TWI524601B - Cover, electronic device and manufacturing method for cover - Google Patents

Description

Cover plate, electronic device and cover plate manufacturing method

The present invention relates to a cover, and more particularly to a structure and method for assembling a cover to an electronic device.

With the rapid development of electronic devices, various thin display technologies are applied to display modules of electronic devices, such as liquid crystal display (LCD) modules, organic light emitting display devices (OLEDs), and the like.

1 is a schematic diagram of a conventional electronic device. 2 is a cross-sectional view of a region A of the electronic device of FIG. 1. Referring to FIG. 1 and FIG. 2 , the electronic device 100 includes a body 110 , a display module 120 , a touch panel 130 , and a cover 140 . The cover plate 140 is disposed on the body 110. The cover plate 140 includes a substrate 142, a colloid layer 144, and a color layer 146. The touch panel 130 is disposed between the display module 120 and the colloid layer 144 and adhered to the substrate 142 by the colloid layer 144 . The color layer 146 is disposed on the flat surface of the substrate 142 such that the surface of the color layer 146 has a height difference H from the surface of the substrate 142. When the height difference H causes the colloid layer 144 to cover the surface of the color layer 146 and the substrate 142, it is easy to generate the gap G at the boundary of the three, and it is reflected that the appearance of the electronic device 100 is that bubbles are observed at the gap G.

3 is a cross-sectional view of a region B of the electronic device of FIG. 1. Referring to Figure 3, color layer 146 has an icon area 148 for visualizing the pattern of function keys. However, the ink applied to this icon area 148 is uneven in thickness and has a depression 148a. The colloid layer 144 covers the icon area 148 and When the surface of the color layer 146 is formed, voids are also easily generated at the recess 148a, and are reflected in the appearance of the electronic device 100 as bubbles visible to the naked eye.

The invention provides a cover plate for solving the problem of air bubbles existing when the colloid layer is covered.

The present invention provides an electronic device in which the cover plate does not have a bubble problem.

The invention provides a method for manufacturing a cover plate for solving the problem of bubbles existing when the colloid layer is covered.

The invention proposes a cover plate. The cover plate includes a substrate, a gel layer and a color layer. The substrate has a thinned zone. The color layer is placed in the thinned zone and is located between the substrate and the colloid layer.

The invention further proposes an electronic device. The electronic device includes a body and a cover. The body includes a display module. The cover plate is disposed on the display module. The cover plate includes a substrate, a gel layer and a color layer. The substrate has a thinned zone. The color layer is placed in the thinned zone and is located between the substrate and the colloid layer.

In an embodiment of the invention, the substrate of the cover comprises a bottom plate and a filling layer. The bottom plate has a flat surface. The filling layer is disposed on the plane, and the portion where the plane is not disposed with the filling layer is a thinning region, and the surface of the filling layer is flush with the surface of the color layer.

In an embodiment of the invention, the material of the filling layer of the cover plate is UV glue, ink, optical glue, cerium oxide.

In an embodiment of the invention, the surface of the color layer of the cover is flush or protrudes from the surface of the substrate directly contacting the colloid layer.

In an embodiment of the invention, the cover plate further includes a filler. The color layer has an icon area and the icon area has a depression. The filler material is filled in the depression to form a flat surface together with the color layer.

In an embodiment of the invention, the color layer of the cover layer has a different color in the portion of the icon area than the other portions of the color layer.

In an embodiment of the invention, the color layer of the cover is an ink layer or a photoresist layer.

In an embodiment of the invention, the color layer of the cover comprises a white ink layer and a black ink layer. The black ink layer is located between the white ink layer and the colloid layer.

The invention further proposes a method for manufacturing a cover plate, comprising the following steps. A substrate is provided. A thinned region of the substrate is provided with a color layer. Next, a colloid layer is disposed to cover the color layer and the substrate.

In an embodiment of the invention, in the method of fabricating the cover, the step of providing a substrate comprises the following steps. A bottom plate is provided. The bottom plate has a flat surface, and the planar thinned portion is provided with a color layer. Next, a portion of the flattening layer on which the color layer is not disposed is disposed, and the surface of the filling layer is flush with the surface of the color layer.

