TWI476885B - Leadframe, assembly of leadframe and substrate and led module - Google Patents

Description

Conductive frame strip, combination of conductive strip and insulating shell, and light emitting diode module using the same

The invention relates to a conductive frame strip, a combination of the conductive strip and an insulating shell, and a light emitting diode module using the same, in particular to a die cut and ready for re-cutting. The conductive strip as a conductive loop for guiding the light-emitting dies, the combination of the conductive strip and the insulating case, and the light-emitting diode module to which the combination is applied.

In the past, a product for a surface light source or a light source having a plurality of light-emitting dies is mounted on a circuit board by arranging a plurality of light-emitting dies on a circuit board, and then soldering by means of reflow soldering and flow soldering, but In the process of reflow soldering and wave soldering, since the size of the light-emitting crystal grain is small, the alignment with the printed circuit on the circuit board is relatively difficult, and the processing difficulty is high.

Therefore, the object of the present invention is to provide a light-emitting diode module capable of eliminating the problem that the arrangement of the circuit board is not easy to align the light-emitting crystal grains.

Another object of the present invention is to provide a conductive carrier tape that can be placed in the illuminating die and re-punched to form a conductive frame that replaces the printed circuit of the circuit board.

It is still another object of the present invention to provide a combination of the aforementioned conductive web and an insulative housing.

Thus, the conductive strip of the present invention comprises a plurality of conductive frame combinations, each conductive frame combination comprising two first conductive frames and at least two second conductive frames. The first conductive frames are spaced apart from each other and extend in a first direction for connecting an external power source. The second conductive frame is arranged between the two first conductive frames in a second direction different from the first direction, and a first solid is provided between each of the first conductive frames and any of the second conductive frames. Crystal area.

The combination of the conductive strip and the insulating shell of the present invention comprises a conductive strip and a plurality of insulating shells, the conductive strip comprising a plurality of conductive frame combinations, each of the conductive frame combinations comprising two first conductive frames and at least two Two conductive frames. The first conductive frames are spaced apart from each other and extend in a first direction for connecting an external power source. The two second conductive frame units are arranged between the two first conductive frames in a second direction different from the first direction, and a first space is provided between each of the first conductive frames and any of the second conductive frame units. A solid crystal zone. The insulating housings are respectively coupled to the conductive frame assemblies, and each of the insulating housings has a plurality of recesses, and the first die bonding region of each of the conductive frame combinations is exposed by one of the recesses of the insulating housing.

The LED module of the invention comprises a conductive strip, an insulating shell and a plurality of illuminating dies. The conductive strip includes two first conductive frames and at least two second conductive frame units. The two first conductive frames are spaced apart from each other and extend in a first direction for connecting an external power source. The two second conductive frame units are arranged between the two first conductive frames in a second direction different from the first direction, and a first space is provided between each of the first conductive frames and any of the second conductive frame units. A solid crystal zone. The insulating housing is coupled to the conductive strip, and the insulating housing has a plurality of recesses, each of the first solid crystal regions being exposed by one of the recesses. Each of the first die bonding regions is provided with the light emitting die.

In the present invention, the conductive frame is used to replace the printed circuit of the circuit board to guide the light-emitting dies, thereby solving the problem that the conventional illuminating crystal grains are difficult to align and difficult to process, and further, punching out different sets of second conductive frames. The unit and the different number of second conductive frames can also be modified to provide different types of surface light sources for different sizes of light-emitting dies.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Referring to FIG. 1, a preferred embodiment of the LED module of the present invention is actually a planar light source and includes a conductive frame combination 1, a plurality of light-emitting dies, and a combination of conductive frames. An insulating case 3 of 1 and a plurality of light-transmitting colloids 4 bonded to the insulating case 3 and respectively encapsulating the light-emitting dies 2 are provided. The conductive frame assembly 1 is partially exposed outside the insulating housing 3 for connection to an external power source. By the structural arrangement of the conductive frame assembly 1 itself, in each of the light-emitting crystal grains AI, each column of the light-emitting crystal grains AC, DF, and GI are in a series relationship, and the three rows of light-emitting crystal grains AC, DF, and GI are in parallel relationship. . Regarding the detailed structure of the conductive frame assembly 1, the following will be described in more detail.

