CN107395938A - Image sensor package structure, there is its camera module and preparation method - Google Patents
Image sensor package structure, there is its camera module and preparation method Download PDFInfo
- Publication number
- CN107395938A CN107395938A CN201710748850.3A CN201710748850A CN107395938A CN 107395938 A CN107395938 A CN 107395938A CN 201710748850 A CN201710748850 A CN 201710748850A CN 107395938 A CN107395938 A CN 107395938A
- Authority
- CN
- China
- Prior art keywords
- image sensor
- pcb board
- plastic
- sealed body
- sensor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of image sensor package structure, there is its miniaturization camera module and preparation method, wherein, reinforcing plate is preset on pcb board upper surface, then it is again that image sensor chip is viscous in the reinforcing plate of pcb board upper surface, image sensor chip is supported by the rigidity of reinforcing plate, pcb board and image sensor chip warpage caused by being influenceed in moulding process due to molding pressure and injection temperature are effectively improved, so as to improve the properties of product of camera module.Preferably, being placed in housing groove formed with housing groove, reinforcing plate on pcb board, can avoid causing the size of camera module to increase when introducing reinforcing plate.The preparation method forms a kind of miniaturization camera module of warpage preventing by setting up reinforcing plate on pcb board in moulding process.
Description
Technical field
The present invention relates to camera technical field, in particular to a kind of image sensor package structure, has taking the photograph for its
As head mould group and preparation method.
Background technology
At present, camera module generally includes imaging sensor, pcb board, support, optical filter and the lens group provided with camera lens
Part.Imaging sensor is by gluing crystalline substance (Die Bond；D/B gold thread (Wire Bond), are beaten；W/B) process Installation is on pcb board, branch
Frame is installed on pcb board, and covers on the top of imaging sensor, and lens assembly is installed on support, and optical filter is located at lens group
Between part and imaging sensor, and installed in the middle part of support.But the size of the camera module of this structure is larger, no
Meet light, thin, the small development trend of current electronic product (mobile phone, tablet personal computer etc.), and product reliability also needs further
Strengthen.Therefore, present applicant has proposed the image sensor package technique of mould model, i.e., first image sensor chip is mounted
Onto pcb board, then in the non-photo-sensing area dispensing of image sensor chip, an annular rib is formed, plastic packaging material when stopping molding
Material then, then is molded (Molding) pressing mold, capsulation material is passed image into the photosensitive area of image sensor chip
Passive device, the gold thread of sensor chip non-photo-sensing area and surrounding are all cast on together, formed overall structure, the encapsulating structure with
Conventional stent reduces space shared by support compared with pcb board combines, so as to reach the mesh for reducing camera module size
, and enhance the reliability of product.
But during Molding pressing molds, due to the influence of temperature during clamping pressure and capsulation material plastic packaging,
Easily cause pcb board to deform upon, while cause image sensor chip that warpage occurs together, cause camera imaging quality
Decline.
The content of the invention
Pcb board is caused to produce due to the influence of clamping pressure and plastic packaging temperature in moulding process for imaging sensor
Buckling deformations, cause to fit in image sensor chip on pcb board warpage together, cause asking for camera imaging Quality Down
Topic, the present invention propose a kind of new image sensor package structure, have its camera module and preparation method, avoid
Pcb board and image sensor chip produce warpage in moulding process, while camera module size is reduced, it is ensured that take the photograph
As head image quality.
The technical proposal of the invention is realized in this way：
A kind of image sensor package structure, including pcb board, it has upper surface and relative lower surface；Image sensing
Device chip；At least a reinforcing plate and plastic-sealed body, wherein, a reinforcing plate is arranged at the upper surface of the pcb board, imaging sensor
Chip is located in the reinforcing plate of pcb board upper surface, and image sensor chip has photosensitive area and the non-sense around the photosensitive area
Light area, multiple first weld pads are provided with non-photo-sensing area, are provided with pcb board on the periphery of described image sensor chip
Multiple second weld pads, the first weld pad the second weld pad corresponding with pcb board are electrically connected with by routing mode；Plastic-sealed body passes through modeling
Closure material molds to be formed, and the plastic-sealed body coats the non-photo-sensing area of the image sensor chip, and plastic-sealed body is photosensitive formed with exposure
The light hole in area.
Further, the number of reinforcing plate is two, and two reinforcing plates are respectively arranged at upper surface and the following table of pcb board
Face.
Further, pcb board upper surface is arranged in housing groove formed with housing groove, reinforcing plate.
Further, reinforcing plate is stainless steel substrates or ceramic substrate.
Further, the annular rib of photosensitive area, the non-photo-sensing outside annular rib are surrounded in non-photo-sensing area formed with a circle
Mold to form plastic-sealed body in area and by capsulation material on pcb board, the first weld pad, the second weld pad and routing are coated on by plastic-sealed body
It is interior.
Further, annular rib is formed by progress dry glue after drawing glue.
Further, passive device is provided with the pcb board on image sensor chip periphery, passive device is coated on plastic packaging
In vivo.
