CN201741711U - Plastic piece injection-mold die of positioning lens or forming lens with formed LED integrated structure - Google Patents
Plastic piece injection-mold die of positioning lens or forming lens with formed LED integrated structure Download PDFInfo
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- CN201741711U CN201741711U CN2010202623220U CN201020262322U CN201741711U CN 201741711 U CN201741711 U CN 201741711U CN 2010202623220 U CN2010202623220 U CN 2010202623220U CN 201020262322 U CN201020262322 U CN 201020262322U CN 201741711 U CN201741711 U CN 201741711U
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Abstract
The utility model relates to a plastic piece injection-mold die of a positioning lens or a forming lens with a formed LED integrated structure. The LED integrated structure comprises a radiating substrate, a layout circuit conducting layer, a plastic piece of the positioning lens or the forming lens; the injection-mold die comprises a plastic piece body cavity and a boss which forms a first through hole in the plastic piece body cavity, a blocking part cavity, a containing cavity for containing the radiating substrate and a positioning mechanism; the plastic piece body cavity and the boss are arranged at the same side of a parting surface; the blocking part cavity and the plastic piece body cavity are arranged at the different sides of the parting surface; and the containing cavity and the plastic piece body cavity are communicated mutually or communicated with the blocking part cavity. The plastic piece injection-mold die has the advantages that when the plastic piece of the positioning lens or the forming lens is being formed, the plastic piece of the positioning lens or the forming lens is fixed with the radiating substrate, therefore, the installation process of the plastic piece of the positioning lens or the forming lens is not required, no gap exists between the plastic piece of the positioning lens or the forming lens and the radiating substrate in the axial and radial directions, and the fixing mode is very firm.
Description
Technical field
The utility model relates to the injection mould of the plastic parts of a kind of location of moulding LED integrated morphology or molded lens, relates to particularly that a kind of moulding is used to throw light on, the injection mould of the plastic parts of the location of the LED integrated morphology of backlight, television set, LED dot matrix display screen, projector equipment etc. or molded lens.
Background technology
Background technology
Semiconductor LED is as the novel solid light source, and its conventional package is to electrically connect the such straight cutting structure of led chip with epoxy resin enclosed led chip, pin, to the eighties in last century, begins to adopt the surface pasting technology.Led light source, high-power LED light source particularly, heat is concentrated when luminous, if untimely the distributing of heat that led chip produces, the temperature of led light source is too high, will cause the light efficiency of LED to reduce, the life-span is low etc., therefore the heat that how led chip is produced when luminous has effectively distributed the bottleneck into the popularization and application led light source rapidly.How to improve the light transmittance of led light source, thereby and the heat dispersion that how to improve led light source increase the service life, be the important technology difficult problem on the present industry.
The integrated again mode of single individual LED luminous tube that existing great power LED integrated morphology commonly used adopts support to be packaged into usually.
Application number is in 200810135621.5 the patent of invention, disclose a kind of encapsulation device of light emitting diode, cooling base and electrode suppor combination and method thereof, this encapsulation device of light emitting diode comprises: cooling base, an electrode suppor, locating unit and a cladding of crystal grain contact placement are made and supplied to a LED crystal particle, by high heat-conducting.Cooling base is made by metal or ceramic contour heat-conducting, comprises the depressed part of chassis, body and body end face.Crystal grain places the bottom surface of depressed part.Electrode suppor is gone out moulding by metal material, comprises that a substrate and a vacancy section periphery from substrate extend axially and define the location wall of an accommodation space.Positioning unit be located at cooling base and electrode suppor at least one of them, with so that the cooling base inlay card be fixed in the accommodation space of this electrode suppor.This positioning unit can be to comprise that at least one from the trip salient point that the location of this electrode suppor wall internal face protrudes, also can be to comprise a flange that radially outward protrudes out from the nearly end face of this cooling base place.This manufacture method comprises following steps:
Step (A) a: cooling base is provided;
Step (B): go out moulding one electrode suppor, make this electrode suppor comprise the substrate of a central hollow out, reach one from the axially extended location of vacancy section periphery of this substrate wall, this location wall defines an accommodation space;
Step (C): be located at this cooling base and this electrode suppor positioning unit of one of them at least by one, this cooling base inlay card is fixed in the accommodation space of this electrode suppor;
Step (D): fixing cooling base and the electrode suppor of this mutual inlay card partly coated combination with injection molding method.Existing this encapsulation device of light emitting diode, cooling base and electrode suppor combination and method thereof exist following defective and deficiency:
1) crystal grain is made first radiator by the cooling base of stepped cylindrical, because the not direct ingress of air of the cooling base of column dispels the heat, and it has the solid length of certain metal, owing to need long metal heat loss through conduction apart from heat being distributed in air, and the contact area of cooling base and air is little, so the heat that crystal grain produces when luminous can play hot polymerization collection effect.In order to improve heat dispersion, this cooling base generally also need design heat sinks such as the metal of other high heat dispersion that contact with the conduction of cooling base direct heat or pottery, finally dispels the heat through heat sink.This mode has increased the distance of heat conducting and radiating on the one hand, on the other hand because cooling base and heat sink adhere to two parts separately, both just are to use heat-conducting glue to be bonded together also still huge thermal resistance, basically here temperature is very high can to keep cooling base when crystal grain is luminous, heat sink is temperature and the similar phenomenon of ambient temperature here, do not reach the purpose that the heat on the cooling base is distributed rapidly, radiating effect is very poor.
2) because the cooling base of many columns and electrode suppor etc. are again different parts with heat sink, and part is many, the supporting structure complexity, thickness is thicker, is unfavorable for assembling, and cost is also high; The electric connection of light-emitting diode and Butut circuit need be passed through electrode suppor, complex structure, and the thermal resistance of intermediate link is many, has reduced the luminous efficiency and the radiating efficiency of led chip.
3) need moulding cooling base and electrode suppor respectively in its manufacture method, particularly because of the electrode suppor complex structure, go out the shaped electrode support and need multiple working procedure, the stamping die complex structure of electrode suppor, also need increase the operation that electrode suppor and heat-radiating substrate are installed together, so operation is many in its manufacture method, complex process, the mould structure complexity, the cost of manufacture height.
4) ejection formation moulding cladding and the cooling base of will this mutual inlay card fixing and electrode suppor partly coat in conjunction with the time, because electrode suppor complexity, therefore cladding is in the forming surface complexity of electrode suppor cooperation, the accommodation space complexity of ccontaining cooling base and electrode suppor in the injection mould, the die joint complexity of injection mould, during ejection formation with the cooling base and the electrode suppor detent mechanism complexity that is seated in desired location of combination, when Butut circuit conductive layer places on the pcb board, can't when ejection formation, pcb board, cooling base and electrode suppor be fixed together.