Referring to FIG. 2 , a conductive strip 100 is die cut from a metal sheet. The conductive strip 100 includes two edges 101 extending along a first direction 201 and arranged between the two sides 101 . The plurality of conductive frame combinations 1, each of the conductive frame combinations 1 can be solid crystal and packaged to form one of the above-mentioned light emitting diode modules.

Referring to FIG. 3, each of the conductive frame assemblies 1 includes two first-phase conductive frames 11, 14 extending in a first direction 201 and at least two between the two first conductive frames 11, 14 and along a different The second conductive frame 12 and the at least one third conductive frame 13 are arranged in the second direction 202 of the direction 201. The second direction 202 in this embodiment is the vertical first direction 201, but it is not limited thereto.

In this embodiment, the two first conductive frames 11 and 14 are located between the two sides 101, and a first die bonding region 110 is disposed between each of the first conductive frames 11 and 14 and any of the second conductive frames 12, 140, in other words, each of the first conductive frames 11, 14 is adjacent to any one of the ends of any of the second conductive frames 12 to provide the first die attach regions 110, 140. Further, a first conductive frame 11 includes a first body 111 extending in the first direction 201 and a first protrusion 113 and a branch segment 112 protruding toward the other first conductive frame 14 . The other first conductive frame 14 includes a first body 114 extending in the first direction 201 and a second protrusion 143 and a branch 142 protruding toward the other first conductive frame 11 . That is, if the first protruding portion 113 extends in a direction opposite to the second direction 202, the second protruding portion 143 extends along the second direction 202. Therefore, the second conductive frame 12 is interposed between the first protruding portion 113 and the second protruding portion 143.

Each of the second conductive frames 12 includes two second conductive frame units 121 arranged along the first direction 201. Each of the second conductive units 121 has two end points, such as a first end point and a second end point, one of which One end of the second conductive frame unit 121 (such as the first end point) is adjacent to a first protruding portion 113 of the first conductive frame 11 and provides a first solid crystal region 110 therebetween, and the other second conductive frame unit One end of the 121 (such as the second end) is adjacent to a first protrusion 143 of the other first conductive frame 14 and provides another first solid crystal area 140 therebetween; in addition, a second solid is further provided. The crystal region 120 is between the adjacent second conductive frame units 121, that is, between the second end of one of the second conductive frame units 121 and the first end of the other second conductive frame unit 121 .

In this embodiment, each of the conductive frame assemblies 1 includes three sets of second conductive frames 12 and two third conductive frames 13 , wherein each third conductive frame 13 is interposed between each two adjacent second conductive frames Between 12 and respectively connected to the branch segments 112, 142 of the first conductive frame, in more detail, each of the third conductive frames 13 includes a first direction 201 extending and two ends respectively and two first conductive frames a third body 131 connected to the branch segments 112 and 142 of the 11 and 14 and a first protrusion 132 and a first portion protruding from the two ends of the third body 131 toward the two first conductive frames 11 and 14 respectively Two tabs 133.

The first set of second conductive frames 12 are located between the first protruding portion 113 of the first conductive frame 11 and the first protruding piece 132 of one of the third conductive frames 13, and the second set of second conductive frames 12 are in position. Between the second protrusion 143 of the first conductive frame 14 and the second protrusion 133 of one of the third conductive frames 13, the third group of second conductive frames 12 is located at one of the third conductive frames 13 A tab 132 is interposed between the second tab 133 of the other third conductive frame 13.

In addition, the second conductive frame units 121 arranged along the second direction 202, the first conductive frames 11 and 14 and the third conductive frames 13 are fixed through the plurality of connecting segments 15 .

Referring to FIGS. 2, 3, and 4, the insulative housing 3 is molded in an in-mold injection molding manner on each of the conductive frame assemblies 1 of the conductive strip 100, and The two sides 101 are exposed, and the insulating housing 3 is formed with a plurality of recesses 31. The recesses 31 are respectively exposed to the first solid crystal regions 110, 140 and the second solid crystal regions 120.

