JP2012193080A - Break method and break apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a break method for manufacturing a plurality of liquid crystal devices of high quality from a mother substrate; and to provide a break apparatus.SOLUTION: The method includes: a step of forming scribe lines 71 on a surface of an opposite side mother substrate 42; a step of breaking the opposite side mother substrate 42 along the scribe lines 71 by tapping the surface of the element-side mother substrate 41 with a center-convex break bar 65a the center portion of which comes into contact with an element-side mother substrate 41 ahead of the periphery portion thereof; a step of forming scribe lines on a surface of the element-side mother substrate 41; and a step of breaking the element-side mother substrate 41 along the scribe lines by tapping the surface of the opposite side mother substrate 42 with a center-concave break bar the periphery portion of which comes into contact with the opposite side mother substrate 42 ahead of the center portion thereof.

Description

  The present invention relates to a break method and a break device for breaking a mother substrate.

  As the break device described above, for example, a device as described in Patent Document 1 is used, and breaks (divides) a pair of mother substrates in which liquid crystal is sandwiched between substrates made of glass substrates, etc. cut.

  The liquid crystal device is formed, for example, such that an external connection terminal for electrical connection with the outside is exposed. More specifically, the external connection terminal is formed in an overhanging portion formed so as to protrude outward in one substrate (for example, an element substrate) of the pair of substrates from the other substrate (for example, a counter substrate). Has been.

  In the break method, first, the counter substrate side is broken. Specifically, a scribe line is formed in a portion corresponding to the base end of the overhang portion in the counter substrate. Next, the pair of substrates are reversed and pressed using a break bar from the element substrate side, and the counter substrate is broken along the scribe line. The break method on the element substrate side is also performed using the same method.

JP 2004-131341 A

  However, when the portion of the counter substrate corresponding to the base end of the overhang portion is broken, only the counter substrate is broken, but a crack is generated from the outer peripheral side of the mother substrate, and as a result, the element substrate is also cracked. There is a problem that cracking occurs.

  Further, after breaking the counter substrate side, the element substrate side is broken. However, there is a case where a break occurs in the vicinity of the outer periphery of the mother substrate by curving from a normal dividing line, and there is a problem that burrs and chips occur.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A break method according to this application example includes a pair of an element-side mother substrate having a plurality of element substrates attached thereto and a counter-side mother substrate having a plurality of opposite substrates attached thereto. A break method for manufacturing a plurality of electro-optical devices by breaking a mother substrate, wherein a facing scribe line forming step for forming a facing scribe line on a surface of the facing mother substrate, and the element side mother substrate First, the counter-side mother substrate is broken along the counter-side scribe line by hitting the surface of the element-side mother board with a center-convex break bar whose central portion comes into contact with the peripheral portion of the element-side mother substrate first. A break step, an element-side scribe line forming step for forming an element-side scribe line on the surface of the element-side mother substrate, and the counter-side mother substrate A second break that breaks the element-side mother substrate along the element-side scribe line by hitting the surface with a center-recessed break bar whose peripheral edge comes in contact with the front side of the center of the counter-side mother substrate. And a process.

  According to this method, in the first break step, when the opposing mother substrate is broken along the opposing scribe line, the middle convex break bar is used, so that it is possible to strike from the center of the mother substrate. It is possible to suppress the occurrence of co-cracking (the element-side mother substrate that is not to be cracked), such as when the outer peripheral side of the conventional mother substrate first hits (hits). In the second break process, when the element-side mother board is broken along the element-side scribe line, a break bar having a concave shape is used, so that the outer peripheral side of the mother board can be hit first, and the planned dividing line Therefore, the occurrence of burrs and chips can be suppressed.

  [Application Example 2] In the break method according to the application example, the element substrate has an overhang portion that protrudes outward from the counter substrate, and the first break step includes the step of forming the overhang portion of the counter mother substrate. It is preferable to break the portion corresponding to the proximal end.

  According to this method, the portion corresponding to the base end of the overhanging portion is broken using the center-convex break bar, so that it is possible to hit in order from the approximate center of the mother substrate toward the peripheral portion. Therefore, it is possible to divide only the opposite-side mother substrate, and to suppress the occurrence of co-cracking that breaks up to the element-side mother substrate.

