CN102881685A - Light-emitting diode (LED) chip on board (COB) packaging light source - Google Patents
Light-emitting diode (LED) chip on board (COB) packaging light source Download PDFInfo
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- CN102881685A CN102881685A CN201210372516XA CN201210372516A CN102881685A CN 102881685 A CN102881685 A CN 102881685A CN 201210372516X A CN201210372516X A CN 201210372516XA CN 201210372516 A CN201210372516 A CN 201210372516A CN 102881685 A CN102881685 A CN 102881685A
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- Prior art keywords
- groove
- led
- die bond
- light source
- array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a light-emitting diode (LED) chip on board (COB) packaging light source. The LED COB packaging light source comprises a substrate, a solid crystal groove array, LED chips, a packaging adhesive groove and a flexible circuit board, wherein the solid crystal groove array is positioned in the substrate; the LED chips are arranged in solid crystal grooves in the solid crystal groove array; the packaging adhesive groove is formed in the upper surface of the substrate; the solid crystal groove array is positioned at the bottom of the packaging adhesive groove; the flexible circuit board is fixed at the bottom of the packaging adhesive groove; openings are formed in the flexible circuit board corresponding to the solid crystal grooves to expose the LED chips in the solid crystal grooves; and the LED chips are electrically connected with the flexible circuit board through gold wires. The LED chips are not directly densely arranged but arranged in different solid crystal grooves, light emitted from the front sides of the LED chips is normally emitted, and light emitted from the sides of the LED chips is emitted after irradiating the sides of the solid crystal grooves, and is further reflected through the side wall of the packaging adhesive groove, so that a light effect can be improved.
Description
Technical field
The present invention relates to the LED technology, particularly a kind of LED COB packaged light source.
Background technology
In the LED application, the LED module is because of its super brightness, and the characteristics such as low-power consumption, long service life, simple installation are widely used in the places such as advertising lamp box, sign signboard, publicity Warning Mark.Along with the gradually maturation of LED module technology, its range of application will be more extensive.
Chang Shiyong's is exactly the COB encapsulation in the LED module.In existing COB encapsulation, led chip generally all is densely arranged, and the spacing between the led chip is at 0.5 ~ 0.8 millimeter.Be arranged at led chip in the situation of individual slots, the distance between the led chip can reach 2.0 millimeter.Because led chip all is in one plane densely arranged, penetrates a large amount of light from the side of led chip and at first is radiated at adjacent LED side, thereby cause light to be blocked.The problems such as therefore, present LED COB encapsulation module all exists light efficiency low, and heat-conductive characteristic is bad.
Therefore, there are the needs that can improve the LED COB encapsulation of light efficiency and heat-conductive characteristic to a kind of in the prior art.
Summary of the invention
According to the present invention, a kind of LED COB packaged light source is provided, can improve light efficiency, and improve heat-conductive characteristic.
According to embodiments of the invention, a kind of LED COB packaged light source is provided, comprise substrate, die bond groove array and led chip, it is characterized in that described die bond groove array is arranged in substrate, in each die bond groove of described die bond groove array, led chip is set.
Described LED COB packaged light source further comprises packaging plastic groove and flexible PCB, wherein, described packaging plastic groove is arranged in the upper surface of described substrate, described die bond groove array is positioned at the bottom of described packaging plastic groove, described flexible PCB is fixed on the bottom of described packaging plastic groove, and have opening to expose the led chip in the die bond groove with the corresponding position of die bond groove in described flexible circuit, described led chip and flexible PCB are electrically connected by gold thread.
Wherein, the spacing between the adjacent die bond groove in the described die bond groove array is 1.5 ~ 2mm.
Wherein, described die bond groove array is irregular array.
Wherein, described die bond groove array is circular array.
Wherein, described die bond groove array is the polygon array.
Wherein, described packaging plastic groove is circular recess.
Wherein, the slope of the sidewall of described packaging plastic groove is 45 ~ 60 degree.
Wherein, be provided with 1 ~ 4 led chip in each die bond groove.
Wherein, in described packaging plastic groove, be filled with packaging plastic, to encapsulate described flexible PCB, gold thread and led chip.
Wherein, the thickness 1.5-3.0mm of described substrate, material is aluminium alloy or copper alloy.
