CN113270459B - Organic light-emitting display panel with back light emission, manufacturing method thereof and display device - Google Patents
Organic light-emitting display panel with back light emission, manufacturing method thereof and display device Download PDFInfo
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The application relates to the technical field of organic light-emitting diode display, and discloses a back-side-emitting organic light-emitting display panel, a manufacturing method thereof and a display device, wherein the back-side-emitting organic light-emitting display panel comprises the following components in sequence: the organic light-emitting device comprises an organic light-emitting layer, a back plate layer, a first transparent bonding layer, a quantum dot film, a second transparent bonding layer, a color film layer and a polarizing layer. The display device comprises the organic light-emitting display panel with back light emission. A method for manufacturing a back-side light-emitting organic light-emitting display panel includes the steps of: preparing a back plate layer; forming an organic light-emitting layer on the front surface of the back plate layer; preparing a color film layer; the quantum dot film is adhered between the backboard layer and the color film layer through the first transparent adhesive layer and the second transparent adhesive layer; a polarizing layer is provided. The organic light-emitting display panel capable of emitting back light, the manufacturing method and the display device thereof can improve the color reproduction rate, the color purity and the color representation force, and the formed product is stable, convenient to manufacture and low in cost.
Description
Technical Field
The present invention relates to the field of organic light emitting diode display technology, and in particular, to a back-side-emitting organic light emitting display panel, a method of manufacturing the same, and a display device.
Background
Organic Light-Emitting diodes (OLEDs) are widely used in display devices due to their self-luminescence, wide viewing angle, short reaction time, etc.
The organic light-emitting display panel with back light emission is a display panel manufactured by adopting an organic light-emitting diode technology, and in the existing organic light-emitting display panel with back light emission, light emitted by an organic light-emitting diode is directly displayed on the display panel after passing through a Color Filter and a polarizing layer (Polarizer), and the Color reproduction rate, the Color purity and the Color representation of the display are low.
The foregoing is merely provided to facilitate an understanding of the principles of the present application and is not admitted to be prior art.
Disclosure of Invention
The main purpose of the present application is to provide a back-side-emission organic light-emitting display panel, a manufacturing method thereof and a display device, and aims to solve the technical problems of low color reproduction rate, low color purity and low color representation of the back-side-emission organic light-emitting display panel in the prior art.
To achieve the above object, a back-side light emitting organic light emitting display panel according to the present application includes: an organic light-emitting layer, a back plate layer, a quantum dot film, a color film layer and a polarizing layer; the organic light emitting layer emits light toward the back surface; the back plate layer is arranged on the back surface of the organic light-emitting layer; the quantum dot film is adhered to the back surface of the back plate layer through the first transparent adhesive layer; the color film layer is adhered to the back surface of the quantum dot film through a second transparent adhesive layer; the polarizing layer is arranged on the back surface of the color film layer.
Optionally, the quantum dot film is a monolithic quantum dot film, and is integrally adhered between the back plate layer and the color film layer through the first transparent adhesive layer and the second transparent adhesive layer.
Optionally, the surface of the quantum dot film has a barrier film.
Optionally, the back surface of the back plate layer is provided with a first polyimide layer, and the quantum dot film is adhered to the first polyimide layer through a first transparent adhesive layer; the back of the color film layer is provided with a second polyimide layer, and the polarizing layer is arranged on the second polyimide layer.
Optionally, the first transparent adhesive layer and the second transparent adhesive layer are each formed of optically clear adhesive.
The display device comprises the organic light-emitting display panel with back light emission.
The method for manufacturing the organic light-emitting display panel with back surface light emission comprises the following steps of:
preparing a back plate layer;
forming an organic light-emitting layer on the front surface of the back plate layer, so that the organic light-emitting layer emits light towards the back plate layer;
preparing a color film layer;
bonding the front surface of the quantum dot film with the back surface of the back plate layer through the first transparent bonding layer;
bonding the back surface of the quantum dot film with the front surface of the color film layer through the second transparent bonding layer;
and a polarizing layer is arranged on the back surface of the color film layer, and the polarizing layer can be a polaroid and is adhered to the back surface of the color film layer.
Optionally, the step of preparing the backing layer includes the steps of:
stacking a first polyimide layer on the front surface of the first substrate;
after the step of stacking the first polyimide layer on the front surface of the first substrate is completed, forming an organic thin film transistor layer on the front surface of the first polyimide layer, wherein the back plate layer comprises the first polyimide layer and the organic thin film transistor layer;
before the step of bonding the front surface of the quantum dot film to the back surface of the back plate layer by the first transparent bonding layer, the method further comprises the steps of:
removing the first substrate from the first polyimide layer;
in the step of bonding the front surface of the quantum dot film to the back surface of the back plate layer through the first transparent adhesive layer, the front surface of the quantum dot film is bonded to the first polyimide layer through the first transparent adhesive layer.
