CN209133532U - LED encapsulation module - Google Patents
LED encapsulation module Download PDFInfo
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- CN209133532U CN209133532U CN201821929108.9U CN201821929108U CN209133532U CN 209133532 U CN209133532 U CN 209133532U CN 201821929108 U CN201821929108 U CN 201821929108U CN 209133532 U CN209133532 U CN 209133532U
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Abstract
This application discloses a kind of LED encapsulation modules, belong to LED display encapsulation technology field.LED encapsulation module provided by the present application includes: pcb board, multiple LED luminescent wafers and colloid layer；The multiple LED luminescent wafer is fixed on the front of the pcb board, and each LED luminescent wafer is connect by conducting wire with the pcb board；The colloid layer is covered on the front of the pcb board so that each LED luminescent wafer and pcb board front whole face are embedded in the colloid layer by way of drenching glue encapsulating.It is breakdown that the encapsulation module can be effectively prevented LED luminescent wafer, service life with higher；And production efficiency with higher and yield rate；It can also making point spacing be easily simultaneously≤the LED display of 1mm.
Description
Technical field
This application involves a kind of LED encapsulation modules, belong to LED display encapsulation technology field.
Background technique
With the fast development of LED display technique, LED display using more and more extensive.
In the prior art, main LED display module packaged type includes: SMD (surface attaching type, Surface
Mounted Devices) encapsulation, COB (chip on board encapsulation, Chip on Board) encapsulation.SMD packaging thermal resistance is big, and dissipates
Hot difference, there is glare problem, needs for device to be attached on fixed substrate in application, can be only applied to properties of product requirement
Not high display field.COB encapsulation is encapsulated relative to SMD, and performance is substantially improved, and bracket, Reflow Soldering, patch process etc. is omitted
Step, while can also effectively avoid glare problem.Cost performance is very prominent.
CN102386312A discloses existing LED encapsulation generally using following technique: LED chip is fixed on bracket；
Chip positive and negative anodes are connected respectively in the circuit of bracket with gold thread；Epoxy resin is mixed evenly, pumping bubble；Use dispensing
Machine or bracket complete to die bond bonding wire manually carry out dispensing；Baking-curing.As shown in Figure 1, being fixed with LED chip on bracket 11
12, LED chip 12 is covered with remote fluorescence lens 13 outside, binder 14 is marked between bracket 11 and remote fluorescence lens 13, often
A LED chip 12 is an independent dispensing unit.
CN103943756A is first provided with hole for injecting glue in the prior art on substrate；Die bond weldering is carried out on substrate
Line；The substrate is fixed on injecting glue bed die；Injecting glue is carried out to the hole for injecting glue by accurate injecting glue syringe needle；To colloid solidification
Afterwards, the substrate is carried out from mold forming.As shown in Fig. 2, injecting glue syringe needle 18 is located at the top of substrate 17, colloid passes through hole for injecting glue
15 enter in the injecting glue chamber 16 on bed die, to complete colloid encapsulation.
Luminescent device is first mounted on circuit substrate by CN105810801A in the prior art；Then in circuit base
The surrounding of plate sticks power supply apparatus with tin cream, is made into the COB mould group of light source and power supply integration；In integrated COB mould group
With the method compression moulding transparent outer cover of compression molding, two cavity bodies are formed between the transparent outer cover and circuit substrate, wherein one
The middle part that a cavity body is located at transparent outer cover is central cavity body, and the surrounding that another cavity body is centered around central cavity body is outer
Portion's cavity body, the luminescent device are located in central cavity body, and the power supply apparatus is located in external cavity body；In transparent outer cover
On open up a hole for injecting glue, by hole for injecting glue will fill glue inject external cavity body in.
As it can be seen that the mode for generalling use dispensing or hole for injecting glue encapsulating is packaged in existing LED encapsulation module.But
These LED encapsulation modules have that yields is difficult to control and the encapsulation manufacturing cost height of LED display module COB etc.
Problem.
In addition, due to the limitation of glue envelope mode, causing to picture according to LED display module made of existing packaging technology
The protection of plain unit is unfavorable, there are a variety of electrostatic sources (electrostatic on such as manpower), if electrostatic source contact
To LED display module, it is breakdown to will cause pixel unit, so that LED display module service life is lower.
Moreover, because the limitation of existing glue envelope mode, causes to be difficult making point spacing to be 1mm or less than 1mm scale
LED display module.
In conclusion how to provide one kind has long service life, and production efficiency and the higher COB encapsulation of yields
The problem of structure is those skilled in the art's urgent need to resolve.
Utility model content
According to LED encapsulation module provided by the present application, which can be effectively prevented LED luminescent wafer and be hit
It wears, service life with higher；And production efficiency with higher and yield rate；LED display can achieve a little simultaneously
Spacing is≤1mm scale.
