JP2008052166A - Manufacturing method of electrooptical device, electrooptical device, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electrooptical device, wherein high accuracy in the depth and the like of a scribing groove is not needed and generation of a crack and a chip of a substrate can be prevented even when the substrate is made thin, to provide the electrooptical device and to provide an electronic device. <P>SOLUTION: When outer side surfaces of a panel structural body is etched to reduce a thickness of the substrate in manufacture of a liquid crystal device 1, a region superposed on parting scheduled lines of the outer side surfaces is covered by a mask 340. Thereby, the high accuracy in the depth of the scribing groove is not needed when a panel 30 is separated from the large-sized panel structural body after an etching step. Recessed parts 315 and 325 formed in the etching step are utilized for disposing polarizing plates 91 and 96 and retardation plates 92 and 97 to reduce a thickness dimension as the whole liquid crystal device 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method for manufacturing an electro-optical device in which two substrates are bonded together, an electro-optical device, and an electronic apparatus.

Among various electro-optical devices, for example, an active matrix type liquid crystal device has a panel structure in which an element substrate and a counter substrate are bonded together, and liquid crystal is held between the element substrate and the counter substrate. Yes. Here, since each of the element substrate and the counter substrate is manufactured one by one, the productivity is low. Therefore, the first large substrate capable of obtaining a large number of single-size element substrates and the number of single-size counter substrates capable of being obtained. After the two large substrates are bonded together to form a large panel structure, the panel structure is divided into single-size panels. When performing such division, for example, when dividing the second large substrate, in the scribe groove forming process, a scribe blade is made to enter from the end of the planned dividing line with respect to the second large substrate, and the second After the scribe groove is formed on the outer surface of the large substrate, the second large substrate is bent by pressing from the side of the first large substrate on the back surface side in the break process, and the second large substrate is bent by the bending stress. Cleave the board. The same applies to the case of dividing the first large substrate (see, for example, Patent Document 1).
JP 2002-316829 A

However, in the conventional method, when the substrate is thinned for the purpose of reducing the thickness of the liquid crystal device, there is a restriction that the depth of the scribe groove needs to be controlled with high accuracy, and the workability is reduced. There is a problem of being bad. Further, when the substrate is thinned, there is a problem that the substrate is likely to be chipped or cracked when the scribe groove forming process or the break process is performed, and even after the dividing process is performed.

In view of the above problems, the object of the present invention is to prevent the occurrence of cracks and chipping of the substrate without requiring excessive accuracy in the depth of the scribe groove even when the substrate is thinned. The present invention provides an electro-optical device manufacturing method, an electro-optical device, and an electronic apparatus.

In order to solve the above problems, in the method for manufacturing an electro-optical device according to the present invention, a bonding step of bonding a first substrate and a second substrate to form a panel structure, An etching step of thinning the first substrate and the second substrate by etching an outer surface; a cutting step of cutting the panel structure along a planned cutting line to form a single-size panel; And in the etching step, the outer surface of the panel structure is etched with respect to the outer surface of the panel structure in a state where the region overlapping the planned dividing line is covered with a mask. The first concave portion is formed on the outer surface of the substrate, and the second concave portion is formed on the outer surface of the second substrate.

In the present invention, when the first substrate and the second substrate are thinned by etching the outer surface of the panel structure, the region overlapping the planned dividing line is covered with the mask on the outer surface of the panel structure. Therefore, after the etching process, the substrate thickness in the region overlapping with the planned dividing line is thick. For this reason, even when the substrate is thinned, when the scribe groove is formed, the depth of the scribe groove does not require excessive accuracy. Even when the substrate is thinned, the substrate is not chipped or cracked when the scribe groove forming process or the break process is performed. Furthermore, even when the substrate is thinned, the thick plate region is formed along the outer peripheral edge of the panel, so that the substrate is prevented from being chipped or cracked even after being divided into single panels. be able to.

In the present invention, in an electro-optical device that includes a panel in which a first substrate and a second substrate are bonded to each other, and an image display region is configured in an inner region of the panel, on the outer surface of the first substrate, By the first recess formed in the inner region avoiding the outer peripheral edge of the first substrate,
A first thin plate region is formed in a region including the pixel display region, and a first thick plate region is formed along an outer peripheral edge of the first substrate, and on the outer surface of the second substrate. The second thin plate region is formed in the region including the pixel display region by the second concave portion formed in the inner region avoiding the outer peripheral edge of the second substrate, and the second substrate A second thick plate region is formed along the outer peripheral edge.

