TWI544664B - Light-emitting package structure and method of fabricating the same - Google Patents

Description

Illuminated package structure and its preparation method

The present invention relates to a semiconductor package, and more particularly to an illuminable package.

With the rapid development of the electronics industry, electronic products tend to be light, thin and short in terms of type, and gradually become a high-performance, high-function, high-speed research and development direction in terms of functions. Among them, the Light Emitting Diode (LED) has the advantages of long life, small size, high shock resistance and low power consumption, so it is widely used in electronic products requiring illumination, and therefore, industrially, The application of various electronic products and home appliances is becoming more and more popular.

Figure 1 is a cross-sectional view showing a conventional LED package. The LED package 1 is formed with a reflective cup 11 on a substrate 10, and the reflective cup 11 has an opening 110, and an LED element 12 is disposed in the opening 110, and the LED element 12 is electrically connected by using a plurality of wires 120. The substrate 10 is further covered with the encapsulant 13 having a phosphor layer.

However, in the conventional LED package 1, since the phosphor powder layer is close to the LED element 12, and the phosphor powder layer is dispersed in the encapsulant 13, the heat dissipation capability is poor, and for high-power LEDs, colloidal yellowing and firefly often occur. Light powder is heated Problems such as lowering luminous efficiency.

Therefore, how to overcome the problems in the prior art has become a problem that is currently being solved.

In view of the above-mentioned deficiencies of the prior art, the present invention provides an illuminating package structure, comprising: an covering body having opposite first and second surfaces; at least one illuminating element embedded in the covering body The light-emitting element has a light-emitting side and a heat-dissipating side, wherein the light-emitting side is exposed on the first surface of the covering body, and the heat-dissipating side is on the same side as the second surface of the covering body; at least one dam body is Embedded in the coating body, the dam is exposed to the first surface of the coating body; at least one conductive element is connected to the light emitting side of the light emitting element and the dam; and the fluorescent layer is formed on The first surface of the covering body covers the light emitting side of the light emitting element and the conductive element.

The invention provides a method for manufacturing a package structure, comprising: combining at least one light-emitting element and at least one dam body on a carrier member, and the light-emitting element has a light-emitting side coupled to the carrier member and a heat-dissipating side opposite to the light-emitting side Forming a covering body on the carrier member to cause the covering body to cover the light emitting element and the dam body, and the covering body is defined to be coupled to the first surface of the carrier member and opposite to the first surface a second surface, the heat dissipation side of the light emitting element is on the same side as the second surface of the covering body; the carrier is removed to expose the light emitting side of the light emitting element and the first surface of the dam to the covering body a surface; connecting at least one conductive element to the light emitting side of the light emitting element and the dam; and forming a phosphor layer on the first surface of the covering body to cover the light emitting side of the light emitting element and the conductive element.

It can be seen that the illuminating package structure of the present invention and the method for manufacturing the same are formed on the first surface of the covering body, so that heat generated by the luminescent layer can pass through the conductive element and the dam body. It is transmitted to the outside to avoid the yellowing of the silicone (or the coating layer), and the fluorescent layer does not cover the light-emitting element, so that the thermal decay problem caused by the heat generation of the light-emitting element can be avoided, thereby improving the luminous efficiency.

Furthermore, since the light-emitting element has the heat-dissipating side, the heat can be directly discharged, so that the light-emitting efficiency can be improved.