A kind of camera module, including image sensor package structure, in addition to optical filter and lens assembly, lens assembly
It is directly mounted on plastic-sealed body or is installed on by support on plastic-sealed body, optical filter is arranged at lens assembly and imaging sensor core
Between piece.
Further, lens assembly is directly mounted on plastic-sealed body, and middle side part filters formed with subsidence trough on plastic-sealed body
Piece is mounted into subsidence trough, and it is simultaneously relative with the photosensitive area of image sensor chip to cover light hole；Lens assembly is installed on modeling
Seal the upside of body.
Further, lens assembly is installed on plastic-sealed body by support, and support includes rack body and is formed at support
Through hole in the middle part of body, bore periphery are arrived in the subsidence trough of bore periphery formed with subsidence trough, optical filter attachment；Plastic-sealed body
Formed with storage tank, the support with optical filter mounts into storage tank upper middle side part, makes optical filter and image sensor chip
Photosensitive area it is relative；Lens assembly is installed on the upside of support and plastic-sealed body.
A kind of camera module preparation method, comprises the following steps：
1) providing a pcb board and an at least reinforcing plate, pcb board has upper surface and relative lower surface, wherein one will add
Strong plate is fixed on pcb board upper surface middle part position, and pcb board upper surface periphery is provided with multiple second weld pads；
2) image sensor chip is provided, image sensor chip has photosensitive area and the non-photo-sensing around photosensitive area
Area, multiple first weld pads are provided with non-photo-sensing area；Image sensor chip is mounted onto the reinforcing plate after step 1, and will
First weld pad the second weld pad corresponding with pcb board is electrically connected with by routing mode；
3) by the pcb board after step 2 be positioned over one be used for mold mould in, using capsulation material molding method,
A plastic-sealed body is formed on pcb board, the plastic-sealed body coats the non-photo-sensing area of image sensor chip, and formed with exposure on plastic-sealed body
The light hole of photosensitive area；
4) optical filter and a lens assembly are provided, lens assembly is directly mounted on plastic-sealed body or installed by support
In on plastic-sealed body, optical filter is arranged between lens assembly and image sensor chip.
Further, the number of reinforcing plate is two, and two reinforcing plates are respectively arranged at upper surface and the following table of pcb board
Face.
Further, pcb board upper surface is arranged in housing groove formed with housing groove, reinforcing plate.
Further, the annular rib of photosensitive area, the non-photo-sensing outside annular rib are surrounded in non-photo-sensing area formed with a circle
Mold to form plastic-sealed body in area and by capsulation material on pcb board, the first weld pad, the second weld pad and routing are coated on by plastic-sealed body
It is interior.
The beneficial effects of the invention are as follows：The present invention provides a kind of image sensor package structure, wherein, in pcb board upper table
Reinforcing plate is preset in face, and then again that image sensor chip is viscous in reinforcing plate, reinforcing plate has very strong rigidity, not variable
Shape, image sensor chip is supported by the rigidity of reinforcing plate, is effectively improved in moulding process due to molding pressure and plastic packaging
Pcb board and image sensor chip warpage caused by temperature influences, so as to improve the properties of product of camera module.Preferably
, the position that image sensor chip is pre-installed on pcb board is placed in housing groove formed with housing groove, reinforcing plate.So,
Reinforcing plate is embedded into housing groove, avoids the increase for causing camera module module thickness when introducing reinforcing plate.Using
The camera module of the encapsulating structure, while effectively reducing camera module size, it is thus also avoided that pcb board and imaging sensor
Chip caused warpage in moulding process, so as to improve camera module properties of product.The preparation method is by molding
During reinforcing plate is set up on pcb board, form a kind of miniaturization camera module of warpage preventing.
Brief description of the drawings
Fig. 1 is the image sensor package section of structure that first embodiment of the invention provides；
Fig. 2 is the overall schematic for the image sensor package structure that first embodiment of the invention provides；
Fig. 3 is the decomposing schematic representation of the image sensor package structure shown in Fig. 2；
Fig. 4 is the diagrammatic cross-section for the image sensor package structure that second embodiment of the invention provides；
Fig. 5 is the overall schematic for the image sensor package structure that second embodiment of the invention provides；
Fig. 6 is the decomposing schematic representation of the image sensor package structure shown in Fig. 5；
Fig. 7 is the diagrammatic cross-section for the camera module that one embodiment of the invention provides；
Fig. 8 is the diagrammatic cross-section for the camera module that another embodiment of the present invention provides.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention
Embodiment elaborate.Many details are elaborated in the following description to fully understand the present invention.
But the invention can be embodied in many other ways as described herein, those skilled in the art can be without prejudice to originally
Similar improvement is done in the case of invention intension, therefore, this hair is not limited by following public specific implementation.
Term as used herein " upper surface ", " lower surface " " on " and similar statement simply to illustrate that mesh
, it is unique embodiment to be not offered as.
