JP2008235719A - Illumination apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination apparatus which can be easily manufactured and have a structure in which the leakage of a sealing resin for sealing a semiconductor light-emitting element and the mixing of bubbles into the sealing resin can be easily suppressed in manufacturing. <P>SOLUTION: The illumination apparatus 1 is provided with a printed wiring board 2, a plurality of LEDs (semiconductor light-emitting devices) 11, a frame member 15, an adhesive member 21 and a light-transmissive sealing resin 25. A plurality of juxtaposed conductor patterns 7 owned by the printed wiring board 2 are formed of a wiring pattern 8 and a power feeding pattern 9. The power feeding pattern is formed of a land pattern portion 9a, and a connection pattern portion 9b having a width smaller than the width of the pattern portion 9a. The LEDs 11 are electrically connected to the wiring pattern 8 and mounted to the wiring board 2. The frame member 15 for accommodating the LEDs 11 is disposed on the wiring board 2 across the connection patterns 9b. The adhesive member 21 is formed by impregnating a thermosetting adhesive resin on a frame-like material. The adhesive member 21 is provided between the frame member 15 and the printed wiring board 2 and then bonded. The sealing resin 25 is filled in the frame member 15 to seal all the LEDs 11. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a lighting device using a semiconductor light emitting element such as a plurality of LED (light emitting diode) chips as a light source.

  Conventionally, a plurality of LEDs are fixed to predetermined positions on a wiring pattern formed on the surface of a printed circuit board by soldering or the like, and a reflection frame made of a resin with high reflectivity is attached to the periphery of the printed circuit board. There is known a light emitting display in which a diffusion sheet for diffusing LED light is attached to the upper surface of a frame to suppress variation in luminance (see, for example, Patent Document 1).

  Each LED of the light emitting display has a pair of opposing lead terminals, an LED element attached to the tip of one of these terminals, and the tip of this element and the other lead terminal. A metal wire that connects the two and the tip of the lead terminal including the LED element is molded with a translucent resin.

In addition, a plurality of LED chips are mounted on the conductor layer formed on the surface of the printed circuit board in a predetermined pattern, and a cover member that forms a cavity for storing each of the plurality of LED chips is attached to the surface of the printed circuit board. A technique is known in which a light-transmitting resin for sealing an LED chip is molded in each cavity (for example, see Patent Document 2).
JP-A-7-283440 (paragraphs 0011-0015, FIG. 2) Japanese Patent No. 3329573 (paragraph 0004, FIG. 5)

  In the technique of Patent Document 1, in order to supply power to the plurality of LEDs in the reflection frame, the end of the wiring pattern to which an external power supply is connected must be arranged outside the reflection frame. The portion of the wiring pattern on the side connected to the external power supply is formed with a relatively wide width in order to ensure the reliability of the solder connection with the external lead wire leading to the external power supply.

  Since the configuration in which the wiring pattern is provided only on the surface of the printed circuit board as in Patent Document 1 does not require a device for passing a part of the wiring pattern through the inside of the printed circuit board and escaping the wiring pattern with respect to the reflection frame, There is an advantage that the configuration of the printed wiring board is simple. However, it is inevitable that a part of the reflection frame is arranged so as to cross a portion of the wiring pattern on the side connected to the external power source. Therefore, a gap corresponding to the thickness of the wiring pattern is formed between the frame portion that crosses the wiring pattern and the printed board.

  If the sealing technique of Patent Document 2 is applied to the light-emitting display of Patent Document 1, the inside of the reflective frame is filled with a sealing resin so that all LEDs can be sealed at one time, so that individual LEDs are sealed. This is preferable in that it does not require labor and is easy to manufacture. However, in this application, the filled uncured sealing resin leaks out of the reflection frame through the gap between the printed circuit board and the portion (frame portion) that crosses the wiring pattern of the reflection frame as described above. There is a possibility that this needs to be resolved.

  By the way, although not described in Patent Documents 1 and 2, since an adhesive is generally used to attach the reflection frame to the printed wiring board, it is conceivable that the gap is eliminated by this adhesive.