In an embodiment of the invention, in the method of fabricating the cover, the step of providing a substrate comprises the following steps. A thinned region is formed on the substrate. Next, a color layer is disposed in the thinned region of the substrate.

In an embodiment of the invention, an icon region of the color layer has a depression. The method for manufacturing the cover plate further comprises filling a recess in the recess to form a flat surface together with the color layer before the colloid layer is disposed.

In an embodiment of the invention, the method of fabricating the color layer comprises the following steps. A white ink layer is disposed in the thinned region of the substrate. Next, a black ink layer is disposed on the white ink layer.

Based on the above, the present invention effectively avoids generation of bubbles in the subsequent colloid layer configuration by reducing the height difference between the substrate and the surface of the color layer.

The above described features and advantages of the present invention will be more apparent from the following description.

4 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 5A is a schematic view showing the combination of the cover plate of FIG. 4 and the display module. Referring to FIG. 4 and FIG. 5A , the electronic device 200 of the embodiment includes a body 210 , a touch panel 230 , and a cover 240 . The body 210 includes a display module 220. The cover 240 is disposed on the display module 220. The cover 240 includes a substrate 242, a colloid layer 244, and a color layer 246. The cover 240 includes a display area 240a and a decoration zone 240b. The position of the display module 220 corresponds to the position of the display area 240a. And the color layer 246 is disposed in the light shielding area 240b. The touch panel 230 is disposed between the display module 220 and the colloid layer 244 . In the embodiment, the touch panel 230 is adhered to the substrate 242 by the colloid layer 244. The touch panel 230 is, for example, a capacitive touch panel. In other embodiments, the touch panel 230 can also be a resistive touch panel or other forms of touch panels.

In this embodiment, the cover 240 covering the touch panel 230 can not only beautify the appearance of the electronic device 200, but also protect the touch panel 230. Free from external damage. For example, the base material 242 of the cover plate 240 of the embodiment is made of transparent plastic or glass.

Figure 5B is a schematic illustration of the substrate of Figure 5A. Referring to FIGS. 5A and 5B, the substrate 242 of the present embodiment has a thinned region 242a. In other words, the surface S1 of the substrate 242 is not a flat surface such that the thinned region 242a of the substrate 242 has a height difference H1 from other portions. Color layer 246 is placed in thinned region 242a and between substrate 242 and colloid layer 244. Under this configuration, the thinned region 242a of the substrate 242 is filled with the height difference H1 by the color layer 246, so that the colloid layer 244 can closely adhere to the color layer 246 and the substrate 242 without voids to reduce bubbles. The possibility of existence.

The present invention reduces the likelihood of bubbles present at the interface of the colloid layer 244 by reducing or eliminating the difference in height at the junction of the color layer 246 disposed on the substrate 242.

In the present embodiment, the substrate 242 of the cover 240 includes a bottom plate 242b and a fill level 242c. The bottom plate 242b has a flat surface S2. The filling layer 242c is disposed on the plane S2, and the portion of the plane S2 where the filling layer 242c is not disposed is the thinned portion 242a. The surface of the filling layer 242c of the present embodiment is flush with the surface of the color layer 246, that is, the filling layer 242c and the color layer 246 together form a flat surface S. In addition, the material of the filling layer 242c of the cover plate 240 is optical grade UV glue, high penetration ink (Ink), optical glue (OCA/LOCA/OCR), cerium oxide (SiO2).

Under this configuration, after the thinned region 242a of the substrate 242 is filled by the color layer 246, the flat surface S can be formed together with the color layer 246. Because the flat surface S does not have a high and low drop, the colloid layer 244 can be closely matched to the color. Layer 246 and substrate 242 are free of voids.