In the present invention, one or a plurality of sheet-like or thin plate-like first optical members are arranged inside the first recess, and one or more sheets are arranged inside the second recess. It is preferable to arrange a plurality of sheet-like or thin plate-like second optical members. In the electro-optical device according to the aspect of the invention, one or a plurality of sheet-like or thin plate-like first optical members are disposed inside the first recess, and the second recess is inside. It is preferable that one or a plurality of sheet-like or thin plate-like second optical members are arranged. With this configuration, since the thickness dimension of the entire electro-optical device including the optical member can be reduced, the same thinning as in the case where the entire outer surfaces of the first substrate and the second substrate are thinned is achieved. be able to.

In the present invention, the planned dividing line overlaps a plurality of first divided dividing lines extending in one direction at positions where the outer surfaces on both sides of the panel structure overlap, and the outer surfaces on both sides of the panel structure. A plurality of second portions extending in a direction intersecting the first dividing line at the position
And a plurality of third parting lines extending in parallel with the first parting line on one outer surface of the panel structure. In the parting step, the first parting line includes the first parting line. In the order of splitting along one of the planned split lines, splitting along one planned split line, splitting along the other planned split line, and splitting along the third planned split line May do. In this case, in the etching step, a region of the outer surface of the panel structure that overlaps the first scheduled dividing line, the second scheduled dividing line, and the third scheduled dividing line is covered with the mask. It is preferable to etch the outer surface of the panel structure in a state.

In the electro-optical device according to the aspect of the invention, the first substrate includes a protruding region that protrudes from an outer peripheral edge of the second substrate, and the protruding region is included in the first thick plate region. It is preferable that at least one of the driving IC and the flexible wiring board is mounted on the projecting region. With this configuration, the driving I
When mounting C or a flexible wiring board, it is possible to prevent the substrate from being chipped or cracked.

The present invention is effective when applied to a case where both the first thin plate region and the second thin plate region are thinned to a thickness of 0.5 mm or less, and further to a thickness of 0.25 mm or less. It is.

The electro-optical device to which the present invention is applied is used in an electronic apparatus such as a mobile computer or a mobile phone.

Embodiments of the present invention will be described below with reference to the drawings. In the drawings used for the following description, the scales are different for each layer and each member in order to make each layer and each member large enough to be recognized on the drawing.

(Overall configuration of liquid crystal device)
1A and 1B show a liquid crystal device (electro-optical device) to which the present invention is applied as viewed from the side of a counter substrate (the side from which display light is emitted) together with each component formed thereon. FIG. 6 is a plan view and a sectional view taken along the line HH ′. 2A and 2B are exploded perspective views schematically showing the configuration of the liquid crystal device shown in FIG. 1 on the side from which the display light is emitted, and the configuration on the side opposite to the side from which the display light is emitted. It is a disassembled perspective view which shows typically. In FIG. 1A, illustration of a polarizing plate, a retardation plate, and the like is omitted.

1A and 1B, the liquid crystal device 1 of the present embodiment is a TN (Twisted Nem).
atic) mode, ECB (Electrically Controlled Bir)
efficiency) mode, or VAN (Vertical Aligned)
This is a transmissive active matrix liquid crystal device in a (Nematic) mode. The liquid crystal device 1 includes a panel 30 in which a rectangular element substrate 10 (first substrate) and a rectangular counter substrate 20 (second substrate) are bonded together with a sealant 22. Then, the liquid crystal 1 f is held between the element substrate 10 and the counter substrate 20. The liquid crystal device 1 is configured such that display light is emitted from the counter substrate 20 side, and a backlight device 90 is disposed on the back side where the element substrate 10 is disposed.

In the panel 30, the sealing material 22 is an adhesive made of a photo-curing resin or a thermosetting resin for bonding the element substrate 10 and the counter substrate 20 around them, and the distance between the substrates is set to a predetermined value. Gap materials such as glass fiber or glass beads are blended. A liquid crystal injection port 25 is formed in the sealing material 22 by the discontinuous portion,
After injecting the liquid crystal 1 f, the liquid crystal 1 f is sealed with a sealing material 250.

