M443814 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種燈條結構，特別是有關於一種 可減少製造成本及提升生產良率之燈條結構。 【先前技術】 現今隨著環保意識的高漲，具有省電與符合環保要 求之發光二極體（LED)已逐漸應用於生活中的各項 電子產品中，例如聖誕燈飾、手電筒、車輛信號燈、 交通標誌、手機與顯示器等商品，且未來發展的趨勢 也是利用發光二極體來逐漸替代功能相近之傳統燈 泡。 一般發光二極體元件之基本構造，係包括一導線 架、成型於導線架上之燈罩、晶片、金線及透明封裝 絕緣體，導線架上設有不同極性之導電端及一承載 部，其承載部處係固設有晶片，其晶片之週邊係設有 螢光材料，利用金線構成晶片之電極層與導電端之連 接，而導線架之各導電端並延伸出於燈罩及透明封裝 絕緣體外以成為電源接點。在導電端之通電作用下， .其晶片所產生之光源在穿過螢光材料時，即與螢光材 料之波長結合成為預期之可見光。 現今應用於照明之設有發光二極體之燈條結構大 都係將發光二極體元件直接焊接固定於印刷電路板 3 M443814 (PCB)或軟性電路板（FPC)上，然而，使用印刷電 路板或軟性電路板之成本較高，不利於市場競爭。因 此又有業者發展出將發光二極體元件直接烊接固定於 軟性排線（FFC)上，藉以降低燈條的生產成本。然 而，此種設有發光二極體元件之軟性排線在製作時經 常因為發光二極體元件之電源接點與軟性排線之導接 點之間產生焊接不良而使得生產良率下降，如此導致 製造成本増加的問題。 【新型内容】 習知燈條結構容易因為發光二極體元件焊接不良 而使得生產良率下降，如此導致製造成本增加的問題。 本創作提供一種燈條結構，包括一軟性排線及複數 個燈杯’其中軟性排線包括一金屬導線及包覆該金屬 導線之一絕緣層，該絕緣層上設有複數開口，該些開 口係沿著該絕緣層的長度方向間隔設置，該金屬導線 上設有複數個安裝部，該些安裝部對應於該些開口設 置，每一該些安裝部包括一前接點、連接該前接點之 一植晶區及一後接點，該植晶區與該後接點之間設有 一截斷點，前接點、植晶區及後接點經由開口外露於 絕緣層。複數個燈杯設置於絕緣層上，每一個燈杯對 應於開口設置且包圍前接點、植晶區及後接點。 本創作所提供之燈條結構，其係利用軟性排線來取 代原先所使用的印刷電路板或軟性電路板，且將發光 4 二極體晶片直接設置於軟性排線之安裝部的植晶區 上，然後直接在軟性排線上直接進行打線與封裝製 程，如此即可完成設有發光二極體晶片之燈條結構。 本發明與習知之燈條相比由於不需要將發光二極體元 件之電源接點焊接固定於軟性排線上之導接點，所以 節省了焊接製程，因此可以解決習知技術之焊接不良 所導致的生產良率下降與製造成本增加的問題。此 外，本創作之燈條結構不需要有導線架，如此不僅結 構簡單且可達到節省成本的目的。 【實施方式】 .請參閱第一圖至第三圖所示，為本創作之一較佳實 施例之立體示意圖、分解示意圖與部份剖面示意圖。 本創作提供一種燈條結構1，此燈條結構1主要由軟 性排線2、複數燈杯3、複數發光二極體晶片4以及複 數封裝材料5所構成。 軟性排線2包括一條金屬導線21及包覆金屬導線 21之一絕緣層22，該絕緣層22包括上下相對設置的 第一絕緣層221與第二絕緣層222，第一絕緣層221 上設有複數開口 220,該些開口 220係沿著第一絕緣 層221的長度方向間隔設置，且該些開口 220之間係 為等距間隔設置，金屬導線21上設有複數個安裝部 210，該些安裝部210對應於該些開口 220設置，每一 安裝部210包括一前接點211、連接前接點211之一 植晶區212及一後接點.213’植晶區212與後接點213 之間設有一截斷點214以形成分隔，前接點211、植 晶區212及後接點213經由開口 220外露於絕緣層22。 複數個燈杯3設置於絕緣層22上，每一個燈杯3 對應於每一個開口 220設置且包圍前接點211、植晶 區212及後接點213。複數發光二極體晶片4設置於 該些安裝部210之植晶區212上，利用打線製程形成 複數條連接線6於該些發光二極體晶片4與該些安裝 部210之前接點211及後接點213之間，使得發光二 極體晶片4電性連接於安裝部210之前接點21Γ及後 接點213。利用封裝製程形成複數個封襞材料5以覆 蓋於該些發光二極體晶片4上，該些封装材料5可保 濩發光二極體晶片4、連接線6、前接點211及後接點 213避免受到外界影響而氧化與污染。此外，燈杯3 包圍發光二極體晶片4、連接線6與封裝材料5，以強 化封裝材料5的保護結構並且具有控制發光二極體晶 片4所發射之光線行進方向的效果。 在本實施例中，為了使植晶製程容易實施與控制較 好的光線發射效果，故將植;晶區212對應於每一開口 220之中央位置设置，且使植晶區212位於每一燈杯3 之底部的中央位置。前接點211及後接點213分別設 於植晶區213之前後兩側，且截斷點214位於植晶區 212與後接點213之間以形成分隔，此時前接點211 之接觸面積係大於後接點213之接觸面積。 可以理解的是，在本實施例中，軟性排線2内僅設 置一條金屬導線21且經過切斷製程後於金屬導線21 上形成複數個安裝部210，然不限於此，另一種選擇 是，如第四圖與第五圖所示，亦可在軟性排線2内設 置二條以上之金屬導線21以形成另一種燈條結構7， 此時另一種燈條結構7係同樣呈現相似於前述之燈條 結構1，只是在第一絕緣層221上增設有複數個另一 開口 220,該些另一開口 220係沿著第一絕緣層221 的長度方向間隔設置，且該些另一開口 220與該些開 口 220係呈平行排列設置。設置另一條金屬導線21於 第一絕緣層221上，另一金屬導線21係對應於該些另 一開口 220設置，且另一金屬導線21與金屬導線21 係呈平行排列設置。對另一金屬導線21進行一切斷製 程，以使另一金屬導線21上形成複數另一安裝部 210,該些另一安裝部210對應於該些另一開口 220設 置。設置第二絕緣層222於另一金屬導線21上，以使 另一金屬導線21被包覆於第二絕緣層222與第一絕緣 層221之間。 同理亦可推知，另外增設複數另一燈杯3於絕緣層 22上，及增設複數另一發光二極體晶片4於該些另一 安裝部210之另一植晶區212上，並且進行後續之打 線與封裝等製程，故在此不再贅述詳細結構。然後在 完成封裝製程的步驟後，可對燈條結構7之第一絕緣 層221與第二絕緣層222進行一切割製程，以將另一 =屬導線2!分離於金屬導線21而形成二燈條結構 此，當增設的金屬導線21的數目越多，就可在相同 =程下’形成更多的燈條結構i，如此可降低生產時 間與成本。 ”不上所述’本創作之燈條結構，其係利用軟性排線 =取代原先所❹的印刷電路板或軟性電路板，且將 ^，一極體晶片直接設置於軟性排線之安裝部的植晶 ^ ⑽直接在軟性H直接進行打線與封裝製 本私此即可70成§是有發光二極體晶片之燈條結構。 件之雷：：知之燈條相比由於不需要將發光二極體元 接點焊接固定於軟性排線上之導接點，所以 即名了焊接製程，因此 ^ 所導致的峰遙自安 解決習知技術之焊接不良 外，太4 、：ί下降與製造成本增加的問題。此 構簡單且可達到節省成本的：導線架’如此不僅結 例說明31而t 本創作—種較佳之可行實施 專利範圍，凡其它未脫非用以限定本創作之申請 所完成之均等變化與修 _所揭示之技藝精神下 涵蓋之專職圍巾。、'變更，均應包含於本創作所 【圖式簡單說明】 第-創作之燈條結構的立體示意圖。 圖係第一圖之燈條結構的分解示意圖。 M443814 第三圖係第一圖之燈條結構的部份剖面示意圖。 第四圖係本創作之另一種燈條結構的立體示意圖。 第五圖係第四圖之另一種燈條結構的分解示意圖。 【主要元件符號說明】 1 燈條結構 2 軟性排線 21 金屬導線 210安裝部 211前接點 212植晶區 213後接點 214截斷點 22 絕緣層 220 開口 221第一絕緣層 222第二絕緣層 3 燈杯 4 發光二極體晶片 5 封裝材料 連接線 燈條結構 9 6M443814 V. New description: [New technical field] This creation is about a light bar structure, especially for a light bar structure that can reduce manufacturing costs and increase production yield. [Prior Art] Nowadays, with the rising awareness of environmental protection, light-emitting diodes (LEDs) with energy saving and environmental protection requirements have been gradually applied to various electronic products in life, such as Christmas lights, flashlights, vehicle signal lights, and