JP2008184358A - Manufacture method of electro-optical apparatus, and electro-optical apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cut a pair of mother substrates so as to have cutting planes high in smoothness when cutting the pair of mother substrates to manufacture a plurality of electro-optical apparatuses. <P>SOLUTION: In the manufacturing method of electro-optical apparatuses, the pair of mother substrates (S1 and S2) are cut for every panel forming region (810) to manufacture electro-optical apparatuses provided each with a pair of substrates (10 and 20). Furthermore, the method includes a process for forming scribe grooves (510) by scribing the surface of the one mother substrate (S2) on the opposite side to the other substrate (S1) opposed to the mother substrate (S2) along a planned cutting line (L2) positioned at the boundary between the panel forming regions; a process for forming cracks (520) starting at the scribe grooves by pushing one mother substrate from the surface side opposed to the other substrate; and a process for forming dicing grooves (530) by applying a half-dicing after the process for forming cracks. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electro-optical device such as a liquid crystal device, and a technical field of an electro-optical device such as a liquid crystal device manufactured by the method for manufacturing the electro-optical device.

  As an example of this type of electro-optical device, there is a liquid crystal device having a liquid crystal panel in which liquid crystal is sandwiched between a pair of substrates bonded with a sealing material as an electro-optical material.

  In manufacturing such a liquid crystal device, there are cases where two substrates cut to a size corresponding to each panel are stacked and bonded together. For example, forming wiring patterns and various electronic elements for multiple liquid crystal devices on a mother substrate (large glass substrate) that can be formed, and then processing the large mother substrate until the middle of the manufacturing process. In many cases, the mother substrate is cut and divided into individual glass substrates.

  As a method for cutting such a mother substrate, for example, a cutter such as a diamond tip is kept in contact with the surface of the mother substrate, and the cutter is moved relative to the mother substrate along a planned cutting line. A scribe groove (scribe line) is formed on the substrate, and then the mother substrate is pressed from the back side with a break jig (for example, a rubber roller) to apply bending stress, and this stress starts the scribe groove. There is a method of cutting a mother substrate by generating a crack (hereinafter, this method is appropriately referred to as a “scribe / break method”).

  However, in the scribe / break method, the cut surface of each glass substrate is defined by a crack starting from the scribe groove, so that it is inclined with respect to a desired cut surface (for example, a surface perpendicular to the substrate surface). There is a risk of shifting. The cut surfaces of the individual glass substrates are used, for example, as positioning means when the liquid crystal device is accommodated in the mounting case, and the displacement of the liquid crystal device within the mounting case may occur due to the deviation from the desired cutting surface. The liquid crystal device may not be accommodated in the mounting case.

  Therefore, instead of the scribing / breaking method, a dicing groove is formed by half-dicing the cutting line of the mother substrate with a diamond circular rotating blade (dicing blade) rotated at high speed, and then the back surface. A method of cutting the mother substrate by applying a bending stress from the side to generate a crack starting from the dicing groove may be employed (hereinafter, this method is appropriately referred to as a “half-dicing / breaking method”). According to the half dicing / breaking method, since the cut surface of each glass substrate includes a surface defined by the side surface of the dicing groove, the deviation from the desired cutting surface is reduced as compared with the scribe / breaking method. For example, the occurrence of displacement of the liquid crystal device in the mounting case can be reduced.

  For example, Patent Document 1 discloses a technique for cutting a glass substrate by forming a scribe line on the surface of the glass substrate and then irradiating laser light along the scribe line.

JP 2001-35816 A

  However, when the mother substrate is cut by the above-described half dicing / breaking method, the portion of the cut surface that is defined by the crack starting from the dicing groove is defined by the crack starting from the scribe groove in the scribing / breaking method, for example. There is a technical problem that the smoothness is low compared to the cut surface to be produced, and glass dust is likely to be generated. Due to the glass waste generated in this way, there is a possibility that a defect may occur in the wiring pattern and various electronic elements formed on the substrate.

  The present invention has been made in view of, for example, the above-described problems. When a plurality of electro-optical devices are manufactured by cutting a pair of mother substrates, the pair of mother substrates have a highly smooth cut surface. It is an object of the present invention to provide a method for manufacturing an electro-optical device that can be cut into two pieces, and an electro-optical device manufactured by the method for manufacturing the electro-optical device.

