CN102062323A - Method for manufacturing LED lamp bar and LED lamp - Google Patents
Method for manufacturing LED lamp bar and LED lamp Download PDFInfo
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- CN102062323A CN102062323A CN2010105336383A CN201010533638A CN102062323A CN 102062323 A CN102062323 A CN 102062323A CN 2010105336383 A CN2010105336383 A CN 2010105336383A CN 201010533638 A CN201010533638 A CN 201010533638A CN 102062323 A CN102062323 A CN 102062323A
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Abstract
The invention discloses a method for manufacturing a light emitting diode (LED) lamp bar and an LED lamp. The method comprises the following steps of: A, arranging a plurality of rows of reflection cavities on a substrate; B, performing LED chip die bond at the bottom of each reflection cavity; C, injecting colloid into each reflection cavity, and forming a light emitting surface at the top of the reflection cavity; and D, cutting the substrate to form the LED lamp bar or an LED lamp unit. The method has simple process and low cost, and the produced LED lamp bar has high reliability and good light emitting color uniformity.
Description
Technical field
The present invention relates to LED (light emitting diode) field, the manufacture method of especially a kind of LED lamp bar and LED lamp.
Background technology
The manufacturing process of LED lamp bar mainly comprises in existing: steps A, and injection moulding PPA forms the package support of band reflection cavity on the copper base material; Step B carries out solid crystalline substance, bonding wire and the injecting glue technology of led chip successively in the reflection cavity of package support, form single LEDs assembly; Step C is bonded in a plurality of single LEDs assemblies on the PCB substrate by surperficial bonding technology (SMT) one by one, and these LED assemblies bond side by side; Step D, cutting PCB substrate forms many LED lamp bars.
In the above-mentioned flow process, the equipment that relates in the steps A has pressing equipment, bending equipment and injection-moulding device; The equipment that relates among the step C mainly is used surperficial stamping device of SMT technology and Reflow Soldering equipment.
Can see from the manufacturing process flow of above-mentioned LED lamp bar, its main thought is to make single LED assembly earlier, by SMT it is arranged on the PCB substrate then, adopt the defective of this kind mode to be, relate to the preparation of package support and the use of SMT technology, and plurality of devices is used in the preparation of package support, complicated process of preparation, cost height; Simultaneously, SMT also is a kind of complicated technology, and production cost is also very high.
Therefore, existing in when making LED lamp bar, complex process, production cost height.
Summary of the invention
The main technical problem to be solved in the present invention is, a kind of technology is simple, cost the is low light-emitting diode light bar and the manufacture method of LED light lamp are provided.
For solving the problems of the technologies described above, the manufacture method of LED lamp bar provided by the invention and LED lamp, the step that comprises jointly in both manufacture methods is steps A: many row's reflection cavities are set on substrate; Step B: carry out the solid crystalline substance of led chip in the bottom of each reflection cavity; Step C: in each described reflection cavity, inject colloid, and form exiting surface at the top of described reflection cavity.
In above-mentioned steps, described substrate is a wiring board, and described step B specifically comprises, step B1: the predeterminated position that led chip is fixed on the bottom of each reflection cavity; Step B2: described led chip is connected on the described wiring board.
In above-mentioned steps, also comprise among the described step B1 and will be fixed on the predeterminated position of the bottom of each reflection cavity with the protection diode of described led chip serial or parallel connection.
In above-mentioned steps, be covered with on the described wiring board be used for the conduction and the heat conductive metal superficial layer.
In above-mentioned steps, described reflection cavity is the plastic cement reflection cavity, in the described steps A, adopts the method for heat cure moulding that the described reflection cavity of many rows directly is set on described substrate.
In above-mentioned steps, the sidewall of described each reflection cavity has gum-injecting port, among the described step C, injects cavity by described gum-injecting port in each described reflection cavity.
In above-mentioned steps, adopt die pressing in described reflection cavity, to inject colloid by described gum-injecting port, the exiting surface that forms at the top of described reflection cavity is plane or concave surface or convex surface.
In above-mentioned steps, described colloid is a fluorescent glue, and during injecting glue, the preheat temperature of the fluorescent glue glue cake of employing is 70-80 ℃, and upper and lower mold forming temperature is 145-160 ℃, and pressure is 90-100kgf/cm
2
In above-mentioned steps, among the described step C, in described reflection cavity, inject colloid, the exiting surface plane or concave surface or the convex surface that form at the top of described reflection cavity by print process.
