JP7399059B2 - Image display panel manufacturing method - Google Patents

Image display panel manufacturing method Download PDF

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JP7399059B2
JP7399059B2 JP2020166081A JP2020166081A JP7399059B2 JP 7399059 B2 JP7399059 B2 JP 7399059B2 JP 2020166081 A JP2020166081 A JP 2020166081A JP 2020166081 A JP2020166081 A JP 2020166081A JP 7399059 B2 JP7399059 B2 JP 7399059B2
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潤一郎 村杉
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Citizen Watch Co Ltd
Citizen Fine Device Co Ltd
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本発明は、画像表示パネルの製造方法に関するものである。 The present invention relates to a method of manufacturing an image display panel.

液晶パネルなどの画像表示パネルは、例えば、シリコンウェハーとガラスウェハーとを接着剤を挟んで貼り合わせた後にそれら二つのウェハーを複数の個片に分断することにより作成される。 An image display panel such as a liquid crystal panel is produced, for example, by bonding a silicon wafer and a glass wafer together with an adhesive in between, and then cutting the two wafers into a plurality of pieces.

ウェハーの分断工程では、主にダイサー、スクライバー等が用いられる。これらを用いてウェハーを分断する際には、例えば、ダイサーのブレードを回転させ、純水で冷却と切削屑の洗い流しを行いながらウェハーの表面を切断してV形状の断面を有する溝を形成した後、溝の最下点にスクライブホイールの先端を押し当てて外力を加えることにより、溝の最下点から基板の内部にクラック(亀裂)を伸展させてウェハーを分断する。(例えば、特許文献1参照) In the wafer dividing process, dicers, scribers, etc. are mainly used. When dividing a wafer using these, for example, the blade of a dicer is rotated, and the surface of the wafer is cut while cooling with pure water and washing away cutting waste, forming grooves with a V-shaped cross section. Thereafter, by pressing the tip of the scribe wheel against the lowest point of the groove and applying an external force, a crack extends into the substrate from the lowest point of the groove, dividing the wafer. (For example, see Patent Document 1)

特許第4133475号公報Patent No. 4133475

図3(a)~(c)は、それぞれ、従来技術における画像表示パネルの製造方法の一例を示す上面図、A-A断面図、A-A断面図の一部拡大図である。図3に示す従来技術における画像表示パネルの製造方法では、ウェハー状態の第一基板2と第二基板3とを画素領域4を囲むように配置された接着剤を挟んで貼り合わせた後、ダイサーを用いて第一基板2をx方向とy方向へ格子状に切断して分断し、次に、ダイサーを用いて第二基板3の表面をx方向とy方向へ格子状に切断してV形状の断面を有する溝6を形成し、次に、溝6の最下点にスクライブホイール8の先端を押し当てながらスクライブホイール8をx方向とy方向へ移動させて第二基板3に外力を加えることにより、溝6の最下点から真下へ向かって第二基板3の内部にクラックCを伸展させて第二基板3を格子状に分断している。 FIGS. 3A to 3C are a top view, an AA cross-sectional view, and a partially enlarged view of an AA cross-sectional view, respectively, showing an example of a conventional method for manufacturing an image display panel. In the method for manufacturing an image display panel in the prior art shown in FIG. Using a dicer, the first substrate 2 is cut in a grid pattern in the x and y directions, and then the surface of the second substrate 3 is cut in a grid pattern in the x and y directions using a dicer. A groove 6 having a cross section of the same shape is formed, and then an external force is applied to the second substrate 3 by moving the scribe wheel 8 in the x direction and the y direction while pressing the tip of the scribe wheel 8 against the lowest point of the groove 6. By adding cracks C1 to the inside of the second substrate 3 extending directly below from the lowest point of the groove 6, the second substrate 3 is divided into a grid pattern.