Application number is 200720172030 to disclose a kind of encapsulating structure of pinned great power LED device, comprises LED wafer, lens, printing pcb board, metal heat sink body, gold thread and pin; The metal heat sink body comprises the boss on pedestal and this pedestal, and the upper surface area of pedestal is 2 times of upper surface area of boss at least; Printing pcb board and pedestal are glued together; Pedestal below the printing pcb board is provided with through hole, is electrically connected with the printing pcb board by this through-hole pins; Lens cap button LED wafer cements on the printing pcb board with the printing pcb board and by process for filling colloid into.This powerful pinned great power LED device, though increased the pedestal area of metal heat sink body, but radiating effect still is relatively poor, even dispose radiator in addition, the heat on the led chip must be conducted on boss and the pedestal during owing to heat radiation, pass to the metal heat sink body again, conduct to radiator by the metal heat sink body again, because heat conduction has increased intermediate link, and the very long heat-transfer path of very thick metal heat transfer body correspondence, therefore thermal resistance is very high, and heat-conducting effect is very poor.Also have lens to be buckled on the printing pcb board by cover earlier, coming cementation by encapsulating again is to be difficult to realize, because lens are buckled in very difficult accurate positioning when printing on the pcb board by cover earlier, and lens is shifted during encapsulating, and lens position can't accurately define.Pin will be electrically connected and pass printing pcb board and metal heat sink body with the Butut circuit of printing pcb board top, processed complex, and technology difficulty is big; The LED wafer need pass through electrode suppor with the electric connection of printing the Butut circuit on the PCB, complex structure, and the thermal resistance of intermediate link is many.
For the heat dissipation problem of the integrated morphology that solves existing great power LED, COB (the Chip on Board) package design of LED integrated morphology has been proposed in the prior art.Compare with existing stand type LED integrated morphology, because this invention directly is fixed on chip on the substrate by elargol or eutectic solder etc., the thermal resistance that can cut down the number of intermediate links to greatest extent, thus the thermal resistance of led chip p-n junction reduced to external environment condition, can improve radiating efficiency and luminous efficiency.The advantage of this COB (Chip on Board) package design is that the electrode of each led chip all goes between directly by bonding electrode and metal pad forms ohmic contact, the formation of LED multi-path chip array is to realize electrically interconnected by the arrangements of electric connection of heat-radiating substrate and led chip, the connection in series-parallel of led chip can be realized, reliability of products and qualification rate can be improved again.And overall dimension is little, and thin thickness is easy to assembling, the occasion of can be used for throwing light on, display instrument etc. being had relatively high expectations to the light source fitted position.This package design mainly contains following several mode:
Application number is in 200920136646.7 the utility model patent, a kind of white light LEDs integrated array lighting source based on the encapsulation of COB technology is disclosed, comprise a substrate and some led chips, this substrate is provided with some grooves, form electronic circuit by wiring on it, the printing pcb board that this electronic circuit and surface mount elements on being arranged at substrate cooperate formation to have specific function and be electrically connected; Led chip is bonded in the bottom portion of groove of substrate, and its contact conductor is bonded on the pad of appointment and forms the loop with electronic circuit and surface mount elements, also is coated with fluorescent material on this led chip; LED light-emitting zone top on the substrate is provided with transparent silica gel.The shortcoming one of above-mentioned COB encapsulation technology is the bottom portion of groove that led chip is bonded in substrate, during packaging LED chips, need to fill a large amount of silica gel, because silica gel costs an arm and a leg, therefore increased cost, shortcoming two is that led chip is difficult to the distance that realization needs according to lens focus; Shortcoming three is that the encapsulated electrode lead-in wire must be electrically connected on the Butut circuit of pedestal upper surface from the led chip of base bottom, the light that led chip sends can be because the obstruction of long lead-in wire produces shade, influence optical effect, especially be unfavorable for secondary optics optimization exploitation.Also have this utility model openly how not electrically connect between electronic circuit and surface mount elements, because electronic circuit all places in the reflector, figure one disclosed content particularly from its figure, its electronic circuit also needs be connected by pin from substrate back with electric connection between surface mount elements.
Application number is in 200920112089.5 the utility model patent, a kind of high-power LED street lamp device of COB encapsulation is disclosed, comprise lens, silica gel, gold thread, chip, heating panel etc., heating panel is provided with 5-50 boss, chip directly is fixed on the boss of heating panel, distributes by the fin on heating panel and the heating panel again.The high-power LED street lamp of this structure, though radiating effect is better, owing to there is not the plastic parts of positioning lens or molded lens, the location of lens is inaccurate, silica gel comes packaged chip on the pre-point in lens, the silica gel consumption is big on the one hand, particularly uses this packaged type, has bubble to produce after encapsulation silica gel solidifies, have a strong impact on the luminous mass of led chip, the light that can cause coming out has hot spot, and optics birth defects such as shade are unfavorable for the optical secondary optimization exploitation of led light source.
Application number is in the utility model patent of 200820214808.X, a kind of high-power LED encapsulation structure of efficiency heat-dissipating luminous high is disclosed, comprise lens, substrate and LED luminescence chip, lens are fixed in upper surface of base plate, the lens lower surface is provided with the installation depression that raises up, the LED luminescence chip places upper surface of base plate and is mounted the depression buckle closure, just be provided with at the upper surface of base plate that depression institute buckle closure is installed, negative lighting electrode, lighting electrode is connected by metal wire with the LED luminescence chip, upper surface of base plate is provided with lighting electrode and just links to each other, negative connection electrode, bonding by the adhesive layer of annular between lens lower surface that the depression outside is installed and upper surface of base plate, fill with silica gel at the endoporus of adhesive layer with installing in the formed cavity of depression, offer on the substrate to the endoporus of adhesive layer with the formed cavity of depression is installed in the glue injection channel that is communicated with, and lens become by the crystal polymorph system with substrate.The high-power LED encapsulation structure of this structure, shortcoming one are the fixing by the adhesive layer bonding of lens and substrate, and bonding is fixing not firm; Shortcoming two is detent mechanisms of no positioning lens, and lens are located by with substrate bonding the time, locatees inaccurately, and lens position is departed from; Shortcoming three is that lens are fixed on the substrate by tack coat, and tack coat stops up glue injection channel easily, influence injection silica gel; Shortcoming four is that the metal wire that electrically connects the LED luminescence chip needs and is fixed on the substrate and places the lighting electrode in the installation depressed part of lens to electrically connect, lighting electrode electrically connects with connection electrode again, connection electrode electrically connects with Butut circuit conductive layer again, the thermal resistance of intermediate link is many, influences radiating efficiency and luminous efficiency; Shortcoming five is that the distance of LED luminescence chip and lens recess portion is big, and the anaclasis loss is big, and luminous efficiency is low.