After the insulating housing 3 is formed on each of the conductive frames 1 of the conductive strip 100, the connecting segments 15 on both sides of each of the second conductive frames 13 are punched out, and the third body 131 of each of the third conductive frames 13 is removed. The connection with the second tab 133 is also washed out, or the third body 131 and the second tab 133 may be initially disposed in a non-connected manner.

Referring to FIG. 3, FIG. 4, FIG. 5, FIG. 6, each of the illuminating crystal grains AI has two electrode contacts 21, wherein one of the electrode contacts 21 passes through the metal wires 22 and the first protruding portion 113 and the second convex portion where they are located. The sheet 133 or the second conductive frame 121 is electrically connected, and the other electrode contact 21 is electrically connected to the other end of the second conductive frame 121 or the second protruding portion 143 and the first protruding piece 132 adjacent to the metal wire 22 The three rows of the light-emitting dies AC, DF, and GI are in a parallel relationship, and the three rows of the light-emitting dies AC, DF, and GI are in a parallel relationship.

Referring to FIG. 1 and FIG. 7 , after the light-emitting dies 2 are disposed, the light-transmissive colloid 4 can be filled in the recesses 31 and the illuminating dies 2 are encapsulated. Then, the conductive strips 100 are assembled. The device is cut in units of each of the conductive frames 1 and the sides 101 of the two sides are removed to form a separate LED module as shown in FIG. Of course, taking the aspect of FIG. 7 as an example, it is also possible to remove only the sides 101 of the two sides, so that the two sets of the LED modules are formed in parallel.

In addition, in the conductive frame sheet 100 of the present invention, along the second The number of the second conductive frame 12 arranged in the direction and the number of the second conductive frame units 121 arranged along the first direction 201 of each of the second conductive frames 12 can be adjusted according to the actual application, and are not in this embodiment. The shape of the die cutting is limited. For example, referring to FIG. 8, another embodiment of the conductive frame assembly 1' of the present invention is also connected between the two sides 101 and includes two first conductive frames 11', 14' and two second conductive frames. 12', wherein the first conductive frame 11' includes a first body 111' extending in the first direction 201 and a first protrusion protruding from the first body 111' toward the other first conductive frame 14' The first conductive frame 14' includes a first body 141' extending in the first direction 201 and a second protrusion protruding from the first body 141' toward the other first conductive frame 11'. The second conductive frame 12' of the upper portion 142' is arranged along the second direction 202 and interposed between the first protruding portion 111' and the second protruding portion 141' of the two first conductive frames 11', 14', and each A first die attach region 110' is provided between a first conductive frame 11' and one end of each of the second conductive frames 12'. Therefore, the conductive die combination 1' is used to set the light emitting die to 2 ×2 arrangement.

In summary, the present invention utilizes the combination of the conductive frame to replace the printed circuit of the circuit board to guide the illuminating crystal grains, thereby solving the problem that the illuminating crystal grains are difficult to align and difficult to process, and the transmission is changed in the second direction. The number of groups of the second conductive frame arranged and the number of the second conductive frame units of each set of the second conductive frame arranged in the first direction may also change the conductive frame provided for different numbers of light-emitting dies to manufacture The surface light sources of different sizes are used, so that the object of the present invention can be achieved.

However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the patent application according to the present invention The scope of the invention and the equivalent equivalents and modifications of the invention are still within the scope of the invention.