In addition, the colloid layer 244 for the flat surface S disposed on the filling layer 242c and the color layer 246 to adhere the touch panel 230 needs to be a transparent adhesive material. In this embodiment, the colloid layer 244 is an Optical Clear Adhesive (OCA) layer. On the other hand, the color layer 246 in this embodiment is, for example, an ink layer or a photo resister. Specifically, color layer 246 includes a white ink layer 246a and a black ink layer 246b. The black ink layer 246b is positioned between the white ink layer 246a and the colloid layer 244 to block light from entering. In other words, the touch panel 230 covered by the black ink layer 246b and the portion of the display module 220 are invisible. The present invention does not limit the number of layers of the white ink layer 246a and the black ink layer 246b. In other embodiments, the white ink layer 246a can be a single layer of white ink or a multilayer white ink. The purpose of the multilayer white ink is to provide a relatively pure white appearance when the cover panel 240 is viewed from the substrate 242. The effect of the black ink layer 246b can obscure light leakage that may occur at the periphery of the display module 220 or prevent the white ink 246a from seeing through to the internal circuitry as viewed from the substrate 242. However, the color and structure of the color layer 246 is freely variable for those of ordinary skill in the art to achieve the desired visual effect.

In the above embodiment, by filling the filling layer 242c on the bottom plate 242b of the substrate 242, the filling layer 242c of the substrate 242 and the color layer 246 together form a flat surface S to improve the presence of bubbles in the configuration of the colloid layer 244. problem. However, the present invention does not limit the manner in which the substrate and the color layer are collectively formed to form a flat surface, and the following is exemplified by the drawings.

6A is a schematic view of a cover plate according to another embodiment of the present invention. Figure 6B It is a schematic view of the substrate of Figure 6A. Referring to FIG. 6A and FIG. 6B , the cover 340 of the embodiment is substantially the same as the embodiment of FIG. 5A , wherein the functions and shapes are the same or the similar components are given the same reference numerals, and the detailed content and design can refer to FIG. 5A and FIG. 5B . And the description will not be repeated below. The difference between the two is that the substrate 342 of the present embodiment does not require the filling layer of the above embodiment.

In detail, the thinned region 342a is formed directly on the substrate 342 of a single material. In other words, the surface of the thinned region 342a of the substrate 342 has a height difference H2 from the surface S3 of the other portion of the substrate 342. The substrate 342 is, for example, a glass substrate, a plastic substrate or other light transmissive substrate, and the thinned region 342a is formed, for example, by etching or other means. The color layer 346 of this embodiment is placed in the thinned region 342a and between the substrate 342 and the colloid layer 244. The surface S4 of the color layer 346 is flush with the substrate 342 directly contacting the surface S3 of the colloid layer 244 to collectively constitute the flat surface S.

Under this configuration, after the thinned region 342a of the substrate 342 is filled with the height difference H2 by the color layer 346, the colloid layer 244 can be closely adhered to the surface of the color layer 346 and the substrate 342 without a gap.

7A is a schematic view of a cover plate according to still another embodiment of the present invention. Figure 7B is a schematic illustration of the substrate of Figure 7A. Referring to FIG. 7A and FIG. 7B , the cover 440 of the embodiment is substantially the same as the embodiment of FIG. 6A , wherein the functions and shapes are the same or the similar components are given the same reference numerals, and the detailed content and design can refer to FIG. 6A and FIG. 6B . The description will not be repeated below. The difference between the two is that the surface S5 of the color layer 446 of the present embodiment protrudes from the substrate 442 directly contacting the surface S6 of the colloid layer 244 and has a height difference H3. Under this configuration, since the substrate 442 has the thinned region 442a, the height difference can be made. H3 is less than the thickness of the color layer 446 and thereby reduces the chance of bubbles present in the subsequent colloid layer 244 configuration.

The above embodiments are all to explain how to solve the problem of the presence of air bubbles at the edge of the display area of the electronic device 200. However, the present invention can also be used to solve the problem that bubbles may exist in the icon area of the electronic device 200. The following is illustrated by way of example. .

Figure 8 is a schematic view of a cover plate in accordance with still another embodiment of the present invention. Referring to FIG. 8, the description of the embodiment focuses on the icon area of the cover 540. The color layer 546 has an icon area 548 for displaying icons of function keys such as a home page, a call, a volume adjustment, and the like.

