopted, both end portions of the substrate edge 201 are curved, but the tangent line and the substrate edges 202 and 203 intersect at an angle of about 160 °.

  Even in such a configuration, when the driving IC 60 and the flexible substrate 70 are mounted on the overhanging region 15 of the element substrate 10 as in the first embodiment, if a load is applied to the overhanging region 15, The force to bend the overhanging region 15 is concentrated on the portion 150 where the substrate edge 201 of the substrate 20 and the substrate edges 202 and 203 overlap with each other, but the counter substrate 20 is not sharp at the intersection 50. The force is distributed and applied to the element substrate 10. Therefore, even when the element substrate 10 and the counter substrate 20 are thinned, the portion 150 of the element substrate 10 that overlaps the intersection 50 between the substrate edge 201 and the substrate edges 202 and 203 of the counter substrate 20 does not crack.

  Further, in this embodiment, since the R chamfering is used, the counter substrate 20 does not have a corner at the intersection point 50, so that there is an advantage that force is applied to the element substrate 10 in a distributed manner as compared with the first to third embodiments. .

  Further, the substrate edge 201 includes a straight portion that linearly extends on the center side in the length direction, and this straight portion intersects with the substrate edges 202 and 203 and has an arc shape with respect to an end portion that forms the intersection 50. It is connected through the curved part. For this reason, since no excessive force is applied to the element substrate 10 even on the substrate surface, the element substrate 10 is not cracked.

[Embodiment 5]
FIG. 8 is an explanatory view schematically showing a state in which the liquid crystal device according to Embodiment 5 of the present invention is viewed from the counter substrate side.

  In the fourth embodiment, the counter substrate 20 is a corner portion formed when the substrate edge 201 (first substrate edge) is extended to be orthogonal to the substrate edges 202 and 203 (second substrate edge). The both ends of the substrate edge 201 are chamfered portions 210 bulging outward, but as shown in FIG. 8, the both ends of the substrate edge 201 are turned inward. A concave arcuate recess 213 may be used. Even in such a configuration, the substrate edge 201 and the substrate edges 202 and 203 intersect with each other at an angle θ larger than 90 ° at a position overlapping the substrate edges 102 and 103 of the element substrate 10 (on the outline of the liquid crystal device 1). An intersection point 50 is formed.

  Therefore, when the driving IC 60 and the flexible substrate 70 are mounted on the overhanging region 15 of the element substrate 10, if a load is applied to the overhanging region 15, the substrate edge 201 of the counter substrate 20 and the substrate edges 202 and 203 in the element substrate 10. The force to bend the overhanging region 15 is concentrated and applied to the portion 150 overlapping the intersection point 50 of the contact point 50. However, since the counter substrate 20 is not sharp at the intersection point 50, the force is applied to the element substrate 10 in a distributed manner. Become. Therefore, even when the element substrate 10 and the counter substrate 20 are thinned, the portion 150 of the element substrate 10 that overlaps the intersection 50 between the substrate edge 201 and the substrate edges 202 and 203 of the counter substrate 20 does not crack.

  In addition, the substrate edge 201 includes a straight portion linearly extending on the center side in the length direction, and this straight portion intersects the substrate edges 202 and 203 with respect to an end portion constituting the intersection 50. It is connected through a larger angle angle part. For this reason, since no excessive force is applied to the element substrate 10 even on the substrate surface, the element substrate 10 is not cracked.

[Embodiment 6]
FIG. 9 is an explanatory view schematically showing a state in which the liquid crystal device according to Embodiment 5 of the present invention is viewed from the counter substrate side.

  As shown in FIG. 9, also in this embodiment, the element substrate 10 includes an overhang region 15 that overhangs from the substrate edge 201 (first substrate edge) of the counter substrate 20. However, in this embodiment, the substrate edge 201 of the counter substrate 20 is curved in a U shape, and the counter substrate 20 has substrate edges 205 and 206 (second substrate edges) overlapping the substrate edge 101 of the element substrate 10. I have.

