200905909 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種發光二極體封裝單元，特別 是指一種製造方便且穩定性高的發光二極體封裝單元 〇 【先前技術】 隨著發光二極體（High Brightness LED)的發展，其 應用愈來愈廣泛’像是用於顯示器背光源、迷你型投 影機、照明以及汽車燈源等。但是，由於目前LED只 有15〜20%的輸入功率轉換成光，而8〇〜85%的功率都 轉換成熱，假如這些熱能無法迅速排出，將使LED晶 粒的界面溫度過高而影響其發光強度及使用壽命，尤 其咼功率高亮度的發光二極體所產生的熱更多，其散 熱效能需要更好。因此，LED的熱管理問題愈來愈受 到重視，若欲降低LED的界面溫度，必須在led的封 裝、’Ό構上針對散熱問題加以改善，以降低LED封裝單 元的熱阻抗。 LED可分為燈型（lamp )及表面黏著型（) 兩種如圖1所示，一種習知燈型發光二極體燈源1 ' 光極體日日粒11透過黏結劑（silver epoxy)貼 放在基座12的散熱塊121上，打線連接晶粒11電極 與金屬支架122，再塗佈透明的環氧樹脂封裝材料 14，最後覆蓋-個透鏡15組裝而成。其中，該基座12 200905909 是將散熱力121及金屬支架122放入一模具（圖未示 )的八杈中’再將塑料注入穴模而將散熱土鬼⑵與金 屬支架122，结合，塑料冷卻後形成包覆體123;金屬支 架122末端則與電路板（圖未示）連接。至於透鏡15 組裝固定方式’也與該包覆冑123相關—利用加熱的 壓合治具（圖未示）使塑料在受熱、受壓的情況下緊 壓固定在透鏡15周緣。 該發光二極體燈源1製作方法雖可使晶粒U產生 的熱快速傳遞至散熱塊121而向下傳出，且元件間的 結合穩固，但由於形成包覆冑123需使用高精密度射 出模具’而該模具製作技術精密度高且成本昂貴，利 用C 口 m具固定透鏡15又需要使用較多、較厚的塑料 才能完成’且有烫壞透鏡15的風險；整體而言，咳習 知的發光二極體燈源」存在製造所需模具、材料成本 皆高，製造過程元件易損壞的缺點。 1231609號專利揭露一種 電路板基材22預放晶粒 如圖2所示，中華民國第 SMD型發光二極體2，是在一 处又貫孔並在貝孔内填滿銅膠、銀膠或銲錫之高 導熱金屬錢焊加溫（Refw)，冷卻後形成高導熱金 屬導體23，接著將晶纟21置於高導熱金屬導體η上 並打線連接電極，最後以環氧樹脂29封裝成型。高導 熱金屬導體23 -方面連接電路板電極一方面將晶粒 η通電時產生的熱傳導出去，也就是電熱合-的設計 200905909 雖然此種發光二極體2可透過高導熱金屬導體乃 的設計而順利散熱，且比燈型發光二極體製作成本低 ，但此種發光二極體2所採用高導熱金屬導體23皆為 焊接材料，當二次迴焊時若SMT溫度到達約25〇艺， 則會造成該高導熱金屬導體23熔化或變形，嚴重影響 發光二極體的結構及封裝品質。 如圖3所示，中華民國第1231613號專利揭露另一 種SMD型發光二極體2,，是在電路板基材24底部製 一凹槽241，且中央貫穿形成一孔洞242，散熱導體 安裝於凹槽241内，散熱導體25上有一凸塊碗杯251 則露出孔洞242，LED發光晶粒26固定於凸塊碗杯 25 1内，晶粒26正、負導電極藉金屬線與位在電路板 基材24兩側的正、負導電極27接合，最後將透鏡片 28裝在電路板基材24上而成一 LED封裝結構。 這種發光二極體2,的缺點在於晶粒26與凸塊碗杯 25 1是一對一置入，反射面之大小受到凸塊碗杯25丨之 大小的限制’若要應用在多晶粒的封裝，必須大幅變 更設計；且正、負導電極27環繞電路板基材24，對於 電路板基材24的製作上，必須多次加工、裁切，並不 方便。 综而言之，以現有發光二極體技術而言，除了追 求散熱性能之外’在封裝精密度上、材料選用及成本 控制上仍有許多研發改善的空間。 【發明内容】 200905909 本發明之目的，是在提供一種製 古 裡眾造方便、穩定性 向且結合性佳的發光二極體封裝單元。 本發明的其他目的和優點可以你 ^ j M攸本發明所揭露的 技術特徵卡得到進一步的了解。 為達上述之-或部份或全部目的或是其他目的 ，本發明-實施例的發光二極體的封裴單元包含一設 有至少一貫孔的電路板、數量對廡首·2| 双里耵應貫孔之散熱塊、數 量至少等於散熱塊的發光二極體曰私 往體日日叔，及對數對應該 晶粒的電極引腳。電路板還包括—基板及數量對應該 了:L之兩倍且間隔位於該貫孔外側的引腳穿孔，貫孔 是貫穿該基板所形成。散熱塊為一熔點高於“Ο。。的金 屬，其尺寸配合該貫孔’該散熱塊係設置於該貫孔中 ，且具有一呈水平之頂面。發井-朽 货尤—極體晶粒固定於該 散熱塊之頂面上，-個散熱塊頂面可對應設置一個或 多個晶粒。該對電極引腳分別設在該電路板的該此引 腳穿孔内，該對電極引腳之i 沾 山 丁电往引腳之其一的一端與該晶粒的正 極電性連接’該對電極引腳之另 电徑刃腳之另一的一端與該晶粒的 負電極電性連接。每_哕雷& 2丨_ ^ σ 母°亥電極引腳的另一端與該電路 板下方電路連接。散熱塊的材質可以為鋼。 較佳地，貫孔孔壁塗佈有一層黏固物，藉此，當 該散熱塊設置於該貫子丨φ，# & m 、邊員孔中，该黏固物填滿於該散熱塊 與該貫孔孔壁間的縫隙，且使該散熱塊黏固。該黏固 物的材質包含樹脂、矽膠與錫膏的其中之一者。 較佳地，散熱塊高度小於該貫孔之深度且該散熱 200905909 塊設在該貫孔底層，該封努置& ^ 才裝早凡更包含數量對應該貫 孔且設在該貫孔孔壁、未與兮吟也 不兴'•亥散熱塊接觸處且圍繞該200905909 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode package unit, and more particularly to a light-emitting diode package unit which is easy to manufacture and has high stability. [Prior Art] The development of High Brightness LEDs is becoming more and more popular, such as for display backlights, mini projectors, lighting, and automotive light sources. However, since only 15 to 20% of the input power of LEDs is converted into light, and 8 to 85% of the power is converted into heat, if these heat energy cannot be quickly discharged, the interface temperature of the LED die will be too high and affect it. The luminous intensity and service life, especially the high-brightness light-emitting diodes generate more heat, and the heat dissipation performance needs to be better. Therefore, the thermal management problem of LEDs has become more and more important. To reduce the interface temperature