  Application Example 3 In the break method according to the application example, it is preferable that the second break process is performed after the first break process.

  According to this method, when the opposing mother substrate is broken by the first break step, the strength of the opposing mother substrate (especially the peripheral portion) is weakened and is likely to be unstable. Since the break bar is used to strike from the peripheral portion of the element-side mother substrate, it is possible to break along the planned dividing line and to suppress the occurrence of burrs and chips.

  Application Example 4 In the break method according to the application example, in the first break process, the element-side mother substrate line corresponding to the counter-side scribe line is not a dividing line, but in the second break process. It is preferable that the line of the opposing mother substrate corresponding to the element side scribe line is a dividing line.

  According to this method, since the second break process breaks the common dividing line of the element-side mother substrate and the counter-side mother substrate, for example, even if co-cracking occurs using a concave recess bar, It is possible to suppress adverse effects on the side mother substrate side.

  Application Example 5 In the break method according to the application example described above, it is preferable that the counter-side mother substrate and the element-side mother substrate have a wafer shape.

  According to this method, when a break is performed using a wafer-like mother substrate, the peripheral edge of the mother substrate tends to be bent with respect to the planned dividing line. Since the break bar is used, it is possible to suppress the peripheral portion from being bent and to suppress occurrence of burrs and chips.

  Application Example 6 A break device according to this application example is a break device that manufactures a plurality of electro-optical devices by breaking a pair of mother substrates using a break bar, and the break bar has a convex shape. If the center of the pair of mother substrates is to be broken before the peripheral portion, the center of the pair of mother substrates is used. When it is desired to break the peripheral portion before the portion, it is controlled to use the above-mentioned concave break bar.

  According to this configuration, for example, when the opposite mother substrate of the pair of mother substrates is to be broken, it is possible to strike from the center of the mother substrate by using the middle convex break bar. The occurrence of co-cracking (breaking of the element-side mother substrate that is not to be broken) can be suppressed as in the case where the outer peripheral side of the substrate first hits (hits). In addition, by using a concave break bar, for example, when breaking the element-side mother substrate out of a pair of mother substrates, it is possible to hit the outer peripheral side of the mother substrate first, which causes burrs and chips. It is possible to provide a break device capable of suppressing the above.

FIG. 2 is a schematic plan view illustrating a structure of a liquid crystal device. FIG. 2 is a schematic cross-sectional view taken along line AA ′ of the liquid crystal device illustrated in FIG. 1. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the liquid crystal device. The model perspective view which shows the structure of a pair of mother board | substrate. The top view explaining the division | segmentation planned line which divides | segments a pair of mother board | substrate. (A) is a schematic side view which shows the structure of a break apparatus, (b), (c) is a schematic side view which shows the structure of the break bar which comprises a break apparatus. The schematic perspective view which looked at the structure of the break apparatus from the diagonal direction. 3 is a flowchart showing a manufacturing method and a breaking method of the liquid crystal device according to the first embodiment in the order of steps. FIG. 6 is a schematic cross-sectional view illustrating a part of the steps of the liquid crystal device manufacturing method and the break method. FIG. 6 is a schematic cross-sectional view illustrating a part of the steps of the liquid crystal device manufacturing method and the break method. FIG. 6 is a schematic cross-sectional view illustrating a part of the steps of the liquid crystal device manufacturing method and the break method. 9 is a flowchart showing a method for manufacturing a liquid crystal device according to a second embodiment and a break method in the order of steps. FIG. 6 is a schematic cross-sectional view illustrating a part of the steps of the liquid crystal device manufacturing method and the break method.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

(First embodiment)
<Configuration of electro-optical device>
FIG. 1 is a schematic plan view showing a structure of a liquid crystal device as an electro-optical device. FIG. 2 is a schematic cross-sectional view taken along line AA ′ of the liquid crystal device shown in FIG. Hereinafter, the structure of the liquid crystal device will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, a liquid crystal device 100 includes a TFT active matrix type liquid crystal device using, for example, a thin film transistor (hereinafter referred to as a “TFT (Thin Film Transistor) element”) as a pixel switching element. It is. In the liquid crystal device 100, an element substrate 12 and a counter substrate 13 constituting a pair of substrates are bonded together via a sealing material 14 having a substantially rectangular frame shape in plan view.

