CN104882439B - LED component - Google Patents
LED component Download PDFInfo
- Publication number
- CN104882439B CN104882439B CN201510150524.3A CN201510150524A CN104882439B CN 104882439 B CN104882439 B CN 104882439B CN 201510150524 A CN201510150524 A CN 201510150524A CN 104882439 B CN104882439 B CN 104882439B
- Authority
- CN
- China
- Prior art keywords
- die bond
- bond slot
- glue groove
- substrate
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of LED components, the LED component includes at least one LED chip and the high heat conduction efficiency substrate at least one LED chip to be arranged, it is characterized in that, the molding substrate is the component at least one die bond slot and the encapsulation glue groove for being accommodated in the inner at least one described die bond slot, and the bottom of the encapsulation glue groove is arranged at least one described die bond slot in a manner of by making the substrate deformation, at least one described LED chip is separately positioned at least one described die bond slot.Die bond slot array of the invention is arranged as circular array according to the symmetrical form of circle, converges light using the symmetrical circular array structure of circle, improves the light emission rate of LED chip, the light of outgoing is made more evenly to become clear.
Description
The present invention be original applying number be 201210372516.X, original application date is September in 2012 29, original name is
The divisional application of LED COB packaged light source.
Technical field
The present invention relates to LED technology, in particular to a kind of LED component.
Background technique
In LED application field, LED module is because of its super brightness, the features such as low-power consumption, long service life, simple installation,
It is widely used in the places such as advertising lamp box, mark signboard, publicity Warning Mark.With gradualling mature for LED module technology,
Application range will more extensively.
Most Chang Shiyong's is exactly COB encapsulation in LED module.In existing COB encapsulation, LED chip is typically intensive
It arranges, the spacing between LED chip is at 0.5~0.8 millimeter.In the case where LED chip is in individual slots, LED chip it
Between distance can reach 2.0 millimeters or so.Due to LED chip be all it is densely arranged in one plane, from the side of LED chip
It projects a large amount of light and is radiated at the adjacent side LED first, be blocked so as to cause light.Therefore, current LED COB encapsulation
All there is the problems such as light efficiency is low, and heat-conductive characteristic is bad in mould group.
Therefore, the needs to a kind of LED COB encapsulation that can be improved light efficiency and heat-conductive characteristic exist in the prior art.
Summary of the invention
According to the present invention, a kind of LED COB packaged light source is provided, can be improved light efficiency, and improve heat-conductive characteristic.
According to an embodiment of the invention, providing a kind of LED COB packaged light source, including substrate, die bond slot array and LED
Chip, which is characterized in that the die bond slot array is located in substrate, is arranged in each die bond slot of the die bond slot array
LED chip.
The LED COB packaged light source further comprises encapsulation glue groove and flexible circuit board, wherein the encapsulation glue groove is set
It sets in the upper surface of the substrate, the die bond slot array is located at the bottom of the encapsulation glue groove, and the flexible circuit board is solid
It is scheduled on the bottom of the encapsulation glue groove, and has opening with exposure at position corresponding with die bond slot in the flexible circuit
The LED chip in die bond slot, the LED chip are electrically connected with flexible circuit board by gold thread out.
Wherein, the spacing between the adjacent die bond slot in the die bond slot array is 1.5~2mm.
Wherein, the die bond slot array is irregular array.
Wherein, the die bond slot array is circular array.
Wherein, the die bond slot array is Polygonal arrays.
Wherein, the encapsulation glue groove is circular trough.
Wherein, the slope of the side wall of the encapsulation glue groove is 45~60 degree.
Wherein, 1~4 LED chip is provided in each die bond slot.
Wherein, it is filled with packaging plastic, in the encapsulation glue groove to encapsulate the flexible circuit board, gold thread and LED chip.
Wherein, the thickness 1.5-3.0mm of the substrate, material are aluminium alloy or copper alloy.
As seen from the above technical solution, in LED COB packaged light source of the invention, since LED chip is all that setting exists
In die bond slot 14 rather than simply densely arranged, a large amount of light released from the side of LED chip will not be blocked, but
It goes out to enter in packaging plastic from the slant reflection of LED chip, light carries out diffusing reflection in packaging plastic, and encounters encapsulation glue groove
Skew back face after can be reflected.Therefore, all go out to the maximum extent from the front of LED chip from the light that LED chip issues
It penetrates, greatly improves the light extraction efficiency of LED chip.Moreover, because substrate 10 of the invention is using high heat conduction efficiency
Substrate, such as the substrate of aluminium alloy or copper alloy profile, therefore LED COB packaged light source of the invention has good heat transfer
Performance.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described.It should be evident that the attached drawing in being described below is only this
Some embodiments of invention illustrated embodiment can also obtain according to these attached drawings for those of ordinary skills
Other embodiments and its attached drawing.