In the element substrate 10, the pixel transistors 1 c and the pixel electrodes 2 a are formed in a matrix shape in a region surrounded by the sealing material 22, and an alignment film 19 is formed on the surface thereof. On the counter substrate 20, a frame 26 (not shown in FIG. 1B) made of a light-shielding material is formed in an inner region of the sealing material 22, and an inner side thereof is an image display region 1 a (pixel region). . Although not shown, a light shielding film called a black matrix or black stripe is formed on the counter substrate 20 in a region facing the vertical and horizontal boundary regions of each pixel. An alignment film 29 is formed. In the counter substrate 20,
In a region facing each pixel of the element substrate 10, RGB color filters (not shown) are formed together with the protective film, so that the liquid crystal device 1 can be used for electronic devices such as mobile computers, mobile phones, and liquid crystal televisions. It can be used as a color display device. In addition,
As schematically shown in FIG. 1A, a sealing material 2 is provided between the element substrate 10 and the counter substrate 20.
The common wiring formed on the element substrate 10 and the counter electrode 28 of the counter substrate 20 are electrically connected by the conductive material 23 for inter-substrate conduction blended in No. 2 and the like.

The element substrate 10 is larger than the counter substrate 20, and the element substrate 10 includes an extended region 15 that protrudes from the substrate edge of the counter substrate 20 outside the sealing material 22. An IC mounting region 1 s is formed in the overhang region 15, and a driving IC 60 including a gate line driving circuit 66 and a source line driving circuit 67 is provided in the IC mounting region 1 s by COG (Chip On G).
lass). Further, a substrate connection region 1t is formed in the projecting region 15 of the element substrate 10 on the outer peripheral side of the IC mounting region 1s, and a flexible wiring substrate 70 is connected to the substrate connection region 1t. Accordingly, in the element substrate 10, the wiring lines 1x and 1y extend from the image display region 1a to the IC mounting region 1s through the outer region 1b of the image display region 1a, and the IC mounting region 1s and the substrate connection are connected. A wiring (not shown) is formed between the region 1t and the region 1t.

(Configuration of panel 30 and optical member)
As shown in FIGS. 1A and 1B and FIGS. 2A and 2B, in the element substrate 10,
On the outer surface of the glass substrate 11 as the base material, a rectangular first recess 315 is formed in an inner region avoiding the outer peripheral edge of the element substrate 10, and the bottom thereof is 0.5 mm or less, and further 0.25 m.
Thinned to a thickness of m or less. Therefore, in the element substrate 10, the pixel display region 1
In the region including a, a first thin plate region 316 is formed as the bottom of the first recess 315, and a first thick plate region 317 is formed along the outer peripheral edge of the element substrate 10. .
In the present embodiment, the first recess 315 is formed only in the overlapping region between the element substrate 10 and the counter substrate 20, and is formed so as to avoid the overhanging region 15 in which the IC mounting region 1s and the wiring connection region 1t are mounted. Therefore, the overhang region 15 is included in the first thick plate region 317.

Also in the counter substrate 20, similarly to the element substrate 10, a rectangular second recess 325 is formed on the outer surface of the glass substrate 21 that is the base material in an inner region that avoids the outer periphery of the counter substrate 20.
The bottom is thinned to a thickness of 0.5 mm or less, and further 0.25 mm or less.
For this reason, in the counter substrate 20, the second recess 325 is provided in a region including the pixel display region 1 a.
A second thin plate region 326 is formed as a bottom portion of the counter substrate 20, and a second thick plate region 327 is formed along the outer peripheral edge of the counter substrate 20.

In the liquid crystal device 1 configured as described above, the first concave portion 315 and the second concave portion 325 are formed on both surfaces of the panel 30, and members constituting the liquid crystal device 1 are provided inside the concave portions 315 and 325. If arranged, the thickness dimension of the entire liquid crystal device 1 can be compressed.

Here, the liquid crystal device 1 of the present embodiment is a transmissive liquid crystal display device, and a first polarizing member is used as a sheet-like or thin plate-like first optical member between the panel 30 and the backlight device 90. A plate 91 and a first retardation plate 92 are arranged. Further, on the panel 30 on the side from which the display light is emitted (on the side of the counter substrate 20), a second polarizing plate 96 and a first retardation plate 97 are provided as a sheet-like or thin plate-like second optical member. Is arranged.

