JP2010159187A - Method and apparatus for breaking substrate, and breaking bar - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for breaking a substrate, which method prevents the crack formation phenomenon starting at the end portion of a laminated substrate while suppressing the increase in processing time at the time of dividing the laminated substrate. <P>SOLUTION: By the method for breaking the substrate, one pair of mother substrates (201, 202) is divided into each of plural elements (100) arranged in an element formation region (210) in an apparatus (300) for breaking a substrate. The method for breaking a substrate has a breaking process for dividing one pair of mother substrates into each of plural elements by depressing the mother substrates by a breaking bar (330). In the breaking process, the force for depressing at least a part of the element formation region is larger than the force for depressing a peripheral region (220) located in the circumference of the element formation region. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technical field of a substrate break method, a substrate break device, and a break bar in the substrate break device for dividing, for example, a mother substrate on which a scribe line is formed along the scribe line.

  In this type of method, for example, when one mother substrate of the bonded substrates is divided (ie, broken) when the two mother substrates are bonded to each other, the other mother on which no scribe line is formed. It is possible to suppress the occurrence of a phenomenon that breaks up to the substrate simultaneously (so-called co-cracking). For example, in Patent Document 1, a glass substrate to be cut is arranged on a stainless steel substrate arranged on a rubber plate, and a stopper is arranged on the stainless steel substrate and in a portion around the glass substrate. And the technique which prevents a co-cracking phenomenon is described by pressing a stopper with a break bar.

  Alternatively, in Patent Document 2, the groove depth of the scribe line formed on one mother substrate of the bonded substrates is made deeper than the groove depth of the scribe line formed on the other mother substrate. A technique for preventing abnormal cracking of a laminated substrate is described. Alternatively, in Patent Document 3, both sides of the scribe line formed on the lower surface of the bonded substrate are supported by the convex portions formed on the mat on the lower surface of the bonded substrate, and a shocking pressure is applied to the bonded substrate. A technique for preventing the co-cracking phenomenon and the like by lowering the break bar at such a speed as not to be applied is described.

JP 2004-131341 A JP 2003-131185 A Japanese Patent Laid-Open No. 10-330125

  However, in the technique described in Patent Document 1, the state where the glass substrate and the stopper are pressed must be maintained for a certain period of time so that the shape of the rubber plate follows the waviness of the substrate surface of the glass substrate. Then, there is a technical problem that the processing time becomes relatively long. In addition, the technique described in Patent Document 2, that is, there is a technical problem that it is extremely difficult to prevent the co-cracking phenomenon practically only by setting the groove depth of the scribe line.

  Further, in the technique described in Patent Document 3, the substrate surface of the bonded substrate board may be inclined with respect to the movement direction of the break bar depending on the formation accuracy of the convex portions that support the bonded substrate board. Then, there exists a technical problem that a shape defect may arise in the cut surface of a bonded substrate board. Furthermore, the above-described background art has a technical problem that it is extremely difficult to prevent the co-cracking phenomenon starting from the edge of the bonded substrate.

  The present invention has been made in view of the above-mentioned problems, for example, and a substrate break method and a substrate capable of preventing the co-cracking phenomenon starting from the end of the bonded substrate while suppressing an increase in processing time. It is an object to provide a break device and a break bar.

  In order to solve the above problems, the substrate breaking method of the present invention is movable in a direction along a normal direction of the support surface, and a support member having a support surface that supports a pair of mother substrates bonded to each other. A pair of supported mother substrates, including a break bar that presses the supported pair of mother substrates from a side opposite to the side facing the support surface of the pair of supported mother substrates. A substrate breaking method for dividing a mother substrate into a plurality of elements arranged in an element formation region of the pair of supported mother substrates, wherein the supported pair of mother substrates is pressed by the break bar. A break process for dividing each of the plurality of elements, wherein at least a part of the element formation region is pressed in the break process. That force, the force is greater than the peripheral region around the element forming region in the supported pair of mother substrates were is pressed.