Application number is in 200420112507.8 the utility model patent, a kind of great power LED light-emitting diode is disclosed, comprise aluminium base, elargol, wafer, gold thread, the reflection lid, aluminium base is a convex-concave bowl cup-shaped, promptly there is a circular groove bottom surface at heart place therein, one bowl of cup-shaped boss is arranged above corresponding with it, plastic frame is housed on the boss, plastic frame is circular, the center is provided with circular hole, with the concentric twice groove that has of circular hole, inside and outside formation is hanged down high twice convex edge, and the bottom surface is arranged with two cylinder pin, and be contained in bowl circular hole on cup-shaped boss both sides, the less flat cover that approaches of cambered surface cover in reflection, and its time bead scribbles bonding glue, dress in the groove of plastic frame.The plastic frame bottom surface scribbles adhesive glue water, is filled with glue in it.It is less that bottom surface distance H value is covered in luminous element wafer and reflection.Aluminium base can be a plum blossom shape, also can be circular.Technology and the utility model of this patent disclosure are the most approaching.The number of assembling steps of this patent is, earlier elargol is clicked and entered in the aluminium base boss shape bowl cup, again wafer is fixed on the elargol, put into 145 ℃ of baking box bakings 1 hour, weld gold thread then, the both positive and negative polarity of eyeglass is welded on the aluminium base both positive and negative polarity with gold thread respectively, with bonding glue on the plastic frame coated on bottom side, insert in the aluminium base location hole, glue is filled in the plastic frame toasts, to reflect lid again and coat bonding glue, can use in the groove of the plastic frame of packing into.The shortcoming one of this patent is plastic frame and aluminium base to be fixed by bonding glue, in follow-up potting process, and non-refractory, its reliability of fixation can be subjected to very big influence under hot conditions; Shortcoming two is not inject the passage of filling glue on plastic frame, just needs to fill glue before dress reflection lid, if do not use mould, the shape of glue is uncontrollable, if use mould to fill glue, cost height; Shortcoming three is to fill reflection to be covered behind the glue to coat pack into the groove internal fixation of plastic frame of bonding glue again, fixing so on the one hand unreliable, the position relation is fixing inaccurate, in addition can be gapped between reflection lid and glue, have air in the gap, just have air in the reflection lid, influence the illumination effect of light-emitting diode greatly.Also having the aluminium base in this utility model patent is the bowl cup-shaped, has only a boss on it, gold thread electrically connects the both positive and negative polarity of aluminium base, from its literal and the disclosed content of figure, the both positive and negative polarity of aluminium base can not be a Butut circuit conductive layer, but is as disclosed lighting electrode or stent-type pin etc. in the 200820214808.X patent.
Summary of the invention
The technical problems to be solved in the utility model is, the injection mould of the plastic parts of a kind of location of moulding LED integrated morphology or molded lens is provided, when the plastic parts of injection mo(u)lding positioning lens or molded lens, the plastic parts and the heat-radiating substrate of positioning lens or molded lens are fixed, and all there are not the gap in the plastic parts of positioning lens or molded lens and heat-radiating substrate in axial, radial direction.
The injection mould of a kind of location of moulding LED integrated morphology or the plastic parts of molded lens, LED integrated morphology comprises heat-radiating substrate, Butut circuit conductive layer, the plastic parts of positioning lens or molded lens; Injection mould comprises cover half device, dynamic model device, advances adhesive dispenser and liftout attachment, advance adhesive dispenser and be arranged on cover half device one side, the plastic parts of positioning lens or molded lens comprises the plastic parts body, is provided with first through hole of positioning lens or molded lens on the plastic parts body; On the end face of plastic parts body, extend and be provided with two or more fixed legs, be provided with the blocking part in the fixed leg end, be provided with second through hole that cooperates with fixed leg on heat-radiating substrate, fixed leg passes second through hole of heat-radiating substrate and is fixed together by the plastic parts and the heat-radiating substrate of blocking part with positioning lens or molded lens; Injection mould comprises the plastic parts body die cavity of forming plastic cement spare body and is convexly equipped with the boss of moulding first through hole in plastic parts body die cavity, the blocking part die cavity of moulding blocking part, the containing cavity of ccontaining heat-radiating substrate is placed on heat-radiating substrate the detent mechanism of containing cavity desired location; Plastic parts body die cavity and boss are arranged on the homonymy of die joint, and blocking part die cavity and plastic parts body die cavity are arranged on the heteropleural of die joint, and containing cavity is communicated with plastic parts body die cavity or is communicated with the blocking part die cavity; Second through hole forms the die cavity of moulding fixed leg.
As first kind of improvement, plastic parts body die cavity, boss are arranged on the cover half part, and the blocking part die cavity is arranged on the dynamic model part, and ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity; Plastic parts body die cavity and boss are big along the forming surface demoulding tapering of stripping direction, and the blocking part die cavity of dynamic model part does not have demoulding tapering or is back taper along the forming surface of stripping direction.Plastic parts body die cavity, boss are arranged on the cover half part, the filling balance of plastic cement when being convenient to the setting of the cast gate of adhesive dispenser into and injection moulding.Ejecting mechanism is arranged on dynamic model partly makes mould structure simple.Since in the forming surface of cover half part stripping direction greater than forming surface at dynamic model part stripping direction, therefore the plastic parts body die cavity of cover half part and boss want big along the forming surface demoulding tapering of stripping direction when mfg. moulding die, the blocking part die cavity of dynamic model part does not have demoulding tapering or is back taper along the forming surface of stripping direction, and product is stayed dynamic model one side in the time of can guaranteeing dynamic model part and cover half part somatotype like this.
As second kind of improvement, plastic parts body die cavity, boss are arranged on the cover half part, and the blocking part die cavity is arranged on the dynamic model part, and ejecting mechanism is arranged on the cover half part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity.Plastic parts body die cavity, boss are arranged on the cover half part, are convenient to the into setting of the cast gate of adhesive dispenser and the filling balance of injection moulding plastic cement.Since in the forming surface of cover half part stripping direction greater than forming surface at dynamic model part stripping direction, product can be stayed cover half one side when dynamic model part and cover half part somatotype, ejecting mechanism is arranged on cover half one side, just adopt the upside-down mounting mould, be convenient to ejecting of product, and the mould molding face of stripping direction does not need particular design.
As the third improvement, plastic parts body die cavity, boss are arranged on the dynamic model part, and the blocking part die cavity is arranged on the cover half part, and ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of blocking part die cavity.Like this in the forming surface of dynamic model part stripping direction greater than forming surface at cover half part stripping direction, can guarantee when dynamic model part and cover half part somatotype that product can stay dynamic model mould one side, be convenient to ejecting of product.Ejecting mechanism is arranged on dynamic model one side, and mould structure is simple.
As the 4th kind of improvement, on heat-radiating substrate, be provided with and the integrated two or more chip fixing lug boss that are used for fixing led chip of heat-radiating substrate, chip fixing lug boss correspondence one by one places in first through hole; Be provided with chip fixing lug boss emptiness avoiding hole in mould, chip fixing lug boss emptiness avoiding hole and plastic parts body die cavity are arranged on the homonymy of die joint, are provided with the empty avoiding gap between chip fixing lug boss emptiness avoiding hole and chip fixing lug boss.Be provided with the empty avoiding gap between chip fixing lug boss emptiness avoiding hole and chip fixing lug boss, can reduce the machining accuracy of chip fixing lug boss emptiness avoiding hole, the chip fixing lug boss is not interfered with mould when guaranteeing to be placed on heat-radiating substrate in the mould.
