TWI550227B - Light-emitting module and method of manufacturing a single light-emitting structure thereof - Google Patents

Description

Light-emitting module and manufacturing method thereof

The invention relates to a method for manufacturing a light-emitting module and a single light-emitting structure thereof, in particular to a thin-type light-emitting module and a method for manufacturing the same.

As for the comparison between the light-emitting diode (LED) and the conventional light source, the light-emitting diode has the advantages of small volume, power saving, good luminous efficiency, long life, fast operation response, and no pollution of toxic substances such as heat radiation and mercury. . Therefore, in recent years, the application of light-emitting diodes has been extremely extensive. In response to the trend of thinner products, more and more thin LEDs are demanding, and the applicable end products include mobile phone indicators, keyboard backlights, and the like. In the PCB structure used in the conventional SMD type LED, the conductive layer on the front side of the PCB and the soldering pad on the reverse side of the PCB need to be turned on by using a through hole formed on the side of the PCB, such as the Taiwan Patent Publication No. A semiconductor light emitting device disclosed in TW200849675. However, since the conductive layer on the front side of the PCB is directly extended from the bonding wire bonding region and connected to the through hole, moisture or solder easily invades the solid crystal bonding region along the conductive layer, resulting in a decrease in product reliability. In addition, when a through hole is formed on the side of the PCB, the PCB has a certain thickness limit, which increases the thickness of the PCB, and cannot meet the thin design requirements of the customer. Moreover, the traditional PCB structure used in the design, there will be waste between each two sets of SMD type LEDs, not only the waste of the production materials, but also the SMD form of LED and waste coexist, need to be artificial The way of screening separates the LED from the waste.

A lighting module provided by one embodiment of the present invention includes Two identical light emitting structures, each of which includes: a base unit, a conductive unit, a light emitting unit, and a package unit. The conductive unit includes n electrical conductors that are separated from each other and extend through the base unit, wherein n is greater than one. The light emitting unit is electrically connected to the n conductive bodies. The package unit includes a light transmissive package disposed on the base unit to cover the conductive unit and the light emitting unit. Wherein the two light emitting structures are disposed on the same plane, wherein one of the light emitting structures is rotated by 180 degrees on the plane with respect to the other one of the light emitting structures, and the two light emitting structures are connected to each other. Wherein each of the light emitting structures has a first side end and a second side end opposite to the first side end, wherein n of the ones of the light emitting structures are along the first side end Arranging sequentially toward the second side end and sequentially defining the first, second, third, ..., n in accordance with the order of the difference, and n of the other conductors of the light emitting structure along the The second side end is sequentially arranged in the direction of the first side end and is sequentially defined as the nth, ..., 3, 2, 1 according to the order of the difference, and the first one of the light emitting structures 2, 3, ..., n of the electrical conductors are respectively connected to the nth, ..., 3, 2, 1 of the electrical conductors of the other of the light emitting structures.

A light-emitting module according to another embodiment of the present invention includes two identical light-emitting structures, wherein each of the light-emitting structures includes a base unit, a conductive unit, a light-emitting unit, and a package unit. The conductive unit includes n electrical conductors that are separated from each other and extend through the base unit, wherein n is greater than one. The light emitting unit includes at least one light emitting diode die electrically connected between at least two of the electrical conductors. The package unit includes a light transmissive package disposed on the base unit to cover the conductive unit and the light emitting unit. Wherein two of the light-emitting structures are arranged On the same plane, one of the light-emitting structures is rotated 180 degrees on the plane relative to the other of the light-emitting structures, and the two light-emitting structures are connected to each other. Wherein each of the light emitting structures has a first side end and a second side end opposite to the first side end, and n of the electrical conductors of each of the light emitting structures are along the first side end Arranging sequentially toward the second side end and sequentially defining the first, second, third, ..., n, and the nth of the electrical conductors of the one of the light emitting structures and the other of the light emitting The nth of the conductors of the structure are connected to each other.

A method for fabricating a single light emitting structure according to still another embodiment of the present invention includes the following steps: First, a light emitting module is provided, wherein the light emitting module has at least two connected and identical light emitting structures, each of which The light emitting structure has a base unit and at least one side through hole extending through a side of the base unit, and at least one of the side through holes is provided with an electric conductor, wherein at least one of the light emitting structures The side through-holes are connected to and disposed opposite to at least one of the side through-holes of the other of the light-emitting structures such that two of the conductors of the at least two of the light-emitting structures are connected to each other; Cutting the light emitting module at a common cutting line between at least two of the side through holes of at least two of the light emitting structures to separate at least two of the light emitting structures, wherein each of the light emitting structures It is the single light emitting structure.

