CN103542310A - Manufacturing method of light bar - Google Patents
Manufacturing method of light bar Download PDFInfo
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- CN103542310A CN103542310A CN201210241118.4A CN201210241118A CN103542310A CN 103542310 A CN103542310 A CN 103542310A CN 201210241118 A CN201210241118 A CN 201210241118A CN 103542310 A CN103542310 A CN 103542310A
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- insulating barrier
- plain conductor
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- lamp bar
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Abstract
The invention provides a manufacturing method of a light bar. The manufacturing method of the light bar includes the steps that a flexible flat cable is provided, wherein the flexible flat cable comprises a metal wire and an insulating layer coating the metal wire, the insulating layer is provided with a plurality of openings, the openings are arranged at intervals in the length direction of the insulating layer, the metal wire is provided with a plurality of mounting parts, and the mounting parts are arranged corresponding to the openings; a plurality of LED chips are arranged on the mounting parts; the manufacturing procedure of routing is conducted on the LED chips; the manufacturing procedure of packaging is conducted on the LED chips. The LED chips are directly arranged on the mounting parts of the flexible flat cable, then the manufacturing procedure of routing and the manufacturing procedure of packaging are directly conducted on the flexible flat cable, and thus a light bar structure which is provided with the LED chips can be achieved. Due to the fact that there is no need for power supply contact points of LED components to be welded and fixed on conducting points of the flexible flat cable, the manufacturing procedure of welding is removed, production yield is improved, and cost is saved.
Description
Technical field
The present invention relates to a kind of manufacture method of lamp bar, relate in particular to a kind of manufacture method that reduces manufacturing cost and promote the lamp bar of producing yield.
Background technology
Surging along with environmental consciousness now, having power saving is applied in the every electronic product in life gradually with the light emitting diode (LED) that meets environmental requirement, commodity such as Christmas lights, flashlight, signalling light for vehicle, traffic sign, mobile phone and display, and the trend of future development is also to utilize light emitting diode to carry out the close conventional bulb of alternative functions gradually.
The essential structure of general light-emitting diode component, conducting end and a supporting part that is provided with opposed polarity in the inside of a transparent insulator, its supporting part place is installed with a chip, the outer fluorescent material that is arranged with of its chip, separately be provided with gold thread and form the electrode layer of chip and being connected of conducting end, and each conducting end extend transparent insulation external body and become power supply contact.Under the energization action of conducting end, the light source that its chip produces, when through fluorescent material, is combined into the visible ray of expection with the wavelength of fluorescent material.
The lamp bar structure that is provided with light emitting diode that is applied to now illumination is mostly directly weldingly fixed on light-emitting diode component on printed circuit board (PCB) (PCB) or flexible circuit board (FPC), yet, use the cost of printed circuit board (PCB) or flexible circuit board higher, be unfavorable for market competition.Therefore there is again dealer to develop light-emitting diode component is directly fixedly welded on to flexible flat cable (FFC) above, so as to reducing the production cost of lamp bar.Yet, the flexible flat cable that this kind is provided with light-emitting diode component when making often because the power supply contact of light-emitting diode component and flexible flat cable connect a little between produce failure welding and make to produce yield decline, so cause the problem of manufacturing cost increase.
Summary of the invention
Therefore the object of the present invention is to provide a kind of manufacture method of lamp bar, can solve existing lamp bar structure and easily because of light-emitting diode component failure welding, make to produce yield decline, and the problem that causes manufacturing cost to increase.
For achieving the above object, the invention provides a kind of manufacture method of lamp bar, comprising:
One flexible flat cable is provided, described flexible flat cable comprises an insulating barrier of a plain conductor and coated this plain conductor, this insulating barrier is provided with several openings, those openings arrange along the length direction interval of this insulating barrier, this plain conductor is provided with several installation portions, and those installation portions arrange corresponding to those openings;
Several light-emitting diode chip for backlight unit are set on described installation portion;
Described light-emitting diode chip for backlight unit is carried out to a routing processing procedure; And
Described light-emitting diode chip for backlight unit is carried out to an encapsulation procedure.
