JP5405602B2 - LED package and frame for LED package - Google Patents

Description

  The present invention relates to an LED package for mounting an LED (Light Emitting Diode) used for a general lighting fixture, a backlight light source of a liquid crystal display, a headlight, an optical sensor, and the like, and an LED package frame.

  In recent years, a light emitting device in which an LED chip having a size of about several tens of μm to several mm is housed in a package, and its use is expanding as an electronic device, a vehicle, and various lighting devices.

  An LED package has an LED chip mounted on the bottom surface of a recess, is resin-molded with a sealing resin such as epoxy resin or silicon resin, and is electrically and mechanically connected to the mounting substrate by a plurality of electrodes (lead frames) exposed from the package to the outside. A connection is made.

  The most common LED package is one in which a lead frame and a case are integrated. The lead frame is required to have electrical continuity and heat dissipation effects, and the case is required to have insulation and heat dissipation effects. The LED package is required to efficiently extract the light emitted from the LED chip. In addition to the light emitted directly from the LED, the LED package reflects the light by providing a reflector, and more light is emitted to the outside. Such high-brightness packages are being studied.

  The lead frame is made by photoetching or stamping a metal material for a lead frame made of an iron plate such as SPCC or SPCE, an alloy thin plate such as plate-like iron-nickel, or an alloy thin plate such as copper-nickel-tin. It is done. In addition, some have been subjected to silver plating to improve light reflection.

  The sealing resin fills the recesses in the upper part of the package to protect the LED chip and the wiring, and converts the wavelength of light from the LED chip from blue to white, for example, by containing a fluorescent material. Since the sealing resin is required to be filled into a narrow gap, a low-viscosity organic resin is often used. For this reason, as a package, it is necessary to prevent the liquid resin that has flowed into the concave portion at the top from leaking out from the side surface or the bottom surface of the package.

  In Patent Document 1, the adhesion between the lead frame and the package is further strengthened, the interface frame between the lead frame and the package is prevented from being peeled, the package is prevented from being discolored by light from the light emitting element, and the heat generated from the light emitting element is disclosed. A light-emitting device that can efficiently dissipate heat is described. A package having an opening having a side surface and a bottom surface; and a lead frame exposed at the bottom surface of the opening portion. The lead frame has a bent reflection portion on a side surface of the opening portion. It is described that a part of the wall surface is located inside the package.

JP 2010-34325 A

  However, in the light emitting device described in Patent Document 1, a reflection part made by bending a part of the lead frame is provided to increase the adhesion between the lead frame and the package only at the center part of the lead frame (LED chip position). However, there is a problem that the adhesiveness is not sufficient at each end portion of the lead frame facing each other across the insulating portion.

  In addition, when the reflector placed in the package is made of resin, it is necessary to sandwich most of the periphery of the lead frame, which makes it difficult to ensure the adhesion.

  In this way, if the adhesion between the lead frame and the package remains inadequate, if sulfides such as sulfur dioxide in the air permeate from the interface between the lead frame and the package member, Ag plating for obtaining high reflection is The silver sulfide becomes black and the reflectance decreases. In addition, the deterioration of the LED chip due to the penetration of moisture and gas in the air often reduces the reliability. In recent years, not only the LED chip but also the lead connected to the LED chip may be corroded by a small amount of hydrogen sulfide released from the cardboard material used for packaging.

  Furthermore, if the adhesion between the lead frame and the package remains insufficient, the sealing resin leaks from the gap at the interface between the package and the lead frame. The leaked sealing resin causes various problems such as generation of burrs during cut and forming and poor mounting properties of solder. Moreover, when the fluorescent material is contained in the sealing resin, the fluorescent material also leaks together with the sealing resin, resulting in deviation from the target chromaticity.

  In addition, the lead frame, which is a material obtained by plating the surface of the Cu alloy with Ag, has a complicated structure because the grooves or protrusions are formed by stamping (pressing) or etching. For this reason, the formed groove or protrusion may damage the Ag plating on the surface of the Cu alloy. Moreover, even if the Ag treatment having a sufficient film thickness is performed on the surface, it is inevitable that the Ag treatment is not uniform in the groove or the protrusion.