Optionally, the step of preparing the color film layer includes the steps of:
superposing a second polyimide layer on the front surface of the second substrate;
after the step of superposing the second polyimide layer on the front surface of the second substrate is completed, forming a color filter layer on the front surface of the second polyimide layer, wherein the color filter layer comprises the second polyimide layer and the color filter layer;
after the step of forming the color filter layer on the front surface of the second polyimide layer is completed, a step of bonding the back surface of the quantum dot film with the front surface of the color filter layer through a second transparent bonding layer is performed, and the back surface of the quantum dot film is bonded on the front surface of the color filter layer through the second transparent bonding layer;
before the step of arranging the polarizing layer on the back surface of the color film layer, the method further comprises the steps of:
removing the second substrate from the second polyimide layer;
in the step of arranging the polarizing layer on the back surface of the color film layer, the polarizing layer is arranged on the second polyimide layer.
Optionally, the color film layer is paved with a plurality of color resistors, and the thickness of the color resistors is determined according to the parameters of the back plate layer luminescence, the parameters of the quantum dot film and the display effect index of the back-side luminescence organic light-emitting display panel.
In the technical scheme, the quantum dot film is arranged between the back plate layer and the color film layer, and light emitted by the organic light-emitting layer is converted by the quantum dot film after passing through the back plate layer and then displayed by the color film layer and the polarizing layer, so that the color reproduction rate, the color purity and the color representation can be improved; when the method is applied to a high dynamic illumination rendering (High Dynamic Range, HDR) technology, wide, fine and accurate color display can be realized according to the brightness level; the quantum dot film is respectively adhered with the back plate layer and the color film layer through the first transparent adhesive layer and the second transparent adhesive layer, so that the problems of low luminous efficiency, short service life, abnormal color, low yield and the like of the quantum dot caused by uneven thickness of the quantum dot layer due to unstable manufacturing process when the quantum dot layer is manufactured by adopting the manufacturing processes such as ink-jet printing and the like can be avoided, the manufacturing process such as ink-jet printing of the quantum dot is not required, the investment can be reduced, and the manufacturing difficulty is low; in addition, through the mode of pasting the quantum dot membrane between backplate layer and various rete, do benefit to and adjust the display effect through adjusting various rete and the chromatic resistance in, to the product that has different display effect index requirements, can satisfy the display effect index through adjusting low cost's various rete, do benefit to and realize the commercialization.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from the structures shown in these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of an embodiment of a back-side-emission organic light-emitting display panel according to the present application;
fig. 2 is a schematic diagram of a first polyimide layer superimposed on a front surface of a first substrate in an embodiment of a method for fabricating a back-side-emission organic light-emitting display panel according to the present application;
FIG. 3 is a schematic diagram of a back-side-emission organic light-emitting display panel according to an embodiment of the method for fabricating a back-side-emission organic light-emitting display panel according to the present invention, wherein a back-side layer and an organic light-emitting layer are sequentially formed on a front side of a first polyimide layer;
FIG. 4 is a schematic diagram of a back plate layer after separating a first substrate from a first polyimide layer in an embodiment of a method for fabricating a back-side-emission organic light-emitting display panel according to the present application;
FIG. 5 is a schematic diagram of a second polyimide layer stacked on a front surface of a second substrate in an embodiment of a method for fabricating a back-side-emission organic light-emitting display panel according to the present invention;
FIG. 6 is a schematic diagram of a back-side-emission organic light-emitting display panel according to an embodiment of the present invention, wherein a color filter layer is formed on the front side of a second polyimide layer;
FIG. 7 is a schematic diagram of a back-side-emission organic light-emitting display panel according to an embodiment of the present disclosure, after forming a second transparent adhesive layer on the front side of the color filter layer;
FIG. 8 is a schematic diagram of a method for manufacturing a back-side-emission organic light-emitting display panel according to an embodiment of the present disclosure, in which the back side of the quantum dot film is bonded to the front side of the color filter layer through a second transparent adhesive layer;
fig. 9 is a schematic diagram of a quantum dot film after forming a first transparent adhesive layer on the front surface of the quantum dot film in an embodiment of a method for manufacturing a back-side light-emitting organic light-emitting display panel according to the present application;
fig. 10 is a schematic diagram of a method for manufacturing a back-side light-emitting organic light-emitting display panel according to an embodiment of the present invention, after adhering the front side of the quantum dot film to the first polyimide layer through the first transparent adhesive layer and before separating the second substrate from the second polyimide layer;
FIG. 11 is a schematic diagram of a method for manufacturing a back-side-emission organic light-emitting display panel according to an embodiment of the present disclosure, in which a second substrate and a second polyimide layer are separated and a polarizing layer is disposed on the back side of a color film layer;
FIG. 12 is a flow chart of an embodiment of a method for fabricating a back-side-emission organic light-emitting display panel according to the present application;
reference numerals illustrate:
the realization, functional characteristics and advantages of the present application will be further described with reference to the embodiments, referring to the attached drawings.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is correspondingly changed.