The step of described flexible flat cable comprises:
One first insulating barrier is provided, and the first insulating barrier is provided with those openings, and described opening arranges along the length direction interval of this first insulating barrier;
Described plain conductor is set on this first insulating barrier, this plain conductor arranges corresponding to those openings;
This plain conductor is carried out to a cut-out processing procedure, so that form those installation portions on this plain conductor; And
One second insulating barrier is set on this plain conductor, this plain conductor is coated between described the second insulating barrier and this first insulating barrier.
Described in each, installation portion comprises a front contact, connects one of this front contact and plant crystalline region and a back contact, and this is planted between crystalline region and this back contact and is provided with a point of cut-off, and this front contact, this plants crystalline region and this back contact exposes to this insulating barrier via this opening.
Also be included in and arrange before the step of described light-emitting diode chip for backlight unit on those installation portions, several Lamp cups are set on this insulating barrier and corresponding to those opening settings.
It is ultrasonic vibration processing method that the method for described Lamp cup on this insulating barrier is set.
It is viscose glue fixation that the method for described Lamp cup on this insulating barrier is set.
Provide the step of described the first insulating barrier to be included in this first insulating barrier and be provided with several another openings, those another openings arrange along the length direction interval of this first insulating barrier, and those another openings and those openings are the setting that is arranged in parallel.
The step of described plain conductor on this first insulating barrier is set and comprises and another plain conductor is set on this first insulating barrier, this another plain conductor arranges corresponding to those another openings, and this another plain conductor and this plain conductor are the setting that is arranged in parallel.
Arrange in the step of described the second insulating barrier on this plain conductor and be included in and this second insulating barrier be set on this another plain conductor, this another plain conductor is coated between this second insulating barrier and this first insulating barrier.
Also be included in more described light-emitting diode chip for backlight unit is carried out after the step of this encapsulation procedure, this first insulating barrier and this second insulating barrier are carried out to a cutting processing procedure, thereby form two lamp bars so that this another plain conductor is located away to this plain conductor.
Beneficial effect of the present invention: the manufacture method of lamp bar provided by the present invention, light-emitting diode chip for backlight unit is directly arranged on the installation portion of flexible flat cable, then directly on flexible flat cable, directly carry out routing and encapsulation procedure, so can complete the lamp bar structure that is provided with light-emitting diode chip for backlight unit.The present invention compares with existing processing procedure owing to not needing that the power supply contact of light-emitting diode component is fixedly welded on to connecting a little on flexible flat cable, therefore so saved welding processing procedure, can solve the problem that production yield that the failure welding of prior art causes declines and increases with manufacturing cost.
For feature of the present invention and technology contents can also further be understood, refer to following detailed description and accompanying drawing about this, yet accompanying drawing only provides reference and explanation use, is not used for the present invention to be limited.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is the schematic perspective view of lamp bar of the present invention.
Fig. 2 is the decomposing schematic representation of the lamp bar of Fig. 1.
The processing procedure generalized section of the manufacture method of the lamp bar that Fig. 3 A to Fig. 3 H is Fig. 1.
Fig. 4 is the steps flow chart block diagram of manufacture method of the lamp bar of Fig. 1.
Fig. 5 is the steps flow chart block diagram of another embodiment of manufacture method of the lamp bar of Fig. 1.
Fig. 6 is the schematic perspective view of another lamp bar of the present invention.
Fig. 7 is the decomposing schematic representation of another lamp bar of Fig. 6.
The specific embodiment
Technological means and the effect thereof for further setting forth the present invention, taked, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 1, 2 and 3H, lamp bar 1 provided by the present invention, its structure mainly includes flexible flat cable 2, several Lamp cups 3, several light-emitting diode chip for backlight unit 4 and several encapsulating material 5, wherein flexible flat cable 2 comprises an insulating barrier 22 of a strip metal wire 21 and clad metal wire 21, this insulating barrier 22 comprises the first insulating barrier 221 and the second insulating barrier 222 being oppositely arranged up and down, the first insulating barrier 221 is provided with several openings 220, those openings 220 arrange along the length direction interval of the first insulating barrier 221, this plain conductor 21 is provided with several installation portions 210, those installation portions 210 arrange corresponding to those openings 220, each installation portion 210 comprises a front contact 211, connect one of front contact 211 and plant crystalline region 212 and a back contact 213, plant and between crystalline region 212 and back contact 213, be provided with a point of cut-off 214 and form and separate, front contact 211, plant crystalline region 212 and back contact 213 exposes to insulating barrier 22 via opening 220.