Therefore, in the present embodiment, the first polarizing plate 91 and the first retardation plate 92 are stacked in the first concave portion 315 of the element substrate 10 and are disposed in the second concave portion 325 of the counter substrate 20. A second polarizing plate 96 and a second retardation plate 97 are stacked. Further, in this embodiment, the depths of the first recess 315 and the second recess 325 are equal to each other, and these depths are the total thickness of the first polarizing plate 91 and the first retardation plate 92. , And the second polarizing plate 96 and the second retardation plate 9
7 equal to the total thickness. Therefore, the first recess 315 is completely filled with the first polarizing plate 91 and the first retardation plate 92, and the second recess 325 is formed with the second polarizing plate 96 and the second retardation. Since it is completely filled with the plate 97, both sides of the panel 30 are flattened.

(Manufacturing method of the liquid crystal device 1)
FIG. 3 is an explanatory view up to the bonding step in manufacturing the liquid crystal device shown in FIG.
Each of (a), (b), and (c) includes a first large substrate (first substrate), a second large substrate (second substrate), and a first substrate used for manufacturing the liquid crystal device. The large-sized panel structure which bonded together the large sized board | substrate and the 2nd large sized board | substrate is shown. FIG. 4 is an explanatory view showing a state in which a mask is formed on the panel structure in the etching process when the liquid crystal device shown in FIG. 1 is manufactured. FIG. 5 is an explanatory diagram of an etching process and a dividing process when the liquid crystal device shown in FIG. 1 is manufactured.
, (B), (c), and (d) each show a state after etching the large panel structure, a state after dividing the large panel structure into strips, A state after the panel structure is divided into single-size panels and a state after an overhang region is formed on the single-size panel are shown. 3, 4, and 5 show a state in which a large substrate, a panel structure, and the like are viewed from the upper surface side (the side from which the display light is emitted) and the lower surface side (indicated by an arrow T) by inverting the front and back. The state seen from the side opposite to the side from which the display light is emitted is shown.

In thinning the liquid crystal device 1 of this embodiment, if a thin substrate is used as the element substrate 10 and the counter substrate 20 from the beginning, the pixel transistor 1c, the pixel electrode 2a, the counter electrode 28, and the like are formed using a semiconductor process. There is a risk of the substrate breaking. Further, if each of the element substrate 10 and the counter substrate 20 is manufactured one by one, the productivity is low.

Therefore, in this embodiment, as shown in FIGS. 3A and 3B, a large number of first large-sized glass substrates 100 capable of obtaining a large number of single-sized element substrates 10 and a large number of single-sized counter substrates 20 are provided. The second large substrate 200 made of thick glass that can be taken is prepared, and these large substrates 10 are prepared.
For 0 and 200, each component such as a pixel switching element, a pixel electrode, and a counter electrode is formed for a plurality of substrates using a semiconductor process or the like.

Next, in the bonding step, the sealing material 22 (FIG. 1A) is applied to each of the regions cut out as the element substrate 10 or the counter substrate 20 with respect to the first large substrate 100 or the second large substrate 200. , (B)) is applied or printed, and then, as shown in FIG. 3B, the large substrates 100 and 200 are bonded to each other with the sealing material 22 to form a large panel structure 300.

Here, since the 1st large sized board | substrate 100 and the 2nd large sized board | substrate 200 are parted in the parting process mentioned later, in FIG. 3-5, the parting schedule line in which a scribe groove | channel is formed in the parting is shown. It is indicated by a one-dot chain line. In the present embodiment, the planned dividing line is a plurality of lines extending in one direction at positions where the outer surfaces on both sides of the panel structure 300 (the outer surface of the first large substrate 100 and the outer surface of the second large substrate 200) overlap. First dividing lines 301 and 302 and the outer surfaces on both sides of the panel structure 300 (the outer surface of the first large substrate 100 and the outer surface of the second large substrate 200) overlap each other. A plurality of second dividing planned lines 303 and 304 extending in a direction intersecting with the planned lines 301 and 302 and one outer surface of the panel structure 300 (the outer surface of the second large substrate 200) 1 planned dividing line 301, 302
And a plurality of third dividing lines 305 extending in parallel with each other.

