TWI549323B - Semiconductor lead frame package and led package - Google Patents

Description

Semiconductor lead frame package and LED package

This invention relates to semiconductor packages and, more particularly, to semiconductor leadframe packages and light emitting diode (LED) packages.

For many lighting applications, light-emitting diode (LED) components are favored for their advantages such as low cost, low energy consumption, and related environmental benefits. A conventional LED component includes at least one LED package containing an LED chip. LED component efficiency depends not only on the quantum efficiency of the LED chip, but also on the package design.

LED components generate heat that must be dissipated during use. Heat not only causes inefficiency, but also affects the long-term reliability of LED components. Therefore, LED components typically include metal heat sinks for better heat dissipation.

Some LED packages include a pre-molded lead frame (rather than a conventional ceramic substrate) for carrying LED wafers. The pre-molded leadframe includes a pre-molded insulator to encapsulate a leadframe having a plurality of electrodes and a thermal pad. The electrodes and thermal pads are exposed on the bottom of the LED package.

However, conventional LED packages do not directly adhere to the conductive surface of the metal heat sink because the heat sink will short the exposed electrode of the LED package. Typically, printed circuit boards provide electrically insulated buffers between conventional LED packages and heat sinks to overcome this problem, but this solution adds significantly to manufacturing costs.

In addition, in order to reduce the thermal impedance between the LED package and the heat sink, the circuit board often has a thermal via (Metal Via) or a metal insert (Metal Insert). These features will further increase manufacturing costs.

Another LED package design (referred to as a Chip-On-Board (COB) package) includes an LED chip mounted on a Metal-Core Printed Circuit Board (MCPCB). The MCPCB typically includes an aluminum plate having an insulating layer coated on its front surface and a copper pattern on the insulating layer, the copper pattern providing electrical wiring and connections.

A surface-mount wafer (COB) LED package can be directly bonded to the conductive surface of the metal heat sink. However, heat transfer from the LED chip to the heat sink is significantly hindered by the insulating layer between the copper pattern and the aluminum core, which results in low heat dissipation efficiency.

According to an embodiment, a semiconductor lead frame package includes a die pad; a pin; a die disposed on a top surface of the die pad and electrically connected to a main portion of the pin, The main portion is disposed above the die pad. An insulating body partially encapsulates the die pad and the pin, and one of the electrode portions of the pin is folded onto a top surface of the insulating body, the electrode portion is parallel to the main portion, wherein a bottom surface of the die pad It is exposed from the bottom surface of one of the insulating bodies.

In one embodiment, the exposed bottom surface of the die pad directly contacts a heat sink. That is, the bottom surface of the die pad is thermally attached to the heat sink. Therefore, heat generated by the die can be quickly dissipated to the air through the die pad and the heat sink, which results in high heat dissipation efficiency.

In one embodiment, the pin includes the main portion, a connecting portion folded from the main portion, and the electrode portion folded from the connecting portion to the top surface of the insulative housing. The connecting portion of the pin is folded into a recess of the insulative housing such that the connecting portion is recessed from a side surface of the insulative housing. By causing the connecting portion to be recessed from the side surface of the insulating body, the short circuit between the pin and the heat sink is effectively reduced Opportunity.