  Therefore, the present inventor applies a liquid adhesive to the reflective frame, and heats and cures the adhesive in a state where the reflective frame is pressed against the printed wiring board, thereby bonding the reflective frame to the printed wiring board. Tried. However, in this measure, it is difficult to manage the amount of adhesive applied, and workability is poor. Therefore, the present inventor has tried to fix the reflective frame to the printed wiring board by using a thermosetting adhesive member having a frame shape similar to that of the reflective frame. As a result, it was found that management of the coating amount is unnecessary and workability can be improved.

  However, it has been difficult to sufficiently close the gap between the frame portion that crosses the wiring pattern of the reflective frame and the printed wiring board. That is, according to the inventor's analysis, the adhesive member cannot sufficiently enter the corner formed by the surface of the printed wiring board and the side surface of the continuous wiring pattern standing on the surface, It was found that a minute space that communicates the inside and outside of the reflective frame may be formed at the corner.

  Thereby, it is difficult to sufficiently suppress the leakage of the uncured sealing resin, and when the filled uncured sealing resin is heat-cured, the air in the space enters the reflection frame. It sometimes flows out and remains as bubbles in the sealing resin. The bubbles remaining in the sealing resin in this way may cause a decrease in the withstand voltage when moisture enters the sealing resin.

  An object of the present invention is to provide an illuminating device that is easy to manufacture and that can easily suppress leakage of a sealing resin that seals a semiconductor light emitting element and entry of bubbles into the sealing resin. .

  According to the first aspect of the present invention, a plurality of conductor patterns each including a wiring pattern and a power supply pattern are arranged in parallel, and the power supply pattern has a land pattern portion and a width narrower than a width of the pattern portion in the land pattern portion. A printed wiring board formed integrally with a connection pattern portion; a plurality of semiconductor light emitting elements electrically connected to the wiring pattern and mounted on the printed wiring board; and having a frame shape A frame member disposed on the printed wiring board across the connection pattern portion and containing the semiconductor light-emitting elements inside; and a frame-shaped base material impregnated with a thermosetting adhesive resin. An adhesive member provided between the frame member and the printed wiring board and bonded thereto; and a thermosetting material that is filled in the frame member and seals the semiconductor light emitting elements. It is provided with; and sexual translucent sealing resin.

  In the invention according to claim 1, the printed wiring board includes a printed circuit board provided with a conductor pattern portion. This printed circuit board may be one in which a plurality of conductor patterns are arranged in parallel on the surface of a substrate portion composed of a single layer of synthetic resin plate or a plurality of laminated synthetic resin plates, and also the heat dissipation of the semiconductor light emitting device. In order to improve, it may be a printed circuit board in which a plurality of conductor patterns are arranged in parallel on the surface of a substrate part formed by laminating a synthetic resin plate on the surface of a metal plate such as Cu or Al. Furthermore, in the latter printed circuit board, the metal plate has a plurality of convex portions penetrating the synthetic resin plate, and a semiconductor light emitting element is bonded onto these convex portions to further improve the heat dissipation from these elements. A printed circuit board with a different configuration can be used. In the first aspect of the present invention, the conductor pattern is made of a conductive metal material such as Cu, or a conductor pattern in which a surface metal layer such as Al, Ni, Ag, Au is preferably deposited or plated on the surface of Cu. Good.

  In the first aspect of the invention, the land pattern portion of the conductor pattern refers to a portion where an external electric wire is connected thereto by soldering or the like. The width of the land pattern portion is preferably set to 1.0 mm or more in order to obtain reliability of connection with an external electric wire by solder connection or the like. In the present invention, the connection pattern portion of the conductor pattern is integrated with the land pattern portion, and at least points to a portion where the frame member crosses, and may include a portion protruding inside the frame member. . Although this connection pattern part and the site | part protruded inside a frame member are integral, these may be the same width | variety or a different width | variety. The position of the connection pattern portion with respect to the land pattern portion in the width direction of the conductor pattern is shifted evenly at the position where the connection pattern portion is integrally continuous with the center portion in the width direction of the land pattern portion or in the width direction of the land pattern portion. The connection pattern part may be a position where the connection pattern part is continuous.