  According to the substrate breaking method of the present invention, a substrate breaking device to which the substrate breaking method is applied includes a supporting member that has a supporting surface that supports a pair of mother substrates bonded together, and a normal direction of the supporting surface. A break bar that is movable in the direction and that presses the supported pair of mother substrates from the side opposite to the side facing the support surface of the pair of supported mother substrates. Here, the “direction along the normal direction” means not only a direction parallel to the normal direction but also a direction slightly deviated from the normal direction as long as it can be considered to be along the normal direction in practice. Good.

  In the breaking step, the pair of mother substrates supported by the support member is divided by the plurality of elements arranged in the element formation region of the pair of mother substrates by being pressed by the break bar. Here, the force with which at least a part of the element forming region is pressed is greater than the force with which the peripheral region located around the element forming region in the pair of mother substrates is pressed.

  In addition, the substrate surface facing the support surface of the mother substrate facing the support surface of the support member (that is, the mother substrate not directly pressed by the break bar) of the pair of mother substrates is previously scribed along the planned dividing line. Is applied to form a scribe line.

  The “element formation region” does not mean a region of individual elements, but means an entire region in which a plurality of elements are arranged in a plane. In addition, “the force with which at least a part of the element formation region is pressed is greater than the force with which the peripheral region located around the element formation region in the pair of mother substrates is pressed” means that the scribe pressed by the break bar is used. When a micro-width region extending along a line is further divided into a plurality of micro regions for each micro length, the force that presses one micro region included in the element formation region is included in the peripheral region. This means that each of the micro regions is larger than the maximum value of the pressing force.

  According to the research of the present inventor, for example, the mother board is made thinner in accordance with the demand for downsizing and weight reduction of electronic devices such as mobile phones. Here, as a method for reducing the thickness of the mother substrate, a method of mechanical polishing (ie, polishing) or chemical polishing (ie, etching) is often employed after a pair of mother substrates are bonded together. At this time, in order to prevent the abrasive from entering the pair of mother substrates, the end surfaces of the pair of mother substrates are sealed with a sealing agent such as an ultraviolet curable resin.

  The co-cracking phenomenon occurs relatively often when a pair of mother substrates having a thin mother substrate is broken. In particular, a relatively large number of co-cracking phenomena starting from the end faces of a pair of mother substrates occur. This is because the sealant penetrates into the pair of mother substrates, and the pair of mother substrates is in close contact (that is, there is no space between the pair of mother substrates), and when the break occurs, the break bar directly It is considered that this is because the mother substrate that is not pressed becomes difficult to break.

  As a method for preventing the co-cracking phenomenon, for example, there is a method of relatively weakening the force pressed by the break bar. However, the pressing force must be optimized for each substrate to be broken in order to prevent cracking of the mother substrate on which the scribe line is formed, a defective shape of the cut surface, and the like. It is desirable to increase the break pressure in order to prevent crack residue and cut shape defects, but if the pressure is increased too much, the probability of co-cracking increases (that is, there is a trade-off relationship), so optimization is very high. difficult.

  However, in the present invention, in the breaking step, the pair of mother substrates supported by the support member are separated by the break bar so that the force with which at least a part of the element forming region is pressed is greater than the force with which the peripheral region is pressed. Pressed. For this reason, it is possible to prevent the co-cracking phenomenon starting from the end surfaces of the pair of mother substrates. In addition, the force for pressing at least a part of the element formation region only needs to be larger than the force for pressing the peripheral region, and it is not necessary to set the pressing force strictly. (That is, the margin can be increased).

  As in the present invention, in the breaking process, in order to make the force that presses at least a part of the element forming region larger than the force that presses the peripheral region, for example, the length of the break bar in the longitudinal direction is set to a pair. What is necessary is just to make it shorter than the diameter of a mother board | substrate. Or what is necessary is just to form a break bar so that the center part of the longitudinal direction of a break bar may protrude toward a supporting member.

  In addition, it has been found by the inventor's research that the peripheral area may become difficult to break along the formed scribe line because the force with which the peripheral area is pressed becomes relatively small. Is not used as a product, so there is no problem.