1‧‧‧LED package

10‧‧‧Substrate

11‧‧‧Reflection Cup

110‧‧‧ openings

12‧‧‧LED components

120‧‧‧ wire

13‧‧‧Package colloid

2‧‧‧Lighting package structure

20‧‧‧Carrier

21‧‧‧Lighting elements

21'‧‧‧Substrate

21a‧‧‧Lighting side

21b, 21b’‧‧‧ heat side

210‧‧‧metal layer

211‧‧‧electrode

22‧‧‧ dam body

22a‧‧‧ bottom side

22b‧‧‧ External junction

22c‧‧‧ side

220‧‧‧electrode

23‧‧‧ Covering body

23a‧‧‧ first surface

23b‧‧‧ second surface

230‧‧‧ trench

24‧‧‧Conducting components

25‧‧‧Fluorescent layer

250‧‧‧Fluorescent particles

26, 26'‧‧‧ heat sink

27‧‧‧reflective layer

28‧‧‧Transparent layer

330‧‧‧Opening

D‧‧‧ area

S, L‧‧‧ cutting path

W‧‧‧ gap

1 is a cross-sectional view of a conventional LED package; FIGS. 2A to 2H are cross-sectional views showing a method of fabricating the light-emitting package structure of the present invention; wherein the 2A' is a single state of FIG. 2A; The 2C' and 2C" diagrams are different embodiments of FIG. 2C; the 2E' diagram is a bottom view of FIG. 2E; the 2G' and 2G" diagrams are different embodiments of the 2G diagram; and 3A to 3C is a schematic cross-sectional view showing another embodiment of the method of fabricating the light-emitting package structure of the present invention; wherein the 3C' diagram is another mode of FIG. 3C.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings of the present specification are only used in conjunction with the contents disclosed in the specification to familiarize themselves with the art. The understanding and reading of the person is not intended to limit the conditions for the implementation of the present invention, and therefore does not have technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size may not be affected by the present invention. The efficacies and the achievable objectives should still fall within the scope of the technical content disclosed in the present invention. In the meantime, the terms "upper", "lower", "bottom", "first", "second" and "one" as used in this specification are also for convenience of description, not for The scope of the invention can be implemented, and the relative changes or adjustments of the invention are considered to be within the scope of the invention.

2A to 2H are schematic cross-sectional views showing the manufacturing method of the light-emitting package structure 2 of the present invention.

As shown in Figs. 2A and 2A', a substrate 21' having a metal layer 210 composed of a plurality of light-emitting elements 21 is provided.

In the present embodiment, a single light-emitting element 21 is obtained via a singulation process, such as the cutting path L shown in FIG. 2A.

In this embodiment, the light-emitting element 21 is a light-emitting diode having a light-emitting side 21a having a plurality of electrodes 211 on the light-emitting side 21a, and the metal layer 210 serves as a heat-dissipating side 21b of the light-emitting element 21. The heat radiating side 21b is opposed to the light emitting side 21a.

As shown in FIG. 2B, a plurality of the light-emitting elements 21 are bonded to a carrier 20 with their light-emitting sides 21a, and a plurality of dams 22 are bonded to the carrier 20.

In the present embodiment, since the processes around the respective light-emitting elements 21 are the same, only a single light-emitting element 21 is illustrated for convenience of explanation.

Further, the carrier 20 has a wide variety of styles, such as a release film, and the like, and is not particularly limited.

Moreover, the dam 22 is a circuit board, a lead frame or a conductor; when the dam 22 is a lead frame, the side 22c thereof is electrically isolated.

In addition, the dam body 22 has a section that is wide and narrow, and is tapered toward the carrier 20 so that the side surface 22c of the dam body 22 serves as a reflecting surface for reflecting the light-emitting element 21. Light.

As shown in FIG. 2C, a covering body 23 is formed on the carrier 20 such that the covering body 23 covers the light emitting element 21 and the dam body 22, and the covering body 23 is defined to be bonded thereto. The first surface 23a of the carrier 20 and the second surface 23b opposite to the first surface 23a are such that the heat-dissipating side 21b of the light-emitting element 21 is on the same side as the second surface 23b of the covering body 23.

In this embodiment, the heat dissipating side 21b of the illuminating element 21 is exposed on the second surface 23b of the covering body 23. For example, the heat dissipating side 21b of the illuminating element 21 and the second surface 23b of the covering body 23 The dam body 22 is not exposed to the second surface 23b of the covering body 23.

Furthermore, the covering body 23 is a silicone rubber, such as a transparent silicone rubber; generally, a rubber material remains on the heat dissipation side 21b of the optical component 21, and the residual rubber material needs to be removed.

In addition, in other embodiments, the dam body 22 may also be exposed on the second surface 23b of the covering body 23. As shown in FIG. 2C', the upper surface of the dam body 22 (ie, the outer connecting surface 22b) is The second surface 23b of the covering body 23 is flush. Alternatively, as shown in FIG. 2C′′, the heat dissipation side 21b of the light-emitting element 21 and the dam body 22 are not exposed on the second surface 23b of the coating body 23, at this time, The covering body 23 is preferably made of white silicone to reflect the light emitted by the light-emitting element 21.