Through behind identical steps A, B and the C, also comprise step D, cutting substrate forms LED lamp bar or LED lamp.
The invention has the beneficial effects as follows: make single LEDs in existing earlier, then it is bonded to printed substrate by surface mounting technology (SMT), because the SMT complex process is used the equipment cost height, the manufacturing process complexity of the LED lamp bar in feasible the having now, the production cost height.And the present invention by arranging the reflection cavity setting in the circuit board earlier more, can realize by the mode of direct etching or heat cure moulding in the circuit board, in this reflection cavity, realize the solid crystalline substance of led chip, bonding wire and injecting glue then, cutting at last, avoided the use of surperficial sticking packing technique (SMT), thereby simplified processing step, reduced production cost.
Description of drawings
Fig. 1 is the manufacture method flow chart of the LED lamp bar of an embodiment of the present invention;
Fig. 2 is the PCB substrate figure of an embodiment of the present invention;
Fig. 3 is the reflection chamber profile of the injection mo(u)lding of an embodiment of the present invention;
Fig. 4 is the solid brilliant schematic diagram of an embodiment of the present invention;
Fig. 5 is the bonding wire schematic diagram of an embodiment of the present invention;
Fig. 6 is a generalized section behind the lamp bar injecting glue of an embodiment of the present invention;
Fig. 7 is the side generalized section of structure shown in Figure 5;
Fig. 8 is the front view before an embodiment of the present invention cutting;
Fig. 9 is the LED lamp bar finished product front view of an embodiment of the present invention.
The specific embodiment
In conjunction with the accompanying drawings the present invention is described in further detail below by the specific embodiment.
As shown in Figure 1, the manufacture method of present embodiment LED lamp or LED lamp bar may further comprise the steps:
Step S1: form the reflection cavity that many rows are used for packaging LED chips in the precalculated position of substrate.
In this step, as shown in Figure 2, substrate can be wiring board 1, preferably, can adopt the PCB substrate 3 that is covered with matallic surface layer 2 on the surface of wiring board 1, and this matallic surface layer 2 can be a copper metal layer, also can be the metal level of other conduction and perfect heat-dissipating.Be reserved with the position that reflection cavity is set on the surface of this PCB substrate 3.
Be understandable that, also can downward depressed part be set as reflection cavity 4 on the surface of PCB substrate 3 by methods such as etchings.
Step S2: the solid crystalline substance and the bonding wire that in each reflection cavity, carry out led chip.
As shown in Figure 4; on the predeterminated position of the bottom surface of each reflection cavity 4, fix one or more led chip 5; also can be at the precalculated position of reflection cavity 4 bottom surfaces fixed L ED chip 5 and protection diode (scheming not shown), protection diode and led chip 5 serial or parallel connections.
As shown in Figure 5; the positive and negative electrode of led chip 5 or protection diode is connected on the precalculated position of wiring board 1 in the reflection cavity 4; be welded on the wiring board 1 such as lead-in wire 6, make the led chip 5 in each reflection cavity 4 pass through wiring board 1 serial or parallel connection led chip 5.A kind of mode is led chip 5 serial or parallel connections in each row's reflection cavity 4, and each is arranged between the led chip 5 between the reflection cavity 4 and connects.
Step S3: in reflection cavity, inject colloid with methods such as wire mark method, spraying process or die pressings, form exiting surface.At injecting glue in reflection cavity can be all injecting glue, also injecting glue that can be several rows of together.
As shown in Figure 6, by wire mark method, spraying process or die pressing injecting glue in reflection cavity 4, form exiting surface.A kind ofly preferred embodiment be, adopt die pressing to realize injecting glues from the gum-injecting port 8 of reflection cavity 4, colloid adopts fluorescent glue 7, also can be transparent adhesive tape or other colloid.If adopt fluorescent glue 7, then fluorescent glue glue cake preheat temperature is 70-80 ℃, preferred 75 ℃; During mold pressing, the upper and lower mould forming temperature is set in the 145-160 ℃ of scope, and preferred 150 ℃, pressure setting range 90-100kgf/cm
2, preferred 95kgf/cm
2Simultaneously, the exiting surface of reflection cavity 4 can form difform exiting surface by top die, reaches the surface state of control light-emitting area, improves the effect of light extraction efficiency, and the shape of exiting surface can be even curface or concave surface or convex surface, and roughening treatment can be done in the surface.
