CN203339216U - Surface mounting type LED support, LED device and LED display screen - Google Patents

Surface mounting type LED support, LED device and LED display screen Download PDF

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Publication number
CN203339216U
CN203339216U CN201320365831XU CN201320365831U CN203339216U CN 203339216 U CN203339216 U CN 203339216U CN 201320365831X U CN201320365831X U CN 201320365831XU CN 201320365831 U CN201320365831 U CN 201320365831U CN 203339216 U CN203339216 U CN 203339216U
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CN
China
Prior art keywords
led
bowl
holder
surface mount
cup
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CN201320365831XU
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Chinese (zh)
Inventor
李漫铁
晏思平
李振宁
谢振胜
屠孟龙
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深圳雷曼光电科技股份有限公司
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Priority to CN201320365831XU priority Critical patent/CN203339216U/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Abstract

The utility model discloses a surface mounting type LED support, an LED device and an LED display screen. The surface mounting type LED support comprises an insulation base, wherein the insulation base comprises an outer boss and at least one inner boss, the outer boss is arranged at an outer side of the insulation base to form a support bowl cup having an accommodating space, and the at least one inner boss is arranged in the support bowl cup to divide the support bowl cup into at least two independent sub bowl cups. Through the surface mounting type LED support, light shapes of emitted light of different luminescent wafers in the LED device can be independently adjusted to improve consistency of the light shapes of the LED device.

Description

—种表面贴装式LED支架、LED器件及LED显示屏 - seed holder surface mount LED, LED devices, and LED display

技术领域 FIELD

[0001] 本实用新型涉及LED显示技术领域,特别是涉及一种表面贴装式LED支架、LED器件及LED显示屏。 [0001] The present invention relates to the field of LED display technology, particularly to a surface mount LED support, LED and LED display device.

背景技术 Background technique

[0002]表面贴装(Surface Mounted Devices,简称SMD)式发光二极管(Light EmittingDiode,简称LED)是一种可直接把电转化为光的固态半导体器件,表面贴装式LED技术有助于提高生产效率,以及便于不同设施应用,故得到广泛应用。 [0002] SMT (Surface Mounted Devices, referred to as SMD) light emitting diode (Light EmittingDiode, referred to as LED) is a direct light into electricity to solid-state semiconductor devices, a surface mount LED technology helps improve production efficiency and facilitate the application of different facilities, it is widely used.

[0003] 现有技术中,表面贴装式LED器件一般包括金属基板和绝缘的基座构成的支架、多个发光晶片和封装胶体,所述绝缘基座将所述金属基板部分包围,以形成以金属基板为底的碗杯。 [0003] In the prior art, a surface mount LED device typically comprises a metal substrate and an insulating holder formed of a base, a plurality of the light emitting chip and an encapsulant enclosing the insulating base to the metal substrate portion to form in the bottom of the metal substrate is a glass bowl. 所述多个发光晶片设置在所述支架的碗杯中,并所述封装胶体将碗杯封装。 The plurality of light emitting chips disposed on the cup bowl of the stent, and the encapsulant encapsulating the cups.

[0004] 然而,由于LED器件中的多个发光晶片的生产厂商、发光晶片结构和尺寸、发光颜色、发光亮度或出光光形等参数并不完全相同,而参数不同的发光晶片在相同形状的碗杯中分别对应的出光光形会部分或者全部无法形成一致。 [0004] However, since a plurality of light emitting chips of the LED device manufacturers, the light emitting structure and size of the wafer, light color, luminance and a light shape and other parameters are not exactly the same, but different parameters in the same shape as the light-emitting chip bowl output light corresponding to each of the cup-shaped portion will not be formed or all the same. 故现有表面贴装式LED器件中多个发光晶片封装在同一碗杯,会出现光形不一致的情况。 Therefore, the conventional surface mount LED plurality of light emitting devices packaged in the same chip bowl cup-shaped light will be inconsistent situation. 当用光形不一致的表面贴装式LED器件拼装成显示屏时,则会造成显示屏的花屏,影响观测效果。 When the light-shaped inconsistent surface mount LED devices assembled into a display, will cause the video display screen, the effect observed effect.

实用新型内容 SUMMARY

[0005] 本实用新型主要解决的技术问题是提供一种表面贴装式LED支架、LED器件及LED显示屏,能够独立调节LED器件内不同发光晶片的出光光形,提高了LED器件光形的一致性。 [0005] The present invention is mainly to solve the technical problem of providing a surface mount LED support, LED and LED display device can be adjusted independently of the output light of the light emitting chip shaped different LED devices, LED devices to improve the light-shaped consistency.

