CN107833836A - A kind of single camera module and its processing method - Google Patents
A kind of single camera module and its processing method Download PDFInfo
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- CN107833836A CN107833836A CN201711215426.9A CN201711215426A CN107833836A CN 107833836 A CN107833836 A CN 107833836A CN 201711215426 A CN201711215426 A CN 201711215426A CN 107833836 A CN107833836 A CN 107833836A
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- 238000005538 encapsulation Methods 0.000 claims abstract description 46
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The embodiment of the invention discloses a kind of single camera module and its processing method, including the functional pin for being positioned over the bare chip of package substrate upper surface is connected on the side pad for being arranged at package substrate side wall, weldable material is arranged at the side pad；Packaging protection layer is loaded on bare chip by degradable adhesive plaster, and applies degradable viscose glue in packaging protection layer surrounding side wall and forms encapsulation chip；Will encapsulation chip attachment on single mode group substrate, and weldable material is soldered to formation single mode group bare bones in the solder pad of module group substrates；In single mode group bare bones, the non-encapsulated protective layer encapsulation of bare chip region is pointed to using capsulation material and whole components are packaged, forms plastic packaging single mode group bare bones；Packaging protection layer is drawn and peeled off, and removes degradable viscose glue and forms single plastic packaging module；Optical filter and camera lens are carried to formation single camera module on single plastic packaging module.Reduce the volume and production cost of single camera module.
Description
Technical field
The present embodiments relate to camera module technical field, more particularly to a kind of single camera module and its processing
Method.
Background technology
With the development of science and technology, more and more higher of the people to the image quality requirements of picture pick-up device, is meeting higher shooting
In the case of quality, the frivolous of picture pick-up device has become development trend.In camera module field, the encapsulation of single camera module
Manufacture craft influences the production cost and modular volume of whole single camera module.
Existing module manufacture craft is mainly using the mode of COB encapsulation (Chips on Board, chip on board encapsulation)
COB modules are made, and COB modules are mounted in above sensitive chip by base, base is used as sealing and the work of support camera lens
With specifically refer to Fig. 1.On the one hand, COB packaging technologies module is using bare chip binding gold thread, i.e., using gold thread by bare chip
Get up with the connection of wiring board, substrate connection of the sensitive chip by way of bonding gold thread with single camera module, need
Certain spacing is designed with other devices of module, and makes the cost rise of whole single camera module using binding gold thread；Separately
On the one hand, COB modules are carried using base, because base side wall is thick generally by 0.3mm, the component in module is apart from base side
Wall at least 0.12mm, so that it is 0.42mm that component most descends size A apart from the outer peripheral distance of module group substrates, so that
The volume of whole single camera module is relatively large.
In consideration of it, how on the basis of single camera module photographic effect is ensured, reduce single camera modular volume, drop
Low single camera production cost is those skilled in the art's urgent problem to be solved.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of single camera module and its processing method, reduces single camera mould
The volume and production cost of group, are advantageous to the miniaturization of single camera module.
In order to solve the above technical problems, the embodiments of the invention provide a kind of processing method of single camera module, including：
The functional pin for the bare chip for being positioned over package substrate upper surface is connected to and is arranged at the package substrate side wall
Side pad on, and weldable material is arranged at the side pad；
Packaging protection layer is loaded on the bare chip by degradable adhesive plaster, to protect the photosensitive area of the bare chip
Domain, and degradable viscose glue is applied in the packaging protection layer surrounding side wall, to form encapsulation chip；
By the encapsulation chip attachment on single mode group substrate, and the weldable material is soldered to the module group substrates
Solder pad on, formed single mode group bare bones；The single mode group substrate is preset with several components；
In the single mode group bare bones, described bare chip is pointed to using capsulation material not sealed by the packaging protection layer
The region of dress and whole components are packaged, to form plastic packaging single mode group bare bones；The capsulation material and the envelope
The upper surface for filling protective layer is concordant；
The packaging protection layer is drawn and peeled off, and removes the degradable viscose glue, so that the photosensitive area of the bare chip
Domain is exposed, forms single plastic packaging module；
Optical filter and camera lens are carried to formation single camera module on single plastic packaging module.
Optionally, the functional pin by the bare chip for being positioned over package substrate upper surface is connected to the package substrate
Side pad on be：
The functional pin for the bare chip for being positioned over package substrate upper surface is connected to by semiconductor leads technique described
On the side pad of package substrate.