First embodiment
Fig. 1 is first embodiment of the invention image sensor package section of structure, and Fig. 2 is first embodiment of the invention figure
As sensor-packaging structure overall diagram, Fig. 3 is first embodiment of the invention image sensor package structure decomposition figure.Such as Fig. 1, figure
Shown in 2 and Fig. 3, the present invention provides a kind of image sensor package structure, and it includes pcb board 1, reinforcing plate 2, imaging sensor core
Piece 3 and plastic-sealed body 4.
Pcb board 1 also known as prints pcb board, has upper surface and relative lower surface, is carrying for electronic component electrical connection
Donor, can use rigid pcb board, flexible PCB and Rigid Flex, and the present embodiment is preferably Rigid Flex, including camera lens
Hardboard portion 101, the middle soft board portion 103 of connector hardboard portion 102 and connection therebetween, the upper table of camera lens hardboard portion 101 of pcb board
Middle face is the position of pre-installation reinforcing plate, i.e., the position of installation image sensor chip, the mirror of pcb board in conventional package
The upper surface periphery of head hardboard portion 101 has multiple second weld pads 104, and the upper surface periphery of camera lens hardboard portion 101 of pcb board is also set up
There are multiple passive devices 105；Connector hardboard portion 102 is used for installs connector, to realize the other parts such as pcb board and mainboard
It is quick to be electrically connected with.
Reinforcing plate 2 is with very strong hardness and on-deformable platy structure, can be the sheet metal of high intensity, ceramic
Substrate etc., more specifically, such as can be stainless steel substrates, in addition, be not limited to the thickness of reinforcing plate, with can be real
Image sensor chip is now supported, and pcb board will not be caused in mould model and as sensor chip deforms, warpage is defined.
Image sensor chip 3 can be charge coupled cell imaging sensor (CCD), or complementary metal oxygen
Compound semiconductor image sensor (CMOS) etc..
Plastic-sealed body 4 is molded by capsulation material, and capsulation material can use epoxy resin etc. all available for molded
Capsulation material.
Referring to Fig. 3 and Fig. 1, in this book example, reinforcing plate 2 is arranged at the upper surface of pcb board 1, more specifically, reinforcing plate 2
It is fixed in the camera lens hardboard portion 101 of Rigid Flex, that is, is arranged at conventional package pre-installation image sensor chip
Position.Preferably, reinforcing plate 2 is bonded by glue or surface mounting technology (surface mount technology, SMT) welds
Tin mode is fixed on pcb board 1, and reinforcing plate 2 arrives the camera lens hardboard portion of pcb board 1 using the attachment of metal adhesive-layer 5 in the present embodiment
101 upper surface.Reinforcing plate 2 is preferably stainless steel substrates, has very strong rigidity, is unlikely to deform, it is ensured that closed in moulding process
Molding pressure and plastic packaging temperature will not cause pcb board to deform, and produce warpage, so as to lift camera module properties of product, but it is unlimited
In this, sheet metal of other high intensity etc. is can also be in other embodiments, and the thickness of reinforcing plate 2 is unrestricted, can basis
It is actually needed and selects relatively thin reinforcing plate, meets the growth requirement of encapsulating structure slimming.
Referring to Fig. 3 and Fig. 1, in the present embodiment, image sensor chip 3 is fixed in reinforcing plate 2, it is preferred that image
Sensor chip is mounted in reinforcing plate 2 using D/B adhesive-layers 6.Image sensor chip 3 has photosensitive area 301 and around sense
The non-photo-sensing area 302 in light area, is provided with multiple first weld pads 303 in non-photo-sensing area 302, the first weld pad 303 with pcb board 1 with
Its corresponding second weld pad 104 is electrically connected with by gold thread 8 in a manner of routing；The size of image sensor chip 3 can be with slightly larger
In, slightly smaller than or size equal to reinforcing plate 2, it is preferred that the shape of image sensor chip 3 and size and the shape of reinforcing plate 2
It is identical with size.
Referring to Fig. 1, plastic-sealed body 4 molds to be formed by capsulation material, is formed at the upper surface of pcb board 1, coats image sensing
The non-photo-sensing area of device chip 3, the middle part of plastic-sealed body 4 form the light hole 401 of exposure photosensitive area 301.Specifically, plastic-sealed body 4 is formed
In on the upper surface periphery of pcb board 1, by the non-sense of the second weld pad 104 and image sensor chip 3 on the upper surface periphery of pcb board 1
Light area 302 and the first weld pad 303 thereon are coated in it, meanwhile, it will also be set on the pcb board 1 on the periphery of image sensor chip 3
Multiple passive devices 105 put etc. are coated in it.Plastic-sealed body 4 is molded by capsulation material, can replace conventional package knot
Support in structure, space shared by support is reduced, so as to reach the purpose for reducing camera module size, and enhance product
Reliability.
