TW201407748A - LED light bar - Google Patents

Abstract

An LED light bar includes a substrate and at least one LED package disposed on the substrate. At least one recess corresponding to each LED package is formed in the substrate to receive the LED package therein. A first connecting electrode and a second connecting electrode are disposed on the inner wall of the substrate and in the recess. Each LED package includes a first electrode, a second electrode insulated from the first electrode and an LED chip electrically connecting to the first electrode and the second electrode. Each LED package is correspondingly received in the recess, wherein the first electrode is electrically connected to the first connecting electrode and the second electrode is electrically connected to the second connecting electrode.

Description

LED light bar

The present invention relates to the field of semiconductor illumination, and in particular to a light-emitting diode light bar.

As a highly efficient light source, Light Emitting Diode (LED) has many characteristics such as environmental protection, energy saving and long life. It has been widely used in various fields, such as backlights used in liquid crystal displays.

In the field of display imaging, a plurality of light-emitting diode package components are generally disposed on a circuit board to form a light bar, and then the light bar is disposed on the backlight module or the light board. The plurality of LED package components are fixed on the circuit board by solder joints and electrically connected to the circuit structure of the circuit board. This will increase the overall thickness of the light bar, which is not conducive to the thinning of the light bar.

In view of the above, it is necessary to provide a thinned light-emitting diode light bar.

A light-emitting diode light bar comprising a circuit board and a light-emitting diode package component fixed on the circuit board, wherein the circuit board is formed with a mounting groove corresponding to the light-emitting diode package component, the circuit a first contact electrode and a second contact electrode are disposed in the mounting groove, and the LED package component comprises a light emitting diode chip and a first electrode and a second electrode electrically connected to the light emitting diode chip. The light emitting diode package component is housed in the mounting groove, and the first electrode and the second electrode are electrically connected to the first contact electrode and the second contact electrode, respectively.

In the present invention, the corresponding light-emitting diode package component on the circuit board is provided with a mounting groove, and the light-emitting diode package component is correspondingly received in the mounting groove, which can effectively reduce the overall thickness of the light-emitting diode light bar. .

Referring to FIG. 1 and FIG. 2 , the LED strip 100 of the first embodiment of the present invention includes a circuit board 20 and a light emitting diode package component 10 fixed on the circuit board 20 . A mounting groove 23 is formed on the circuit board 20 corresponding to the LED package component 10. The circuit board 20 includes opposing upper and lower surfaces. The mounting groove 23 penetrates the upper and lower surfaces of the circuit board 20. The circuit board 20 is provided with a first contact electrode 21 and a second contact electrode 22 in the mounting groove 23. The LED package component 10 is received in the mounting groove 23 and electrically connected to the first contact electrode 21 and the second contact electrode 22, respectively.

Referring to FIG. 3 and FIG. 4 , the LED package component 10 includes a heat dissipation block 13 , a light emitting diode chip 15 disposed on the heat dissipation block 13 , and a reflective cup disposed around the LED chip 15 . 16. The first electrode 11 and the second electrode 12 respectively disposed on opposite sides of the reflective cup 16, the insulating layer 14 respectively connecting the heat dissipation block 13 and the first electrode 11 and the second electrode 12, and being received in the reflective cup 16 and The transparent encapsulation layer 17 over the LED substrate 15 is covered.

The first electrode 11 and the second electrode 12 respectively extend from the bottom of the reflective cup 16 to the sidewall of the reflective cup 16 and abut against the first contact electrode 21 and the second contact electrode 22 of the circuit board, respectively. The inner surfaces of the first electrode 11 and the second electrode 12 closely fit on the outer wall of the reflective cup 16.

The cross-sectional shape of the first electrode 11 and the second electrode 12 is substantially "L" shaped. The first electrode 11 and the second electrode 12 are exposed at the bottom of the reflective cup 16. Each of the first electrode 11 and the second electrode 12 is integrally formed by bending a metal plate body having good conductivity and ductility, such as silver, copper, and gold. Specifically, a “V” shaped groove may be firstly formed on the upper surface of the metal plate body, and then one end of the metal plate body is bent toward the other end of the metal plate body along the opening direction of the “V” shaped groove. An "L" shaped electrode can be formed by folding.

The heat dissipating block 13 is made of a metal material having good thermal conductivity, and is used to derive heat generated during operation of the light emitting diode chip 15. The heat sink block 13 includes a top surface and a bottom surface that are oppositely disposed. The LED chip 15 is disposed on the top surface of the heat dissipation block 13 and electrically connected to the first electrode 11 and the second electrode 12 at the bottom of the reflective cup 16 by wires (not shown).