1‧‧‧Semiconductor lead frame package

1a‧‧‧Semiconductor lead frame package

11‧‧‧External heat sink

12‧‧‧ die pad

14‧‧‧ pin

16‧‧‧ ribs

18‧‧‧Fixed components

20‧‧‧ strip section

22‧‧‧Insulated body

23‧‧‧Center opening

24‧‧‧ upper center opening

25‧‧‧ upper inner side wall

26‧‧‧ Lower central opening

27‧‧‧ Lower inner side wall

28‧‧‧LED dies

30‧‧‧Wire

32‧‧‧Package

33‧‧‧ top surface

34‧‧‧Connector

50‧‧‧fasteners

60‧‧‧External power supply circuit system

62‧‧‧Contacts or wires

111‧‧‧ openings

121‧‧‧ top surface

122‧‧‧ bottom

123‧‧‧ bottom

141‧‧‧ main part

141a‧‧‧ bottom

142‧‧‧Connected section

143‧‧‧Electrode part

181‧‧‧through hole

201‧‧‧First body part

202‧‧‧Second body part

221‧‧‧ top surface

222‧‧‧ bottom

223‧‧‧ notch

224‧‧‧ side surface

225‧‧‧ side wall

281‧‧‧Light conversion layer

341‧‧‧ center ring

342‧‧‧Top ribs

343‧‧‧Base

344‧‧‧ vertical part

1 illustrates a perspective view of a semiconductor leadframe package mounted to a heat sink in accordance with an embodiment; FIG. 2 illustrates a cross-sectional view taken along line 2-2 of FIG. 1; and FIG. 3 illustrates a line 3-3 along FIG. FIG. 4 illustrates a cross-sectional view of the semiconductor leadframe package of FIG. 4, the semiconductor leadframe package being connected to an external power supply circuit by wires FIG. 5 illustrates a perspective view of a semiconductor leadframe package in accordance with another embodiment; FIG. 6 illustrates a top view of the semiconductor leadframe package of FIG. 5 mounted to an external heat sink via a connector; FIG. 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , and 18 illustrate a process for fabricating a semiconductor lead frame package in accordance with an embodiment; 19 through 20 illustrate a process for fabricating a semiconductor leadframe package in accordance with another embodiment.

Referring to Figure 1, a semiconductor leadframe package 1 is illustrated in accordance with an embodiment. The semiconductor leadframe package 1 includes a die pad 12, at least one pin 14 (eg, two pins 14), at least one rib 16 (eg, four ribs 16), at least one securing element 18 (eg, Two fixing elements 18), an insulative body 22, at least one wire 30 (for example, three wires 30), at least one die 28 (for example, two die 28), at least one light conversion layer 281 (for example, two Light conversion layer 281), and package 32.

The die pad 12 is used to carry the die 28. In this embodiment, the die 28 is a light emitting diode (LED) die and adheres to the die pad 12. Therefore, the semiconductor lead frame package 1 is an LED Package. The material of the die pad 12 is a metal such as copper.

Although two dies 28 are illustrated in the figures, in another embodiment, the semiconductor leadframe package 1 includes only a single die 28. In yet another embodiment, the semiconductor leadframe package 1 includes more than two dies 28.

The insulative housing 22 (also referred to as a housing) partially encapsulates the die pad 12 and the leads 14 thereby forming a pre-molded leadframe, and the insulative housing 22 has a top surface 221, a bottom surface 222, and at least one recess 223 (eg, , two notches 223), and a central opening 23. The recess 223 is disposed on the edge of the insulative housing 22. More specifically, the side surface 224 of the insulative housing 22 extends perpendicularly between the top surface 221 and the bottom surface 222 of the insulative housing 22, and the recess 223 is formed in the side surface 224.

The upper inner side wall 25 of the insulative body 22 defines an upper central opening 24 in the insulative body 22. The lower inner side wall 27 of the insulative body 22 defines a central opening 26 at the lower portion of the insulative body 22. The central opening 23 includes a lower central opening 26 and an upper central opening 24.

The upper central opening 24 is in communication with the lower central opening 26 and the upper central opening 24 is sized larger than the lower central opening 26. The lower central opening 26 exposes a portion of the die pad 12, the die 28 is disposed over a portion of the exposed die pad 12, and the upper central opening 24 exposes a portion of the lead 14, and the wire 30 is bonded to a portion of the exposed pin 14. The material of the insulative body 22 may be a sealant material, such as a transparent or translucent polymer, Soft Gel, Elastomer, Resin, Epoxy Resin, Silicone. , or Epoxy-Silicone Hybrid Resin.

The two pins 14 are electrically isolated from the die pad 12, and each of the pins 14 has a main portion 141, a connection portion 142, and an electrode portion 143 (eg, as a positive electrode and a negative electrode). The main portion 141 is embedded in the insulative housing 22, and a portion of the main portion 141 is exposed from the upper central opening 24 of the insulative housing 22 and is electrically connected to the die 28 via wires 30. The connecting portion 142 connects the main portion 141 and the electrode portion 143 and is disposed at the recess 223 in.

In this embodiment, the connecting portion 142 extends beyond the insulative housing 22 and is disposed on the sidewall 225 of the recess 223 (see FIG. 4). The connecting portion 142 is folded such that the connecting portion 142 is substantially perpendicular to the main portion 141. Although various features may be described as being vertical, parallel, or otherwise, it will be understood by those skilled in the art that the features may be inaccurately perpendicular or parallel, but only within acceptable manufacturing tolerances. Vertical or parallel.