The light-emitting module provided by the embodiment of the present invention may be configured to transmit "one of the light-emitting structures on the plane with respect to another one of the light-emitting structures by 180 degrees, and two The light-emitting structures are connected to each other, and the conductive unit of the present invention is designed with the concept of a common side through-hole, so that there is no waste generated between the two light-emitting structures, so the present invention can effectively reduce the base unit and conduct electricity. unit Material cost with package unit. Furthermore, since there is no waste generated between the two light-emitting structures, the two light-emitting structures can be separated by cutting the light-emitting module along a common cutting line between the two light-emitting structures, so the present invention It also eliminates the traditional screening time derived from the need to separate the waste.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

Referring to FIG. 1A to FIG. 2B , FIG. 1A and FIG. 1B are respectively perspective views of different viewing angles of the light-emitting module M before cutting, and FIG. 2A and FIG. 2B are respectively three-dimensional views of different viewing angles after the cutting of the light-emitting module M. Decomposition diagram.

First, after the light-emitting module M is cut along the common cutting line L1 shown in FIG. 1A and FIG. 1B, the light-emitting module M forms two light-emitting structures S separated from each other and having the same size and shape (see FIG. 2A and FIG. 2A). Figure 2B)). Each of the light-emitting structures S includes a base unit 1, a conductive unit 2, a light-emitting unit 3, and a package unit 4. Each of the light-emitting structures S has a first side end S101 and a back side of the first side end S101. The second side end S102, wherein the first side end S101 and the second side end S102 are respectively side end faces of two opposite short sides of the light emitting structure S. In addition, the conductive unit 2 includes n conductors 20 separated from each other and penetrating the base unit 1, wherein n is a positive integer and greater than 1. The light emitting unit 3 includes a plurality of light emitting diode crystal grains 30, wherein each of the light emitting diode crystal grains 30 is electrically connected to at least two of the n electric conductors 20. The package unit 4 includes a light transmissive package 40 disposed on the base unit 1 to cover the conductive unit 2 and the light emitting unit 3.

Furthermore, when the light-emitting module M has not been cut along the common cutting line L1 so that the two light-emitting structures S are still connected to each other (as shown in FIGS. 1A and 1B, the two light-emitting structures S respectively In the case where the side faces of one of the long sides are connected to each other), it is assumed that the two light-emitting structures S are simultaneously disposed on the same plane P, wherein one of the light-emitting structures S can be rotated 180 degrees on the plane P with respect to the other one of the light-emitting structures S Corresponding relationship, and the first side end S101 and the second side end S102 of one of the light emitting structures S are respectively connectable to the second side end S102 and the first side end S101 of the other one of the light emitting structures S, respectively, such that one of the light emitting structures The face of the first side end S101 of S is coplanar with the face of the second side end S102 of the other light emitting structure S. At this time, the two base units 1 of the two light-emitting structures S are also in a state of being connected to each other, and the two conductive units 2 of the two light-emitting structures S are also in a state of being connected to each other, and two of the two light-emitting structures S are transparent. The light package bodies 40 are also in a state of being connected to each other to form a single package member 40'.

Furthermore, the base unit 1 of each of the light-emitting structures S includes a first substrate 11 , a second substrate 12 , and a substrate connection layer 13 connected between the first substrate 11 and the second substrate 12 . Therefore, in the case where the two light emitting structures S appear to be connected to each other, the two first substrates 11 of the two light emitting structures S are connected to each other to form a single first substrate member 11', two second of the two light emitting structures S The substrates 12 are connected to each other to form a single second substrate member 12', and the two substrate connection layers 13 of the two light emitting structures S are connected to each other to form a single substrate connecting member 13'. In addition, the n conductors 20 of one of the light-emitting structures S are sequentially arranged along the first side end S101 toward the second side end S102, and are sequentially defined as the first order according to the tolerance level of 1. 2, 3, ..., n, and another glow The n conductors 20 of the structure S are sequentially arranged along the second side end S102 toward the first side end S101, and are sequentially defined as nth, ..., 3 according to a tolerance level of -1. 2, 1 . Therefore, in the case where the two light emitting structures S are connected to each other, the first, second, third, ..., n conductors 20 of one of the light emitting structures S are respectively connected to the nth, ..., 3 of the other light emitting structure S. 2, 1 conductor 20.

In other words, in the case where the light-emitting module M has not been cut so that the two light-emitting structures S are still connected to each other (as shown in FIGS. 1A and 1B), since the two light-emitting structures S are presented to each other on the same setting plane P Rotating the corresponding relationship of 180 degrees, so looking at the common cutting line L1 shown in FIG. 1A and FIG. 1B (that is, looking at the common cutting line L1 as a relative reference line), the two light emitting structures S can be rendered upside down And the opposite relationship between the left and right, wherein the front-rear direction is the extending direction of the short side of the light-emitting structure S, and the left-right direction is the extending direction of the long side of the light-emitting structure S.