しかし、この製造方法では、スクライブホイール8により第二基板3を分断した際に、溝6の最下点から真下へクラックCが伸展せずに、溝6の最下点から右側へ斜めにクラックCが伸展する、あるいは、溝6の最下点から左側へ斜めにクラックCが伸展することがあり、第二基板3の安定した断面形状が得られなかった。特に左側へクラックCが伸展すると、第二基板3の断面が左側へ突出し、第一基板2の電極端子7に近接することがあった。第二基板3の断面が電極端子7に近接すると、第二基板3の断面が電極端子7に接続されるワイヤーやFPCと干渉してしまう恐れがある。この問題は、第二基板3の安定した断面形状が得られないことにより生じる問題の一例に過ぎず、第一基板2に電極端子7が設けられていない場合などのその他の場合にも何らかの問題が生じることがある。 However, in this manufacturing method, when the second substrate 3 is divided by the scribe wheel 8, the crack C1 does not extend directly downward from the lowest point of the groove 6, but instead extends diagonally to the right from the lowest point of the groove 6. The crack C2 sometimes extended, or the crack C3 sometimes extended diagonally to the left from the lowest point of the groove 6, and a stable cross-sectional shape of the second substrate 3 could not be obtained. In particular, when the crack C3 extended to the left, the cross section of the second substrate 3 sometimes protruded to the left and came close to the electrode terminal 7 of the first substrate 2. If the cross section of the second substrate 3 comes close to the electrode terminal 7, there is a risk that the cross section of the second substrate 3 will interfere with the wire or FPC connected to the electrode terminal 7. This problem is only one example of the problem caused by not being able to obtain a stable cross-sectional shape of the second substrate 3, and may also occur in other cases such as when the first substrate 2 is not provided with the electrode terminal 7. may occur.

本発明は、以上の問題に鑑みてなされたものであり、基板の安定した断面形状を得ることが可能な画像表示パネルの製造方法を提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing an image display panel that allows a stable cross-sectional shape of a substrate to be obtained.

基板の表面に溝を形成する工程と、前記溝の最下点を避けた位置に設けられた前記溝の内面に応力を加えることにより、前記基板の内部にクラックを伸展させて前記基板を分断する工程と、を有する画像表示パネルの製造方法とする。 The step of forming a groove on the surface of the substrate and applying stress to the inner surface of the groove provided at a position avoiding the lowest point of the groove causes a crack to extend inside the substrate and divide the substrate. A method of manufacturing an image display panel includes the steps of:

前記溝は、V形状の断面を有する画像表示パネルの製造方法であっても良い。 In the method for manufacturing an image display panel, the groove may have a V-shaped cross section.

前記基板は、互いに貼り合わされた第一基板と第二基板とで構成され、前記第一基板と前記第二基板のうち一方には、前記溝が形成され、他方には、前記溝と近接する電極端子が形成され、前記溝の前記内面のうち前記電極端子と近接する内面に前記応力を加える画像表示パネルの製造方法であっても良い。 The substrate is composed of a first substrate and a second substrate that are bonded to each other, and one of the first substrate and the second substrate has the groove formed therein, and the other substrate has the groove formed therein, and the other substrate is adjacent to the groove. The method for manufacturing an image display panel may be one in which an electrode terminal is formed and the stress is applied to an inner surface of the groove that is close to the electrode terminal.

本発明によれば、基板の安定した断面形状を得ることが可能な画像表示パネルの製造方法を提供することができる。 According to the present invention, it is possible to provide a method for manufacturing an image display panel that allows a stable cross-sectional shape of a substrate to be obtained.

本発明における画像表示装置の一実施例を示す上面図A top view showing an embodiment of an image display device according to the present invention 本発明における画像表示装置の一実施例を示すA-A断面図AA sectional view showing one embodiment of the image display device according to the present invention 本発明における画像表示パネルの製造方法の一実施例を示す上面図A top view showing an embodiment of the method for manufacturing an image display panel according to the present invention 本発明における画像表示パネルの製造方法の一実施例を示すA-A断面図AA sectional view showing an embodiment of the method for manufacturing an image display panel according to the present invention 本発明における画像表示パネルの製造方法の一実施例を示すA-A断面図の一部拡大図A partially enlarged view of the AA sectional view showing an embodiment of the method for manufacturing an image display panel according to the present invention 従来技術における液晶表示パネルの製造方法の一例を示す上面図A top view showing an example of a conventional method for manufacturing a liquid crystal display panel. 従来技術における液晶表示パネルの製造方法の一例を示すA-A断面図AA sectional view showing an example of a method for manufacturing a liquid crystal display panel in the conventional technology 従来技術における液晶表示パネルの製造方法の一例を示すA-A断面図の一部拡大図A partially enlarged view of an AA cross-sectional view showing an example of a method for manufacturing a liquid crystal display panel in the conventional technology