Fig. 1 a is the top view of the LED COB packaged light source in the embodiment of the present invention；
Fig. 1 b is schematic cross-section of the LED COB packaged light source in the embodiment of the present invention along A-A；
Fig. 2 is the part section enlarged diagram of the LED COB packaged light source in the embodiment of the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, right hereinafter, referring to the drawings and the embodiments,
The present invention is further described.
The LED COB packaged light source of embodiment according to the present invention, multiple LED chips are not set up directly in substrate
On same plane, but in the different die bond slots being disposed on the substrate.Firstly, the setting encapsulation glue groove on substrate, then exists
It encapsulates and chip groove, that is, die bond slot is set in glue groove.The packaging plastic trench bottom of substrate is provided with ultrathin flexible circuit board, and
There is opening to expose chip groove in the corresponding position of each chip groove.LED chip is fixed on chip by adhesive
In groove.Preferably, adhesive can be dedicated crystal-bonding adhesive.The bottom surface of each chip groove can in same level,
It can not also be in same level.In this way, the light normal transmission issued from LED chip front goes out when LED chip shines
It goes, then the side wall reflection through chip groove can also launch the light issued from side later, rather than shine directly into phase
Adjacent LED chip and be blocked.
Fig. 1 a and 1b show the structure of LED COB packaged light source according to an embodiment of the invention.Such as Fig. 1 a and
Shown in Fig. 1 b, LED COB packaged light source includes substrate 10, encapsulates glue groove 12, die bond slot 14, flexible circuit board 16 and LED chip
18.Substrate 10 is metal substrate.In order to obtain very high heat conduction efficiency, substrate 10 uses aluminium alloy or Copper alloy material,
For example, aluminium alloy can be the aluminium alloy of 6063,5050 etc. 5 series or 6 series, copper alloy can be fine copper T series or nothing
Oxygen copper TU series.The thickness H of substrate 10 is 1.5-3.0mm, it is preferable that substrate 10 is 1.6mm or 2.0mm.Encapsulation glue groove 12 is set
It sets in the upper surface of substrate 10, is a circular groove, and its axial slices is inverted trapezoidal.Encapsulate the slope of the side wall of glue groove 12
It is 45~60 degree, it is therefore preferable to 60 degree.The depth for encapsulating glue groove 12 is 0.6~1.2.Die bond slot 14 is located at the bottom of encapsulation glue groove 12
Portion.The general value of spacing between adjacent die bond slot is in 1.5~2mm.If the area for encapsulating glue groove 12 is small, and require
Spacing of the 18 power height of LED chip then between adjacent die bond slot 14 takes smaller value；If it is required that 18 power of LED chip it is smaller,
The area for encapsulating glue groove 12 is larger, and the spacing of adjacent die bond slot 14 just takes the larger value.Preferably, the depth of each die bond slot 14
Degree is the same.Alternatively, the depth of each die bond slot 14 can also be different.The shape for encapsulating glue groove 12 is generally come
Say that requirement is consistent with the spread geometry of die bond slot 14.For example, if die bond slot 14 is arranged according to the symmetrical circular array of circle
(as shown in Figure 1), then encapsulating glue groove 12 is circular groove；If die bond slot 14 is arranged according to rectangular array, packaging plastic
Slot 12 is rectangle.Preferably, die bond slot array is the regular arrays such as circle.Optionally, die bond slot array can be polygon battle array
Column.Optionally, die bond slot array can be the array of irregular shape.Flexible circuit board 16 passes through adhesive bonding to packaging plastic
Above the bottom of slot 12.Adhesive can be the anti-aging adhesive of high temperature resistant, and flexible circuit board 16 can be transparent flexible electrical
Road plate.Flexible circuit board 16 is ultrathin circuit board, with a thickness of 0.125~0.254 millimeter.It is provided with out on flexible circuit board 16
Mouthful, to expose die bond slot 14.
LED chip 18 is arranged in die bond slot 14.Preferably, a LED chip 18 is provided in each die bond slot 14.
Optionally, 2~4 LED chips 18 also can be set in a die bond slot 14.LED chip 18 is fixed to die bond by dispensing
In slot 14.Each LED chip 18 is connected to flexible circuit board 16 through gold thread.Specifically, one end of gold thread is welded to flexible electrical
On road plate 16, the other end is welded to LED chip 18.
Encapsulation glue groove 12 in be also filled with encapsulation mucilage binding glue be filled up completely full encapsulation glue groove 12, with fix LED chip 18,
Flexible circuit board 16.