In summary, since the two base units 1 of the two light-emitting structures S are connected to each other, the two conductive units 2 of the two light-emitting structures S are connected to each other, and the two package units 4 of the two light-emitting structures S are connected to each other. Therefore, there is no waste generated between the two light-emitting structures S. Therefore, the present invention can effectively reduce the material cost of the base unit 1, the conductive unit 2, and the package unit 4. Furthermore, since there is no waste generated between the two light-emitting structures S, the two light-emitting structures S can be performed by cutting the light-emitting module M along the common cutting line L1 shown in FIG. 1A and FIG. 1B. Separation, therefore, the present invention can also eliminate the traditional screening time of "light-emitting structure and waste separation" derived from the separation of waste materials. In addition, when the light-emitting structure S needs to be mass-produced, the plurality of light-emitting modules M may be arranged in an array or a matrix, and since each of the two light-emitting modules M is also connected to each other, each two-emitting There is also no waste generated between the optical modules M, so the material cost of the base unit 1, the conductive unit 2 and the packaging unit 4 can be effectively reduced, and the conventional "light-emitting structure and derivation due to the separation of waste materials can be omitted. Screening time for waste separation.

Please refer to FIG. 3A and FIG. 3B , which are respectively a schematic perspective view and a top view of the package unit 4 in FIG. 1A .

As shown in FIG. 2A, FIG. 3A and FIG. 3B, each of the electrical conductors 20 includes a die pad 200 disposed on the top end of the first substrate 11 of the base unit 1, wherein the first and second portions of one of the light-emitting structures S are provided. , 3, ..., the die pads 200 of the n conductors 20 are separated from the die pads 200 of the nth, ..., 3, 2, and 1 conductors 20 of the other light emitting structure S, respectively, and each The LED die 30 is electrically connected between the two die pads 200 of the two corresponding conductors 20. In addition, since the light-transmissive package 40 is disposed on the top end of the first substrate 11 of the base unit 1 to completely close the die pad 200, the die pad 200 is not exposed outside the light-transmitting package 40, and thus The invention can avoid the possibility that water vapor may infiltrate into the functional area or the wiring area of the light-emitting structure S along the grain pad 200, thereby increasing product reliability. In FIG. 2A, the light transmissive package 40 is designed in a rectangular structure to completely enclose the die pad 200, but the invention is not limited thereto. For example, the present invention can also design the light transmissive package 40 to completely enclose the lens structure of the die pad 200 according to different optical considerations.

First, for example, the present invention uses three light-emitting diode dies 30, which may be in the form of a vertical wafer (one electrode on the upper and lower surfaces, respectively) of a red LED die 30R, in the form of a horizontal wafer (the upper surface has two Electrode) green LED die 30G, and blue LED die 30B in horizontal wafer form, wherein blue LED die 30B and green LED die 30G are The top surface of the first substrate 11 of the base unit 1 is disposed, and the red LED die 30R is disposed on the die pad 200 of the corresponding electrical conductor 20. Furthermore, since the blue LED die 30B and the green LED die 30G are directly disposed on the top end of the first substrate 11 of the base unit 1, the present invention can be omitted for manufacturing blue LED crystals. The extra space required for the carrying pad of the pellet 30B and the green LED die 30G is to achieve a thinned design, and the die pad 200 of the present invention is retracted from the edge of the first substrate 11 by a specific distance, or may be completely The risk of "short-circuiting of the exposed load-bearing pads and the solder-pads 201 due to the bias-bearing pads" is avoided. Taking FIG. 3A as an example, the arrangement of the light-emitting diode crystal grains 30 of one light-emitting structure S is 30B, 30R, 30G, and the arrangement of the light-emitting diode crystal grains 30 of another light-emitting structure S rotated by 180 degrees is determined. The order is 30G, 30R, 30B, wherein the grain pad 200 of one light-emitting structure S is arranged from left to right in the order of 200A, 200B, 200C, 200D, and the other is rotated by 180 degrees. The arrangement order of 200 from left to right is 200D, 200C, 200B, 200A, that is, the above-mentioned two light-emitting structures S may be presented with a reverse relationship and a left-right opposite relationship with each other. It should be noted that the blue LED die 30B is further rotated by 90 degrees compared with the green LED die 30G to be disposed at the top end of the first substrate 11. In addition to effectively shortening the length of the light emitting structure S, the blue LED crystal is also convenient. The pellet 30B is easily wire bonded to the die and the pad 200C, and does not affect product reliability because the first wire W1 intersects the third wire W3.