図1(a)、(b)は、それぞれ、本発明における画像表示装置の一実施例を示す上面図、A-A断面図である。この実施例における画像表示装置1は、画像表示パネル5と、回路基板9とを備えている。画像表示パネル1は、反射電極などの画素電極が形成された画素領域4を有するシリコン基板から成る第一基板2と、それに相対する表面にITO電極などの対向電極が形成されたガラス基板から成る第二基板3とを、所定の位置および間隔で、画素領域4を囲むように配置された接着剤を挟んで貼り合せることで形成された第一基板2と第二基板3との間の隙間に液晶が封入された液晶表示パネルである。 FIGS. 1(a) and 1(b) are a top view and an AA cross-sectional view, respectively, showing an embodiment of an image display device according to the present invention. The image display device 1 in this embodiment includes an image display panel 5 and a circuit board 9. The image display panel 1 consists of a first substrate 2 made of a silicon substrate having a pixel region 4 on which a pixel electrode such as a reflective electrode is formed, and a glass substrate on the opposite surface of which a counter electrode such as an ITO electrode is formed. A gap between the first substrate 2 and the second substrate 3 formed by bonding the second substrate 3 at a predetermined position and interval with an adhesive placed so as to surround the pixel area 4. This is a liquid crystal display panel with liquid crystal sealed inside.

画像表示パネル1は、回路基板9の上面に粘着テープを介して搭載されている。第一基板2の上面に設けられた電極端子7と回路基板9の上面に設けられた電極端子10とはワイヤー11で電気的に接続され、そこを介して液晶の駆動電圧が画素領域4に供給される。ワイヤー11とその周囲は、シリコン系樹脂などで構成される保護樹脂12で覆われて保護されている。第二基板3の下面に設けられた対向電極と回路基板9の上面に設けられた別の電極端子とは導電性接着剤13で電気的に接続され、そこを介して液晶の駆動電圧が対向電極に供給される。 Image display panel 1 is mounted on the upper surface of circuit board 9 via adhesive tape. The electrode terminal 7 provided on the upper surface of the first substrate 2 and the electrode terminal 10 provided on the upper surface of the circuit board 9 are electrically connected by a wire 11, and the driving voltage of the liquid crystal is applied to the pixel area 4 through the wire 11. Supplied. The wire 11 and its surroundings are protected by being covered with a protective resin 12 made of silicone resin or the like. The counter electrode provided on the bottom surface of the second substrate 3 and another electrode terminal provided on the top surface of the circuit board 9 are electrically connected by a conductive adhesive 13, and the drive voltage of the liquid crystal is applied to the counter electrode via the conductive adhesive 13. supplied to the electrodes.