A kind of LED encapsulation module, comprising: pcb board, multiple LED luminescent wafers and colloid layer；
The multiple LED luminescent wafer is fixed on the front of the pcb board, each LED luminescent wafer by conducting wire with
The pcb board connection；
The front of the pcb board is covered on by way of drenching glue encapsulating for the colloid layer so that each LED shines
Chip and pcb board front whole face are embedded in the colloid layer.
Optionally, the LED luminescent wafer includes red-light LED chip, green light LED chip and blue LED wafers；
The red-light LED chip is connected to by conducting wire with the pad on the pcb board；
The green light LED chip is connected to by conducting wire with the pad on the pcb board；
The blue LED wafers are connected to by conducting wire with the pad on the pcb board.
Optionally, the red-light LED chip is connected to by conducting wire with the first pad on the pcb board；The green light LED
Chip is connected to the first pad, the second pad on the pcb board respectively by conducting wire；The blue LED wafers pass through conducting wire
It is connected to respectively with the first pad, the third pad on the pcb board.
Optionally, the top of the red-light LED chip is green light LED chip, and the lower section of red-light LED chip is blue-ray LED
Chip, the right of red-light LED chip are the first pad, and the left of red-light LED chip is the second pad, the right side of red-light LED chip
Lower section is third pad.
Optionally, the top of the red-light LED chip is blue LED wafers, and the lower section of red-light LED chip is green light LED
Chip, the right of red-light LED chip are the first pad, and the left of red-light LED chip is the second pad, the right side of red-light LED chip
Lower section is third pad.
Optionally, the pcb board is rectangular plate, and the multiple LED luminescent wafer is along the lateral, longitudinal of the pcb board
It is uniformly distributed.
Optionally, the spacing between the LED luminescent wafer be selected from P0.9375, P1.25, P1.5625, P1.875,
Any one in P0.9495, P1.266, P1.5825, P1.9, P1.17.
Optionally, the pcb board is circular slab, rhombic plate, triangular plate, any one in irregular shape plate.
Optionally, the upper surface of the colloid layer is horizontal.
The beneficial effect that the application can generate includes:
1) LED encapsulation module provided herein, the colloid layer in the encapsulation module cover LED in large area and shine crystalline substance
Piece, therefore it is breakdown to be effectively prevented LED luminescent wafer, so that encapsulation module service life with higher.
2) LED encapsulation module provided herein, manufacturing process is simple, production efficiency and yield rate with higher,
And there is lower production cost.
It 3) can making point spacing be easily≤the LED of 1mm according to LED encapsulation module provided herein
Display screen.
Detailed description of the invention
Fig. 1 is LED dispensing procedure chart in the prior art；
Fig. 2 is LED injecting glue procedure chart in the prior art；
Fig. 3 is the longitudinal profile structure schematic for the LED encapsulation module that embodiment 1 provides；
Fig. 4 is the top view for the LED encapsulation module that embodiment 1 provides；
Fig. 5 is the partial schematic diagram for the LED encapsulation module that embodiment 1 provides.
Component and reference signs list:
100 pcb boards；101 first ends；102 second ends
200 LED luminescent wafers；201 red-light LED chips；
202 green light LED chips；203 blue LED wafers；300 colloid layers；
400 conducting wires；501 first pads；502 second pads；
503 third pads.
Specific embodiment
The application is described in detail below with reference to embodiment, but the application is not limited to these embodiments.
Embodiment 1
Fig. 3 be LED encapsulation module provided in this embodiment longitudinal profile structure schematic, Fig. 4 be the present embodiment provides
LED encapsulation module top view, Fig. 5 be LED encapsulation module provided in this embodiment partial schematic diagram, below with reference to Fig. 3
~5 illustrate the present embodiment.
As shown in figure 3, LED encapsulation module prepared by the COB packaging method of the LED according to above-described embodiment, packet
It includes: pcb board 100, multiple LED luminescent wafers 200 and colloid layer 300；
Multiple LED luminescent wafers 200 are fixed on the front of pcb board 100, and each LED luminescent wafer 200 passes through conducting wire
400 connect with pcb board 100；
Colloid layer 300 is covered on the front of pcb board 100 so that each LED luminescent wafer 200 by way of drenching glue encapsulating
And the positive whole face of pcb board 100 is embedded in colloid layer 300.
Colloid layer is covered LED luminescent wafer by the way of drenching glue encapsulating by LED encapsulation module provided by the present application
In the positive whole face of pcb board 100, the large area protection to LED luminescent wafer can be realized, it is so effective that prevent luminescence unit from being hit
It wears；And the manufacturing process of LED encapsulation module is simple, high yield rate；Production efficiency is also very high.