  In order to solve the above problems, the electro-optical device manufacturing method of the present invention includes a pair of substrates formed by cutting a pair of mother substrates bonded to each other for each panel formation region and sandwiching an electro-optical material. An electro-optical device manufacturing method for manufacturing an electro-optical device, wherein one of the pair of mother substrates is disposed on a surface opposite to the surface facing the other mother substrate between the panel formation regions. A step of forming a scribe groove by scribing along a planned cutting line located at the boundary; and pressing the one mother substrate from the opposite surface side to thereby form the scribe groove on the one mother substrate. After the step of forming a crack reaching the opposite side surface and the step of forming the crack, on the opposite side surface to the planned cutting line And forming a dicing grooves by performing half-dicing I.

  According to the method for manufacturing an electro-optical device of the present invention, the pair of mother substrates are bonded to each other by, for example, a sealing material. One of the pair of mother substrates includes, for example, a plurality of pixel substrates and an element substrate on which wiring and electronic elements electrically connected to the plurality of pixel electrodes are formed, one for each panel formation region. Comprising. The other of the pair of mother substrates includes a plurality of counter substrates each having a counter electrode facing a plurality of pixel electrodes, one for each panel formation region. An electro-optical device in which an electro-optical material such as a liquid crystal is sandwiched between a pair of substrates configured as an element substrate and a counter substrate, for example, by cutting the pair of mother substrates bonded together for each panel formation region Is manufactured. For example, an electro-optical material such as a liquid crystal is sandwiched between a pair of substrates by, for example, dropping a liquid crystal in each panel formation region on either one of the pair of mother substrates and then bonding the pair of mother substrates together. Alternatively, the pair of mother substrates bonded together with the sealing material may be cut into each panel forming region and then sealed between the pair of substrates. In the electro-optical device manufactured as described above, during the operation, for example, light incident from a light source passes through the electro-optical material in each pixel and is emitted as display light, thereby displaying an image.

  Particularly in the present invention, when cutting a pair of mother substrates bonded together, a step of forming a scribe groove, a step of forming a crack starting from the scribe groove, and a step of forming a dicing groove are performed in this order. .

  That is, first, of the pair of mother substrates, one surface of the mother substrate is opposite to the surface facing the other mother substrate (that is, the surface not facing the electro-optical material) between the panel formation regions. A step of forming a scribe groove (that is, a scribe line or a V-shaped cut groove) is performed by scribing along a planned cutting line located at the boundary. The scribing is performed, for example, by relatively moving the cutter along a planned cutting line while keeping a cutter such as a diamond tip in contact with the surface of one mother substrate.

  Next, one mother substrate on which a scribe groove is formed is pressed or pressed from the side facing the other mother substrate (that is, the surface facing the electro-optical material), and bent to one mother substrate. By applying the stress, a process is performed in which one mother substrate is formed with a crack starting from the scribe groove and reaching the surface facing the other mother substrate. Here, since the scribe groove is formed along the planned cutting line, the crack starting from the scribe groove is also formed substantially along the planned cutting line. Since the cut surface defined by the crack starting from such a scribe groove has higher smoothness than the crack starting from the dicing groove in the above-mentioned half dicing / breaking method, for example, glass scraps, etc. This material has a characteristic that little or no material waste (that is, material waste) constituting the mother substrate is generated. Therefore, for example, when one mother substrate is cut, material waste such as glass waste is generated, and the material waste is generated on the wiring or electronic element formed on the element substrate included in one of the pair of mother substrates. On the other hand, it is possible to reduce or prevent damage or adverse effects on the device.