  In one aspect of the substrate breaking method of the present invention, the first length that is the length of the break bar in the longitudinal direction is shorter than the second length that is the length of the supported mother substrate along the longitudinal direction. And it is more than 3rd length which is the length of the said element formation area along the said longitudinal direction.

  According to this aspect, it is possible to make the force for pressing at least a part of the element formation region larger than the force for pressing the peripheral region in the break process relatively easily. In addition, since the length of the break bar in the longitudinal direction is equal to or longer than the length of the element formation region along the longitudinal direction, the element formation region to be broken can be normally broken, which is very advantageous in practice. is there.

  In another aspect of the substrate break method of the present invention, in the cross section obtained by cutting the break bar by a plane including a vector along a longitudinal direction of the break bar and a normal vector of the support surface, the break bar is the support It has a protrusion that protrudes toward the surface.

  According to this aspect, it is possible to make the force for pressing at least a part of the element formation region larger than the force for pressing the peripheral region in the break process relatively easily. In addition, regardless of the size of the substrate to be broken, the force with which at least a part of the element forming region is pressed can be made larger than the force with which the peripheral region is pressed, which is very advantageous in practice.

  In another aspect of the substrate breaking method of the present invention, the break bar may have the break bar in a cross-section obtained by cutting the break bar by a plane including a vector along a longitudinal direction of the break bar and a normal vector of the support surface. Curvature imparting means capable of making the side of the bar facing the support surface into a curve that swells toward the support surface.

  According to this aspect, it is possible to make the force for pressing at least a part of the element formation region larger than the force for pressing the peripheral region in the break process relatively easily. In addition, since the curvature can be changed for each substrate to be broken, for example, a plurality of types of substrates can be processed in one substrate breaking device, which is very advantageous in practice.

  In another aspect of the substrate breaking method of the present invention, the support surface corresponds to at least the element formation region when viewed in plan on the support surface, and the area of the support surface is the pair of supported mother substrates. Is smaller than the area.

  According to this aspect, it is possible to make the force for pressing at least a part of the element formation region larger than the force for pressing the peripheral region in the break process relatively easily. Note that “when viewed in plan on the support surface, the support surface corresponds to at least the element formation region” means that the pair of mother substrates is placed on the support surface of the support member and is flat on the support surface. From a specific viewpoint, this means that at least an element formation region is included in the support surface.

  In order to solve the above problems, the substrate breaker of the present invention is a substrate breaker that divides a pair of mother substrates bonded together into a plurality of elements arranged in an element formation region of the pair of mother substrates. A support member having a support surface for supporting the pair of mother substrates; and a movable member that is movable in a direction along a normal direction of the support surfaces; A break bar that is pressed from a side opposite to the side facing the support surface of the mother substrate, and the force by which at least a part of the element forming region is pressed is applied to the element in the pair of supported mother substrates. The peripheral area located around the formation area is larger than the pressing force.

  According to the substrate breaking apparatus of the present invention, as in the above-described substrate breaking method of the present invention, the co-cracking phenomenon starting from the end surfaces of the pair of mother substrates can be prevented, and the processing time can be made relatively short. be able to.

  Note that the substrate breaker of the present invention can also employ various aspects of the above-described substrate break method of the present invention.

  In order to solve the above problems, the break bar of the present invention is a break in a substrate breaker that divides a pair of mother substrates bonded together into a plurality of elements arranged in an element formation region of the pair of mother substrates. The bar is configured such that a force that presses at least a part of the element formation region is greater than a force that presses a peripheral region located around the element formation region in the pair of mother substrates.

  According to the break bar of the present invention, the force that presses at least a part of the element formation region in the pair of mother substrates is configured to be greater than the force that presses the peripheral region in the pair of mother substrates. For this reason, if the break bar is applied to the substrate breaker, it is possible to prevent the co-cracking phenomenon starting from the end surfaces of the pair of mother substrates, and to relatively shorten the processing time.

  The break bar of the present invention can also employ various aspects of the above-described substrate break method of the present invention.

  The effect | action and other gain of this invention are clarified from the form for implementing demonstrated below.