  For this reason, it was found that the Ag plating was peeled off at the groove or the protrusion, and the epoxy resin infiltrated into this portion to reach the Cu alloy. The Cu alloy may corrode due to generation of hydroxides and oxides due to humidity and the like. When the Cu alloy is corroded, the corroded material is exposed to the surface, and there is a problem that the characteristics of the LED such as luminance are deteriorated.

  The object of the present invention is to secure the adhesion between the lead frame and the package (especially the insulating portion that insulates between the two lead frames) with a simple structure using an inexpensive aluminum lead frame. An object is to provide an LED package and an LED package frame capable of improving reliability.

In order to achieve the above object, an LED package according to the present invention includes an LED element, one surface on which the LED element is placed, the other surface opposite to the one surface, and the one surface. A first reflector frame that rises on the one surface side from the first lead frame that is electrically connected to the LED element, and the first lead frame is spatially isolated, A second lead frame comprising: a bonding surface electrically connected to the LED element; and a second reflector portion rising from the bonding surface to the bonding surface side; the first lead frame; anda insulating member that insulates and holds between the second lead frame, the first lead frame, at least a portion of the other surface is exposed from the insulating member, and wherein Covered on the back side is the insulating member of the end portion on the side facing the second lead frame, wherein the first reflector portion and the second reflector portion, the surface of the LED element side is exposed from the insulating member the rear surface of the LED element side is covered with the insulating member, the first and second lead frames, said first and second lead frames from the one surface and the bonding surface is opposed with a recess over the end portion of the insulating portion, the insulating portion is sandwiched and the back of the bonding surface of the second lead frame and the other surface and the recess of the said recess first lead frame, the first The size of the concave portion of the lead frame is smaller than the size of the concave portion of the second lead frame .

  Since the present invention is configured as described above, by providing a chamfered portion at the end portion of the lead frame, the insulating portion that insulates between the two lead frames can be reliably sandwiched with a resin for molding. it can. As a result, the lead frame that affects the performance of the LED package and the package can be reliably adhered, and the sealing member can be prevented from leaking. Reduction of the irradiation amount of the LED package and the LED package frame can be prevented.

  In addition, the shape of the lead frame does not need to be complicated, the cost of the material can be reduced, and unnecessary stress can be applied to the lead frame, preventing moisture from entering and preventing deterioration of the optical characteristics of the lead frame. Can do.

The perspective view which shows typically the LED package in embodiment of this invention Sectional drawing of the LED package in embodiment of this invention The expanded sectional view of the LED package in embodiment of this invention The expanded sectional view of the LED package in embodiment of this invention

The first invention in the present invention is the LED element, the one surface on the side where the LED element is mounted, the other surface opposite to the one surface, and the one surface side from the one surface. And a first lead frame that is electrically connected to the LED element, and the first lead frame is spatially isolated from the LED element and electrically connected to the LED element. A second lead frame comprising: a bonding surface connected to the second surface; a second reflector portion rising from the bonding surface toward the bonding surface; and the first lead frame and the second lead frame. anda insulating member that insulates and holds between the first lead frame is at least partially exposed from the insulating member, and opposed to the second lead frame of the second surface That the rear surface of the end portion of the side is covered with the insulating member, wherein the first reflector portion and the second reflector portion, the surface of the LED element side is exposed from the insulating member, the LED element side back surface is covered with the insulating member, wherein first and second lead frames, the insulating portion side of the end portion to which the first and second lead frames from the one surface and the bonding surface is opposed The insulating portion sandwiches the concave portion and the other surface of the first lead frame and the concave portion and the back surface of the bonding surface of the second lead frame, and the concave portion of the first lead frame The present invention relates to an LED package characterized in that the size is smaller than the size of the concave portion of the second lead frame .