Next, in the etching process, as shown in FIG. 4, the first scheduled dividing lines 301 and 302, the second scheduled divided lines 303 and 304, and the both sides of the panel structure 300 are formed using photolithography technology. A mask 340 (shaded area in FIG. 4) made of a photosensitive resin is formed in a region overlapping with the third planned dividing line 305. Here, the mask 340 is the element substrate 1.
At 0, it is also formed in a region sandwiched between the first planned split lines 301 and 302 and the third planned split line 305. In the etching process, a gap between the large substrates 100 and 200 opened at the outer peripheral edge of the panel structure 300 is closed with a coating material (not shown) such as epoxy resin or pitch paint.

In the etching step, the panel structure 300 is immersed in an etchant containing hydrofluoric acid, and the mask 3 is formed on both sides of the panel structure 300 (outer surfaces of the large substrates 100 and 200).
The region exposed from 40 is etched to a thickness of 0.5 mm or less, further 0.25 mm or less, and as shown in FIG. First recesses 315 and second recesses 325 are formed on both sides (outer surfaces of the large substrates 100 and 200). Next, the panel structure 300 is cleaned. The epoxy resin and pitch paint used as a coating material may be removed with a solvent,
It is preferable to remove the portion to which the coating material is attached by the dividing step described below.
In addition to wet etching, dry etching may be employed for etching the substrate.

Next, a dividing step is performed. In this dividing step, first, the panel structure 300 (the first large substrate 100 and the second large substrate 200) is divided along the first dividing lines 301 and 302 shown in FIG. A strip-shaped panel structure 350 shown in FIG. 5B is obtained.

When this division is performed, as shown in FIG.
For the large substrate 100, a scribe blade is entered from the end of the first planned dividing line 301 to form a scribe groove along the first divided planned line 301.
The first large substrate 200 is pressed by a break bar, a break roller or the like from the first large substrate 200 side.
The large substrate 100 is bent, and the first large substrate 100 is cleaved by the bending stress. The same scribe groove forming process and break process are performed when the second large substrate 100 is divided.

In this way, when the large panel structure 300 is divided into the strip-shaped panel structure 350, the discontinuous portion of the sealing material 22 shown in FIG. Therefore, after the liquid crystal is injected into the panel from the liquid crystal injection port 25, the liquid crystal injection port 25 is sealed with the sealing material 250.

Next, the strip-shaped panel structure 350 is divided along the second planned dividing lines 303 and 304 shown in FIG. 5B, and as shown in FIG. obtain. Even when the division is performed, the scribe groove forming process and the break process are performed on each of the first large substrate 100 and the second large substrate 200 constituting the strip-shaped panel structure 350.

Next, the counter substrate 20 is divided along the third dividing line 305 shown in FIG. 5C, and the projecting region of the element substrate 10 in the counter substrate 20 is shown in FIG. 5D. 15 is removed, and the IC mounting region 1s and the substrate connection region 1t formed in the overhanging region 15 are removed.
Open the top of. Even when the division is performed, the scribe groove forming process and the break process are performed on the counter substrate 20.

Next, in the mounting process, although not shown in the drawing, with respect to the IC mounting region 1 s of the element substrate 10 with the panel 30 placed on the stage with the element substrate 10 facing the stage (not shown). Then, the driving IC 60 is disposed through the anisotropic conductive material, and then the driving IC 60 is pressed by a head (not shown) while heating the anisotropic conductive material. As a result, element substrate 1
The zero pad and the bump of the driving IC 60 are connected by conductive particles contained in the anisotropic conductive material. After or before such an IC mounting process, the flexible substrate 70 is connected to the substrate connection region 1t using an anisotropic conductive material or the like.

(Main effects of this form)
As described above, in the liquid crystal device 1 of the present embodiment, the recesses 3 formed on both surfaces of the panel 30.
15 and 325 are used to dispose the polarizing plates 91 and 96 and the phase difference plates 92 and 97, so that the thickness dimension of the entire liquid crystal device 1 can be compressed.

Further, in the liquid crystal device 1, the panel 30 includes the large panel structure 30 as described above.
In this embodiment, the first thick plate region 317 is formed along the outer peripheral edge of the element substrate 10, and the outer peripheral edge of the panel 30 corresponds to the dividing line at that time. Counter substrate 2
A second thick plate region 327 is formed along the outer periphery of 0. Accordingly, when the liquid crystal device 1 is thinned, unlike the case where the entire element substrate 10 and the counter substrate 20 are thinned, when the panel 30 is divided from the large panel structure 300, the scribe blade The large sized substrate 100, the second large sized substrate 200, and the thick plate regions 317 and 327 of the counter substrate 20 are moved, so that the scribe groove depth does not require excessive precision. Even when the element substrate 10 and the counter substrate 20 are thinned, they are divided by the thick plate regions 317 and 327, so that the substrate is not chipped or cracked when the scribe groove forming process or the break process is performed. Furthermore, even when the element substrate 10 and the counter substrate 20 are thinned, the panel 30
Since the thick plate regions 317 and 327 are formed along the outer periphery of the substrate, it is possible to prevent the substrate from being chipped or cracked even after being divided into single panels.