of LEDs, it is necessary to improve the heat dissipation problem in the package and the structure of the LED to reduce the thermal impedance of the LED package unit. The LED can be divided into a lamp type and a surface adhesion type. As shown in FIG. 1 , a conventional lamp type light-emitting diode lamp source 1 'light body body 11 grain through a cement (silver epoxy) It is placed on the heat dissipating block 121 of the susceptor 12, and the wire 11 electrode and the metal bracket 122 are connected by wire bonding, and then the transparent epoxy resin encapsulating material 14 is coated, and finally the lens 15 is assembled. Wherein, the base 12 200905909 is to put the heat dissipation force 121 and the metal bracket 122 into the gossip of a mold (not shown), and then inject the plastic into the cavity mold to combine the heat dissipation earth ghost (2) with the metal bracket 122, plastic After cooling, the covering body 123 is formed; the end of the metal bracket 122 is connected to a circuit board (not shown). As for the lens 15 to be assembled and fixed, it is also associated with the covering crucible 123. The heated press-fit jig (not shown) is used to press and hold the plastic to the periphery of the lens 15 under heat and pressure. The method for manufacturing the light-emitting diode lamp source 1 can quickly transfer the heat generated by the die U to the heat-dissipating block 121 and pass downward, and the bonding between the components is stable, but the high precision is required for forming the cladding 胄123. The mold is produced with high precision and high cost. The use of a fixed lens 15 with a C port requires a thicker and thicker plastic to complete the risk of scalding the lens 15; overall, coughing The conventional light-emitting diode lamp source has the disadvantages of high manufacturing cost and high material cost, and the components in the manufacturing process are easily damaged. Patent No. 1231609 discloses a pre-release die of a circuit board substrate 22. As shown in FIG. 2, the SMD type LED 2 of the Republic of China is filled in a hole and filled with copper glue and silver glue in the hole. Or the high thermal conductivity metal soldering of the solder is heated (Refw), and after cooling, the high thermal conductive metal conductor 23 is formed, and then the wafer 21 is placed on the high thermal conductive metal conductor η and connected to the electrode by wire bonding, and finally encapsulated by the epoxy resin 29. The highly thermally conductive metal conductor 23 - the surface of the circuit board electrode on the one hand conducts the heat generated when the crystal grain η is energized, that is, the design of the electric heating - 200905909 although the light emitting diode 2 can transmit the design of the high thermal conductivity metal conductor Smooth heat dissipation, and lower cost than the lamp type LED, but the high thermal conductivity metal conductor 23 used in the LED 2 is a solder material, and if the SMT temperature reaches about 25 二次 during the second reflow, The high thermal conductive metal conductor 23 is melted or deformed, which seriously affects the structure and package quality of the light emitting diode. As shown in FIG. 3, the Republic of China No. 