Specifically, as shown in figure 4, pcb board is rectangular plate, LED luminescent wafer 200 transversely, it is longitudinal equidistant uniform
It is arranged in the front of pcb board 100.Uniformly leaching is full and is solidificated in the positive entire surface of pcb board 100 for colloid layer 300.Due to PCB
Colloid is full of in the positive whole face of plate 100, so that each LED luminescent wafer 200 obtains full and uniform encapsulation and each LED
Luminescent wafer obtains full and uniform encapsulation each other, i.e. colloid layer 300 substantially complete covers pcb board 100 and installation
LED luminescent wafer 200 on it, so that LED luminescent wafer 200 is all covered by colloid layer 300.
Optionally, LED luminescent wafer 200 includes red-light LED chip 201, green light LED chip 202 and blue LED wafers
203；
Red-light LED chip 201 is connected to by conducting wire 400 with the pad on pcb board 100；
Green light LED chip 202 is connected to by conducting wire 400 with the pad on pcb board 100；
Blue LED wafers 203 are connected to by conducting wire 400 with the pad on pcb board 100.
Optionally, red-light LED chip 201 is connected to by conducting wire 400 with the first pad 501 on pcb board 100；Green light LED
Chip 202 is connected to the first pad 501, the second pad 502 on pcb board 100 respectively by conducting wire 400；Blue LED wafers
203 are connected to the first pad 501, the third pad 503 on pcb board 100 respectively by conducting wire 400.
Optionally, the top of red-light LED chip 201 is green light LED chip 202, and the lower section of red-light LED chip 201 is indigo plant
Light LED wafer 203, the right of red-light LED chip 201 are the first pad 501, and the left of red-light LED chip 201 is the second pad
502, the lower right of red-light LED chip 201 is third pad 503.
Optionally, the top of red-light LED chip 201 is blue LED wafers 203, and the lower section of red-light LED chip 201 is green
Light LED wafer 202, the right of red-light LED chip 201 are the first pad 501, and the left of red-light LED chip 201 is the second pad
502, the lower right of red-light LED chip 201 is third pad 503.
In a specific example, as shown in figure 5, red-light LED chip 201 is centrally located, red-light LED chip
201 tops are green light LED chip 202, are blue LED wafers 203, the right side of red-light LED chip 201 below red-light LED chip 201
Side is the first pad 501, and the left of red-light LED chip 201 is the second pad 502, and the lower right of red-light LED chip 201 is the
Three pads 503.Red-light LED chip 201, green light LED chip 202, blue LED wafers 203 are connected to the by conducting wire 400 respectively
On one pad 501, green light LED chip 202 is connected on the second pad 502 by conducting wire 400, and blue LED wafers 203 are by leading
Line 400 is connected on third pad 503.The bottom surface of red-light LED chip 201 is cathode, and there is no need to reconnect pad.This implementation
Pad in example is copper foil.
Certainly, the arrangement side between red-light LED chip 201, green light LED chip 202, blue LED wafers 203 and pad
Formula be not limited to the present embodiment in cited arrangement mode, those skilled in the art can voluntarily adjust as needed LED crystal it
Between arrangement mode.
Optionally, electronic component and chip are further fixed at the back side of pcb board 100.
Optionally, the point spacing between LED luminescent wafer 200 be selected from P0.9375, P1.25, P1.5625, P1.875,
Any one in P0.9495, P1.266, P1.5825, P1.9, P1.17.
Optionally, pcb board 100 is plate.It certainly can also be other shapes, such as circular slab, rhombic plate, triangle
Plate, irregular shape plate etc..
Optionally, the upper surface of colloid layer 300 is horizontal, and colloid layer in homogeneous thickness is conducive to preferably protection LED and shines
Chip 200.
Embodiment 2
A kind of method for present embodiments providing LED encapsulation module prepared in above-described embodiment includes at least step:
Multiple LED luminescent wafers 200 are uniformly fixed to the front of pcb board 100；It is with conducting wire 400 that each LED is luminous brilliant
Piece 200 and pcb board 100 are connected；The front that glue is drenched to glue encapsulating pcb board 100 according to preset showering mode, so that each
LED luminescent wafer 200 and the positive whole face of pcb board 100 are uniformly completely covered by glue；Pcb board 100 after leaching glue encapsulating is quiet
It sets, after the glue solidifies, baking-curing.
In a specific example, preset showering mode can be with are as follows:
The top of glue from the positive first end 101 of pcb board 100 of continuous uniform outflow is continuous along first straight line direction
Showering is to the positive second end 102 of pcb board 100；
It controls pcb board 100 and moves pre-determined distance along second straight line direction；
By glue from the positive second end 102 of pcb board 100 along the direction continuous showering contrary with first straight line to
The positive first end 101 of pcb board 100；
It controls pcb board 100 and moves pre-determined distance along second straight line direction；
It repeats the above process, until glue all continuously covers LED luminescent wafer 200 and the positive whole face of pcb board 100
Lid；
Wherein, as shown in Figure 4 and Figure 5, the first end 101 and second end 102 of pcb board are opposite both ends, first straight line
Direction and second straight line direction are mutually perpendicular to.