As further improvement, Butut circuit conductive layer is set directly on the heat-radiating substrate and towards the plastic parts of positioning lens or molded lens; Detent mechanism is the location hole that cooperates with the chip fixing lug boss, and location hole and plastic parts body die cavity are at the homonymy of die joint.Adopt chip fixing lug boss and location hole location, simple in structure.Under the situation that a lot of chip fixing lug boss are arranged on the heat-radiating substrate, only two to four location holes that cooperate with the chip fixing lug boss need be set, remaining design is an emptiness avoiding hole.
As another improvement, a side that deviates from the chip fixing lug boss at heat-radiating substrate is provided with heat radiation blind hole or the heat radiation ladder hole that places in the chip fixing lug boss; Deviate from the heat-radiating substrate of a side of chip fixing lug boss being provided with and the integrated heat radiation convex tendon of substrate at the periphery of the periphery of heat radiation blind hole or heat radiation ladder hole big end, in the heat radiation convex tendon, be provided with heat insulation blind hole; Be provided with heat radiation convex tendon emptiness avoiding hole on injection mould, heat radiation convex tendon emptiness avoiding hole and blocking part die cavity are provided with the empty avoiding gap at the homonymy of die joint between heat radiation convex tendon emptiness avoiding hole and heat radiation convex tendon.Heat radiation convex tendon emptiness avoiding hole be regular shape, the processing of the convex tendon emptiness avoiding hole of being convenient to dispel the heat.Be provided with the empty avoiding gap between heat radiation convex tendon emptiness avoiding hole and heat radiation convex tendon, can reduce the machining accuracy of heat radiation convex tendon emptiness avoiding hole, the heat radiation convex tendon is not interfered with mould when guaranteeing to be placed on heat-radiating substrate in the mould.
As the 5th kind of improvement, keeper is a locating shaft, and locating shaft cooperates with heat-radiating substrate.Locating shaft can cooperate etc. with the neighboring of heat-radiating substrate or the location hole on the heat-radiating substrate or the location notch on the heat-radiating substrate.Adopt locating shaft location heat-radiating substrate, simple in structure.
As the 6th kind of improvement, also comprise pcb board, Butut circuit conductive layer is set directly on the pcb board, and the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate; Be provided with the third through-hole that cooperates with fixed leg on pcb board, fixed leg passes second through hole of the third through-hole of pcb board and heat-radiating substrate successively and is fixed together by plastic parts, pcb board and the heat-radiating substrate of blocking part with positioning lens or molded lens; Keeper is a locating shaft, is provided with ringent location notch on the side of pcb board, locating shaft be multidiameter and with plastic parts body die cavity homonymy, the little axle of locating shaft cooperates with heat-radiating substrate, adjacent with little of locating shaft cooperates with location notch on the pcb board; Third through-hole forms the die cavity of moulding fixed leg.Because the area of pcb board is less than or equal to the area of heat-radiating substrate, or is provided with flange on heat-radiating substrate, the locating shaft of mode that adopts location notch to cooperate with locating shaft can be located from both direction.
As the 7th kind of improvement, when Butut circuit conductive layer was set directly on the heat-radiating substrate, the degree of depth of the containing cavity of ccontaining heat-radiating substrate equaled the thickness sum of the thickness and the Butut circuit conductive layer of heat-radiating substrate; When Butut circuit conductive layer was arranged on the pcb board, the degree of depth of the containing cavity of ccontaining heat-radiating substrate and pcb board equaled the thickness sum of the thickness and the Butut circuit conductive layer of the thickness of heat-radiating substrate, pcb board.The degree of depth of containing cavity increases the thickness of Butut circuit conductive layer, can save the die cavity of machine-shaping Butut circuit conductive layer on the mould molding face, under Butut circuit conductive layer very complicated situation, reduces die manufacturing cost greatly.Because Butut circuit conductive layer thickness is extremely thin, be generally 0.02mm, so this structure can not cause Lou glue phenomenon yet.
First kind of common improvement as such scheme, the plastic parts of positioning lens or molded lens is the lens position plastic parts of positioning lens, on the lens position plastic parts, be provided with the glue injection channel of injecting packing colloid, the Jiao Kou of glue injection channel places on the end face of lens position plastic parts away from blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; On the sidewall of boss, be provided with the protuberance of moulding glue injection channel.
As second kind of common improvement of such scheme, the plastic parts of positioning lens or molded lens comprises the plastic cement body of a ring-type, is fixed with the plastic parts of two or more separate positioning lens or molded lens on heat-radiating substrate; The cast gate that advances adhesive dispenser is communicated with plastic cement body cavity bottom for the some cast gate, corresponding one or two cast gate of each plastic cement body die cavity.Because the plastic parts of a plurality of independently positioning lens of moulding or molded lens in a mold, the some cast gate is convenient to penetrate in nozzle glue is diverted to each independently forming cavity.
The beneficial effects of the utility model are, in injection mould, be provided with the containing cavity of ccontaining heat-radiating substrate, detent mechanism is with the spacing desired location in injection mould of heat-radiating substrate during the plastic parts of injection mo(u)lding positioning lens or molded lens, injection mould is when the plastic parts of moulding positioning lens or molded lens, the plastic parts and the heat-radiating substrate of positioning lens or molded lens are fixed, saved the installation procedure of the plastic parts of positioning lens or molded lens, and the plastic parts of positioning lens or molded lens and heat-radiating substrate are axially, all there is not the gap in radial direction, fixed form is very reliable, position relation between the plastic parts of heat-radiating substrate and positioning lens or molded lens can be very accurate, the lens position relation of the plastic parts of positioning lens or molded lens is very accurate, thereby improves the optical effect of LED integrated morphology.Plastic parts body die cavity and blocking part die cavity place the heteropleural of die joint, are convenient to the demoulding of product.
Description of drawings
Fig. 1 is that the master of the utility model embodiment 1 looks schematic diagram.
Fig. 2 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the utility model embodiment 1, the perspective exploded view of detent mechanism.
Fig. 3 is the dynamic model mold insert, cover half mold insert, LED integrated morphology, detent mechanism of the utility model embodiment 1 perspective exploded view from another direction projection.
Fig. 4 is the I portion enlarged drawing of Fig. 3.
Fig. 5 is the detent mechanism of the utility model embodiment 1 and the schematic perspective view of LED integrated morphology.
Fig. 6 is that schematic diagram is looked on the right side of the utility model embodiment 2.
Fig. 7 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the utility model embodiment 2, the perspective exploded view of detent mechanism.
Fig. 8 is the dynamic model mold insert, cover half mold insert, LED integrated morphology, detent mechanism of the utility model embodiment 2 perspective exploded view from another direction projection.
Fig. 9 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the utility model embodiment 3, the perspective exploded view of detent mechanism.
Figure 10 is the dynamic model mold insert, cover half mold insert, LED integrated morphology, detent mechanism of the utility model embodiment 3 perspective exploded view from another direction projection.
Figure 11 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the utility model embodiment 4, the perspective exploded view of detent mechanism.
Figure 12 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the utility model embodiment 4, the perspective exploded view of detent mechanism.
Figure 13 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the utility model embodiment 5, the perspective exploded view of detent mechanism.
Figure 14 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the utility model embodiment 6, the perspective exploded view of detent mechanism.