1231613 discloses another SMD type light-emitting diode 2, which is formed with a recess 241 at the bottom of the circuit board substrate 24, and a hole 242 is formed in the center, and the heat-dissipating conductor is mounted on In the recess 241, a heat-dissipating conductor 25 has a bump cup 251 to expose the hole 242, and the LED light-emitting die 26 is fixed in the bump cup 25 1 , and the positive and negative conductive electrodes of the die 26 are connected to the circuit by the metal wire. The positive and negative conductive electrodes 27 on both sides of the board substrate 24 are joined, and finally the lens sheet 28 is mounted on the circuit board substrate 24 to form an LED package structure. A disadvantage of such a light-emitting diode 2 is that the die 26 is placed one-to-one with the bump cup 25 1 , and the size of the reflecting surface is limited by the size of the bump cup 25 ' 'If applied to polycrystalline The package of the particles must be greatly changed in design; and the positive and negative conductive electrodes 27 surround the circuit board substrate 24. For the fabrication of the circuit board substrate 24, it is inconvenient to process and cut a plurality of times. In summary, in terms of the existing LED technology, in addition to pursuing heat dissipation performance, there is still much room for improvement in packaging precision, material selection and cost control. SUMMARY OF THE INVENTION 200905909 An object of the present invention is to provide a light-emitting diode package unit which is convenient in manufacturing, stable in stability, and excellent in bonding. Other objects and advantages of the present invention will be further appreciated by the technical features of the present invention. For the above-mentioned or some or all of the purposes or other purposes, the sealing unit of the light-emitting diode of the present invention-embodiment includes a circuit board provided with at least a consistent hole, and the number of pairs of daggers 2 | The number of heat-dissipating blocks of the hole should be at least equal to the number of the light-emitting diodes of the heat-dissipating block, and the electrode pins of the logarithmic corresponding die. The circuit board further includes a substrate and a number corresponding to: a pin perforation at a distance of L and spaced outside the through hole, the through hole being formed through the substrate. The heat dissipating block is a metal having a melting point higher than "Ο. The size of the metal is matched with the through hole." The heat dissipating block is disposed in the through hole and has a horizontal top surface. The well is a decaying body. The die is fixed on the top surface of the heat dissipating block, and the top surface of the heat dissipating block may be correspondingly provided with one or more crystal grains. The pair of electrode pins are respectively disposed in the pin perforations of the circuit board, and the pair of electrodes One end of the pin i is electrically connected to one end of the pin and the other end of the other electrode of the pair of electrodes is electrically connected to the negative electrode of the die. Sexual connection. The other end of each _ 哕 & amp ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ a layer of cement, whereby when the heat dissipating block is disposed in the through hole 丨φ,# & m, the edge of the edge, the cement fills the gap between the heat dissipating block and the wall of the through hole, And fixing the heat dissipating block. The material of the cement comprises one of resin, silicone and solder paste. Preferably, the height of the heat sink is high. It is smaller than the depth of the through hole and the heat dissipation 200905909 block is disposed on the bottom layer of the through hole, and the seal is placed in the & ^ before loading, and the number is corresponding to the through hole and is disposed on the wall of the through hole, Unhappy '•Hai heat block contact and surround
發光二極體晶粒的反射層，該B 茨日日极發出之光線的至少 -部分經該反射層反射而向一出光方向射出。該貫孔 孔壁之設有該反射層處’可以是與該散熱塊頂面垂直 ，或與該散熱塊頂面失一鈍角。 較佳地，該封裝單元更包含數量對應該晶粒的透 鏡’該透鏡固定於該電路板的頂面且遮蔽該晶粒。透 鏡可以是-外加構件或由透明膠材直接成型。有關前 者，該電路板更包括數量對應該透鏡且貫穿該基板所 形成之注膠孔，該注膠孔一端連通該電路板頂面之受 該透鏡遮蔽處，另一端與外部連通，供一透明膠材自 外部填灌入該透鏡與晶粒之間。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效 ’在以下配合參考圖式之一較佳實施例的詳細說明中 ’將可清楚的呈現。為了能更清楚表達’以下說明是 以圖中所示之上、下、左、右、前或後等方位為基準 ’因此，使用的方向用語是用來說明並非用來限制本 發明。 參閱圖4，本發明第一較佳實施例之發光二極體的 封裝單元3包含一電路板31、一散熱塊32、一發光二 極體晶粒（以下簡稱晶粒）33、一反射層34、二電極 引腳35，及一透鏡36。 200905909 電路板31包括一基板31〇及貫穿基板31〇所形成 之一貫孔311，及二間隔位於貫孔3丨丨外側的引腳穿孔 312。貫孔311孔壁，特別是下半部，塗佈有一層黏固 物3 13，該黏固物3 13的材質可以為樹脂，或矽膠、錫 膏。 散熱塊32是利用熔點高於22〇〇c的金屬（例如， 銅）配合貫孔311尺寸製成後，再設置於貫孔311中 。該散熱塊32具有一呈水平之頂面321。本實施例散 熱塊32高度小於貫孔311之深度且設在貫孔311底層 ;由於前述貫孔3 11孔壁塗佈有黏固物3 13，因此當散 熱塊32設置於貫孔311中，黏固物313填滿於散熱塊 32與貫孔3 11孔壁的縫隙間’且使散熱塊32確實黏固 。晶粒33固定於散熱塊32之頂面321上。 反射層34設在貫孔311孔壁未與散熱塊32接觸處 且圍繞晶粒33，本實施例貫孔3 11孔壁設有該反射層 34處與散熱塊32頂面垂直，因此晶粒33發出的部分 側向光線，會經反射層34反射後向出光方向射出。另 外，本實施例雖是以晶粒3 3數量為一，也就是最小單 位舉例說明，但本發明也可在散熱塊32頂面設置多晶 粒。 该二電極引腳35代表一正一負，分別設在電路板 31的引腳穿孔312内’其上端透過導線37與晶粒33 的正、負電極連接，下端則與電路板31下方電路連接 10 200905909 本實％例透鏡36是一外加構件，固定於電路板3 j 板 的頂面且遮蔽晶粒3 3。此外，電路板3 1更包 括貫穿基板3 10所形成之至少-注膠孔3 14，該注膠孔 314上端連通基板31()頂面受透鏡％遮蔽處，下端與 外部連通，供透明膠材自外部填灌人透鏡％與晶粒^ 之間相較於空心的結構，填充有透明膠的結構具有 較佳的出光效果。 —本實轭例中’晶粒33的正、負極可如圖4所示地 同位於其頂面，也可以如圖5所示，分別位於頂、底 面，並且晶粒33底面的電極與散熱塊32之間隔有絕 緣政…、板38，6亥位於底面的電極透過絕緣散熱板與 導線37電性連接’再電性連接到對應的電極引腳35， 也就是電熱分離的設計。 此外，還可以如圖6所示，晶粒33位於底面之電 極直接透過接觸散熱塊32而與導線37連接，再連接 到對應之電極引腳35，也就是電熱合一的設計。 如圖7所示，本發明第二較佳實施例之發光二極 體的封裝單元3,與第一較佳實施例的差別在於：第二 較佳實施例之貫孔3U孔壁設有反射層34,處，與散= 塊32頂面夾一鈍角。此外，透鏡36,整體是由透明膠 材直接成型，因此無須如第一較佳實施例設注膠孔HA (圖6 )且在固定透鏡36後填灌透明膠材。 如圖8所示’本發明發光二極體的封裝單元3更 可進一步應用作成燈條型，也就是一發光二極體的封 11 200905909 裝單元組合’該組合相當於由多數個第一較佳實施例 之發光二極體的封裝單元並排而成，但實際製作上， 是由-大片相連的電路板31貫穿多數貫孔3ιι、每個 貫孔311外側又穿設二相間隔引腳穿孔312,接著對應 組裝其他元件而成。發光二極體的封裝單元組合可應 用於檯燈等照明裝置。 歸納上述’本發明正、負電極引腳35是透過在電 路板31上直接設穿孔，再設置其中，因此在製作電路 板31時可一次加工完成，並 ^ 甚至在一大片電路板31經 鑽孔後即可裝設成多個封裝單元，空間利用性極佳； 與習知將電極引腳環繞電路板基材的技術相較，本發 明之電路板31不需多次加工、裁切，製作上方便許多 。此外’本發明可應用為多晶粒發光，且反射層34等 結構都無需重新設計，應變性強且可應用性較廣。整 體而言，本發明以簡潔之結構達到製造方便、降低成 本、穩定、應用性佳等多項好處，確實可達到本發明 之目的。 *惟以上所述者，僅為本發明之較佳實施例而已， =以此限定本發明實施之範圍，即大凡依本發明 甲凊專利範圍及發明說明内交 所作之簡單的等效變化 —飾’皆仍屬本發明專利涵蓋之範圍内。本發明的 =實施例或中請專利範圍不須達成本發明所揭露 ::部目的或優點或特點。此外，摘要部分和標題 疋用來輔助專利文件搜尋之用，並非用來限制本 12 200905909 發明之權利範圍。 ' 【圖式簡單說明】 ' 圖1是習知一種燈型發光二極體燈源之立體剖視 圖； 圖2是習知一種SMD型發光二極體之結構示意圖 9 圖3是習知另一種SMD型發光二極體之結構示意 圖； 圖4是依據本發明第一較佳實施例發光二極體的 封裝單元的結構示意圖； 圖5是類似圖4之電熱分離設計之示意圖； 圖6類似圖4之電熱合一設計之示意圖； 圖7是依據本發明第二較佳實施例發光二極體的 封裝單元的結構示意圖；及 圖8是本發明發光二極體的封裝單元進一步應用 纟發光二極體的封裳單元組合的結構示意圖。 13 200905909 【主要元件符號說明】 3、3’…·發光二極體的封裝單元 31 .........電路板 310 .......基板 311 .......