Further, in the element substrate 10, the overhang region 15 is included in the first thick plate region 317. For this reason, since it is the first thick plate region 317 that applies stress when the driving IC 60 and the flexible wiring board 70 are mounted in the overhang region 15, it is possible to prevent the substrate from being chipped or cracked. Can do.

[Other embodiments]
In the above embodiment, the present invention is applied to the transmissive liquid crystal device 1. However, in the transflective liquid crystal device, optical members such as polarizing plates 91 and 92 and retardation plates 96 and 97 are provided on both sides of the panel. Since it is arranged, the present invention may be applied. In the case of a configuration in which an optical member such as a reflecting plate is disposed on the side opposite to the display light emitting side with respect to the panel 30 in the reflective liquid crystal device, the present invention may be applied. Further, in the case of a configuration in which an optical member such as the polarizing plate 91 or the retardation plate 92 is not disposed on the side opposite to the display light emission side in the reflective liquid crystal device, the polarizing plate 96 or Since an optical member such as the phase difference plate 97 is disposed, the present invention may be applied.

In the above-described embodiment, the concave portions 315 and 325 are provided with the polarizing plates 91 and 96 and the retardation plates 92 and 9.
7 is used, but when the concave portions 315 and 325 are used as the space for arranging the optical member, a configuration in which one optical member is arranged in the concave portions 315 and 325, or the concave portion A configuration in which the optical member partially protrudes from 315 and 325 may be adopted.

Moreover, in the said embodiment, the division | segmentation along the 1st parting plan line 301,302, the parting along the 2nd parting plan line 303,304, the parting along the 3rd parting plan line 305 However, depending on the relationship with the position of the liquid crystal injection port, etc., the second scheduled dividing lines 303 and 30 are performed.
4 may be performed in the order of division along line 4, division along first planned division lines 301 and 302, and division along third planned division line 305.

In the above embodiment, the break process is performed after the scribe groove forming process as the dividing process. For example, the substrate is bent in advance and then the scribe groove is formed, and the vacuum is formed simultaneously with the formation of the scribe groove. The present invention may be applied to a case where a method of increasing the bending by suction or the like and dividing the substrate is adopted.

Further, in the above embodiment, the active matrix type liquid crystal device in the TN mode, the ECB mode, and the VAN mode has been described as an example. However, IPS (In-Plane Switch) is described.
ng) mode liquid crystal device (electro-optical device) may be applied.

Furthermore, the present invention may be applied not only to a liquid crystal device as an electro-optical device, but also to, for example, an organic EL (electroluminescence) device, and other electro-optical devices.

[Embodiment of Electronic Device]
FIG. 6 shows an embodiment in which the liquid crystal device according to the present invention is used as a display device of various electronic devices. The electronic device shown here is a personal computer, a mobile phone, or the like, and includes a display information output source 170, a display information processing circuit 171, a power supply circuit 172, a timing generator 173, and the liquid crystal device 1. Further, the liquid crystal device 1 includes a panel 175 and a drive circuit 176, and the above-described liquid crystal device 1 can be used. The display information output source 170 includes a ROM (Read Only Memory) and a RAM (Random).
The timing generator 1 includes a memory such as an access memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and the like.
Display information such as an image signal of a predetermined format is supplied to the display information processing circuit 171 based on the various clock signals generated by 73. The display information processing circuit 171 includes a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit,
A variety of well-known circuits such as a clamp circuit are provided, processing of the inputted display information is executed, and the image signal is supplied to the drive circuit 176 together with the clock signal CLK. The power supply circuit 172
A predetermined voltage is supplied to each component.