  The element substrate 12 and the counter substrate 13 are made of a translucent material such as glass or quartz, for example. The liquid crystal device 100 has a configuration in which a liquid crystal layer 15 is enclosed in a region surrounded by a sealing material 14. The sealing material 14 is provided with an injection port 16 for injecting liquid crystal, and the injection port 16 is sealed with a sealing material 17.

  As the liquid crystal layer 15, for example, a liquid crystal material having a positive dielectric anisotropy is used. In the liquid crystal device 100, a frame light-shielding film 18 having a rectangular frame shape made of a light-shielding material is formed on the counter substrate 13 along the vicinity of the inner periphery of the sealing material 14, and an area inside the frame light-shielding film 18 is formed. It is a display area 19.

  The frame light shielding film 18 is made of, for example, aluminum (Al), which is a light shielding material, and is provided so as to partition the outer periphery of the display region 19 on the counter substrate 13 side.

  In the display area 19, pixel areas 21 are provided in a matrix. The pixel area 21 constitutes one pixel that is the minimum display unit of the display area 19. In addition, the element substrate 12 has an overhang portion 29 in which a region along one side as viewed in plan is overhanging from the counter substrate 13. In the region of the overhang portion 29, a signal line drive circuit 22 and an external connection terminal 23 are formed.

  Further, scanning line driving circuits 24 are formed in the inner region of the sealing material 14 along two sides adjacent to the one side. An inspection circuit 25 is formed on the remaining side of the element substrate 12 (upper side in FIG. 1). The frame light shielding film 18 formed on the counter substrate 13 side is formed, for example, at a position facing the scanning line driving circuit 24 and the inspection circuit 25 formed on the element substrate 12 (in other words, a position overlapping in plan). ing.

  On the other hand, vertical conduction terminals 26 for providing electrical conduction between the element substrate 12 and the counter substrate 13 are disposed at each corner of the counter substrate 13 (for example, four corners of the sealing material 14). Has been.

  As shown in FIG. 2, a plurality of pixel electrodes 27 are formed on the element substrate 12 on the liquid crystal layer 15 side, and a first alignment film 28 is formed so as to cover the pixel electrodes 27. The pixel electrode 27 is a conductive film made of a transparent conductive material such as ITO (Indium Tin Oxide).

  On the other hand, a lattice-shaped light shielding film (BM: black matrix) (not shown) is formed on the liquid crystal layer 15 side of the counter substrate 13, and a flat solid common electrode 31 is formed thereon. A second alignment film 32 is formed on the common electrode 31. The common electrode 31 is a conductive film made of a transparent conductive material such as ITO.

  The liquid crystal device 100 is a transmissive type, and polarizing plates (not shown) and the like are respectively disposed on the light incident side and the light emitting side of the element substrate 12 and the counter substrate 13. The configuration of the liquid crystal device 100 is not limited to this, and may be a reflective type or a transflective type.

  FIG. 3 is an equivalent circuit diagram showing an electrical configuration of the liquid crystal device. Hereinafter, the electrical configuration of the liquid crystal device will be described with reference to FIG.

  As shown in FIG. 3, the liquid crystal device 100 has a plurality of pixel regions 21 that constitute the display region 19. A pixel electrode 27 is disposed in each pixel region 21. A TFT element 33 is formed in the pixel region 21.

  The TFT element 33 is a switching element that controls energization of the pixel electrode 27. A signal line 34 is electrically connected to the source side of the TFT element 33. Image signals S1, S2,..., Sn are supplied to each signal line 34 from, for example, the signal line drive circuit 22 (see FIG. 1).

  A scanning line 35 is electrically connected to the gate side of the TFT element 33. The scanning lines 35 are supplied with scanning signals G1, G2,..., Gm in a pulsed manner at a predetermined timing from, for example, the scanning line driving circuit 24 (see FIG. 1). Further, the pixel electrode 27 is electrically connected to the drain side of the TFT element 33.