貫孔 312 .......引腳穿孔 313 .......黏固物 314 .......注膠孔 32 .........散熱塊 321.......頂面 33 .........發光二極體晶粒 34、34’·反射層 35.........電極引腳 36、36’ ·透鏡 37 .........導線 38 .........絕緣散熱板 14A reflective layer of the light-emitting diode crystal, at least a portion of the light emitted by the B-day pole is reflected by the reflective layer and emitted toward a light exiting direction. The portion of the through-hole wall provided with the reflective layer may be perpendicular to the top surface of the heat-dissipating block or may be offset from the top surface of the heat-dissipating block. Preferably, the package unit further comprises a number of lenses corresponding to the die. The lens is fixed to the top surface of the circuit board and shields the die. The lens can be - plus or directly formed from a transparent glue. In the former case, the circuit board further includes a number of injection holes formed by the lens and penetrating through the substrate. The one end of the injection hole communicates with the top surface of the circuit board and is shielded by the lens, and the other end communicates with the outside for a transparent The glue is filled from the outside into the lens and the die. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. For the sake of clarity, the following description is based on the top, bottom, left, right, front, or rear orientations shown in the drawings. Therefore, the directional terminology used is intended to be illustrative and not limiting. Referring to FIG. 4, a package unit 3 of a light-emitting diode according to a first embodiment of the present invention includes a circuit board 31, a heat dissipation block 32, a light-emitting diode die (hereinafter referred to as a die) 33, and a reflective layer. 34. Two electrode pins 35, and a lens 36. The circuit board 31 includes a substrate 31 and a uniform hole 311 formed through the substrate 31, and two pin holes 312 spaced apart from the outside of the through hole 3. The through hole 311 hole wall, particularly the lower half, is coated with a layer of cement 3 13, and the material of the cement 3 13 may be a resin, or a silicone or a solder paste. The heat dissipating block 32 is made of a metal (for example, copper) having a melting point higher than 22 〇〇c and is formed in the through hole 311, and then formed in the through hole 311. The heat sink block 32 has a horizontal top surface 321 . The height of the heat dissipation block 32 is smaller than the depth of the through hole 311 and is disposed on the bottom layer of the through hole 311. Since the hole of the through hole 3 11 is coated with the adhesive 3 13, the heat dissipation block 32 is disposed in the through hole 311. The cement 313 fills the gap between the heat sink block 32 and the wall of the hole of the through hole 3 11 and the heat sink block 32 is surely adhered. The die 33 is fixed to the top surface 321 of the heat sink block 32. The reflective layer 34 is disposed at a position where the hole wall of the through hole 311 is not in contact with the heat dissipation block 32 and surrounds the die 33. In the hole wall of the through hole 3 11 of the embodiment, the reflective layer 34 is perpendicular to the top surface of the heat dissipation block 32. Part of