traffic. Signs, mobile phones and monitors, and the future trend is also the use of light-emitting diodes to gradually replace the traditional light bulbs with similar functions. The basic structure of a general LED component includes a lead frame, a lampshade formed on the lead frame, a wafer, a gold wire and a transparent package insulator. The lead frame is provided with conductive ends of different polarities and a carrying portion, which carries The wafer is fixed at the periphery, and the periphery of the wafer is provided with a fluorescent material, and the gold wire is used to form the connection between the electrode layer and the conductive end of the wafer, and the conductive ends of the lead frame extend out of the lampshade and the transparent package insulator. To become a power contact. Under the energization of the conductive end, the light source generated by the wafer is combined with the wavelength of the fluorescent material to become the visible visible light when passing through the fluorescent material. Most of the light bar structures equipped with light-emitting diodes for illumination today are directly soldered to the printed circuit board 3 M443814 (PCB) or flexible circuit board (FPC), however, using printed circuit boards. Or the high cost of the flexible circuit board is not conducive to market competition. Therefore, some manufacturers have developed a direct connection of the light-emitting diode components to the flexible cable (FFC), thereby reducing the production cost of the light bar. However, such a flexible cable provided with a light-emitting diode component is often produced at a low production rate due to poor soldering between the power contact of the light-emitting diode component and the conductive contact of the flexible wiring component. The problem that leads to increased manufacturing costs. [New content] The conventional light bar structure is liable to cause a decrease in production yield due to poor soldering of the light emitting diode element, which causes a problem of an increase in manufacturing cost. The present invention provides a light bar structure comprising a flexible cable and a plurality of light cups, wherein the flexible cable comprises a metal wire and an insulating layer covering the metal wire, the insulating layer is provided with a plurality of openings, the openings The plurality of mounting portions are disposed on the metal wire, and the mounting portions are disposed corresponding to the openings, each of the mounting portions includes a front contact and the front connection One of the points is a seeding area and a back contact point, and a cut-off point is formed between the seeding area and the back contact point, and the front contact point, the crystallization area and the rear contact point are exposed to the insulating layer via the opening. A plurality of lamp cups are disposed on the insulating layer, and each of the lamp cups is disposed corresponding to the opening and surrounds the front contact, the crystallization area, and the rear contact point. The light bar structure provided by the present invention uses a flexible cable to replace the printed circuit board or the flexible circuit board which is originally used, and the light-emitting diode is directly disposed in the crystallizing area of the mounting portion of the flexible cable. Then, directly perform the wire bonding and packaging process directly on the flexible cable, so that the light bar structure with the light emitting diode chip can be completed. Compared with the conventional light bar, the invention saves the welding process by welding the power contact of the light emitting diode component to the guiding point of the flexible wire, so that the welding process of the prior art can be solved. The problem of reduced production yield and increased manufacturing costs. In