[0006] 为解决上述技术问题,本实用新型采用一种技术方案为:提供一种表面贴装式LED支架,包括绝缘基座,所述绝缘基座包括外凸台和至少一个内凸台,所述外凸台设置在所述绝缘基座的外围,以形成具有容置空间的支架碗杯,所述至少一个内凸台设置在所述支架碗杯内,以将所述支架碗杯分隔成独立的至少两个子碗杯。 [0006] In order to solve the above problems, the present invention adopts a technical solution as follows: to provide a surface mount LED holder, comprising an insulating base, the insulating base station comprises a convex projection and at least one inner, the convex station disposed at the periphery of the insulating base to form a glass bowl holder having a receiving space, said at least one projection disposed in said bowl holder cup, bowl separated by the cup holder into at least two separate sub-cups.

[0007] 其中,所述外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平。 [0007] wherein, the highest convex point higher than the highest point of the table within the boss or the highest point of the flat inner boss.

[0008] 其中,所述外凸台的高度为0.3至2毫米间的数值。 [0008] wherein said convex station height value between 0.3 to 2 mm.

[0009] 其中,所述外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率,所述内凸台的侧面具有1°至30°间的斜率。 The side facing the side of the accommodating space [0009] wherein said convex station having a slope between 1 ° to 30 °, the inner side surface of said boss having a slope of between 1 ° to 30 °.

[0010] 为解决上述技术问题,本实用新型采用另一种技术方案为:提供一种表面贴装式LED支架,包括一体成型的支架碗杯,还包括设置于所述支架碗杯内的至少两个子碗杯,每个所述子碗杯用于至少设置一个发光晶片。 [0010] In order to solve the above problems, the present invention uses another technique scheme: providing a surface mount LED stent, comprising a stent integrally molded cups, further comprising a stent disposed within the bowl of the cup at least two sub cups, cups for each of the sub-set of at least one light emitting chip.

[0011] 为解决上述技术问题,本实用新型采用再一种技术方案为:提供一种表面贴装式LED器件,包括上述的表面贴装式LED支架、导电基板、至少两个发光晶片和封装胶体;所述导电基板设置于所述表面贴装式LED支架的支架碗杯内的底部,所述至少两个发光晶片分别设置在所述LED支架中的不同子碗杯中,并分别与所述不同子碗杯中的导电基板连接,所述封装胶体填充在所述LED支架的支架碗杯中,以将所述至少两个发光晶片密封在所述支架碗杯的不同子碗杯中。 [0011] In order to solve the above problems, the present invention adopts a technical solution to further: provide a surface mount LED device comprising the above-mentioned surface mount LED support, a conductive substrate, and at least two light emitting chip package colloids; the conductive substrate disposed in the bottom of the inner surface of the cup holder bowl mount LED holder, said at least two light emitting chips are disposed in the different sub-LED cup bowl bracket and, respectively, the said conductive substrate is connected to different sub-cup bowl, the encapsulant is filled in the cup holder bowl LED stent to seal said at least two different sub-LED chips in the bowl cup bowl cup holder.

[0012] 其中,设置在所述子碗杯底部的导电基板包括相互绝缘的第一区域和第二区域,所述子碗杯中的发光晶片的正极与所述第一区域连接,负极与所述第二区域连接。 [0012] wherein the conductive substrate provided at the bottom of the sub cups comprises mutually insulated first and second regions, the sub-wafer emission cathode cup bowl is connected to the first region, and the negative electrode connecting said second region.

[0013] 其中,所述封装胶体的最高点与所述LED支架的外凸台的最高点持平。 [0013] wherein, the highest point of the highest point of the encapsulant and the convex station LED flat bracket.

[0014] 其中,所述封装胶体包括比例设置的封装胶水和扩散粉,所述封装胶水包括有A胶和B胶,其中,所述A胶、B胶和扩散粉的比例在1: (0.7-1.3): (0.03-0.5)之间。 [0014] wherein the encapsulant comprises a package and a diffusion powder ratio setting glue, said glue comprises a package A and B adhesive glue, wherein the ratio of gum A, B, and diffusion gum powder in 1: (0.7 ) -1.3: between (0.03 to 0.5).

[0015] 为解决上述技术问题,本实用新型采用又再一种技术方案为:提供一种显示屏,包括上一项所述的表面贴装式LED器件和LED驱动电路,所述LED驱动电路与所述至少一个表面贴装式LED器件连接。 [0015] In order to solve the above problems, the present invention adopts a technical solution again to: provide a display screen, including one of the surface mount LED devices, and LED driver circuit, the LED driver circuit at least one surface mount LED devices are connected to the.

[0016] 区别于现有技术,本实用新型在表面贴装式的LED支架的支架碗杯内设有独立至少两个子碗杯,通过分别控制不同的所述独立的子碗杯的形状,以实现独立地调节设置在不同子碗杯中的发光晶片的出光光形,提高了LED器件光形的一致性,进而提高发光显示效果。 [0016] distinguished from the prior art, the present invention features a cup holder bowl of the surface mount LED holder has at least two separate sub-cups, each controlled by a different shape of the individual sub cups to provided independently adjusted to achieve the emission light shape different sub-wafer cup bowl, improved consistency shaped light LED devices, thereby increasing the light emitting display.