In addition, the exposed manner may also be performed on the second surface 23b of the covering body 23 to expose the heat radiating side 21b or the dam 22 of the light emitting element 21, as shown in FIG. 3B.

As shown in FIG. 2D, the carrier 20 is removed such that the light emitting side 21a of the light emitting element 21 and the bottom side 22a of the dam 22 are exposed on the first surface 23a of the covering body 23.

As shown in FIG. 2E, the plurality of conductive elements 24 are electrically connected to the electrode 211 of the light-emitting side 21a of the light-emitting element 21 and the bottom side 22a of the dam 22.

In this embodiment, the conductive member 24 is a lead leg of the lead frame, which is disposed on the first surface 23a of the covering body 23. In other embodiments, the conductive member 24 can be a wire, such as a wire bonding process. Used for welding wire. Alternatively, the conductive element 24 can be a conductive paste such as silver paste or copper paste to facilitate process and cost.

Regarding the use of conductive adhesive, the conventional LED component uses a wire as a conductive component. As shown in FIG. 1, if a conventional LED component uses a conductive adhesive as a conductive component, the conductive adhesive may overflow to the side electrode of the LED component (P or The N-pole) causes the upper surface electrode (P or N-pole) to be electrically connected to the side electrode, and causes the P-pole and the N-pole to be short-circuited. Therefore, the conventional method does not use the conductive paste as the conductive element.

In contrast, in the method of the present invention, the P-electrode of the light-emitting element 21 is electrically insulated from the N-pole by first covering the side of the light-emitting element 21 with the covering body 23, so that the conductive paste is subsequently formed on the coating. On the first surface 23a of the body 23 When the conductive paste does not contact the side electrode (such as P or N pole) of the light-emitting element 21, short-circuiting between the electrode 211 and the side electrode (ie, the P-pole and the N-pole) can be avoided.

Furthermore, as shown in FIG. 2E', a trench 230 is formed on the first surface 23a of the covering body 23 to facilitate subsequent processes. The structure of FIG. 2E is shown in FIG. 2E'. Area D.

As shown in FIG. 2F, a phosphor layer 25 is formed on the first surface 23a of the covering body 23 to cover the light emitting side 21a of the light emitting element 21 and the conductive member 24.

In this embodiment, the material of the phosphor layer 25 is injected into the trench 230 to cover the light emitting side 21a of the light emitting element 21 and the conductive element 24 along the trench 230, and the trench 230 The phosphor layer 25 can be used as an electrical barrier.

Further, when the conductive member 24 is a wire, the phosphor layer 25 is formed by an electrostatic adsorption method.

In addition, the phosphor layer 25 can be thinned as needed.

As shown in FIG. 2G, a heat sink 26 is formed on the second surface 23b of the covering body 23.

In the embodiment, the heat sink 26 contacts the heat dissipation side 21b of the light emitting element 21, and the heat sink 26 is made of a metal material, and the metal heat dissipation layer can be formed by coating, plating, deposition, or the like.

Furthermore, when the dam body 22 is exposed on the second surface 23b of the covering body 23, the dam body 22 has an external side 22b exposed on the second surface 23b of the covering body 23, so that the external side 22b Forming electrode 220 thereon, such as 2G' As shown in the figure, the heat sink 26' is formed on the heat dissipation side 21b of the light emitting element 21. At this time, a gap w is formed between the electrode 220 and the heat sink 26'. Therefore, a light reflecting layer 27 can be formed thereon. The gap w between the heat sink 26' and the electrode 220 is as shown in FIG. 2G", wherein the material of the light reflecting layer 27 is different from the material of the heat sink 26' and the material of the electrode 220.

Further, the electrode 220 is made of a metal material and can be produced together with the heat sink 26'.

As shown in FIG. 2H, a protective layer (not shown) for protecting the phosphor layer 25 or a light-transmitting layer 28 such as a lens is formed on the phosphor layer 25, as shown in FIG. 2G. The cutting path S performs a cutting operation to produce a plurality of light-emitting package structures 2.

Further, after the cladding body 23 is formed, the heat dissipation side 21b of the light-emitting element 21 may be formed, as shown in Figs. 3A to 3C.

As shown in FIGS. 3A and 3B, a plurality of openings 330 are formed in the second surface 23b of the covering body 23, and the upper surface of the light-emitting element 21 and the outer side 22b of the dam 22 are exposed.