  Next, along the planned cutting line (that is, the scribe groove and the scribe groove) on the surface of the one mother substrate opposite to the surface facing the other mother substrate (in other words, the surface on which the scribe groove is formed). A dicing groove is formed by performing half-dicing (overlapping on the crack starting from). Half dicing is performed by pressing a circular rotary blade (that is, a dicing blade) made of diamond or the like rotated at a high speed to a predetermined depth along a planned cutting line on one mother substrate. Therefore, the cut surface along the planned cutting line in one mother substrate can be formed so as to include a portion defined by the side surface of the dicing groove and a portion defined by the crack starting from the scribe groove. That is, of the cut surface along the planned cutting line in one mother substrate, the portion from the surface opposite to the surface facing the other mother substrate to the predetermined depth in one mother substrate is defined by the dicing groove. The portion of the surface of the one mother substrate that faces the other mother substrate is cut from the mother substrate so that the portion of the mother substrate facing the other mother substrate is defined by the crack starting from the scribe groove. can do. The cut surface defined by the side surface of such a dicing groove has higher smoothness than the above-described cut surface by the scribe / break method, and a desired cut surface can be formed with high accuracy. Therefore, a dicing groove in a cut surface (that is, an end surface of each substrate included in one mother substrate out of a pair of substrates obtained by cutting the pair of mother substrates) along a planned cutting line in one mother substrate. For example, the portion defined by the side surface can be suitably used as positioning means when the electro-optical device is accommodated in the mounting case. That is, when the electro-optical device is accommodated in the mounting case, the portion defined by the side surface of the dicing groove is used as a positioning unit, so that the occurrence of the positional deviation of the electro-optical device in the mounting case can be almost or completely eliminated. It is possible to avoid a situation where the electro-optical device cannot be accommodated in the mounting case.

  As described above, according to the electro-optical device manufacturing method of the present invention, when cutting a pair of bonded mother substrates, a step of forming a scribe groove and a step of forming a crack starting from the scribe groove. Since the dicing groove forming step is performed in this order, the pair of mother substrates can be cut so as to have a highly smooth cut surface. Therefore, it is possible to reduce or prevent the occurrence of defects in, for example, wirings or electronic elements formed on the mother substrate due to material waste such as glass waste in the manufacturing process. As a result, the yield can be improved and a highly reliable electro-optical device can be manufactured.

  In one aspect of the method of manufacturing an electro-optical device according to the aspect of the invention, the electro-optical device includes a plurality of pixel electrodes and wirings and electronic elements that are electrically connected to the plurality of pixel electrodes as the pair of substrates. An element substrate and a counter substrate on which counter electrodes facing the plurality of pixel electrodes are formed. The one mother substrate includes a plurality of the counter substrates, and the other mother substrate includes the element substrate. Includes multiple substrates.

  According to this aspect, the step of forming the scribe groove, the step of forming the crack starting from the scribe groove, and the step of forming the dicing groove in this order on one mother substrate including a plurality of counter substrates. By performing this, the one mother substrate is cut along a planned cutting line. Therefore, when cutting one mother substrate, for example, material waste such as glass waste avoids adversely affecting wirings or electronic elements formed on the other mother substrate including a plurality of element substrates. it can.

  In addition, by performing a step of forming a scribe groove, a step of forming a crack starting from the scribe groove, and a step of forming a dicing groove in this order for the other mother substrate including a plurality of element substrates, The other mother substrate may be cut along a planned cutting line. Further, any one of the other mother substrate including a plurality of element substrates and the other mother substrate including a plurality of counter substrates may be cut first.

  In order to solve the above problems, the electro-optical device of the present invention includes a pair of substrates sandwiching an electro-optical material, and at least one of the pair of substrates has a cut surface by half dicing. And a crack portion that protrudes outward along the substrate surface of the at least one substrate from the dicing portion and has a cut surface formed by a crack formed from a scribe groove.

  According to the electro-optical device of the present invention, for example, it is manufactured by the above-described method for manufacturing the electro-optical device of the present invention, and the smoothness of the side surface of at least one of the substrates is enhanced. Accordingly, it is possible to provide a highly reliable electro-optical device that hardly generates scraps of materials constituting at least one substrate such as glass scraps. Further, by using the dicing portion as a positioning means when the electro-optical device is accommodated in the mounting case, the occurrence of the positional deviation of the electro-optical device in the mounting case can be almost or completely eliminated.

  The operation and other advantages of the present invention will become apparent from the best mode for carrying out the invention described below.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a driving circuit built-in type TFT active matrix driving type liquid crystal device, which is an example of the electro-optical device of the present invention, is taken as an example.

  First, the configuration of the liquid crystal device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the configuration of the liquid crystal device according to the present embodiment, and FIG. 2 is a cross-sectional view taken along the line HH ′ of FIG.