  In the invention of claim 1, for example, an LED (light emitting diode) chip can be suitably used as the semiconductor light emitting element. The semiconductor light emitting element can be mounted on the printed wiring board by mounting the semiconductor light emitting element on the wiring pattern by a flip chip method or by bonding the semiconductor light emitting element on the printed wiring board and using a bonding wire. It may be a mounting method in which it is electrically connected to. In the latter case, a semiconductor light-emitting element is bonded onto a printed wiring board using a die bond material, and this element and a wiring pattern adjacent to both sides thereof are electrically connected with bonding wires, respectively. Alternatively, it may be a single wire type mounting method in which a semiconductor light emitting element is bonded onto a wiring pattern, and the element and a wiring pattern adjacent thereto are electrically connected by a bonding wire.

  In the invention of claim 1, the frame member may or may not have a reflecting surface on the inner surface, and the frame member having the reflecting surface on the inner surface also serves as a reflector. The reflective surface in the case of serving also as a reflector can be provided by making the reflective layer or the frame member itself white. The reflective layer can be formed of a vapor-deposited layer or a plating layer of a metal material having a high reflectance such as Al or Ni, or can be formed of a coating film of white paint. In order to make the frame member itself that also serves as a reflector white, white powder may be mixed into the resin material for molding the frame member. As the white powder, white fillers such as aluminum oxide, titanium oxide, magnesium oxide, and barium sulfate are used. Can be used.

  In the invention of claim 1, the base material of the adhesive member is made of a thin fiber material such as paper or cloth, and the adhesive resin impregnated therein is made of a thermosetting resin such as a silicone resin. Although it is desirable to mix white powder into the adhesive resin, it is not limited thereto. The thickness of the adhesive member is larger than the thickness of the conductor pattern, for example, 0.1 mm to 0.2 mm, and the width of each part of the adhesive member is preferably slightly larger than the width of each part of the frame member.

  In the invention of claim 1, a light-transmitting material such as a transparent epoxy resin or a transparent silicone resin can be used as the sealing resin. Although not essential, the sealing resin can be mixed with a phosphor that emits light of different colors by converting the wavelength of part of the emission color emitted from each sealed semiconductor light emitting element.

  In the invention of claim 1, all the semiconductor light emitting elements mounted on the printed wiring board can be sealed at once by filling a sealing resin in a frame member bonded to the printed wiring board. Since the adhesive member for adhering the frame member to the plate is formed by impregnating the base material with an adhesive resin, it is not necessary to manage the amount of adhesive applied. Therefore, the labor required for manufacturing the lighting device is reduced.

  In this manufacturing, the adhesive member sandwiched between the printed wiring board and the frame member is cured by being heated while being pressed against the printed wiring board through the frame member, and the frame member is attached to the printed wiring board. Glue. In this case, even when the arrangement pitch along the arrangement direction of the plurality of conductor patterns is made as narrow as possible, the width of the connection pattern portion of each power feeding pattern crossed by the frame member is the width of the land pattern portion of the power feeding pattern. Since it is narrower, the interval between adjacent connection pattern portions can be increased. As a result, the adhesive member easily enters between adjacent connection pattern portions with the pressing, and the adhesive member softens at the beginning when heated, so that the adhesive member enters the corners between the connection pattern portions. Can be made. In other words, the corner formed by the side surface of the continuous connection pattern portion and the printed wiring board so as to stand up with respect to the printed wiring board is filled with the adhesive member, and a minute space that communicates the inside and outside of the frame member is formed at this corner. It can be prevented. In addition, since the width of the connection pattern portion of the power supply pattern is wider than the width of the land pattern portion of each power supply pattern, the connection area with the external electric wire connected to the land pattern portion is large, and the connection stability of the external electric wire to it is increased. It can be secured.

  According to a second aspect of the present invention, the width of the connection pattern portion of each conductor pattern is 0.1 mm to less than 1.0 mm, and the interval between the connection pattern portions arranged side by side is 0.2 mm or more.

  By setting the width of the connection pattern portion according to the present invention, the interval between the connection pattern portions adjacent to each other in the direction in which the nuclear conductor patterns are arranged can be widened to 0.2 mm or more. For the reason already described in the invention of claim 1, In addition to the fact that the sealing resin for sealing the semiconductor light-emitting element can be filled at once and management of the amount of adhesive for bonding the frame member to the printed wiring board can be made unnecessary, the side surface of the connection pattern portion and the printed wiring board It is possible to prevent a minute space communicating between the inside and the outside of the frame member from being formed at the corner formed by.