In the present application, unless explicitly specified and limited otherwise, the terms "coupled," "secured," and the like are to be construed broadly, and for example, "secured" may be either permanently attached or removably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
The application provides a back-side-emitting organic light-emitting display panel, a manufacturing method thereof and a display device, wherein the color reproduction rate, the color purity and the color representation capability can be improved, the thickness of a Quantum Dot Film 300 (Quantum Dot Film) is uniform, the formed product is stable, the yield is high, the luminous efficiency is high, the service life is long, the manufacturing is convenient, and the manufacturing cost is low.
As shown in fig. 1, in an embodiment of the back-side emission organic light emitting display panel proposed in the present application, the back-side emission organic light emitting display panel includes: an organic light emitting Layer 100 (OLED Layer), a Back-plane Layer 200 (Back-plane), a Quantum Dot Film 300 (Quantum Dot Film), a color Film Layer 400 (CF Layer), and a polarizing Layer 500 (Polarizer); the organic light emitting layer 100 emits light toward the rear surface; the back plate layer 200 is disposed on the back surface of the organic light emitting layer 100; the quantum dot film 300 is adhered to the back surface of the back plate layer 200 through the first transparent adhesive layer 710; the color film layer 400 is adhered to the back surface of the quantum dot film 300 through the second transparent adhesive layer 720; the polarizing layer 500 is disposed on the back surface of the color film layer 400.
In the above embodiment, by disposing the quantum dot film 300 between the back plate layer 200 and the color film layer 400, the light emitted by the organic light emitting layer 100 is converted by the quantum dot film 300 after passing through the back plate layer 200, and then displayed by the color film layer 400 and the polarizing layer 500, so that the color reproduction rate, color purity and color representation can be improved; when the method is applied to a high dynamic illumination rendering (High Dynamic Range, HDR) technology, wide, fine and accurate color display can be realized according to the brightness level; the quantum dot film 300 is adhered to the back plate layer 200 and the color film layer 400 through the first transparent adhesive layer 710 and the second transparent adhesive layer 720, so that uneven thickness of the quantum dot layer caused by unstable manufacturing process when the quantum dot layer is manufactured by adopting processes such as ink-jet printing and the like can be avoided, the problems of low luminous efficiency, short service life, abnormal color, low yield and the like of the quantum dot can be avoided, the processes such as ink-jet printing and the like of the quantum dot are not required during manufacturing, investment can be reduced, and manufacturing difficulty is low; in addition, the quantum dot film 300 is adhered between the back plate layer 200 and the color film layer 400, so that the display effect can be adjusted by adjusting the color film layer 400 and the color resistance 4122 therein, and for products with different display effect index requirements, the display effect index can be met by adjusting the color film layer 400 with low cost, thereby being beneficial to realizing the commercialization.
As a further aspect of the above embodiment, the quantum dot film 300 is a monolithic quantum dot film 300, and is integrally adhered between the back sheet layer 200 and the color film layer 400 through the first transparent adhesive layer 710 and the second transparent adhesive layer 720. The color film layer 400 includes: a color filter layer 410; a plurality of Color resistors 4122 (Color filters) are arranged on the Color Filter layer 410 at intervals, all the Color resistors 4122 are in the irradiation range of the light emitted by the whole quantum dot film 300, the properties of each part of the quantum dot film 300 corresponding to each Color resistor 4122, such as the Color, the material and the like, are the same, and the properties of each part of the quantum dot film 300 are not different due to the different Color resistors 4122. The plurality of Color resistors 4122 may be Red Color resistors (Red Color Filter), green Color resistors (Green Color Filter), and blue Color resistors (Blue Color Filter) arranged in this order.