Embodiment
Extremely shown in Figure 5 as Fig. 1, the injection mould of a kind of location of moulding LED integrated morphology or the plastic parts of molded lens, LED integrated morphology, the plastic parts that comprises heat-radiating substrate 1, pcb board 2, Butut circuit conductive layer 3, positioning lens or molded lens, injection mould comprise cover half device, dynamic model device, advance adhesive dispenser, liftout attachment and heat-radiating substrate 1 and pcb board 2 are placed on the positioner of the desired location in the injection mould when injection mo(u)lding lens position ring.
The plastic parts of positioning lens or molded lens is a lens position ring 4, lens position ring 4 comprises the independently plastic parts body 5 of ring-type, be provided with first through hole 6 of positioning lens at the axis direction of plastic parts body 5, on the end face of plastic parts body 5, extend and be provided with four fixed legs 7, form cross section during at molded lens locating ring 4 in the end of fixed leg 7 in by the mould that heat-radiating substrate 1 is placed molded lens locating ring 4 and be circular blocking part 8.Be provided with the glue injection channel 9 of injecting packing colloid on plastic parts body 5, the glue mouth 10 of glue injection channel 9 places on the end face of plastic parts body 5 away from blocking part 8 one sides, and glue mouth 10 and glue injection channel 9 are communicated with the sidewall of first through hole 6.
Convex with in the bottom of heat-radiating substrate 1 and heat-radiating substrate 1 integrated a plurality of chip fixing lug boss 11, second through hole 12 that cooperates with fixed leg 7.The cross section of chip fixing lug boss 11 is circular, is provided with the depressed part 12 with the concentric storing led chip of chip fixing lug boss 11 at the top of chip fixing lug boss 11, and the bottom surface of depressed part 12 is for placing the plane of led chip.A side that deviates from chip fixing lug boss 11 at heat-radiating substrate 1 is provided with macropore (not shown), the aperture 13 that places in the chip fixing lug boss 11 with the concentric heat radiation ladder hole of chip fixing lug boss 11, and led chip covers the aperture 13 of heat radiation ladder hole fully.Deviate from the periphery of the big end of ladder hole on the heat-radiating substrate 1 of chip fixing lug boss 11 1 sides and be provided with and heat-radiating substrate 1 integrated heat radiation convex tendon 14, be provided with heat insulation blind hole 15 in heat radiation convex tendon 14, heat insulation blind hole 15 is communicated with towards chip fixing lug boss 11 1 sides with the base plate of heat-radiating substrate 1 towards a side of chip fixing lug boss 11.The side that heat-radiating substrate 1 deviates from chip fixing lug boss 11 directly contacts with heat radiation gas.
Butut circuit conductive layer 3 is set directly on the pcb board 2, and Butut circuit conductive layer 3 is distributed on the same plane.On pcb board 2, be provided with fourth hole 16 that cooperates with chip fixing lug boss 11 and the third through-hole 17 that cooperates with fixed leg 7, pcb board 2 places heat-radiating substrate 1 to be provided with a side of chip fixing lug boss 11 and directly contacts with heat-radiating substrate 1, and the side that pcb board 2 is provided with Butut circuit conductive layer 3 deviates from the contact-making surface that contacts heat-radiating substrate 1.
The chip fixing lug boss 11 of heat-radiating substrate 1 is passed the fourth hole 16 of pcb board 2, and the fixed leg 7 of lens position ring 4 passes the third through-hole 17 on the pcb board 2, second through hole 12 of heat-radiating substrate 1 is fixed with pcb board 2, heat-radiating substrate 1 by the blocking part 8 of fixed leg 7 ends.Chip fixing lug boss 11 places in first through hole 6 of corresponding plastic parts body 5, and Butut circuit conductive layer 3 stretches between the madial wall and chip fixing lug boss 11 lateral walls of first through hole 6.
The cover half device comprises the top clamping plate 18 that is fixed on the injection molding machine, and with the cover half backing plate 19 that top clamping plate 18 is fixed, the solid plate 20 with cover half backing plate 19 is fixed is fixed on the cover half mold insert 21 in the solid plate 20.
The dynamic model device comprises the Bottom clamp plate 22 that is fixed on the injection molding machine, and with two cushion blocks 23 that Bottom clamp plate 22 is fixed, the moving platen 24 with two cushion blocks 23 are fixed is fixed on the dynamic model mold insert 25 in the moving platen 24.
Advance adhesive dispenser and comprise six some cast gates that are communicated with runner 26 and nozzle 27.Each lens position ring 4 corresponding two some cast gate, the some cast gate is communicated with plastic parts body 5 die cavities, is symmetrically distributed in the both sides of the protuberance of moulding glue injection channel 9.Nozzle 27 is fixed in top clamping plate 18 and the cover half backing plate 19.
Liftout attachment comprises thimble backing plate 28, thimble fixed head 29, thimble 30, and thimble 30 is fixed on the thimble fixed head 29 and stretches in moving platen 24 and the dynamic model mold insert 25.Thimble backing plate 28 and thimble fixed head 29 are installed between two cushion blocks 23.
Along the base plane somatotype that heat-radiating substrate 1 deviates from chip fixing lug boss 11, die joint is the plane.
On cover half mold insert 21, be provided with ccontaining heat-radiating substrate 1 and pcb board 2 rectangle cavity 31, the degree of depth of rectangle cavity 31 equals the thickness sum of heat-radiating substrate 1 and pcb board 2, is provided with the empty avoiding gap between the sidewall of the sidewall of rectangle cavity 31 and heat-radiating substrate 1.
Be provided with the groove 34 of the plastic parts body die cavity 32 of forming plastic cement spare body 5, the boss 33 that is convexly equipped with moulding first through hole 6 in plastic parts body die cavity 32, moulding Butut circuit conductive layer 3, the recessed circular hole 35 of empty avoiding of empty avoiding chip fixing lug boss 11 in the bottom of rectangle cavity 31, on the sidewall of boss 33, be provided with the protuberance 36 of moulding glue injection channel 9.Boss 33 and plastic parts body die cavity 32 form the depressed part of ring-type.Be provided with the blocking part die cavity 37 of moulding blocking part 8 and the emptiness avoiding hole 38 of empty avoiding heat radiation convex tendon 14 on dynamic model mold insert 25, blocking part die cavity 37 is circular shrinkage pool for the cross section.Also be provided with the detent mechanism that heat-radiating substrate 1 and pcb board 2 is placed on the containing cavity desired location.Detent mechanism comprises the U-shaped location notch 39 that is arranged on 2 two opposite flanks of pcb board, is fixed on four cylindrical ladder locating shaft 40 and four ladder locating shafts 41 with three ladders with two ladders in the cover half mold insert 21.On dynamic model mold insert 25, be provided with little 42 emptiness avoiding hole 43 of cylindrical ladder locating shaft 40 and little 46 emptiness avoiding hole 44 of ladder locating shaft 41.The axis 45 of ladder locating shaft 41 cooperates with U-shaped location notch 39.Folding mould direction is that horizontal direction is a Y direction, heat-radiating substrate 1 and pcb board 2 are placed in the injection mould, two U-shaped sides of 42 pairs of heat-radiating substrates 1 of little axle of cylindrical ladder locating shaft 40 position in Z-direction, 45 pairs of pcb boards 2 of the axis of ladder locating shaft 41 position from Z-direction and X-direction both direction, and 46 pairs of heat-radiating substrates of the little axle of ladder locating shaft 41 1 position from X-direction.Plastic parts body die cavity 32 and boss 33 are that the forming surface demoulding tapering of Y direction is big along stripping direction, and the blocking part die cavity 37 of dynamic model part is that the forming surface of Y direction does not have demoulding tapering along stripping direction.