Fig. 2 shows the partial cutaway views of LED COB packaged light source according to an embodiment of the present invention.As shown in Fig. 2, LED
Chip 18 is fixed on 14 bottom of die bond slot, and encapsulation 12 bottom of glue groove is equipped with flexible circuit board 16, and flexible circuit board 16 is provided with out
Mouth is to expose LED chip 18.Packaging plastic is directed through from the light of 18 front outgoing of LED chip to launch outward；From LED chip
The light of 18 sides outgoing is irradiated on the side wall of die bond slot 14 first and reflects away, into packaging plastic.Light is encapsulating
Diffusing reflection is carried out in glue, the back reflection being finally irradiated on the side wall of sealing groove 12 and the front outgoing from LED chip 18.
The manufacturing process of LED COB packaged light source of the invention is described below.
There is provided thickness H first is the metal substrate of 1.5~3.0mm as substrate 10.The die bond slot made as needed
Arrangement mode, encapsulation glue groove 14 is produced on surface on the substrate 10.The arrangement of die bond slot can be processed by using numerically-controlled machine tool
Or press machine tool machine-shaping is completed.According to the arrangement mode of required die bond slot, using high-speed machine tool in packaging plastic
Die bond slot array, such as circular array disposably are formed on the bottom surface of slot 12.Next, using adhesive by flexible circuit board
16 are adhered on the bottom surface of encapsulation glue groove 14, and correspond at each 14 position of die bond slot in flexible circuit board 16 and be cut into
Opening, to expose die bond slot 14.Then, LED chip 18 is fixed in die bond slot 14 by dispensing, and by welding gold thread
To LED chip 18 and flexible circuit board 16, so that LED chip 18 and flexible circuit board 16 are electrically connected.Then, using packaging plastic
Encapsulation glue groove 12 is filled.Since glue is initially semi-fluid condition, in the case where substrate 10 is laid flat, make glue
Not from encapsulation glue groove outflow, encapsulation glue groove will be filled and led up automatically before glue curing.
In the present invention, since LED chip is all that setting is simply densely arranged in die bond slot 14, from LED core
A large amount of light that the side of piece releases will not be blocked, but go out to enter in packaging plastic from the slant reflection of LED chip, light
Line carries out diffusing reflection in packaging plastic, and can be reflected after encountering the skew back face of encapsulation glue groove.Therefore, from LED chip
The light of sending all to the maximum extent from the front outgoing of LED chip, greatly improves the light extraction efficiency of LED chip.Moreover, by
In substrate 10 of the invention using the substrate of high heat conduction efficiency, such as the substrate of aluminium alloy or copper alloy profile, therefore
LED COB packaged light source of the invention has good heat-conductive characteristic.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the scope of the present invention.It is all
Within the spirit and principles in the present invention, made any modification, equivalent replacement and improvement etc. should be included in guarantor of the invention
Within the scope of shield.
Claims (7)
1. a kind of LED component, the LED component includes that multiple LED chips and the high fever for the multiple LED chip to be arranged pass
Lead efficiency substrate, it is characterised in that:
The molding substrate is the component with multiple die bond slots and the encapsulation glue groove for being accommodated in the inner the multiple die bond slot, and
And the bottom of the encapsulation glue groove is arranged in the multiple die bond slot in a manner of by making the substrate deformation；
The multiple LED chip is separately positioned in the multiple die bond slot；And
The multiple die bond slot is arranged in circular array, and the depth of each in the multiple die bond slot according to the symmetrical mode of circle
It is not identical；
Wherein the size of the power of the LED chip of the size and requirement of the spacing between the adjacent die bond slot is set in inverse correlation
It sets.
2. LED component as described in claim 1, which is characterized in that be provided with flexible circuit board with packaging plastic trench bottom is stated, institute
It states flexible circuit board and is equipped with opening in the corresponding position of each die bond slot with the exposure die bond slot.
3. LED component as described in claim 1, which is characterized in that the encapsulation glue groove was formed with the multiple die bond slot
The shape of array is consistent.
4. the LED component as described in one of claim 1 to 2, which is characterized in that the encapsulation glue groove and the multiple die bond slot
It include inclined side wall.
5. LED component as claimed in claim 4, which is characterized in that the slope of the wall of the encapsulation glue groove is 45-60 degree,
The depth of the encapsulation glue groove is 0.6-1.2mm.
6. the LED component as described in one of claim 1 to 2, which is characterized in that the substrate is aluminium alloy or copper alloy profile
Substrate, and the substrate with a thickness of 1.5-3.Omm.