The electrode portion 143 is disposed on the top surface 221 of the insulative housing 22 and is used for external electrical connection. The electrode portion 143 is folded such that the electrode portion 143 is substantially perpendicular to the connecting portion 142, and the electrode portion 143 is substantially parallel to the main portion 141. In this embodiment, the material of the lead 14 (the main portion 141, the connecting portion 142, and the electrode portion 143) is a metal such as copper. Pin 14 and die pad 12 may be referred to as a leadframe.

The package 32 is disposed in the central opening 23 (ie, the lower central opening 26 and the upper central opening 24) to encapsulate the die 28 and the wires 30. The encapsulant 32 may be made of a transparent polymer or a translucent polymer (for example, a soft gel, an elastomer, a resin, an epoxy resin, a polyoxymethylene, or an epoxy-polyoxyl mixed resin).

In order to improve the uniformity of illumination from the die 28, light can be scattered as it is emitted. Thus, scattering particles can be added to the encapsulant 32 to randomly refract light as it passes through the encapsulant 32.

In this embodiment, the top surface 33 of the package 32 is coplanar with the top surface 221 of the insulative body 22; however, in other embodiments, the top surface 33 of the package 32 may be convex to form a convex lens structure.

The light conversion layer 281 is disposed between the package 32 and the die 28. Light conversion layer 281 substantially covers the top surface of die 28 and may also cover portions of each wire 30.

The light conversion layer 281 includes particles of a light conversion substance such as fluorescent particles. Light emitted from the die 28 (eg, blue light) can be converted to a different color by a light converting substance (such as green Light, yellow, and red), and the different colors can then be mixed to produce white light.

However, in other embodiments, the light conversion layer 281 can be omitted for a single color LED package. Alternatively, the light conversion layer 281 may be replaced by a light converting substance in the package 32.

Portions of the ribs 16 and the securing elements 18 are exposed from the insulative body 22. The fixing element 18 is connected to the die pad 12 via ribs 16. In this embodiment, the securing element 18 is a plate and has a through hole 181 for external connection. The material of the rib 16 and the fixing member 18 is a metal such as copper.

Referring to Figure 2, a cross-sectional view taken along line 2-2 of Figure 1 is illustrated in which the semiconductor leadframe package 1 is further mounted to an external heat sink 11 to form an LED module. The die pad 12 has a top surface 121 and a bottom surface 122. The die 28 is disposed on the top surface 121 of the die pad 12. The bottom surface 122 of the die pad 12 is coplanar with the bottom surface 222 of the insulative housing 22 so as to be exposed from the bottom surface 222 of the insulative housing 22 and directly contact the heat sink 11. That is, the bottom surface 122 of the die pad 12 is thermally attached to the heat sink 11.

Therefore, the heat generated by the die 28 can be quickly dissipated to the air by the die pad 12 and the heat sink 11, which results in high heat dissipation efficiency. In addition, the die pad 12, the ribs 16, and the fixing member 18 are the same plate formed by stamping, so that the rib 16 is bent, and the bottom surface 123 of the fixing member 18 is coplanar with the bottom surface 122 of the die pad 12. . The fixing member 18 is for fastening to the heat sink 11.

In this embodiment, the fastener 50 is located in the through hole 181 of the fixing member 18 and the opening 111 of the heat sink 11 to fasten the semiconductor lead frame package 1 to the heat sink 11. The fasteners 50 and the openings 111 of the fins 11 may have threads. However, it will be appreciated that the securing element 18 can be adhered or welded to the heat sink 11. In addition, the bottom surface 123 of the fixing member 18 is coplanar with the bottom surface 122 of the die pad 12 such that when the fixing member 18 is fastened to the heat sink 11, the bottom surface 122 of the die pad 12 simultaneously contacts the heat sink 11.

Referring to FIG. 3, a cross-sectional view along line 3-3 of FIG. 1 is illustrated in which the semiconductor leadframe package 1 is further mounted to the heat sink 11. The horizontal portion of the main portion 141 of the lead 14 is higher than the crystal grain The horizontal line of pad 12, i.e., the plane in which main portion 141 of pin 14 is located, lies above the plane in which die pad 12 is located. That is, the main portion 141 of the lead 14 is disposed over the die pad 12 and spaced apart from the die pad 12.