  In a third aspect of the invention, the thickness of each conductor pattern is 20 μm or less.

  By setting the thickness of each conductor pattern according to the present invention, the adhesive member that softens with heating can easily enter through the corners between the connection pattern portions. Therefore, the frame is formed at the corner formed by the side surface of the connection pattern portion and the printed wiring board. It is possible to prevent a minute space communicating between the inside and outside of the member from being formed.

  According to a fourth aspect of the present invention, an angle formed by the inner surface of the frame portion that crosses each connection pattern portion of the frame member and the printed wiring board is covered with an adhesive, and the adhesive is covered with the sealing resin. Yes.

  In the invention of claim 4, the adhesive is provided before the sealing resin is filled, and may be an adhesive provided separately from the adhesive member or an adhesive integral with the adhesive member. Good.

  In the invention of claim 4, it is possible to seal along the frame portion of the frame member that crosses each connection pattern portion by the adhesive that covers the corner formed by the inner surface of the frame portion of the frame member and the printed wiring board. . Thereby, even if a minute space is formed at the corner formed by the side surface of the connection pattern portion and the printed wiring board, the space can be sealed so as not to communicate with the inside of the frame member.

  According to the first to third aspects of the present invention, since the filling of the sealing resin for sealing the semiconductor light emitting element is completed at once, it is not necessary to manage the application amount of the adhesive for bonding the frame member to the printed wiring board. In addition to being easy to manufacture, it is possible to prevent the formation of a minute space that connects the inside and outside of the frame member at the corner formed by the connection pattern portion and the printed wiring board. It is possible to provide an illuminating device having a configuration that easily suppresses the mixing of bubbles.

  According to the invention of claim 4, not only the manufacture is easy, but even if a minute space is formed at an angle formed by the connection pattern portion and the printed wiring board, the space does not communicate with the inside of the frame member. Therefore, it is possible to provide an illumination device having a configuration in which leakage of the sealing resin and mixing of bubbles into the sealing resin can be more easily suppressed.

  An embodiment of the present invention will be described with reference to FIGS.

  Reference numeral 1 in each figure denotes an illumination device that forms an LED package. As shown in FIG. 1 and the like, the illumination device 1 includes a printed wiring board 2, a plurality of semiconductor light emitting elements such as LED chips (hereinafter abbreviated as LEDs) 11, a frame member such as a frame-shaped reflector 15, and an adhesive member. 21 and the sealing resin 25.

  The printed wiring board 2 functions as an apparatus substrate, and is formed by providing a conductor pattern 7 on the surface of the printed substrate 3.

  As shown in FIGS. 2 and 3, the printed circuit board 3 includes a substrate portion 6 formed by laminating a synthetic resin plate 5 that is a white insulating material on the surface of a metal plate 4 such as Cu (copper). . The thickness of the substrate part 6 is 0.5 mm, for example. In order to obtain a light emitting area required for the lighting device 1, the substrate unit 6 has a predetermined shape, for example, each shape, specifically a rectangular shape.

  The conductor patterns 7 are arranged on the surface of the substrate part 6 in parallel in a direction orthogonal to the longitudinal direction of the substrate part 6 at regular intervals, for example, 3.0 mm. Each conductor pattern 7 includes a wiring pattern 8 and a pair of power supply patterns 9. Each of the wiring pattern 8 and the power supply pattern 9 is formed by laminating an Ag (gold) layer on the surface of Cu (copper) by plating or the like. The thickness t (see FIG. 3) of the conductor pattern 7 is set to 20 μm or less, for example, 14 μm.

  As shown in FIG. 1, the wiring patterns 8 are arranged in the longitudinal direction of the substrate portion 6 at a constant interval, for example, 3.0 mm. The pair of power supply patterns 9 are provided at both ends in the longitudinal direction of the substrate portion 6 so as to be continuous with both ends of the row formed by the wiring patterns 8. In this way, the power supply patterns 9 arranged at both ends in the longitudinal direction of the substrate unit 6 are arranged at regular intervals, for example, 3.0 mm intervals in a direction orthogonal to the longitudinal direction of the substrate unit 6.

  The power feeding pattern 9 has a land pattern portion 9a and a connection pattern portion 9b integrated therewith. The land pattern portion 9a is a portion to which an unillustrated external electric wire connected to an external power source is connected by soldering or the like, and the power supply pattern 9 is electrically connected to an external power source (not shown) via the external electric wire. Connected. The width of the land pattern portion 9a is, for example, 1.0 mm.