Preferably, the annular rib 7 of photosensitive area is surrounded in the non-photo-sensing area 302 of image sensor chip 3 formed with a circle,
Mold to form plastic-sealed body by capsulation material in non-photo-sensing area 302 of the annular rib 7 away from the side of photosensitive area 301 and on pcb board 1
4, plastic-sealed body is by the second weld pad 104 and gold on first weld pad 303 in the non-photo-sensing area 302 of image sensor chip 3, pcb board
In line 8 is coated on.Preferably, annular rib 7 is formed by progress dry glue after drawing glue.Ring is formed by drawing glue and then carrying out dry glue
Shape rib 7, simple operation are convenient to carry out.So, by being carried out a little within 302 1 weeks in the periphery non-photo-sensing area of image sensor chip 3
Glue simultaneously carries out dry glue, forms a ring shape rib 7, can stop that capsulation material enters image sensor chip in moulding process
Photosensitive area 301, and can prevent mould in moulding process from weighing the photosensitive area 301 of image sensor chip 3 wounded.Image sensing of the present invention
The Making programme of device encapsulating structure is as follows：On the basis of conventional package, increase reinforcing plate 2, use glue bonding or SMT scolding tin
Mode is fixed on pcb board 1 the originally position of bonding image sensor chip；Then image sensor chip 3 is adhered to and added
On strong plate 2, then by COB (chip on board) technique routings by image sensor chip 3 gold thread 8 and the upper table of pcb board 1
Second weld pad 104 on face periphery is connected, then carries out capsulation material molding pressing mold, forms plastic-sealed body 4, that is, forms image of the present invention and pass
Sensor encapsulating structure, so, by setting up reinforcing plate between pcb board and image sensor chip, effectively improve and molded
Pcb board and image sensor chip warpage caused by being influenceed in journey due to molding pressure and injection temperature, so as to lift camera
Module properties of product.
In the present embodiment, reinforcing plate 2 is arranged at the upper surface of pcb board 1, i.e., installation diagram is as sensor core in conventional package
The position of piece, image sensor chip 3 are located in reinforcing plate 2, further, in other embodiments, image sensor package
The number of reinforcing plate 2 is two in structure, and two reinforcing plates 2 are respectively arranged at the upper and lower surface of pcb board 1, image
Sensor chip 3 is arranged in the reinforcing plate of pcb board upper surface, so in the present embodiment, by same on pcb board two sides
When mount reinforcing plate, can more preferably prevent pcb board and image sensor chip from being deformed in moulding process, produce warpage, so as to
Lift camera module properties of product.
Second embodiment
Fig. 4 is second embodiment of the invention image sensor package section of structure, and Fig. 5 is second embodiment of the invention figure
As sensor-packaging structure overall schematic, Fig. 6 is second embodiment of the invention image sensor package structure decomposition figure.Such as figure
4th, shown in Fig. 5 and Fig. 6, a kind of image sensor package structure, including pcb board 1, reinforcing plate 2, image sensor chip 3 and modeling
Seal body 4.The present embodiment includes most of technical characteristic in first embodiment, and its difference is, in pcb board upper surface formed with receipts
Receive groove 106, i.e., originally the position of bonding image sensor chip forms housing groove 106, and reinforcing plate 2 is placed in housing groove
In 106.So, reinforcing plate 2 is embedded into housing groove 106, avoids the chi for causing camera module when introducing reinforcing plate
Very little increase.It should be noted that the thickness of reinforcing plate 2 is not limited, when reinforcing plate 2 is accommodated in housing groove 106, reinforcing plate
2 height can be identical with the depth of housing groove, can also be higher or lower than the depth of housing groove, it is preferable that reinforcing plate 2
Height and housing groove depth same or below housing groove depth, so, the caliper portion of image sensor chip 3
Or all house into housing groove 106, to reach the purpose for reducing image sensor package height.
Image sensor package structure of the present invention is applied to all camera modules using Molding plastic packaging classes, in mould
Plastic-sealed body over-assemble support, optical filter and the camera lens formed after modeling, or directly in plastic-sealed body over-assemble optical filter and camera lens, it is complete
Into the assembling of camera module.
As the presently preferred embodiments, below in conjunction with accompanying drawing 7 and Fig. 8, warpage preventing camera of the present invention is applied to camera module
Module is described in detail.
Fig. 7 shows an a kind of embodiment of camera module of the present invention, applies the warpage preventing of above-mentioned first embodiment
Image sensor package structure, including pcb board 1, reinforcing plate 2, image sensor chip 3 and plastic-sealed body 4, in addition to optical filter 9
With lens assembly 10, middle side part is formed with subsidence trough 402 on plastic-sealed body 4, in the periphery of optical filter 9 attachment to subsidence trough 402,
I.e. optical filter is covered on the light hole 401 of plastic-sealed body 4, relative with the photosensitive area of image sensor chip 3；Lens assembly 10 is installed
In the upside of plastic-sealed body 4.So, by increasing reinforcing plate 2 between image sensor chip 3 and pcb board 1, can be effectively improved
Pcb board warpage and image sensor chip warpage caused by the pressure and injection temperature of molding pressing mold, so as to lift shooting head mould
Set product performance.Preferably, forming a ring shape rib 7 within one week in 3 periphery non-photo-sensing area of image sensor chip, can stop
Capsulation material enters the photosensitive area of image sensor chip 3 in moulding process, and can prevent that mould weighs image wounded in moulding process
The photosensitive area of sensor chip；Preferably, the camera module by the plastic-sealed body that capsulation material is formed by imaging sensor core
The non-photo-sensing area 302 of piece 3 and the first weld pad 303 thereon, the thereon pcb board 1 on the periphery of non-photo-sensing area 302 and the second weld pad 104
It is coated on simultaneously in it with the grade of passive device 4, forms an overall plastic package structure, with conventional stent compared with pcb board combines, subtract
Lack space shared by support, so as to reach the purpose for reducing camera module size, and enhance the reliability of product.