  According to the first aspect of the present invention, the metal is used for the lead frame, and further, the high light reflectivity of the metal is used, and the function of the reflecting mirror and the function of the heat sink using the high thermal conductivity are also used. be able to. This eliminates the need for costly silver plating and a separate heat dissipating member.

  With this heat dissipation action, the LED element is excellent in heat dissipation, can maintain high light emission efficiency, and can achieve a long life.

  Further, by providing a chamfered portion at the end of the lead frame, the insulating portion that insulates between the two lead frames can be reliably sandwiched with a resin for molding. As a result, the lead frame that affects the performance of the LED package and the insulating portion can be reliably adhered, and the sealing member can be prevented from leaking. Reduction of the irradiation amount of the LED package can be prevented.

  In addition, the shape of the lead frame does not need to be complicated, the cost of the material can be reduced, and unnecessary stress can be applied to the lead frame, preventing moisture from entering and preventing deterioration of the optical characteristics of the lead frame. Can do.

A second invention in the present invention relates to the LED package according to claim 1, wherein the lead frame is made of aluminum.

According to the second invention of the present invention, since aluminum is used for the lead frame, the high light reflectivity is used, and the function of the reflector and the function of the heat sink using the high thermal conductivity are also used. Can do. This eliminates the need for costly silver plating and a separate heat dissipating member. It is lightweight, easy to process, and can produce lead frames at low cost.

Furthermore, the LED element is excellent in heat dissipation by this heat dissipation action, can maintain high luminous efficiency, and can achieve a long life.

According to a third aspect of the present invention, there is provided the LED package according to claim 1, wherein an upper surface of the lead frame and an upper surface of the insulating portion are in the same plane.

According to the third aspect of the present invention, the upper surface of the lead frame and the upper surface of the insulating portion are formed in substantially the same plane so as not to prevent light irradiation from the LED element and light reflection from the lead frame. It is possible to prevent a reduction in the irradiation amount of the LED package.

According to a fourth aspect of the present invention, there is provided a first surface that rises from the one surface to the one surface side on the side on which the LED element is placed, the other surface opposite to the one surface. A first lead frame comprising: a reflector portion; a first lead frame that is spatially isolated from the first lead frame; and a bonding surface that can be electrically connected to the LED element; and from the bonding surface to the bonding surface side A second lead frame having a raised second reflector portion, and an insulating member that insulates and holds between the first lead frame and the second lead frame. In the lead frame, at least a part of the other surface is exposed from the insulating member, and the back surface of the end portion facing the second lead frame is covered with the insulating member, and the second lead Frame is the back side of the bonding surface is covered with the insulating member, wherein the first reflector portion and the second reflector portion, the LED side surface is exposed from the insulating member, a surface of the LED side backside is covered with the insulating member, across the first and second lead frames, the end of the insulating portion side of the first and second lead frames from the one surface and the bonding surface is opposed A recess, and the insulating portion sandwiches the recess and the other surface of the first lead frame, and the recess and the back surface of the bonding surface of the second lead frame, and the size of the recess of the first lead frame. The present invention relates to a frame for an LED package, characterized in that the size is smaller than the size of the concave portion of the second lead frame .

According to the fourth aspect of the present invention, the metal is used for the lead frame, and also the function of the reflector using the high light reflectance of the metal and the function of the heat sink utilizing the high thermal conductivity are also used. be able to. This eliminates the need for costly silver plating and a separate heat dissipating member.

  With this heat dissipation action, the LED element is excellent in heat dissipation, can maintain high light emission efficiency, and can achieve a long life.

  Further, by providing a chamfered portion at the end of the lead frame, the insulating portion that insulates between the two lead frames can be reliably sandwiched with a resin for molding. As a result, the lead frame that affects the performance of the LED package and the insulating portion can be reliably adhered, and the sealing member can be prevented from leaking. Reduction of the irradiation amount of the LED package can be prevented.

  In addition, the shape of the lead frame does not need to be complicated, the cost of the material can be reduced, and unnecessary stress can be applied to the lead frame, preventing moisture from entering and preventing deterioration of the optical characteristics of the lead frame. Can do.