  The connection pattern portion 9 b extends from the land pattern portion 9 a so as to protrude toward the wiring pattern 8. The width of the connection pattern portion 9b is narrower than that of the land pattern portion 9a, and the width is set to 0.1 mm to less than 0.1 mm, specifically 0.5 mm. In the case of the present embodiment, the width of the connection pattern portion 9b is the wiring pattern 8 because the portion of the connection pattern portion 9b is formed on the opposite side of the land pattern portion 9a to a length that can also serve as the wiring pattern 8. Is the same as the width of Further, the interval P (see FIG. 3) between the connection pattern portions 9b of the conductor patterns 7 arranged in parallel in the direction orthogonal to the longitudinal direction of the substrate portion 6 is 0.2 mm or more, for example, 2.5 mm.

  Each LED 11 employs a double-wire type using, for example, a nitride semiconductor. These LEDs 11 are formed by laminating a semiconductor light emitting layer on one surface of a translucent element substrate made of, for example, sapphire. The semiconductor light emitting layer emits blue light, for example. Each LED 11 is mounted between the wiring patterns 8 adjacent to each other in the longitudinal direction of the substrate part 6 and between the wiring pattern 8 located at the end and the connection pattern part 9b adjacent thereto. In this mounting, the other surface of the element substrate that is parallel to the one surface and on which the semiconductor light emitting layer is not laminated is bonded to the surface of the synthetic resin plate 5 of the substrate portion 6 using a light-transmitting die bond material (not shown). It is made in.

  The mounted LED 11 is connected to the wiring pattern 8 and the connection pattern portion 9b, which are adjacent to the LED 11 in the longitudinal direction of the substrate portion 6, by bonding wires 12 (see FIG. 1). Therefore, the plurality of LEDs 11 that are mounted at intervals in the longitudinal direction of the substrate unit 6 are connected in series, and are supplied with power through a pair of power supply patterns 9.

  The reflector 15 that functions as a frame member is not provided for each LED 11 or for each of the plurality of LEDs 11, but is a single one that surrounds all the LEDs 11 on the printed wiring board 2. For example, as shown in FIG. It has a rectangular frame shape. The reflector 15 is formed of a synthetic resin mixed with a white filler made of magnesium oxide or the like in order to obtain reflection performance on the inner surface. The thickness of the reflector 15 is 1.0 mm, for example.

  The reflector 15 overlaps the pair of frame portions 16 parallel to each other on the side edges extending in the longitudinal direction of the substrate portion 6, and the other pair of frame portions 17 parallel to each other cross the connection pattern portion 9b to form the substrate. The printed circuit board 2 is adhered to the surface of the printed wiring board 2 so as to overlap the end portion of the portion 6 in the longitudinal direction. Therefore, as shown in FIG. 1, the frame portion 17 crosses the power supply patterns 9 arranged in a direction orthogonal to the longitudinal direction of the substrate portion 6 in plan view. It is arranged so as to cover the connection pattern portion 9b.

  As shown in FIGS. 2 and 3, an adhesive member 21 is provided between the reflector 15 and the surface of the printed wiring board 2 in order to bond the reflector 15. The adhesive member 21 is formed by impregnating a base material having the same shape as the reflector 15 into a thermosetting adhesive resin, for example, a silicone resin. The thickness of the adhesive member 21 is larger than the thickness of the conductor pattern 7 and smaller than the thickness of the reflector 15, specifically 0.15 mm. The width of the adhesive member 21 is substantially the same as the width of the frame portions 16 and 17 of the reflector 15. In the case of the present embodiment as one form thereof, the inner diameter (vertical and horizontal dimensions between the inner edges parallel to each other) is slightly smaller than the inner diameter of the reflector 15 (vertical and horizontal dimensions between the inner surfaces parallel to each other). The diameter (vertical and horizontal dimensions between outer edges parallel to each other) is slightly smaller than the outer diameter of the reflector 15 (vertical and horizontal dimensions between outer surfaces parallel to each other).