Moreover, for example, the present invention uses four die pads 200, which may be a first negative pad 200A, a second negative pad 200B, a positive pad 200C, and a third negative pad 200D, respectively. The blue LED die 30B can be electrically connected to the first negative electrode through two first wires W1. Between the pad 200A and the positive pad 200C. The green LED die 30G can be electrically connected between the third negative pad 200D and the positive pad 200C through the two second wires W2. The bottom electrode of the red LED die 30R can directly electrically contact the positive pad 200C, and the top electrode of the red LED die 30R can be electrically connected to the second negative pad 200B through a third wire W3. Further, the base unit 1 has a center line L2 (shown in FIG. 3B) connected between the opposite side ends, and the blue LED die 30B and the green LED disposed on the top end of the first substrate 11 The center point C1 of the die 30G may be disposed on the center line L2, and the center point C2 of the red LED die 30R disposed on the die pad 200 may be offset from the center line L2 by a predetermined distance d, wherein d is preferably 15% of the width of a single light-emitting structure, but the invention is not limited thereto. Therefore, when the red LED die 30R is electrically connected to the second negative pad 200B through the third wire W3, since the center point C2 of the red LED die 30R is off the center line L2 by a predetermined distance d, the third The wire W3 does not collide with the first wire W1 electrically connected between the blue LED die 30B and the positive pad 200C to effectively reduce the possibility of short circuit. Furthermore, the center point C2 of the red LED die 30R is offset from the center line L2 by a predetermined distance d in a direction away from the solder pad 201, so when applied to the red LED die 30R, silver paste (not shown) In the case of exposure, because the exposed side of the silver glue has a relationship with the solder pad 201, the tin pad 201 does not have a "short circuit due to contact with the silver glue" after the tin is eaten. .

Please refer to FIG. 4A to FIG. 6B , wherein FIG. 4A and FIG. 4B are respectively a schematic perspective view and a top view of the light emitting unit and the die pad of FIG. 3A and FIG. 3B respectively, and FIG. 5A and FIG. 5B respectively. Stereoscopic illustration after removing the first connecting portion 2021 and the first substrate 11 in FIGS. 4A and 4B FIG. 6A and FIG. 6B are respectively a schematic perspective view and a top view of the second connecting portion 2022 and the substrate connecting layer 13 of the conductive connecting layer 202 in FIGS. 5A and 5B.

As shown in FIG. 4A to FIG. 6B, each of the electrical conductors 20 includes a soldering pad 201 exposed from the bottom end of the base unit 1 and disposed on the side ends and the bottom end of the second substrate 12 (FIG. 6A). The conductive connection layer 202 (shown in FIG. 4A to FIG. 5B) is connected to the die pad 200 and the solder pad 201 as shown in FIG. 6B.

First, as shown in FIG. 4A and FIG. 5A, the conductive connection layer 202 has a first connection portion 2021 connected to the die pad 200 and penetrating through the first substrate 11, and a connection between the first connection portion 2021 and the solder pad. A second connecting portion 2022 between the 201 and through the substrate connecting layer 13. Further, as shown in FIG. 4B and FIG. 5B, the first connection portion 2021 of the conductive connection layer 202 of the first, second, third, ..., nth conductors 20 of one of the light-emitting structures S respectively emits light with another one. The first connection portions 2021 of the conductive connection layer 202 of the nth, ..., 3, 2, and 1 conductors 20 of the structure S are separated from each other, and the first, second, third, ..., n of one of the light-emitting structures S are electrically conductive The second connecting portion 2022 of the conductive connecting layer 202 of the body 20 is respectively connected to the second connecting portion 2022 of the conductive connecting layer 202 of the nth, ..., 3, 2, and 1 electrical conductors 20 of the other light emitting structure S. In addition, as shown in FIG. 4B and FIG. 5B, in order to allow the first connecting portion 2021 to effectively contact the second connecting portion 2022 within a predetermined error range, in particular, the second connecting portion 2022 is closer to the first connecting portion. An arcuate convex portion 20220 that expands outward in a direction away from the first connecting portion 2021 is designed at the periphery of the 2021.

Furthermore, as shown in FIG. 6A and FIG. 6B, the soldering pads 201 of the first, second, third, ..., n conductors 20 of one of the light-emitting structures S are respectively connected. The solder pads 201 of the nth, ..., 3, 2, and 1 conductors 20 of the other light emitting structure S are respectively formed to form a plurality of single solder members 201'. In addition, as shown in FIG. 6B, in order to enable the soldering pad 201 of each of the light emitting structures S to have a large tin-wearing area, the tin soldering pad 201 covers at least a range of more than 1 from the top view. /4 circles to avoid when the single piece is placed (that is, when the two light-emitting structures S are separated by cutting), the tin is poor due to the cutting error.