Optionally, it is described that the functional pin of the bare chip is connected to by the package substrate by semiconductor leads technique
Side pad on be：
The functional pin of the bare chip is connected to by way of semiconductor side lead or semiconductor perforate lead
On the side pad of the package substrate.
Optionally, it is described by the encapsulation chip attachment in being on single mode group substrate：
By the encapsulation chip by way of drawing glue, or single mode group base is mounted on by way of attaching semisolid viscose glue
On plate.
Optionally, described weldable material is arranged at the side pad is：
Tin ball is arranged at the side pad edge.
Optionally, described be soldered to the weldable material in the solder pad of the single mode group substrate is：
The weldable material is soldered to the solder pad of the single mode group substrate point by point by way of laser spot welding
On.
Optionally, it is described to be by top of the degradable adhesive plaster loaded on the bare chip by packaging protection layer：
By packaging protection layer by light sensation viscose glue in the top of the bare chip.
Optionally, the packaging protection layer is the packaging protection layer being made based on exotic material.
Optionally, it is described to include packaging protection layer absorption stripping：
Using light sensation viscose glue described in ultra violet lamp, to be degraded to the light sensation viscose glue；
The packaging protection layer is drawn to stripping from the light sensation viscose glue after degraded.
The embodiment of the present invention provides a kind of single camera module, including camera lens and optical filter, in addition to one accordingly
Bare chip, a package substrate, single mode group substrate and capsulation material；
The functional pin of the bare chip is connected on the side pad of the package substrate by semiconductor leads；It is described
Weldable material is provided with the side pad of package substrate；
The package substrate is connected to by the weldable material in the solder pad of the single mode group substrate, is formed single
Module bare bones；Several components and the solder pad are preset with the single mode group substrate；
The capsulation material is basic by other regions outside the photosensitive region of the bare chip and the single mode group
Whole components on part carry out plastic packaging, to form single plastic packaging module；
The camera lens and the optical filter are equipped on single plastic packaging module.
The embodiments of the invention provide a kind of camera module and its processing method, including package substrate upper table will be positioned over
The functional pin of the bare chip in face is connected on the side pad for being arranged at package substrate side wall, and weldable material is arranged at
At the pad of side；Packaging protection layer to protect photosensitive region, and is protected by degradable adhesive plaster loaded on bare chip in encapsulation
Sheath surrounding side wall applies degradable viscose glue, to form encapsulation chip；Will encapsulation chip attachment on single mode group substrate, and can
Welding material is soldered in the solder pad of module group substrates, forms single mode group bare bones；Single mode group substrate is preset with several yuan
Device；In single mode group bare bones, the non-encapsulated protective layer encapsulation of bare chip region and whole are pointed to using capsulation material
Component is packaged, to form plastic packaging single mode group bare bones；Capsulation material is concordant with the upper surface of packaging protection layer；Will encapsulation
Protective layer, which is drawn, to be peeled off, and removes degradable viscose glue, so that the photosensitive region of bare chip is exposed, forms single plastic packaging module；Will filter
Mating plate and camera lens are carried to formation single camera module on single plastic packaging module.