In the present embodiment, the bottom surface 141a of the main portion 141 of the lead 14 is covered by the insulative housing 22 so that the semiconductor lead frame package 1 can be directly mounted to the metal fins 11 without shorting the leads 14.

A portion of the insulative body 22 between the main portion 141 of the lead 14 and the die pad 12 defines a lower central opening 26, and a portion of the insulative body 22 on the main portion 141 of the pin 14 defines an upper central opening 24. More specifically, the lower inner sidewall 27 of the insulative body 22 extends between the main portion 141 of the lead 14 and the die pad 12 and defines a lower central opening 26. The upper inner sidewall 25 of the insulative housing 22 extends between the main portion 141 of the lead 14 and the top surface 221 of the insulative housing 22 and defines an upper central opening 24.

Referring to Figure 4, a cross-sectional view along line 4-4 of Figure 1 is illustrated. Referring to FIG. 4A, the semiconductor leadframe package 1 of FIG. 4 is connected to an external power supply circuitry 60 by a pair of contacts or wires 62 (only one of which is shown in FIG. 4A). The butt or wire 62 is secured to the leads. The exposed electrode portion 143 of 14. The external power supply circuitry 60 delivers current to the semiconductor leadframe package 1 such that the LED die 28 can produce light.

In this embodiment, the lead 14 (the main portion 141, the connecting portion 142, and the electrode portion 143) are integrally formed and folded twice to form the main portion 141, the connecting portion 142, and the electrode portion 143, respectively. One portion of the pin 14 (i.e., the connecting portion 142) is folded over the sidewall 225 of the recess 223 such that the connecting portion 142 is recessed from the side surface 224 of the insulative housing 22 and another portion of the pin 14 (i.e., the electrode) Portion 143) is further folded onto top surface 221 of insulative body 22.

The position of the recess 223 corresponds to the folded portion of the lead 14 (i.e., the connecting portion 142 and the electrode portion 143). In some embodiments, the connecting portion 142 is recessed from the side surface 224 of the insulative housing 22 by at least 0.15 mm, thereby effectively reducing the pin 14 and the heat sink 11 The chance of a short circuit between them is discussed further below.

In one embodiment, the semiconductor leadframe package 1 does not have a recess 223 and the connection portion 142 is disposed on the side surface 224, which shortens the distance between the pin 14 and the heat sink 11 and can result in a pin The possibility of a short circuit between the 14 and the heat sink 11 increases. In addition, in the illustrated embodiment, when viewed from the bottom surface 222 of the insulative housing 22, the bottom surface 122 of the die pad 12 is exposed, but the bottom surface 141a of the main portion 141 of the lead 14 is not exposed.

Referring to Figure 5, a semiconductor leadframe package 1a in accordance with another embodiment is illustrated. The semiconductor lead frame package 1a is substantially similar to the semiconductor lead frame package 1 of FIG. 1 and the same elements are given the same reference numerals. The difference between the semiconductor lead frame package 1a of this embodiment and the semiconductor lead frame package 1 of FIG. 1 is that the semiconductor lead frame package 1a does not have the fixing member 18 of the semiconductor lead frame package 1. Therefore, only a portion of the rib 16 is exposed from the side of the insulative body 22.

Referring to Fig. 6, a top view of Fig. 5 is illustrated in which the semiconductor lead frame package 1a is further mounted to the outer fins 11 via a connector 34 (hatched area in Fig. 6). The connector 34 includes a center ring 341, two top ribs 342, two bases 343, and two vertical portions 344. The center ring 341 is disposed on the top surface 221 of the insulative housing 22 and corresponds to the central opening 24 of the upper portion of the insulative housing 22. The inner diameter of the center ring 341 is slightly larger than the diameter of the upper central opening 24.

The top rib 342 extends from the center ring 341 to the two corners of the insulative body 22 and is coupled to the base 343 via two vertical portions 344, respectively. The bottom surface of the base 343 is coplanar with the bottom surface 122 of the die pad 12, and each of the bases 343 is shaped to fit the corner of the insulative housing 22 to lock the insulative housing 22. The fastener 50 is used to fasten the semiconductor lead frame package 1a to the heat sink 11 through a through hole (not shown) of the base 343.

Referring to Figures 7 through 18, a semiconductor process for fabricating a semiconductor leadframe package in accordance with an embodiment is illustrated.