As can be seen from the above description, the light-emitting structure S is designed to rotate 180 degrees on the plane P with respect to the other light-emitting structure S such that the side through-holes of the two light-emitting structures S are connected to form a circle or a 1/2 circle. The electrical conductors on the through-holes (ie, the solder pads 201) are designed to be connected to each other such that no waste is generated between the two light-emitting structures S, which increases the utilization of the base unit 1. It should be noted that the base unit 1 is not limited to the form of the above two-layer board (that is, the double-layer board formed by pressing the first substrate 11 and the second substrate 12), and may also be in the form of a single-layer board ( That is, the front surface of the base unit 1 has a die pad 200, and the side surface and the back surface of the base unit 1 have a solder pad 201), so that only one of the two light-emitting structures S connected to each other is rotated 180. The embodiment in which the side through-holes of the two light-emitting structures S are connected to each other is a category to be protected by the present invention.

Regarding the light-emitting structure S using a single-layer board, for example, as shown in FIGS. 7A to 7C, the conductive unit 2 includes at least two electric conductors 20 separated from each other and penetrating the base unit 1, and each of the electric conductors 20 includes a die pad 200 disposed on the top end of the base unit 1 and two tins connected to the die pad 200 and extending from the through hole formed at the side end of the base unit 1 to the bottom end of the base unit 1 Solder pad 201. The light unit 3 includes at least The light emitting diode die 30 is electrically connected between the two conductors 20, and the light emitting diode die 30 is electrically connected between the two die pads 200 of the two conductors 20. The package unit 4 includes a light transmissive package 40 disposed on the base unit 1 to cover the conductive unit 2 and the light emitting unit 3, and the light transmissive package 40 is disposed on the top end of the base unit 1 to enclose the die pad 200. .

Further, when the two light emitting structures S are disposed on the same plane P, one of the light emitting structures S is rotated by 180 degrees on the plane P with respect to the other one of the light emitting structures S, and the two light emitting structures S are connected to each other. In addition, each of the light emitting structures S has a first side end S101 and a second side end S102 facing away from the first side end S101. The at least two electric conductors 20 of each of the light emitting structures S can be along the first side end S101. The second electrical conductors 20 of one of the light-emitting structures S and the second electrical conductors 20 of the other one of the light-emitting structures S are connected to each other in the order of the second side end S102 and sequentially defined as the first and second ones. At this time, as shown in FIG. 7B, the two second side ends S102 of the two light emitting structures S are in a state of being connected to each other (of course, it is also possible to design, in which the first electric conductor 20 of one of the light emitting structures S and the other one The first conductors 20 of the light-emitting structure S are connected to each other, in which case the two first side ends S101 of the two light-emitting structures S are connected to each other, and the two base units 1 of the two light-emitting structures S are connected to each other. In addition, the die pads 200 of the two light emitting structures S are mirror images of each other with reference to the common cutting line L. When the light-emitting module M is cut along the common cutting line L1 shown in FIG. 7A, the light-emitting module M forms two light-emitting structures S separated from each other and having the same size and shape (as shown in FIG. 7C). In this embodiment, two adjacent and identical light emitting structures S share the through holes in the short sides to improve the utilization of the base unit 1. Due to two identical light-emitting structures S phase The adjacent setting eliminates the screening time for separating the waste and the light-emitting structure S. The above is an example of two electrical conductors, but is not limited thereto. For example, the number of the conductors may be n, and the nth conductor 20 of one of the light emitting structures S and the nth conductor 20 of the other light emitting structure S are connected to each other.

The light-emitting structure S of the present invention is adjacent to each other and disposed opposite to each other, and the light-emitting module M is formed by sharing the through-holes with the long side or the short side of the light-emitting structure S. Therefore, as long as the two light emitting structures S are separated along the long side or the short side of the common through hole, no waste is generated between the two light emitting structures S. In addition, the common through-hole design of the present invention can be applied not only to a single-layer board but also to a multi-layer board, which can improve the utilization rate of the board.