Another kind of implementation is, from the end face of reflection cavity 4 colloid filled with reflection cavity by print process, forms even curface, and when the colloid that injects was fluorescent glue 7, the preheat temperature of fluorescent glue glue cake can be 70-80 ℃, such as 75 ℃.
Step S4: cutting substrate forms a plurality of LED lamp bars or LED lamp.。
After being illustrated in figure 8 as injecting glue and finishing, finished figure before the cutting; As shown in Figure 9, cut wiring board shown in Figure 8, obtain LED lamp bar.At this moment, also can cutting substrate form the LED lamp, described each LED lamp comprises one or two or three or four LED unit, and preferred cutting forms the single lamp of the LED that comprises a LED unit.
In the process of above-mentioned manufacturing LED lamp bar or LED lamp, method by direct injection moulding on the PCB substrate forms reflection cavity, package support as all led chips, used equipment has only injection-moulding device and etching apparatus, and in existing usually in the copper base material injection moulding PPA form the package support of single LEDs chip, used equipment has pressing equipment, bending equipment and injection-moulding device usually.Obviously, the present invention is easier on the method for making package support, and cost is lower.Moreover, have chip now at package support fixed L ED, bonding wire forms also to relate to behind single LEDs assembly single LEDs assembly is mounted on the PCB wiring board, common implementation is to arrange light emitting diode by SMT earlier, weld the LED assembly by Reflow Soldering equipment then, and Ben Ming is directly injection molded on the PCB substrate owing to the reflection cavity that is mainly used in packaging LED chips, has avoided the use of SMT, further simplify technology, saved cost.
Usually after the LED lamp bar manufacturing in existing is finished, also comprise the inhomogeneity spectrophotometric test step of test glow color.And the present invention is provided with gum-injecting port by the side at reflection cavity, the fluorescent glue of fixed mixing ratio is injected reflection cavity from gum-injecting port, improved the uniformity of lamp bar color and luster, can save this step of spectrophotometric test, if when selecting led chip, select the identical or close led chip of performance parameter and be used to make LED lamp bar, will more can improve the uniformity of glow color, even further guarantee not carry out the glow color uniformity that spectrophotometric test also can guarantee LED lamp bar.
The single lamp paster of the single lamp of LED in existing for disperseing when the SMT paster, must be the LED of package, so also will carry out braid before using for the user usually, and the LED lamp bar that the present invention makes only needs simple packing to use for the user, has saved the cost of winding.
The present invention has also protected LED lamp bar and the LED lamp that adopts above preparation method to make.The production technology of this LED lamp bar is simple, low cost of manufacture, and color homogeneity is good, dependable performance.
Above content be in conjunction with concrete embodiment to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. the manufacture method of a LED lamp bar is characterized in that, comprises the steps steps A: many row's reflection cavities are set on substrate; Step B: carry out the solid crystalline substance of led chip in the bottom of each reflection cavity; Step C: in each described reflection cavity, inject colloid, and form exiting surface at the top of described reflection cavity; Step D: cut described substrate and form LED lamp bar.
2. the manufacture method of LED lamp bar as claimed in claim 1 is characterized in that, described substrate is a wiring board, and described step B specifically comprises, step B1: the predeterminated position that led chip is fixed on the bottom of each reflection cavity; Step B2: described led chip both positive and negative polarity is connected on the described wiring board.
3. the manufacture method of LED lamp bar as claimed in claim 2 is characterized in that, also comprises among the described step B1 being fixed on the predeterminated position of the bottom of each reflection cavity with the protection diode of described led chip serial or parallel connection.
4. the manufacture method of LED lamp bar as claimed in claim 2 is characterized in that, is covered with on the described wiring board to be used for conduction and heat conductive metal superficial layer.
5. the manufacture method of LED lamp bar as claimed in claim 1 is characterized in that, described reflection cavity is the plastic cement reflection cavity, in the described steps A, adopts the method for heat cure moulding that the described reflection cavity of many rows directly is set on described substrate.