1, 1'‧‧‧ Conductive frame combination

100‧‧‧ Conductive frame strip

101‧‧‧

11, 14‧‧‧ first conductive frame

110‧‧‧First solid crystal zone

111‧‧‧First Ontology

112‧‧‧ branch

113‧‧‧First bulge

11', 14'‧‧‧ first conductive frame

111’‧‧‧First Ontology

141’‧‧‧First Ontology

112’‧‧‧First bulge

142’‧‧‧second bulge

12‧‧‧Second conductive frame

120‧‧‧Second solid crystal zone

121‧‧‧Second conductive frame unit

13‧‧‧ Third Conductor

131‧‧‧ Third ontology

132‧‧‧First tab

133‧‧‧second tab

140‧‧‧First solid crystal zone

141‧‧‧ Ontology

142‧‧‧ branch

143‧‧‧second bulge

15‧‧‧ Connection section

A-I‧‧‧Lighting grain

201‧‧‧First direction

202‧‧‧second direction

21‧‧‧Electrode contacts

22‧‧‧Metal wire

3‧‧‧Insulated housing

31‧‧‧ recess

4‧‧‧Translucent adhesive

1 is a perspective view of a preferred embodiment of a light emitting diode module in accordance with the present invention; FIG. 2 is a perspective view of a conductive frame strip in accordance with the present invention; FIG. 3 is a partial plan view of FIG. FIG. 5 is a perspective view of a preferred embodiment of the preferred embodiment of FIG. 4; FIG. 6 is a partial enlarged view of FIG. 5; FIG. It is a perspective view of the preferred embodiment of Fig. 5 in which the light transmissive colloid is disposed; and Fig. 8 is another embodiment of the conductive frame assembly of the present invention.

1. . . Conductive frame

101. . . Material edge

3. . . Insulating housing

4. . . Light transmissive glue

Claims (26)