The insulating layer 14 is made of a plastic material and is used to electrically block the heat dissipating block 13 from the first electrode 11 and the second electrode 12. The insulating layer 14 is disposed on opposite sides of the heat dissipation block 13 and between the first electrode 11 and the second electrode 12 and the heat dissipation block 13 to ensure electrical safety of the LED package component 10 during use. .

The light emitting diode chip 15 is located at the bottom of the reflective cup 16. In this embodiment, the reflector cup 16 and the insulating layer 14 are made of the same material and integrally formed. In other embodiments, the material of the reflective cup 16 and the insulating layer 14 may be different, and the reflective cup 16 and the insulating layer 14 may be separately formed.

The transparent encapsulating layer 17 is a transparent material composed of silicone, epoxy resin or other polymer. The transparent encapsulation layer 17 is located in the reflective cup 16 and covers the LED array 15 . Preferably, the transparent encapsulating layer 17 further comprises phosphor powder for converting the light emitted by the LED chip 15.

Referring to FIG. 5 and FIG. 6 simultaneously, the printed circuit board 20 is formed with a mounting slot 23 corresponding to the LED package component 10. The circuit board 20 includes opposing upper and lower surfaces that extend longitudinally through the upper and lower surfaces of the circuit board 20. The circuit board 20 is made of a material having good thermal conductivity and insulation properties, such as an aluminum nitride ceramic. The mounting slot 23 is located on one side of the circuit board 20, that is, the mounting slot 23 is recessed inwardly from one side of the circuit board 20. In this embodiment, the mounting slots 23 are two and disposed side by side on the same side of the circuit board 20. In other embodiments, the mounting slots 23 may be multiple, and the mounting slots 23 may be alternately disposed on opposite sides of the circuit board 20.

The circuit board 20 is provided with a first contact electrode 21, a second contact electrode 22 and a heat conducting member 25 in the mounting groove 23.

The heat conducting member 25, the first contact electrode 21, and the second contact electrode 22 are respectively disposed on different sidewalls in the mounting groove 23 of the circuit board 20. The first contact electrode 21 and the second contact electrode 22 are disposed on the opposite sidewalls of the circuit board 20 in the mounting groove 23. The heat conducting member 25 is disposed adjacent to the first contact electrode 21 and the second contact electrode 22 at the bottom of the other side wall of the circuit board 20 located in the mounting groove 23. The circuit board 20 is further provided with a connection electrode 24 that connects the two adjacent first contact electrodes 21 and the second contact electrodes 22.

The first contact electrode 21 and the second contact electrode 22 extend vertically downward from the upper surface of the circuit board 20 along the side wall surface of the circuit board 20 located in the mounting groove 23. The tops of the first contact electrode 21 and the second contact electrode 22 are flush with the upper surface of the circuit board 20. The bottoms of the first contact electrode 21 and the second contact electrode 22 are kept at a distance from the lower surface of the circuit board 20.

The heat conducting member 25 extends vertically upward from a lower surface of the circuit board 20 along a side wall surface of the circuit board 20 located in the mounting groove 23. The bottom of the heat conducting member 25 is flush with the lower surface of the circuit board 20. The top of the heat conducting member 25 is at a distance from the upper surface of the circuit board 20. The heat conducting member 25 is made of the same metal as the heat dissipating block 13 and is made of the same metal having good thermal conductivity, such as silver, copper, or aluminum. Further, in order to reduce the thermal resistance between the heat conducting member 25 and the circuit board 20, the material of the heat conducting member 25 may be the same as that of the circuit board 20. Further, in order to improve the heat conduction efficiency, the heat dissipation area of the heat conductive member 25 is larger than the heat dissipation area of the heat dissipation block 13.

The connection electrode 24 electrically connects the first contact electrode 21 in one of the two adjacent mounting grooves 23 with the second contact electrode 22 in the other mounting groove 23. The connection electrode 24 is embedded on the upper surface of the circuit board 20. It can be understood that, in order to facilitate the arrangement of the connecting electrode 24, a slot can be formed on the upper surface of the circuit board 20 in advance, and the connecting electrode 24 is embedded in the recessed groove and respectively adjacent to the two mounting slots 23 The first contact electrode 21 in one of the mounting slots 23 and the second contact electrode 22 in the other mounting slot 23 are electrically connected.