the lateral light emitted by 33 is reflected by the reflective layer 34 and then emitted toward the light exiting direction. In addition, although the present embodiment is exemplified by the number of crystal grains 3 being one, that is, the smallest unit, the present invention can also provide polycrystalline grains on the top surface of the heat dissipating block 32. The two electrode pins 35 represent a positive and a negative voltage, respectively disposed in the pin through holes 312 of the circuit board 31. The upper end thereof is connected to the positive and negative electrodes of the die 33 through the wire 37, and the lower end is connected to the circuit under the circuit board 31. 10 200905909 The actual example lens 36 is an additional member that is fixed to the top surface of the board 3 j board and shields the die 33. In addition, the circuit board 3 1 further includes at least a glue injection hole 3 formed through the substrate 3 10 . The upper end of the injection hole 314 communicates with the top surface of the substrate 31 (the lens is shielded by the lens %, and the lower end communicates with the outside for the transparent glue The material is filled from the outside and the human lens is compared with the hollow crystal structure, and the structure filled with the transparent plastic has a better light-emitting effect. In the present embodiment, the positive and negative electrodes of the die 33 may be located on the top surface thereof as shown in FIG. 4, or may be located on the top and bottom surfaces, respectively, as shown in FIG. 5, and the electrodes and the heat dissipation on the bottom surface of the die 33. The block 32 is separated by an insulating ..., the plate 38, 6 Hai is located on the bottom surface of the electrode through the insulating heat sink and electrically connected to the wire 37 're-electrically connected to the corresponding electrode lead 35, that is, the design of electrothermal separation. In addition, as shown in FIG. 6, the electrode of the die 33 on the bottom surface is directly connected to the wire 37 through the contact heat sink 32, and is then connected to the corresponding electrode pin 35, that is, the design of the electric heat and the heat. As shown in FIG. 7, the package unit 3 of the light-emitting diode according to the second preferred embodiment of the present invention is different from the first preferred embodiment in that the hole of the through hole 3U of the second preferred embodiment is provided with reflection. At layer 34, there is an obtuse angle with the top surface of the bulk block 32. Further, the lens 36 is integrally formed of a transparent material as a whole, so that it is not necessary to provide the glue hole HA (Fig. 6) as in the first preferred embodiment and to fill the transparent glue after the lens 36 is fixed. As shown in FIG. 8 , the package unit 3 of the light-emitting diode of the present invention can be further applied to form a light bar type, that is, a light-emitting diode package 11 200905909 unit combination 'this combination is equivalent to a plurality of first comparisons The package unit of the light-emitting diode of the preferred embodiment is formed side by side, but in actual production, the circuit