附图说明 BRIEF DESCRIPTION

[0017] 图1是本实用新型表面贴装式LED支架一实施方式的平面结构示意图; [0017] FIG. 1 is a plan schematic view of the present invention a surface mount LED holder of the embodiment;

[0018] 图2是图1所示的表面贴装式LED支架沿AA方向的截面结构示意图; [0018] FIG. 2 is a schematic cross-sectional configuration shown in FIG. 1 surface mount LED holder taken along line AA;

[0019] 图3是本实用新型表面贴装式LED器件一实施方式的平面结构示意图; [0019] FIG. 3 is a plan schematic view of the present invention a surface mount LED device of the embodiment;

[0020] 图4是图3所示的表面贴装式LED器件沿BB方向的截面结构示意图 [0020] FIG. 4 is a schematic cross-sectional view of a surface mount LED device shown in FIG. 3 along direction BB

[0021] 图5是本实用新型LED显示屏一实施方式的结构示意图。 [0021] FIG. 5 is a schematic structural diagram of an embodiment of the present invention the LED display.

具体实施方式 Detailed ways

[0022] 下面结合附图和具体的实施方式进行说明。 Drawings and specific embodiments will be described [0022] below in conjunction.

[0023] 请参阅图1和图2,图1是本实用新型表面贴装式LED支架一实施方式的平面结构示意图,图2是图1所示的表面贴装式LED支架沿AA方向的截面结构示意图。 [0023] Please refer to FIG. 1 and FIG. 2, FIG. 1 is a plan schematic view of the present invention a surface mount LED holder of the embodiment, FIG. 2 is a cross-sectional surface mount LED holder taken along line AA shown in FIG. 1 Schematic. 本实施方式中,表面贴装式LED支架包括绝缘基座110,所述绝缘基座110包括外凸台111和至少一个内凸台112,所述外凸台111设置在所述绝缘基座110的外围,以形成具有容置空间的支架碗杯113,所述至少一个内凸台112设置在所述支架碗杯113内,以将所述支架碗杯113分隔成独立的至少两个子碗杯114。 The present embodiment, the surface mount LED bracket comprises an insulating base 110, the insulating base 110 comprises a convex inner table 111 and at least one boss 112, the convex station 111 is provided in the insulating base 110 periphery, to form a glass bowl bracket 113 having a receiving space, said at least one inner boss 112 disposed within the bowl cup holder 113, the holder bowl to the cup 113 is divided into at least two separate sub cups 114. 具体,内凸台112为长条状,内凸台112的两端分别与外凸台111粘连,以将外凸台112分成至少两部分,内凸台112与被至少一个内凸台112分隔开的外凸台111相应部分构成子碗杯114。 Specifically, the boss 112 is an elongated, convex ends 111 and table 112 are convex sets adhesion to the convex portion into at least two stations 112, 112 within the boss and at least one inner boss 112 minutes spaced outwardly convex portion 111 corresponding cups 114 units of subframes. 其中,所述外凸台111的最高点高于所述内凸台112的最高点或与内凸台112的最高点持平,即外凸台111的高度hi大于或者等于内凸台112的的高度h2,以便于所述LED支架填充封装胶体。 Wherein the highest point of the convex units 111 is higher than the highest point of the boss 112 or boss with the highest point of the flat 112, i.e., the height Hi convex station 111 is greater than or equal within the boss 112 height h2, so as to fill the LED encapsulant holder.

[0024] 本实施方式中,支架碗杯113内的子碗杯114用于放置至少一个的发光晶片(图未示)。 [0024] In the present embodiment, the cup holder bowl bowl 113 within the cup 114 for placement of the at least one light-emitting chip (not shown). 由于不同的发光晶片的生产厂商、发光晶片结构和尺寸、发光颜色、发光亮度或出光光形等参数并不完全相同,故在用所述LED支架组装LED器件时,在不同的子碗杯114中设置参数不同的发光晶片,其中,每个子碗杯114的形状与设置在子碗杯114中的发光晶片的参数对应,以使不同子碗杯114中的发光晶片的出光光形一致。 Because different manufacturers of the light emitting chip, the light emitting structure and the size of the wafer, light color, luminance and a light shape and other parameters are not exactly the same, so in the holder with the LED assembly of the LED device, different sub cups 114 parameter light-emitting chip set the parameters of different light emitting chip, wherein the shape of each sub cups 114 disposed in the sub 114 corresponding cups, so that the light emitting chip 114 different sub-cups of the same light shape.