In other embodiments, the first contact electrode 21 and the second contact electrode 22 and the heat conducting member 25 may be embedded on the sidewall of the circuit board 20 in the mounting slot 23, and the connecting electrode 24 may be mounted on the circuit board. On the upper surface of 20.

Referring to FIG. 1 and FIG. 2 again, in the process of assembling the LED light bar 100, the LED package component 10 is embedded and correspondingly received in the mounting groove 23. The LED package component 10 emits light toward the side of the circuit board 20, that is, the LED strip 100 is a lateral illumination structure.

The first electrode 11 and the second electrode 12 of the light emitting diode package component 10 are electrically connected to the first contact electrode 21 and the second contact electrode 22 in the mounting groove 23, respectively. The heat dissipating block 13 of the LED package component 10 is closely attached to the heat conducting member 25 in the mounting groove 23. The connecting electrode 24 electrically connects the first contact electrode 21 of the circuit board 20 located in one of the mounting slots 23 in the adjacent mounting slot 23 with the second contact electrode 22 in the other mounting slot 23, thereby being adjacent The light emitting diode package components 10 are connected in series with each other.

The LED package component 10 corresponds in shape to the mounting groove 23. The LED package component 10 is embedded and correspondingly received in the mounting groove 23 . The top surface of the LED package component 10 is flush with the side edge of the circuit board 20.

Referring to Figures 7 and 8, a light-emitting diode light bar 100a of a second embodiment of the present invention is illustrated. The light emitting diode package component 10 of the second embodiment is different from the light emitting diode light bar 100 of the first embodiment in that the light emitting diode package component 10 of the second embodiment faces the circuit board. The upper surface or the lower surface of the light 20 emits light, that is, the light-emitting diode light strip 100a is a top light-emitting structure.

The light emitting surface of the LED package component 10 is flush with the upper surface of the circuit board 20. The bottom surface of the LED package component 10 is flush with the lower surface of the circuit board 20. The side surface of the heat dissipation block 13 at the bottom of the light emitting diode package component 10 abuts against the heat conduction member 25.

The bottom surface of the heat dissipating block 13 at the bottom of the LED package component 10 is in contact with the air and dissipates a part of the heat generated when the LED package component 10 operates to the air. Further, the light-emitting diode strip 100a can be disposed on a heat sink (not shown), and the heat-dissipating block 13 at the bottom of the LED package component 10 is directly adhered to the heat sink for The large amount of heat generated by the light emitting diode package component 10 is quickly derived.

In the present invention, the corresponding LED component 10 of the circuit board 20 of the LED strip 100, 100a is provided with a mounting slot 23, and the LED package component 10 is embedded and correspondingly received in the mounting slot. 23 inside. This can effectively reduce the overall thickness of the LED strips 100, 100a. When the LED strips 100, 100a are disposed in the backlight module, the thickness of the entire display device can be further thinned. At the same time, the laterally-emitting light-emitting diode light bar 100 and the top-emitting light-emitting diode light bar 100a can be mutually converted, only from the laterally-emitting light-emitting diode light bar 100 or the top light-emitting The light-emitting diode package 100 is removed from the LED package 100 and the angle of the LED package 10 embedded in the circuit board 20 is readjusted to obtain an expected light distribution, which saves time and labor.

It can be understood that the mounting slot 23 in the LED strip 100a of the second embodiment of the present invention can also be disposed at the center of the circuit board 20 according to actual needs.

In the light-emitting diode light bar 100 of the first embodiment of the present invention and the light-emitting diode light bar 100a of the second embodiment, a first lead may be disposed on the upper surface of the circuit board 20. a terminal (not shown), one end of the first lead terminal is electrically connected to the connection electrode 24, and the other end of the first lead terminal is electrically connected to an anode of an external power source (not shown), and is located at the outermost side of the circuit board 20. The first contact electrode 21 in one of the two mounting slots 23 and the second contact electrode 22 in the other mounting slot 23 are electrically connected by a wire (not shown), and the circuit board 20 is further disposed. a second lead terminal (not shown), one end of the second lead terminal is electrically connected to the wire, and the other end of the second lead terminal is connected to the cathode of the external power source, thereby illuminating the adjacent mounting groove 23 The diode package components 10 are connected in parallel with each other.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100, 100a. . . LED light bar

10. . . LED package component

11. . . First electrode

12. . . Second electrode

13. . . Heat sink

14. . . Insulation

15. . . Light-emitting diode chip

16. . . Reflective cup

17. . . Transparent encapsulation layer

20. . . Circuit board

twenty one. . . First contact electrode

twenty two. . . Second contact electrode

twenty three. . . Mounting slot

twenty four. . . Connecting electrode

25. . . Heat conductive member

1 is a plan view of a light-emitting diode light bar according to a first embodiment of the present invention.