As shown in FIG. 3C, the electrode 220 and the metal layer 210 are formed in the openings 330, and the metal layer 210 serves as the heat dissipation side 21b of the light-emitting element 21.

Alternatively, in the process modification of FIGS. 2A to 2C, as shown in FIG. 3C', the upper surface of the light-emitting element 21 is flush with the second surface 23b of the covering body 23, so that the light-emitting element 21 is above. The surface is exposed on the second surface 23b of the covering body 23, so that the upper surface of the light-emitting element 21 directly serves as the heat-dissipating side 21b' without forming the metal layer 210.

Wherein, the outer side 22b of the dam body 22 can be selectively exposed and the Electrode 220.

In summary, the present invention forms the heat dissipation side 21b on one side of the light emitting element 21, and the dam body 22 is disposed around the light emitting chip 21, so that the dam body 22 is exposed to the first of the covering body 23. The surface 23a is further contacted by the conductive element 24 to contact the light-emitting side 21a of the light-emitting element 21 and the bottom side 22a of the dam 22 to form a fluorescent layer 25 formed on the first surface 23a of the covering body 23. Heat can be transmitted to the outside through the conductive member 24 and the dam 22 to avoid yellowing of the covering body 23, and to maintain the luminous efficiency of the fluorescent layer 25, and the fluorescent layer 25 does not cover the light emitting element. 21, thereby avoiding the problem of thermal decay caused by the heat generation of the light-emitting element 21, so that the luminous efficiency can be improved.

Furthermore, since the light-emitting element 21 has the heat-dissipating side 21b, the light-emitting element 21 can directly discharge heat to improve luminous efficiency.

Moreover, in one embodiment, the dam 22 and its electrode 220 can also serve as a heat dissipation path.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2‧‧‧Lighting package structure

21‧‧‧Lighting elements

21a‧‧‧Lighting side

21b‧‧‧heat side

210‧‧‧metal layer

211‧‧‧electrode

22‧‧‧ dam body

23‧‧‧ Covering body

23a‧‧‧ first surface

23b‧‧‧ second surface

24‧‧‧Conducting components

25‧‧‧Fluorescent layer

26‧‧‧ Heat sink

28‧‧‧Transparent layer

Claims (43)