  1 and 2, in the liquid crystal device according to the present embodiment, a TFT array substrate 10 as an example of a “pair of substrates” according to the present invention and a counter substrate 20 are disposed to face each other. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 are in a frame-shaped or frame-shaped seal region located around the image display region 10a. The sealing material 52 provided is bonded to each other.

  In FIG. 1, a light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. A data line driving circuit 101 and an external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 in a region located outside the sealing region in which the sealing material 52 is disposed in the peripheral region. The sampling circuit 7 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. Further, the scanning line driving circuit 104 is provided so as to be covered with the frame light-shielding film 53 inside the seal region along two sides adjacent to the one side. On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20.

  On the TFT array substrate 10, a lead wiring 90 is formed for electrically connecting the external circuit connection terminal 102 to the data line driving circuit 101, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like. .

  In FIG. 2, on the TFT array substrate 10, there is formed a laminated structure in which pixel switching TFTs (Thin Film Transistors), which are driving elements, and wirings such as scanning lines and data lines are formed. In the image display area 10a, pixel electrodes 9a are provided in a matrix on the upper layer of wiring such as pixel switching TFTs, scanning lines, and data lines. An alignment film is formed on the pixel electrode 9a. On the other hand, a light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. The light shielding film 23 is formed of, for example, a light shielding metal film or the like, and is patterned, for example, in a lattice shape in the image display region 10a on the counter substrate 20. On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed in a solid shape so as to face the plurality of pixel electrodes 9a. An alignment film is formed on the counter electrode 21. Further, the liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  As will be described in detail later, each of the end surfaces of the TFT array substrate 10 and the counter substrate 20 includes a cut surface by half dicing and a cut surface by a crack formed starting from a scribe groove.

  Although not shown here, in addition to the data line driving circuit 101 and the scanning line driving circuit 104, the TFT array substrate 10 is used for inspecting the quality, defects, and the like of the liquid crystal device during manufacturing or at the time of shipment. An inspection circuit, an inspection pattern, or the like may be formed.

  Next, a method for manufacturing the liquid crystal device according to this embodiment configured as described above will be described with reference to FIGS.

  FIG. 3 is a partial plan view showing a part of a first mother substrate including a plurality of TFT array substrates, and FIG. 4 is a second mother substrate including a plurality of counter substrates. FIG. 5 is a cross-sectional view taken along the line AA ′ of FIG. 4 when the first mother substrate and the second mother substrate are bonded to each other.

  According to the method of manufacturing the liquid crystal device according to the present embodiment, first, as shown in FIG. 3, various components (that is, the pixel electrode 9a) on the TFT array substrate 10 side described above with reference to FIGS. And a layered structure including a pixel switching TFT, a scanning line driving circuit 104, a data line driving circuit 101, and the like) are formed on the first mother substrate S1 for each panel formation region 810. The first mother substrate S1 is made of a relatively large glass substrate. The first mother substrate S1 may be made of a silicon substrate.

  On the other hand, on the other side of the second mother substrate S2 shown in FIG. 4 in parallel with or in parallel with the formation process on the first mother substrate S1 side, the above-described opposition described above with reference to FIGS. A laminated structure including various components (the counter electrode 21, the light shielding film 23, etc.) on the substrate 20 side is formed for each panel formation region 810. The second mother substrate S2 is made of a relatively large glass substrate.

  Thereafter, as shown in FIG. 5, the first mother substrate S <b> 1 and the second mother substrate S <b> 2 are opposed to each other in a bonding process, and are bonded together by a sealing material 52 made of, for example, an ultraviolet curable resin or a thermosetting resin. At this time, the sealing material 52 is formed on the first mother substrate S1 at a predetermined height in the frame-shaped sealing region in each panel forming region 810, and the liquid crystal layer 50 is formed in the inner region of the sealing material 52. After the fixed amount of liquid crystal is dropped, the mother substrates S1 and S2 are bonded to each other by the sealing material 52. That is, in this embodiment, a so-called liquid crystal dropping and bonding method is adopted. Note that the sealing material 52 is omitted in a part of the frame-shaped sealing region, and the bonded mother substrates S1 and S2 are cut for each panel forming region 810 as will be described later, and then the sealing material 52 is missing. Liquid crystal may be injected between the TFT array substrate 10 and the counter substrate 20 using the formed portion as an injection port.