2 is a cross-sectional view of the light-emitting diode light bar shown in FIG. 1 taken along line II-II when all of the light-emitting diode package components are housed in the mounting groove.

3 is a cross-sectional view of the light emitting diode package component of the light emitting diode light bar shown in FIG. 1.

4 is a top plan view of a light emitting diode package component of the light emitting diode light bar shown in FIG. 1.

Figure 5 is a top plan view of the circuit board of the light-emitting diode light bar shown in Figure 1.

Figure 6 is a cross-sectional view of the circuit board shown in Figure 5 taken along line VI-VI.

Fig. 7 is a plan view showing a light-emitting diode light bar of a second embodiment of the present invention.

FIG. 8 is a cross-sectional view of the light-emitting diode light bar shown in FIG. 7 taken along line VIII-VIII when all of the light-emitting diode package components are housed in the mounting groove.

100. . . LED light bar

10. . . LED package component

11. . . First electrode

12. . . Second electrode

13. . . Heat sink

14. . . Insulation

15. . . Light-emitting diode chip

16. . . Reflective cup

20. . . Circuit board

twenty one. . . First contact electrode

twenty two. . . Second contact electrode

twenty three. . . Mounting slot

twenty four. . . Connecting electrode

25. . . Heat conductive member

Claims (11)

A light-emitting diode light bar comprising a circuit board and a light-emitting diode package component fixed on the circuit board, wherein the circuit board is formed with a mounting groove corresponding to the light-emitting diode package component The circuit board is provided with a first contact electrode and a second contact electrode in the mounting groove, and the LED package component comprises a light emitting diode chip and a first electrode and a first electrode electrically connected to the light emitting diode chip In the two electrodes, the LED package component is housed in the mounting groove, and the first electrode and the second electrode are electrically connected to the first contact electrode and the second contact electrode, respectively. The light-emitting diode light strip of claim 1, wherein the light-emitting diode package component further comprises a reflective cup disposed around the light-emitting diode wafer, the first electrode and the second electrode. The electrodes extend from the bottom of the reflector cup to the sidewall of the reflector cup and abut against the first contact electrode and the second contact electrode of the circuit board, respectively. The light-emitting diode light bar of claim 2, wherein the first electrode and the second electrode are respectively disposed on opposite sides of the reflective cup, and the first contact electrode and the second contact electrode are respectively The circuit board is disposed on opposite side walls of the mounting slot. The light-emitting diode light bar of claim 3, wherein the light-emitting diode package component and the corresponding mounting groove are plural, and the circuit board is further provided with a connection electrode, the connection The electrodes electrically connect adjacent two contact electrodes of the circuit board in different mounting slots, thereby connecting adjacent light emitting diode package components to each other in series or in parallel. The light-emitting diode light bar of claim 1, wherein the circuit board includes opposite upper and lower surfaces, and the light-emitting diode package component faces an upper surface of the circuit board or Light is emitted in the direction of the lower surface. The light-emitting diode light bar of claim 1, wherein the mounting groove is located at one side of the circuit board, and the mounting groove is formed by an inward recess of one side of the circuit board. The light emitting diode package component emits light toward a side of the circuit board. The light-emitting diode package of claim 1, wherein the light-emitting diode package further includes a heat-dissipating block, wherein the light-emitting diode chip is disposed on the heat-dissipating block, The first electrode and the second electrode are electrically insulated from the heat dissipating block. The circuit board is further provided with a heat conducting member in the mounting groove, and the heat dissipating block of the LED package component is in thermal contact with the heat conducting member of the circuit board. The light-emitting diode light bar of claim 7, wherein the heat-dissipating block is attached to the heat-conducting member away from the bottom surface of the light-emitting diode chip. The light-emitting diode light bar of claim 7, wherein the heat-conducting member, the first contact electrode and the second contact electrode are respectively disposed on different sidewalls in the mounting groove of the circuit board. The light-emitting diode light bar of claim 7, wherein the side surface of the heat-dissipating block is attached to the heat-conducting member. The light-emitting diode light bar of claim 10, wherein the heat-conducting member is disposed at a bottom of a sidewall of the mounting groove of the circuit board.