In detail, color layer 546 is placed on substrate 542 and icon region 548 has a recess 548a. The cover plate 540 of this embodiment further includes a filler 549 which is filled in the recess 548a to form a flat surface S together with the color layer 546.

Under this configuration, the filler 549 is first filled in the recess 548a prior to configuring the colloid layer 244. After the recess 548a is filled by the filler 549, it forms a flat surface S together with the color layer 546. Therefore, the colloid layer 244 can closely conform to the color layer 546 and the filler 549 without voids.

Further, the color of the color layer 546 in the portion of the icon area 548 in this embodiment is different from the color of other portions of the color layer 546. For example, color layer 546 is, for example, white ink layer 246a and black ink layer 246b, while color layer 546 is, for example, gray ink layer 246c in icon area 548 to highlight the icon of icon area 548.

The method of manufacturing the cover of the present invention will be described below by taking the cover 240 of FIG. 5A as an example.

Figure 9 is a textual flow diagram of the method of making the cover of Figure 5A. 10A to 10F are schematic views showing the manufacturing process of the manufacturing method of the cover of FIG. 5A. Referring first to FIG. 10D, a substrate 242 is provided in which a thinned region 242a of the substrate 242 is provided with a color layer 246 (step S910).

Specifically, in the step S910 of providing the substrate 242 described above, the following steps are included. First, a bottom plate 242b as shown in Fig. 10A is provided. The bottom plate 242b has a flat surface S2. Referring again to FIG. 10C, a thinned region 242a of the plane S2 is provided with a color layer 246.

Referring to FIG. 10D, a portion of the filling layer 242c is disposed on the plane S2 without the color layer 246, and the surface of the filling layer 242c is flush with the surface of the color layer 246, that is, the filling layer 242c and the color layer 246. Together form a flat surface S.

Next, referring to FIG. 10E, a colloid layer 244 is disposed to cover the color layer 246 and the substrate 242 (step S920). In the present embodiment, after the portion of the bottom plate 242b where the color layer 246 is not disposed is filled by the filling layer 242c, the substrate 242 can form a flat surface S together with the color layer 246. Therefore, the colloid layer 244 can be closely adhered to the color layer 246 and the substrate 242 without air bubbles.

Referring to FIG. 10F , the manufacturing method of the cover 240 further includes attaching a touch panel 230 to the substrate 242 by the colloid layer 244 (step S930 ).

On the other hand, the method of manufacturing the color layer 246 in the above step S910 includes the following steps. Please refer to FIG. 10B first, and the thinning of the bottom plate 242b. A white ink layer 246a is disposed in the region 242a. Next, referring to FIG. 10C, a black ink layer 246b is disposed on the white ink layer 246a. The present invention does not limit the number of layers of the white ink layer 246a and the black ink layer 246b herein. In other embodiments, the white ink layer 246a can be a single layer of white ink or a multilayer white ink.

In the method for fabricating the cover plate, the filling layer 242c is added to the bottom plate 242b of the substrate 242 such that the filling layer 242c of the substrate 242 and the color layer 246 together form a flat surface S to improve the configuration of the colloid layer 244. There is a problem with bubbles. However, the present invention does not limit the manner in which the base material and the color layer are formed to form a flat surface. The method of manufacturing the cover of the present invention will be described below by taking the cover 340 of FIG. 6A as an example.

11A to 11E are schematic diagrams showing the manufacturing process of the manufacturing method of the cover plate of FIG. 6A. The method for manufacturing the cover 340 of the present embodiment is substantially the same as the embodiment of the above-mentioned FIG. 10A to FIG. 10F, wherein the functions and shapes are the same or the same components are given the same reference numerals, and the detailed contents and steps can be referred to FIG. 10A to FIG. , the following will not repeat. The difference between the two is that the substrate 342 of the present embodiment does not require the filling layer of the above embodiment.

In detail, in step S910 of providing the substrate 342, the following steps are included. First, referring to FIG. 11B, a thinned region 342a is formed on a substrate 342 of a single material. In other words, the surface of the thinned region 342a of the substrate 342 has a height difference H2 from the surface S3 of the other portion of the substrate 342. In the present embodiment, the thinned region 342a is formed, for example, by etching or other means.