Still further, the present invention further provides a manufacturing method for fabricating a single light emitting structure S, which is applicable to the fabrication of a light emitting structure S using a single layer or a double layer. For example, in conjunction with FIG. 1A and FIG. 1B, a light-emitting module M is provided, which includes at least two identical and connected light-emitting structures S, at least two of which are illuminated. The structures S are arranged on the same plane P, and one of the light-emitting structures S is rotated by 180 degrees on the plane P with respect to the other one. In addition, each of the light emitting structures S has at least one side through hole 100 penetrating the side of the base unit 1 , and the side through hole 100 is provided with a conductor 20 (that is, the conductive unit 2 shown in FIG. 1A and FIG. 1B ). The side through-holes 100 of one of the light-emitting structures S are connected to and disposed opposite to the side through-holes 100 of the other light-emitting structure S, so that the two conductors 20 of the two light-emitting structures S are connected to each other; then, with FIG. 2A As shown in FIG. 2B, the light-emitting module M is cut along the common cutting line L1 shown in FIGS. 1A and 1B (that is, along a common cutting line formed between the two side through-holes 100 of the light-emitting structure S). L1 to cut the light module M) to separate at least two lights The structure S, wherein at least two of the light-emitting structures S are formed by the cutting step to simultaneously form two mutually corresponding cutting faces W (that is, two mutually formed naturally after cutting the light-emitting module M along the common cutting line L1) Corresponding cutting faces W), and each of the light emitting structures S is a single light emitting structure.

In addition, the light-emitting structure S using a single-layer board is taken as an example. First, as shown in FIG. 7A and FIG. 7B, a light-emitting module M is provided, which includes at least two identical and connected light-emitting structures S, at least two of which are at least two. The light emitting structures S are disposed on the same plane P, and one of the light emitting structures S is rotated by 180 degrees on the plane P with respect to the other one of the light emitting structures S. In addition, each of the light emitting structures S has at least one side through hole 100 penetrating the side of the base unit 1. The side through hole 100 is provided with a conductor 20, and one side of the light emitting structure S passes through the hole 100 and another The side through-holes 100 of the light-emitting structure S are connected and disposed oppositely to connect the two conductors 20 of the two light-emitting structures S to each other; and then, as shown in FIG. 7C, along the common cut shown in FIGS. 7A and 7B The line L1 cuts the light-emitting module M (that is, cuts the light-emitting module M along a common cutting line L1 formed between the two side through-holes 100 of the light-emitting structure S) to separate at least two light-emitting structures S, At least two of the light emitting structures S are formed by the cutting step to simultaneously form two cutting faces W corresponding to each other, and each of the light emitting structures S is a single light emitting structure.

In summary, the present invention has at least the following advantages:

1. Since the front surface of the base unit 1 is not provided with any through holes formed on the side of the conventional PCB, the first substrate 11 and the second substrate 12 are pressed together to simultaneously embed the conductive connection layer. 202 and the double-layer board design of the soldering pad 201, so the invention can effectively reduce the overall thickness of the light-emitting module M, thereby achieving thinning the design of.

2. Since the plurality of die pads 200 of the conductor 20 are completely covered by the package unit 4 (for example, a light-transmissive resin or a light-transmissive silicone), the present invention can effectively reduce the path of moisture intrusion into the die pad 200. To increase the reliability of the product.

3. Since the blue LED die 30B and the green LED die 30G are directly disposed on the top end of the first substrate 11 of the base unit 1, the present invention can eliminate the extra space required for manufacturing the load pad. The thinned design is achieved, and the die pad 200 of the present invention is shrunk from the edge of the first substrate 11 by a certain distance, and the exposed load pad and the soldering solder which are exposed due to the bias-bearing pad can be completely avoided. The risk of the pad 201 creating a short circuit.

4. Since the center point C2 of the red LED die 30R is slightly offset from the center line L2 by a predetermined distance d, when the silver paste applied to the red LED die 30R is exposed, the exposed side of the silver paste is For the relationship of eating the solder pad 201, the solder pad 201 does not have a "short circuit due to contact with the silver paste" after the tin is eaten.

5. Since there is no waste generated between the two light-emitting structures S, the present invention can effectively reduce the material cost, and can also eliminate the traditional screening time for deriving the "light-emitting structure and waste separation" due to the separation of waste materials.

6. According to the above design, the length, width and height of the single light-emitting structure S of the present invention can be approximately 3.0 mm, 0.4 mm and 1.0 mm, respectively. It is worth noting that the present invention successfully reduces the width of the light-emitting structure S to 0.4 mm to meet the demand for thinned LEDs. because Therefore, the single light emitting structure S provided by the present invention can be further applied to a mobile phone indicator light, a keyboard backlight, or an ultra-thin notebook (Ultrabook).

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.