It is a perspective view of the board | substrate breaking apparatus which concerns on 1st Embodiment. It is a front view which shows the principal part of the board | substrate breaking apparatus which concerns on 1st Embodiment. It is the top view which looked at the bonding substrate concerning a 1st embodiment in plane. FIG. 4 is a cross-sectional view taken along line AA ′ in FIG. 3. It is the top view which looked at the TFT array substrate concerning a 1st embodiment from the counter substrate side with each component formed on it. It is the HH 'sectional view taken on the line of FIG. It is a schematic diagram which shows typically the shape of the bonded substrate board in the break process which concerns on 1st Embodiment. It is a front view which shows the break bar which concerns on 2nd Embodiment. It is a front view which shows the break bar which concerns on the modification of 2nd Embodiment. It is a front view which shows the break bar which concerns on 3rd Embodiment. It is a front view which shows the principal part of the board | substrate breaking apparatus which concerns on 4th Embodiment. It is the top view which looked at the bonding board | substrate and board | substrate supporting member which concern on 4th Embodiment in the planar view seen from the bonding board | substrate side. It is the bottom view which looked at the break bar concerning a 5th embodiment from the bottom side of the break bar.

  Embodiments of a substrate breaker according to the present invention will be described below with reference to the drawings. In the following drawings, the scale is different for each layer / member so that each layer / member can be recognized on the drawing.

<First Embodiment>
A substrate breaker according to a first embodiment of the present invention will be described with reference to FIGS.

(Configuration of substrate breaker)
In FIG. 1, a substrate breaker 300 includes a table 310, a substrate support member 320 as an example of a “support member” according to the present invention, a break bar 330, and a cylinder 340. FIG. 1 is a perspective view of the substrate breaker according to the present embodiment, and FIG. 2 is a front view showing the main part of the substrate breaker according to the present embodiment.

  The table 310 can move along the Y-axis direction in FIG. 1 and can be rotated exactly 90 degrees in the XY plane by a rotation mechanism (not shown). The substrate support member 320 includes a stainless plate 321 and a rubber plate 322. FIG. 1 shows a state in which a bonded substrate 200 made of a pair of mother substrates bonded to each other is placed on the substrate support member 320.

  The break bar 330 includes a rubber part 331 and a support part 332. The break bar 330 can be moved along the Z-axis direction in the figure by a cylinder 340 and can press the bonded substrate 200 from above the bonded substrate 200. The “upper surface 322a” and the “Z-axis direction” of the rubber plate 322 according to this embodiment are examples of the “support surface” and the “normal direction of the support surface” according to the present invention, respectively.

(Structure of bonded substrate)
Next, the bonded substrate 200 will be described with reference to FIGS. FIG. 3 is a plan view of the bonded substrate substrate according to the present embodiment as viewed in plan, and FIG. 4 is a cross-sectional view taken along the line AA ′ of FIG. In addition, the dotted line in FIG. 3 represents the scribe line.

  As shown in FIGS. 3 and 4, the bonded substrate 200 is configured to include mother substrates 201 and 202 arranged to face each other. A plurality of liquid crystal devices 100 are arranged in an element formation region 210 (region surrounded by a broken line a in FIG. 3) in the bonded substrate 200. At least a part of the peripheral region 220 located between the mother substrates 201 and 202 and around the element forming region 210 in the bonded substrate 200 is sealed with a sealing agent 230 such as an ultraviolet curable resin.

(Configuration of liquid crystal device)
Next, a liquid crystal device 100 as an example of the “element” according to the present invention will be described with reference to FIGS. 5 and 6. In this embodiment, a TFT (Thin Film Transistor) active matrix driving type liquid crystal device with a built-in driving circuit is taken as an example.

  5 and 6, in the liquid crystal device 100, the TFT array substrate 10 and the counter substrate 20 are arranged to face each other. FIG. 5 is a plan view of the TFT array substrate as viewed from the side of the counter substrate together with each component formed thereon, and FIG. 6 is a cross-sectional view taken along the line HH ′ of FIG.