  Adhesion of the reflector 15 to the printed wiring board 2 using the adhesive member 21 is performed in the following procedure. The adhesive member 21 is bonded and held in advance on the surface of the reflector 15 facing the printed wiring board 2. Then, by arranging the reflector 15 at a predetermined position on the printed wiring board 2 where the LEDs 11 have already been die-bonded, the adhesive member 21 is also bonded to the surface of the printed wiring board 2. In this state, the reflector 15 is passed through a heating furnace (not shown) while being pressed against the printed wiring board 2, whereby the adhesive member 21 is cured and the bonding of the reflector 15 to the printed wiring board 2 is completed.

  Along with the adhesion in such a procedure, an adhesive 22 comprising a protruding portion into the reflector 15 is provided as shown in FIGS. 1 and 3 due to the difference in the inner diameter and the deformation of the adhesive member 21 accompanying the pressing. In FIG. 3, the adhesive 22 is exaggerated. The adhesive 22 covers at least the angle formed by the inner surface 17a of the frame portion 17 and the surface 2a of the printed wiring board 2 that cross the connection pattern portion 9b. The adhesive 22 covering this corner extends continuously in the direction in which the frame portion 17 extends along the inner surface 17a of the frame portion 17 without interruption. The fact that the adhesive 22 is integrated with the adhesive member 21 is preferable in terms of manufacturing because it does not require labor for providing the adhesive 22 at the corner.

  The protruding dimension B (see FIG. 2) of the adhesive 22 from the inner surface 17a of the frame portion 17 is 0.2 mm or less. This dimensional regulation is preferable in the following points. That is, even if the adhesive 22 is slightly colored in a color other than white instead of white, and the adhesive 22 may become a light absorber, the absorption area is kept to a minimum, and the lighting device 1 The reduction in the light extraction efficiency can be suppressed. At the same time, when wire bonding is performed after the reflector 15 is bonded to the printed wiring board 2, the bonding tool can be prevented from being stained with the adhesive 22.

  The sealing resin 25 is filled in the reflector 15 and seals all the LEDs 11, the bonding wires 12, and the like housed in the reflector 15. Further, the sealing resin 25 also covers the adhesive 22. The sealing resin 25 is made of a translucent resin such as a thermosetting silicone resin. The sealing resin 25 is cured by being heated in a heating furnace after being filled in the reflector 15.

  The sealing resin 25 is mixed with a phosphor (not shown) preferably in a uniformly dispersed state. The phosphor emits light of a different color by absorbing a part of the emission color emitted from each LED 11 and converting the wavelength, thereby defining the color of the illumination light emitted from the illumination device 1 It is. In the present embodiment, in order to change the illumination light emitted from the illumination device 1 to white light, a phosphor that emits yellow light that is complementary to the blue color emitted by each LED 11 is used.

  The lighting device 1 having the above configuration seals all the LEDs 11 and the bonding wires 12 mounted on the printed wiring board 2 at a time by filling the reflector 15 bonded to the printed wiring board 2 with the sealing resin 25. it can. Further, since the adhesive member 21 that adheres the reflector 15 to the printed wiring board 2 before the sealing is formed by impregnating the base material with an adhesive resin, it is not necessary to manage the amount of adhesive applied. Therefore, the labor required for manufacturing the lighting device 1 having the above-described configuration is reduced, and the lighting device 1 can be manufactured at a low cost. Further, in the illumination device 1 having the above-described configuration, the width of the land pattern portion 9a of each power feeding pattern 9 is wider than the width of the connection pattern portion 9b, so that the connection area with the external electric wire connected to the land pattern portion 9a is wide. As a result, the connection stability with the external electric wire can be secured.

  The reflector 15 is bonded to the printed wiring board 2 in the manufacture of the illumination device 1 in a state where the adhesive member 21 is sandwiched between the printed wiring board 2 and the reflector 15 and the reflector 15 is pressed against the printed wiring board 2. It is carried out by heating the adhesive member 21 in a heating furnace and curing it.

  By the way, the width of the connection pattern portion 9 b of each power feeding pattern 9 across which the frame portion 17 of the reflector 15 crosses is narrower than the width of the land pattern portion 9 a of the power feeding pattern 9. Thereby, the space | interval P of the connection pattern parts 9b adjacent to the direction where the frame part 17 is extended can be ensured widely. This can be realized even when the arrangement pitch between the plurality of conductor patterns 7 is as narrow as possible.

