JP2012124191A - Light emitting device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which prevents a sealing resin from intruding into through holes and is easily manufactured.SOLUTION: A light emitting device 20 includes: a circuit board 11; an LED element 13 placed on electrode patterns 14, 24 formed on an upper surface of the circuit board 11; and a sealing resin 16 provided so as to coat the LED element 13. The light emitting device 20 is mounted so as to emit light in parallel to a mother board 18. In the light emitting device 20, the circuit board 11 has recessed electrodes 15a, 25a provided on a connection surface with the mother board 18 and through holes 17, 27 electrically connecting the recessed electrodes 15a, 25a with the electrode patterns 14, 24. The through holes 17, 27 are filled with conductive members 17a, 27a.

Description

  The present invention relates to a light-emitting device in which a light-emitting element is mounted on a circuit board, and more particularly to a side-emitting light-emitting device in which the light-emitting direction is substantially parallel to the mother substrate when the light-emitting device is mounted on a mother substrate. .

  A light-emitting device using a light-emitting diode (LED) is mounted on many small portable devices typified by a cellular phone device because of element characteristics such as low power consumption and long life. An example of a side-emitting light emitting device is disclosed as a specific example of such a light emitting device used for a portable device. FIG. 11 is a cross-sectional view of this side-emitting type light emitting device. As shown in FIG. 11, this conventional light emitting device 10 has an LED element 3 mounted on a circuit board 1 having a substantially rectangular plane, and is sealed with a translucent sealing resin 6 so as to cover the LED element 3. It has been stopped. On the circuit board 1, a through hole 5 is formed at a position where the LED element 3 is die-bonded, and an electrode pattern 4 is formed by wiring an electrode pattern directly connected to the LED element 3 to the back surface of the circuit board 1 through the through hole 5. ing. The electrode pattern 4 is wired to the mounting through hole 9 and connected to the wiring pattern 8a of the mother board 8 by the solder 2 (see, for example, Patent Document 1).

  However, when the light emitting device 10 is manufactured by the collective substrate method, there is a problem that the sealing resin 6 enters the through hole 9 in the sealing resin forming step. Therefore, as a structure to prevent this intrusion, a laminated substrate for securing an electrode for connecting to the wiring pattern of the motherboard is laminated on the base substrate to form a circuit substrate, and side emission in which the through hole of the base substrate is blocked by the laminated substrate An example of a type of light emitting device is disclosed. FIG. 12 is a cross-sectional view of this side-emitting type light emitting device. As shown in FIG. 12, the circuit board 1 of the light emitting device 50 includes a base substrate 1A and a laminated substrate 1B laminated on the base substrate 1A. The LED element 3 is mounted on the multilayer substrate 1 </ b> B, and is sealed with a translucent sealing resin 6 so as to cover the LED element 3. Furthermore, a through hole 7 is formed in the multilayer substrate 1B, and an electrode pattern 4 is formed by wiring an electrode pattern connected to the LED element 3 by wire bonding to the back surface of the multilayer substrate 1B through the through hole 7. On the other hand, a semicircular mounting through-hole electrode 9 is formed at the side end of the base substrate 1A. The through-hole electrode 9 is connected to the electrode pattern 4 described above, and is connected to the wiring pattern 8a of the mother board 8 and the solder. 2 (for example, refer to Patent Document 2).

Japanese Patent No. 4056598 (page 4, FIG. 1) JP 2004-186514 A (page 4, FIG. 2)

  However, the conventional light emitting device 50 shown in FIG. 12 can prevent the sealing resin 6 from entering the through-hole 9 in the sealing resin forming process in the case of manufacturing by the collective substrate method. Since 1 has a two-layer structure, the structure is complicated, and there is a problem that a manufacturing process such as bonding of substrates becomes cumbersome.

(the purpose)
The present invention has been made in view of the above problems, and in a sealing resin forming process in the case of manufacturing a circuit board with a single-layer structure by simplifying the structure by a single-layer structure, the sealing resin becomes a through hole. An object of the present invention is to provide a side-emitting type light-emitting device that can prevent intrusion and that can be easily manufactured, and a manufacturing method thereof.

  In order to solve the above problems, a light-emitting device of the present invention includes a circuit board, an LED element placed on an electrode pattern formed on the upper surface of the circuit board, and a sealing resin provided so as to cover the LED element. A light emitting device mounted so as to emit light in parallel to the mother board, wherein the circuit board has a recessed electrode provided on a connection surface with the mother board, and a through hole that electrically connects the recessed electrode and the electrode pattern. And the through hole is filled with a conductive member.

  Further, the concave electrode is provided at a corner portion between a connection surface of the circuit board with the mother board and a lower surface of the circuit board.

  The method for manufacturing a light emitting device of the present invention includes a step of forming a through hole at a predetermined position of the collective substrate, a step of forming a recess on the lower surface of the collective substrate corresponding to the through hole, Forming an electrode pattern on the upper surface; forming a through-hole electrode in the through-hole to electrically connect the electrode pattern and the through-hole electrode; and forming a recessed electrode in the recess to form the through-hole A step of electrically connecting the electrode and the recessed electrode, a step of mounting an LED element on an electrode pattern formed on the upper surface of the collective substrate, and a frame so as to surround the LED element on the upper surface of the collective substrate A step of forming a sealing resin so as to cover the LED element, and a step of cutting the collective substrate vertically and horizontally into individual light emitting devices. Characterized by a.

  The method further includes a step of filling the through hole with a conductive member.

  According to the present invention, since the concave electrode is used as a connection electrode to the mother board, the circuit board is formed of a single layer, and the sealing resin can be prevented from entering the region where the concave electrode is formed during manufacture on the collective substrate. Can do. As a result, a light-emitting device that has a simple structure and is easy to manufacture and a method for manufacturing the light-emitting device can be realized.

It is a perspective view which shows the state which mounted the light-emitting device in embodiment of this invention in the motherboard. It is AA sectional drawing in FIG. It is a perspective view which shows the surface side of the circuit board of the light-emitting device in embodiment of this invention. It is a perspective view which shows the back surface side of the circuit board of the light-emitting device in embodiment of this invention. It is a perspective view which shows the wiring state of the surface side of the light-emitting device in embodiment of this invention. It is a perspective view which shows the recessed part electrode of the light-emitting device in embodiment of this invention. It is a perspective view which shows the electrical connection state of the light-emitting device and mother board in embodiment of this invention. It is a figure which shows the manufacturing process of the light-emitting device in embodiment of this invention. It is sectional drawing which shows the manufacturing process of the light-emitting device in embodiment of this invention. It is sectional drawing which shows the manufacturing process of the light-emitting device in embodiment of this invention. It is sectional drawing which shows the state which mounted the light-emitting device in a prior art on the motherboard. It is sectional drawing which shows the state which mounted the light-emitting device in the other example of a prior art in a motherboard.

  1 to 7 are views showing a light emitting device according to an embodiment of the present invention. 8 to 10 are diagrams showing a manufacturing process of the light emitting device in the embodiment of the present invention. Hereinafter, specific embodiments will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a light emitting device according to the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA in FIG. The top view of the light-emitting device in Example 1, FIG. 3 is AA sectional drawing in FIG. As shown in FIGS. 1 and 2, the light emitting device 20 in the present embodiment includes a circuit board 11, LED elements 13 placed on electrode patterns 14 and 24 formed on the upper surface 11 a of the circuit board 11, and LED elements 13. A sealing resin 16 provided so as to cover and a frame body 19 provided so as to surround the LED element 13 and the sealing resin 16 are provided, and are mounted so as to emit light in parallel to the mother board 18. Further, the circuit board 11 has a recessed electrode 15a provided at a corner portion between the side surface 11c and the lower surface 11b serving as a connection surface with the mother board 18, and a through hole 17 that electrically connects the recessed electrode 15a and the electrode pattern 14. The through-hole 17 is filled with the conductive member 17a. Furthermore, although mentioned later for details, the circuit board 11 is provided with the recessed electrode 25a (not shown) in the position corresponding to the electrode pattern 24 in the corner | angular part of the side surface 11c and the lower surface 11b. Also, a through hole 27 (not shown) for electrically connecting the recessed electrode 25a and the electrode pattern 24 is provided, and the through hole 27 (not shown) is filled with a conductive member 27a. .

  3 is a perspective view of the circuit board 11 as viewed from the upper surface 11a side, and FIG. 4 is a perspective view of the circuit board 11 as viewed from the lower surface 11b side. As shown in FIGS. 3 and 4, the circuit board 11 is made of glass epoxy resin or the like, and concave portions 15 and 25 are provided at corners of the side surface 11 c and the lower surface 11 b. Further, a through hole 17 penetrating from the upper surface 11a side to the concave portion 15 on the lower surface 11b side and a through hole 27 penetrating from the upper surface 11a side to the concave portion 25 on the lower surface 11b side are provided.

  FIG. 5 is a perspective view of the LED element 13 mounted on the circuit board 11 as viewed from the upper surface 11a side, and FIG. 6 is a perspective view of the circuit board 11 formed with the recessed electrodes 15a and 25a as viewed from the lower surface 11b side. It is. As shown in FIGS. 5 and 6, electrode patterns 14 and 24 are formed on the upper surface 11 a of the circuit board 11, LED elements are die-bonded to the electrode pattern 14, and the upper electrode 13 a of the LED element 13 is the electrode pattern. 24 is wire-bonded. Further, as shown in FIG. 6, recessed electrodes 15a and 25a are formed in the recessed portions 15 and 25 shown in FIG. 4 on the lower surface 11b side of the circuit board 11, respectively. Furthermore, the electrode pattern 14 and the recessed electrode 15a are electrically connected by the through hole 17 filled with the conductive member 17a, and the electrode pattern 24 and the recessed electrode 25a are connected by the through hole 27 filled with the conductive member 27a. Electrically connected.

  According to the light emitting device 20 in the present embodiment configured as described above, the LED element 13 placed on the circuit board 11 has the through holes 17 filled with the conductive members 17a and 27a with the electrode patterns 14 and 24. , 27, and the through holes 17, 27 are connected to the recessed electrodes 15a, 25a. Thereby, the recessed electrodes 15a and 25a are exposed on the lower surface 11b side and the side surface 11c side of the circuit board 11, and can be easily and reliably electrically connected to the mother board 18 described later. In addition, the concave electrodes 15a and 25a are provided as connection electrodes to the mother board 18, and the through holes 17 and 27 are filled with the conductive members 17a and 27a. It is possible to prevent intrusion into the region where the recessed electrode is formed. Thereby, the light emitting device 20 having a simple structure can be realized.

  In addition, as the conductive members 17a and 27a, a conductive material such as a copper (Cu) paste is used. Further, as the sealing resin 16, a light transmitting epoxy, silicone resin or the like is used. The frame body 19 is made of a light reflective member, and a white resin containing titanium oxide or a resin material containing a highly reflective material such as other metal fine particles is applied. As the resin material, epoxy, Silicone resin or the like is used.

  FIG. 7 is a perspective view showing a connection state between the light emitting device and the mother hohod in the embodiment of the present invention. As shown in FIG. 7, the recessed electrodes 15 a and 25 a in the light emitting device 20 are exposed on the lower surface 11 b and the side surface 11 c of the circuit board 11. Therefore, the light emitting device 20 is arranged on the mother board 18 so that the side surface 11c of the circuit board faces downward, and the recessed electrodes 15a and 25a are electrically connected and fixed to the electrodes 18a and 18b of the mother board 18 by the solder 12, respectively. Thus, the light emitting device 20 is mounted so as to emit light in parallel to the mother board 18.

  Next, a method for manufacturing the light emitting device in the present embodiment will be described. FIG. 8A is a plan view showing the first manufacturing process, and FIGS. 8, 9 and 10 excluding (a) are cross-sectional views showing the manufacturing process of the light emitting device. As shown in FIG. 8A, through holes 17 and 27 are formed at predetermined positions of the collective substrate 100. FIG. 8B is a cross-sectional view taken along the line BB in FIG. Since the through hole 27 is the same as the through hole 17, a cross-sectional view is omitted. In the following manufacturing process, the cross section at the position of the through hole 17 will be described, but the same applies to the through hole 27.

  Next, as shown in FIG. 8C, the through hole 17 is filled with a conductive member 17a. The conductive member 17a is made of a conductive metal material. Similarly, although not shown, the through hole 27 is filled with the conductive member 27a.

  Next, as shown in FIG. 9A, the recess 15 is formed at a position corresponding to the through hole 17 on the lower surface 100 b of the collective substrate 100. The recess 15 can be easily formed by sandblasting. Similarly, although not shown, the recess 25 is formed at a position corresponding to the through hole 27 on the lower surface 100 b of the collective substrate 100.

  Next, as shown in FIG. 9B, the electrode pattern 14 is formed on the upper surface 100a of the collective substrate 100 by a plating method, and the recessed electrode 15a is formed on the recessed portion 15 by the same plating method. 15 a is electrically connected by a conductive member 17 a filled in the through hole 17. Similarly, although not shown, the electrode pattern 24 is formed on the upper surface 100a of the collective substrate 100, the recessed electrode 25a is formed in the recessed portion 25, and the through hole 27 is filled with the electrode pattern 24 and the recessed electrode 25a. The conductive member 27a is electrically connected.

  Next, the LED element 13 is die-bonded on the electrode pattern 14 as shown in FIG. Although not shown, the upper electrode 13 a of the LED element 13 is wire-bonded to the electrode pattern 24. Thereby, the LED element 13 is mounted on the circuit board.

  Next, a frame 19 is formed so as to surround the LED element 13 as shown in FIG. 10A, and then sealed inside the frame so as to cover the LED element 13 as shown in FIG. 10B. A stop resin 16 is formed. At this time, since the through holes 17 and 27 are filled with the conductive members 17a and 27a, the sealing resin 16 does not enter the regions where the through holes 17 and 27 and the recessed electrodes 15a and 25a are formed. Absent.

  Next, the frame body 19 and the collective substrate 100 are cut with a rotating blade at the position of the frame body 19 to form the light emitting device 20 singulated as shown in FIG. At this time, the recessed electrodes 15a and 25a are also divided, and the recessed electrodes 15a and 25a are not only on the lower surface 11b side of the circuit board 11, but also on the side surface 11c side of the circuit board 11 which is a connection surface with the mother board 18 (not shown). Exposed.

  Although the example in which the through holes 17 and 27 are filled with the conductive members 17a and 27a has been described, the inner surface of the through holes 17 and 27 is formed in the step of forming the electrode patterns 14 and 24 or the recessed electrodes 15a and 25a by plating. An electrode may be formed and the through holes 17 and 27 may be closed at the same time. In this case, the step of filling the through holes 17 and 27 with the conductive members 17a and 27a may be omitted. Further, a copper foil may be pasted on the upper surface 100a of the collective substrate in advance. 10A and 10B, the frame body 19 may be formed after the sealing resin 16 is formed. In this case, the sealing resin 16 is applied to the entire upper surface 100a of the collective substrate. A groove is formed, and a resin for the frame body 19 is injected into the groove. In the present embodiment, wire bonding is employed for the LED element 13, but flip chip mounting with good thermal conductivity and mounting area efficiency may be employed.

  As described above, according to the method for manufacturing a light emitting device in the present embodiment, the recessed electrodes 15a and 25a are formed as the connection electrodes with the mother board 18, and the through holes 17 and 27 are filled with the conductive members 17a and 27a. Thus, it is possible to prevent the sealing resin from entering the region where the recessed electrode is formed during the sealing resin forming step in the manufacturing method using the collective substrate. As a result, the circuit board 11 can be formed of a single layer, and a method for manufacturing the light emitting device 20 with a simple structure and easy manufacture can be realized.

DESCRIPTION OF SYMBOLS 11 Circuit board 11a The upper surface of a circuit board 11b The lower surface of a circuit board 11c The side surface of a circuit board 12 Solder 13 LED element 13a The upper surface electrode of an LED element 14, 24 Electrode pattern 15, 25 Recessed part 15a, 25a Recessed electrode 16 Sealing resin 17, 27 Through hole 17a, 27a Conductive member 18 Motherboard 18a Motherboard electrode 19 Frame 20 Light emitting device 100 Aggregate substrate 100a Upper surface of aggregate substrate 100b Lower surface of aggregate substrate

Claims (4)

A circuit board, an LED element placed on an electrode pattern formed on the upper surface of the circuit board, and a sealing resin provided so as to cover the LED element are mounted so as to emit light in parallel to the motherboard. In the light emitting device
The circuit board has a recessed electrode provided on a connection surface with the mother board, and a through hole for electrically connecting the recessed electrode and the electrode pattern, and the through hole is filled with a conductive member. A light emitting device characterized by the above.   2. The light emitting device according to claim 1, wherein the concave electrode is provided at a corner portion between a connection surface of the circuit board with the motherboard and a lower surface of the circuit board.   Forming a through hole at a predetermined position of the collective substrate, forming a recess on the lower surface of the collective substrate corresponding to the through hole, forming an electrode pattern on the upper surface of the collective substrate, and the through hole Forming a through-hole electrode in the electrode and electrically connecting the electrode pattern and the through-hole electrode; forming a recess electrode in the recess and electrically connecting the through-hole electrode and the recess electrode A step, a step of mounting an LED element on the electrode pattern formed on the upper surface of the collective substrate, a step of forming a frame so as to surround the LED element on the upper surface of the collective substrate, and a cover for the LED element A step of forming a sealing resin on the substrate, and a step of cutting the collective substrate vertically and horizontally to divide the light emitting device into individual light emitting devices. Method. The method for manufacturing a light emitting device according to claim 3, further comprising a step of filling the through hole with a conductive member.

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