  The TFT array substrate 10 is made of a substrate such as a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of a substrate such as a quartz substrate or a glass substrate. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20. The TFT array substrate 10 and the counter substrate 20 are bonded to each other by a sealing material 52 disposed in a sealing region 52a located around the image display region 10a.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or an ultraviolet / heat combination curable resin for bonding the two substrates, and is applied to the TFT array substrate 10 in the manufacturing process, and then irradiated with ultraviolet rays. And cured by heating or the like. In the peripheral area located around the image display area 10a and the image display area 10a, a gap such as a glass fiber or a glass bead for setting a distance (that is, a gap) between the TFT array substrate 10 and the counter substrate 20 to a predetermined value. The material is arranged. Note that the gap material may be mixed into the seal material 52 in addition to or instead of the material disposed in the image display area 10a or the like.

  In FIG. 5, a light-shielding frame light-shielding film 53 that defines the image display region 10 a is provided on the counter substrate 20 side in parallel with the inside of the seal region 52 a where the seal material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  In the peripheral region, the data line driving circuit 101 and the external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 in a region located outside the sealing region 52 a where the sealing material 52 is disposed. The sampling circuit 7 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. The scanning line driving circuit 104 is provided in the frame region 53a inside the seal region 52a along two sides adjacent to this one side so as to be covered with the frame light shielding film 53.

  On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20. Further, a lead wiring 90 for electrically connecting the external circuit connection terminal 102 to the data line driving circuit 101, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like is formed.

  In FIG. 6, on the TFT array substrate 10, a laminated structure is formed in which pixel switching TFTs as drive elements, wiring lines such as scanning lines and data lines are formed. The plurality of scanning lines and the plurality of data lines are wired so as to intersect with each other, and pixel portions corresponding to the pixels are provided in a matrix corresponding to these intersections. Although the detailed structure of this laminated structure is not shown in FIG. 6, pixel electrodes 9a made of a transparent material such as ITO (Indium Tin Oxide) are provided on the laminated structure in a predetermined pattern for each pixel. It is formed in an island shape.

  The pixel electrode 9a is formed in the image display region 10a on the TFT array substrate 10 so as to face a counter electrode 21 described later. On the surface of the TFT array substrate 10 facing the liquid crystal layer 50, that is, on the pixel electrode 9a, an alignment film 16 is formed so as to cover the pixel electrode 9a.

  A light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. For example, the light shielding film 23 is formed in a lattice shape when viewed in plan on the facing surface of the facing substrate 20. In the counter substrate 20, a non-opening area is defined by the light shielding film 23, and an area partitioned by the light shielding film 23 is an opening area through which light emitted from a direct-viewing backlight is transmitted, for example. The light shielding film 23 may be formed in a stripe shape, and the non-opening region may be defined by the light shielding film 23 and various components such as data lines provided on the TFT array substrate 10 side. In order to perform color display in the image display area 10a, a color filter may be formed in an area including a part of the opening area and the non-opening area.

  On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed so as to face the plurality of pixel electrodes 9a. An alignment film 22 is formed on the counter electrode 21 on the counter surface of the counter substrate 20.

  In addition to the data line driving circuit 101, the scanning line driving circuit 104, the sampling circuit 7 and the like on the TFT array substrate 10 shown in FIGS. 5 and 6, a plurality of data lines are pre-programmed at a predetermined voltage level. A precharge circuit that supplies the charge signal before the image signal, an inspection circuit for inspecting the quality, defects, and the like of the liquid crystal device 100 during manufacture or at the time of shipment may be formed.

(Breaking method for bonded substrates)
When the bonded substrate 200 is divided into the plurality of liquid crystal devices 100 arranged in the element formation region 210 (see FIG. 3) of the bonded substrate 200, first, for example, the substrate surface 201a of the mother substrate 201 (see FIG. 4). ) Is subjected to a scribing process, and a plurality of scribe lines are formed along each of the X axis and the Y axis (see FIG. 3).