  .., Gm supplied from the scanning line 35 causes the TFT element 33 serving as a switching element to be in an ON state for a certain period, so that the image signals S1, S2,. , Sn are written to the pixel region 21 via the pixel electrode 27 at a predetermined timing.

  Image signals S1, S2,..., Sn written in the pixel area 21 are held for a certain period by a liquid crystal capacitor formed between the pixel electrode 27 and the common electrode 31 (see FIG. 2). In order to prevent leakage of the held image signals S1, S2,..., Sn, a storage capacitor 37 is formed between the pixel electrode 27 and the capacitor line.

  Thus, when a voltage signal is applied to the liquid crystal layer 15, the alignment state of the liquid crystal molecules changes according to the applied voltage level. Thereby, the light incident on the liquid crystal layer 15 is modulated to generate image light.

<Configuration of a pair of mother substrates (wafers)>
FIG. 4 is a schematic perspective view showing the structure of a pair of mother substrates (wafers) before cutting out the liquid crystal device. FIG. 5 is a plan view for explaining a dividing line for dividing the pair of mother substrates. Note that the liquid crystal device according to the present embodiment is formed by dividing each component into a single piece after a plurality of components to be a liquid crystal device are integrally formed. That is, the liquid crystal device is formed by a method of performing multi-cavity from a so-called mother substrate.

  Specifically, as shown in FIG. 4, the pair of mother substrates is formed by stacking stacked structures 44 constituting the plurality of element substrates 12 on the element side mother substrate 41 in a matrix, and similarly. A laminated structure constituting a plurality of counter substrates 13 is formed in a matrix on the counter mother substrate 42, and the element mother substrate 41 and the counter mother substrate 42 are bonded to each other through a sealant 14. The

  In this embodiment, each of the mother substrates 41 and 42 has a wafer-like substantially disk shape having an orientation flat (hereinafter referred to as “orientation flat”) 43. The size of the mother substrates 41 and 42 is, for example, 200 mm. The thicknesses of the mother substrates 41 and 42 are, for example, 1.2 mm (element-side mother substrate 41 and counter-side mother substrate 42), respectively.

  In the following description, an axis parallel to the orientation flat 43 on the surface facing the opposing mother substrate 42 is defined as an X axis, and an axis orthogonal to the X axis on the surface is defined as a Y axis. An axis orthogonal to the X axis and the Y axis is taken as a Z axis.

  The plurality of stacked structures 44 formed on the element-side mother substrate 41 are arranged in a matrix along the X-axis and the Y-axis on the surface facing the counter-side mother substrate 42.

  Further, as shown in FIG. 5, when the pair of mother substrates 41 and 42 in a bonded state is viewed in a plane, one side of the outer shape of the counter substrate 13 parallel to the X direction is defined, and A line that defines the base end side is defined as a first dividing line 51 (dividing line). In addition, one side of the element substrate 12 parallel to the X axis is defined, and a line that defines the tip side of the overhanging portion 29 is defined as a second division line 52 (division line). In addition, a line that defines one side of the outer shape parallel to the Y axis is defined as a third scheduled dividing line 53 (divided line).

<Structure of break device>
FIG. 6A is a schematic side view showing the structure of the break device. 6B and 6C are schematic side views showing the structure of the break bar constituting the break device. FIG. 7 is a schematic perspective view of the structure of the break device viewed from an oblique direction. Hereinafter, the structure of the break device will be described with reference to FIGS.

  As shown in FIGS. 6 and 7, the break device 61 is provided with a stage 62. The size of the stage 62 is, for example, 520 mm × 520 mm. The material of the stage 62 is a plywood of a stainless steel plate and a rubber plate.

  The stage 62 is provided with a plurality of openings for sucking and fixing the pair of mother substrates 41 and 42. The plurality of openings are connected to a vacuum circuit (not shown) processed into the stage 62. On the upper part of the stage 62, a pair of mother substrates 41 and 42 to be broken (cut) are placed.

  Further, as shown in FIG. 7, the break device 61 is provided with a frame-like portion 63 that is movable above the stage 62. A break bar 65 that can be moved up and down in parallel with the stage 62 by a cylinder 64 is provided inside the frame-shaped portion 63.