In the further scheme of the embodiment, the quantum dot film 300 is a monolithic quantum dot film 300, and is integrally adhered, so that the bonding is convenient, the difficulty is low, the manufacturing cost of the panel is low, and the thickness uniformity of the quantum dot film 300 can be ensured; all the color resistors 4122 on the color filter layer 410 are in the irradiation range of the light emitted by the monolithic quantum dot film 300, the monolithic quantum dot film 300 converts the light uniformly and emits the light to each color resistor 4122, and each color resistor 4122 receives the same light, so that the overall display effect is good.
As a further solution of the foregoing embodiment, a light shielding structure 4121 is laid between the edge of the color filter layer 410 and two adjacent color resistors 4122, and the light shielding structure 4121 may be a Black Matrix (BM).
In a further aspect of the foregoing embodiment, the light shielding structure 4121 can avoid light leakage, light crosstalk, and the like, thereby improving the display effect.
As a further aspect of the above embodiment, the surface of the quantum dot film 300 has a Barrier film (Barrier film).
In a further aspect of the above embodiment, the surface of the quantum dot film 300 has a barrier film, which can prevent oxygen and moisture from contacting the quantum dots and can protect the quantum dots.
Of course, the surface of the quantum dot film 300 may be provided with no barrier film, and the quantum dot film 300 without barrier film is selected, so that the thickness can be reduced, and the panel is lighter and thinner.
The quantum dot film 300 has a thickness of 50um to 300um. The thickness of the quantum dot film 300 with the barrier film on the surface is 200-300 um; the quantum dot film 300 without barrier film has a thickness of 50um to 100um and is a film with a powder surface.
As a further aspect of the above embodiment, the back side of the back plate layer 200 has a first polyimide layer 220 (PI), and the quantum dot film 300 is adhered to the first polyimide layer 220 through a first transparent adhesive layer 710; the color film layer 400 has a second polyimide layer 420 (PI) on the back surface, and the polarizing layer 500 is disposed on the second polyimide layer 420.
In a further aspect of the above embodiment, by using the first polyimide layer 220 and the second polyimide layer 420 as base layers, in cooperation with the quantum dot film 300, a Flexible (Flexible) or rolled (roller) display panel product can be realized.
Of course, in other embodiments, the first polyimide layer 220 and the second polyimide layer 420 may be replaced with hard transparent plates such as a first transparent glass layer (glass) and a second transparent glass layer (glass), respectively, to form a hard flat display panel product.
As a further aspect of the above embodiment, the first transparent adhesive layer 710 and the second transparent adhesive layer 720 are each formed of an optically clear adhesive (Optically Clear Adhesive, OCA).
In the further scheme of the embodiment, the optical transparent adhesive can maintain the adhesion and transparency of the heterogeneous multi-layer board, has the same light transmittance of 97 percent as that of glass, can play a role in improving the definition of pictures, and is coated with the optical transparent adhesive, so that the operation is simple and the bonding is convenient.
The back plate layer 200 includes a first polyimide layer 220 and an organic thin film transistor layer 210.
The organic thin film transistor layer 210 includes: pixel bank211, pixel 212, planarization layer 213 (OC), protective layer 214 (PAS), interlayer dielectric layer 215 (ILD), gate electrode 216 (Gate), source/drain 219 (SD), insulating layer 217 (GI), oxide semiconductor 218 (IGZO), first Buffer layer 2110 (Buffer), light shielding layer 2111 (Light Shield), and second Buffer layer 2112 (Buffer).
The organic light emitting layer 100 is formed on the pixel bank211 and the pixel 212 on the front side of the organic thin film transistor layer 210, the light emitting layer 140 of the organic light emitting layer 100 is adjacent to the front side of the organic thin film transistor layer 210, and the organic light emitting layer 100 emits light toward the quantum dot film 300.
The front surface of the organic light emitting layer 100 is a Metal Foil 110. The organic light emitting layer 100 includes a metal susceptor 110, a Film encapsulation layer 120 (Film end), a Cathode layer 130 (Cathode), and a light emitting layer 140, which are sequentially disposed from the front side to the back side.
The organic light emitting layer 100 is a blue light organic light emitting layer 100, emits blue light, converts the blue light into white light through the quantum dot film 300, and emits the white light into the color film 400.
The second buffer layer 2112 is provided on the front surface of the first polyimide layer 220.
The color filter layer 410 includes a color resist layer 412 and a filter packaging layer 411, the light shielding structure 4121 and the color resist 4122 are tiled on the color resist layer 412, the color resist layer 412 is disposed on the front surface of the second polyimide layer 420, and the quantum dot film 300 is adhered to the front surface of the filter packaging layer 411 through the second transparent adhesive layer 720.