(Embodiment)
The LED package of the present invention will be described below with reference to the drawings. The embodiment described below is a preferred specific example of the present invention, and technically favorable conditions are described. However, the scope of the present invention is particularly limited in the following description. Unless otherwise stated, the present invention is not limited to these conditions.

  Hereinafter, the LED package of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view schematically showing an LED package according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the LED package according to the embodiment of the present invention, showing a cross section taken along line ZZ in FIG. It is.

  As shown in FIGS. 1 and 2, the LED package 100 includes a pair of bent lead frames 101 and 102, and a bent insulating portion 103 a that electrically insulates the lead frame 101 and the lead frame 102. The lead frames 101 and 102 and the insulating portion 103a are integrated.

Each of the lead frames 101 and 102 has a substantially semi-cylindrical shape, and is cheap, lightweight, and processed from the viewpoint of performance such as conductivity, heat dissipation, mechanical strength, ease of processing, and light reflection. It is used by processing an aluminum plate that is easy to wear. Here, the resistivity (reciprocal of electrical conductivity) of aluminum is 2 × 10 ⁻⁸ Ω · m, the light reflectance of visible color is 90%, and the thermal conductivity is about 200 W / m · K.

That is, the resistivity (inverse of electrical conductivity) is ^{1 × 10 -8 Ω · m~100 ×} 10 -8 Ω · m, the light reflectivity of the visible color more than 80%, the thermal conductivity of 10 W / m · K Although it may be selected from a metal of ˜500 W / m · K, the material is preferably aluminum from the viewpoint of good balance of required functions.

  For example, in a lead frame, a metal plate made of copper or a copper alloy may be processed, and the surface thereof may be subjected to expensive silver plating in order to improve the light reflectance.

  On the other hand, the lead frames 101 and 102 of the present embodiment are better because they employ aluminum and have high light reflectivity and do not require silver plating. Since silver plating is not used, sulfides such as sulfur dioxide in the air permeate from the interface between the lead frames 101, 102 and the package member 103, and the Ag plating becomes silver sulfide, which turns black and reflects on the reflector. The rate is not lowered, and the light intensity irradiated from the LED package 100 can be prevented from being lowered. Further, the fixing method of the insulating portions 103a of the lead frames 101 and 102 and the package member 103, which will be described later, can secure the adhesion between the lead frames 101 and 102 and the package member 103, and is a lead frame subjected to silver plating. Even if it is, it can be used.

  As described above, the lead frames 101 and 102 are made of a material having high light reflectivity and high thermal conductivity (aluminum in the present embodiment) and have a substantially semi-cylindrical shape, so that the high light reflectivity is used. The lead frame can also function as a heat sink by utilizing the function of the reflector and high thermal conductivity. This eliminates the need for costly silver plating and a separate heat dissipating member. Furthermore, the lead frames 101 and 102 also serve as a reflector.

  Further, the LED element 110 is excellent in heat dissipation due to this heat dissipation action, can maintain high luminous efficiency, and can achieve a long life.

  A pair of the lead frame 101 and the lead frame 102 is disposed so as to sandwich the insulating portion 103a from the horizontal direction. The lead frame 101 is, for example, an anode side lead portion, and the lead frame 102 is a cathode side lead portion. That is, the insulating part 103a is provided to insulate between the anode side lead part and the cathode side lead part.

  In the present embodiment, the lead frame has been described as a pair of configurations, but the present invention is not limited to this, and a case where a plurality of paired lead frames 101 and 102 are installed in the LED package 100 or a plurality of LEDs is included. A configuration in which one lead frame of one electrode is used as a common electrode may be used. The insulating part 103a insulates between the anode and the cathode of a plurality of lead frames.

  The lead frames 101 and 102 are metal electrodes, and are electrically and mechanically connected to the LED element 110 and are electrically and mechanically connected to a mounting board (not shown). As a result, the LED element 110 is supplied with power from the mounting substrate via the lead frames 101 and 102 and becomes operable.