6. as the manufacture method of each described LED lamp bar in the claim 1 to 5, it is characterized in that the sidewall of described each reflection cavity has gum-injecting port, among the described step C, in each described reflection cavity, inject cavity by described gum-injecting port.
7. as the manufacture method of LED lamp bar as described in the claim 6, it is characterized in that adopt die pressing to inject colloid by described gum-injecting port in described reflection cavity, the exiting surface that forms at the top of described reflection cavity is plane or concave surface or convex surface.
8. the manufacture method of LED lamp bar as claimed in claim 6 is characterized in that described colloid is a fluorescent glue, and during injecting glue, the preheat temperature of the fluorescent glue glue cake of employing is 70-80 ℃, and upper and lower mold forming temperature is 145-160 ℃, and pressure is 90-100kgf/cm
2
9. as the manufacture method of each described LED lamp bar in the claim 1 to 5, it is characterized in that, among the described step C, in described reflection cavity, inject colloid, the exiting surface plane or concave surface or the convex surface that form at the top of described reflection cavity by print process.
10. the manufacture method of a LED lamp is characterized in that, comprises step, steps A: many row's reflection cavities are set on substrate; Step B: carry out the solid crystalline substance of led chip in the bottom of each reflection cavity; Step C: in each described reflection cavity, inject colloid, and form exiting surface at the top of described reflection cavity; Step D: cut described substrate and form the LED lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105336383A CN102062323A (en) | 2010-11-05 | 2010-11-05 | Method for manufacturing LED lamp bar and LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105336383A CN102062323A (en) | 2010-11-05 | 2010-11-05 | Method for manufacturing LED lamp bar and LED lamp |
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| CN102062323A true CN102062323A (en) | 2011-05-18 |
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| CN2010105336383A Pending CN102062323A (en) | 2010-11-05 | 2010-11-05 | Method for manufacturing LED lamp bar and LED lamp |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569604A (en) * | 2011-10-27 | 2012-07-11 | 深圳市灏天光电有限公司 | Hidden pin high-power LED (light-emitting diode) bracket and packaging structure and packaging process thereof |
| CN103296184A (en) * | 2013-05-31 | 2013-09-11 | 左洪波 | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support |
| CN103542310A (en) * | 2012-07-12 | 2014-01-29 | 达昌电子科技(苏州)有限公司 | Manufacturing method of light bar |
| CN103746048A (en) * | 2013-12-26 | 2014-04-23 | 深圳市国冶星光电子有限公司 | Production technology of LED nixie tube connecting board |
| CN103855147A (en) * | 2014-01-13 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED lamp filament and lamp |
| CN103904071A (en) * | 2014-03-20 | 2014-07-02 | 苏州东山精密制造股份有限公司 | Manufacturing technology of transparent substrate LED lamp strip |
| CN103994356A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Slitting method for LED lamp band with combined jointed boards and integrated adhesive glue board and LED lamp band |
| CN104051603A (en) * | 2014-03-20 | 2014-09-17 | 苏州东山精密制造股份有限公司 | Manufacturing technology of LED lamp strip capable of emitting light from two sides |
| CN104091880A (en) * | 2014-07-31 | 2014-10-08 | 绍兴联同电子科技有限公司 | Ultrathin and high-efficiency BT (Bismaleimide Triazine)-type LED (Light-Emitting Diode) filament and manufacturing process thereof |
| CN104465955A (en) * | 2014-12-26 | 2015-03-25 | 深圳万润科技股份有限公司 | LED lamp belt and manufacturing method thereof |
| CN104444474A (en) * | 2014-11-18 | 2015-03-25 | 佛山市多谱光电科技有限公司 | Automatic separating, testing, sorting and packaging machine for long-strip-shaped LED optical assemblies |