Please refer to Fig. 3 A to 3H and 4, the manufacture method of lamp bar 1 comprises the following steps:
Step (61): one first insulating barrier 221 is provided, this first insulating barrier 221 is provided with several openings 220, those openings 220 arrange along the length direction interval of the first insulating barrier 221, and wherein several openings 220 are to form by the first insulating barrier 221 is carried out to a punching processing procedure;
Step (62) a: plain conductor 21 is set on the first insulating barrier 221, this plain conductor 21 arranges corresponding to those openings 220;
Step (63): plain conductor 21 is carried out to a cut-out processing procedure, so that form several installation portions 210 on plain conductor 21, each installation portion 210 comprises front contact 211, connect front contact 211 plant crystalline region 212 and back contact 213, plant and between crystalline region 212 and back contact 213, be provided with a point of cut-off 214;
Step (64): one second insulating barrier 222 is set on plain conductor 21, so that plain conductor 21 is coated between the second insulating barrier 222 and the first insulating barrier 221, wherein front contact 211, plant crystalline region 212 and back contact 213 exposes to insulating barrier 22 via opening 220;
Step (65): several Lamp cups 3 are set and arrange on the first insulating barrier 221 and corresponding to those openings 220;
Step (66): several light-emitting diode chip for backlight unit 4 planting on crystalline region 212 in those installation portions 210 is set;
Step (67): those light-emitting diode chip for backlight unit 4 are carried out to a routing processing procedure, light-emitting diode chip for backlight unit 2 is electrically connected to front contact 211 and back contact 213; And
Step (68): those light-emitting diode chip for backlight unit 4 are carried out to an encapsulation procedure, so that light-emitting diode chip for backlight unit 4 and installation portion 210 are packaged in an encapsulating material 5.
In the present embodiment, step (61) to the main purpose of step (64) is to form a kind of structure that offers the flexible flat cable 2 of light-emitting diode chip for backlight unit 4 settings, therefore step (61) to step (64) can be integrated into step (60), refer to Fig. 5, it is the steps flow chart block diagram of another embodiment of the manufacture method of lamp bar 1 of the present invention, this step (60) provides a flexible flat cable 2, this flexible flat cable 2 comprises an insulating barrier 22 of a strip metal wire 21 and clad metal wire 21, insulating barrier 22 is provided with several openings 220, those openings 220 arrange along the length direction interval of insulating barrier 22, plain conductor 21 is provided with the several installation portions 210 corresponding to those openings 220, each installation portion 210 comprises a front contact 211, connect one of front contact 211 and plant crystalline region 212 and a back contact 213, plant and between crystalline region 212 and back contact 213, be provided with a point of cut-off 214, front contact 211, plant crystalline region 212 and back contact 213 exposes to insulating barrier 22 via opening 220.Be understandable that, the present invention does not limit the special construction that can only the method by step (61) to step (64) just can form the flexible flat cable 2 that step (60) will provide, and other method step also likely forms the structure of the flexible flat cable 2 that step (60) provides.
It is worth mentioning that, the several Lamp cups 3 in lamp bar 1 structure provided by the present invention are not necessary assembly, can select to remove not to be arranged on lamp bar 1.In the present embodiment, select Lamp cup 3 to be set on lamp bar 1, and the method for Lamp cup 3 on insulating barrier 22 is set, include ultrasonic vibration processing method or viscose glue fixation.In addition, plant crystalline region 212 between point of cut-off 214 and front contact 211, be arranged at the side that the light-emitting diode chip for backlight unit 4 of planting on crystalline region 212 is adjacent to point of cut-off 214, and 4 of each light-emitting diode chip for backlight unit are arranged corresponding to each opening 220.