  In addition to the function of a terminal for supplying current to the LED element 110, the lead frames 101 and 102 also have a function as a reflector of the LED package 100 depending on the shape thereof. That is, the light from the LED element 110 is efficiently reflected upward in the LED package 100.

  The insulating portion 103a is made of a thermosetting resin such as an epoxy resin or a thermoplastic resin, and insulates the lead frame 101 and the lead frame 102 from each other. The upper surface (front surface) of the insulating portion 103 a forms the substantially concave bottom portion of the LED package 100 together with the upper surfaces (surface) of the lead frames 101 and 102.

  The package member 103 is made by molding a thermosetting resin such as an epoxy resin or a thermoplastic resin together with the insulating portion 103a. That is, the insulating portion 103a is a part of the package member 103, and is a region sandwiched between the side surfaces of the end portions of the lead frames 101 and 102 as shown in a circle A in FIG. An insulating portion is sandwiched between the portions where the lead frames 101 and 102 face each other.

  In addition, one end of each of the lead frames 101 and 102 is fixed using a part of the insulating portion 103a (details will be described later). The other end is fixed by a package member 103.

  On the upper surface (front surface) of the lead frame 102 of the LED package 100, an LED element 110 that is a light emitting element is mounted. Since the upper surface of the lead frame 102, the lead frame 101, and the insulating portion 103a on which the LED element 110 is mounted is surrounded by the respective peripheral portions, a concave LED mounting space (cavity) 105 is formed on the upper side of the LED package 100. Forming.

  The LED element 110 is connected (wire bonded) to the lead frames 101 and 102 by bonding wires 111 and 112 which are conductive members. The diameter of the bonding wires 111 and 112 is preferably φ25 to 35 μm. As a material, gold, copper, platinum or the like is preferably used.

  The LED element 110 is formed by sequentially stacking a buffer layer, an N-type semiconductor layer, a light emitting layer, and a P-type semiconductor layer on a substrate. In the LED element 110, an N-type electrode is formed on the surface of the N-type semiconductor layer, a current diffusion film and a P-type electrode are formed on the surface of the P-type semiconductor layer, and the P-type electrode and the N-type electrode are supplied with power ( (Not shown), a current flows through the LED element 110 to emit light. As the LED element 110, for example, a GaN blue light emitting diode chip is used.

  As described above, the LED package 100 is a package for mounting the LED element 110.

  The cavity 105 is filled with a sealing resin (not shown), and the LED element 110 and the bonding wires 111 and 112 disposed in the cavity 105 are sealed with the filled resin. This sealing resin has a high light transmittance at the emission wavelength of the LED element 110 and is required to be filled in a narrow gap, so that a low-viscosity organic resin (for example, a silicon-based resin) is used.

  Next, the configuration of fixing and holding one end side of the lead frames 101 and 102 and the insulating portion 103a will be described in detail with reference to FIG. FIG. 3 is an enlarged cross-sectional view of the LED package according to the embodiment of the present invention, and is an enlarged view of a circle A portion of FIG.

  As shown in FIG. 3, the periphery of the end portions of the lead frames 101 and 102 is fixed so as to be sandwiched between the resin materials constituting the insulating portion 103a.

  That is, the end of the lead frame 101 on the insulating portion 103a side is formed with a slope (surface A) with a corner chamfered in the direction perpendicular to the paper surface as a recess, and the end of the lead frame 102 on the insulating portion 103a side is similarly formed. A slope (surface B) having a corner chamfered in the direction perpendicular to the paper surface is also formed in advance in the portion as a recess.

  Then, after the two lead frames are installed in the prepared mold, a resin material constituting the insulating portion 103a is poured and resin molding is performed, whereby the insulating portions 103a sandwich the end portions of the lead frames 101 and 102 vertically. Thus, the lead frames 101 and 102 can be securely attached to the package member 103.

  By doing so, the upper surfaces of the lead frames 101 and 102 and the upper surface of the insulating portion 103a form substantially the same plane, and light irradiation from the LED element 110 (see FIG. 2) and the light emission from the lead frames 101 and 102 are performed. The light reflection can be prevented.