Referring next to FIG. 11C, a color layer 346 is disposed on the thinned region 342a of the substrate 342, and the surface of the portion of the substrate 342 other than the thinned region 342a is provided. S3 is flush with the surface S4 of the color layer 346, that is, the substrate 342 and the color layer 346 together form a flat surface S. Of course, in other embodiments, the surface S5 of the color layer 446 may also be a surface S6 that protrudes from the substrate 442 directly contacting the colloid layer 244 as shown in FIG. 7A.

Next, referring to FIG. 11D, the colloid layer 244 is disposed to cover the color layer 346 and the substrate 342 (step S920).

In the above embodiments, the cover plate of the display area of the electronic device is taken as an example to describe the manufacturing method of the cover plate of the present invention. However, the present invention can also be applied to the icon area of the electronic device, and the following is a diagram of the electronic device shown in FIG. The cover plate of the symbol is taken as an example to illustrate the manufacturing method of the cover plate of the present invention.

12A to 12F are schematic diagrams showing the manufacturing process of the method for manufacturing the cover plate of Fig. 8. First, a substrate 542 as shown in Fig. 12A is provided. Further, a color layer 546 is disposed on the substrate 542. In detail, referring to FIG. 12B, a white ink layer 246a is disposed on the substrate 542.

Next, referring again to FIG. 12C, an icon area 548 is formed in which the white ink layer 246a is located between the icon area 548 and the substrate 542. Moreover, the color of the portion of the color layer 546 in the present embodiment is different from the color of the other portions of the color layer 546. For example, the color layer 546 is, for example, the gray ink layer 246c in the icon area 548. The icon of the icon area 548 is highlighted. With continued reference to FIG. 12D, a black ink layer 246b is disposed on the icon area 548. In the present embodiment, an icon region 548 of color layer 546 has a recess 548a.

Referring to FIG. 12E, a filler 549 is filled in the recess 548a to form a flat surface S together with the color layer 546. Then, as shown in Figure 12F As shown, a colloid layer 244 is disposed to cover the color layer 546 and the substrate 242 (step S920).

In summary, the present invention reduces the height difference between the two when the color layer is disposed on the substrate to reduce the possibility of bubbles present in the colloid layer configuration, thereby improving the aesthetics of the product.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

A, B‧‧‧ area

100, 200‧‧‧ electronic devices

110, 210‧‧‧ ontology

120, 220‧‧‧ display module

130, 230‧‧‧ touch panel

140, 240, 340, 440, 540‧ ‧ cover

240a‧‧‧ display area

240b‧‧‧ shading area

142, 242, 342, 442, 542‧‧ ‧ substrates

242a, 342a, 442a‧‧‧ thinned area

242b‧‧‧floor

242c‧‧‧ leveling

144, 244‧‧ ‧ colloid layer

146, 246, 346, 446, 546‧‧ ‧ color layers

246a‧‧‧White ink layer

246b‧‧‧black ink layer

246c‧‧‧ Gray ink layer

148, 548‧‧‧ icon area

148a, 548a‧‧‧ dent

549‧‧‧Filling materials

G‧‧‧ gap

H, H1, H2, H3‧‧‧ height difference

S‧‧‧flat surface

S2‧‧ plane

S1, S3, S4, S5, S6‧‧‧ surface

S910~S930‧‧‧Steps

1 is a schematic diagram of a conventional electronic device.

2 is a cross-sectional view of a region A of the electronic device of FIG. 1.

3 is a cross-sectional view of a region B of the electronic device of FIG. 1.

4 is a schematic diagram of an electronic device according to an embodiment of the present invention.

FIG. 5A is a schematic view showing the combination of the cover plate of FIG. 4 and the display module.

Figure 5B is a schematic illustration of the substrate of Figure 5A.

6A is a schematic view of a cover plate according to another embodiment of the present invention.

Figure 6B is a schematic illustration of the substrate of Figure 6A.

7A is a schematic view of a cover plate according to still another embodiment of the present invention.

Figure 7B is a schematic illustration of the substrate of Figure 7A.

Figure 8 is a schematic view of a cover plate in accordance with still another embodiment of the present invention.