Be understandable that, in the present embodiment, one strip metal wire 21 is only set in flexible flat cable 2 and forms several installation portions 210 after cutting off processing procedure, so be not limited to this, another kind of selection is, also can be at the interior plain conductor 21 arranging more than two of flexible flat cable 2, as shown in Figures 6 and 7, now the manufacture method of lamp bar 1 is equally similar in appearance to aforesaid step, just in step (61), on the first insulating barrier 221, have additional several another openings 220, those another openings 220 arrange along the length direction interval of the first insulating barrier 221, and those another openings 220 are with those openings 220 setting that is arranged in parallel.Another strip metal wire 21 is set in step (62) on the first insulating barrier 221, another plain conductor 21 arranges corresponding to those another openings 220, and another plain conductor 21 is with plain conductor 21 setting that is arranged in parallel.In step (63), another plain conductor 21 is carried out to a cut-out processing procedure, so that form several another installation portions 210 on another plain conductor 21.The second insulating barrier 222 is set in step (64) on another plain conductor 21, so that another plain conductor 21 is coated between the second insulating barrier 222 and the first insulating barrier 221.
In like manner also can know by inference, step (65) in step (68) be also set up several another Lamp cups 3 and several another light-emitting diode chip for backlight unit 4 in step to plant the processing procedures such as crystalline substance, routing and encapsulation, therefore do not repeat them here.Then after completing the step of encapsulation procedure, the first insulating barrier 221 and the second insulating barrier 222 are carried out to a cutting processing procedure, thereby form two lamp bars 1 so that another plain conductor 21 is located away to plain conductor 21.Therefore, when the number of the plain conductor 21 of setting up is more, just can under same process, form more lamp bar 1, so can reduce production time and cost.
In sum, the manufacture method of lamp bar of the present invention, it is directly arranged at light-emitting diode chip for backlight unit on the installation portion of flexible flat cable, then directly on flexible flat cable, directly carries out routing and encapsulation procedure, so can complete the lamp bar structure that is provided with light-emitting diode chip for backlight unit.The present invention compares with existing processing procedure owing to not needing that the power supply contact of light-emitting diode component is fixedly welded on to connecting a little on flexible flat cable, so saved welding processing procedure, therefore can solve the problem that production yield declines and manufacturing cost increases that prior art failure welding causes.
The above, for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme and the technical conceive of invention, and all these changes and distortion all should belong to the protection domain of the claims in the present invention.
Claims (10)
1. a manufacture method for lamp bar, is characterized in that, comprising:
One flexible flat cable is provided, described flexible flat cable comprises an insulating barrier of a plain conductor and coated this plain conductor, this insulating barrier is provided with several openings, those openings arrange along the length direction interval of this insulating barrier, this plain conductor is provided with several installation portions, and those installation portions arrange corresponding to those openings;
Several light-emitting diode chip for backlight unit are set on described installation portion;
Those light-emitting diode chip for backlight unit are carried out to a routing processing procedure; And
Those light-emitting diode chip for backlight unit are carried out to an encapsulation procedure.
2. the manufacture method of lamp bar as claimed in claim 1, is characterized in that, provides the step of described flexible flat cable to comprise:
One first insulating barrier is provided, and described the first insulating barrier is provided with those openings, and those openings arrange along the length direction interval of this first insulating barrier;
Described plain conductor is set on this first insulating barrier, this plain conductor arranges corresponding to those openings;
Described plain conductor is carried out to a cut-out processing procedure, so that form those installation portions on this plain conductor; And
One second insulating barrier is set on described plain conductor, this plain conductor is coated between this second insulating barrier and this first insulating barrier.
3. the manufacture method of lamp bar as claimed in claim 1, it is characterized in that, described in each, installation portion comprises a front contact, connects one of this front contact and plant crystalline region and a back contact, this is planted between crystalline region and this back contact and is provided with a point of cut-off, and this front contact, this plants crystalline region and this back contact exposes to this insulating barrier via this opening.
4. the manufacture method of lamp bar as claimed any one in claims 1 to 3, is characterized in that, is also included in and arranges before the step of described light-emitting diode chip for backlight unit on those installation portions, several Lamp cups is set on this insulating barrier and corresponding to those opening settings.
5. the manufacture method of lamp bar as claimed in claim 4, is characterized in that, it is ultrasonic vibration processing method that the method for described Lamp cup on this insulating barrier is set.
6. the manufacture method of lamp bar as claimed in claim 4, is characterized in that, it is viscose glue fixation that the method for described Lamp cup on this insulating barrier is set.
7. the manufacture method of lamp bar as claimed in claim 2, it is characterized in that, provide the step of described the first insulating barrier to be included in this first insulating barrier and be provided with several another openings, those another openings arrange along the length direction interval of this first insulating barrier, and those another openings and those openings are the setting that is arranged in parallel.