As seen from the above technical solution, in LED COB packaged light source of the present invention, because led chip all is arranged in the die bond groove 14 rather than is densely arranged simply, a large amount of light of emitting from the side of led chip will can not be blocked, enter the packaging plastic but reflect away from the inclined-plane of led chip, light carries out diffuse reflection in packaging plastic, and can be reflected away after running into the skew back face of packaging plastic groove.Therefore, the light that sends from led chip has promoted the light extraction efficiency of led chip greatly all to greatest extent from the positive outgoing of led chip.And because substrate of the present invention 10 employings is the substrate of high heat conduction efficiency, for example substrate of aluminium alloy or copper alloy section bar, so LED COB packaged light source of the present invention has good heat-conductive characteristic.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art.Apparently, the accompanying drawing in below describing only is some embodiments of the present invention, for those of ordinary skills, can also obtain according to these accompanying drawing illustrated embodiments other embodiment and accompanying drawing thereof.
Fig. 1 a is the vertical view of the LED COB packaged light source in the embodiment of the invention;
Fig. 1 b is that LED COB packaged light source in the embodiment of the invention is along the schematic cross-section of A-A;
Fig. 2 is the part section enlarged diagram of the LED COB packaged light source in the embodiment of the invention.
Embodiment
For making purpose of the present invention, technical scheme and advantage clearer, referring to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
LED COB packaged light source according to an embodiment of the invention, a plurality of led chips are not on the same plane that is set directly in the substrate, and are arranged in the different die bond groove on the substrate.At first, at substrate the packaging plastic groove is set, then the chip groove is set in the packaging plastic groove is the die bond groove.Packaging plastic trench bottom at substrate is provided with the ultrathin flexible circuit board, and opening is arranged to expose the chip groove in the corresponding position of each chip groove.Led chip is fixed in the chip groove by adhesive.Preferably, adhesive can be special-purpose crystal-bonding adhesive.The bottom surface of each chip groove can be on the same level face, also can be not on the same level face.Like this, when led chip is luminous, often launch from the light positive that send in the led chip front, the light that sends from the side then also can be launched after the sidewall reflects of chip groove, rather than shines directly into adjacent led chip and be blocked.
Fig. 1 a and 1b show the structure of LED COB packaged light source according to an embodiment of the invention.Shown in Fig. 1 a and Fig. 1 b, LED COB packaged light source comprises substrate 10, packaging plastic groove 12, die bond groove 14, flexible PCB 16 and led chip 18.Substrate 10 is metal substrate.In order to obtain very high heat conduction efficiency, substrate 10 uses aluminium alloy or copper alloy materials, and for example, aluminium alloy can be the aluminium alloy of 5 series such as 6063,5050 or 6 series, and copper alloy can be fine copper T series or oxygen-free copper TU series.The thickness H of substrate 10 is 1.5-3.0mm, and preferably, substrate 10 is 1.6mm or 2.0mm.Packaging plastic groove 12 is arranged on the upper surface of substrate 10, be a circular groove, and its axial slices is inverted trapezoidal.The slope of the sidewall of packaging plastic groove 12 is 45 ~ 60 degree, is preferably 60 degree.The degree of depth of packaging plastic groove 12 is 0.6 ~ 1.2.Die bond groove 14 is positioned at the bottom of packaging plastic groove 12.The general value of spacing between the adjacent die bond groove is at 1.5 ~ 2mm.If the area of packaging plastic groove 12 is little, and the led chip 18 power height that require then the spacing between the adjacent die bond groove 14 get smaller value; If led chip 18 power that require are less, the large then spacing of adjacent die bond groove 14 of the area of packaging plastic groove 12 is just got higher value.Preferably, the degree of depth of each die bond groove 14 is the same.As selection, the degree of depth of each die bond groove 14 also can be different.In general the shape of packaging plastic groove 12 requires consistent with the spread geometry of die bond groove 14.For example, if die bond groove 14 is arranged (as shown in Figure 1) according to the symmetrical circular array of circle, then packaging plastic groove 12 is circular groove; If die bond groove 14 arranges that according to rectangular array then packaging plastic groove 12 is rectangle.Preferably, die bond groove array is the regular arrays such as circle.Alternatively, die bond groove array can be the polygon array.Alternatively, die bond groove array can be erose array.Flexible PCB 16 is adhered to above the bottom of packaging plastic groove 12 by adhesive.Adhesive can be high temperature resistant anti-aging adhesive, and flexible PCB 16 can be transparent flexible PCB.Flexible PCB 16 is ultrathin circuit board, and its thickness is 0.125 ~ 0.254 millimeter.Be provided with opening on the flexible PCB 16, to expose die bond groove 14.