  The descending speed of the break bar 65, the time to stop at the lowest end, the pressure supplied to the cylinder 64 to press the pair of mother boards 41, 42, and the like are adjustable. The break bar 65 is obtained by joining a V-shaped member 67 (for example, urethane rubber) having a V-shaped cross section to the lower surface of a rod-shaped metal member 66. The length of the break bar 65 is, for example, 520 mm. The break bar 65 has a Shore A hardness of 90, for example.

  The break bar 65 has a first break bar 65 a that gradually protrudes toward the center of the V-shaped member 67 and a second break bar 65 b that gradually decreases toward the center of the V-shaped member 67. And have. The height of the convex portion and the depth of the concave portion are, for example, 1 mm.

  The first break bar 65a is used when it is desired to first contact the central portion of the mother substrates 41 and 42 as compared with the peripheral portions of the mother substrates 41 and 42 when the mother substrates 41 and 42 are broken. Further, the second break bar 65b is used when it is desired to contact the peripheral portion first as compared with the central portion of the mother substrates 41 and 42.

  Further, the stage 62 can be rotated every 90 ° by a rotation mechanism. That is, it is possible to break (divide) the mother substrates 41 and 42 with respect to the mother substrates 41 and 42 on which orthogonal scribe lines are formed.

  The break device 61 uses the first convex break bar 65a in the middle of the pair of mother substrates 41 and 42 to break the central portion before the peripheral portion, and the peripheral portion of the pair of mother substrates 41 and 42 from the central portion. If the user wants to break first, control is performed to use the second concave break bar 65b.

<Electro-optical device manufacturing method, break method>
FIG. 8 is a flowchart illustrating a method of manufacturing a liquid crystal device as an electro-optical device and a break method in the order of steps. 9 to 11 are schematic cross-sectional views illustrating some steps of the method for manufacturing the liquid crystal device and the break method. Hereinafter, a method for manufacturing a liquid crystal device and a break method will be described with reference to FIGS.

  First, in step S <b> 11, a plurality of stacked structures 44 are formed at predetermined intervals in the row and column directions on one surface of the element-side mother substrate 41. Specifically, as shown in FIG. 9A, a laminated structure 44 is formed on the surface of the element-side mother substrate 41 using a known manufacturing method. The laminated structure 44 is formed on the element substrate 12 on the liquid crystal layer 15 side, and includes a first alignment film 28, a pixel electrode 27, a scanning line 35, a signal line 34, a capacitor line 36, a TFT element 33, an external connection. A terminal 23 and the like are included.

  In step S12, the element-side mother substrate 41 and the counter-side mother substrate 42 are bonded together. Specifically, as shown in FIG. 9B, an element-side mother substrate 41 on which a stacked structure 44 of a plurality of element substrates 12 is formed and a counter-side mother on which a stacked structure of a plurality of counter substrates 13 is formed. The substrate 42 is bonded through the sealing material 14. The stacked structure formed on the counter-side mother substrate 42 includes the common electrode 31 and the second alignment film 32.

  In step S12, the pair of mother substrates 41 and 42 are bonded together, and liquid crystal is filled between the pair of mother substrates 41 and 42. In the present embodiment, the frame-shaped sealing material 14 is formed on each of the plurality of laminated structures 44, and a predetermined amount of liquid crystal is dropped into a region surrounded by the sealing material 14, and then the opposite-side mother substrate 42 is bonded. A so-called liquid crystal dropping method is used.

  The method of filling the liquid crystal between the element-side mother substrate 41 and the counter-side mother substrate 42 is not limited to the liquid crystal dropping method, and the element-side mother substrate 41 and the counter-side mother substrate 42 are bonded together. A so-called liquid crystal injection method in which liquid crystal is injected from an opening formed in the sealing material 14 and sealed after being cut out in a closed state may be used.

  In step S13 (opposing side scribe line forming step, first break step), a primary break process is performed on the opposing side mother substrate. Specifically, as shown in FIG. 9C, a scribe line 71 as an opposing scribe line is formed on the opposing mother substrate 42 along the first dividing line 51 by a scribe blade (not shown). Form.