addition, the light bar structure of the present invention does not require a lead frame, which is not only simple in structure but also cost-effective. [Embodiment] Please refer to the first to third figures, which are schematic perspective views, exploded views and partial cross-sectional views of a preferred embodiment of the present invention. The present invention provides a light bar structure 1 which is mainly composed of a flexible cable 2, a plurality of lamp cups 3, a plurality of light emitting diode chips 4, and a plurality of package materials 5. The flexible cable 2 includes a metal wire 21 and an insulating layer 22 covering the metal wire 21. The insulating layer 22 includes a first insulating layer 221 and a second insulating layer 222 disposed opposite each other. The first insulating layer 221 is disposed on the first insulating layer 221 The plurality of openings 220 are spaced apart along the length of the first insulating layer 221, and the openings 220 are equally spaced apart, and the metal wires 21 are provided with a plurality of mounting portions 210. The mounting portion 210 is disposed corresponding to the openings 220. Each mounting portion 210 includes a front contact 211, a seed crystal region 212 connected to the front contact point 211, and a rear contact point. 213' the crystallized region 212 and the rear contact point. A cut-off point 214 is formed between 213 to form a partition, and the front contact point 211, the physico-crystal area 212 and the rear contact point 213 are exposed to the insulating layer 22 via the opening 220. A plurality of lamp cups 3 are disposed on the insulating layer 22, and each of the lamp cups 3 is disposed corresponding to each of the openings 220 and surrounds the front contact 211, the crystallization region 212, and the rear contact 213. The plurality of LEDs 4 are disposed on the crystallographic regions 212 of the mounting portions 210, and a plurality of connecting wires 6 are formed on the LEDs 4 and the contacts 211 of the mounting portions 210 by using a wire bonding process. Between the rear contacts 213, the LEDs 4 are electrically connected to the contacts 21A and the rear contacts 213 of the mounting portion 210. A plurality of sealing materials 5 are formed on the LED chip 4 by using a packaging process, and the encapsulating material 5 can protect the LED chip 4, the connecting line 6, the front contact 211 and the back contact. 213 Avoid oxidation and pollution from outside influences. Further, the lamp cup 3 surrounds the light-emitting diode wafer 4, the connecting wire 6 and the encapsulating material 5 to enhance the protective structure of the encapsulating material 5 and has an effect of controlling the traveling direction of the light emitted from the light-emitting diode wafer 4. In this embodiment, in order to make the phytolithography process easy to implement and control a better light emission effect, the seeding region 212 is disposed corresponding to the central position of each opening 220, and the crystallization region 212 is located at each lamp. The center of the bottom of the cup 3. The front contact point 211 and the rear contact point 213 are respectively disposed on the front and rear sides of the phytocrystallized area 213, and the cut-off point 214 is located between the physico-crystallized area 212 and the rear contact point 213 to form a separation, and the contact area of the front contact point 211 at this time. It is greater than the contact area of the back contact 213. It is to be understood that, in the present embodiment, only one metal wire 21 is disposed in the flexible cable 2 and a plurality of mounting portions 210 are formed on the metal wire 21 after the cutting process. However, the present invention is not limited thereto, and another option is As shown in the fourth and fifth figures, two or more metal wires 