  Here, the substrate edge 201 and the substrate edges 205 and 206 intersect with the substrate edge 101 of the element substrate 10 (on the outline of the liquid crystal device 1) at an angle θ larger than 90 ° to form an intersection 50. Yes. That is, both end portions of the substrate edge 201 extend obliquely toward the substrate edges 205 and 206. Therefore, when the driving IC 60 and the flexible substrate 70 are mounted on the overhanging region 15 of the element substrate 10, if a load is applied to the overhanging region 15, the substrate edge 201 of the counter substrate 20 and the substrate edges 202 and 203 in the element substrate 10. Although the force to bend the overhanging region 15 is concentrated and applied to the portion 150 that overlaps the intersection point 50, since the counter substrate 20 is not sharp at the intersection point 50, the force is applied to the element substrate 10 in a distributed manner. Become. Therefore, even when the element substrate 10 and the counter substrate 20 are thinned, the portion 150 of the element substrate 10 that overlaps the intersection 50 between the substrate edge 201 and the substrate edges 202 and 203 of the counter substrate 20 does not crack. In addition, the substrate edge 201 includes a straight portion linearly extending on the center side in the length direction, and this straight portion intersects the substrate edges 205 and 206 and has an arc shape with respect to the end portion constituting the intersection 50. It is connected through the curved part. For this reason, since no excessive force is applied to the element substrate 10 even on the substrate surface, the element substrate 10 is not cracked.

[Other embodiments]
In the above embodiment, the TN mode, ECB mode, and VAN mode active matrix liquid crystal devices have been described as examples. However, the present invention is applied to an IPS (In-Plane Switching) mode liquid crystal device (electro-optical device). May be.

  Further, the electro-optical device is not limited to a liquid crystal device, and for example, in an organic EL (electroluminescence) device, a pixel transistor is formed in each pixel on an element substrate that holds an organic EL film as an electro-optical material, and an IC Since a mounting region is formed, the present invention may be applied to such an organic EL device and further to other electro-optical devices.

[Embodiment of Electronic Device]
FIG. 10 shows an embodiment in which the liquid crystal device according to the present invention is used as a display device of various electronic devices. The electronic device shown here is a personal computer, a mobile phone, or the like, and includes a display information output source 170, a display information processing circuit 171, a power supply circuit 172, a timing generator 173, and the liquid crystal device 1. Further, the liquid crystal device 1 includes a panel 175 and a drive circuit 176, and the above-described liquid crystal device 1 can be used. The display information output source 170 includes a ROM (Read Only Memory) and a RAM (Random).
A memory unit such as an access memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and a display such as an image signal of a predetermined format based on various clock signals generated by the timing generator 173 Information is supplied to the display information processing circuit 171. The display information processing circuit 171 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, and the like, executes processing of input display information, and outputs the image. The signal is supplied to the drive circuit 176 together with the clock signal CLK. The power supply circuit 172 supplies a predetermined voltage to each component.

(A), (b) is the top view which looked at the liquid crystal device (electro-optical device) based on Embodiment 1 of this invention from the opposing substrate side with each component formed on it, respectively, and its H It is -H 'sectional drawing. It is explanatory drawing which shows typically a mode that the liquid crystal device shown in FIG. 1 was seen from diagonally. It is explanatory drawing which shows the method of manufacturing a liquid crystal device from a large sized substrate. It is explanatory drawing which shows the method of mounting drive IC in the element substrate of a liquid crystal device. It is explanatory drawing which shows typically a mode that the liquid crystal device which concerns on Embodiment 2 of this invention was seen from the counter substrate side. It is explanatory drawing which shows typically a mode that the liquid crystal device which concerns on Embodiment 3 of this invention was seen from the counter substrate side. It is explanatory drawing which shows typically a mode that the liquid crystal device which concerns on Embodiment 4 of this invention was seen from the counter substrate side. It is explanatory drawing which shows typically a mode that the liquid crystal device which concerns on Embodiment 5 of this invention was seen from the counter substrate side. It is explanatory drawing which shows typically a mode that the liquid crystal device which concerns on Embodiment 6 of this invention was seen from the counter substrate side. It is explanatory drawing at the time of using the liquid crystal device which concerns on this invention as a display apparatus of various electronic devices. It is explanatory drawing which shows typically a mode that the conventional liquid crystal device was seen from the counter substrate side.