図2(a)~(c)は、それぞれ、本発明における画像表示パネルの製造方法の一実施例を示す上面図、A-A断面図、A-A断面図の一部拡大図である。画像表示パネル1を作成する際には、ウェハー状態の第一基板2と第二基板3とを画素領域4を囲むように配置された接着剤を挟んで貼り合わせた後、ダイサーを用いて第一基板2をx方向とy方向へ格子状に切断して分断し、次に、ダイサーを用いて第二基板3の表面をx方向とy方向へ格子状に切断してV形状の断面を有する溝6を形成する。この時、溝6の内面には、最下点よりも左側に位置する第一の斜面6aと、最下点よりも右側に位置する第二の斜面6bとが形成される。ここで、「右側」は、x方向又はy方向へ向かって右側であることを意味し、「左側」は、x方向又はy方向へ向かって左側であることを意味する。 2A to 2C are a top view, an AA sectional view, and a partially enlarged view of an AA sectional view, respectively, showing an embodiment of the method for manufacturing an image display panel according to the present invention. When creating the image display panel 1, a first substrate 2 and a second substrate 3 in the form of wafers are bonded together with an adhesive placed so as to surround the pixel area 4, and then a dicer is used to bond the first substrate 2 and the second substrate 3 together using a dicer. One substrate 2 is cut into pieces in a grid pattern in the x and y directions, and then a dicer is used to cut the surface of the second substrate 3 in a grid pattern in the x and y directions to obtain a V-shaped cross section. A groove 6 having a groove 6 is formed. At this time, a first slope 6a located on the left side of the lowest point and a second slope 6b located on the right side of the lowest point are formed on the inner surface of the groove 6. Here, the "right side" means the right side toward the x direction or the y direction, and the "left side" means the left side toward the x direction or the y direction.

次に、溝6の最下点から左側へ僅かにずれた位置の第一の斜面6aにスクライブホイール8の先端を押し当てながらスクライブホイール8をx方向とy方向へ移動させて第二基板3に外力を加えることにより、溝6の第一の斜面6aから最下点の真下へ向かって斜めに第二基板3の内部にクラックCを伸展させて第二基板3を格子状に分断する。 Next, the scribe wheel 8 is moved in the x direction and the y direction while pressing the tip of the scribe wheel 8 against the first slope 6a at a position slightly shifted to the left from the lowest point of the groove 6, and the second substrate 3 is moved. By applying an external force to the groove 6, a crack C4 is extended diagonally into the second substrate 3 from the first slope 6a of the groove 6 toward just below the lowest point, and the second substrate 3 is divided into a grid pattern. .

クラックは、第二基板2の厚さが最も小さい溝6の最下点の真下へ向かって伸展する傾向があるため、スクライブホイール8の先端を溝6の最下点を避けた所定の位置に押し当てることにより、クラックが伸展する方向、即ち、第二基板3の断面形状を制御することができる。なお、溝6の第二の斜面6bにスクライブホイール9を押し当てると、電極端子7に近づく方向へクラックは伸展する。 Since cracks tend to extend directly below the lowest point of the groove 6 where the thickness of the second substrate 2 is the smallest, the tip of the scribe wheel 8 is placed at a predetermined position avoiding the lowest point of the groove 6. By pressing, the direction in which the crack extends, that is, the cross-sectional shape of the second substrate 3 can be controlled. Note that when the scribe wheel 9 is pressed against the second slope 6b of the groove 6, the crack extends in the direction closer to the electrode terminal 7.

この実施例では、電極端子7から遠ざかる方向へクラックCが伸展するため、第二基板3の断面が電極端子7の近傍にまで突出することは無く、電極端子7に接続されるワイヤー11と第二基板3の断面との干渉が防止される。また、クラックCの左側に位置する第二基板3の端部は、隣接する画像表示パネル5の導電性接着剤13が塗布される部位であり、クラックCが右側へ伸展することで右側へ拡張されるため、導電性接着剤13の塗布領域が広がり、電気的接続の信頼性向上に繋がる。 In this embodiment, since the crack C4 extends in the direction away from the electrode terminal 7, the cross section of the second substrate 3 does not protrude to the vicinity of the electrode terminal 7, and the wire 11 connected to the electrode terminal 7 Interference with the cross section of the second substrate 3 is prevented. Further, the end of the second substrate 3 located on the left side of the crack C4 is the part where the conductive adhesive 13 of the adjacent image display panel 5 is applied, and as the crack C4 extends to the right, Therefore, the application area of the conductive adhesive 13 is expanded, leading to improved reliability of electrical connection.