It can be seen that the functional pin of bare chip of the embodiment of the present invention is connected on the side pad of package substrate, and by can
Welding material is by the solder pad of the side pad of package substrate and single mode group substrate, it is not necessary to is connected, saved using gold thread
Cost；During plastic packaging is carried out to single mode group bare bones, the sense of bare chip can be effectively protected by packaging protection layer
Light region, and the plastic package structure that single plastic packaging module is formed by capsulation material carries camera lens and optical filter, avoids using base
Carry, reduce component and the outer peripheral distance of single mode group substrate, so as to reduce the volume of whole single camera module.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in prior art and embodiment
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of existing structural representation of single camera module；
Fig. 2 is a kind of schematic flow sheet of single camera module processing method provided in an embodiment of the present invention；
Fig. 3 is a kind of structural representation of package substrate provided in an embodiment of the present invention；
Fig. 4 is the diagrammatic cross-section of a kind of bare chip provided in an embodiment of the present invention and package substrate integrated structure；
Fig. 5 is the schematic top plan view of a kind of bare chip provided in an embodiment of the present invention and package substrate integrated structure；
Fig. 6 is under a kind of embodiment provided in an embodiment of the present invention that degradable viscose glue is coated on bare chip
Structure top view；
Fig. 7 is under a kind of embodiment provided in an embodiment of the present invention that degradable viscose glue is coated on bare chip
Structure sectional view；
Fig. 8 is a kind of structural representation for encapsulating chip provided in an embodiment of the present invention；
Fig. 9 is a kind of structural representation of single mode group substrate provided in an embodiment of the present invention；
Figure 10 is a kind of structural representation for encapsulating chip and single mode group substrate provided in an embodiment of the present invention；
Figure 11 be a kind of plastic packaging provided in an embodiment of the present invention before single mode group bare bones structural representation；
Figure 12 is a kind of structural representation of plastic packaging single mode group bare bones provided in an embodiment of the present invention；
Figure 13 is a kind of structural representation of the single plastic packaging module provided in the embodiment of the present invention；
Figure 14 is a kind of structural representation by single camera module provided in the embodiment of the present invention；
Figure 15 is that the functional pin of bare chip provided in an embodiment of the present invention is connected to using a kind of semiconductor leads technique
The structural representation of the side pad of package substrate；
Figure 16 is that the functional pin of bare chip provided in an embodiment of the present invention is connected using another semiconductor leads technique
To the structural representation of the side pad of package substrate；
Figure 17 connects package substrate and single mode group substrate for one kind provided in an embodiment of the present invention using laser spot welding mode
Structural representation.
Embodiment
The embodiments of the invention provide a kind of single camera module and its processing method, the body of single camera module is reduced
Product and production cost, are advantageous to the miniaturization of single camera module.
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Fig. 2 is refer to, Fig. 2 is that a kind of flow of single camera module processing method provided in an embodiment of the present invention is illustrated
Figure.
This method includes：
S11：The functional pin for the bare chip for being positioned over package substrate upper surface is connected to and is arranged at package substrate side wall
Side pad on, and weldable material is arranged at the pad of side；
It should be noted that Fig. 3 to Fig. 5 is refer to, can be in advance referring initially to the Outside Dimensions design encapsulation base of bare chip 11
The Outside Dimensions of plate 12, and make the Outside Dimensions of package substrate 12 be slightly larger than the Outside Dimensions of bare chip 11, package substrate 12
Outside Dimensions and the difference of Outside Dimensions of bare chip 11 can be determined according to actual conditions.As shown in figure 3, package substrate
It is provided with side pad 121 in 12 side wall, the specific distribution situation of side pad 121 is according to the functional pin of bare chip 11
111 distribution is determined, then the functional pin 111 of bare chip 11 is connected to the side of package substrate 12 by package lead 14
After side pad 121, weldable material 13 is set at side pad 121, is easy to encapsulate subsequently through the weldable material 13
Substrate 12 is soldered on single mode group substrate.The embodiment of the present invention need not be by the way of gold thread be bound by the functional pin of bare chip
It is connected on single mode group substrate, greatly reduces cost.
Specifically, side pad can be set in the embodiment of the present invention in a side wall of package substrate 12, can also
Side pad is set in two, three or four side walls, and concrete form depending on actual conditions, do not do by the embodiment of the present invention
Limit.In addition, package substrate 12 can use one kind in FPC soft boards, PCB hardboards or Rigid Flex, naturally it is also possible to adopt
With other kinds of wiring board, the application is not construed as limiting to this.
It should also be noted that, the present invention is can be by way of semiconductor leads by the work(of bare chip 11 in embodiment
Energy pin 111 is connected on the side pad 121 of package substrate 12.In addition, weldable material 13 is arranged at package substrate 12
At side pad 121, the bottom without being provided in package substrate 12 helps to reduce the thickness of encapsulation chip, is easy to whole list
The miniaturization of camera module.
S12：Packaging protection layer is loaded on bare chip by degradable adhesive plaster, to protect the photosensitive region of bare chip,
And degradable viscose glue is applied in packaging protection layer surrounding side wall, to form encapsulation chip；
, can be in the top surface mount package protection of bare chip in order to protect the photosensitive region of bare chip in encapsulation process
Layer.Specifically, Fig. 6-Fig. 8 is refer to, by the surrounding of photosensitive region 111 of the degradable viscose glue 14 coated in bare chip 11, and will
Packaging protection layer 15 is placed on coated degradable viscose glue 14, and then packaging protection layer 15 is mounted on bare chip 11,
And degradable viscose glue 14 is coated in the surrounding side wall of packaging protection layer 15, it is easy to the packaging protection layer 15 after the completion of plastic packaging
Draw and come out from degradable viscose glue 14.