To shown in Figure 8, as different from Example 1, ejecting mechanism is arranged on cover half device one side, is the upside-down mounting mould as Fig. 6.
Be provided with the end face somatotype of Butut circuit conductive layer 74 along pcb board 73, die joint is the plane.
The cover half device comprises the top clamping plate 63 that is fixed on the injection molding machine, and with two cushion blocks 64 that top clamping plate 63 is fixed, the solid plate 65 with two cushion blocks 64 are fixed is fixed on the cover half mold insert 54 in the solid plate 65.
The dynamic model device comprises the Bottom clamp plate 66 that is fixed on the injection molding machine, and the moving platen 67 with Bottom clamp plate 66 is fixed is fixed on the dynamic model mold insert 61 in the moving platen 67.
Liftout attachment comprise thimble backing plate 68, with fixing thimble fixed head 69, the thimble 70 of thimble backing plate 68, thimble 70 is fixed on the thimble fixed head 69 and stretches into that solid plate 65 and cover half mold insert 54 are interior to be communicated with plastic parts body die cavity 55.Thimble backing plate 68 and thimble fixed head 69 are installed between two cushion blocks 64.Thimble backing plate 68 links together with moving platen 67 by connecting guide pad 71.
Plastic cement lens position part 51 comprises the plastic parts body 52 of ring-type and the dowel 53 with 52 injection mo(u)ldings of plastic parts body that plastic parts body 52 is linked together.The number of plastic parts body 52 is six.
Be provided with plastic cement body die cavity 55 on the die joint of cover half mold insert 54, be convexly equipped with the moulding dowel 53 that the boss 72 of moulding first through hole in plastic parts body die cavity 55 and plastic cement body die cavity 55 be communicated with dowel die cavity 56,, the recessed circular hole 77 of empty avoiding of empty avoiding chip fixing lug boss 78, on the sidewall of boss 72, be provided with the protuberance 79 of moulding glue injection channel.Dowel die cavity 56 is communicated with the depressed part that boss 72 and plastic parts body die cavity 55 form ring-type.On dynamic model mold insert 61, be provided with the holding part 75 of ccontaining heat-radiating substrate 76 and pcb board 73, be provided with the blocking part die cavity 58 of moulding blocking part 57 and the emptiness avoiding hole 60 of empty avoiding heat radiation convex tendon 59 in the bottom surface of holding part 75.The degree of depth of holding part equals the thickness sum of heat-radiating substrate 76, pcb board 73, Butut circuit conductive layer.Dynamic model mold insert 61 and cover half mold insert 54 design routinely along the demoulding tapering of the forming surface of folding mould direction.
As Fig. 9, shown in Figure 10, as different from Example 1, the plastic parts of positioning lens or molded lens is a lens forming plastic cement spare 80, lens forming plastic cement spare 80 comprises tabular plastic parts body 81, on plastic parts body 81, be provided with six first through holes 82, extension is provided with fixed leg 83 on the end face of plastic parts body 81, is provided with blocking part 84 in the end of fixed leg 83.First through hole 82 is for having the through hole of bellmouth, also is provided with equally distributed four columniform lens fixing holes 85 in the periphery of each first through hole 82.Be not provided with heat radiation convex tendon and heat insulation blind hole on the heat-radiating substrate 94 in the present embodiment.
Be provided with the end face somatotype of Butut circuit conductive layer 87 along pcb board 86, die joint is the plane.
On cover half mold insert 88, also be provided with the plastic parts body die cavity 89 of rectangle, be convexly equipped with boss 90 at bottom moulding first through hole 82 of plastic parts body die cavity 89, the cylindrical mold insert axle 91 of molded lens fixing hole 85 is provided with the emptiness avoiding hole 93 of empty avoiding chip fixing lug boss 92 in boss 90.Cylindrical mold insert axle 91 is fixed on the cover half mold insert 88 and is convexly equipped with bottom at plastic parts body die cavity 89.The degree of depth of plastic parts body die cavity 89 equals the thickness sum of the thickness and the Butut circuit conductive layer 87 of tabular plastic parts body 81.
The bottom of the rectangle cavity 96 of ccontaining heat-radiating substrate 94 and pcb board 86 is provided with the positioning boss 98 that the blocking part die cavity 97 of moulding blocking part 84 and four cooperate with heat radiation blind hole 99 in the chip fixing lug boss 92 on dynamic model mold insert 95.When injection mo(u)lding lens forming plastic cement spare 80, cooperate with positioning boss 98 by the heat radiation blind hole 99 on the heat-radiating substrate 94, heat-radiating substrate 94 and pcb board 86 are seated in desired location in the injection mould.
Cast gate 100 is the some cast gate, and number is two, is communicated with plastic parts body die cavity 89 bottoms.
Embodiment 4
As Figure 11, shown in Figure 12, as different from Example 1, LED integrated morphology comprises heat-radiating substrate 200, Butut circuit conductive layer 201 and lens forming plastic cement spare.Butut circuit conductive layer 201 is set directly on the heat-radiating substrate 200.Lens forming plastic cement spare comprise ring-type plastic parts body 203 and with plastic parts body 203 link together with dowel 204. first through holes 205 of plastic parts body 203 injection mo(u)ldings for having the through hole of bellmouth, also be provided with equally distributed four columniform lens fixing holes 206 in the periphery of each first through hole 205.Lens forming plastic cement spare is fixed together by fixed leg and blocking part and heat-radiating substrate 200.The number of moulding ring is 24.In the present embodiment, be not provided with the chip fixing lug boss on the heat-radiating substrate 200 and place heat radiation blind hole, heat radiation convex tendon and heat insulation blind hole in the boss, chip directly is fixed on the plane of heat-radiating substrate 200 and places in first through hole 205.
Deviate from the bottom somatotype of Butut circuit conductive layer 201 along heat-radiating substrate 200 base plates, die joint is the plane.
On cover half mold insert 207, also be provided with the dowel die cavity 209 of the moulding dowel 204 that is communicated with plastic parts body die cavity 208.Dowel die cavity 209 is communicated with the depressed part that boss 210 and plastic parts body die cavity 208 form ring-type.The containing cavity of ccontaining heat-radiating substrate 200 is the rectangle cavity 210 that is arranged on the cover half mold insert, and the degree of depth of rectangle cavity 210 equals the thickness sum of heat-radiating substrate 200 and pcb board, is provided with the empty avoiding gap between the sidewall of the sidewall of rectangle cavity 210 and heat-radiating substrate 200.