  Therefore, the adhesive member 21 is easily deformed and enters between the connection pattern portions 9b adjacent to each other in the extending direction of the frame portion 17 with the pressing of the reflector 15 at the time of bonding. In this case, in particular, since the width of each connection pattern portion 9b is 0.5 mm and the interval between the connection pattern portions 9b is 2.5 mm, the adhesive member 21 can be more easily inserted between the connection pattern portions 9b. Can do.

  Moreover, since the adhesive member 21 is softened when heated in the heating furnace, the adhesive member 21 can easily enter the corners between the connection pattern portions 9b adjacent to each other in the direction in which the frame portion 17 extends. In this case, since the thickness of each conductor pattern 7 including the connection pattern portion 9b is reduced to 14 μm and the surface of the printed wiring board 2 is smoothed as much as possible, the corners between the connection pattern portions 9b are further improved. The adhesive member 21 can easily enter.

  Thereby, the adhesive member 21 fills an angle C (see FIG. 3) between the side surface of the continuous connection pattern portion 9 b and the surface 2 a of the printed wiring board 2 so as to stand up with respect to the surface 2 a of the printed wiring board 2. Thus, it is possible to prevent the corner C from forming a minute space that communicates the inside and outside of the reflector 15. In addition, since the corner C is covered with the adhesive 22 embedded in the sealing resin 25, even if a minute space is formed in the corner C, the space does not communicate with the inside of the reflector 15. Can be sealed reliably.

  Therefore, when the uncured sealing resin 25 is filled in the reflector 15 and cured by heating, the uncured sealing resin 25 injected into the reflector 15 leaks out of the reflector 15 through the corner C. Is suppressed. Accordingly, the sealing resin 25 is not wasted, and a predetermined amount of the sealing resin 25 can be filled and cured. Along with this, as the uncured sealing resin 25 is heated and cured, it is possible to suppress the air staying at the corner C from flowing into the reflector 15 and remaining as bubbles in the sealing resin 25. Therefore, the insulating performance of the sealing resin 25 can be prevented from being deteriorated by bubbles.

The top view shown in the state which partly cut away the illuminating device which concerns on one Embodiment of this invention. Sectional drawing shown along the arrow F2-F2 line | wire in FIG. Sectional drawing shown along the arrow F3-F3 line | wire in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Illuminating device, 2 ... Printed wiring board, 2a ... The surface of a printed wiring board, 3 ... Printed circuit board, 6 ... Board | substrate part, 7 ... Conductor pattern, 8 ... Wiring pattern, 9 ... Power feeding pattern, 9a ... Land pattern part, 9b: Connection pattern part, 11 ... LED (semiconductor conductor light emitting element), 12 ... Bonding wire, 15 ... Reflector (frame member), 17 ... Frame part, 17a ... Inner surface of the frame part, 21 ... Adhesive member, 22 ... Adhesive 25 ... sealing member, C ... corner

Claims (4)

A plurality of conductor patterns composed of a wiring pattern and a power supply pattern are arranged in parallel, and the power supply pattern is a land pattern part and a connection pattern integrally connected to the land pattern part with a width narrower than the width of the pattern part. A printed wiring board formed with a portion;
A plurality of semiconductor light emitting devices electrically connected to the wiring pattern and mounted on the printed wiring board;
A frame member that has a frame shape and that houses each of the semiconductor light emitting elements therein and that is disposed on the printed wiring board across the connection pattern portions;
An adhesive member formed by impregnating a frame-shaped base material with a thermosetting adhesive resin, provided between the frame member and the printed wiring board, and bonding them;
A thermosetting translucent sealing resin filled in the frame member and sealing the semiconductor light emitting elements;
An illumination device comprising:   2. The illumination according to claim 1, wherein the width of the connection pattern portion of each conductor pattern is 0.1 mm to less than 1.0 mm, and the interval between the connection pattern portions arranged side by side is 0.2 mm or more. apparatus.   The lighting device according to claim 1, wherein the thickness of each conductor pattern is 20 μm or less.   The corner formed by the inner surface of the frame portion crossing each connection pattern portion of the frame member and the printed wiring board is covered with an adhesive, and the adhesive is covered with the sealing resin. The lighting device according to any one of 1 to 3.

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