なお、この実施例では、x方向とy方向の両方について図2(c)に示すクラックCによる分断方法を適用しているが、y方向については図3(c)に示す従来技術と同様のクラックC~Cによる分断方法を適用しても良い。また、クラックCによる分断方法は、分断領域の一部のみに選択的に適用しても良い。また、第一基板2に対してクラックCによる分断方法を適用しても良い。また、第一基板2と第二基板3は、互いに貼り合わされる前にそれぞれ分断されても良い。 In this example, the dividing method using the crack C4 shown in FIG. 2(c) is applied in both the x-direction and the y-direction, but in the y-direction, the same method as the conventional technique shown in FIG. 3(c) is applied. The dividing method using cracks C 1 to C 3 may also be applied. Further, the dividing method using the crack C4 may be selectively applied only to a part of the divided area. Alternatively, a method of dividing the first substrate 2 using cracks C4 may be applied. Further, the first substrate 2 and the second substrate 3 may be separated from each other before being bonded together.

本発明は、この実施例に限定されず、その他種々の形態を取り得る。例えば、本発明は、基板の表面に形成された溝(溝6)の断面が半円形状や階段形状である場合などにも適用することが可能である。また、本発明は、基板の表面に形成された溝(溝6)の内面にブレードの先端を衝突させた際に衝撃により基板の内部にクラックを進展させて基板を分断する場合などにも適用することが可能である。また、本発明は、画像表示パネルが有機ELパネルである場合などにも適用することが可能である。 The present invention is not limited to this embodiment, and may take various other forms. For example, the present invention can be applied to cases where the cross section of the groove (groove 6) formed on the surface of the substrate is semicircular or stepped. The present invention can also be applied to cases where, when the tip of the blade collides with the inner surface of a groove (groove 6) formed on the surface of a substrate, a crack develops inside the substrate due to the impact and the substrate is divided. It is possible to do so. Furthermore, the present invention can be applied to cases where the image display panel is an organic EL panel.

1 液晶表示装置
2 第一基板
3 第二基板
4 画素領域
5 液晶パネル
6 溝
6a 第一の斜面
6b 第二の斜面
7 電極端子
8 スクライブホイール
9 回路基板
10 電極端子
11 ワイヤー
12 保護樹脂
13 導電性接着剤
~C クラック
1 Liquid crystal display device 2 First substrate 3 Second substrate 4 Pixel area 5 Liquid crystal panel 6 Groove 6a First slope 6b Second slope 7 Electrode terminal 8 Scribe wheel 9 Circuit board 10 Electrode terminal 11 Wire 12 Protective resin 13 Conductive Adhesive C 1 to C 4 crack

Claims (3)

基板の表面に斜面を有する溝を形成する工程と、
前記溝の最下点を避けた位置に設けられた前記面に応力を加えることにより、前記斜面から前記最下点の真下へ向かって斜めに前記基板の内部にクラックを伸展させて前記基板を分断する工程と、
を有することを特徴とする画像表示パネルの製造方法。
forming a groove having an inclined surface on the surface of the substrate;
By applying stress to the slope provided at a position avoiding the lowest point of the groove, a crack is extended diagonally into the substrate from the slope toward just below the lowest point, and the substrate is removed. a step of dividing the
A method for manufacturing an image display panel, comprising:
前記溝は、V形状の断面を有し、前記V形状を形成する二つの斜面のうち何れか一方のみの斜面に前記応力を加えることを特徴とする請求項1に記載の画像表示パネルの製造方法。 Manufacturing the image display panel according to claim 1, wherein the groove has a V-shaped cross section, and the stress is applied to only one of two slopes forming the V shape. Method. 前記基板は、互いに貼り合わされた第一基板と第二基板とで構成され、前記第一基板と前記第二基板のうち一方には、前記溝が形成され、他方には、前記溝と近接する電極端子が形成され、前記溝の前記二つの斜面のうち前記電極端子と近接する面に前記応力を加えることを特徴とする請求項に記載の画像表示パネルの製造方法。 The substrate is composed of a first substrate and a second substrate that are bonded to each other, and one of the first substrate and the second substrate has the groove formed therein, and the other substrate has the groove formed therein, and the other substrate is adjacent to the groove. 3. The method of manufacturing an image display panel according to claim 2 , wherein an electrode terminal is formed and the stress is applied to one of the two slopes of the groove that is close to the electrode terminal .
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