On dynamic model mold insert 211, be provided with the blocking part die cavity 212 of moulding blocking part.Also be provided with the hot runner system (not shown) in the cover half device of present embodiment, the number of the cast gate (not shown) that is communicated with runner 202 is six, is communicated with dowel die cavity 209 bottoms.The corresponding hot-runner nozzle (not shown) of each cast gate.
As shown in figure 13, as different from Example 1, be provided with on heat-radiating substrate 230 and heat-radiating substrate 230 integrated boss 231, boss 231 deviates from pcb board, is provided with the blind hole (not shown) of fixed chip in boss 231.
In a cover injection mould, place four heat-radiating substrates 230 simultaneously.
Along the base plane somatotype of heat-radiating substrate base plate towards boss 231, die joint is the plane.
The containing cavity 232 of heat-radiating substrate 230 and pcb board 233 is the rectangle cavity, is arranged on the solid plate, is provided with the empty avoiding gap between the sidewall of containing cavity and heat-radiating substrate 230.
On the dynamic model mold insert, be provided with the emptiness avoiding hole (not shown) of boss 231.
As shown in figure 14, as different from Example 3, on dynamic model mold insert 250, also be provided with the plastic parts body die cavity (not shown) of rectangle, be convexly equipped with boss at bottom moulding first through hole of plastic parts body die cavity, the cylindrical mold insert axle of molded lens fixing hole is provided with the emptiness avoiding hole of empty avoiding chip fixing lug boss 256 in boss.Cylindrical mold insert axle is fixed on the cover half mold insert and is convexly equipped with bottom at plastic parts body die cavity.
The bottom of the rectangle cavity 254 of ccontaining heat-radiating substrate 252 and pcb board 253 is provided with the positioning boss 257 that the blocking part die cavity 255 of moulding blocking part and four cooperate with heat radiation blind hole in the chip fixing lug boss 256 on cover half mold insert 251.The cast gate that is communicated with runner 258 is a cast gate, and number is 7, is communicated with blocking part die cavity 255 bottoms.
The utility model is not limited to the foregoing description.The shape of the utility model heat-radiating substrate can design different shape as required, even can be designed to the product appearance part, the utility model just intercepts wherein led chip unit, so mould die joint of the present utility model is an illustrative, can determine die joint according to the shape of substrate.Chip fixing lug boss number in the utility model can be from one to a lot of, and the utility model just exemplifies several LED integrated morphologies unit.Butut circuit conductive layer in the utility model is an illustrative.On a chip fixing lug boss, can fix a led chip, also can fix the led chip of two different colours, the chip of three R, G, B different colours, or the chip more than three.When the chip number not simultaneously, the design corresponding modify of Butut circuit conductive layer belongs to prior art, the utility model no longer describes in detail.Heat-radiating substrate in the utility model directly contacts with radiator liquid, only needs heat-radiating substrate no leakage body to get final product, so no longer illustrate with embodiment in the utility model.
In the utility model, if the dimensional accuracy height of heat-radiating substrate and pcb board, the periphery location of also available heat-radiating substrate and pcb board.
Claims (15)
1. the injection mould of the plastic parts of the location of moulding LED integrated morphology or molded lens, LED integrated morphology comprises heat-radiating substrate, Butut circuit conductive layer, the plastic parts of described positioning lens or molded lens; Injection mould comprises cover half device, dynamic model device, advances adhesive dispenser and liftout attachment, advance adhesive dispenser and be arranged on cover half device one side, it is characterized in that: the plastic parts of positioning lens or molded lens comprises the plastic parts body, is provided with first through hole of positioning lens or molded lens on the plastic parts body; On the end face of plastic parts body, extend and be provided with two or more fixed legs, be provided with the blocking part in the fixed leg end, be provided with second through hole that cooperates with fixed leg on heat-radiating substrate, fixed leg passes second through hole of heat-radiating substrate and is fixed together by the plastic parts and the heat-radiating substrate of blocking part with positioning lens or molded lens; Injection mould comprises the plastic parts body die cavity of forming plastic cement spare body and is convexly equipped with the boss of moulding first through hole in plastic parts body die cavity, the blocking part die cavity of moulding blocking part, the containing cavity of ccontaining heat-radiating substrate is placed on heat-radiating substrate the detent mechanism of containing cavity desired location; Plastic parts body die cavity and boss are arranged on the homonymy of die joint, and blocking part die cavity and plastic parts body die cavity are arranged on the heteropleural of die joint, and containing cavity is communicated with plastic parts body die cavity or is communicated with the blocking part die cavity; Second through hole forms the die cavity of moulding fixed leg.
2. the injection mould of the location of moulding LED integrated morphology as claimed in claim 1 or the plastic parts of molded lens, it is characterized in that: plastic parts body die cavity, boss are arranged on the cover half part, the blocking part die cavity is arranged on the dynamic model part, ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity; Plastic parts body die cavity and boss are big along the forming surface demoulding tapering of stripping direction, and the blocking part die cavity of dynamic model part does not have demoulding tapering or is back taper along the forming surface of stripping direction.
3. the injection mould of the location of moulding LED integrated morphology as claimed in claim 1 or the plastic parts of molded lens, it is characterized in that: plastic parts body die cavity, boss are arranged on the cover half part, the blocking part die cavity is arranged on the dynamic model part, ejecting mechanism is arranged on the cover half part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity.
4. the injection mould of the location of moulding LED integrated morphology as claimed in claim 1 or the plastic parts of molded lens, it is characterized in that: plastic parts body die cavity, boss are arranged on the dynamic model part, the blocking part die cavity is arranged on the cover half part, ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of blocking part die cavity.
5. the injection mould of the location of moulding LED integrated morphology as claimed in claim 1 or the plastic parts of molded lens, it is characterized in that: be provided with on heat-radiating substrate and the integrated two or more chip fixing lug boss that are used for fixing led chip of heat-radiating substrate, chip fixing lug boss correspondence one by one places in first through hole; Be provided with chip fixing lug boss emptiness avoiding hole in mould, chip fixing lug boss emptiness avoiding hole and plastic parts body die cavity are arranged on the homonymy of die joint, are provided with the empty avoiding gap between chip fixing lug boss emptiness avoiding hole and chip fixing lug boss.
6. the injection mould of the location of moulding LED integrated morphology as claimed in claim 5 or the plastic parts of molded lens is characterized in that: Butut circuit conductive layer is set directly on the heat-radiating substrate and towards the plastic parts of positioning lens or molded lens; Detent mechanism is the location hole that cooperates with the chip fixing lug boss, and location hole and plastic parts body die cavity are at the homonymy of die joint.
7. the injection mould of the location of moulding LED integrated morphology as claimed in claim 5 or the plastic parts of molded lens is characterized in that: a side that deviates from the chip fixing lug boss at heat-radiating substrate is provided with heat radiation blind hole or the heat radiation ladder hole that places in the chip fixing lug boss; Deviate from the heat-radiating substrate of a side of chip fixing lug boss being provided with and the integrated heat radiation convex tendon of substrate at the periphery of the periphery of heat radiation blind hole or heat radiation ladder hole big end, in the heat radiation convex tendon, be provided with heat insulation blind hole; Be provided with heat radiation convex tendon emptiness avoiding hole on injection mould, heat radiation convex tendon emptiness avoiding hole and blocking part die cavity are provided with the empty avoiding gap at the homonymy of die joint between heat radiation convex tendon emptiness avoiding hole and heat radiation convex tendon.