21 may be disposed in the flexible cable 2 to form another light bar structure 7. At this time, the other light bar structure 7 is similar to the foregoing. The light bar structure 1 is provided with a plurality of other openings 220 on the first insulating layer 221, and the other openings 220 are spaced apart along the length direction of the first insulating layer 221, and the other openings 220 are The openings 220 are arranged in parallel. Another metal wire 21 is disposed on the first insulating layer 221, and another metal wire 21 is disposed corresponding to the other openings 220, and the other metal wires 21 and the metal wires 21 are arranged in parallel. The other metal wire 21 is subjected to a cutting process to form a plurality of other mounting portions 210 on the other metal wire 21, and the other mounting portions 210 are disposed corresponding to the other openings 220. The second insulating layer 222 is disposed on the other metal wire 21 such that the other metal wire 21 is coated between the second insulating layer 222 and the first insulating layer 221. Similarly, it is also inferred that a plurality of other light cups 3 are additionally disposed on the insulating layer 22, and a plurality of other light emitting diode chips 4 are additionally disposed on the other crystallizing region 212 of the other mounting portions 210, and Subsequent processes such as wire bonding and packaging, so the detailed structure will not be described here. Then, after the step of completing the packaging process, the first insulating layer 221 and the second insulating layer 222 of the light bar structure 7 can be subjected to a cutting process to separate the other wire 2! from the metal wire 21 to form two lamps. In this case, when the number of additional metal wires 21 is increased, more light bar structures i can be formed under the same process, which can reduce production time and cost. "Not in the above description", the light bar structure of the present invention uses a flexible cable to replace the original printed circuit board or flexible circuit board, and the TFT chip is directly placed on the mounting portion of the flexible cable. The phytocrystal ^ (10) directly in the soft H directly wire and package the system can be 70% § is a light bar structure with a light-emitting diode chip. Pieces of lightning:: know the light bar compared to because there is no need to shine two The pole-body joint is welded and fixed on the guiding point of the flexible cable, so it is called the welding process, so the peak caused by the ^ is caused by the poor soldering of the conventional technology, too much, and the manufacturing cost is too low. The problem is increased. This construction is simple and cost-effective: the lead frame is so not only the description 31 but also the preferred scope of the patent application, where the other application is not limited to the application for the creation of the creation. The uniform change and the full-time scarf covered under the technical spirit revealed by _ _, 'changes, should be included in this creation [simplified description of the schema] The first-creative light bar structure stereoscopic diagram. Schematic diagram of the structure of the light bar. M443814 The third figure is a partial cross-sectional view of the light bar structure of the first figure. The fourth picture is a three-dimensional view of another light bar structure of the present invention. Schematic diagram of another light bar structure. [Main component symbol description] 1 Light bar structure 2 Flexible cable 21 Metal wire 210 mounting portion 211 Front contact 212 Arbitration area 213 Rear contact point 214 Cut point 22 Insulation layer 220 Opening 221 First insulating layer 222 second insulating layer 3 lamp cup 4 light emitting diode chip 5 packaging material connecting line light bar structure 9 6