Led chip 18 is arranged in the die bond groove 14.Preferably, be provided with a led chip 18 in each die bond groove 14.Alternatively, also can be provided with 2 ~ 4 led chips 18 in a die bond groove 14.Led chip 18 is fixed in the die bond groove 14 by a glue.Each led chip 18 is connected to flexible PCB 16 through gold thread.Particularly, an end of gold thread is welded on the flexible PCB 16, and the other end is welded to led chip 18.
In packaging plastic groove 12, also be filled with encapsulation mucilage binding glue and fill full packaging plastic groove 12 fully, with fixed L ED chip 18, flexible PCB 16.
Fig. 2 shows the part sectioned view according to the LED COB packaged light source of the embodiment of the invention.As shown in Figure 2, led chip 18 is fixed on die bond groove 14 bottoms, and packaging plastic groove 12 bottoms are provided with flexible PCB 16, and flexible PCB 16 is provided with opening to expose led chip 18.Directly outwards launch through packaging plastic from the light of led chip 18 positive outgoing; At first shine on the sidewall of die bond groove 14 from the light of led chip 18 side outgoing and reflect away, enter in the packaging plastic.Light carries out diffuse reflection in packaging plastic, shine at last on the sidewall of sealing groove 12 after reflection and from the positive outgoing of led chip 18.
The manufacturing process of LED COB packaged light source of the present invention is described below.
It is that the metal substrate of 1.5 ~ 3.0mm is as substrate 10 that thickness H at first is provided.The arrangement mode of the die bond groove of making is as required produced packaging plastic groove 14 at substrate 10 upper surfaces.The arrangement of die bond groove can be by finishing with Digit Control Machine Tool processing or press machine tool machine-shaping.According to the arrangement mode of desired die bond groove, use high-speed machine tool on the bottom surface of packaging plastic groove 12, once to form to property die bond groove array, for example circular array.Next, use adhesive that flexible PCB 16 is adhered on the bottom surface of packaging plastic groove 14, and cut out opening at flexible PCB 16 corresponding to each die bond groove 14 position, to expose die bond groove 14.Then, led chip 18 is fixed in the die bond groove 14 by a glue, and by gold thread being welded to led chip 18 and flexible PCB 16, so that led chip 18 and flexible PCB 16 electrical connections.Then, use packaging plastic that packaging plastic groove 12 is filled.Because it is semi-fluid condition that glue begins, therefore in the situation that substrate 10 keeps flat, glue is not gone out from the packaging plastic concentrated flow, before glue curing, will automatically fill and lead up the packaging plastic groove.
Among the present invention, because led chip all is arranged in the die bond groove 14 rather than is densely arranged simply, a large amount of light of emitting from the side of led chip will can not be blocked, enter the packaging plastic but reflect away from the inclined-plane of led chip, light carries out diffuse reflection in packaging plastic, and can be reflected away after running into the skew back face of packaging plastic groove.Therefore, the light that sends from led chip has promoted the light extraction efficiency of led chip greatly all to greatest extent from the positive outgoing of led chip.And because substrate of the present invention 10 employings is the substrate of high heat conduction efficiency, for example substrate of aluminium alloy or copper alloy section bar, so LED COB packaged light source of the present invention has good heat-conductive characteristic.
The above is preferred embodiment of the present invention only, is not for limiting protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of doing, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (11)
1. a LED COB packaged light source comprises substrate, die bond groove array and led chip, it is characterized in that, described die bond groove array is arranged in substrate, in each die bond groove of described die bond groove array led chip is set.
2. LED COB packaged light source as claimed in claim 1 further comprises packaging plastic groove and flexible PCB, wherein,
Described packaging plastic groove is arranged in the upper surface of described substrate, described die bond groove array is positioned at the bottom of described packaging plastic groove, described flexible PCB is fixed on the bottom of described packaging plastic groove, and have opening to expose the led chip in the die bond groove with the corresponding position of die bond groove in described flexible circuit, described led chip and flexible PCB are electrically connected by gold thread.
3. LED COB packaged light source as claimed in claim 2, wherein, the spacing between the adjacent die bond groove in the described die bond groove array is 1.5 ~ 2mm.
4. LED COB packaged light source as claimed in claim 3, wherein, described die bond groove array irregular array.
5. LED COB packaged light source as claimed in claim 3, wherein, described die bond groove array is circular array.
6. LED COB packaged light source as claimed in claim 3, wherein, described die bond groove array is the polygon array.
7. LED COB packaged light source as claimed in claim 5, wherein, described packaging plastic groove is circular recess.
8. LED COB packaged light source as claimed in claim 2, wherein, the slope of the sidewall of described packaging plastic groove is 45 ~ 60 degree.