Referring to Figure 7, a lead frame is provided. The leadframe includes a plurality of strip portions 20 that traverse each other to define a plurality of cells. Each of the units includes a die pad 12, at least one pin 14. At least one rib 16, at least one fixing element 18, at least one first rod portion 201 and at least one second rod portion 202. The pattern of the leadframe can be formed by stamping or etching a copper plate.

In this embodiment, each of the units includes two pins 14, four ribs 16, and two securing elements 18. In this embodiment, each of the fastening elements 18 is plated and has a through hole 181 for external connection. The ribs 16 connect the fixing member 18 and the die pad 12, and the fixing member 18 is coupled to the strip portion 20 by the first body portion 201. The leads 14 extend along the die pad 12 without the die pad 12 being attached. Each of the pins 14 has a main portion 141, a connecting portion 142, and an electrode portion 143. The connecting portion 142 connects the main portion 141 and the electrode portion 143. The electrode portion 143 is connected to the strip portion 20 by the second rod portion 202.

Referring to Figure 8, a cross-sectional view taken along line 8-8 of Figure 7 is illustrated. The die pad 12 has a top surface 121 and a bottom surface 122. The main portion 141 has a bottom surface 141a. The horizontal line of the main portion 141 of the pin 14 is higher than the horizontal line of the die pad 12. That is, the main portion 141 of the lead 14 is disposed over the die pad 12 and spaced apart from the die pad 12.

Referring to Figure 9, a cross-sectional view along line 9-9 of Figure 7 is illustrated. In this embodiment, the die pad 12, the ribs 16, and the fixing member 18 are the same plate formed by stamping, so that the rib 16 is bent, and the bottom surface 123 of the fixing member 18 is bonded to the die pad 12 The bottom surface 122 is coplanar. Therefore, when the fixing member 18 is fastened to the heat sink 11 (FIG. 2), the bottom surface 122 of the die pad 12 simultaneously contacts the heat sink 11.

Referring to FIG. 10, an insulative housing 22 is formed to partially encapsulate the die pad 12 and the leads 14, and the insulative housing 22 has at least one recess 223 and a central opening 23. The recess 223 is disposed on the edge of the insulative housing 22. The central opening 23 includes a lower central opening 26 and an upper central opening 24. The upper central opening 24 is in communication with the lower central opening 26 and the upper central opening 24 is sized larger than the lower central opening 26. The lower central opening 26 exposes a portion of the die pad 12, the die 28 is disposed in a portion of the exposed die pad 12, and the upper central opening 24 is exposed A portion of the main portion 141 of the pin 14 is bonded to a portion of the main portion 141 of the exposed pin 14. The material of the insulative body 22 may be a sealant material, such as a transparent or translucent polymer, Soft Gel, Elastomer, Resin, Epoxy Resin, Silicone. , or Epoxy-Silicone Hybrid Resin. .

Referring to Figure 11, a cross-sectional view taken along line 11-11 of Figure 10 is illustrated. The insulative housing 22 further has a top surface 221, a bottom surface 222, at least one recess 223, and a central opening 23. A portion of the insulative body 22 between the main portion 141 of the lead 14 and the die pad 12 defines a lower central opening 26, and a portion of the insulative body 22 on the main portion 141 of the pin 14 defines an upper central opening 24.

Referring to Figure 12, a cross-sectional view along line 12-12 of Figure 10 is illustrated. The bottom surface 122 of the die pad 12 is coplanar with the bottom surface 222 of the insulative housing 22 for exposure from the bottom surface 222 of the insulative body 22. Portions of the ribs 16 and the securing elements 18 are exposed from the insulative body 22.

Referring to Figure 13, a cross-sectional view along line 13-13 of Figure 10 is illustrated. The position of the recess 223 corresponds to the connecting portion 142 of the lead 14 and the electrode portion 143. Therefore, the connecting portion 142 and the electrode portion 143 extend beyond the insulating body 22 through the recess 223.

Referring to Figure 14, the die 28 is attached to the top surface 121 of the die pad 12. In this embodiment, the die 28 is a light emitting diode (LED) die and adheres to the die pad 12. Next, at least one wire 30 is bonded from die 28 to the exposed portion of main portion 141 of pin 14. Next, the light conversion layer 281 is coated to cover the top surface of the die 28 and may also cover portions of each of the wires 30.