Fig. 8 shows another embodiment of camera module of the present invention, and the embodiment applies above-mentioned second embodiment
Warpage preventing image sensor package structure, the difference of the miniaturization camera module of the warpage preventing gone out with Fig. 7 examples be,
In the middle part of pcb board housing groove 106, reinforcing plate are formed formed with housing groove 106, the i.e. position of pre-bonded image sensor chip
2 are placed in housing groove 106.So, reinforcing plate 2 is embedded into housing groove 106, avoids causing to take the photograph when introducing reinforcing plate
As the size increase of head mould group.Preferably, the depth of the height of reinforcing plate 2 and the depth of housing groove same or below housing groove
Degree, so, in the caliper portion of image sensor chip 3 or all collecting to housing groove 106, to reach reduction image sensing
The purpose of device packaging height.
The invention also provides a kind of camera module preparation method, comprise the following steps：
1) providing a pcb board and an at least reinforcing plate, the pcb board has upper surface and relative lower surface, will wherein
One reinforcing plate is fixed on the pcb board upper surface middle part position, and pcb board upper surface periphery is provided with multiple second weld pads；
2) image sensor chip is provided, described image sensor chip has photosensitive area and around the photosensitive area
Non-photo-sensing area, multiple first weld pads are provided with the non-photo-sensing area；After described image sensor chip attachment to step 1
In reinforcing plate, and first weld pad the second weld pad corresponding with the pcb board is electrically connected with by routing mode；
3) by the pcb board after step 2 be positioned over one be used for mold mould in, using capsulation material molding method,
A plastic-sealed body is formed on the pcb board, the plastic-sealed body coats the non-photo-sensing area of described image sensor chip, and the plastic-sealed body
On the light hole formed with the exposure photosensitive area；
4) optical filter and a lens assembly are provided, the lens assembly is directly mounted on the plastic-sealed body or passed through
Support is installed on the plastic-sealed body, and the optical filter is arranged between the lens assembly and described image sensor chip.
The preparation method for proposing a kind of miniaturization camera module of warpage preventing as the method that is preferable to carry out, the present invention,
Comprise the following steps：
1) pcb board 1, an image sensor chip 3 and a reinforcing plate 2 are provided, close to the position shape at edge on pcb board 1
Into there is passive device 105, reinforcing plate 2 is first fixed on pre-bonded image on pcb board 1 using glue bonding or SMT scolding tin mode
The position of sensor chip, then, picture glue or gluing are carried out in this reinforcing plate 2, image sensor chip 3 is adhered to and added
On strong plate 2, then by COB techniques routing image sensor chip gold thread is connected with the second weld pad 104 on pcb board 1；
2) the non-photo-sensing area on the periphery of image sensor chip 3 after step 1 carries out picture glue for 302 1 weeks and carries out dry glue,
Form annular rib 7；Dispensing being carried out image sensor chip periphery non-photo-sensing area one week, being moulded during for stopping follow-up molding
Closure material enters the photosensitive area of image sensor chip；
3) by the pcb board 1 after step 2 be positioned over one be used for mold mould in, the lower mould of the mould point and upper mould, in upper mould
Portion has the stepped boss of umbo, is pressed together on after matched moulds, in the middle part of boss on annular rib, the step edges of boss
With pcb board border certain distance (to form the subsidence trough of accommodating optical filter), formed ring on image sensor chip
The die cavity that passive device and gold thread are accommodated on part, pcb board outside the ladder of shape rib and boss, then, into die cavity
Inject capsulation material, formed a plastic-sealed body, the plastic-sealed body by passive device, gold thread, annular rib, image sensor chip and
Pcb board is cast on together to form an entirety, and middle side part corresponds to the part formation subsidence trough of the ladder of boss on plastic-sealed body；Its
In, when pcb board is Rigid Flex, after matched moulds, upper mould corresponds to hardboard area and the join domain position of flexible board area and can grown
Projection, during molding, this projection is pressed together on RFPC hardboard area, to stop that the capsulation material such as epoxy resin flows into
Flexible board area, in this manner it is possible to be cast on together passive device and gold thread in RFPC hardboards area head surrounding using capsulation material
Form an entirety.