  Here, the first dividing line 51 defines one side of the outer shape of the counter substrate 13 and the base end side of the overhang portion 29 when the pair of mother substrates 41 and 42 in a bonded state is viewed in a plan view. Is a line that prescribes

  Next, a crack 72 based on the scribe line 71 of the first dividing line 51 is generated to divide the opposing mother substrate 42 (primary break) (extend the crack 72). For the division, the first break bar 65a in which the center of the V-shaped member 67 is convex is used. As a result, the first break bar 65a can be applied from the vicinity of the center of the opposite-side mother substrate 42, and the occurrence of co-cracking as when hitting from the peripheral edge of the conventional opposite-side mother substrate is suppressed. Can do.

  FIG. 9C shows the arrangement (vertical direction) of the pair of mother boards 41 and 42 in the same manner as the other figures, and the actual processing is performed using the break device 61 shown in FIG. In some cases, the first break bar 65a is disposed above and comes into contact with the element-side mother substrate 41.

  In step S14, dicing is performed on the opposing mother substrate. Specifically, as shown in FIG. 10A, a predetermined depth is formed in the opposing mother substrate 42 along the first dividing line 51, the second dividing line 52, and the third dividing line 53. The groove portion 57 is formed.

  The depth of the groove-like portion 57 is a value smaller than the thickness of the opposing mother substrate 42, and is set so as to leave a thickness (for example, 100 μm) at which the opposing mother substrate 42 is not completely cut. Dicing is performed, for example, in order to obtain dimensional accuracy of the outer shape. Therefore, dicing may not be performed unless high dimensional accuracy is required.

  Here, when the pair of mother substrates 41 and 42 in a plan view are seen in plan view, the second dividing line 52 is defined as two sides parallel to the X axis of the element substrate 12 and one side of the counter substrate 13. And a line that defines the tip end side of the overhang portion 29.

  That is, the tip and the base end of the overhang portion 29 are defined by the first parting line 51 and the second parting line 52. The overlapping portion 58 (see FIG. 10C), which is a region facing the overhang portion 29 in the opposing mother substrate 42, is sandwiched between the crack and the groove-like portion 57.

  In step S15 (element-side scribe line forming process, second break process), the element-side mother substrate 41 is divided (secondary break). Specifically, as shown in FIG. 10B, a scribe line as an element-side scribe line is formed on the element-side mother substrate 41 along a second scheduled dividing line 52 and a third scheduled divided line 53 by a scribe blade (not shown). A line 73 is formed. Next, the element-side mother substrate 41 is divided by generating (extending) a crack 74 having a scribe line 73 formed along the third dividing line 53 as a base point.

  For the division, the second break bar 65b in which the center of the V-shaped member 67 is concave is used. Accordingly, the second break bar 65b can be applied from the peripheral portion of the element-side mother substrate 41, and the break can be made along the planned dividing line, so that occurrence of burrs and chips can be suppressed.

  And after dividing a pair of mother board | substrates 41 and 42 into strip shape, as shown in FIG.10 (c), it divides | segments into the several piece 100a. In this piece 100 a, the overlapping portion 58 extends from the counter substrate 13 in the direction opposite to the protruding portion 29 with respect to the configuration of the liquid crystal device 100 described above.

  In step S16, the superimposing unit 58 is divided. Specifically, as shown in FIG. 11, the overlapping portion 58 is applied to the overlapping portion 58 extending from the facing substrate 13 by applying a force that causes the overlapping portion 58 to be bent at the groove portion 57. Divide from 13. Thereby, the liquid crystal device 100 is cut out from the pair of mother substrates 41 and 42.

  As described above in detail, according to the break method and break device of the first embodiment, the following effects can be obtained.

  (1) According to the break method of the first embodiment, in the primary break (first break process), when the opposing mother substrate 42 is broken along the first dividing planned line 51, the first convex break Since the bar 65a is used, it is possible to strike from the vicinity of the center of the pair of mother boards 41 and 42, and an element that does not want to be cracked, such as when the outer peripheral side of a conventional mother board first hits (hits). It is possible to suppress the occurrence of cracking of the side mother board 41). Further, in the secondary break (second break step), when the element-side mother substrate 41 is broken along the scribe line 73, the second concave break bar 65b is used, so that the peripheral edges of the pair of mother substrates 41, 42 are used. It becomes possible to hit the part first, and it is possible to divide by a line close to the normal severing line, so that the occurrence of burrs and chips can be suppressed.