S13：Will encapsulation chip attachment on single mode group substrate, and the welding that weldable material is soldered to module group substrates is welded
On disk, single mode group bare bones is formed；Single mode group substrate is preset with several components；
It should be noted that an encapsulation chip installation position is only provided with single mode group substrate, in advance will be other some
Individual component is welded on single mode group by SMT (Surface Mount Technology, the surface mounting technology) modes welded
On the relevant position of substrate, then by the encapsulation chip attachment made in setting on the single mode group substrate of other components, have
Body can will be encapsulated on chip attachment and single mode group substrate by way of drawing glue, as shown in figure 9, being set on single mode group substrate 2
Picture glue 21 is put, and each solder pad 22 is also pre-set on single mode group substrate 2, the bottom of encapsulation chip 1 that will have been mounted
The side pad 121 of package substrate side corresponding solder pad on single mode group substrate 2 is soldered to by weldable material 13
On 22, so as to which encapsulation chip 1 is connected on single mode group substrate 2, as shown in Figure 10.Due to gold need not be bound during this
Line, so shortening spacing between bare chip edge and component therefore, the embodiment of the present invention is advantageous to whole single camera
The miniaturization of module.
Specifically, weldable material can be soldered to single mode group substrate by way of laser welding or ultrasonic bonding
Solder pad on, specific welding manner is unlimited.In addition, single mode group substrate can use FPC soft boards, PCB hardboards or soft or hard knot
One kind in plywood, naturally it is also possible to use other kinds of wiring board, the application is not construed as limiting to this.
S14：The region of the non-encapsulated protective layer encapsulation of bare chip in single mode group bare bones is pointed to using capsulation material
And whole components are packaged, to form plastic packaging single mode group bare bones；Capsulation material is concordant with the upper surface of packaging protection layer；
It should be noted that after single mode group bare bones is made, single mode group bare bones is moulded using plastic package process
Envelope, wherein, plastic package process is that the liquid capsulation material of molten condition is filled into body surface, the object after capsulation material cooling
Sealed by the capsulation material of solid-state.Specifically, packaging protection layer is packaged with bare chip, and packaging protection layer only encapsulates
Photosensitive region, the non-encapsulated protective layer encapsulation in non-photo-sensing region in bare chip, so the capsulation material that finally cools down can will
The region of non-encapsulated protective layer encapsulation and other the whole components singly taken the photograph in module group substrates part are packaged in bare chip,
Also, the upper surface of the solid-state capsulation material after plastic packaging is concordant with the upper surface of packaging protection layer.Specifically, plastic packaging can be passed through
Die perfusion capsulation material, due to there is provided packaging protection layer during plastic packaging, so plastic packaging grinding tool will not be contacted directly
The photosensitive region of bare chip, so as to ensure that photosensitive region will not be contaminated, and it also ensure that bare chip will not be because bearing to press
Power and be damaged, wherein, the plastic packaging single mode group bare bones that is obtained after the single mode group bare bones and plastic packaging before plastic packaging specifically such as Figure 11 and
Shown in Figure 12, capsulation material 5 is irrigated to single mode group bare bones 3 by plastic package die 4 in Figure 11, to enter to single mode group bare bones 3
Row plastic packaging；As shown in Figure 12, the region that non-encapsulated protective layer encapsulates on bare chip 11, and whole components 6 are by plastic packaging
The plastic packaging of material 5, obtain plastic packaging single mode group bare bones.
Specifically, the capsulation material 5 in the embodiment of the present invention can be preferably epoxy resin, it is of course also possible to be other
Hot-melt resin material, do not limit specifically, the purpose of the embodiment of the present invention can be realized.
It should also be noted that, the solid-state capsulation material after the completion of plastic packaging can replace base to be used to support camera lens, and
The side wall of base is thicker, and the component in the single mode group bare bones after capsulation material plastic packaging and single mode group substrate edge away from
From shortening, for example, the component in the embodiment of the present invention can be accomplished apart from the outer peripheral minimum dimension of single mode group substrate
0.15mm, beneficial to the miniaturization of whole single camera module.