M‧‧‧Lighting Module

S‧‧‧Lighting structure

S101‧‧‧ first side

S102‧‧‧ second side

1‧‧‧Base unit

11‧‧‧First substrate

11'‧‧‧First substrate member

12‧‧‧second substrate

12'‧‧‧Second substrate member

13‧‧‧Substrate connection layer

13'‧‧‧Substrate connection member

100‧‧‧ side through hole

2‧‧‧Conducting unit

20‧‧‧Electric conductor

200‧‧‧die pad

200A‧‧‧First negative electrode pad

200B‧‧‧second negative electrode pad

200C‧‧‧ positive electrode pad

200D‧‧‧third negative electrode pad

201‧‧‧eat solder pads

201'‧‧‧ eat tin components

202‧‧‧Electrically conductive layer

2021‧‧‧First connection

2022‧‧‧Second connection

20220‧‧‧arc convex

3‧‧‧Lighting unit

30‧‧‧Light-emitting diode grains

30R‧‧‧Red LED die

30G‧‧‧Green LED die

30B‧‧‧Blue LED die

W1‧‧‧First wire

W2‧‧‧second wire

W3‧‧‧ third wire

4‧‧‧Package unit

40‧‧‧Light Transmissive Encapsulation

40'‧‧‧Packaged components

P‧‧‧ plane

L1‧‧‧Common cutting line

L2‧‧‧ center line

C1, C2‧‧‧ center point

d‧‧‧Predetermined distance

W‧‧‧cut surface

1A is a perspective view of one of the viewing angles of the light-emitting module of the present invention before being cut along a common cutting line.

FIG. 1B is a perspective view of another viewing angle of the light-emitting module of the present invention before cutting along a common cutting line.

2A is a perspective view showing one of the viewing angles of the light-emitting module of the present invention after being cut along a common cutting line.

2B is a perspective view showing another viewing angle of the light-emitting module of the present invention after being cut along a common cutting line.

FIG. 3A is a perspective view of the package unit of FIG. 1A after the invention is removed.

FIG. 3B is a top view of the package unit of FIG. 1A after the invention is removed.

4A is a perspective view of the present invention after removing the light emitting unit and the die pad of FIG. 3A.

4B is a top plan view of the present invention after removing the light emitting unit and the die pad of FIG. 3B.

FIG. 5A is a perspective view of the first connecting portion and the first substrate of FIG. 4A after the present invention is removed.

FIG. 5B is a top view of the first connecting portion of FIG. 4B after the first substrate is removed according to the present invention.

FIG. 6A is a view showing the second connection portion and the substrate connection layer in FIG. 5A being moved according to the present invention; A three-dimensional diagram after the removal.

FIG. 6B is a top view of the second connection portion and the substrate connection layer in FIG. 5B after the invention is removed.

7A is a perspective view showing one of the viewing angles of another light-emitting module before cutting along a common cutting line according to the present invention.

FIG. 7B is a top view of the package unit of FIG. 7A after the invention is removed.

7C is a perspective view showing one of the viewing angles of another illuminating module cut along a common cutting line according to the present invention.

M‧‧‧Lighting Module

S‧‧‧Lighting structure

S101‧‧‧ first side

S102‧‧‧ second side

1‧‧‧Base unit

11‧‧‧First substrate

12‧‧‧second substrate

13‧‧‧Substrate connection layer

100‧‧‧ side through hole

2‧‧‧Conducting unit

20‧‧‧Electric conductor

3‧‧‧Lighting unit

30‧‧‧Light-emitting diode grains

4‧‧‧Package unit

40‧‧‧Light Transmissive Encapsulation

W‧‧‧cut surface

Claims (13)