The polarizing layer 500 may be a polarizer, and is attached to the back surface of the second polyimide layer 420.
In the embodiment of the back-side light-emitting organic light-emitting display panel provided in the present application, the light-emitting layer 140 of the organic light-emitting layer 100 emits blue light, and the blue light passes through the back plate layer 200, the first polyimide layer 220 and the first transparent adhesive layer 710, and is emitted to the quantum dot film 300, and is converted into white light by the quantum dot film 300, and is emitted to the color film layer 400, and the white light is displayed through the polarizing layer 500 after passing through each color resistor 4122.
In an embodiment of the display device, the display device includes the organic light emitting display panel with back surface light emission.
Since the display device provided in the present application adopts all the technical features of the embodiment of the organic light-emitting display panel with back surface light emission, all the advantages brought by the technical scheme of the embodiment of the organic light-emitting display panel with back surface light emission are at least provided, and are not further described herein.
As shown in fig. 1 to 12, in an embodiment of the method for manufacturing a back-side emission organic light emitting display panel according to the present application, the method for manufacturing a back-side emission organic light emitting display panel includes the steps of:
preparing a backing layer 200;
after the step of preparing the back plate layer 200 is completed, forming the organic light emitting layer 100 on the front surface of the back plate layer 200, and causing the organic light emitting layer 100 to emit light toward the back plate layer 200;
preparing a color film layer 400;
after the step of preparing the back sheet layer 200 is completed, the front surface of the quantum dot film 300 is bonded to the back surface of the back sheet layer 200 through the first transparent bonding layer 710; a step of bonding the front surface of the quantum dot film 300 to the back surface of the back plate layer 200 through the first transparent bonding layer 710 may be performed after the step of forming the organic light emitting layer 100 on the front surface of the back plate layer 200 is completed;
after the step of preparing the color film layer 400 is completed, bonding the back surface of the quantum dot film 300 to the front surface of the color film layer 400 through the second transparent bonding layer 720;
after the step of preparing the color film 400 is completed, a polarizing layer 500 is disposed on the back surface of the color film 400, and the polarizing layer 500 may be a polarizer, and is adhered to the back surface of the color film 400.
In the above embodiment, by disposing the quantum dot film 300 between the back plate layer 200 and the color film layer 400, the light emitted by the organic light emitting layer 100 is converted by the quantum dot film 300 after passing through the back plate layer 200, and then displayed by the color film layer 400 and the polarizing layer 500, so that the color reproduction rate, color purity and color representation can be improved; when the method is applied to a high dynamic illumination rendering (High Dynamic Range, HDR) technology, wide, fine and accurate color display can be realized according to the brightness level; the quantum dot film 300 is adhered to the back plate layer 200 and the color film layer 400 through the first transparent adhesive layer 710 and the second transparent adhesive layer 720, so that uneven thickness of the quantum dot layer caused by unstable manufacturing process when the quantum dot layer is manufactured by adopting processes such as ink-jet printing and the like can be avoided, the problems of low luminous efficiency, short service life, abnormal color, low yield and the like of the quantum dot can be avoided, the processes such as ink-jet printing and the like of the quantum dot are not required during manufacturing, investment can be reduced, and manufacturing difficulty is low; in addition, the quantum dot film 300 is adhered between the back plate layer 200 and the color film layer 400, so that the display effect can be adjusted by adjusting the color film layer 400 and the color resistance 4122 therein, and for products with different display effect index requirements, the display effect index can be met by adjusting the color film layer 400 with low cost, thereby being beneficial to realizing the commercialization.
As a further aspect of the above embodiment, in the step of preparing the back sheet layer 200, the steps of:
stacking a first polyimide layer 220 on the front surface of the first substrate 610;
after the step of stacking the first polyimide layer 220 on the front surface of the first substrate 610 is completed, an organic thin film transistor layer 210 (Oxide TFT) is formed on the front surface of the first polyimide layer 220, and the back plate layer 200 includes the first polyimide layer 220 and the organic thin film transistor layer 210;
after the step of forming the organic thin film transistor layer 210 on the front surface of the first polyimide layer 220 is completed, a step of forming the organic light emitting layer 100 on the front surface of the back plate layer 200 is performed, and the organic light emitting layer 100 is formed on the front surface of the organic thin film transistor layer 210 through an Organic Light Emitting Diode (OLED) evaporation, encapsulation (Encap) process and Metal Foil process;
before the step of bonding the front surface of the quantum dot film 300 to the back surface of the back plate layer 200 by the first transparent bonding layer 710, the steps of:
removing the first substrate 610 from the first polyimide layer 220;
in the step of bonding the front surface of the quantum dot film 300 to the back surface of the back plate layer 200 through the first transparent adhesive layer 710, the front surface of the quantum dot film 300 is coated with an optically transparent adhesive to form the first transparent adhesive layer 710, and the front surface of the quantum dot film 300 is bonded to the first polyimide layer 220 through the first transparent adhesive layer 710.