7. the LED component as described in one of claim 1 to 2, which is characterized in that packaging plastic is filled in the encapsulation glue groove,
The packaging plastic fills and leads up the encapsulation glue groove in the case where the substrate is laid flat and before glue curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510150524.3A CN104882439B (en) | 2012-09-29 | 2012-09-29 | LED component |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510150524.3A CN104882439B (en) | 2012-09-29 | 2012-09-29 | LED component |
| CN201210372516.XA CN102881685B (en) | 2012-09-29 | 2012-09-29 | Light-emitting diode (LED) chip on board (COB) packaging light source |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210372516.XA Division CN102881685B (en) | 2012-09-29 | 2012-09-29 | Light-emitting diode (LED) chip on board (COB) packaging light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104882439A CN104882439A (en) | 2015-09-02 |
| CN104882439B true CN104882439B (en) | 2019-01-15 |
Family
ID=47482959
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210372516.XA Expired - Fee Related CN102881685B (en) | 2012-09-29 | 2012-09-29 | Light-emitting diode (LED) chip on board (COB) packaging light source |
| CN201510150524.3A Active CN104882439B (en) | 2012-09-29 | 2012-09-29 | LED component |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210372516.XA Expired - Fee Related CN102881685B (en) | 2012-09-29 | 2012-09-29 | Light-emitting diode (LED) chip on board (COB) packaging light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN102881685B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI535066B (en) * | 2012-11-30 | 2016-05-21 | 聯京光電股份有限公司 | Led packaging construction and manufacturing method thereof |
| KR102221599B1 (en) * | 2014-06-18 | 2021-03-02 | 엘지이노텍 주식회사 | Light Emitting Device Package |
| CN105655327A (en) * | 2016-03-16 | 2016-06-08 | 广东华辉煌光电科技有限公司 | Structure substrate of COB light source modules with flip LED chips |
| CN107346801A (en) * | 2016-05-06 | 2017-11-14 | 中国科学院苏州纳米技术与纳米仿生研究所 | LED integrated encapsulation structures and its method for packing |
| CN107180824A (en) * | 2017-04-21 | 2017-09-19 | 蒋雪娇 | The optimized packaging structure and light fixture of light emitting diode |
| CN107958948A (en) * | 2017-12-28 | 2018-04-24 | 广东晶科电子股份有限公司 | A kind of LED light emitting diodes and preparation method thereof |
| CN110533008A (en) * | 2019-09-18 | 2019-12-03 | 上海菲戈恩微电子科技有限公司 | Optical bio identifies mould group and preparation method, display device and electronic equipment |
| CN113224219B (en) * | 2021-05-10 | 2021-11-16 | 珠海市宏科光电子有限公司 | Full-color-matching COB light source and manufacturing method thereof |
| CN115274639B (en) * | 2022-08-17 | 2023-04-07 | 珠海市宏科光电子有限公司 | Dimming and color-mixing integrated COB light source and processing technology thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254907A (en) * | 2010-09-29 | 2011-11-23 | 深圳市聚飞光电股份有限公司 | LED (light-emitting diode) and packaging method thereof |
| CN102306699A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Integrated light-emitting diode (LED) packaging structure |
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| CN202373623U (en) * | 2011-11-04 | 2012-08-08 | 深圳市瑞丰光电子股份有限公司 | Light emitting diode (LED) support and LED module group |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4922555B2 (en) * | 2004-09-24 | 2012-04-25 | スタンレー電気株式会社 | LED device |
| DE602006014604D1 (en) * | 2006-12-12 | 2010-07-08 | Inverto Nv | LED ILLUMINATION WITH CONTINUOUS AND ADJUSTABLE COLOR TEMPERATURE (CT) WITH MAINTAINING A HIGH CRI |
| CN101656251B (en) * | 2009-06-22 | 2012-01-25 | 李建营 | Method for lowering light attenuation of light emitting diode |
| KR101039994B1 (en) * | 2010-05-24 | 2011-06-09 | 엘지이노텍 주식회사 | Light emitting device and light unit having thereof |
| CN202816941U (en) * | 2012-09-29 | 2013-03-20 | 四川新力光源股份有限公司 | LED COB package light source |
-
2012
- 2012-09-29 CN CN201210372516.XA patent/CN102881685B/en not_active Expired - Fee Related
- 2012-09-29 CN CN201510150524.3A patent/CN104882439B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254907A (en) * | 2010-09-29 | 2011-11-23 | 深圳市聚飞光电股份有限公司 | LED (light-emitting diode) and packaging method thereof |
| CN102306699A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Integrated light-emitting diode (LED) packaging structure |
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| CN202373623U (en) * | 2011-11-04 | 2012-08-08 | 深圳市瑞丰光电子股份有限公司 | Light emitting diode (LED) support and LED module group |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102881685B (en) | 2015-05-06 |
| CN104882439A (en) | 2015-09-02 |
| CN102881685A (en) | 2013-01-16 |
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