A conductive frame strip comprising: a plurality of conductive frame combinations, each conductive frame combination comprising two first conductive frames spaced apart from each other and extending along a first direction, each of the first conductive frames having a first direction extending a first body; at least two second conductive frames spaced apart from each other and arranged between the two first conductive frames in a second direction different from the first direction, each of the first conductive frames and any second A first die bonding region is disposed between the conductive frames; and two edges spaced apart from each other and extending along the first direction, the conductive frames being coupled between the edges. The conductive strip according to claim 1, wherein each second conductive frame comprises at least two second conductive frame units arranged along the first direction, and a second conductive frame unit is provided between the two The second solid crystal region. The conductive strip according to claim 1 or 2, wherein one of the first conductive frames has a first protruding portion and the other first conductive frame has a second protruding portion, the first The second conductive frame is between the first protruding portion and the second protruding portion. According to the conductive strip of claim 3, wherein a first conductive frame provides the first solid crystal region between the first protruding portion and each of the second conductive frames, and the other The first conductive frame provides another first die bonding region between the second protruding portion and each of the second conductive frames. The conductive frame strip according to item 1 or 2 of the patent application scope is further included The at least one third conductive frame is disposed, and the third conductive frame is located between the second conductive frames. The conductive rack tape according to claim 5, wherein the third conductive frame is arranged in parallel with the first conductive frames. The conductive frame strip of claim 5, wherein the first conductive frame further has a branching section extending from the first body, and the other first conductive frame further has a first body extending from the first body Out of the branch segment. The lead frame strip according to claim 3, further comprising at least one third conductive frame, the third conductive frame having a third body and protruding from the third body toward the two first conductive frames respectively a first tab and a second tab, wherein a second conductive frame is interposed between the first protrusion of the first conductive frame and the first protrusion of the third conductive frame, and the second The conductive frame is interposed between the second protrusion of the first conductive frame and the second protrusion of the third conductive frame. The invention relates to a combination of a conductive strip and an insulating shell, comprising: a conductive strip, comprising a plurality of conductive frame combinations, each conductive frame combination comprising two first conductive frames spaced apart from each other and extending in a first direction, The second conductive frame is connected to the external power source, and the at least two second conductive frames are arranged between the two first conductive frames in a second direction different from the first direction, and each of the first conductive frames and any second conductive frame Providing a first solid crystal region therebetween; and a plurality of insulating shells respectively coupled to the conductive frame combinations, and each An insulative housing has a plurality of recesses, and the first die attaching region of each of the conductive frame combinations is exposed by one of the recesses of the insulating housing. The combination of the conductive strip and the insulating case according to claim 9 , wherein each of the second conductive frames comprises at least two second conductive frame units arranged along the first direction, the two second conductive A second die bonding region is provided between the frame units, and the first die bonding regions and the second die bonding regions are respectively exposed by the holes. The combination of the conductive strip and the insulating case according to claim 9 or 10, wherein one of the first conductive frames has a first protruding portion and the other first conductive frame has a second convex portion. The second conductive frame is interposed between the first protruding portion and the second protruding portion. The combination of the conductive strip and the insulating case according to claim 11 , wherein a first conductive frame provides the first between the first protruding portion and each of the second conductive frames In the die bonding region, another first conductive frame provides another first die bonding region between the second protruding portion and each of the second conductive frames. The combination of the conductive strip and the insulating case according to claim 9 or 10 further includes at least one third conductive frame, the third conductive frame being located between the second conductive frames. The combination of the conductive strip and the insulating case according to claim 13 , wherein the third conductive frame is arranged in parallel with the first conductive frames. The combination of the conductive strip and the insulating case according to claim 13 , wherein one of the first conductive frames has a first direction An extended first body and a branch segment extending from the first body, the other first conductive frame has a first body extending in the first direction and a branch segment extending from the first body. The combination of the lead frame strip and the insulating case according to claim 11 further includes at least one third conductive frame, the third conductive frame has a third body and the third body faces the two a first protrusion and a second protrusion protruding from the first conductive frame, wherein a second conductive frame is interposed between the first protrusion of the first conductive frame and the first protrusion of the third conductive frame Meanwhile, another second conductive frame is interposed between the second protrusion of the first conductive frame and the second protrusion of the third conductive frame. The combination of the conductive strip and the insulating case according to claim 9 or 10, wherein the conductive strip further comprises two edges extending along the first direction, the two first conductive frames Between the two sides of the material. A light emitting diode module includes: a conductive frame assembly including two first conductive frames spaced apart from each other and extending in a first direction for connecting an external power source, and at least two second conductive frames, along a different Arranging between the two first conductive frames in a second direction of the first direction, a first die bonding region is provided between each first conductive frame and any second conductive frame; and an insulating housing is disposed. Combined with the conductive frame assembly, and the insulating housing has a plurality of recesses, each of the first solid crystal regions being exposed by one of the recesses; The plurality of luminescent crystal grains are provided with a luminescent crystal grain in each of the first solid crystal regions. The illuminating diode module of claim 18, wherein each second conductive frame comprises at least two second conductive frame units arranged along the first direction, between the second conductive frame units Providing a second solid crystal region, wherein the first solid crystal regions and the second solid crystal regions are respectively exposed by the recesses, and the light emitting crystal grains are respectively disposed in the first solid crystal regions and the first The two solid crystal regions are located in the recesses. The illuminating diode module of claim 18 or 19, wherein one of the first conductive frames has a first protruding portion and the other first conductive frame has a second protruding portion. The second conductive frame is interposed between the first protruding portion and the second protruding portion. According to the illuminating diode module of claim 20, wherein the first conductive frame provides the first die bonding region between the first protruding portion and each of the second conductive frames, Another first conductive frame provides another first die bonding region between the second protruding portion and each of the second conductive frames. The LED module of claim 18 or 19, further comprising at least one third conductive frame, the third conductive frame being located between the second conductive frames. The illuminating diode module according to claim 22, wherein the third conductive frame is arranged in parallel with the first conductive frames. The illuminating diode module of claim 22, wherein one of the first conductive frames has a first body extending along the first direction and a branching portion extending from the first body. Another first conductive The frame has a first body extending in the first direction and a branching section extending from the first body. The illuminating diode module of claim 20, further comprising at least one third conductive frame, the third conductive frame having a third body and the third body respectively facing the two first conductive frames a first protruding piece and a second protruding piece, wherein a second conductive frame is interposed between the first protruding portion of the first conductive frame and the first protruding piece of the third conductive frame, and the other The second conductive frame is interposed between the second protrusion of the first conductive frame and the second protrusion of the third conductive frame. The light-emitting diode module according to claim 18 or 19, further comprising two material edges extending in the first direction, the two first conductive frames being interposed between the two material edges.