  FIG. 6 is a process cross-sectional view showing a series of cutting processes for cutting the second mother substrate. 6A is a process cross-sectional view showing a scribe groove forming process, FIG. 6B is a process cross-sectional view showing a crack forming process, and FIG. 6C shows a dicing groove forming process. It is process drawing. FIG. 7 is an enlarged view showing a portion C1 of FIG. FIG. 8 is a view corresponding to FIG. 7 showing a cut surface of a mother substrate by a half dicing break method as a comparative example. FIG. 6 is shown corresponding to the cross-sectional view shown in FIG.

  Next, through the series of cutting steps shown in FIG. 6, the second mother substrate S2 is scheduled to be cut for each panel formation region 810 (ie, at the boundary between the panel formation regions 810 in the second mother substrate S2 shown in FIG. 4). Cut along line L2. Subsequently, the first mother substrate S1 is cut for each panel formation region 810 (that is, the panel formation region 810 in the first mother substrate S1 shown in FIG. 4) by a cutting process similar to the cutting process for cutting the second mother substrate S2. Cut along the planned cutting line L1 located at the boundary between them. In this way, the mother substrates S1 and S2 bonded to each other are cut for each panel forming region 810, whereby each individual liquid crystal device as shown in FIGS. 1 and 2 is manufactured.

  Note that the second mother substrate S2 may be cut for each panel formation region 810 after the first mother substrate S1 is cut for each panel formation region 810. That is, any of the mother substrates S1 and S2 may be cut first.

  As shown in FIG. 6, in the present embodiment, in particular, when the second mother substrate S2 is cut for each panel forming region 810, a scribe groove forming step (see FIG. 6A) and a crack forming step (FIG. 6 ( b)) and the dicing groove forming step (see FIG. 6C) are performed in this order.

  That is, when the second mother substrate S2 is cut for each panel formation region 810, first, as shown in FIG. 6A, the second mother substrate S2 is opposed to the first mother substrate S1 in the second mother substrate S2 by a scribe groove forming step. A cutting line L2 (see FIG. 4) located on the boundary between the panel forming regions 810 is formed on the surface opposite to the surface (that is, the surface not facing the liquid crystal layer 50, that is, the upper surface in the drawing). A scribe groove 510 is formed by scribing. The scribing is performed, for example, by relatively moving the cutter along the planned cutting line L2 while keeping a cutter such as a diamond tip in contact with the surface of the second mother substrate S2.

  Next, as shown in FIG. 6B, the second mother substrate S <b> 2 in which the scribe grooves 510 are formed by the crack formation step is opposed to the surface facing the first mother substrate S <b> 1 (that is, facing the liquid crystal layer 50). By applying a bending stress to the second mother substrate S2 by pressing from the surface, that is, the lower surface in the drawing, the first mother substrate S1 has the scribe groove 510 as a starting point in the second mother substrate S2. A crack 520 reaching the surface on the side opposite to is formed. Here, since the scribe groove 510 is formed along the planned cutting line L2, the crack 520 starting from the scribe groove 510 is also formed substantially along the planned cutting line L2. The cut surface defined by the crack 520 starting from such a scribe groove 510 is a half dicing break method shown as a comparative example in FIG. 8 (that is, without performing the above-described scribe groove formation process and crack formation process, First, a method of cutting the mother substrate S2 by forming a dicing groove 530b by half-dicing the surface of the second mother substrate S2 and forming a crack 540b by applying a bending stress to the second mother substrate S2. Compared with the cut surface 541b defined by the crack 540b starting from the dicing groove 530b, the smoothness is high. Therefore, glass waste is generated when the second mother substrate S2 is cut, and the glass waste adversely affects various components on the TFT array substrate 10 side formed on the first mother substrate S1. Can be reduced or prevented.

  Next, as shown in FIG. 6C, the surface of the second mother substrate S2 opposite to the surface facing the first mother substrate S1 (in other words, the scribe groove 510 is formed by the dicing groove forming step. The dicing groove 530 is formed by performing half dicing along the planned cutting line L2 (that is, overlapping the scribe groove 510 and the crack 520). Half dicing is performed by pressing a diamond dicing blade rotated at a high speed to a predetermined depth along the planned cutting line L2 in the second mother substrate S2.