  Next, the bonded substrate 200 is turned upside down and placed on the substrate support member 320 (see FIG. 2) of the substrate breaker 300 (ie, the substrate breaker so that the mother substrate 201 is on the lower side). 300 is placed on the substrate support member 320). Subsequently, the mother substrate 201 is divided by the substrate bar 202a (see FIG. 4) of the mother substrate 202 being pressed by the break bar 330 from above the scribe line formed on the substrate surface 201a of the mother substrate 201. The

  Specifically, for example, first, the break bar 330 presses the portion of the substrate surface 202a corresponding to the scribe line along the Y axis formed on the substrate surface 201a. Next, the break bar 330 presses the portion of the substrate surface 202a corresponding to the scribe line along the X axis formed on the substrate surface 201a.

  Next, a scribe process is performed on the substrate surface 202a of the mother substrate 202 to form a plurality of scribe lines. Next, the bonded substrate 200 is turned upside down and placed on the substrate support member 320 of the substrate breaker 300 (that is, the substrate support member of the substrate breaker 300 so that the mother substrate 202 is on the lower side). 320). Subsequently, the mother substrate 202 is divided by pressing the substrate surface 201a of the mother substrate 201 by the break bar 330 along the scribe line formed on the substrate surface 202a of the mother substrate 202.

  Through the above steps, the plurality of liquid crystal devices 100 arranged in the element formation region 210 of the bonded substrate 200 are divided into individual liquid crystal devices 100. The break method is detailed in the above-mentioned Patent Document 3.

  Here, when the mother substrate 201 is divided, the bonded substrate 200 after the portion of the substrate surface 202a corresponding to the scribe line along the Y axis formed on the substrate surface 201a is pressed by the break bar 330. As shown in FIG. 7, the shape is a warped shape.

  FIG. 7 is a schematic diagram schematically showing the shape of the bonded substrate in the breaking process according to the present embodiment. In FIG. 7, for the convenience of explanation, the degree of warping of the bonded substrate 200 is exaggerated from the actual one. In FIG. 7, the vertical lines written on the mother board 201 represent the break surface.

If the bonded substrate 200 is pressed by a break bar longer than the length d ₂ (see FIG. 3) in the longitudinal direction of the bonded substrate 200, the end of the bonded substrate 200 (enclosed by a dotted line in FIG. 7). A relatively strong force is applied to the part). Then, it has been found by the inventor's research that the co-cracking phenomenon starting from the end of the bonded substrate 200 is relatively easy to occur.

However, in the present embodiment, the length d ₁ (see FIG. 2) in the longitudinal direction of the break bar 330 is shorter than the length d ₂ in the longitudinal direction of the bonded substrate 200 and is along the longitudinal direction of the element formation region 210. direction length d ₃ is configured such that _(see FIG. 3) or more. For this reason, the force with which at least a part of the element formation region 210 in the bonded substrate 200 is pressed is greater than the force with which the peripheral region 220 (see FIG. 3) is pressed. In addition, since the length d _{1 in} the longitudinal direction of the break bar 330 is shorter than the length d ₂ in the longitudinal direction of the bonded substrate 200 as described above, the break bar 330 hits the end of the bonded substrate 200. There is no. As a result, it is possible to prevent the co-cracking phenomenon starting from the end of the bonded substrate.

Note that the “length d ₁ ”, “length d ₂ ”, and “length d ₃ ” according to the present embodiment are respectively “first length”, “second length”, and “length” according to the present invention. This is an example of “third length”.

<Second Embodiment>
Next, a second embodiment of the substrate breaker according to the present invention will be described with reference to FIG. The second embodiment is the same as the first embodiment except that the shape of the break bar is different. Therefore, in the second embodiment, the description overlapping with that of the first embodiment is omitted, and the common portions in the drawing are denoted by the same reference numerals, and only fundamentally different points are described with reference to FIG. explain. FIG. 8 is a front view showing the break bar according to the present embodiment.