[0025] 具体地,子碗杯114的形状由绝缘基座110的外凸台111和内凸台112的高度和侧面斜率决定。 [0025] In particular, the shape of the sub cups 114 and the height and slope of the side surface of the boss 112 is determined by convex insulation base station 110 111. 本实施方式中,外凸台111的高度hi为0.3至2毫米(mm)间的数值,如夕卜凸台111的高度hi为1.2毫米,内凸台高度h2为0.7。 In the present embodiment, the convex Height hi 111 between the values ​​of 0.3 to 2 millimeters (mm), the height of the boss as Xi Bu hi 111 is 1.2 mm, the height h2 of the projection 0.7. 外凸台111的朝向容置空间一侧的侧面1111和内凸台112两侧的侧面1121均具有1°至30°间的斜率,即外凸台111的朝向容置空间一侧的侧面1111与支架碗杯113底面法线方向间的夹角α的角度值在1°至30°间,内凸台112两侧的侧面1121分别与与支架碗杯113底面法线方向间的夹角β的角度值在1°至30°间,例如,外凸台111的朝向容置空间一侧的侧面1111的斜率为20°,内凸台112—侧面1121的斜率为10°,另一侧面1121的斜率为15°。 1,121,112 both sides of the accommodating space of the side surface 1111 facing the convex side of the stage 111 and the boss has a slope of between 1 ° to 30 °, i.e. the side facing the convex side of the accommodating space 111 of table 1111 the bowl bracket angle α of the angle between the normal direction between the bottom surface 113 of 1 ° to 30 °, on both sides of the projection 112 side of the table 1121 included angle β between the cup 113 and the bottom surface of the bowl holder and a normal direction angle values ​​between 1 ° to 30 °, e.g., the slope of the side surface 1111 of the accommodating space toward the convex side of the station 111 is 20 °, the inner side surface of the boss 112- slope 1121 is 10 °, the other side surface 1121 a slope of 15 °. 其中,构成不同子碗杯114的外凸台111和内凸台112的高度、不同子碗杯114内的外凸台的侧面1111的斜率和内凸台112的侧面1121的斜率,均可根据放置在对应子碗杯114内的发光晶片的参数而设置为不相同,以控制设置在不同子碗杯114内的发光晶片的出光光形。 Wherein the configuration and height 111 within the boss 112, the slope of the side surface 1111 of the convex stations in different sub cups 114 and 112 within the boss side surfaces slope 1121 of different sub cups convex stage 114, can be based on placed in the corresponding sub-parameter cups 114 are provided to the light emitting chip is not the same, in order to control the light emitting chip is provided in different sub cups 114 the light shape. 当然,本实用新型表面贴装式LED支架的外凸台的高度并不限于上述高度数值范围,外凸台的朝向容置空间一侧的侧面和内凸台两侧的侧面的斜率也不限在上述斜率范围,上述高度数值范围和斜率范围仅为优选范围,在其他实施方式中,外凸台的高度也可为上述数值范围外的数值,夕卜凸台的朝向容置空间一侧的侧面和内凸台两侧的侧面还可具有上述斜率范围之外的斜率,在此不作限定。 Of course, the height of the present invention sets convex surface mount LED support is not limited to the above numerical ranges height, the slope of the side surface side and convex on both sides of the table toward the accommodating space side is also not limited to convex station in the slope range, and the height and slope range numerical ranges are only preferred ranges, in other embodiments, the height of the convex outer stage may also be the above-described numerical range of values, the side facing the accommodating space of the boss Xi Bu and the side surfaces of the convex sides having a slope table may slope range is outside the above, this is not limited.

[0026] 进一步地,LED支架还包括数量与子碗杯114个数对应的金属管脚120,所述金属管脚120的一端设置在绝缘基座110的底部115外围,且所述金属管脚120的另一端穿过绝缘基座110底部115到达对应的子碗杯114。 [0026] Furthermore, LED further comprises a number of sub-bracket cups 114 corresponding to the number of metal pins 120, 120 at one end of the metal pin 115 is provided at the bottom periphery of the insulating base 110, and the metal pin the other end 120 of the base 115 through the insulating base 110 reaches the corresponding sub cups 114.

[0027] 另外,绝缘基座110的外凸台111和内凸台112 —体注塑成型,形成支架碗杯113内的至少两个子碗杯114,或者,外凸台111与内凸台112也可不一体成型,如外凸台111与内凸台112分别为独立绝缘机构,通过组合方式组合起来,以将外凸台111构成的支架碗杯113分隔成至少两个子碗杯114。 [0027] Further, the insulating convex base station 111 and 110 within the boss 112 - form injection molded to form at least two sub cups 114 in the bowl cup holder 113, or convex units 111 and 112 within the boss may not be integrally formed, such as the station 111 and the inner convex boss 112 is independently an insulating means, combined by combination, convex glass bowl to the stent 111 configuration table 113 is sub-divided into at least two cups 114.

[0028] 本实施方式中,绝缘基座110整体均由塑料材料构成,当然,在其他实施方式中,绝缘基座也可由其他绝缘材料构成,或者绝缘基座的部分由绝缘材料构成,例如,绝缘基板的外凸台和内凸台的侧面为绝缘材料,故在此不作限定。 [0028] In the present embodiment, the entire 110 base constituted by an insulating plastic material, of course, in other embodiments, the insulation base may also be composed of other insulating materials, or insulating the base portion is made of an insulating material, e.g., and the convex side table within the boss insulating substrate is an insulating material, it is not defined here.

