KR101201558B1 - LED package - Google Patents

Abstract

PURPOSE: An LED package is provided to efficiently discharge heat from an LED chip by reducing the thickness of an anode electrode plate and a substrate. CONSTITUTION: An insulation layer(110) is formed on an anode electrode plate(100). A cathode electrode(120) is formed on the upper side of the insulation layer. A first electrode pad(201) is formed on the lower side of a light emitting structure(202). A second electrode pad(203) is formed on the upper side of the light emitting structure. A wire(190) is connected to the second electrode and the cathode electrode.

Description

LED package {LED package}

The present invention relates to an LED package.

In general, a light emitting diode (hereinafter referred to as 'LED') refers to a device that generates light by using an electric field emission phenomenon generated by applying a voltage to a semiconductor, and is a backlight of a liquid crystal display (LCD). The use of LED as a unit is widely used.

Here, the LED is an all-light conversion semiconductor device having a structure in which a p-type semiconductor crystal and an n-type semiconductor crystal are bonded to each other, and are used as various display light source devices because of the property of converting an electrical signal into light. In addition, the light efficiency of the LED is determined by the reflective structure of the package, and the reliability is determined by the heat dissipation capacity from the lead frame structure including the package, the luminance of light emitted to the outside, the uniformity of the luminance, and the like.

The current application trend of the LED package is progressing from the simple indicator of the electronic device to the backlight unit of the indirect lighting / LCD TV through the flash lamp of the mobile phone, and is more likely to proceed to the direct lighting.

The present invention is to solve the problem that can reduce the manufacturing cost by simplifying the structure.

The present invention,

A positive electrode plate;

An insulating layer formed in said anode electrode plate and having an opening for exposing said anode electrode plate;

A cathode electrode formed on the insulating layer;

And a light emitting structure, a first electrode pad formed under the light emitting structure, and a second electrode pad formed on the light emitting structure, wherein the first electrode pad is bonded with solder to the anode electrode plate exposed to the opening. An LED chip;

An LED package including a wire bonded to the second electrode and the cathode electrode is provided.

In one embodiment of the present invention, the opening may be a plurality of openings formed in a row and a row in the insulating layer, and the cathode electrode may be a cathode electrode line formed along a column of the plurality of openings. .

The anode electrode plate may be a common electrode of the LED chips.

In addition, a plurality of grooves may be formed on a bottom surface of the cathode electrode plate.

The plurality of grooves may be formed in a bottom region of the anode electrode plate corresponding to a region in which the LED chip is located.

In addition, a material or a structure having better heat dissipation efficiency than the anode electrode plate may be inserted into the groove.

The present invention,

A substrate;

A first insulating layer formed on the substrate;

An anode electrode formed on the first insulating layer;

A second insulating layer having an opening exposing the anode electrode;

A cathode electrode formed on the second insulation layer;

And a light emitting structure, a first electrode pad formed under the light emitting structure, and a second electrode pad formed on the light emitting structure, wherein the first electrode pad is bonded with solder to the anode electrode plate exposed to the opening. An LED chip;

An LED package including a wire bonded to the second electrode and the cathode electrode is provided.

According to an embodiment of the present invention, the anode electrode is a plurality of anode electrode lines, the openings are a plurality of openings formed in a row and a row in the second insulating layer, and the cathode electrode is the plurality of openings. It may be cathode electrode lines formed along a row of openings.

The plurality of anode electrode lines and the plurality of cathode electrode lines may cross each other.

The LED package of the present invention can effectively release the heat generated from the LED chip through the anode electrode plate, there is an effect that can reduce the manufacturing cost by simplifying the structure.

1 is a conceptual cross-sectional view for explaining the LED package according to the first embodiment of the present invention
2 is a conceptual plan view for explaining the electrode arrangement of the LED package according to the first embodiment of the present invention
3 is a conceptual cross-sectional view illustrating an LED package according to a second embodiment of the present invention.
4 is a conceptual plan view for explaining the electrode arrangement of the LED package according to a second embodiment of the present invention
5 is a conceptual perspective view for explaining a state of an example of the bottom of the LED package according to the present invention;
6 is a conceptual cross-sectional view for explaining a state of another example of the bottom of the LED package according to the present invention;

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a conceptual cross-sectional view for explaining the LED package according to the first embodiment of the present invention.