| CN105489743A (en) * | 2015-12-02 | 2016-04-13 | 广州市莱帝亚照明科技有限公司 | Manufacturing method of LED light bars |
| CN105864665A (en) * | 2016-05-16 | 2016-08-17 | 佛山电器照明股份有限公司高明分公司 | Soft substrate lamp tube sticking machine |
| CN108534093A (en) * | 2018-04-07 | 2018-09-14 | 周小燕 | A kind of reflector for LED light |
| WO2019057143A1 (en) * | 2017-09-22 | 2019-03-28 | 王定锋 | Led bulb made from combination of multiple circuit board packaging modules |
| CN113446526A (en) * | 2021-07-01 | 2021-09-28 | 深圳市卷对卷光电科技有限公司 | LED light bar production method and production system applying same |
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| CN1971906A (en) * | 2006-12-20 | 2007-05-30 | 黄虎钧 | Lighting stick with LBD wafer |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1971906A (en) * | 2006-12-20 | 2007-05-30 | 黄虎钧 | Lighting stick with LBD wafer |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569604A (en) * | 2011-10-27 | 2012-07-11 | 深圳市灏天光电有限公司 | Hidden pin high-power LED (light-emitting diode) bracket and packaging structure and packaging process thereof |
| CN102569604B (en) * | 2011-10-27 | 2013-11-06 | 深圳市灏天光电有限公司 | Hidden pin high-power LED (light-emitting diode) bracket and packaging structure and packaging process thereof |
| CN103542310A (en) * | 2012-07-12 | 2014-01-29 | 达昌电子科技(苏州)有限公司 | Manufacturing method of light bar |
| CN103296184A (en) * | 2013-05-31 | 2013-09-11 | 左洪波 | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support |
| CN103746048A (en) * | 2013-12-26 | 2014-04-23 | 深圳市国冶星光电子有限公司 | Production technology of LED nixie tube connecting board |
| CN103855147A (en) * | 2014-01-13 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED lamp filament and lamp |
| CN103904071B (en) * | 2014-03-20 | 2016-08-17 | 苏州东山精密制造股份有限公司 | A kind of manufacturing process of transparency carrier LED lamp bar |
| CN103904071A (en) * | 2014-03-20 | 2014-07-02 | 苏州东山精密制造股份有限公司 | Manufacturing technology of transparent substrate LED lamp strip |
| CN104051603A (en) * | 2014-03-20 | 2014-09-17 | 苏州东山精密制造股份有限公司 | Manufacturing technology of LED lamp strip capable of emitting light from two sides |
| CN103994356A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Slitting method for LED lamp band with combined jointed boards and integrated adhesive glue board and LED lamp band |
| CN104091880A (en) * | 2014-07-31 | 2014-10-08 | 绍兴联同电子科技有限公司 | Ultrathin and high-efficiency BT (Bismaleimide Triazine)-type LED (Light-Emitting Diode) filament and manufacturing process thereof |
| CN104444474A (en) * | 2014-11-18 | 2015-03-25 | 佛山市多谱光电科技有限公司 | Automatic separating, testing, sorting and packaging machine for long-strip-shaped LED optical assemblies |
| CN104444474B (en) * | 2014-11-18 | 2015-08-19 | 佛山市多谱光电科技有限公司 | A kind of automatic discrete testing sorting of strip shape LED light component and wrapping machine |
| CN104465955A (en) * | 2014-12-26 | 2015-03-25 | 深圳万润科技股份有限公司 | LED lamp belt and manufacturing method thereof |
| CN105489743A (en) * | 2015-12-02 | 2016-04-13 | 广州市莱帝亚照明科技有限公司 | Manufacturing method of LED light bars |
| CN105489743B (en) * | 2015-12-02 | 2018-02-16 | 广州市莱帝亚照明股份有限公司 | A kind of manufacture method of LED light bar |
| CN105864665A (en) * | 2016-05-16 | 2016-08-17 | 佛山电器照明股份有限公司高明分公司 | Soft substrate lamp tube sticking machine |
| CN105864665B (en) * | 2016-05-16 | 2018-10-12 | 佛山电器照明股份有限公司高明分公司 | A kind of soft base plate fluorescent tube labelling machine |
| WO2019057143A1 (en) * | 2017-09-22 | 2019-03-28 | 王定锋 | Led bulb made from combination of multiple circuit board packaging modules |
| CN108534093A (en) * | 2018-04-07 | 2018-09-14 | 周小燕 | A kind of reflector for LED light |
| CN113446526A (en) * | 2021-07-01 | 2021-09-28 | 深圳市卷对卷光电科技有限公司 | LED light bar production method and production system applying same |
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Application publication date: 20110518 |