The light conversion layer 281 includes particles of a light conversion substance such as fluorescent particles. Light emitted from the die 28 (e.g., blue light) can be converted to light of different colors (such as green, yellow, and red) by the light converting material, and the different colors can then be mixed to produce white light. However, in other embodiments, the light conversion layer 281 can be omitted for a single color LED package.

Next, the package 32 is applied to the central opening 23 (ie, the lower central opening 26 and above) In the central opening 24), the die 28 and the wire 30 are packaged. The encapsulant 32 may be made of a transparent polymer or a translucent polymer (for example, a soft gel, an elastomer, a resin, an epoxy resin, a polyoxymethylene, or an epoxy-polyoxyl mixed resin).

In order to improve the uniformity of illumination from the die 28, light can be scattered as it is emitted. Thus, scattering particles can be added to the encapsulant 32 to cause the light to refract randomly as it passes through the encapsulant 32. In this embodiment, the top surface 33 of the package 32 is coplanar with the top surface 221 of the insulative body 22; however, in other embodiments, the top surface of the package 32 may be convex to form a convex lens structure.

Referring to Figures 14 and 15, the second shaft portion 202 is cut away.

Referring to Figure 16, the connecting portion 142 of the pin 14 is folded upward.

Referring to Figure 17, a cross-sectional view taken along line 17-17 of Figure 16 is illustrated. In this embodiment, the connecting portion 142 is folded over the side wall 225 of the recess 223 and is substantially perpendicular to the main portion 141. At the same time, the electrode portion 143 of the pin 14 protrudes from the top surface 221 of the insulative body 22.

Referring to Figure 18, the electrode portion 143 of the pin 14 is folded over the top surface 221 of the insulative body 22 such that the electrode portion 143 is substantially perpendicular to the connecting portion 142 and the electrode portion 143 is substantially parallel to the main portion 141. The electrode portion 143 is used for external electrical connection. Next, the first body portion 201 is cut away to obtain the semiconductor lead frame package 1 of FIG.

Referring to Figures 19 through 20, a semiconductor process for fabricating a semiconductor leadframe package in accordance with another embodiment is illustrated.

Referring to Figure 19, a lead frame is provided. The lead frame of this embodiment is substantially similar to the lead frame of Figure 7, and the same elements are given the same reference numerals. The difference between the lead frame of this embodiment and the lead frame of Fig. 7 is that the lead frame of this embodiment does not have the fixing member 18 of the lead frame of Fig. 7, and the ribs 16 directly connect the strip portion 20. Therefore, in the lead frame of the same size, the design of this embodiment has more cells, which increases the package density.

Referring to Figure 20, an insulative body 22 is formed to partially encapsulate the die pad 12 and leads 14, as in Figure 10. Next, the die 28 is attached to the top surface 121 of the die pad 12, and the wire 30 is self-made. 28 is bonded to the exposed portion of the main portion 141 of the lead 14, coated with a light conversion layer 281 to cover the top surface of the die 28, and may also cover portions of each of the wires 30, as in Figures 10 and 14.

The subsequent steps of this embodiment are the same as those of Figures 15 through 18 in order to obtain the semiconductor leadframe package 1a of Figure 5.

The present invention has been described and illustrated with reference to the particular embodiments of the invention. It will be understood by those skilled in the art that various changes may be made and the equivalents may be substituted without departing from the true spirit and scope of the invention as defined by the appended claims. The descriptions may not necessarily be drawn to scale. There is a difference between the technical translation in the present invention and the actual device attributable to the manufacturing process and tolerance. Other embodiments of the invention that are not specifically described may exist. The description and drawings are to be regarded as illustrative rather Modifications may be made to adapt a particular situation, material, combination of matter, method or procedure to the objects, spirit and scope of the invention. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to the specific operations performed in a particular order, it is understood that such operations can be combined, sub-divided or re-ordered to form, etc. without departing from the teachings of the present invention. Effective method. Therefore, the order and grouping of such operations are not limiting of the invention unless specifically indicated herein.