S15：Packaging protection layer is drawn and peeled off, and removes degradable viscose glue, so that the photosensitive region of bare chip is exposed, shape
Into single plastic packaging module；
It should be noted that taken out after plastic packaging, it is necessary to which packaging protection layer is taken the photograph in module bare bones from plastic packaging list
Come, can specifically be degraded by being degraded to the degradable viscose glue in plastic packaging single mode group bare bones, and in degradable viscose glue
Packaging protection layer is drawn from degradable viscose glue afterwards and is stripped out, now the photosensitive region 111 of bare chip 11 can expose
Come, then the degradation material after degraded is removed totally again, single plastic packaging module is now obtained, as Figure 13 shows single plastic sealed mould
Capsulation material 5, bare chip 11, package substrate 12, component 6 and single mode group substrate 2 in group.
S16：Optical filter and camera lens are carried to formation single camera module on single plastic packaging module.
Specifically, the solid-state capsulation material on single plastic packaging module can replace base, for supporting camera lens.By optical filter 8
It is mounted in successively with camera lens 9 on the single plastic packaging module 7 made, you can complete the making of single camera module, certainly, carrying
During also need to focusing detection.The structural representation of single camera module is as shown in figure 14.
The embodiments of the invention provide a kind of processing method of camera module, including package substrate upper surface will be positioned over
The functional pin of bare chip be connected on the side pad for being arranged at package substrate side wall, and weldable material is arranged at side
At the pad of side；Packaging protection layer is loaded on bare chip by degradable adhesive plaster, to protect photosensitive region, and in packaging protection
Layer surrounding side wall applies degradable viscose glue, to form encapsulation chip；Will encapsulation chip attachment on single mode group substrate, and will be solderable
Connect material to be soldered in the solder pad of module group substrates, form single mode group bare bones；Single mode group substrate is preset with several yuan of device
Part；In single mode group bare bones, the non-encapsulated protective layer encapsulation of bare chip region and all member are pointed to using capsulation material
Device is packaged, to form plastic packaging single mode group bare bones；Capsulation material is concordant with the upper surface of packaging protection layer；Encapsulation is protected
Sheath, which is drawn, to be peeled off, and removes degradable viscose glue, so that the photosensitive region of bare chip is exposed, forms single plastic packaging module；It will filter
Piece and camera lens are carried to formation single camera module on single plastic packaging module.
It can be seen that the functional pin of bare chip of the embodiment of the present invention is connected on the side pad of package substrate, and by can
Welding material is by the solder pad of the side pad of package substrate and single mode group substrate, it is not necessary to is connected, saved using gold thread
Cost；During plastic packaging is carried out to single mode group bare bones, the sense of bare chip can be effectively protected by packaging protection layer
Light region, and the plastic package structure that single plastic packaging module is formed by capsulation material carries camera lens and optical filter, avoids using base
Carry, reduce component and the outer peripheral distance of single mode group substrate, so as to reduce the volume of whole single camera module.
On the basis of above-described embodiment：
As a preferred embodiment, the functional pin for the bare chip for being positioned over package substrate upper surface is connected to envelope
Fill on the side pad of substrate and be：
The functional pin for the bare chip for being positioned over package substrate upper surface is connected to by encapsulation by semiconductor leads technique
On the side pad of substrate.
It should be noted that semiconductor leads technique is easy to use, it is not limited only to use semiconductor in the embodiment of the present invention
The functional pin of bare chip is connected on the side pad of package substrate by lead technique, can also be real in other way
Existing, the application does not do particular determination to this, can realize the purpose of the embodiment of the present invention.
As a preferred embodiment, the functional pin of bare chip is connected to by encapsulation base by semiconductor leads technique
It is on the side pad of plate：
The functional pin of bare chip is connected to encapsulation by way of semiconductor side lead or semiconductor perforate lead
On the side pad of substrate.
Specifically, the function of bare chip 11, which draws 111 pin, to pass through package lead in the way of the lead of semiconductor side
141 are connected on the side pad of package substrate 12, as shown in figure 15；It can also pass through by the way of semiconductor perforates lead
Package lead 142 is connected on the side pad of package substrate 12, as shown in figure 16.It is of course also possible to partly led by others
Body gage system is connected on the side pad of package substrate, and its specific implementation the application does not do unlimited to this.