In a further aspect of the above embodiment, the back sheet layer 200 and the organic light emitting layer 100 are prepared on the first substrate 610, and the manufacturing is convenient; before manufacturing the back plate layer 200, the first polyimide layer 220 is stacked on the front surface of the first substrate 610 to serve as a base layer of the back plate layer 200, and before being adhered to the front surface of the quantum dot film 300, the first substrate 610 is removed, so that the first polyimide layer 220 is adhered to the quantum dot film 300, and the flexible or curved display panel product is manufactured.
Of course, in manufacturing the hard flat display panel product, the first substrate 610 may be a transparent substrate, such as a glass substrate, and the organic thin film transistor layer 210 is directly formed on the front surface of the transparent substrate, so as to manufacture the back plate layer 200 including the transparent substrate and the organic thin film transistor layer 210; in the step of bonding the front surface of the quantum dot film 300 to the back surface of the back plate layer 200 through the first transparent bonding layer 710, the front surface of the quantum dot film 300 is directly bonded to the back surface of the first substrate 610 through the first transparent bonding layer 710.
As a further aspect of the foregoing embodiment, the step of preparing the color film layer 400 includes the steps of:
a second polyimide layer 420 is stacked on the front surface of the second substrate 620;
after the step of stacking the second polyimide layer 420 on the front surface of the second substrate 620 is completed, a color filter layer 410 is formed on the front surface of the second polyimide layer 420, and the color filter layer 400 includes the second polyimide layer 420 and the color filter layer 410;
in forming the color filter layer 410, a color resist 4122 and a black pattern (BM) are laid according to the design, a color resist layer 412 is formed, and the color resist layer 412 is encapsulated (Encap) with an organic film, thereby forming a filter encapsulation layer 411.
After the step of forming the color filter layer 410 on the front surface of the second polyimide layer 420 is completed, a step of bonding the back surface of the quantum dot film 300 to the front surface of the color filter layer 400 through the second transparent bonding layer 720 is performed, the front surface of the color filter layer 410 is coated with an optically transparent adhesive to form the second transparent bonding layer 720, and the back surface of the quantum dot film 300 is bonded to the front surface of the color filter layer 410 through the second transparent bonding layer 720;
before the step of disposing the polarizing layer 500 on the back surface of the color film layer 400, the method further includes the steps of:
removing the second substrate 620 from the second polyimide layer 420;
in the step of disposing the polarizing layer 500 on the back surface of the color film 400, the polarizing layer 500 is disposed on the second polyimide layer 420, and when the polarizing layer 500 is a polarizer, it may be adhered to the second polyimide layer 420.
In a further aspect of the above embodiment, the color film layer 400 is prepared on the second substrate 620, which is convenient to manufacture; before the color filter layer 410 is manufactured, the second polyimide layer 420 is first stacked on the front surface of the second substrate 620 to serve as a base layer of the color filter layer 410, and before the polarizing layer 500 is arranged, the second substrate 620 is removed, so that the polarizing layer 500 is arranged on the second polyimide layer 420 and matched with the quantum dot film 300, and a flexible or curved display panel product is manufactured.
Of course, in manufacturing the hard flat display panel product, the second substrate 620 may be a transparent substrate, such as a glass substrate, and the color filter layer 410 is directly formed on the front surface of the transparent substrate, so as to manufacture the color film layer 400 including the transparent substrate and the color filter layer 410; the polarizing layer 500 is disposed on the back surface of the second substrate 620.
As a further aspect of the foregoing embodiment, the color film layer 400 is paved with a plurality of color resistors 4122, and the thickness of the color resistors 4122 is determined according to the parameters of the back plate layer 200 for emitting light, the parameters of the quantum dot film 300, and the display effect index of the organic light emitting display panel for emitting light from the back surface.