[0029] 另外需要说明的是,本实用新型表面贴装式LED支架中,内凸台并不限为长条状。 [0029] Note further that the present invention is a surface mount LED holder, and the boss is not elongated. 在其他应用实施方式中,内凸台还可以为其他符合放置其中的发光晶片出光光形要求的任意形状的条形凸台,例如为弧形、S形等,以将外凸台分隔,并与对应部分外凸台形成子碗杯。 In other applications, embodiments, within the boss may also be placed in line with the other light-emitting chip in which a bare strip-shaped projection of any required shape, for example curved, S-shaped, so as to partition the convex units, and the bowl is formed with a corresponding portion of the sub-convex sets. 进一步地,内凸台还可为封闭形状的凸台,如圆形,所述内凸台设置在支架碗杯中,不与外凸台粘连,内凸台的内外侧将支架碗杯中分隔为不同的子碗杯。 Further, the shape of the boss may also be closed boss such as a circle, a holder is provided within the boss cup bowl, not inside the outer stent within the boss and spaced convex cup bowl station adhesions for the different sub-cup bowl.

[0030] 本实施方式中,利用内凸台将支架碗杯分隔成独立的至少两个子碗杯,通过对不同的子碗杯的高度和内、外凸台的侧面斜率独立地进行不同设置,可独立精确地控制不同子碗杯的发光晶片的出光光形,进而实现使放置在不同子碗杯的不同参数的发光晶片的出光光形尽量一致,提高发光显示效果。 [0030] In the present embodiment, the stent within the boss using a glass bowl divided into separate at least two sub-cups, and by the height of the different sub cups, side convex slope different stations are independently arranged, emission can be accurately controlled independently wafer cups of different sub-type of output light, so as to realize the light emitting chip is placed in different sub cups of different parameters of the light shape as much as possible consistent with the effect of improving the light emitting display.

[0031 ] 请参阅图3和图4,图3是本实用新型表面贴装式LED器件一实施方式的平面结构示意图,图4是图3所示的表面贴装式LED器件沿BB方向的截面结构示意图。 [0031] Please refer to FIG. 3 and FIG. 4, FIG. 3 is a plan schematic view of the present invention, the surface mount LED device of an embodiment, FIG. 4 is a view of the surface mount LED device 3 shown in cross-section along direction BB Schematic. 本实施方式中,表面贴装式LED器件包括表面贴装式LED支架310、导电基板320、至少两个发光晶片330和封装胶体340。 The present embodiment, the surface mount LED device comprises a surface mount LED holder 310, a conductive substrate 320, at least two light emitting chip 330 and the encapsulant 340. 其中,表面贴装式LED支架310为上面实施方式所述的表面贴装式LED支架,其具体说明请参阅图1、2以及上面实施方式文字描述,在此不作赘述。 Wherein the surface mount LED holder 310 to implement the above embodiment of the surface mount LED bracket, a detailed description see Figures 1, 2 and the embodiment described above the text, this will not be repeated herein.

[0032] 导电基板320为金属基板,例如为铜金属基板,导电基板320设置于表面贴装式LED支架310的支架碗杯3113内的底部,且导电基板320不在支架碗杯3113内的一面贴附在表面贴装式LED支架310的绝缘基座底部3115上,以使绝缘基座底部3115支撑导电基板320。 [0032] The conductive substrate 320 is a metal substrate, a metal substrate, for example, copper, a conductive substrate 320 disposed on the bottom of the inner surface of the bowl mount LED holder cup holder 3113 310, and the conductive substrate 320 is not attached to the inner side of the cup holder bowl 3113 an insulating base attached to the bottom 310 surface mount LED support 3115, a base 3115 to support the bottom of the insulating substrate 320 conductive. 所述导电基板320被LED支架310的至少一个内凸台3112分隔成至少两部分321、322、323,所述导电基板320的至少两部分321、322、323分别对应设置在支架碗杯3113的不同子碗杯3114内的底部,且导电基板320的至少两部分321、322、323相互之间绝缘。 The conductive substrate 320 is at least one inner projection LED holder station 310 3112 321, 322 divided into at least two portions, the conductive substrate 321, 322 respectively corresponding to the at least two portions 320 provided in the bowl cup holder 3113 3114 in different sub-bottom cups, and insulated from each other at least two portions 321, 322 between the conductive substrate 320.