  In FIG. 8, the rubber part 333 of the break bar 330 according to the present embodiment has a protruding part 333a that protrudes toward the upper surface 322a (see FIG. 2) of the rubber plate 322. In the present embodiment, since the rubber portion 333 of the break bar 330 has the protruding portion 333a, at least a part of the element formation region 210 (see FIG. 3) is pressed when the bonded substrate 200 is divided. The force to be applied can be larger than the force with which the peripheral region 220 (see FIG. 3) is pressed.

  Note that the height h (see FIG. 8) of the protrusion is appropriately set according to the amount by which the break bar 330 is pushed into the bonded substrate 200. Specifically, for example, when the break bar 330 is pushed into the bonded substrate 200 by 0.3 mm (millimeters), the height h of the protrusion 333a is preferably 0.1 mm to 0.15 mm. Further, the length in the longitudinal direction of the break bar 330 according to the present embodiment may be longer than the length in the longitudinal direction of the bonded substrate 200.

<Modification>
Next, a modification of the break bar according to the second embodiment will be described with reference to FIG. FIG. 9 is a front view showing a break bar according to a modification of the second embodiment having the same concept as in FIG.

  As shown in FIG. 9, the outer edge of the protrusion 333 a of the rubber part 333 (line below the rubber part 333 in FIG. 9) in the break bar 330 according to this modification swells toward the upper surface 322 a of the rubber plate 322. It is a curve.

<Third Embodiment>
Next, a third embodiment of the substrate breaker according to the present invention will be described with reference to FIG. The third embodiment is the same as the first embodiment except that the shape of the break bar is different. Accordingly, the description of the third embodiment that is the same as that of the first embodiment is omitted, and common portions in the drawing are denoted by the same reference numerals, and only the points that are basically different are described with reference to FIG. explain. FIG. 10 is a front view showing the break bar according to the present embodiment having the same purpose as FIG.

  In FIG. 10, the break bar 330 according to this embodiment includes a plurality of micrometers 336 having bolt screws 336 a that can adjust the distance between the support portion 332 and the rubber portion 335. The curvature of the rubber part 335 can be changed by the micrometer 336. For this reason, for example, a plurality of types of bonded substrates can be processed in the substrate breaker 300.

  The “micrometer 336” according to the present embodiment is an example of the “curvature imparting unit” according to the present invention. Further, the length in the longitudinal direction of the break bar 330 according to the present embodiment may be longer than the length in the longitudinal direction of the bonded substrate 200.

<Fourth embodiment>
Next, a fourth embodiment of the substrate breaker according to the present invention will be described with reference to FIGS. The fourth embodiment is the same as the first embodiment except that the shape of the substrate support member is different. Accordingly, the description of the fourth embodiment that is the same as that of the first embodiment is omitted, and common portions in the drawings are denoted by the same reference numerals, and only the points that are basically different are shown in FIGS. 11 and 12. The description will be given with reference. FIG. 11 is a front view showing the main part of the substrate breaker according to the present embodiment having the same meaning as in FIG. 2, and FIG. 12 shows the bonded substrate and the substrate support member according to the present embodiment. It is the top view seen planarly seen from the bonded substrate side.

  11 and 12, the area of the substrate support member 320 according to this embodiment is configured to be smaller than the area of the bonded substrate 200 and equal to or larger than the area of the element formation region 210 of the bonded substrate 200. ing. When the bonded substrate 200 is placed on the substrate support member 320, the bonded substrate 200 is arranged so that at least the element formation region 210 is included in the substrate support member 320 in plan view. Placed.

  For this reason, since the substrate support member 320 does not exist at least below the end of the bonded substrate 200, the bonded substrate 200 is formed by the break bar 300 having the rubber portion 337 longer than the length in the longitudinal direction of the bonded substrate 200. Even if pressed, the force applied to the end of the bonded substrate 200 can be made relatively small.

  If the area of the rubber plate 324 of the substrate support member 320 is smaller than the area of the bonded substrate 200 and more than the area of the element formation region 210 of the bonded substrate 200, the stainless steel plate 323 of the substrate support member 320 is used. May be larger than the area of the bonded substrate 200.