4) optical filter, such as infrared fileter (infrared are provided：IR the optical filtering) or in other camera modules used
Optical filter is adhered in the subsidence trough in the middle part of plastic-sealed body by piece by adhering process, makes light hole and image sensor chip
Photosensitive area is relative；That is optical filter is fixed on plastic-sealed body by adhering process, this plastic-sealed body is reserved in molding
Subsidence trough, i.e., step is with central through hole surrounding, preferably, being reserved with escape hole on plastic-sealed body one side, sunk recessed
Escape air drain formed with connection escape hole in groove bottom, can by optical filter in step dispensing in one week for escaping gas during viscose glue dry glue
Directly it is fitted on step；
5) glue is drawn in plastic-sealed body upper surface, lens assembly is bonded in plastic-sealed body upper surface, completes whole camera module
Assembling, referring to Fig. 7.
Design of the present invention preferably can be applied on mobile phone or tablet personal computer, be it is a kind of using pcb board+plastic packaging+plus
The miniaturization camera module scheme that strong plate+optical filter barbola work forms；For image sensor chip photosensitive area compared with
It is small, rather than photosensitive area is larger, and have the situation of enough distances apart from pcb board edge, so, plastic-sealed body is left for outside annular rib
Space it is also larger, after subsidence trough is formed, plastic packaging body sidewall (side wall of subsidence trough surrounding) will not be too thin, installation mirror
During head assembly, effective support can be played.This camera module scheme, will first by glue bonding or SMT scolding tin mode
Reinforcing plate is fixed on the position of pre-bonded image sensor chip on pcb board, and picture glue (gluing) is then carried out in this reinforcing plate,
Image sensor chip is adhered in reinforcing plate, then draws within one week glue in the non-photo-sensing area of image sensor chip and is done
Glue, then molded, so, the upper molding of mould on a circle glue, can stop that capsulation material enters photosensitive area, in addition herein
Can prevent that mould from weighing the photosensitive area of image sensor chip wounded, and because reinforcing plate is with the presence of rigidity, mold pressing mold pressure and
Image sensor chip warpage caused by injection temperature can be effectively improved the modification of pcb board, so as to lift camera module product
Performance.This camera module scheme forms plastic-sealed body by plastic package process and replaces conventional stent, can reduce camera module size,
Simultaneously because among passive device and gold thread all are cast in into plastic-sealed body, product reliability is enhanced.Because the miniaturization is taken the photograph
As head mould prescription case is first to carry out molding to form plastic-sealed body, then by optical filter directly against the subsidence trough being attached on plastic-sealed body
It is interior, optical filter can be avoided to be damaged in molding, so as to influence product quality.
Above example is referring to the drawings, to a preferred embodiment of the present invention will be described in detail.Those skilled in the art
Member by above-described embodiment carry out various forms on modification or change, but without departing substantially from the present invention essence in the case of, all
Fall within the scope and spirit of the invention.
Claims (14)
- A kind of 1. image sensor package structure, it is characterised in that：Including pcb board, it has upper surface and relative lower surface； Image sensor chip；At least a reinforcing plate and plastic-sealed body, wherein, a reinforcing plate is arranged at the upper surface of the pcb board, institute Image sensor chip is stated to be located in the reinforcing plate of the pcb board upper surface, described image sensor chip have photosensitive area and Around the non-photo-sensing area of the photosensitive area, multiple first weld pads are provided with the non-photo-sensing area, are surrounded on the pcb board described Multiple second weld pads, first weld pad corresponding with the pcb board second are provided with the periphery of image sensor chip Weld pad is electrically connected with by routing mode；The plastic-sealed body molds to be formed by capsulation material, and the plastic-sealed body coats image biography The non-photo-sensing area of sensor chip, and light hole of the plastic-sealed body formed with the exposure photosensitive area.
- 2. image sensor package structure according to claim 1, it is characterised in that：The number of the reinforcing plate is two Individual, two reinforcing plates are respectively arranged at the upper and lower surface of the pcb board.
- 3. image sensor package structure according to claim 1, it is characterised in that：The pcb board upper surface formed with Housing groove, the reinforcing plate are arranged in the housing groove.
- 4. image sensor package structure according to claim 1, it is characterised in that：The reinforcing plate be stainless steel substrates or Person's ceramic substrate.
- 5. image sensor package structure according to claim 1, it is characterised in that：Formed with one in the non-photo-sensing area Circle surrounds the annular rib of the photosensitive area, passes through plastic packaging material in the non-photo-sensing area outside the annular rib and on the pcb board Material molding forms the plastic-sealed body, and first weld pad, second weld pad and routing are coated on interior by the plastic-sealed body.
- 6. image sensor package structure according to claim 5, it is characterised in that：After the annular rib is by drawing glue Dry glue is carried out to be formed.
- 7. image sensor package structure according to claim 1, it is characterised in that：Described image sensor chip perimeter Pcb board on be provided with passive device, the passive device is coated in the plastic-sealed body.
- A kind of 8. camera module, it is characterised in that：Including the image sensor package knot described in claim any one of 1-7 Structure, in addition to optical filter and lens assembly, the lens assembly are directly mounted on the plastic-sealed body or are installed on by support On the plastic-sealed body, the optical filter is arranged between the lens assembly and described image sensor chip.