[0033] 进一步地,对应设置在子碗杯3114内的底部的导电基板320的至少两个部分321、322、323,分别包括相互绝缘的第一区域3211和第二区域3212,导电基板320的至少两个部分321、322、323的第一区域3211和第二区域3212分别与LED支架310的金属管脚312到达对应子碗杯3114的一端连接。 [0033] Further, corresponding to the conductive substrate disposed in the bottom portion 3114 of the sub cups at least two portions 321, 322 320, each comprising a first region 3211 and a second mutually insulated region 3212, a conductive substrate 320 at least a first portion 321, 322 of the two regions 3211 and 3212 respectively, the second region 312 LED holder metal pin 310 reaches the end of the corresponding sub cups 3114 are connected. 如图3所示,LED支架310的支架碗杯3113被两个内凸台3112分隔成三个子碗杯3114,三个子碗杯3114底部分别设置相互绝缘的导电基板321、322,323,即LED支架310的绝缘基座底部3115设置有6个金属管脚312,所述6个金属管脚312分别穿过绝缘基座底部3115与导电基板321、322、323的第一、第二区域3211、3212连接。 As illustrated, the stent glass bowl LED bracket 310 is two 3113 within the boss 3112 is divided into three sub-cups 33 114, three sub-bottom cups 3114 are disposed mutually insulated conductive substrate 321, 322, i.e., LED holder 310 an insulating base 3115 provided with a bottom 6 of metal pins 312, the six pins 312 extend through insulating metal base 3115 is connected to the bottom of the first and second regions 3211 and 3212 of the conductive substrate 321, 322 .

[0034] 所述至少两个发光晶片330分别设置在所述LED支架310中的不同子碗杯3114中,所述LED支架310的至少两个子碗杯3114的形状分别与对应设置在所述子碗杯3114中的发光晶片330的参数对应,以独立调节设置在不同子碗杯3114中的发光晶片330的出光光形,使不同子碗杯3114中的发光晶片330的出光光形一致。 The bowl 3114 different sub [0034] the at least two light-emitting chip of the LED 330 are provided in the holder 310, the LED 310 of cradle shape of at least two sub cups 3114 are respectively disposed in the corresponding sub- parameters of the light emitting chip 330 corresponding cups 3114 to independently adjust the light-emitting chip disposed in different sub cups 3114 330 shaped output light, so that the different sub-LED chips in 330 cups of the 3114 light shape consistent. 不同子碗杯3114的发光晶片330分别与所处子碗杯3114底部中的导电基板320连接。 The bowl different sub emission wafer 3,303,114 which are respectively connected to the bottom sub cups 3114 of the conductive substrate 320. 进一步地,发光晶片330的正极331通过导线与对应子碗杯3114底部的导电基板320的第一区域3211连接,以与LED支架310的其中一个金属管脚312连接,发光晶片330的负极332通过导线与对应子碗杯3114底部的导电基板320的第二区域3212连接,以与LED支架310的其中另一个金属管脚312连接。 Further, the positive electrode 330 of the light emitting chip 331 is connected to a first region of 3,211,320 base 3114 through the conductive substrate and the corresponding sub-wire cups, to which a metal pin bracket 312 connected to the LED 310, the light emitting chip by negative 332330 a conductive substrate 3114 and the bottom of the lines corresponding to the second sub-region 3212320 cups are connected to the metal pin is connected to the other of the bracket 312 LED 310. 所述LED支架310的金属管脚312分别与供电电路连接,以向所述至少两个发光晶片330供电,驱动发光。 Metal pins 312 of the LED holder 310 are connected to the power supply circuit to supply power to at least 330 the two light emitting chip, the light emitting driving.

[0035] 所述封装胶体340填充在所述LED支架310的支架碗杯3113的容置空间中,以将所述至少两个发光晶片330密封在所述支架碗杯3113的不同子碗杯3114中。 [0035] The encapsulant 340 filled in the bowl cup holder LED holder accommodating space 310 in 3113, to the at least two light-emitting chip 330 sealed in the cup holder bowl different sub cups 3113 3114 in. 本实施方式中,所述封装胶体340的最高点与所述LED支架310的外凸台3111的最高点持平,以保证封装胶体340能够完全填充各子碗杯3114的容置空间,当然,封装胶体340也不限其最高点与外凸台3111的最高点,在其他实施方式中,封装胶体的最高点也可与内凸台的最高点持平,或者封装胶体的最高点在内、外凸台的最高点之间等。 In the present embodiment, the encapsulant 340 and the highest point of the LED holder 310 to the highest point of the convex station 3111 flat encapsulant 340 is able to ensure complete filling of the sub-accommodating space 3114 cups, of course, the package colloid 340 is also not limited to its highest point and the highest point of the convex station 3111, in other embodiments, the highest point of the encapsulant may also be flat with the highest point of the boss, or the highest point of the inner encapsulant, convex between the highest point and other stations.