In a further aspect of the foregoing embodiment, for products with different display effect indexes, the thickness of the color resistor 4122 can be adjusted to meet the display effect requirement, without adjusting the thickness of the organic light emitting layer 100, the back sheet layer 200 and the quantum dot film 300, the color resistor 4122 is adjusted with low cost and convenient operation.
In one embodiment of the method for manufacturing a back-side emission organic light emitting display panel, the method for manufacturing a back-side emission organic light emitting display panel includes the steps of:
the preparation of the backsheet layer 200 comprises the steps of:
a first polyimide layer 220 is stacked on the front surface of a first substrate 610, and a glass substrate can be selected as the first substrate 610;
after the step of stacking the first polyimide layer 220 on the front surface of the first substrate 610 is completed, the organic thin film transistor layer 210 is formed on the front surface of the first polyimide layer 220, and the back plate layer 200 including the organic thin film transistor layer 210 and the first polyimide layer 220 is manufactured.
After the step of preparing the back sheet layer 200 is completed, the organic light emitting layer 100 is formed on the front surface of the back sheet layer 200 such that the organic light emitting layer 100 emits light toward the back sheet layer 200, comprising the steps of:
after the step of forming the organic thin film transistor layer 210 on the front surface of the first polyimide layer 220 is completed, performing Organic Light Emitting Diode (OLED) evaporation on the front surface of the organic thin film transistor layer 210, and then forming the organic light emitting layer 100 through an encapsulation (Encap) process and a Metal Foil (Metal Foil) process;
after the step of preparing the back sheet layer 200 and the step of forming the organic light emitting layer 100 on the front surface of the back sheet layer 200 are completed, separating the first substrate 610 from the first polyimide layer 220, and removing the first substrate 610 from the first polyimide layer 220;
the preparation of the color film layer 400 comprises the following steps:
a second polyimide layer 420 is stacked on the front surface of the second substrate 620;
after the step of stacking the second polyimide layer 420 on the front surface of the second substrate 620 is completed, a color filter layer 410 is formed on the front surface of the second polyimide layer 420 to manufacture a color film layer 400 including the second polyimide layer 420 and the color filter layer 410 on the second substrate 620;
in the step of forming the color filter layer 410 on the front side of the second polyimide layer 420, a color resist 4122 and a black pattern are laid on the front side of the second polyimide layer 420 according to the design to form a color resist layer 412, and the color resist layer 412 is encapsulated with an organic film to form a filter encapsulation layer 411, so as to manufacture the color filter layer 410 including the color resist layer 412 and the filter encapsulation layer 411.
After the step of preparing the color film layer 400 is completed, the back surface of the quantum dot film 300 is adhered to the front surface of the color film layer 400 by the second transparent adhesive layer 720, comprising the steps of:
after the step of forming the color filter layer 410 on the front surface of the second polyimide layer 420 is completed, the front surface of the filter encapsulation layer 411 of the color filter layer 410 is coated with an optically transparent adhesive to form a second transparent adhesive layer 720, so that the back surface of the quantum dot film 300 is adhered to the front surface of the filter encapsulation layer 411 of the color filter layer 410 through the second transparent adhesive layer 720.
After the step of preparing the back sheet layer 200 is completed, the front surface of the quantum dot film 300 is bonded to the back surface of the back sheet layer 200 through the first transparent bonding layer 710, comprising the steps of:
after the step of separating the first substrate 610 from the first polyimide layer 220 and the step of adhering the back surface of the quantum dot film 300 to the front surface of the filter encapsulation layer 411 of the color filter layer 410 through the second transparent adhesive layer 720, the front surface of the quantum dot film 300 is coated with an optically transparent adhesive to form a first transparent adhesive layer 710, and the front surface of the quantum dot film 300 is adhered to the first polyimide layer 220 through the first transparent adhesive layer 710;
after the step of adhering the front surface of the quantum dot film 300 to the first polyimide layer 220 through the first transparent adhesive layer 710 is completed, separating the second substrate 620 from the second polyimide layer 420, and removing the second substrate 620 from the second polyimide layer 420;
after the step of preparing the color film layer 400 is completed, a polarizing layer 500 is disposed on the back surface of the color film layer 400, including the steps of:
after the step of removing the second substrate 620 from the second polyimide layer 420, a polarizing layer 500 is disposed on the second polyimide layer 420 on the back side of the color film layer 400, and a polarizer may be attached to the second polyimide layer 420 to form the polarizing layer 500.
The foregoing description is merely an optional embodiment of the present application, and is not intended to limit the scope of the patent application, and all equivalent structural modifications made by the specification and drawings of the present application or direct/indirect application in other related technical fields are included in the scope of the patent application.