1‧‧‧Semiconductor lead frame package

11‧‧‧External heat sink

12‧‧‧ die pad

14‧‧‧ pin

16‧‧‧ ribs

18‧‧‧Fixed components

22‧‧‧Insulated body

23‧‧‧Center opening

24‧‧‧ upper center opening

25‧‧‧ upper inner side wall

26‧‧‧ Lower central opening

27‧‧‧ Lower inner side wall

28‧‧‧LED dies

30‧‧‧Wire

32‧‧‧Package

50‧‧‧fasteners

121‧‧‧ top surface

141‧‧‧ main part

142‧‧‧Connected section

143‧‧‧Electrode part

181‧‧‧through hole

221‧‧‧ top surface

222‧‧‧ bottom

223‧‧‧ notch

224‧‧‧ side surface

281‧‧‧Light conversion layer

Claims (20)

A semiconductor package structure comprising: a die pad; a lead; a die disposed on a top surface of the die pad and electrically connected to one of the pins The main portion is disposed above the die pad; and an insulative body partially encapsulating the die pad and the pin, and one of the pin portions is folded to a top surface of the insulative body, The electrode portion is parallel to the main portion, wherein a bottom surface of the die pad is exposed from a bottom surface of the insulating body. The semiconductor package structure of claim 1, wherein the bottom surface of the die pad is coplanar with the bottom surface of the insulating body. The semiconductor package structure of claim 1, wherein a plane in which the main portion of the pin is located is spaced apart from a plane in which the die pad is located. The semiconductor package structure of claim 1, wherein a bottom surface of one of the main portions of the pin is covered by the insulating body. The semiconductor package structure of claim 1, further comprising a heat sink, the bottom surface of the die pad directly contacting the heat sink. The semiconductor package structure of claim 5, further comprising a fixing component coupled to the die pad and fastened to the heat sink, wherein the bottom surface of the insulating body, the bottom surface of the die pad, and the One of the bottom surfaces of the fixing member is coplanar and directly contacts the heat sink. The semiconductor package structure of claim 1, wherein the pin further comprises a connection portion perpendicular to the main portion and the electrode portion. The semiconductor package structure of claim 1, wherein the insulating body comprises a lower inner side a wall, the lower inner sidewall extending between the main portion of the lead and the die pad, the lower inner sidewall defining a lower central opening that exposes the die pad. The semiconductor package structure of claim 8, wherein the insulative housing comprises an upper inner sidewall extending between the top surface of the insulative housing and the main portion of the lead, the upper inner sidewall defining an upper portion a central opening that exposes the major portion of the pin. The semiconductor package structure of claim 1, wherein the insulative housing further comprises an upper central opening and a lower central opening, the upper central opening exposing the main portion of the lead, the lower central opening exposing the die pad, the upper portion The central opening and the lower central opening define a central opening of the insulative body, the structure further comprising: an encapsulation disposed in the central opening. The semiconductor package structure of claim 10, wherein a top surface of the package is coplanar with the top surface of the insulating body. A semiconductor package structure comprising: a die pad; a pin comprising: a main portion; a connection portion; and an electrode portion; a die disposed on the die pad and electrically connected to the pin The main portion; and an insulative housing partially encapsulating the die pad and the main portion of the pin, the insulative body comprising: a top surface having the electrode portion disposed thereon; a bottom surface; and a side surface extending between the top surface and the bottom surface, the side surface including a notch, the connecting portion being disposed in the recess. The semiconductor package structure of claim 12, wherein the connecting portion is recessed from the side surface. The semiconductor package structure of claim 12, wherein the recess comprises a sidewall, the connecting portion being disposed on the sidewall. The semiconductor package structure of claim 12, wherein the connecting portion is perpendicular to the main portion and the electrode portion, and the main portion is parallel to the electrode portion. The semiconductor package structure of claim 12, wherein the insulative housing further comprises a central opening, the central opening comprising: a lower central opening exposing the die pad; and an upper central opening exposing the main portion of the pin section. The semiconductor package structure of claim 16, wherein the die is a light emitting diode (LED) die, the structure further comprising an encapsulation in the central opening and encapsulating the LED die. A method of fabricating a semiconductor package structure, comprising: partially packaging a die pad and a pin in an insulative body, wherein a bottom surface of the die pad is exposed from a bottom surface of the insulative body; attaching a crystal Graining to a top surface of the die pad; bonding a wire from the die to a main portion of the pin; and folding a connecting portion of the pin to a sidewall of one of the recesses of the insulating body . The method of claim 18, further comprising: folding one of the electrode portions of the pin to a top surface of the insulative body. The method of claim 19, wherein the bottom surface of the insulating body and the die pad The bottom surface is coplanar, and the method further comprises: directly contacting a heat sink to the bottom surface of the insulating body and the bottom surface of the die pad.