[0036] 具体地,封装胶体340包括比例设置的封装胶水和扩散粉,所述封装胶水包括A胶和B胶,一般,封装胶水为环氧树脂或硅胶。 [0036] In particular, the encapsulant 340 includes a package glues and diffusion powder ratio provided, said glue comprising a package A and B adhesive glue, in general, an epoxy resin or silicone glue package. 本实施方式中,A胶与B胶的比例一般在1:(0.7-1.3)之间,封装胶体340整体的A胶、B胶和扩散粉的比例在I: (0.7-1.3): (0.03-0.5)之间。 The present embodiment, the ratio of A to B adhesive glue is generally between 1: (0.7-1.3), the entire encapsulant 340 A glue, glue B, and the ratio of diffusion in powder I: (0.7-1.3): (0.03 between -0.5). 需要说明的是,上述比例范围仅是封装胶体中的A胶、B胶和扩散粉的比例的优选,在其他实施方式中,封装胶体中的A胶、B胶和扩散粉的比例也可为上述比例范围之外的比例值,故上述比例范围并不作为对本实用新型的限定。 It should be noted that the above ratio ranges are merely A plastic encapsulant, and the ratio of the B plastic and diffusion powder is preferable, in other embodiments, A plastic encapsulant is, B gum, and the ratio of the diffusion powder may also be scale value outside the above range of ratio, it is not the above-described ratio range of the present invention as defined pair.

[0037] 需要说明的是,本实施方式中,导电基板320的至少两部分321、322、323相互之间绝缘,但在具体应用中,所述导电基板320的至少两部分321、322、323不限为相互间绝缘,在设置在不同子碗杯3114中的发光晶片330的驱动电压相同时,所述导电基板320的至少两部分321、322、323的第一区域间可相互导电,所述导电基板320的至少两部分321、322、323的第二区域间可相互导电。 [0037] Incidentally, in this embodiment, the insulation between at least two portions 321, 322 each electrically conductive substrate 320, but in the specific application, the at least two portions 321, 322 of the conductive substrate 320 Any interlayer insulating each other between the driving voltage of the light emitting chip is provided in different sub cups 3114 330 is the same, the conductive substrate 320 a first region of at least two portions 321, 322 may be electrically conductive with each other, the said conductive region between the second substrate 320 may be at least two conductive portions 321, 322 to each other.

[0038] 另外,在另一实施方式中,本实用新型表面贴装式LED支架也可包括上述的导电基板,对应地,表面贴装式LED器件中的导电基板即为表面贴装式LED支架的导电基板,故在产品布局上,将上述导电基板归属于表面贴装式LED支架或表面贴装式LED器件均属于本实用新型保护范围。 [0038] Further, in another embodiment, the present invention is a surface mount LED holder may also include the above conductive substrate, corresponding to the conductive substrate surface mount LED devices is the surface mount LED holder the conductive substrate, so that the product distribution, attributable to the above-described conductive substrate surface or surface mount LED bracket mount LED devices belong to the protection scope of the invention novel.

[0039] 本实施方式在表面贴装式LED支架的支架碗杯内设有独立至少两个子碗杯,通过分别控制不同的所述独立的子碗杯的形状,以独立地调节设置在不同子碗杯中的不同参数的发光晶片的出光光形,提高表面贴装式LED器件中不同参数的发光晶片出光光形的一致性,提高发光显示效果。 [0039] In the present embodiment, there are at least two separate sub cups in the cup holder bowl equipped with surface mount LED stent, by controlling a shape different from said independent sub cups to be adjusted independently disposed in different sub different parameters of the light emitting chip of the bare cup-shaped bowl, increase the surface mount LED devices emitting different parameters of the bare wafer-shaped consistency, improve the emission display.

[0040] 请参阅图5,图5是本实用新型LED显示屏一实施方式的结构示意图。 [0040] Referring to FIG. 5, FIG. 5 is a schematic structural diagram of an embodiment of the present invention the LED display. 本实施方式中,LED显示屏包括至少一个表面贴装式LED器件510和LED驱动电路520,LED驱动电路520分别与所述至少一个表面贴装式LED器件510连接,以向所述至少一个表面贴装式LED器件510提供驱动电压,驱动所述至少一个表面贴装式LED器件510发光实现显示,其中,表面贴装式LED器件510为上面实施方式中所述的表面贴装式LED器件,其具体说明请参阅图1至4以及上面实施方式的文字描述,在此不作赘述。 In the present embodiment, LED display comprising at least one surface mount LED device 510 and the LED driving circuit 520, the LED driving circuit 520 at least one surface mount LED device 510 is connected to the respectively to the at least one surface mount LED device 510 supplies a driving voltage, driving at least one surface mount LED device to realize a light emitting display 510, wherein the surface mount LED device 510 of the embodiment described above, a surface mount LED devices, see detailed description thereof and the text of the above-described embodiments 1 to 4, will not be repeated here.

[0041] 上述技术方案在表面贴装式的LED支架的支架碗杯内设有独立至少两个子碗杯,通过分别控制不同的所述独立的子碗杯的形状,以实现独立地调节设置在不同子碗杯中的发光晶片的出光光形,提高了LED器件光形的一致性,进而提高发光显示效果。 [0041] The technical solution of the at least two separate sub cups in the cup holder bowl equipped with an LED surface mount bracket, by controlling a shape different from said independent sub cups to achieve disposed independently adjusted different sub-light-emitting chip bowl cup-shaped output light, the light-shaped LED device increased consistency, thereby improving the light emitting display.