Pre-determined distance can be showering width of the glue on the pcb board, or may be LED luminescent wafer between
Away from.
By the continuous showering of colloid to pcb board front by the way of walking in the application, to realize to the luminous crystalline substance of LED
The positive whole face of piece and pcb board is by the uniform complete coverage effect of glue, that is to say, that LED luminescent wafer is embedded in colloid layer
In.
The above is only several embodiments of the application, not does any type of limitation to the application, although this Shen
Please disclosed as above with preferred embodiment, however not to limit the application, any person skilled in the art is not taking off
In the range of technical scheme, a little variation or modification are made using the technology contents of the disclosure above and is equal to
Case study on implementation is imitated, is belonged in technical proposal scope.
Claims (9)
1. a kind of LED encapsulation module characterized by comprising pcb board, multiple LED luminescent wafers and colloid layer；
The multiple LED luminescent wafer is fixed on the front of the pcb board, each LED luminescent wafer by conducting wire with it is described
Pcb board connection；
The colloid layer is covered by way of drenching glue encapsulating and is solidificated on the front of the pcb board, so that each LED
The positive whole face of luminescent wafer and pcb board is uniformly completely embedded in the colloid layer.
2. LED encapsulation module according to claim 1, which is characterized in that the LED luminescent wafer includes red-light LED crystalline substance
Piece, green light LED chip and blue LED wafers；
The red-light LED chip is connected to by conducting wire with the pad on the pcb board；
The green light LED chip is connected to by conducting wire with the pad on the pcb board；
The blue LED wafers are connected to by conducting wire with the pad on the pcb board.
3. LED encapsulation module according to claim 2, which is characterized in that the red-light LED chip by conducting wire with it is described
The first pad connection on pcb board；The green light LED chip by conducting wire respectively on the pcb board the first pad, second
Pad connection；The blue LED wafers are connected to the first pad, the third pad on the pcb board respectively by conducting wire.
4. LED encapsulation module according to claim 3, which is characterized in that the top of the red-light LED chip is green light
LED wafer, the lower section of red-light LED chip are blue LED wafers, and the right of red-light LED chip is the first pad, and red-light LED is brilliant
The left of piece is the second pad, and the lower right of red-light LED chip is third pad.
5. LED encapsulation module according to claim 3, which is characterized in that the top of the red-light LED chip is blue light
LED wafer, the lower section of red-light LED chip are green light LED chip, and the right of red-light LED chip is the first pad, and red-light LED is brilliant
The left of piece is the second pad, and the lower right of red-light LED chip is third pad.
6. LED encapsulation module according to claim 1, which is characterized in that the pcb board is rectangular plate, the multiple
LED luminescent wafer is uniformly distributed along the lateral, longitudinal of the pcb board.
7. LED encapsulation module according to claim 6, which is characterized in that the point spacing of the LED luminescent wafer is selected from
Any one in P0.9375, P1.25, P1.5625, P1.875, P0.9495, P1.266, P1.5825, P1.9, P1.17.
8. LED encapsulation module according to claim 1, which is characterized in that the pcb board is circular slab, rhombic plate, triangle
Any one in shape plate, irregular shape plate.
9. LED encapsulation module according to claim 1, which is characterized in that the upper surface of the colloid layer is horizontal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821929108.9U CN209133532U (en) | 2018-11-22 | 2018-11-22 | LED encapsulation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821929108.9U CN209133532U (en) | 2018-11-22 | 2018-11-22 | LED encapsulation module |
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| Publication Number | Publication Date |
|---|---|
| CN209133532U true CN209133532U (en) | 2019-07-19 |
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ID=67246345
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821929108.9U Active CN209133532U (en) | 2018-11-22 | 2018-11-22 | LED encapsulation module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109509826A (en) * | 2018-11-22 | 2019-03-22 | 深圳市新光台显示应用有限公司 | The COB packaging method and LED encapsulation module of LED |
| CN110456574A (en) * | 2019-09-20 | 2019-11-15 | 青岛海信电器股份有限公司 | A kind of display device and backlight module |
-
2018
- 2018-11-22 CN CN201821929108.9U patent/CN209133532U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109509826A (en) * | 2018-11-22 | 2019-03-22 | 深圳市新光台显示应用有限公司 | The COB packaging method and LED encapsulation module of LED |
| CN110456574A (en) * | 2019-09-20 | 2019-11-15 | 青岛海信电器股份有限公司 | A kind of display device and backlight module |
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