  Therefore, as shown in FIG. 7, the cut surface along the planned cutting line L <b> 2 in the second mother substrate S <b> 2 is cut by the cut surface 531 defined by the side surface of the dicing groove 530 and the crack 520 starting from the scribe groove 510. It can be formed so as to include a defined cut surface 521. Such a cut surface 531 defined by the side surface of the dicing groove 530 has higher smoothness and can form a desired cut surface with high accuracy as compared with the cut surface by the scribe / break method described above. Therefore, the cut surface 531 defined by the side surface of the dicing groove 530 can be suitably used as a positioning unit when the liquid crystal device is accommodated in the mounting case, for example. That is, by using the cut surface 531 defined by the side surface of the dicing groove as a positioning means when the liquid crystal device is accommodated in the mounting case, the occurrence of the displacement of the liquid crystal device in the mounting case is almost or completely eliminated. Or a situation in which the liquid crystal device cannot be accommodated in the mounting case can be avoided.

  As described above, according to the manufacturing method of the liquid crystal device according to the present embodiment, when the pair of mother substrates S1 and S2 bonded together are cut, a scribe groove forming process, a crack forming process, and a dicing groove forming process are performed. In this order, the pair of mother substrates S1 and S2 can be cut so as to have a highly smooth cut surface. Therefore, in the manufacturing process, glass waste that can be generated from the cut surface can be reduced, and such glass waste causes a problem in various components on the TFT array substrate 10 side formed on the first mother substrate S1, for example. This can be reduced or prevented. As a result, the yield can be improved and a highly reliable liquid crystal device can be manufactured.

  Next, a characteristic configuration of the ends of the pair of substrates of the liquid crystal device according to the present embodiment manufactured by the manufacturing method as described above will be described with reference to FIG.

  FIG. 9 is a schematic diagram showing a characteristic configuration at the ends of a pair of substrates of the liquid crystal device according to the present embodiment. In FIG. 9, only the TFT array substrate 10, the counter substrate 20, the sealing material 52, and the liquid crystal layer 50 are shown, and various components described above with reference to FIGS. 1 and 2 are omitted. FIG. 9 is shown corresponding to the cross-sectional view shown in FIG. 5, and shows one of a plurality of liquid crystal devices manufactured from a part of the pair of mother substrates shown in FIG. ing.

  9, the liquid crystal device according to the present embodiment is manufactured by being cut by the cutting process described above with reference to FIG. 6, so that the end 20e of the counter substrate 20 has a dicing portion 20e1 and a crack. Part 20e2. The dicing portion 20e1 has a cut surface 531 by half dicing. The crack portion 20e2 is closer to the substrate surface of the counter substrate 20 than the dicing portion 20e1 (that is, in a direction from the center of the counter substrate 20 toward the periphery of the counter substrate 20 when viewed in plan on the counter substrate 20). And a cut surface 521 by a crack 520 formed from the scribe groove 510 as a starting point. Furthermore, the end 10e of the TFT array substrate 10 has a dicing portion 10e1 and a crack portion 10e2. The dicing portion 10e1 has a cut surface 532 by half dicing. The crack portion 10e2 is located along the substrate surface of the TFT array substrate 10 more than the dicing portion 10e1 (that is, when viewed in plan on the TFT array substrate 10, from the center of the TFT array substrate 10 to the periphery of the TFT array substrate 10). It has a cut surface 522 by a crack that protrudes outward (along the direction toward the outer side) and is formed starting from a scribe groove.

  Therefore, the smoothness of the side surfaces of each of the counter substrate 20 and the TFT array substrate 10 is improved. Accordingly, it is possible to provide a highly reliable liquid crystal device in which glass dust is hardly generated from the side surfaces of each of the counter substrate 20 and the TFT array substrate 10. Further, by using the cut surface 531 of the dicing portion 20e1 or the cut surface 532 of the dicing portion 10e1 as positioning means when the liquid crystal device is accommodated in the mounting case, the positional deviation of the liquid crystal device in the mounting case can be generated. It can be almost or completely eliminated.