Explanation of symbols

1 .... Liquid crystal device (electro-optical device), 1a..Image display area (pixel area), 1s..IC mounting area, 1t..Substrate connection area, 10..Element substrate (first substrate), 15. · Overhang region, 20 · · Opposing substrate (second substrate), 22 · · Sealing material, 50 · · Intersections between the substrate edges of the opposing substrate, 101 to 104 · · Substrate edge of the element substrate, 150 · · Element substrate , 201, the substrate edge of the counter substrate (first substrate edge), 202, 203, 205, 206, the substrate edge of the counter substrate (second substrate edge), 210, 212 ..Chamfered portion 211 211 Linear portion 213 Arc-shaped concave portion 214 214 End edge of substrate edge

Claims (9)

An electro-optical device in which a first substrate and a second substrate are bonded to each other, and at least one of a flexible substrate and an IC is mounted on the first substrate in a projecting region projecting from the second substrate. In the device
The second substrate includes a first substrate edge that overlaps a substrate surface of the first substrate on a side where the overhanging region is located, a second substrate edge that overlaps a substrate edge of the first substrate, and A point of intersection between the first substrate edge and the second substrate edge;
The electro-optical device is characterized in that the first substrate edge and the second substrate edge intersect at an angle greater than 90 ° at the intersection. The first substrate edge includes a straight portion extending linearly on the center side in the length direction,
At the first substrate edge, an end portion that intersects with the second substrate edge and forms the intersection point and the straight line portion are connected via an exit angle portion or a curved portion having an angle larger than 90 °. The electro-optical device according to claim 1.   The said 2nd board | substrate is equipped with the shape which removed the corner | angular part formed when extending the said 1st board | substrate edge so that it might orthogonally cross with respect to the said 2nd board | substrate edge, It is characterized by the above-mentioned. The electro-optical device according to Item 1.   The second substrate has a shape in which a corner portion formed when the first substrate edge is extended so as to be orthogonal to the second substrate edge is a C-chamfered shape or an R-chamfered shape. The electro-optical device according to claim 3.   5. The electro-optical device according to claim 1, wherein the first substrate and the second substrate have a thickness of 0.5 mm or less.   An electronic apparatus comprising the electro-optical device according to claim 1. A bonding step of bonding the first substrate and the second substrate, and substrate cutting for cutting the second substrate to form an overhanging region protruding from the second substrate with respect to the first substrate In a method for manufacturing an electro-optical device, including a step and a mounting step of mounting at least one of a flexible substrate and an IC on the overhang region,
In the substrate cutting step, the second substrate overlaps the substrate surface of the first substrate on the side where the overhanging region is located, and the second substrate overlaps the substrate edge of the first substrate. And an intersection at which the first substrate edge and the second substrate edge intersect with each other, and at the intersection, the first substrate edge and the second substrate edge are more than 90 °. A method of manufacturing an electro-optical device, wherein the second substrate is cut so as to intersect at a large angle.   In the substrate cutting step, the first substrate edge includes a linear portion linearly extending on the center side in the length direction, and intersects the second substrate edge at the first substrate edge. 8. The second substrate is cut into a shape in which the end portion constituting the intersection point and the straight line portion are connected via an outgoing angle portion having a larger angle than 90 ° or a curved portion. The electro-optical device according to 1.   After the bonding step and before the substrate cutting step, the outer surfaces of the first substrate and the second substrate are etched or polished to thin the first substrate and the second substrate. The method of manufacturing an electro-optical device according to claim 7 or 8.

Images