TW201431113A - LED module - Google Patents

Abstract

An LED module includes a base, a chip and a circuit. The base includes a first face and a second face facing a direction different from that of the first face. The chip is mounted on the first face of the base. The circuit is formed on the second face of the base. A conductive pathway extends through the first face and the second face to conduct the chip with the circuit. The LED module can prevent the circuit from absorbing light from the chip, thereby increasing light emitting efficiency of the LED module. A method for manufacturing the LED module is also disclosed.

Description

Light-emitting diode module

The invention relates to a diode module, in particular to a light emitting diode module and a manufacturing method thereof.

As an emerging light source, light-emitting diodes have been widely used in various applications. The heat emitted by the LED during operation is an important factor that limits its luminous efficiency. Currently, in order to improve the heat dissipation efficiency of the light-emitting diode, the industry has developed a so-called wafer on board, which is to directly bond the wafer to the circuit board to reduce the heat transfer path. However, since the circuit pattern of the wafer is conductively formed on the surface of the printed circuit board, the circuit pattern (especially the plastic insulating material for patterning the circuit) absorbs light emitted from the light emitting chip, thereby reducing Overall light output efficiency.

Therefore, it is necessary to provide a light-emitting diode module with high luminous efficiency and a method of manufacturing the same.

A light emitting diode module includes a base, a light emitting chip and a circuit. The base includes a first surface and a second surface facing the first surface. The light emitting chip is mounted on the first surface of the base, and the circuit is disposed on the first surface On the second surface of the susceptor, the luminescent wafer is electrically connected to the circuit by a conductive path extending through the first surface and the second surface.

A method of manufacturing a light emitting diode module, comprising: providing a pedestal, the pedestal comprising a first surface and a second surface facing the first surface; the conductive path extending through the first surface and the second surface is formed in the pedestal a reflective cup is formed on the first surface of the base, and a circuit communicating with the conductive path is attached on the second surface of the base; the light emitting chip is mounted on the first surface of the base, so that the light emitting chip is received in the reflective cup and The conductive path is turned on.

The light-emitting diode module adopts the light-emitting chip and the circuit respectively disposed on two different surfaces of the base to realize spatial separation of the light-emitting chip and the circuit. Thereby, the light emitted by the light-emitting chip can be directly emitted from the first surface of the pedestal without being absorbed by the circuit located on the second surface, thereby improving the light-emitting efficiency of the light-emitting diode module.

10. . . Light-emitting diode module

20. . . heat sink

200. . . Groove

202. . . Cavity

twenty two. . . Substrate

220. . . Top surface

222. . . Bottom

twenty four. . . Side wall

240. . . Inner side

242. . . Outer side

26. . . Reflective cup

260. . . Inner circumference

262. . . Outer circumferential surface

28. . . Pedestal

30. . . electrode

40. . . Circuit

50. . . Conductive path

60. . . Light emitting chip

70. . . Package

80. . . The protective layer

90. . . Insulation

1 shows a first step of fabricating a light emitting diode module in accordance with an embodiment of the present invention.

2 is a cross-sectional view of the heat sink of FIG. 1.

FIG. 3 shows a second step of fabricating a light emitting diode module in accordance with an embodiment of the present invention.

Figure 4 is a cross-sectional view of the semi-finished product of Figure 3.

Figure 5 is a partial plan view of the semi-finished product of Figure 3.

Fig. 6 shows a third step of fabricating a light emitting diode module in accordance with an embodiment of the present invention.

Figure 7 is a cross-sectional view of the semi-finished product of Figure 6.

Figure 8 is a partial plan view of the semi-finished product of Figure 6.

Figure 9 shows a fabricated LED module.

10 is a cross-sectional view of the light emitting diode module of FIG. 9.

FIG. 11 is a cross-sectional view of a light emitting diode module according to another embodiment of the present invention.

Referring to FIG. 1-10, a method for manufacturing a light-emitting diode module 10 according to an embodiment of the present invention is shown, which mainly includes the following steps:

First, as shown in Figures 1-2, a heat sink 20 is provided. The heat sink 20 includes a base 28 and a plurality of reflective cups 26 on the base 28. The susceptor 28 is composed of a substrate 22 and two side walls 24 extending downward from opposite sides of the substrate 22. In this embodiment, the heat sink 20 is made of a heat conductive and insulating material such as ceramic, and the base 28 is integrally formed with the reflective cup 26. The substrate 22 has an elongated shape and includes a top surface 220 and a bottom surface 222 opposite the top surface 220. The inner side surface 240 of the two side walls 24 and the bottom surface 222 of the substrate 22 are collectively formed to form an elongated groove 200. These reflector cups 26 are aligned in alignment with the top surface 220 of the substrate 22. Each of the reflector cups 26 has a circular shape, and an inner peripheral surface 260 thereof and a top surface 220 of the substrate 22 are collectively formed to form a circular cavity 202. Preferably, the diameter of the cavity 202 of each of the reflector cups 26 is gradually reduced from top to bottom for better light reflection.

Then, as shown in FIGS. 3-5, a plurality of electrodes 30 and a circuit 40 are formed on the top surface 220 and the bottom surface 222 of the substrate 22, respectively. In this embodiment, a pair of separate electrodes 30 are disposed in each of the reflective cups 26. Each pair of electrodes 30 are arranged along the length direction of the substrate 22, and the two electrodes 30 are separated by a gap. The circuit 40 is attached to the bottom surface 222 of the substrate 22 along the longitudinal direction of the substrate 22. The length of the circuit 40 is slightly shorter than the length of the substrate 22 and is disposed directly below each pair of electrodes 30. The width of the circuit 40 is less than the width of the substrate 22 and is equal to the outer diameter of the reflective cup 26. The length of the electrode 30 is less than the width of the circuit 40. The thickness of the circuit 40 is the same as the thickness of the electrode 30 and is smaller than the height of the side wall 24 and the reflective cup 26. Thereby, the circuit 40 is completely housed in the recess 200, and the electrode 30 is completely housed in the cavity 202. Each pair of electrodes 30 is electrically connected to the circuit 40 through two conductive paths 50 through the substrate 22 (only one conductive path 50 is shown). In the present embodiment, the conductive path 50 is formed by first drilling a hole on the substrate 22 and then filling the hole with a conductive material. It will be appreciated that when the substrate 22 is fabricated from a ceramic material, the conductive paths 50 may also be formed by lamination of low temperature co-firing ceramic techniques. The circuit 40 and the electrode 30 can be formed on the substrate 22 by printing, evaporation, or the like to obtain a specific pattern.

Thereafter, as shown in FIGS. 6-8, the light-emitting wafer 60 is mounted in each of the reflective cups 26 and filled in the package 70. In this embodiment, the illuminating wafer 60 is flip-chip, and its two electrodes (not shown) are respectively fixed to the top surface of the pair of electrodes 30 by a conductive paste (not shown) or other conductive material. Thereby, current can be input from the circuit 40 into the light-emitting wafer 60 via the conductive path 50 and the electrode 30, thereby driving the light-emitting wafer 60 to emit light. The luminescent wafer 60 is fabricated from a semiconductor luminescent material, such as gallium nitride, indium gallium nitride, aluminum indium gallium nitride, or the like, which is excited by a current to emit light of a particular color. The package body 70 is made of a transparent material such as epoxy resin, silicone rubber or the like. The package 70 fills the cavity 202 of each of the reflective cups 26 to cover the luminescent wafer 60 to prevent the luminescent wafer 60 from directly contacting the external environment. Preferably, the package body 70 may be further doped with phosphor powder (not shown) to change the color of the light emitted by the light-emitting chip 60. Since the light-emitting chip 60 is disposed on the top surface 220 of the substrate 22, and the circuit 40 is disposed on the bottom surface 222 of the substrate 22, the light emitted by the light-emitting chip 60 will not be absorbed by the circuit 40, thereby improving the overall light-emitting efficiency. Moreover, the reflective cup 26 is used to surround the light-emitting wafer 60, and the light emitted from the light-emitting chip 60 can be collected laterally, thereby further improving the overall light-emitting efficiency.

Finally, a protective layer 80 is formed on the heat sink 20 as shown in Figures 9-10. In the present embodiment, the protective layer 80 is made of an insulating material (such as resin, ceramics, etc.), which is fixed to the surface of the heat sink 20 by injection molding or the like. Preferably, the manufacturing material of the protective layer 80 may further have a heat dissipation function to assist the heat sink 20 to dissipate heat. The protective layer 80 covers the top surface 220 of the substrate 22, the outer peripheral surface 262 of the reflective cup 26, and the outer side surface 242 of the side wall 24. The top surface of the reflector cup 26 and the package body 70 are exposed to the top of the protective layer 80, and the bottom surface of the sidewall 24 and the recess 200 are exposed to the bottom of the protective layer 80. Preferably, the top surface of the reflective cup 26 and the top surface of the package body 70 are flush with the top surface of the protective layer 80, and the bottom surface of the side wall 24 is flush with the bottom surface of the protective layer 80. When the protective layer 80 is formed, the two side walls 24 can block the material of the protective layer 80 from being prevented from flowing into the recess 200 to contaminate the circuit 40.

It can be understood that, as shown in FIG. 11, the heat sink 20 can also be directly made of a metal material. At this time, each pair of electrodes 30 and the top surface 220 of the substrate 22 are separated by an insulating layer 90, and the periphery of each conductive path 50 is also The substrate 40 is separated from the substrate 22 by an annular insulating layer 90, and the circuit 40 is separated from the bottom surface 222 of the substrate 22 by an insulating layer 90 to avoid short circuits. In this case, the protective layer 80 can protect the exposed surface of the metal heat sink 20 from being immersed in the air for a long time to cause oxidation, which affects the normal heat dissipation effect. Further, when the heat sink 20 is made of a metal material, the substrate 22, the two side walls 24, and the respective reflecting cups 26 may be integrally formed by machining such as cutting, and may be separately formed separately and then fixed by welding.

It is also understood that the circuit 40 is not limited to being attached to the bottom surface 222 of the substrate 22, but may also be attached to the outer side surface 242 of the sidewall 24 and electrically connected to the electrode 30 of the top surface 220 of the substrate 22 through the bent conductive path 50. . In this case as well, the problem of light absorption by the circuit 40 can be avoided.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

26. . . Reflective cup

30. . . electrode

40. . . Circuit

50. . . Conductive path

60. . . Light emitting chip

70. . . Package

Claims (10)

A light emitting diode module includes a base, a light emitting chip and a circuit. The base includes a first surface and a second surface facing the first surface. The light emitting chip is mounted on the first surface of the base, and the improvement is The circuit is disposed on the second surface of the pedestal to avoid light emission from the optical wafer, and the luminescent wafer is electrically connected to the circuit through a conductive path penetrating the first surface and the second surface. The illuminating diode module according to claim 1, wherein the susceptor forms an electrode on the first surface, the electrode is electrically connected to the circuit through a conductive path, and the luminescent wafer is mounted on the electrode. The illuminating diode module of claim 1, wherein the pedestal comprises two sidewalls extending in the same direction, and the two sidewalls and the second surface of the pedestal enclose the recess of the receiving circuit. According to the light-emitting diode module of claim 3, wherein the thickness of the circuit is smaller than the height of the side wall. The illuminating diode module of claim 3, wherein the pedestal forms a reflective cup on the first surface, and the luminescent wafer is received in the reflective cup. The illuminating diode module of claim 5, further comprising a protective layer bonded to the pedestal, the protective layer covering a portion of the first surface of the pedestal and the outer peripheral surface of the reflective cup to expose the top of the reflective cup The protective layer also covers the outer sidewall faces of the two side walls to expose the grooves. According to the light-emitting diode module of claim 6, wherein the top surface of the protective layer is flush with the top surface of the reflective cup, and the bottom surface of the protective layer is flush with the bottom surface of the side wall. The illuminating diode module according to claim 2, wherein the pedestal is made of a metal material, and the circuit, the electrode and the conductive path are fixed to the pedestal by the insulating material. A method for manufacturing a light emitting diode module, comprising:
Providing a pedestal, the pedestal comprising a first surface and a second surface facing different from the first surface, the pedestal forming a conductive path extending through the first surface and the second surface, the first surface of the pedestal forming a reflective cup, the base Forming a circuit in communication with the conductive path on the second surface of the seat;
A light-emitting chip is mounted on the first surface of the pedestal to receive the light-emitting chip in the reflective cup and to be electrically connected to the conductive path. The method of claim 9, wherein after the mounting of the luminescent wafer, the step of forming a protective layer on the pedestal, the protective layer covering a portion of the first surface of the pedestal and exposing the reflective cup.