- 9. camera module according to claim 8, it is characterised in that：The lens assembly is directly mounted at the plastic packaging On body, middle side part is formed with subsidence trough on the plastic-sealed body, and the optical filter attachment is arrived in the subsidence trough, described in covering Light hole is simultaneously relative with the photosensitive area of described image sensor chip；The lens assembly is installed on the upside of the plastic-sealed body.
- 10. camera module according to claim 8, it is characterised in that：The lens assembly is installed on institute by support State on plastic-sealed body, the support includes rack body and the through hole being formed in the middle part of the rack body, the bore periphery shape Into there is subsidence trough, the optical filter attachment is arrived in the subsidence trough of the bore periphery；Middle side part is formed on the plastic-sealed body There is storage tank, in the support attachment with optical filter to the storage tank, make the optical filter and described image sensor chip Photosensitive area it is relative；The lens assembly is installed on the upside of the support and the plastic-sealed body.
- 11. a kind of camera module preparation method, it is characterised in that comprise the following steps：1) providing a pcb board and an at least reinforcing plate, the pcb board has upper surface and relative lower surface, wherein one will add Strong plate is fixed on the pcb board upper surface middle part position, and pcb board upper surface periphery is provided with multiple second weld pads；2) image sensor chip is provided, described image sensor chip has photosensitive area and the non-sense around the photosensitive area Light area, multiple first weld pads are provided with the non-photo-sensing area；By described image sensor chip attachment to the reinforcement after step 1 On plate, and first weld pad the second weld pad corresponding with the pcb board is electrically connected with by routing mode；3) by the pcb board after step 2 be positioned over one be used for mold mould in, using capsulation material molding method, described A plastic-sealed body is formed on pcb board, the plastic-sealed body coats the non-photo-sensing area of described image sensor chip, and shape on the plastic-sealed body Into the light hole for having the exposure photosensitive area；4) optical filter and a lens assembly are provided, the lens assembly is directly mounted on the plastic-sealed body or passed through support It is installed on the plastic-sealed body, the optical filter is arranged between the lens assembly and described image sensor chip.
- 12. camera module preparation method according to claim 11, it is characterised in that：The number of the reinforcing plate is two Individual, two reinforcing plates are respectively arranged at the upper and lower surface of the pcb board.
- 13. camera module preparation method according to claim 11, it is characterised in that the pcb board upper surface is formed There is housing groove, the reinforcing plate is arranged in the housing groove.
- 14. camera module preparation method according to claim 11, it is characterised in that：In the non-photo-sensing area formed with One circle surrounds the annular rib of the photosensitive area, passes through plastic packaging in the non-photo-sensing area outside the annular rib and on the pcb board Material molds to form the plastic-sealed body, and first weld pad, second weld pad and routing are coated on interior by the plastic-sealed body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710748850.3A CN107395938A (en) | 2017-08-28 | 2017-08-28 | Image sensor package structure, there is its camera module and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710748850.3A CN107395938A (en) | 2017-08-28 | 2017-08-28 | Image sensor package structure, there is its camera module and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107395938A true CN107395938A (en) | 2017-11-24 |
Family
ID=60345573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710748850.3A Pending CN107395938A (en) | 2017-08-28 | 2017-08-28 | Image sensor package structure, there is its camera module and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107395938A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107833836A (en) * | 2017-11-28 | 2018-03-23 | 信利光电股份有限公司 | A kind of single camera module and its processing method |
| CN108121364A (en) * | 2017-12-15 | 2018-06-05 | 上海索广电子有限公司 | The position adjustment and method of a kind of imaging sensor |
| CN108134898A (en) * | 2018-01-30 | 2018-06-08 | 维沃移动通信有限公司 | The assemble method and mobile terminal of a kind of camera module, camera module |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| CN110213473A (en) * | 2019-07-08 | 2019-09-06 | Oppo（重庆）智能科技有限公司 | The production method of camera module, electronic device and camera module |
| WO2021017746A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, image capture module, and fabrication method therefor |
| CN112714239A (en) * | 2019-10-25 | 2021-04-27 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, method thereof and electronic equipment |
| CN115514864A (en) * | 2021-06-04 | 2022-12-23 | 胜丽国际股份有限公司 | Solderless sensing lens |
| CN115514863A (en) * | 2021-06-04 | 2022-12-23 | 胜丽国际股份有限公司 | Solderless sensing lens |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202150457U (en) * | 2011-07-14 | 2012-02-22 | 杭州海康威视数字技术股份有限公司 | Assembly used for fixing charge-coupled device |
| CN104796588A (en) * | 2015-03-10 | 2015-07-22 | 南昌欧菲光电技术有限公司 | Camera module |