  (2) According to the break device 61 of the first embodiment, since the two break bars 65, which are the first convex break bar 65a and the second concave break bar 65b, are provided, It is possible to provide a break device 61 that can be efficiently produced without the need to change to a dedicated break bar 65 depending on the type.

(Second Embodiment)
<Electro-optical device manufacturing method, break method>
FIG. 12 is a flowchart illustrating a method of manufacturing a liquid crystal device as an electro-optical device according to the second embodiment and a break method in the order of steps. FIG. 13 is a schematic cross-sectional view illustrating some steps of the method for manufacturing the liquid crystal device and the break method. Hereinafter, a manufacturing method and a breaking method of the liquid crystal device according to the second embodiment will be described with reference to FIGS.

  The break method of the second embodiment is different from that of the first embodiment in the portion where the region of the overhang portion 29 is exposed first in the pair of mother substrates 41 and 42 bonded together. Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified here. Steps S21 to S22 are the same as steps S11 to S12 of the first embodiment.

  In step S23, a primary break process is performed on the opposing mother substrate 42. Specifically, as shown in FIG. 13A, a scribe line 71 is formed on the opposing mother substrate 42 along the first dividing line 51 using a scribe blade (not shown). Next, the opposing mother substrate 42 is divided (primary break) by generating a crack 72 with the scribe line 71 of the first dividing line 51 as a base point.

  As in the first embodiment, the first break bar 65a in which the center of the V-shaped member 67 is convex is used for the division. As a result, the first break bar 65a can be applied from the vicinity of the center of the opposite-side mother substrate 42, and the occurrence of co-cracking as when hitting from the peripheral edge of the conventional opposite-side mother substrate is suppressed. Can do.

  As described above, the first dividing line 51 defines one side of the outer shape of the counter substrate 13 and the overhang portion 29 when the pair of mother substrates 41 and 42 in a bonded state are viewed in a plan view. It is a line which prescribes the base end side.

  In step S24, dicing is performed on the opposing mother substrate. Specifically, as shown in FIG. 13B, a predetermined depth is formed in the opposing mother substrate 42 along the first dividing line 51, the second dividing line 52, and the third dividing line 53. The groove portion 57 is formed.

  Note that as a difference from the first embodiment, the groove portion 57 is diced to a depth that only the second dividing line 52 bites into the element-side mother substrate 41. As a result, the overlapping portion 58 of the opposing mother substrate 42 corresponding to the overhang portion 29 is removed, and the overhang portion 29 is exposed.

  As described above, the second dividing line 52 has two sides parallel to the X axis of the element substrate 12 and the counter substrate 13 when the pair of mother substrates 41 and 42 in a bonded state are viewed in a plan view. And a line that defines the tip side of the overhang portion 29.

  In step S25, the element-side mother board 41 is divided. Specifically, as shown in FIG. 13C, a scribe line 73 is formed on the element-side mother substrate 41 along the second and third dividing lines 52 and 53 with a scribe blade (not shown). Next, a crack 74 with a scribe line 73 formed in the element side mother substrate 41 as a base point is generated, and the element side mother substrate 41 is divided.

  Similar to the first embodiment, the second break bar 65b in which the center of the V-shaped member 67 is concave is used for the division. As a result, the second break bar 65b can be applied from the peripheral edge of the element-side mother substrate 41, and the occurrence of burrs and chips can be suppressed.

  The pair of mother boards 41 and 42 are divided into a plurality of pieces 100a by a break, and a plurality of pieces are picked up using a chip sorter or the like. Thereby, the liquid crystal device 100 is cut out from the pair of mother substrates 41 and 42.

  As described above in detail, according to the break method of the second embodiment, in addition to the effect (1) of the first embodiment, the following effects can be obtained.

  (3) According to the break method of the second embodiment, a plurality of high-quality liquid crystal devices 100 can be manufactured even when a manufacturing facility having a process different from the manufacturing process of the first embodiment is included. .