(A), (b) is the plane which looked at the liquid crystal device (electro-optical device) to which this invention was applied from the side of the counter substrate (the side from which the display light is emitted) together with each component formed thereon. It is a figure and its H-H 'sectional drawing. (A), (b) is a disassembled perspective view schematically showing the configuration of the liquid crystal device shown in FIG. 1 on the side from which display light is emitted, and schematically shows the configuration on the side opposite to the side from which display light is emitted. FIG. It is explanatory drawing to the bonding process at the time of manufacturing the liquid crystal device shown in FIG. It is explanatory drawing of the state which formed the mask 340 in the panel structure body at the etching process at the time of manufacturing the liquid crystal device shown in FIG. It is explanatory drawing of the etching process at the time of manufacturing the liquid crystal device shown in FIG. 1, and a division | segmentation process. It is explanatory drawing at the time of using the liquid crystal device which concerns on this invention as a display apparatus of various electronic devices.

Explanation of symbols

1 .... Liquid crystal device, 10 .... Element substrate (first substrate), 20 .... Counter substrate (second substrate),
30..Single size panel, 90..Backlight device, 91..First polarizing plate (first
, 92... First retardation plate (first optical member), 96.. Second polarizing plate (second optical member), 97... Second retardation plate (second optical member) Optical member), 100... First large substrate (first substrate), 200 .. second large substrate (second substrate), 300, 350... Panel structure, 301, 302. 1 parting line 303, 304... Second parting line 305 .. third parting line 315 .. first recess 316 .. first thin plate region 3
17 ··· First thick plate region, 325 · · Second recess, 326 · · Second thin plate region, 327 · ·
・ Second plate area

Claims (9)

In the method of manufacturing the electro-optical device,
A bonding step of bonding a first substrate and a second substrate to form a panel structure;
An etching step of thinning the first substrate and the second substrate by etching an outer surface of the panel structure;
A dividing step of dividing the panel structure along a planned dividing line to form a single-size panel, and
In the etching step, the outer surface of the panel structure is etched with respect to the outer surface of the panel structure in a state where the region overlapping the planned dividing line is covered with a mask.
A method of manufacturing an electro-optical device, wherein a first recess is formed on an outer surface of the first substrate, and a second recess is formed on an outer surface of the second substrate. One or a plurality of sheet-like or thin plate-like first optical members are disposed inside the first recess,
2. The method of manufacturing an electro-optical device according to claim 1, wherein one or a plurality of sheet-like or thin plate-like second optical members are arranged inside the second recess. The parting line is divided into a plurality of first parting lines extending in one direction at positions where the outer surfaces on both sides of the panel structure overlap, and the parting line at the positions where the outer surfaces on both sides of the panel structure overlap. A plurality of second parting lines extending in a direction intersecting with the first parting line and a plurality extending in parallel to the first parting line on one outer surface of the panel structure. And a third parting line of the book,
In the dividing step, the division along one of the first scheduled dividing lines and the second divided planned line, the dividing along the other divided planned line, and the third divided scheduled line In the order of division along the line,
In the etching step, the region of the outer surface of the panel structure that overlaps the first planned split line, the second planned split line, and the third planned split line is covered with the mask. The outer surface of the panel structure is etched.
A method for manufacturing the electro-optical device according to claim 1. An electro-optical device manufactured by the method according to claim 1. In an electro-optical device including a panel in which a first substrate and a second substrate are bonded to each other, and an image display region is configured in an inner region of the panel.
On the outer surface of the first substrate, a first thin plate region is formed in a region including the pixel display region by a first recess formed in an inner region avoiding the outer peripheral edge of the first substrate. And a first plank region is formed along the outer periphery of the first substrate,
On the outer surface of the second substrate, a second thin plate region is formed in a region including the pixel display region by a second recess formed in an inner region avoiding the outer peripheral edge of the second substrate. And an electro-optical device characterized in that a second thick plate region is formed along the outer peripheral edge of the second substrate. Inside the first recess, one or a plurality of sheet-like or thin plate-like first optical members are arranged,
6. The electro-optical device according to claim 5, wherein one or a plurality of sheet-like or thin plate-like second optical members are arranged inside the second recess. The first substrate includes a projecting region projecting from an outer peripheral edge of the second substrate, and the projecting region is included in the first thick plate region,
7. The electro-optical device according to claim 5, wherein at least one of a driving IC and a flexible wiring board is mounted in the projecting region. The electro-optical device according to claim 5, wherein the first thin plate region and the second thin plate region both have a thickness of 0.5 mm or less. An electronic apparatus comprising the electro-optical device according to claim 4.

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