  The cutting step for cutting the mother substrate shown in FIG. 6 is provided, for example, on the outer surfaces of the pair of TFT array substrates 10 and the counter substrate 20 (that is, the surfaces of the pair of substrates that do not face the liquid crystal layer 50). You may apply when forming the dust-proof board | substrate which can be obtained. That is, for example, apart from the mother substrates S1 and S2, a third mother substrate in which a plurality of dust-proof substrates are formed for each panel formation region is prepared, and the second mother substrate S2 is provided for each panel formation region 810. After cutting, it is bonded to the outer surface of the second mother substrate S2, and then the third mother substrate may be cut by a process similar to the cutting process shown in FIG. In this case, the smoothness of the end surface of the dust-proof substrate can be improved, and the generation of material waste such as glass waste from the end surface of the dust-proof substrate can be reduced. Here, by providing a dustproof substrate on the outer surface of the pair of substrates of the liquid crystal device, it is possible to prevent dust from directly adhering to the outer surface of the pair of substrates, and the dust temporarily adhered to the dustproof substrate. However, it is possible to avoid a situation in which a dust image is projected on an image because the dust-proof substrate has a predetermined thickness.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change. The manufacturing method and the electro-optical device are also included in the technical scope of the present invention.

It is a top view which shows the structure of the liquid crystal device which concerns on 1st Embodiment. It is HH 'sectional drawing of FIG. It is a fragmentary top view which shows a part of 1st mother board | substrate comprised including a some TFT array board | substrate. It is a top view which shows the 2nd mother board | substrate comprised including a some opposing board | substrate. FIG. 5 is a cross-sectional view taken along the line AA ′ of FIG. 4 when the first mother substrate and the second mother substrate are bonded together. It is process sectional drawing which shows a series of cutting processes which cut | disconnect a 2nd mother board | substrate. It is an enlarged view which expands and shows a part of FIG.6 (c). It is a figure which shows the cut surface of the mother board | substrate in a comparative example. It is a schematic diagram which shows the structure of the edge part of a pair of board | substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 7 ... Sampling circuit, 9a ... Pixel electrode, 10 ... TFT array substrate, 10a ... Image display area, 10e ... End part, 10e1 ... Dicing part, 10e2 ... Crack part, 20 ... Opposite substrate, 20e ... End part, 20e1 ... Dicing Part: 20e2: Crack part, 21: Counter electrode, 23: Light shielding film, 50: Liquid crystal layer, 52: Sealing material, 53: Frame light shielding film, 101: Data line driving circuit, 102: External circuit connection terminal, 104: Scanning Line drive circuit 106 ... Vertical conduction terminal 107 ... Vertical conduction material 510 ... Scribe groove 520 ... Crack 530 ... Dicing groove 810 ... Panel formation region S1, S2 Mother board, L1, L2 ... Planned cutting line

Claims (3)

A method of manufacturing an electro-optical device, which manufactures an electro-optical device including a pair of substrates formed by cutting a pair of mother substrates bonded to each other for each panel formation region and sandwiching an electro-optical material,
Scribing is performed by scribing one of the pair of mother substrates on the surface of the one mother substrate opposite to the surface facing the other mother substrate along a planned cutting line located at the boundary between the panel forming regions. Forming a groove;
By pressing the one mother substrate from the opposing surface side to form a crack reaching the opposing surface while starting from the scribe groove on the one mother substrate; and
And a step of forming a dicing groove by performing half dicing on the opposite surface along the planned cutting line after the step of forming the crack. The electro-optical device includes, as the pair of substrates, a plurality of pixel electrodes, an element substrate on which wirings and electronic elements electrically connected to the plurality of pixel electrodes are formed, and an opposing surface that faces the plurality of pixel electrodes. An opposite substrate on which an electrode is formed,
The one mother substrate includes a plurality of the counter substrates,
The method of manufacturing an electro-optical device according to claim 1, wherein the other mother substrate includes a plurality of the element substrates. Comprising a pair of substrates sandwiching an electro-optic material;
The end of at least one of the pair of substrates is
A dicing portion having a cut surface by half dicing, and
An electro-optical device comprising: a crack portion that protrudes outward along the substrate surface of the at least one substrate from the dicing portion and has a cut surface due to a crack formed with a scribe groove as a starting point.

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