[0042] 以上所述仅为本实用新型的实施例,并非因此限制本实用新型的专利范围,凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本实用新型的专利保护范围内。 [0042] The foregoing is only embodiments of the present invention, not intended to limit the patent scope of the present invention, all utilize the present invention disclosure and drawings taken equivalent structures or equivalent process, or directly or indirectly used in other technical fields shall fall within the scope of the novel utility patent protection.

Claims (9)

1.一种表面贴装式LED支架,其特征在于, 包括绝缘基座,所述绝缘基座包括外凸台和至少一个内凸台,所述外凸台设置在所述绝缘基座的外围,以形成具有容置空间的支架碗杯,所述至少一个内凸台设置在所述支架碗杯内,以将所述支架碗杯分隔成独立的至少两个子碗杯。 1. A surface mount LED bracket comprising an insulating base, the insulating base station and comprises at least one inner convex boss, disposed at the periphery of the convex station of the insulating base to form a glass bowl holder having a receiving space, said at least one projection disposed in said bowl holder cup holder to the bowl of the cup is divided into at least two separate sub-cups.
2.根据权利要求1所述的表面贴装式LED支架,其特征在于, 所述外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平。 The surface mount LED holder according to claim 1, characterized in that the highest point of the convex stage higher than the highest point of the inner flat boss or the highest point of the boss.
3.根据权利要求1所述的表面贴装式LED支架,其特征在于, 所述外凸台的高度为0.3至2毫米间的数值。 The surface mount LED holder according to claim 1, wherein said convex station height value between 0.3 to 2 mm.
4.根据权利要求1所述的表面贴装式LED支架,其特征在于, 所述外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率,所述内凸台的侧面具有1°至30°间的斜率。 The surface mount LED holder according to claim 1, characterized in that the convex side surface of said table toward the accommodation space having a slope between 1 ° to 30 °, the inner boss side surface having a slope between 1 ° to 30 °.
5.一种表面贴装式LED支架,其特征在于, 包括一体成型的支架碗杯,还包括设置于所述支架碗杯内的至少两个子碗杯,每个所述子碗杯用于至少设置一个发光晶片。 A surface mount LED holder, wherein the holder comprises an integrally formed cup bowl, further comprising at least two sub cups disposed in the bowl cup holder, each of said sub-cups for at least a light emitting chip is provided.
6.—种表面贴装式LED器件,其特征在于, 包括权利要求1至5任一项所述的表面贴装式LED支架、导电基板、至少两个发光晶片和封装胶体; 所述导电基板设置于所述表面贴装式LED支架的支架碗杯内的底部,所述至少两个发光晶片分别设置在所述LED支架中的不同子碗杯中,并分别与所述不同子碗杯中的导电基板连接,所述封装胶体填充在所述LED支架的支架碗杯中,以将所述至少两个发光晶片密封在所述支架碗杯的不同子碗杯中。 6.- kinds of surface mount LED devices, characterized by comprising 1-1 of the surface mount LED support, any conductive substrate 5, and at least two light emitting chip encapsulant claims; the conductive substrate is provided to the surface mount LED holder bottom of the inner bowl cup holder, said at least two light emitting chips are disposed in the different sub-LED holder cup bowl, and the cup respectively the different sub bowl connecting the conductive substrate, the encapsulant is filled in the cup holder LED holder bowl to the at least two light-emitting chip sealed in the different sub-holder cup bowl cup bowl.
7.根据权利要求6所述的表面贴装式LED器件,其特征在于, 设置在所述子碗杯底部的导电基板包括相互绝缘的第一区域和第二区域,所述子碗杯中的发光晶片的正极与所述第一区域连接,负极与所述第二区域连接。 The surface mount LED device according to claim 6, wherein the conductive substrate provided at the bottom of the bowl cup comprising mutually insulated sub-first and second regions, the sub-cup bowl the light-emitting chip connected to the first region of the positive electrode, a negative electrode connected to the second region.
8.根据权利要求6所述的表面贴装式LED器件,其特征在于, 所述封装胶体的最高点与所述LED支架的外凸台的最高点持平。 8. The surface mount LED device according to claim 6, characterized in that the highest point of the highest point of the encapsulant and the convex station LED flat bracket.
9.一种LED显示屏,其特征在于, 包括至少一个权利要求6所述的表面贴装式LED器件和LED驱动电路,所述LED驱动电路与所述至少一个表面贴装式LED器件连接。 A LED display, characterized by comprising at least one surface mount LED device of claim 6 and claim the LED driving circuit, the LED driver circuit and the at least one surface mount LED devices are connected.
CN201320365831XU 2013-06-24 2013-06-24 Surface mounting type LED support, LED device and LED display screen CN203339216U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014205874A1 (en) * 2013-06-24 2014-12-31 深圳雷曼光电科技股份有限公司 Surface mounted led support, led device, and led display screen
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014205874A1 (en) * 2013-06-24 2014-12-31 深圳雷曼光电科技股份有限公司 Surface mounted led support, led device, and led display screen
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels

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