An illuminating package structure includes: an covering body having opposite first and second surfaces; at least one illuminating element embedded in the covering body, the illuminating element having opposite light emitting sides and heat dissipation a side, the light emitting side is exposed on the first surface of the covering body, and the heat dissipating side is on the same side as the second surface of the covering body; at least one dam body is embedded in the covering body, so that The dam is exposed on the first surface of the covering body; at least one conductive element is connected to the light emitting side of the light emitting element and the dam body; and a fluorescent layer is formed on the first surface of the covering body to Covering the light emitting side of the light emitting element and the conductive element. The illuminating package structure of claim 1, wherein the illuminating element is a light emitting diode. The illuminating package structure of claim 1, wherein the heat dissipating side of the illuminating element is exposed on the second surface of the covering body. The illuminating package structure of claim 1, wherein the heat dissipating side of the illuminating element is flush with the second surface of the covering body. The illuminating package structure of claim 1, wherein the illuminating element has a metal layer on the surface to serve as the heat dissipating side. The illuminating package structure of claim 1, wherein the dam system is exposed on the second surface of the covering body. The illuminating package structure according to claim 1, wherein The surface of the dam is flush with the second surface of the cladding. The illuminating package structure of claim 6 or claim 7, wherein the dam body has an external side exposed on a second surface of the covering body, and the external side has an electrode thereon. The illuminating package structure according to claim 8 further comprising a heat dissipating body formed on a heat dissipating side of the illuminating element. The illuminating package structure of claim 9, comprising a reflective layer formed between the heat sink and the electrode. The illuminating package structure of claim 1, wherein the dam system is a circuit board, a lead frame or a conductor. The illuminating package structure of claim 1, wherein the width of the dam is tapered toward the first surface of the covering body such that the side of the dam body serves as a reflecting surface. The illuminating package structure of claim 1, wherein the coating system is silicone. The illuminating package structure of claim 1, wherein the first surface of the covering body has a groove, and the fluorescent layer is partially located in the groove. The illuminating package structure of claim 1, wherein the conductive element is a wire or a lead frame. The illuminating package structure of claim 1, wherein the conductive element is a conductive paste. The illuminating package structure of claim 1, wherein the phosphor layer has a plurality of fluorescent particles, and the fluorescent particles are concentrated. On one side of the phosphor layer. The illuminating package structure according to claim 1, further comprising a heat dissipating body formed on the second surface of the covering body. The illuminating package structure of claim 18, wherein the heat sink contacts the heat dissipating side of the illuminating element. The illuminating package structure according to claim 1, further comprising a protective layer or a light transmissive layer formed on the luminescent layer. The method for manufacturing an illuminating package structure comprises: combining at least one illuminating element and at least one dam body on a carrier member, and the illuminating element has a light emitting side coupled to the illuminating side of the carrier member and a heat dissipating side opposite to the illuminating side; Coating the cover on the carrier to cover the light-emitting component and the dam, and the cover defines a first surface bonded to the carrier and a second surface opposite to the first surface a surface, the heat-dissipating side of the light-emitting element is on the same side as the second surface of the covering body; the carrier is removed to expose the light-emitting side of the light-emitting element and the dam body to the first surface of the covering body; And connecting at least one conductive element to the light emitting side of the light emitting element and the dam; and forming a fluorescent layer on the first surface of the covering body to cover the light emitting side of the light emitting element and the conductive element. The method of fabricating an illuminating package structure according to claim 21, wherein the illuminating element is a light emitting diode. The system of the illuminating package structure as described in claim 21 of the patent application scope The method, wherein the heat dissipation side of the light emitting element is exposed on the second surface of the covering body. The method of fabricating an illuminating package structure according to claim 21, wherein the heat dissipating side of the illuminating element is flush with the second surface of the covering body. The method of manufacturing the illuminating package structure according to claim 21, wherein before the illuminating element is coupled to the carrier, a metal layer is formed on the surface of the illuminating element to form the heat dissipating side. The method of manufacturing the illuminating package structure according to claim 21, wherein after forming the covering body, forming a surface on the second surface of the covering body to expose the surface of the illuminating element, A metal layer is formed in the opening to become the heat dissipation side. The method of fabricating an illuminating package structure according to claim 21, wherein the dam system is exposed on the second surface of the covering body. The method of manufacturing the illuminating package structure according to claim 21, wherein the surface of the dam body is flush with the second surface of the covering body. The method of fabricating an illuminating package structure according to claim 27, wherein the dam has an external side exposed on a second surface of the covering body to form an electrode on the circumscribed side. The method for manufacturing an illuminating package structure according to claim 29, further comprising forming a heat dissipating body on a heat dissipating side of the illuminating element. The method for manufacturing an illuminating package structure according to claim 30, further comprising forming a light reflecting layer between the heat sink and the electrode. The system of the illuminating package structure as described in claim 21 of the patent application scope The method wherein the dam system is a circuit board, a lead frame or a conductor. The method of manufacturing the illuminating package structure according to claim 21, wherein the width of the dam body is tapered toward the first surface of the covering body such that the side surface of the dam body serves as a reflecting surface. The method of manufacturing the illuminating package structure according to claim 21, wherein the coating system is silicone. The method of manufacturing the illuminating package structure according to claim 21, wherein the first surface of the covering body is formed with a groove so that the luminescent layer covers the illuminating element along the groove The light emitting side and the conductive element. The method of fabricating an illuminating package structure according to claim 21, wherein the conductive element is a wire or a lead frame. The method for manufacturing an illuminating package structure according to claim 21, wherein the conductive member is a conductive paste. The method of fabricating an illuminating package structure according to claim 21, wherein the luminescent layer is formed by an electrostatic adsorption method. The method of manufacturing the illuminating package structure according to claim 21, wherein the luminescent layer has a plurality of luminescent particles, and the luminescent particles are concentrated on one side of the luminescent layer. The method of fabricating an illuminating package structure according to claim 21, further comprising thinning the phosphor layer. The method for fabricating an illuminating package structure according to claim 21, further comprising forming a heat dissipating body on the second surface of the covering body. The system of the illuminating package structure as described in claim 41 of the patent application scope The method, wherein the heat sink contacts the heat dissipation side of the light emitting element. The method for manufacturing an illuminating package structure according to claim 21, further comprising forming a protective layer or a light transmitting layer on the luminescent layer.