<Fifth Embodiment>
Next, a fifth embodiment according to the substrate breaking apparatus of the present invention will be described with reference to FIG. The fifth embodiment is the same as the first embodiment except that the shape of the break bar is different. Accordingly, the description of the fifth embodiment that is the same as that of the first embodiment is omitted, and common portions in the drawing are denoted by the same reference numerals, and only fundamentally different points are described with reference to FIG. explain. FIG. 13 is a bottom view of the break bar according to the present embodiment as viewed from the bottom side of the break bar. In order to emphasize the bottom surface of the break bar 330, the lower surface is hatched in FIG.

  As shown in FIG. 13, the bottom surface of the rubber portion 338 of the break bar 330 according to the present embodiment is such that the width of the bottom surface of the rubber portion 338 near the center of the break bar 330 is equal to the width of the rubber portion 338 at the end of the break bar 330. It is comprised so that it may become smaller than the width | variety of a bottom face. For this reason, when the bonded substrate 200 is divided, the force with which at least a part of the element formation region 210 (see FIG. 3) is pressed is made larger than the force with which the peripheral region 220 (see FIG. 3) is pressed. Can do.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist or concept of the invention that can be read from the claims and the entire specification. A substrate breaker and a break bar are also included in the technical scope of the present invention.

  DESCRIPTION OF SYMBOLS 100 ... Liquid crystal device, 200 ... Bonded substrate, 201, 202 ... Mother substrate, 210 ... Element formation region, 220 ... Peripheral region, 300 ... Substrate break device, 310 ... Table, 320 ... Substrate support member, 330 ... Break bar, 340 ... Cylinder

Claims (7)

A support member having a support surface that supports a pair of mother substrates bonded together, and a movable member that is movable in a direction along a normal direction of the support surface. In the substrate breaker comprising a break bar that is pressed from the opposite side of the mother substrate opposite to the side facing the support surface, the pair of supported mother substrates is changed to an element formation region in the pair of supported mother substrates. A substrate breaking method for dividing each of a plurality of elements arranged in
A step of breaking the plurality of elements by pressing the pair of supported mother substrates by the break bar;
In the breaking step, the force with which at least a part of the element forming region is pressed is greater than the force with which the peripheral region located around the element forming region in the pair of supported mother substrates is pressed. Substrate break method.   The first length which is the length in the longitudinal direction of the break bar is shorter than the second length which is the length of the supported mother substrate along the longitudinal direction, and the element formation region along the longitudinal direction The substrate breaking method according to claim 1, wherein the substrate breaking method is not less than a third length which is the length of the substrate.   In a cross section obtained by cutting the break bar by a plane including a vector along the longitudinal direction of the break bar and a normal vector of the support surface, the break bar has a protrusion that protrudes toward the support surface. The substrate breaking method according to claim 1 or 2, characterized in that   The break bar has a side opposite to the support surface of the break bar in a cross section cut by the plane including a vector along a longitudinal direction of the break bar and a normal vector of the support surface. The substrate breaking method according to claim 1, further comprising a curvature imparting unit capable of forming a curve that swells toward the support surface.   The support surface corresponds to at least the element formation region when viewed in plan on the support surface, and an area of the support surface is smaller than an area of the pair of supported mother substrates. 5. The substrate breaking method according to any one of 1 to 4. A substrate breaker that divides a pair of mother substrates bonded together into a plurality of elements arranged in an element formation region of the pair of mother substrates,
A support member having a support surface for supporting the pair of mother substrates;
Break that is movable in a direction along the normal direction of the support surface and that presses the pair of supported mother substrates from the side opposite to the side facing the support surface of the pair of supported mother substrates. With a bar and
The substrate breaking device characterized in that the force with which at least a part of the element forming region is pressed is larger than the force with which the peripheral region located around the element forming region is pressed in the pair of supported mother substrates. . A break bar in a substrate break device that divides a pair of mother substrates bonded together into a plurality of elements arranged in an element formation region of the pair of mother substrates,
Break that is configured such that a force that presses at least a part of the element formation region is larger than a force that presses a peripheral region that is positioned around the element formation region in the pair of mother substrates. bar.

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