8. the injection mould of the location of moulding LED integrated morphology as claimed in claim 1 or the plastic parts of molded lens is characterized in that: keeper is a locating shaft, and locating shaft cooperates with heat-radiating substrate.
9. the injection mould of the location of moulding LED integrated morphology as claimed in claim 1 or the plastic parts of molded lens, it is characterized in that: also comprise pcb board, Butut circuit conductive layer is set directly on the pcb board, and the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate; Be provided with the third through-hole that cooperates with fixed leg on pcb board, fixed leg passes second through hole of the third through-hole of pcb board and heat-radiating substrate successively and is fixed together by plastic parts, pcb board and the heat-radiating substrate of blocking part with positioning lens or molded lens; Keeper is a locating shaft, is provided with ringent location notch on the side of pcb board, locating shaft be multidiameter and with plastic parts body die cavity homonymy, the little axle of locating shaft cooperates with heat-radiating substrate, adjacent with little of locating shaft cooperates with location notch on the pcb board; Third through-hole forms the die cavity of moulding fixed leg.
10. the injection mould of the location of moulding LED integrated morphology as claimed in claim 1 or the plastic parts of molded lens, it is characterized in that: when Butut circuit conductive layer was set directly on the heat-radiating substrate, the degree of depth of the containing cavity of ccontaining heat-radiating substrate equaled the thickness sum of the thickness and the Butut circuit conductive layer of heat-radiating substrate; When Butut circuit conductive layer was arranged on the pcb board, the degree of depth of the containing cavity of ccontaining heat-radiating substrate and pcb board equaled the thickness sum of the thickness and the Butut circuit conductive layer of the thickness of heat-radiating substrate, pcb board.
11. injection mould as the plastic parts of the location of any described moulding LED integrated morphology of claim 1 to 10 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens is the lens position plastic parts of positioning lens, on the lens position plastic parts, be provided with the glue injection channel of injecting packing colloid, the Jiao Kou of glue injection channel places on the end face of lens position plastic parts away from blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; On the sidewall of boss, be provided with the protuberance of moulding glue injection channel.
12. injection mould as the plastic parts of the location of any described moulding LED integrated morphology of claim 1 to 10 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens comprises the plastic cement body of a ring-type, is fixed with two or more the separate described positioning lens or the plastic parts of molded lens on heat-radiating substrate; The cast gate that advances adhesive dispenser is communicated with plastic cement body cavity bottom for the some cast gate, corresponding one or two cast gate of each plastic cement body die cavity.
13. injection mould as the plastic parts of the location of any described moulding LED integrated morphology of claim 1 to 10 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens comprises the plastic parts body of ring-type and will set the dowel with the injection mo(u)lding of plastic parts body that the plastic parts body of number links together that the plastic parts of positioning lens or molded lens comprises the plastic parts body of two or more described ring-types; Be provided with the dowel forming cavity that is communicated with plastic parts body die cavity on mould, the cast gate that advances adhesive dispenser is communicated with plastic parts body die cavity and/or dowel die cavity; The cast gate that advances adhesive dispenser is a cast gate or down gate.
14. injection mould as the plastic parts of the location of any described moulding LED integrated morphology of claim 1 to 10 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens comprises tabular plastic parts body, be provided with two or more described first through holes on tabular plastic cement body, the cast gate that advances adhesive dispenser is a cast gate or down gate.
15. as the injection mould of the plastic parts of the location of any described moulding LED integrated morphology of claim 1 to 10 or molded lens, it is characterized in that: the cover half part also comprises hot runner system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202623220U CN201741711U (en) | 2010-07-07 | 2010-07-07 | Plastic piece injection-mold die of positioning lens or forming lens with formed LED integrated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202623220U CN201741711U (en) | 2010-07-07 | 2010-07-07 | Plastic piece injection-mold die of positioning lens or forming lens with formed LED integrated structure |
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| Publication Number | Publication Date |
|---|---|
| CN201741711U true CN201741711U (en) | 2011-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202623220U Expired - Fee Related CN201741711U (en) | 2010-07-07 | 2010-07-07 | Plastic piece injection-mold die of positioning lens or forming lens with formed LED integrated structure |
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| CN (1) | CN201741711U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102682672A (en) * | 2011-09-30 | 2012-09-19 | 杨东佐 | LED (light-emitting diode) dot matrix display screen |
| CN102682673A (en) * | 2011-09-30 | 2012-09-19 | 杨东佐 | LED (Light Emitting Diode) dot matrix display screen and combined dot matrix display screen |
| CN102848526A (en) * | 2012-09-18 | 2013-01-02 | 福建省石狮市通达电器有限公司 | Injection mold capable of reducing cost of IML (in-mold labeling) product |
| CN102931295A (en) * | 2012-01-17 | 2013-02-13 | 深圳市斯迈得光电子有限公司 | Light-emitting diode (LED) packaging die |
| CN105261583A (en) * | 2015-11-03 | 2016-01-20 | 江苏海天微电子科技有限公司 | Electronic device removing tool |
| CN112923248A (en) * | 2021-02-26 | 2021-06-08 | 同辉电子科技股份有限公司 | COB light source of even light-emitting |
| CN113644186A (en) * | 2021-07-14 | 2021-11-12 | 深圳市定千亿电子有限公司 | Packaging structure of flip LED chip |
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2010
- 2010-07-07 CN CN2010202623220U patent/CN201741711U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102682672A (en) * | 2011-09-30 | 2012-09-19 | 杨东佐 | LED (light-emitting diode) dot matrix display screen |
| CN102682673A (en) * | 2011-09-30 | 2012-09-19 | 杨东佐 | LED (Light Emitting Diode) dot matrix display screen and combined dot matrix display screen |
| CN102931295A (en) * | 2012-01-17 | 2013-02-13 | 深圳市斯迈得光电子有限公司 | Light-emitting diode (LED) packaging die |
| CN102848526A (en) * | 2012-09-18 | 2013-01-02 | 福建省石狮市通达电器有限公司 | Injection mold capable of reducing cost of IML (in-mold labeling) product |
| CN105261583A (en) * | 2015-11-03 | 2016-01-20 | 江苏海天微电子科技有限公司 | Electronic device removing tool |
| CN105261583B (en) * | 2015-11-03 | 2018-11-13 | 江苏海天微电子科技有限公司 | A kind of electronic device pickup tooling |
| CN112923248A (en) * | 2021-02-26 | 2021-06-08 | 同辉电子科技股份有限公司 | COB light source of even light-emitting |
| CN112923248B (en) * | 2021-02-26 | 2022-12-23 | 同辉电子科技股份有限公司 | COB light source of even light-emitting |
| CN113644186A (en) * | 2021-07-14 | 2021-11-12 | 深圳市定千亿电子有限公司 | Packaging structure of flip LED chip |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110209 Termination date: 20130707 |