As a preferred embodiment, will encapsulation chip attachment in being on single mode group substrate：
By encapsulation chip by way of drawing glue, or single mode group substrate is mounted on by way of attaching semisolid viscose glue
On.
It is, of course, also possible to will encapsulate chip attachment in other way on single mode group substrate, the application is specific to its
Implementation does not limit, and can realize the purpose of the embodiment of the present invention.
As a preferred embodiment, weldable material is arranged at the pad of side it is：
Tin ball is arranged at the pad edge of side.
Specifically, the weldable material in the embodiment of the present invention can be preferably tin ball, naturally it is also possible to for other gold
Belong to material.In addition, the metal filled of package substrate side wall is not limited only to set metal material, affixed metal piece etc. can also be used
Other forms realize that the application is not particularly limited to this.
As a preferred embodiment, weldable material is soldered in the solder pad of single mode group substrate and is：
Weldable material is soldered in the solder pad of single mode group substrate point by point by way of laser spot welding.
It should be noted that laser welding refers to being burnt on metal material by the pulse laser of indirect, metal material
Material is burnt moment by high energy and be in melting state, and then the metal pad hot melt combination on root module group substrates.
Specifically, it can use solderable at side pad of the pulse laser that laser-beam welding machine 10 is launched to encapsulating chip
Connect material and carry out spot welding one by one, be connected encapsulation chip and the solder pad of single mode group substrate, specifically refer to Figure 17.
As a preferred embodiment, it is by top of the degradable adhesive plaster loaded on bare chip by packaging protection layer：
By packaging protection layer by light sensation viscose glue in the top of bare chip.
It should be noted that light sensation viscose glue can be the viscose glue with ultraviolet lighting degraded viscosity in the embodiment of the present invention,
Can also be the light sensation viscose glue with other characteristics, such as glue for the viscosity that can be degraded by other special process etc., specifically
Do not limit.Certainly, the degradable viscose glue in the embodiment of the present invention is not limited only to use light sensation viscose glue, can also use others
Degradable viscose glue.
As a preferred embodiment, packaging protection layer is the packaging protection layer being made based on exotic material.
Specifically, when viscose glue degradable using high temperature degradation, in order to be damaged packaging protection layer, so the present invention is real
It can be the packaging protection layer that is made based on exotic material to apply the packaging protection layer in example, for example with glass, silica gel,
The packaging protection layer that the exotic materials such as resin make.It is of course also possible to use what the material with other characteristics was made
Packaging protection layer, it can be specifically determined according to actual conditions.
As a preferred embodiment, packaging protection layer absorption stripping is included：
Using ultra violet lamp light sensation viscose glue, to be degraded to light sensation viscose glue；
Packaging protection layer is drawn to stripping from the light sensation viscose glue after degraded.
It should be noted that when light sensation viscose glue is the viscose glue with ultraviolet lighting degraded viscosity, uviol lamp can be used
The mode of irradiation makes its degraded.It is of course also possible to use other modes make light sensation viscose glue degrade, specifically use which kind of mode can be with
It is determined according to the concrete property of light sensation viscose glue.
On the basis of above-described embodiment, the embodiment of the present invention provides a kind of single camera module accordingly, and this is singly taken the photograph
As head mould group includes camera lens and optical filter, in addition to a bare chip, a package substrate, single mode group substrate and capsulation material；
The functional pin of bare chip is connected on the side pad of package substrate by semiconductor leads；The side of package substrate
Weldable material is provided with the pad of side；
Package substrate is connected to by weldable material in the solder pad of single mode group substrate, forms single mode group bare bones；
Several components and solder pad are preset with single mode group substrate；
Capsulation material will be all first on other regions outside the photosensitive region of bare chip and single mode group bare bones
Device carries out plastic packaging, to form single plastic packaging module；
Camera lens and optical filter are equipped on single plastic packaging module.
It should be noted that the production cost and volume of single camera module provided in an embodiment of the present invention are reduced, have
Beneficial to the miniaturization of single camera module.In addition, the single camera module provided in the embodiment of the present invention is according to upper
State what the preparation method in embodiment of the method was made, its preparation method refer to above method embodiment, and the application is herein
Repeat no more.