board 31 connected by the large piece penetrates the plurality of through holes 3, and the outer side of each of the through holes 311 is pierced with two-phase spaced pins. 312, and then corresponding assembly of other components. The package unit combination of the light-emitting diodes can be applied to illumination devices such as desk lamps. In summary, the positive and negative electrode pins 35 of the present invention are directly provided with perforations on the circuit board 31, and are disposed therein, so that the circuit board 31 can be fabricated once, and even drilled on a large circuit board 31. The hole can be installed into a plurality of package units, and the space utilization is excellent; compared with the conventional technique of surrounding the electrode pins around the circuit board substrate, the circuit board 31 of the present invention does not need to be processed and cut multiple times. It is convenient to make a lot. Further, the present invention can be applied to multi-grain luminescence, and the structure such as the reflective layer 34 does not need to be redesigned, and has high strainability and wide applicability. In general, the present invention achieves the advantages of ease of manufacture, cost reduction, stability, and applicability with a simple structure, and can indeed achieve the object of the present invention. * The above is only the preferred embodiment of the present invention, which is to limit the scope of the practice of the present invention, that is, the simple equivalent change made by the patent scope and invention description of the present invention - The decorations are still within the scope of the invention patent. The scope of the invention or the scope of the invention is not required to achieve the subject matter or advantages or features of the invention. In addition, the abstract section and the title 疋 are used to assist in the search of patent documents and are not intended to limit the scope of the invention of this invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective cross-sectional view of a conventional lamp type LED light source; FIG. 2 is a schematic view of a conventional SMD type light emitting diode 9; FIG. 3 is another conventional SMD. 4 is a schematic structural view of a package unit of a light-emitting diode according to a first preferred embodiment of the present invention; FIG. 5 is a schematic view similar to the electrothermal separation design of FIG. 4; FIG. FIG. 7 is a schematic structural view of a package unit of a light-emitting diode according to a second preferred embodiment of the present invention; and FIG. 8 is a package unit of the light-emitting diode of the present invention further applied to a light-emitting diode Schematic diagram of the combination of body sealing units. 13 200905909 [Description of main component symbols] 3, 3'...·Light-emitting diode package unit 31 .........circuit board 310 .......substrate 311 ....... Through hole 312 .... pin through hole 313 .... cement 314 ....... glue hole 32 ... ... heat block 321.. ..... top surface 33 ... ... light-emitting diode crystal grains 34, 34' · reflective layer 35 ... electrode lead 36, 36' · lens 37 ......... wire 38 ......... insulated heat sink 14