8. the manufacture method of lamp bar as claimed in claim 7, it is characterized in that, the step of described plain conductor on this first insulating barrier is set to be comprised and another plain conductor is set on this first insulating barrier, this another plain conductor arranges corresponding to those another openings, and this another plain conductor and this plain conductor are the setting that is arranged in parallel.
9. the manufacture method of lamp bar as claimed in claim 8, it is characterized in that, arrange in the step of described the second insulating barrier on this plain conductor and be included in and this second insulating barrier be set on this another plain conductor, this another plain conductor is coated between this second insulating barrier and this first insulating barrier.
10. the manufacture method of lamp bar as claimed in claim 9, it is characterized in that, also be included in those light-emitting diode chip for backlight unit are carried out after the step of this encapsulation procedure, this first insulating barrier and this second insulating barrier are carried out to a cutting processing procedure, thereby form two lamp bars so that this another plain conductor is located away to this plain conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210241118.4A CN103542310A (en) | 2012-07-12 | 2012-07-12 | Manufacturing method of light bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210241118.4A CN103542310A (en) | 2012-07-12 | 2012-07-12 | Manufacturing method of light bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103542310A true CN103542310A (en) | 2014-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210241118.4A Pending CN103542310A (en) | 2012-07-12 | 2012-07-12 | Manufacturing method of light bar |
Country Status (1)
| Country | Link |
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| CN (1) | CN103542310A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017081289A1 (en) * | 2015-11-13 | 2017-05-18 | Osram Opto Semiconductors Gmbh | Module for a video wall |
| CN107524941A (en) * | 2017-08-15 | 2017-12-29 | 信利半导体有限公司 | A kind of preparation method of lamp bar |
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| CN1783485A (en) * | 2004-11-04 | 2006-06-07 | 株式会社日立显示器 | Lighting source unit, illuminating apparatus using the same and display apparatus using the same |
| CN201326940Y (en) * | 2008-11-28 | 2009-10-14 | 鹤山丽得电子实业有限公司 | Surface mounted LED flexible neon lamp |
| CN201434352Y (en) * | 2009-05-08 | 2010-03-31 | 琉明斯光电科技股份有限公司 | Light-emitting diode encapsulation structure and light bar applying same |
| CN101769468A (en) * | 2008-12-31 | 2010-07-07 | 佳必琪国际股份有限公司 | Full-covered light-emitting diode light bar and manufacturing method thereof |
| CN102062323A (en) * | 2010-11-05 | 2011-05-18 | 深圳市聚飞光电股份有限公司 | Method for manufacturing LED lamp bar and LED lamp |
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2012
- 2012-07-12 CN CN201210241118.4A patent/CN103542310A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1783485A (en) * | 2004-11-04 | 2006-06-07 | 株式会社日立显示器 | Lighting source unit, illuminating apparatus using the same and display apparatus using the same |
| CN201326940Y (en) * | 2008-11-28 | 2009-10-14 | 鹤山丽得电子实业有限公司 | Surface mounted LED flexible neon lamp |
| CN101769468A (en) * | 2008-12-31 | 2010-07-07 | 佳必琪国际股份有限公司 | Full-covered light-emitting diode light bar and manufacturing method thereof |
| CN201434352Y (en) * | 2009-05-08 | 2010-03-31 | 琉明斯光电科技股份有限公司 | Light-emitting diode encapsulation structure and light bar applying same |
| CN102062323A (en) * | 2010-11-05 | 2011-05-18 | 深圳市聚飞光电股份有限公司 | Method for manufacturing LED lamp bar and LED lamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017081289A1 (en) * | 2015-11-13 | 2017-05-18 | Osram Opto Semiconductors Gmbh | Module for a video wall |
| US10553148B2 (en) | 2015-11-13 | 2020-02-04 | Osram Opto Semiconductors Gmbh | Module for a video wall |
| CN107524941A (en) * | 2017-08-15 | 2017-12-29 | 信利半导体有限公司 | A kind of preparation method of lamp bar |
| CN107524941B (en) * | 2017-08-15 | 2019-07-09 | 信利半导体有限公司 | A kind of production method of lamp bar |
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Application publication date: 20140129 |