Figure 9 is a textual flow diagram of a method of making the cover of Figure 5.

10A to 10F are manufacturing flows of the manufacturing method of the cover plate of FIG. 5A Schematic diagram.

11A to 11E are schematic diagrams showing the manufacturing process of the manufacturing method of the cover plate of FIG. 6A.

12A to 12F are schematic diagrams showing the manufacturing process of the method for manufacturing the cover plate of Fig. 8.

220‧‧‧ display module

230‧‧‧ touch panel

240‧‧‧ cover

242‧‧‧Substrate

242b‧‧‧floor

242c‧‧‧ leveling

244‧‧ ‧ colloid layer

246‧‧‧ color layer

246a‧‧‧White ink layer

246b‧‧‧black ink layer

S‧‧‧flat surface

S2‧‧ plane

Claims (17)

A cover plate comprising: a substrate having a thinned region; a colloid layer; and a color layer disposed between the substrate and the colloid layer, wherein the substrate comprises a bottom plate And a flattening layer, the bottom plate has a plane, the filling layer is disposed on the plane, the portion of the plane not disposed with the filling layer is the thinned region, the surface of the filling layer and the surface of the color layer Qi Ping. The cover plate according to claim 1, wherein the material of the filling layer is UV glue, ink, optical glue, and cerium oxide. The cover sheet of claim 1, wherein the surface of the color layer is flush or protrudes from the surface of the substrate directly contacting the colloid layer. The cover plate of claim 1, further comprising a filler material, wherein the color layer has an icon area, the icon area has a recess, and the filler material is filled in the recess to be shared with the color layer Form a flat surface. The cover sheet of claim 4, wherein a color of the portion of the color layer in the icon area is different from a color of other portions of the color layer. The cover sheet of claim 1, wherein the color layer is an ink layer or a photo resister. The cover sheet of claim 6, wherein the color layer comprises a white ink layer and a black ink layer, the black ink layer being located in the white ink Between the layer and the colloid layer. An electronic device comprising: a body comprising a display module; and a cover plate disposed on the display module, the cover plate comprising: a substrate having a thinned region; a colloid layer; and a color layer And disposed in the thinned region and located between the substrate and the colloid layer, wherein the substrate comprises a bottom plate and a filling layer, the bottom plate has a plane, the filling layer is disposed on the plane, the plane is The exposed portion of the fill layer is the thinned region, and the surface of the fill layer is flush with the surface of the color layer. The electronic device of claim 8, wherein the material of the filling layer is UV glue, ink, optical glue, and cerium oxide. The electronic device of claim 8, wherein the surface of the color layer is flush or protrudes from the surface of the substrate directly contacting the colloid layer. The electronic device of claim 8, further comprising a filler, wherein the color layer has an icon area, the icon area has a recess, and the filler is filled in the recess to be shared with the color layer Form a flat surface. The electronic device of claim 11, wherein the color layer has a color different from a color of a portion of the color layer. An electronic device as claimed in claim 8, wherein the electronic device The color layer is an ink layer or a photo resister. The electronic device of claim 13, wherein the color layer comprises a white ink layer and a black ink layer, the black ink layer being located between the white ink layer and the colloid layer. A method for manufacturing a cover plate, comprising: providing a substrate, wherein a thinned region of the substrate is provided with a color layer; and a colloid layer is disposed to cover the color layer and the substrate, wherein the step of providing the substrate is provided The method includes: providing a bottom plate, wherein the bottom plate has a plane, and the thinned area of the plane is configured with the color layer; and configuring a portion of the flat layer on which the color layer is not disposed, and the filling layer is The surface is flush with the surface of the color layer. The method for manufacturing a cover plate according to claim 15 , wherein an icon region of the color layer has a recess, and the method for manufacturing the cover plate further comprises: filling a filler material before the colloid layer is disposed; The depression forms a flat surface with the color layer. The method for manufacturing a cover plate according to claim 15, wherein the method for manufacturing the color layer comprises: disposing a white ink layer in the thinned region of the substrate; and disposing a black ink layer on the white ink On the floor.