It should also be noted that, in this manual, such as term " comprising ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, article or equipment including a series of elements not only include that
A little key elements, but also the other element including being not expressly set out, or also include for this process, method, article or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged
Except other identical element in the process including the key element, method, article or equipment being also present.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (10)
- A kind of 1. processing method of single camera module, it is characterised in that including：The functional pin for the bare chip for being positioned over package substrate upper surface is connected to the side for being arranged at the package substrate side wall On the pad of side, and weldable material is arranged at the side pad；Packaging protection layer is loaded on the bare chip by degradable adhesive plaster, to protect the photosensitive region of the bare chip, And degradable viscose glue is applied in the packaging protection layer surrounding side wall, to form encapsulation chip；By the encapsulation chip attachment on single mode group substrate, and the weldable material is soldered to the weldering of the module group substrates Connect on pad, form single mode group bare bones；The single mode group substrate is preset with several components；It is pointed to what in the single mode group bare bones, described bare chip was not encapsulated by the packaging protection layer using capsulation material Region and whole components are packaged, to form plastic packaging single mode group bare bones；The capsulation material is protected with the encapsulation The upper surface of sheath is concordant；The packaging protection layer is drawn and peeled off, and removes the degradable viscose glue, so that the photosensitive region of the bare chip is naked Dew, forms single plastic packaging module；Optical filter and camera lens are carried to formation single camera module on single plastic packaging module.
- 2. the processing method of single camera module according to claim 1, it is characterised in that described to be positioned over encapsulation base The functional pin of the bare chip of plate upper surface is connected on the side pad of the package substrate：The functional pin for the bare chip for being positioned over package substrate upper surface is connected to by the encapsulation by semiconductor leads technique On the side pad of substrate.
- 3. the processing method of single camera module according to claim 2, it is characterised in that described to pass through semiconductor leads The functional pin of the bare chip is connected on the side pad of the package substrate by technique：The functional pin of the bare chip is connected to by way of semiconductor side lead or semiconductor perforate lead described On the side pad of package substrate.
- 4. the processing method of single camera module according to claim 1, it is characterised in that described by the encapsulation chip It is mounted on single mode group substrate and is：By the encapsulation chip by way of drawing glue, or single mode group substrate is mounted on by way of attaching semisolid viscose glue On.
- 5. the processing method of single camera module according to claim 1, it is characterised in that described to set weldable material It is placed at the side pad and is：Tin ball is arranged at the side pad edge.
- 6. the processing method of the single camera module according to claim 1-5 any one, it is characterised in that described by institute State weldable material and be soldered in the solder pad of the single mode group substrate and be：The weldable material is soldered in the solder pad of the single mode group substrate point by point by way of laser spot welding.
- 7. the processing method of single camera module according to claim 6, it is characterised in that described to lead to packaging protection layer Crossing top of the degradable adhesive plaster loaded on the bare chip is：By packaging protection layer by light sensation viscose glue in the top of the bare chip.
- 8. the processing method of single camera module according to claim 7, it is characterised in that the packaging protection layer is base In the packaging protection layer that exotic material is made.
- 9. the processing method of single camera module according to claim 8, it is characterised in that described by the packaging protection Layer, which draws stripping, to be included：Using light sensation viscose glue described in ultra violet lamp, to be degraded to the light sensation viscose glue；The packaging protection layer is drawn to stripping from the light sensation viscose glue after degraded.
- 10. a kind of single camera module, including camera lens and optical filter, it is characterised in that also including a bare chip, an encapsulation Substrate, single mode group substrate and capsulation material；The functional pin of the bare chip is connected on the side pad of the package substrate by semiconductor leads；The encapsulation Weldable material is provided with the side pad of substrate；The package substrate is connected to by the weldable material in the solder pad of the single mode group substrate, forms single mode group Bare bones；Several components and the solder pad are preset with the single mode group substrate；The capsulation material is by other regions outside the photosensitive region of the bare chip and the single mode group bare bones Whole components carry out plastic packaging, to form single plastic packaging module；The camera lens and the optical filter are equipped on single plastic packaging module.
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| CN109547673A (en) * | 2017-09-21 | 2019-03-29 | 罗伯特·博世有限公司 | Method for manufacturing camara module and camara module group |
| CN109830492A (en) * | 2019-01-28 | 2019-05-31 | 深圳奥拦科技有限责任公司 | COB camera module and its packaging method |
| CN110061069A (en) * | 2019-04-30 | 2019-07-26 | 烟台艾睿光电科技有限公司 | A kind of WLP device encapsulating products |
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