Claims (5)
1. A method for manufacturing a back-side emission organic light emitting display panel, the back-side emission organic light emitting display panel comprising:
an organic light emitting layer emitting light toward the back surface;
a back plate layer disposed on the back surface of the organic light emitting layer;
the quantum dot film is a monolithic quantum dot film, is adhered to the back surface of the back plate layer through a first transparent adhesive layer, and is provided with a barrier film on the surface;
the color film layer is adhered to the back surface of the quantum dot film through a second transparent adhesive layer;
the polarizing layer is arranged on the back surface of the color film layer;
wherein, the manufacturing method comprises the following steps:
preparing a back plate layer;
forming an organic light-emitting layer on the front surface of the back plate layer, so that the organic light-emitting layer emits light towards the back plate layer;
preparing a color film layer;
bonding the front surface of the quantum dot film with the back surface of the back plate layer through a first transparent bonding layer;
bonding the back surface of the quantum dot film with the front surface of the color film layer through a second transparent bonding layer;
a polarizing layer is arranged on the back surface of the color film layer;
in the step of preparing a back sheet layer, the steps of:
stacking a first polyimide layer on the front surface of the first substrate;
after the step of stacking the first polyimide layer on the front surface of the first substrate is completed, forming an organic thin film transistor layer on the front surface of the first polyimide layer, wherein the back plate layer comprises the first polyimide layer and the organic thin film transistor layer;
before the step of bonding the front surface of the quantum dot film and the back surface of the back plate layer through the first transparent bonding layer, the method further comprises the steps of:
removing the first substrate from the first polyimide layer;
in the step of bonding the front surface of the quantum dot film and the back surface of the back plate layer through the first transparent bonding layer, the front surface of the quantum dot film is bonded on the first polyimide layer through the first transparent bonding layer;
the step of preparing the color film layer comprises the following steps:
superposing a second polyimide layer on the front surface of the second substrate;
after the step of superposing the second polyimide layer on the front surface of the second substrate is completed, forming a color filter layer on the front surface of the second polyimide layer, wherein the color filter layer comprises the second polyimide layer and the color filter layer;
after the step of forming the color filter layer on the front surface of the second polyimide layer is completed, the step of bonding the back surface of the quantum dot film with the front surface of the color filter layer through a second transparent bonding layer is performed, and the back surface of the quantum dot film is bonded on the front surface of the color filter layer through the second transparent bonding layer;
before the step of arranging the polarizing layer on the back surface of the color film layer, the method further comprises the steps of:
removing the second substrate from the second polyimide layer;
in the step of arranging the polarizing layer on the back surface of the color film layer, the polarizing layer is arranged on the second polyimide layer.
2. The method of manufacturing a back-side emission organic light emitting display panel according to claim 1, wherein the color film layer is laid with a plurality of color resists, and the thickness of the color resists is determined according to the parameters of the back-plate layer for light emission, the parameters of the quantum dot film, and the display effect index of the back-side emission organic light emitting display panel.
3. A back-side light-emitting organic light-emitting display panel, comprising:
an organic light emitting layer emitting light toward the back surface;
a back plate layer disposed on the back surface of the organic light emitting layer;
a quantum dot film adhered to the back surface of the back plate layer through a first transparent adhesive layer, wherein the surface of the quantum dot film is provided with a barrier film;
the color film layer is adhered to the back surface of the quantum dot film through a second transparent adhesive layer;
the polarizing layer is arranged on the back surface of the color film layer;
the quantum dot film is a monolithic quantum dot film and is integrally adhered between the back plate layer and the color film layer through the first transparent adhesive layer and the second transparent adhesive layer;
the color film layer comprises: the color filter layer is paved with a plurality of color resistors at intervals, all the color resistors are in the irradiation range of the emergent light of the whole quantum dot film, the colors and the material properties of all the positions on the quantum dot film corresponding to the color resistors are the same, the whole quantum dot film uniformly converts the light and then emits the light to all the color resistors, and all the color resistors receive the same light;
the back surface of the back plate layer is provided with a first polyimide layer, and the quantum dot film is adhered to the first polyimide layer through the first transparent adhesive layer;
the back of the color film layer is provided with a second polyimide layer, and the polarizing layer is arranged on the second polyimide layer.
4. The back-lit organic light-emitting display panel according to claim 3, wherein the first transparent adhesive layer and the second transparent adhesive layer are each formed of an optically clear adhesive.
5. A display device comprising the back-light-emitting organic light-emitting display panel according to any one of claims 3 to 4.
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