A light-emitting module comprising two identical light-emitting structures, wherein the two light-emitting structures have a common cutting line, wherein each of the light-emitting structures comprises: a base unit; a conductive unit, the conductive unit comprises n conductors separated from each other and penetrating through the base unit, wherein n is greater than 1; an illumination unit, the illumination unit is electrically connected to n of the conductors; and a package unit, the package unit includes a a light transmissive package disposed on the base unit to cover the conductive unit and the light emitting unit; wherein the two light emitting structures are disposed on a same plane, wherein one of the light emitting structures is on the plane Rotating 180 degrees with respect to the common cutting line, and the two light emitting structures are connected to each other; wherein each of the light emitting structures has a first side end and a second side end facing away from the first side end, The n conductors of the one of the light-emitting structures are sequentially arranged along the first side end toward the second side end and are sequentially defined as the first, second, third, and third-order, according to the order of the difference. ..., n The n said conductors of the other light emitting structure are sequentially arranged along the second side end toward the first side end and are sequentially defined as nth, ..., 3 according to an order of difference. 2, 1 and one of the first, second, third, ..., n conductors of the light-emitting structure are respectively connected to the nth, ..., 3, 2, 1 of the other light-emitting structure An electrical conductor; wherein two of the light emitting structures are formed by the common cutting line The first light emitting structure and the second light emitting structure are separated and have the same size and shape. The light emitting module of claim 1, wherein the first side end and the second side end of one of the light emitting structures are respectively connected to the second one of the other light emitting structures a side end and the first side end. The illuminating module of claim 1, wherein each of the electrical conductors comprises a die pad disposed on a top end of the base unit, and an outer end of the base unit is exposed a soldering pad, and a conductive connection layer connected between the die pad and the solder pad, the light emitting unit comprising at least one light emitting diode die, at least one of the light emitting diodes The bulk crystal is electrically connected between the two die pads of at least two of the n conductors, and the light transmissive package is disposed at a top end of the base unit Upper to close the die pad. The light-emitting module of claim 3, wherein the die pads of the first, second, third, ..., n of the ones of the light-emitting structures are respectively associated with another The die pads of the nth, ..., 3, 2, 1st conductors of the light emitting structure are separated from each other, and the first, 2, 3, ..., n of one of the light emitting structures The soldering pads of the electrical conductors are respectively connected to the soldering pads of the nth, ..., 3, 2, and 1 of the electrical conductors of the other of the light emitting structures. The illuminating module of claim 3, wherein the conductive connecting layer has a first connecting portion connected to the die pad and embedded in the base unit, and a connecting portion a second connecting portion between the first connecting portion and the soldering pad. The lighting module of claim 5, wherein the second The connecting portion has an arcuate convex portion that expands outward in a direction away from the first connecting portion, closer to a periphery of the first connecting portion. The illuminating module of claim 5, wherein the base unit comprises a first substrate and a second substrate connected to the first substrate through a substrate connecting layer, the die bonding a pad is disposed on a top end of the first substrate, the soldering pad is simultaneously disposed on a side end and a bottom end of the second substrate, and the first connecting portion of the conductive connecting layer penetrates the first a substrate, and the second connection portion of the conductive connection layer penetrates the substrate connection layer. The illuminating module of claim 7, wherein the illuminating unit comprises a plurality of illuminating diode dies, and the plurality of illuminating diode dies are respectively a red LED dies and a green LED dies. And a blue LED die, wherein two of the light emitting diode dies are disposed on a top end of the first substrate of the base unit, and another one of the light emitting diode dies is disposed at a corresponding one The die pad of the electrical conductor. The light emitting module of claim 8, wherein the base unit has a center line connected between the opposite side ends, and is disposed on a top end of the first substrate of the base unit The center point of two of the light-emitting diode crystal grains is disposed on the center line, and another one of the light-emitting diode crystal grains disposed on the corresponding die pad of the electric conductor The center point is offset from the centerline by a predetermined distance. A light-emitting module comprising two identical light-emitting structures, wherein the two identical light-emitting structures have a common cutting line, each of the light-emitting structures comprising: a base unit; a conductive unit, the conductive unit Including n separate from each other An electrical conductor of the susceptor unit, wherein n is greater than 1; an illuminating unit comprising at least one illuminating diode die electrically connected between at least two of the electrical conductors; and a packaging unit, The package unit includes a light transmissive package disposed on the base unit to cover the conductive unit and the light emitting unit; wherein the two light emitting structures are disposed on a same plane, one of the light emitting The structure is rotated 180 degrees relative to the common cutting line on the plane, and the two light emitting structures are connected to each other; wherein each of the light emitting structures has a first side end and a back side to the first side a second side end of the end, wherein the n conductors of each of the light emitting structures are sequentially arranged along the first side end toward the second side end and are sequentially defined as 1, 2, and 3 And n, and the nth said electrical conductor of one of said light emitting structures is connected to said nth said electrical conductor of said another of said light emitting structures; wherein said two said light emitting structures are The common cutting line is divided to form two Separated from each other and the same size as the shape of a first light emitting structure and a second light emitting structure. The light emitting module of claim 10, wherein each of the electrical conductors comprises a die pad disposed on a top end of the base unit and two wires connected to the die pad a soldering pad extending from a side end of the base unit to a bottom end of the base unit, at least one of the light emitting diodes being electrically connected to two of the two of the conductors Between the pad pads, and the light transmissive package is disposed on a top end of the base unit to enclose the die pad. A method of manufacturing a single light emitting structure, comprising the steps of: Providing a light emitting module, the light emitting module having at least two connected and identical light emitting structures, each of the light emitting structures having a base unit and at least one side through hole penetrating through a side of the base unit, At least one of the side through holes is provided with an electric conductor, and at least one of the side through holes of one of the light emitting structures is connected to and opposite to at least one of the side through holes of the other of the light emitting structures. Having the two conductors of the at least two of the light emitting structures connected to each other; and cutting along a common cutting line formed between at least two of the side through holes of the at least two of the light emitting structures The illuminating module is configured to separate at least two of the illuminating structures, wherein each of the illuminating structures is the single illuminating structure. The method for manufacturing a single light-emitting structure according to claim 12, wherein in the step of providing the light-emitting module, at least two of the light-emitting structures are disposed on a same plane, and one of the light-emitting structures Rotating 180 degrees relative to the other of the illumination structures on the plane.