9. LED COB packaged light source as claimed in claim 2 wherein, is provided with 1 to 4 led chip in each die bond groove.
10. LED COB packaged light source as claimed in claim 2 wherein, is filled with packaging plastic, to encapsulate described flexible PCB, gold thread and led chip in described packaging plastic groove.
11. LED COB packaged light source as claimed in claim 2, wherein, the thickness 1.5-3.0mm of described substrate, material is aluminium alloy or copper alloy.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510150524.3A CN104882439B (en) | 2012-09-29 | 2012-09-29 | LED component |
| CN201210372516.XA CN102881685B (en) | 2012-09-29 | 2012-09-29 | Light-emitting diode (LED) chip on board (COB) packaging light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210372516.XA CN102881685B (en) | 2012-09-29 | 2012-09-29 | Light-emitting diode (LED) chip on board (COB) packaging light source |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510150524.3A Division CN104882439B (en) | 2012-09-29 | 2012-09-29 | LED component |
Publications (2)
| Publication Number | Publication Date |
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| CN102881685A true CN102881685A (en) | 2013-01-16 |
| CN102881685B CN102881685B (en) | 2015-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210372516.XA Expired - Fee Related CN102881685B (en) | 2012-09-29 | 2012-09-29 | Light-emitting diode (LED) chip on board (COB) packaging light source |
| CN201510150524.3A Active CN104882439B (en) | 2012-09-29 | 2012-09-29 | LED component |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510150524.3A Active CN104882439B (en) | 2012-09-29 | 2012-09-29 | LED component |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855272A (en) * | 2012-11-30 | 2014-06-11 | 联京光电股份有限公司 | Light emitting diode packaging structure and related manufacturing method |
| CN105655327A (en) * | 2016-03-16 | 2016-06-08 | 广东华辉煌光电科技有限公司 | Structure substrate of COB light source modules with flip LED chips |
| CN106471631A (en) * | 2014-06-18 | 2017-03-01 | Lg伊诺特有限公司 | Light emitting device package |
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
| CN115274639A (en) * | 2022-08-17 | 2022-11-01 | 珠海市宏科光电子有限公司 | Dimming and color mixing integrated COB light source and processing technology thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107346801A (en) * | 2016-05-06 | 2017-11-14 | 中国科学院苏州纳米技术与纳米仿生研究所 | LED integrated encapsulation structures and its method for packing |
| CN107180824A (en) * | 2017-04-21 | 2017-09-19 | 蒋雪娇 | The optimized packaging structure and light fixture of light emitting diode |
| CN107958948A (en) * | 2017-12-28 | 2018-04-24 | 广东晶科电子股份有限公司 | A kind of LED light emitting diodes and preparation method thereof |
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- 2012-09-29 CN CN201210372516.XA patent/CN102881685B/en not_active Expired - Fee Related
- 2012-09-29 CN CN201510150524.3A patent/CN104882439B/en active Active
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| CN1753200A (en) * | 2004-09-24 | 2006-03-29 | 斯坦雷电气株式会社 | Light emitting diode device |
| US20100001648A1 (en) * | 2006-12-12 | 2010-01-07 | Inverto Nv | Led lighting that has continuous and adjustable color temperature (ct), while maintaining a high cri |
| CN102263098A (en) * | 2010-05-24 | 2011-11-30 | Lg伊诺特有限公司 | Light emitting device and light unit having the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103855272A (en) * | 2012-11-30 | 2014-06-11 | 联京光电股份有限公司 | Light emitting diode packaging structure and related manufacturing method |
| CN103855272B (en) * | 2012-11-30 | 2017-03-01 | 联京光电股份有限公司 | Light emitting diode packaging structure and related manufacturing method |
| CN106471631A (en) * | 2014-06-18 | 2017-03-01 | Lg伊诺特有限公司 | Light emitting device package |
| CN106471631B (en) * | 2014-06-18 | 2018-12-18 | Lg伊诺特有限公司 | Light emitting device package |
| US10396247B2 (en) | 2014-06-18 | 2019-08-27 | Lg Innotek Co., Ltd. | Light-emitting device package |
| CN105655327A (en) * | 2016-03-16 | 2016-06-08 | 广东华辉煌光电科技有限公司 | Structure substrate of COB light source modules with flip LED chips |
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
| CN115274639A (en) * | 2022-08-17 | 2022-11-01 | 珠海市宏科光电子有限公司 | Dimming and color mixing integrated COB light source and processing technology thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104882439B (en) | 2019-01-15 |
| CN104882439A (en) | 2015-09-02 |
| CN102881685B (en) | 2015-05-06 |
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