| CN106973210A (en) * | 2017-05-16 | 2017-07-21 | 昆山丘钛微电子科技有限公司 | Plastic packaging adds stent-type to minimize cam device and preparation method thereof |
| CN107071252A (en) * | 2017-05-16 | 2017-08-18 | 昆山丘钛微电子科技有限公司 | Direct attaching type miniaturization cam device of optical filter and preparation method thereof |
| CN207399341U (en) * | 2017-08-28 | 2018-05-22 | 昆山丘钛微电子科技有限公司 | Image sensor package structure and with its camera module |
-
2017
- 2017-08-28 CN CN201710748850.3A patent/CN107395938A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202150457U (en) * | 2011-07-14 | 2012-02-22 | 杭州海康威视数字技术股份有限公司 | Assembly used for fixing charge-coupled device |
| CN104796588A (en) * | 2015-03-10 | 2015-07-22 | 南昌欧菲光电技术有限公司 | Camera module |
| CN106973210A (en) * | 2017-05-16 | 2017-07-21 | 昆山丘钛微电子科技有限公司 | Plastic packaging adds stent-type to minimize cam device and preparation method thereof |
| CN107071252A (en) * | 2017-05-16 | 2017-08-18 | 昆山丘钛微电子科技有限公司 | Direct attaching type miniaturization cam device of optical filter and preparation method thereof |
| CN207399341U (en) * | 2017-08-28 | 2018-05-22 | 昆山丘钛微电子科技有限公司 | Image sensor package structure and with its camera module |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107833836A (en) * | 2017-11-28 | 2018-03-23 | 信利光电股份有限公司 | A kind of single camera module and its processing method |
| CN108121364A (en) * | 2017-12-15 | 2018-06-05 | 上海索广电子有限公司 | The position adjustment and method of a kind of imaging sensor |
| US11297210B2 (en) | 2018-01-30 | 2022-04-05 | Vivo Mobile Communication Co., Ltd. | Camera module, method for assembling camera module, and mobile terminal |
| CN108134898A (en) * | 2018-01-30 | 2018-06-08 | 维沃移动通信有限公司 | The assemble method and mobile terminal of a kind of camera module, camera module |
| CN108134898B (en) * | 2018-01-30 | 2020-04-10 | 维沃移动通信有限公司 | Camera module, assembling method of camera module and mobile terminal |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| CN110213473A (en) * | 2019-07-08 | 2019-09-06 | Oppo（重庆）智能科技有限公司 | The production method of camera module, electronic device and camera module |
| WO2021017746A1 (en) * | 2019-08-01 | 2021-02-04 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, image capture module, and fabrication method therefor |
| CN112714239A (en) * | 2019-10-25 | 2021-04-27 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, method thereof and electronic equipment |
| CN112714239B (en) * | 2019-10-25 | 2022-07-22 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, method thereof and electronic equipment |
| CN115514864A (en) * | 2021-06-04 | 2022-12-23 | 胜丽国际股份有限公司 | Solderless sensing lens |
| CN115514863A (en) * | 2021-06-04 | 2022-12-23 | 胜丽国际股份有限公司 | Solderless sensing lens |
| CN115514863B (en) * | 2021-06-04 | 2023-10-27 | 同欣电子工业股份有限公司 | Non-welding type sensing lens |
| CN115514864B (en) * | 2021-06-04 | 2024-01-23 | 同欣电子工业股份有限公司 | Non-welding type sensing lens |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107395938A (en) | Image sensor package structure, there is its camera module and preparation method | |
| CN107071252A (en) | Direct attaching type miniaturization cam device of optical filter and preparation method thereof | |
| CN106993123B (en) | Miniaturized camera device and manufacturing method thereof | |
| CN109510932B (en) | Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module | |
| CN106973210A (en) | Plastic packaging adds stent-type to minimize cam device and preparation method thereof | |
| US7405764B2 (en) | Miniature camera module | |
| US6541284B2 (en) | Integrated IC chip package for electronic image sensor die | |
| CN206712912U (en) | Minimize cam device | |
| CN102738188B (en) | Solid state imaging unit, the method manufacturing solid state imaging unit, and electronic equipment | |
| KR100652375B1 (en) | Image sensor module structure comprising a wire bonding package and method of manufacturing the same | |
| CN108401093A (en) | Camera module and its molding photosensory assembly and manufacturing method and electronic equipment | |
| CN102891152B (en) | Semiconductor package body | |
| CN101752323A (en) | Image sensor camera module and method of manufacturing the same | |
| CN101170118B (en) | Image sensor encapsulation, image sensor module and their making method | |
| TW201801512A (en) | Camera module, and photosensitive component thereof and manufacturing method therefor | |
| CN107734227A (en) | Image sensor package structure, camera module and preparation method thereof | |
| CN109246348B (en) | Lens module, packaging method thereof and electronic equipment | |
| CN105847645A (en) | Shooting module based on integrated packaging technology, and integrated pedestal assembly and manufacturing method thereof | |
| CN115134490B (en) | Sinking camera module, sinking photosensitive assembly and manufacturing method thereof | |
| CN207200830U (en) | The direct attaching type miniaturization cam device of optical filter | |
| CN109461748B (en) | Packaging structure and packaging method of optical element | |
| CN206948450U (en) | Plastic packaging adds stent-type to minimize cam device | |
| CN107734215A (en) | Camera module and its molding photosensory assembly and manufacture method and electronic equipment | |
| CN207460338U (en) | Image sensor package structure and camera module | |
| CN107734216A (en) | Array camera module and its molding photosensory assembly and manufacture method and the electronic equipment with array camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |