JP2015018847A - Led module and illumination device including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED module capable of improving a yield when mounted on an illumination device, and an illumination device including the same.SOLUTION: An LED module 10 comprises: a semiconductor light-emitting element 7; a case 2 which houses the semiconductor light-emitting element 7; a first electrode 3 which is electrically connected to the semiconductor light-emitting element 7 and in which the side opposite to the side on which the semiconductor light-emitting element 7 is arranged is exposed to the outside of the case 2; a second electrode 4 facing the first electrode 3; a first heat applying part 3b thermally connected to the first electrode 3 and exposed to the outside of the case 2 in a short direction of the first electrode 3; and a second heat applying part 4b thermally connected to the second electrode 4 and exposed to the outside of the case 2 in a short direction of the second electrode 4. There is also provided an illumination device 50 including the LED module.

Description

  The present invention relates to an LED module and a lighting device including the same.

  In recent years, there is an increasing demand for energy saving for home appliances. In particular, in home lighting devices, instead of conventional light sources such as fluorescent lamps and incandescent lamps, LEDs (Light Emitting Diodes, semiconductor light-emitting elements) are used as light sources that consume less power in order to save energy. An illuminating device that uses a light source has been developed. In such an illumination device, the LED is usually configured as an LED module together with an electrode, a case for housing the LED, and the like. The LED module is mounted and provided on a circuit board on which a circuit through which a current flows is formed.

  As such an LED module, a technique described in Patent Document 1 is known. In Patent Document 1, a body, a first electrode provided on the body, a second electrode spaced apart from the first electrode, and any one of the first electrode and the second electrode are disposed on the body. A light emitting device is described that includes a light emitting chip formed and electrically connected to the first electrode and the second electrode, and a protective cap protruding between the first electrode and the second electrode.

JP2011-119729A

  On a circuit board on which a circuit is formed, a plurality of LED modules are usually mounted (connected and fixed) by soldering or the like. Therefore, after mounting the LED module on the circuit board, if a defective LED module is found, for example, the color is off or the brightness is not good, the LED module is removed and shipped as a product. The However, the LED module is mounted by soldering or the like as described above. Therefore, in order to remove the LED module once mounted, it is necessary to apply heat to the solder and melt the solder.

  However, in the case of the LED module (light emitting element) of Patent Document 1, it may be difficult to apply heat to the solder once it is mounted on the circuit board. Moreover, even if heat can be applied, there may be a case where a sufficient amount of heat cannot be applied to melt the solder. Therefore, when using the LED module of Patent Document 1, even if a defective LED module is found, it may not be easy to remove the defective LED module.

  Therefore, in the illuminating device using the LED module of Patent Document 1, it is necessary to replace the entire circuit board on which the defective LED module is mounted, resulting in an increase in production cost and an increase in waste. Sometimes. In other words, the lighting device mounted with the LED module of Patent Document 1 has a problem that the yield tends to be low.

  This invention is made | formed in view of the said subject, The subject which this invention solves is providing LED module which can improve the yield at the time of mounting and setting it as an illuminating device, and an illuminating device provided with the same. is there.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have provided a heat application terminal for applying heat to the electrode to be soldered so that the LED module is exposed to the outside in the short direction of the electrode. Then, it discovered that the said subject could be solved.

  ADVANTAGE OF THE INVENTION According to this invention, the LED module which can improve the yield at the time of mounting and setting it as an illuminating device, and an illuminating device provided with the same can be provided.

It is a perspective view of the LED module of this embodiment. It is a top view of the LED module of this embodiment. It is a bottom view of the LED module of this embodiment. It is the sectional view on the AA line of FIG. It is a top view of the LED module at the time of disassembling the LED module of this embodiment and removing the phosphor layer and the like. FIG. 6 is a sectional view taken along line B-B in FIG. 5. It is CC sectional view taken on the line of FIG. It is a figure which shows the half edge structure currently formed in the electrode which comprises the LED module of this embodiment. It is sectional drawing which shows the illuminating device with which the LED module of this embodiment was mounted. It is a figure which shows the manufacturing method of the LED module of this embodiment. It is a figure which shows the etched metal plate used at the time of LED module manufacture of this embodiment. It is a figure which shows a mode that the resin-made reflector was formed with respect to the etched metal plate shown in FIG. It is the L section enlarged view of FIG. It is sectional drawing which shows the structure of the lens vicinity of the LED module of 2nd Embodiment. It is sectional drawing which shows the structure of the lens vicinity of the LED module of 3rd Embodiment. It is sectional drawing which shows the structure of the lens vicinity of the LED module of 4th Embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (this embodiment) will be described with reference to the drawings as appropriate. First, the LED module of the present embodiment will be described, and then a manufacturing method thereof and a lighting device including the manufacturing method will be described.

[1. LED Module of First Embodiment]
〔Constitution〕
FIG. 1 is a perspective view of the LED module 10 of the present embodiment. The LED module 10 includes a lens 5 on the upper surface of a resin reflector 2 (case). The reflector 2 is made of, for example, a thermoplastic resin such as 6T nylon, 9T nylon, or polycyclohexylene dimethylene terephthalate. A semiconductor light emitting element 7 (LED; see FIG. 4; not shown in FIG. 1) is provided in the reflector 2, and light from the semiconductor light emitting element 7 is emitted to the outside through a transparent resin lens 5. It is like that. Details of this point will be described later with reference to FIG.

The LED module 10 protrudes from the side surface of the reflector 2 (that is, is exposed to the outside), the negative electrode lead portions 3a and 3a, the positive electrode lead portions 4a and 4a, and the negative electrode sub lead portion 3b (not shown in FIG. 1); And a positive electrode sub lead portion 4b.
These members will be described with reference to FIGS.

FIG. 2 is a top view of the LED module 10 of the present embodiment. FIG. 3 is a bottom view of the LED module 10 of the present embodiment. As shown in FIG. 3, the two negative electrode lead portions 3 a are arranged in the longitudinal direction of the plate-shaped (foil-shaped) negative electrode 3 (first electrode) formed to be exposed to the outside on the lower surface of the reflector 2. And is integrally formed. Similarly, the two positive electrode lead portions 4a are integrated with the positive electrode 4 in the longitudinal direction of the plate-like (foil-like) positive electrode 4 (second electrode) which is also exposed to the outside on the lower surface of the reflector 2. Is formed.
In FIG. 3, the negative electrode 3, the negative electrode lead portions 3 a and 3 a, and the negative electrode sub lead portion 3 b are integrally formed as described above so that the portions of the negative electrode 3, the negative electrode lead portions 3 a and 3 a, and the negative electrode sub lead portion 3 b become clear. Is attached. The same applies to the positive electrode 4 and the like.

  Incidentally, the negative electrode 3 and the positive electrode 4 are opposed to each other, and they are insulated by the resin forming the reflector 2. The details will be described later with reference to FIG. 9, but the negative electrode 3 and the negative circuit 24a are electrically connected to the circuit board 23 by soldering, and the positive electrode 4 and the positive circuit 24b are electrically connected by soldering. It is connected. Thereby, electric power is supplied to the semiconductor light emitting element 7 connected to the negative electrode 3 and the positive electrode 4, and light is emitted from the LED module 10.

  Moreover, in the LED module 10, it protrudes from the side surface of the reflector 2 in the direction (short direction of the negative electrode 3) in the same plane as the negative electrode lead portions 3a, 3a forming direction (extending direction) Exposed), a negative electrode sub lead portion 3b (first heat application portion) is formed. The negative electrode sub lead portion 3b is formed integrally with the negative electrode 3 in the same manner as the negative electrode lead portions 3a and 3a, and is exposed on the lower surface (outside) of the reflector 2. That is, in the LED module 10, the negative electrode 3 and the negative electrode sub lead portion 3 b are integrally connected, and thus are thermally connected. Further, the negative electrode sub lead portion 3 b is provided connected to the vicinity of the center in the longitudinal direction of the negative electrode 3.

  Further, the positive electrode lead portions 4a and 4a protrude from the side surface of the reflector 2 in the direction perpendicular to the direction in which the positive electrode lead portions 4a and 4a are formed (the short direction of the positive electrode 4) (exposed to the outside), and the positive electrode sub lead portion 4b (Two heat application part) is formed. Like the negative electrode lead portions 3a and 3a, the positive electrode sub lead portion 4b is formed integrally with the positive electrode 4 and is exposed on the lower surface (outside) of the reflector 2. That is, in the LED module 10, the positive electrode 4 and the positive electrode sub lead portion 4 b are integrally formed and thus are thermally connected. Further, the positive electrode sub lead portion 4 b is provided connected to the vicinity of the center in the longitudinal direction of the positive electrode 4.

  4 is a cross-sectional view taken along line AA in FIG. The reflector 2 is filled with the phosphor material 6 in addition to the semiconductor light emitting element 7 as described above. The lens 5 is formed so as to extend to the upper end surface 2a1 of the convex portion 2a formed at the upper end of the reflector 2 so as to cover the phosphor material 6. Thereby, the size of the lens 5 can be increased as much as possible, and the light extraction efficiency in the LED module 10 can be improved. Moreover, since parts other than the convex part 2a of the upper end of the reflector 2 are planes, the LED module 10 is attached by adsorbing the plane when manufacturing the LED module 10 to be described later with reference to FIG. It is easy to grip and transport.

Here, a material for forming the phosphor material 6 will be described. The phosphor material 6 includes a phosphor and a sealing resin that seals the phosphor. The phosphor contained in the phosphor material 6 varies depending on the type of the semiconductor light emitting element 7 and cannot be generally described, but examples thereof include a yellow phosphor, a red phosphor, and a green phosphor. The yellow phosphor, for _{example, Y 3 Al 5 O 12:} Ce, Tb 3 Al 5 O 12: Ce, Lu 3 Al 5 O 12: Ce, La 3 Si 6 N 11: Ce and the like. Further, as the red phosphor, for _{example, CaAlSiN 3: Eu, (Sr} , Ca) AlSiN 3: Eu and the like. Further, as the green phosphor, CaSc ₂ O ₄ : Ce, Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce, (Ba, Sr) ₂ SiO ₄ : Eu, (Si, Al) ₆ (O, N) ₈ : Eu etc. are mentioned. One of these may be included alone, or two or more thereof may be included in any ratio and combination.

  Further, in the LED module 10 of the present embodiment, a sealing resin having high sulfidation resistance is used from the viewpoint of suppressing sulfidation of the phosphor contained in the phosphor material 6 and extending the life. Specifically, examples of such a resin include silicone resins such as polyorganosiloxane and polyorganohydrogensiloxane, and urethane resins. By using such a resin, sulfuration of the phosphor can be suppressed, and the life of the LED module 10 can be extended.

  As the sealing resin contained in the phosphor material 6, as described above, a resin having high sulfidation resistance is used. However, the refractive index of such a resin tends to be high. On the other hand, the lens 5 formed by bonding to the phosphor material 6 is often formed of a resin material having a low refractive index (acrylic resin such as PMMA). Therefore, if the refractive index of the phosphor material 6 is larger than the refractive index of the lens 5, the light from the phosphor material 6 may not enter the lens 5 and may be totally reflected at the bonding interface. is there. When such a phenomenon occurs, the light extraction efficiency is significantly reduced.

  Therefore, in the present embodiment, the phosphor material 6 includes a filler having a refractive index lower than that of the resin forming the lens 5 in addition to the phosphor and the sealing resin. In this way, by incorporating a filler having a refractive index lower than that of the resin forming the lens 5 in the phosphor material 6, the refractive index of the phosphor material 6 can be reduced and approach the refractive index of the lens 5. Thereby, it is possible to suppress the total reflection of the light from the light emitter emitted by the excitation light from the semiconductor light emitting element 7 at the bonding interface between the phosphor material 6 and the lens 5. That is, in the LED module 10, the light extraction efficiency from the semiconductor light emitting element 7 can be increased. Examples of such a filler include silica, aluminum nitride, zirconia, and the like.

  The size of the filler contained in the phosphor material 6 is not particularly limited, but a filler smaller than the peak wavelength of the light emitted from the phosphor is preferable as the particle size of the filler, and more preferably 100 nm or less. More preferably still less than 100 nm. By setting the size of the filler to this size, the refractive index of the phosphor material 6 can be reduced more reliably, and total reflection at the junction interface between the lens 5 and the phosphor material 6 can be more reliably suppressed. Can do. Thereby, the light extraction efficiency can be further increased.

  FIG. 5 is a top view of the LED module 10 when the LED module 10 of the present embodiment is disassembled and the lens 5, the phosphor material 6 and the semiconductor light emitting element 7 are removed. 6 is a cross-sectional view taken along line BB in FIG. 5, and FIG. 7 is a cross-sectional view taken along line CC in FIG. In FIG. 5, the broken lines included in the negative electrode 3 and the positive electrode 4 are imaginary lines that indicate interfaces where the thicknesses thereof change.

  As shown in FIGS. 5 and 6, a part of the end of the positive electrode 4 is a half in which the thickness of the positive electrode 4 is about half (thinner than the thickness near the center of the positive electrode 4). An edge portion 4c is formed. However, as shown in FIGS. 5 and 7, the half edge portion 4c is not formed in the positive electrode sub lead portion 4b or the positive electrode lead portions 4a and 4a, and is adjacent to the positive electrode sub lead portion 4b and the adjacent positive electrode lead. A plurality of portions are formed between the portions 4a. Accordingly, the positive edge sub-lead portion 4b is not provided with a half edge portion, and the thickness thereof is uniform. However, at the four corners (four locations) of the positive electrode 4, half edge portions 4c with reduced thickness are formed. Yes. Therefore, in the LED module 10, the half edge portion 4 c in the positive electrode 4 is formed so as to be symmetric in both the longitudinal direction and the short direction of the positive electrode 4.

  Also in the negative electrode 3, a half edge portion 3 c similar to the half edge portion 4 c of the positive electrode 4 is formed. About the half edge part 3c of the negative electrode 3, since it is the same as that of the half edge part 3c of the positive electrode 4, description is abbreviate | omitted.

  As described above, in the LED module 10, the half edge portions 3 c and 4 c are formed in each of the negative electrode 3 and the positive electrode 4. By providing the half edge portions 3c and 4c having different thicknesses in the negative electrode 3 and the positive electrode 4 as described above, the bonding area between the resin forming the reflector 2 and the negative electrode 3 and the positive electrode 4 can be increased. It has become. The half edge portions 3c and 4c can be formed by, for example, pressing or etching, but are preferably formed by pressing from the viewpoint of low cost.

  FIG. 8 is a diagram showing a half-edge structure formed on the negative electrode 3 and the positive electrode 4 constituting the LED module 10 of the present embodiment. In FIG. 8, the broken line is an imaginary line that indicates the ends of the negative electrode 3 and the positive electrode 4 that are hidden by the reflector 2. That is, as shown in FIG. 8 and FIG. 6, the reflector 2 is formed so as to sandwich the half edges 3c and 4c of the negative electrode 3 and the positive electrode 4 in the portions of the half edges 3c and 4c of the negative electrode 3 and the positive electrode 4. Has been. Therefore, when the negative electrode 3 and the positive electrode 4 are mounted on the circuit board 23 (see FIG. 9) by soldering or the like, the reflector 2 is prevented from being pulled out upward (side on which the semiconductor light emitting element 7 is provided). It has become.

  FIG. 9 is a cross-sectional view showing the lighting device 50 on which the LED module 10 of the present embodiment is mounted. The cross section of the LED module 10 shown in FIG. 9 is the same as the cross section taken along the line KK of FIG.

  On the substrate 23, printed circuits 24a and 24b made of, for example, copper are formed. Then, the negative electrode 3 and the positive electrode 4 of the LED module 10 are mounted (connected and fixed) to the printed circuits 24 a and 24 b by the solder 24. As shown in FIG. 9, the solder 24 extends to the outside of the negative electrode sub lead portion 3 b and the positive electrode sub lead portion 4 b of the LED module 10, and the LED module 10 is mounted on the substrate 23.

  Further, in the LED module 10, as described above, the negative electrode sub lead portion 3b, the positive electrode sub lead portion 4b, the negative electrode lead portions 3a and 3a, and the positive electrode lead portions 4a and 4a have a half edge structure (for example, FIG. 8) is not provided. Therefore, as shown in FIG. 9, in addition to the entire surface of the negative electrode 3 and the positive electrode 4, the solder 24 is formed on the entire surface of the negative electrode sub lead portion 3b and the positive electrode sub lead portion 4b, or the negative electrode lead portions 3a, 3a and The positive electrode lead portions 4a and 4a extend to the entire surface.

  Furthermore, as shown in the drawing, the solder 24 extends to the side surfaces of the negative electrode sub lead portion 3b and the positive electrode sub lead portion 4b, that is, to a position where the solder 24 can be visually recognized from the outside. By doing in this way, so that the junction area of the LED module 10 and the board | substrate 23 (more specifically, the printed circuits 24a and 24b on the board | substrate 23) through the solder 24 can be ensured more largely. It has become.

〔effect〕
According to the LED module 10 described above, when the lighting device 50 shown in FIG. 9 is used, the yield of the lighting device 50 can be improved. Specifically, the LED module 10 includes a negative electrode sublead portion 3b formed integrally with the negative electrode 3 connected and fixed by solder, and a positive electrode sublead portion 4b formed integrally with the positive electrode 4 connected and fixed by solder. Are provided in the short direction of the negative electrode 3 and the positive electrode 4. Therefore, the heat transfer distance can be shortened, and the solder attached to the negative electrode 3, the positive electrode 4, and the like can be simultaneously applied by applying heat to each of the negative electrode sublead portion 3 b and the positive electrode sublead portion 4 b simultaneously (together). (Together) and can be melted quickly.

  In particular, in the LED module 10 of the present embodiment, the negative electrode sub lead portion 3c and the positive electrode sub lead portion 4c are connected to the vicinity of the center in the longitudinal direction of the negative electrode 3 and the positive electrode 4, respectively. Therefore, if heat is applied to the negative electrode sub-lead portion 3c and the positive electrode sub-lead portion 4c, heat is transmitted substantially equally to the left and right in the longitudinal direction in each of the negative electrode 3 and the positive electrode 4 and the attached solder is easily melted. . Therefore, it becomes easier to remove the LED module 10 by melting the solder more effectively. Therefore, it is not necessary to discard the entire circuit board including the defective LED module as in the conventional case, and the yield of the lighting device can be improved.

  Further, as described with reference to FIGS. 5 to 8, the negative electrode 3 and the positive electrode 4 of the LED module 10 are provided with half edge portions 3 c and 4 c having a small thickness. In particular, the half edge portions 3c and 4c are not provided in the negative electrode sub lead portion 3b and the positive electrode sub lead portion 4b in addition to the negative electrode lead portions 3a and 3a and the positive electrode lead portions 4a and 4a. Therefore, for example, when the half edge portions 3c and 4c are provided by pressing from the viewpoint of cost reduction, even if the areas of the negative electrode 3 and the positive electrode 4 are changed because the metal has ductility, the negative electrode lead portions 3a and 3a and the positive electrode lead portion 4a, 4a, the negative electrode sub lead portion 3b, and the length and shape of the positive electrode sub lead portion 4b hardly change.

  In particular, in the LED module 10 of the present embodiment, the half edge portions 3 c and 4 c are provided so as to be symmetrical in the longitudinal direction and the lateral direction in each of the negative electrode 3 and the positive electrode 4. For this reason, for example, even if the shape of the negative electrode 3 and the positive electrode 4 is changed by pressing, the half edge portions 3c and 4c are provided symmetrically, so that the influence of pressing can be canceled out. it can. Therefore, distortion and warpage of the negative electrode 3 and the positive electrode 4 are unlikely to occur, and poor contact is not likely to occur when the LED module 10 is fixed to the circuit board while achieving good bonding between the reflector 2, the negative electrode 3, and the positive electrode 4. The advantage is obtained.

  Furthermore, in the LED module 10 of the present embodiment, a sulfidation-resistant sealing resin is used as the sealing resin contained in the phosphor material 6 in order to increase the sulfidation resistance of the phosphor. However, this may cause the refractive index of the phosphor material 6 to be larger than the refractive index of the lens 5. Therefore, it is possible to prevent the light extraction efficiency from being lowered by including a filler for reducing the refractive index in the phosphor material 6.

  Further, a convex portion 2a is provided at the upper end of the reflector 2, and the lens 5 is arranged on the convex portion 2a. Thereby, the size of the lens 5 can be increased as much as possible to increase the light extraction efficiency, and the LED module 10 can be sucked by using a suction means or the like at a portion other than the convex portion 2a. Can be easily transferred.

  Furthermore, as described with reference to FIG. 9, in the lighting device 50 of the present embodiment, a larger bonding area by the solder 24 can be secured. Thereby, electrical continuity between the printed circuits 24a and 24b and the LED module 10 can be achieved more reliably. In addition, since the bonding area between the LED module 10 and the substrate 23 is increased via the solder 24, the heat generated with the light emission of the LED module 10 can be easily released to the substrate 23 via the solder 24. . Therefore, the heat dissipation of the LED module 10 can be improved without providing a special member.

  Furthermore, by applying heat from both the negative electrode sub lead portion 3b and the positive electrode sub lead portion 4b, the solder 24 can be easily melted and the LED module 10 can be easily removed from the substrate 23. Moreover, as described with reference to FIG. 9, the solder 24 extends to a position where it can be visually recognized from the outside. Therefore, in addition to the negative electrode sub lead portion 3b and the positive electrode sub lead portion 4b, the solder 24 can be melted more easily and the LED module 24 can be removed by simultaneously applying heat to the solder 24 at the visually recognized position. . Further, as described above, the solder 24 is bonded over the entire surface of the negative electrode 3 and the positive electrode 4, and the negative electrode lead portions 3a and 3a, the positive electrode lead portions 4a and 4a, the negative electrode sub lead portion 3b, and the positive electrode sub lead portion 4b. The heat transfer area is large, and from this point of view, the solder 24 is more easily melted.

[2. Manufacturing method of LED module of first embodiment]
Next, a manufacturing method of the LED module 10 will be described with reference to FIGS.

  FIG. 10 is a diagram illustrating a method for manufacturing the LED module 10 of the present embodiment. In each of FIGS. 10A to 10H, the upper diagram is a top view, and the lower diagram is a cross-sectional view in the top diagram. That is, for example, the lower diagram in FIG. 10A is a sectional view taken along the line DD of the upper diagram in FIG. -K sectional drawing is shown.

  The LED module 10 can be manufactured mainly through the steps shown in FIGS. Hereinafter, the manufacturing method will be described step by step with reference to other drawings as appropriate.

  First, the copper plate 11 is prepared (FIG. 10A). Then, etching is performed so that a portion surrounded by a broken line in FIG. 10A is removed, and silver plating is performed, so that the metal plate 12 shown in FIG. 11 is obtained. In FIG. 11, the portions surrounded by the two-dot chain line are the negative electrode 3 and the positive electrode 4 that are finally included in the LED module 10. FIG. 10B shows a state after the etching is performed on the portion surrounded by the broken line in FIG. In the following, for simplification of illustration, the processing performed for the portion shown in FIG. 10B will be mainly described.

  A resin-made reflector 2 is formed so as to surround the negative electrode 3 and the positive electrode 4 with respect to the portion shown in FIG. FIG. 10C shows a state when the reflector 2 is formed. Further, FIG. 12 shows a state when the reflector 2 is formed on the entire metal plate 12 shown in FIG. At this time, the gap between the negative electrode 3 and the positive electrode 4 (see the lower diagram in FIG. 10B) is also filled with the resin that forms the reflector 2 (see the lower diagram in FIG. 10C).

  When the negative electrode 3 and the positive electrode 4 are collectively referred to as an electrode group, the reflector 2 is formed by injecting resin between a pair of adjacent electrode groups. This point will be described with reference to FIG.

  As shown in FIG. 13, between the electrode groups 22A and 22B composed of the negative electrode 3 and the positive electrode 4 (near the center), a gate (resin injection port) (not shown) for injecting resin is disposed. Incidentally, FIG. 13 shows a recess 21 remaining after the gate is pulled out.

  When the resin is injected from the gate, the resin is placed on a longitudinal line (broken line in FIG. 13) passing through the vicinity of the center of the gap between the negative electrode 3 and the positive electrode 4 so that the resin flows smoothly. An injecting gate is arranged. And resin is inject | poured from this gate and what is called injection molding is performed. By disposing the gate at such a position, the electrode groups 22A and 22B are symmetrical with respect to the gate, so that the resin can flow evenly through both the electrode groups 22A and 22B. Since the resin can be made to flow evenly in this way, the resin flows smoothly without solidifying in the middle even in a narrow gap between the negative electrode 3 and the positive electrode 4. . Thereby, the space | gap between the negative electrode 3 and the positive electrode 4 is filled, and also the reflector 2 can be formed.

  Further, the four corners of the inner wall of the rectangular reflector 2 have an R shape. In particular, the size of R is large. Thereby, even if it is the narrow space | gap in the type | mold which forms the reflector 2, resin becomes easy to flow through and the reflector 2 can be formed with sufficient precision. In particular, the resin can easily flow into the left side surface of the reflector 22A on the paper surface that is farthest from the gate and the right side surface side of the reflector 22B, and the reflector 2 can be formed more reliably and accurately.

  Then, when the gate is pulled out after flowing the resin, the recess 21 in which the gate is disposed is formed (remains) between the electrode groups 22A and 22B. Although details will be described later, since the LED module 10 is obtained by cutting around the reflector 2, the recess 21 is not involved in the LED module 10 as a product.

  Returning to FIG. 10, the description of the manufacturing method will be continued. After the reflector 2 is formed as shown in FIG. 10C, the semiconductor light emitting element 7 is disposed and fixed inside the reflector 2 and on the upper surface of the negative electrode 3 (FIG. 10D). Then, the semiconductor light emitting element 7, the negative electrode 3 and the positive electrode 4 are wire-bonded by wires 7a and 7b (FIG. 10E). Thereafter, after the reflector 2 is filled with the phosphor material 6 (FIG. 10F), the lens 5 is formed on the reflector 2 so as to cover the phosphor material 6 (FIG. 10G). .

  Finally, the LED module 10 is punched from the metal plate 12 shown in FIG. 11 by cutting from the metal plate 12 around the reflector 2 to obtain the LED module 10 (FIG. 10 (h)). Thereby, the LED module 10 in a state where a portion (that is, the suspension lead portion) connected to the other electrode group is exposed to the outside is obtained. The exposed suspension lead portions become the negative electrode lead portions 3a and 3a, the positive electrode lead portions 4a and 4a, the negative electrode sub lead portion 3b, and the positive electrode sub lead portion 4b described with reference to FIG.

  As shown in FIG. 10, by producing the LED module 10, members for applying heat to the negative electrode 3 and the positive electrode 4 (negative electrode sublead portion 3 b, positive electrode sublead portion 4 b, etc.) The copper plate 11 is formed. Therefore, the LED module 10 can be easily removed without specially providing a member for applying heat to the negative electrode 3 and the positive electrode 4.

[2. LED Module of Second Embodiment]
FIG. 14 is a cross-sectional view showing the structure in the vicinity of the lens 5 of the LED module 20 of the second embodiment. The same components as those of the LED module 10 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the LED module 10, the lens 5 is provided in contact with the upper surface 2a1 of the convex portion 2a of the reflector 2 (see FIG. 4 and the like). However, in the LED module 20 of the second embodiment, the convex portion 2a A lens 5 is provided so as to be surrounded. The lens 5 can be formed, for example, by dropping a resin from above the phosphor material 6 and solidifying it, but if formed like the LED module 20, the dropped resin leaks out of the convex portion 2a. Can be suppressed. Thereby, the part in which the lens 5 is not formed can be provided in the upper end of the reflector 2 more reliably. Thereby, when the LED module 20 is transferred, the upper end surface of the reflector 2 can be adsorbed and transferred more reliably.

  Although not shown, for example, the upper end of the reflector 2 is subjected to a water repellent treatment, or the resin of the reflector 2 is made less wettable than the resin of the lens 5 so that the convex portion 2a is provided. It may not be possible. Also by this, the resin of the lens 5 does not spread on the upper surface of the reflector 2, and the upper end of the reflector 2 can be secured.

[3. LED Module of Third Embodiment]
FIG. 15 is a cross-sectional view showing the structure in the vicinity of the lens 5 of the LED module 30 of the third embodiment. The same components as those of the LED modules 10 and 20 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the LED module 10, the bonding interface between the lens 5 and the phosphor material 6 is smooth (see FIG. 4 and the like). However, in the LED module 30 of the third embodiment, the bonding interface is on the inside. It is curved to be depressed. Moreover, in the LED module 30, the lens 5 is provided so that it may be enclosed by the convex part 2a similarly to the said LED module 20. FIG.

  When forming the lens 5, as described above, for example, resin can be formed by dropping from above the phosphor material 6, but the upper surface of the phosphor material 6 is curved so as to be recessed inward. The resin of the lens 5 is difficult to spread outward, that is, the surface tension of the resin at the end of the lens 5 (that is, the resin existing near the end of the reflector 2) is formed such that the upper surface of the phosphor material 6 is recessed inward. Therefore, it will face in the center direction. Therefore, since the resin receives a force in the central direction, it is possible to more reliably prevent the resin from spreading on the upper surface of the reflector 2 that is in the external direction.

  Even in this case, the convex portion 2a may not be provided in the same manner as the LED module 20 described above. This also provides the same effect.

[4. LED Module of Fourth Embodiment]
FIG. 16 is a cross-sectional view showing the structure in the vicinity of the lens 5 of the LED module 40 of the fourth embodiment. The same components as those of the LED modules 10, 20, and 30 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the LED modules 10, 20, and 30, from the viewpoint of ensuring ease of transfer of the LED modules 10, 20, and 30, a portion where the lens 5 is not formed at the upper end of the reflector 2 has been secured. From another viewpoint, the lens 5 may be formed on the entire upper end of the reflector 2. Specifically, as shown in FIG. 16, the lens 5 may be formed so as to cover the entire surface of the reflector 2 and the entire surface of the phosphor material 6.

  By doing in this way, the dripping amount of the resin which comprises the lens 5 can be increased, and the fluorescent substance material 6 can be covered with the lens 5 more thickly and widely. Therefore, for example, sulfuration of the phosphor contained in the phosphor material 6 can be more reliably prevented by the lens 5. According to this, the lifetime of the LED module 30 can be increased.

[3. Modified example]
Although the present embodiment has been described with specific examples, the present invention is not limited to the above contents.

  For example, the negative electrode lead portions 3a, 3a, the positive electrode lead portions 4a, 4a, the negative electrode sub lead portion 3b, and the positive electrode lead portion 4b described with reference to FIG. 1 and the like do not have to protrude from the outer surface of the reflector 2. It only needs to be exposed to the outside. From the viewpoint that it is easy to apply heat, it is preferable to project, but if these are exposed to the outside, heat can be applied from the exposed part to the negative electrode 3 and the positive electrode 4 from the outside. The effects of the invention can be obtained.

  Further, the negative electrode lead portions 3a, 3a, the positive electrode lead portions 4a, 4a, the negative electrode sub lead portion 3b, and the positive electrode lead portion 4b are not necessarily provided at the illustrated positions, and all of them are not necessarily provided. . In other words, the position where the member thermally connected to the negative electrode 3 and the member thermally connected to the positive electrode 4 are visible when the LED module 10 is mounted on the circuit board 23 (for example, the reflector 2 Any configuration may be used as long as it is disposed on the side surface. Moreover, as long as it is thermally connected, the negative electrode 3 and the negative electrode sublead portion 3b, and the positive electrode 4 and the positive electrode sublead portion 34 do not need to be formed integrally.

  However, from the viewpoint of easily applying heat uniformly to the entire surface of each of the negative electrode 3 and the positive electrode 4, as shown in FIG. It is preferable that the configuration extends. Therefore, for example, a plurality of the negative electrode sub lead portions 3b are provided in parallel, and a plurality of the positive electrode sub lead portions 4b are provided in parallel with the negative electrode sub lead portions 3b. By applying heat at the same time, heat can be applied to the entire surfaces of the negative electrode 3 and the positive electrode 4 more quickly. As a result, the defective LED module can be removed more quickly.

  Moreover, the joining position by the solder 24 demonstrated in FIG. 9 is not limited to the example of illustration. For example, in FIG. 9, the solder 24 has spread to a position where it can be visually recognized. However, the solder 24 can be melted sufficiently easily without doing so. Moreover, even if the solder 24 does not necessarily adhere to the entire surface of the negative electrode 3 and the positive electrode 4, the solder 24 can be melted sufficiently easily.

  Furthermore, the manufacturing method of the LED module 10 is not limited to the method shown in FIG. In FIG. 10, the LED module 10 is finally obtained by punching from the metal plate 12, but only the negative electrode 3 and the positive electrode 4 are previously formed from the copper plate 11 by etching or the like, and the formed negative electrode 3 and positive electrode 4 are formed. On the other hand, a reflector 2 or the like may be provided. Further, the position at which the resin forming the reflector 2 is poured is not limited to the position described with reference to FIG. 13 and may be arbitrarily determined.

  In addition, regarding the formation of the half edge portion described with reference to FIG. 8 and the like, in this embodiment, etching or pressing is performed on the side opposite to the surface on which the reflector 2 is provided. These processing surfaces are not limited to the illustrated example, and processing may be performed on a surface opposite to the illustrated surface. Even if the surface opposite to the illustrated example is processed, the bonding area between the resin, the negative electrode 3 and the positive electrode 4 can be increased.

  In particular, in the illustrated example, the half edge portion is formed so as to be symmetric in both the longitudinal direction and the short side direction, but for example, at least one of the negative electrode 3 and the positive electrode 4 near the center of the electrode. You may provide a half edge part so that it may become a symmetrical position. Even if it does in this way, the influence by the press at the time of press work can be negated, for example, and a sufficient effect is acquired.

  Note that the present invention can be implemented by combining the above-described embodiments or appropriately adding, deleting, converting, etc., well-known techniques.

2 Reflector (case)
3 Negative electrode (first electrode, electrode)
3a Negative electrode lead portion 3b Negative electrode sub lead portion (first heat applying portion)
3c Half edge part 4 Positive electrode (2nd electrode, electrode)
4a Positive lead portion 4b Positive sub lead portion (second heat applying portion)
4c Half edge part 5 Lens 6 Phosphor material 7 Semiconductor light emitting element 10 LED module 20 LED module 23 Substrate (circuit board)
24 Solder 24a, 24b Printed circuit 30 LED module 40 LED module 50 Lighting device

Claims (5)

A semiconductor light emitting device;
A case for housing the semiconductor light emitting element;
A first electrode that is electrically connected to the semiconductor light emitting element, the side opposite to the side on which the semiconductor light emitting element is disposed is exposed to the outside of the case, and a second electrode facing the first electrode;
A first heat application portion thermally connected to the first electrode and exposed to the outside of the case in the short direction of the first electrode;
An LED module comprising: a second heat application portion thermally connected to the second electrode and exposed to the outside of the case in a short direction of the second electrode.   2. The LED module according to claim 1, wherein the first heat application part and the second heat application part are connected in the vicinity of the center in the longitudinal direction of the first electrode and the second electrode. At least one of the first electrode and the second electrode is formed in a plate shape,
At least a part of the end portions of the first electrode and the second electrode formed in a plate shape has a thickness of the end portion of the electrode, and the center of the electrode having the end portion of the electrode. A plurality of parts that are thinner than the thickness of the vicinity are formed,
The plurality of thinned portions are formed symmetrically in at least one of a longitudinal direction and a short direction of the electrode. LED module. While the first electrode and the first heat application part are integrally formed, the second electrode and the second heat application part are also formed integrally,
The first heat application part and the second heat application part are both formed to be exposed to the outside of the case opposite to the side where the semiconductor light emitting element is disposed,
3. The LED module according to claim 1, wherein the first heat application part and the second heat application part have a uniform thickness. The LED module according to claim 1 or 2, and a circuit board for fixing the LED module,
At least the first electrode and the second electrode and an electric circuit formed on the circuit board are electrically connected by solder, and the LED module is fixed to the circuit board. , Lighting equipment.

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