  In addition, embodiment is not limited above, It can also implement with the following forms.

(Modification 1)
As described above, the break device 61 includes the two break bars 65, which are the first convex break bar 65a having a middle convex shape and the second break bar 65b having a middle concave shape. One break bar 65 may be provided, and a middle convex break bar and a middle concave break bar may be used alternately.

  Alternatively, only one break bar 65 may be used, and only the V-shaped member at the tip may be replaced with a middle convex break bar or a middle concave break bar. Moreover, you may provide the mechanism in which a V-shaped member can be reversed alternately.

(Modification 2)
As described above, the electro-optical device is not limited to the liquid crystal device 100, and may be, for example, an organic EL device or a plasma device.

  DESCRIPTION OF SYMBOLS 12 ... Element substrate, 13 ... Opposite substrate, 14 ... Sealing material, 15 ... Liquid crystal layer, 16 ... Injection port, 17 ... Sealing material, 18 ... Frame light shielding film, 19 ... Display area, 21 ... Pixel area, 22 ... Signal Line drive circuit, 23 ... external connection terminal, 24 ... scanning line drive circuit, 25 ... inspection circuit, 26 ... vertical conduction terminal, 27 ... pixel electrode, 28 ... first alignment film, 29 ... overhang, 31 ... common electrode, 32 ... Second alignment film, 33 ... TFT element, 34 ... Signal line, 35 ... Scanning line, 36 ... Capacitance line, 37 ... Storage capacitor, 41 ... Element-side mother substrate, 42 ... Counter-side mother substrate, 43 ... Oriental flat, 44 ... Laminated structure, 51 ... first dividing line, 52 ... second dividing line, 53 ... third dividing line, 57 ... grooved part, 58 ... overlapping part, 61 ... break device, 62 ... stage, 63 ... Frame-shaped part, 64 ... Cylinder, 65 ... Break bar, 65 ... 1st break bar, 65b ... 2nd break bar, 66 ... Metal member, 67 ... V-shaped member, 71 ... Scribe line as opposed scribe line, 72, 74 ... Crack, 73 ... Scribe as element side scribe line Line, 100 ... Liquid crystal device as electro-optical device, 100a ... Individual piece.

Claims (6)

A plurality of electro-optical devices can be obtained by breaking a pair of mother substrates on which an element-side mother substrate on which a plurality of element substrates are affixed and a counter-side mother substrate on which a plurality of counter substrates are affixed are bonded together A break method to manufacture,
A counter scribe line forming step of forming a counter scribe line on the surface of the counter mother substrate;
Strike the surface of the element-side mother substrate with a middle-convex break bar whose central portion comes in contact with the center of the element-side mother substrate before the peripheral edge portion, and the counter-side mother substrate along the counter-side scribe line A first break step for breaking
An element side scribe line forming step of forming an element side scribe line on the surface of the element side mother substrate;
The element-side mother substrate is struck along the element-side scribe line by striking the surface of the counter-side mother substrate with a concave recess bar whose peripheral part comes in contact first with respect to the center of the counter-side mother substrate. A second break step for breaking
The break method characterized by having. The break method according to claim 1,
The element substrate has a projecting portion that projects outward from the counter substrate,
The first break step breaks a portion corresponding to a base end of the overhang portion in the opposing mother substrate. The break method according to claim 1 or 2,
A break method, wherein the second break step is performed after the first break step. A break method according to any one of claims 1 to 3,
In the first break step, the line on the element side mother substrate corresponding to the opposing scribe line is not a dividing line,
In the second break step, the line on the opposite mother substrate corresponding to the element side scribe line is a dividing line. A break method according to any one of claims 1 to 4,
The opposing mother substrate and the element mother substrate are in the form of a wafer. A break device for manufacturing a plurality of electro-optical devices by breaking a pair of mother substrates using a break bar,
The break bar includes a middle convex break bar and a middle concave break bar,
If you want to break the center part first from the peripheral part in the pair of mother substrates, use the middle convex break bar,
A break device characterized in that when the pair of mother boards want to break the peripheral portion first from the center portion, the break bar having the concave shape is used.

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