The LED package according to the first embodiment of the present invention is a positive electrode plate 100; An insulating layer (110) formed in the positive electrode plate (100) and having an opening (111) exposing the positive electrode plate (100); A cathode electrode 120 formed on the insulating layer 110; And a light emitting structure 202, a first electrode pad 201 formed under the light emitting structure 202, and a second electrode pad 203 formed on the light emitting structure 202. An LED chip (200) bonded with solder (130) to the anode electrode plate (100) in which (201) is exposed to the opening (111); The wire 190 is bonded to the second electrode 203 and the cathode electrode 120.

Therefore, in the LED package according to the first embodiment of the present invention, the first electrode pad 201 of the LED chip 200 is bonded to the cathode electrode plate 100, so that the LED chip 200 is connected to the anode electrode. It is mounted on the board 100.

In addition, the anode electrode plate 100 not only functions as an electrode for applying power to the LED chip 200, but also serves as a heat sink for dissipating heat generated from the LED chip 200 to the outside. Do this.

Therefore, the LED package according to the first embodiment of the present invention has the advantage of being capable of efficiently dissipating heat generated from the LED chip through the anode electrode plate and simplifying the structure to reduce the manufacturing cost.

In addition, the insulating layer 110 electrically separates the positive electrode plate 100 and the negative electrode 120.

2 is a conceptual plan view illustrating an electrode arrangement of an LED package according to a first embodiment of the present invention.

As described above, the insulating layer 110 is formed on the positive electrode plate, and the negative electrode is formed on the insulating layer 110.

Here, the LED package according to the first embodiment of the present invention may be implemented by arraying the LED chips.

That is, as illustrated in FIG. 2, a plurality of openings 111a, 111b, 111c, 111d, and 111e are formed in a row and a row in the insulating layer 110, and the plurality of openings are formed. The cathode electrode lines 121, 122, and 123 may be formed along the columns of the 111a, 111b, 111c, 111d, and 111e.

When the plurality of openings 111a, 111b, 111c, 111d, and 111e and the cathode electrode lines 121, 122, and 123 are arranged in this manner, the anodes led to the plurality of openings 111a, 111b, 111c, 111d, and 111e are disposed. A plurality of LED chips may be mounted on the electrode plate, respectively, to uniformly arrange the array of LED chips.

In this case, the LED chips are arranged in a line along each of the cathode electrode lines 121, 122, and 123, and the LED chip and each of the cathode electrode lines 121, 122, and 123 are wire bonded.

The cathode electrode plate is a common electrode of LED chips, and each of the cathode electrode lines 121, 122, and 123 is a common electrode of LED chips mounted along each of the cathode electrode lines 121, 122, and 123.

3 is a conceptual cross-sectional view for describing the LED package according to the second embodiment of the present invention, and FIG. 4 is a conceptual plan view for explaining the electrode arrangement of the LED package according to the second embodiment of the present invention.

The LED package according to the second embodiment of the present invention includes a substrate 300; A first insulating layer 310 formed on the substrate 300; An anode electrode 320 formed on the first insulating layer 310; A second insulating layer 330 having an opening 331 exposing the anode electrode 320; A cathode electrode 120 formed on the second insulation layer 330; And a light emitting structure 202, a first electrode pad 201 formed under the light emitting structure 202, and a second electrode pad 203 formed on the light emitting structure 202. An LED chip (200) bonded to the anode electrode plate (320) having a (201) exposed in the opening (331) with solder (130); The wire 190 is bonded to the second electrode 203 and the cathode electrode 120.

The substrate 300 is preferably a metal substrate that is easy to heat dissipation.

In the LED package according to the second embodiment of the present invention, the first electrode pad 201 of the LED chip 200 is bonded to the anode electrode 320.

In this case, as shown in FIG. 4, the anode electrode 320 may be configured of a plurality of anode electrode lines 311, 312, 313, 314, and 315, and are arranged in rows and rows on the second insulating layer 330. A plurality of openings 331a, 331b, 331c, 331d and 331e are formed, and a plurality of cathode electrode lines 321, 322 and 323 are formed along a row of the plurality of openings 111a, 111b, 111c, 111d and 111e. Can be implemented.

LED chips are mounted in the plurality of anode electrode lines 311, 312, 313, 314, and 315 exposed in the openings 331a, 331b, 331c, 331d, and 331e, respectively, so that the LED chips are arranged in rows and columns.

Here, the plurality of anode electrode lines 311, 312, 313, 314, 315 and the plurality of cathode electrode lines 321, 322, 323 cross each other, and the second insulating layer 330 is present therebetween.

The plurality of anode electrode lines 311, 312, 313, 314, and 315 become common electrodes of LED chips arranged in rows, and the plurality of cathode electrode lines 321, 322, 323 become common electrodes of LED chips arranged in columns.

Meanwhile, a protective layer such as a molding layer and a phosphor may be formed in the LED packages of the first and second embodiments described above.

As an example of this method, a polymer sheet may be laminated on the entire surface where the LED chip is mounted to protect the LED chip, and the LED chip may be coated with a phosphor to obtain a white illumination color.

For reference, FIGS. 2 and 4 are conceptual views illustrating the arrangement relationship of the components on the plan view, and do not consider the cross-sectional positional relationship of FIGS. 1 and 3.

5 is a conceptual perspective view for explaining a state of an example of the bottom of the LED package according to the present invention, Figure 6 is a conceptual cross-sectional view for explaining a state of another example of the bottom of the LED package according to the present invention.

First, the anode electrode plate of the LED package according to the first embodiment and the substrate of the LED package according to the second embodiment are defined as '500' in FIG. 5 and '600' in FIG. 6, and then the state of the bottom surface of the LED package is defined. Explain.

5, the plurality of grooves 510, 520, and 530 may be formed in the bottom surface 501 of the cathode electrode plate and the substrate 500.

That is, when the grooves 510, 520, and 530 are formed in the region where the LED chip is located, the thickness of the anode electrode plate and the substrate 500 where the LED chip exists is shortened and a heat transfer path is shortened, thereby generating in the LED chip. Can easily release the heat.

In addition, the area in which air is in contact with the bottom surface 501 of the cathode electrode plate and the substrate 500 is widened, thereby increasing the heat dissipation efficiency of the LED chip.

Here, the plurality of grooves 510, 520, and 530 may be formed in an area of the bottom surface 501 of the anode electrode plate and the substrate 500 corresponding to the area where the LED chip is located.

The plurality of grooves 510, 520, and 530 may be formed along columns and rows in which LED chips are arranged.

In addition, as described above, an insulating layer is formed on the opposite surface 502 of the bottom surface 501 of the anode electrode plate and the substrate 500.

As shown in FIG. 6, a material or structure 650 having better heat dissipation efficiency than the anode electrode plate and the substrate 600 is inserted into the groove 610 formed on the bottom surface of the cathode electrode plate and the substrate 600. It is to let.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (9)

A positive electrode plate;
An insulating layer formed in said anode electrode plate and having an opening for exposing said anode electrode plate;
A cathode electrode formed on the insulating layer;
And a light emitting structure, a first electrode pad formed under the light emitting structure, and a second electrode pad formed on the light emitting structure, wherein the first electrode pad is bonded with solder to the anode electrode plate exposed to the opening. An LED chip;
An LED package comprising a wire bonded to the second electrode and the cathode electrode.
The method according to claim 1,
The opening is
A plurality of openings formed in rows and rows in the insulating layer,
The cathode electrode,
LED package, the cathode electrode lines formed along a row of the plurality of openings.
The method according to claim 1,
The LED chip is a plurality of LED chips, the plurality of LED chips are mounted on a cathode electrode plate exposed in the plurality of openings, the anode electrode plate is a common electrode of the LED chip LED package.
4. The method according to one of claims 1 to 3,
LED package in which a plurality of grooves are formed on the bottom surface of the positive electrode plate.
The method of claim 4,
The plurality of grooves,
The LED package is formed in the bottom region of the cathode electrode plate corresponding to the region where the LED chip is located.
The method according to claim 5,
In the groove,
An LED package in which a material or structure having better heat dissipation efficiency than the anode electrode plate is inserted. A substrate;
A first insulating layer formed on the substrate;
An anode electrode formed on the first insulating layer;
A second insulating layer having an opening exposing the anode electrode;
A cathode electrode formed on the second insulation layer;
And a light emitting structure, a first electrode pad formed under the light emitting structure, and a second electrode pad formed on the light emitting structure, wherein the first electrode pad is bonded to the anode electrode plate exposed to the opening by solder. An LED chip;
An LED package comprising a wire bonded to the second electrode and the cathode electrode.
The method of claim 7,
The anode electrode,
A plurality of anode electrode lines,
The opening is
A plurality of openings formed in rows and rows in the second insulating layer,
The cathode electrode,
LED package, the cathode electrode lines formed along a row of the plurality of openings.
The method according to claim 8,
The LED package of the plurality of anode electrode lines and the plurality of cathode electrode lines cross each other.

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