  Furthermore, since the configuration in which the slope of the surface A and the surface B is lowered in the direction of the insulating portion 103a is adopted, it is possible to make it difficult for the resin material during the resin molding of the insulating portion 103a to leak out.

  In the present embodiment, the chamfer size of the surface A is C 0.05 mm, and the chamfer size of the surface B is C 0.03 mm. The chamfering may be a curved surface defined by R instead of a flat surface defined by C, but the plane can securely sandwich the lead frames 101 and 102.

  These numerical values may be appropriately determined depending on the overall configuration. However, if the value is too large, the lead frames 101 and 102 can be securely sandwiched, while the area functioning as the reflecting surface of the lead frames 101 and 102 is reduced. End up. Conversely, if it is too small, the area functioning as the reflecting surface of the lead frames 101 and 102 can be increased, while the lead frames 101 and 102 cannot be securely sandwiched.

  That is, the chamfer size of the surface A may be set within a range of C0.03 mm to C0.07 mm, and the chamfer size of the surface B may be set within a range of C0.02 mm to C0.05 mm.

  The angle of chamfering is 45 ° as defined by C0.05mm and C0.03mm, but if it is set within the range of 45 ° ± 15 °, the periphery of the ends of the lead frames 101 and 102 is sandwiched. Can be fixed securely.

  In addition, it is conceivable that the end portions of the lead frames 101 and 102 are not chamfered but are covered with the resin material of the insulating portion 103a. And the resin material may ooze out on the same horizontal plane of the lead frames 101 and 102, and the area functioning as a reflective surface becomes increasingly smaller. However, the configuration of this embodiment can achieve a configuration without such fear.

  Further, as shown in FIGS. 2 and 3, the lead frames 101 and 102 are chamfered when the lead frame 102 (where the LED element 110 is placed) having a longer horizontal length is used. The lead frame 101 having a small size (C0.03) and a short horizontal length of the lead frame has a large chamfer size (C0.05). This is because the rotational torque for removing the lead frames 101, 102 and the insulating portion 103a is the same, and the other end of the lead frames 101, 102 is firmly fixed, so the end of the lead frame that hangs on the surface A or B This is because the forces generated in the are different. Here, the horizontal length of the lead frame is the distance from the portion fixed by the package member 103 to the insulating portion 103a. The lead frame 102 on which the LED element 110 is placed is longer.

  It should be noted that the lead frames 101 and 102 may have the same chamfer size (both chamfers should be adjusted to a large value of C0.05), but function as a reflective surface for securely sandwiching the lead frame. In order to achieve both the reduction of the area to be reduced, the conditions shown in the present embodiment are better.

  FIG. 4 shows another form as the shape of the recess. FIG. 4 is an enlarged cross-sectional view of the LED package in the embodiment of the present invention.

  As shown in FIG. 4, a step is formed in advance in the direction perpendicular to the paper surface as a recess at the end of the lead frame 101 on the insulating portion 103a side. Similarly, the end of the lead frame 102 on the insulating portion 103a side is also formed as a recess on the paper surface. The step is made in the vertical direction in advance.

  Then, after the two lead frames are installed in the prepared mold, a resin material constituting the insulating portion 103a is poured and resin molding is performed, whereby the insulating portions 103a sandwich the end portions of the lead frames 101 and 102 vertically. Thus, the lead frames 101 and 102 can be securely attached to the package member 103.

  By doing so, the upper surfaces of the lead frames 101 and 102 and the upper surface of the insulating portion 103a form substantially the same plane, and light irradiation from the LED element 110 (see FIG. 2) and the light emission from the lead frames 101 and 102 are performed. The light reflection can be prevented.

  The lead frame 101 has a height of 0.05 mm and a horizontal width of 0.05 mm, and the lead frame 102 has a height of 0.03 mm and a horizontal width of 0.03 mm.

  These numerical values may be appropriately determined depending on the overall configuration. However, if the value is too large, the lead frames 101 and 102 can be securely sandwiched, while the area functioning as the reflecting surface of the lead frames 101 and 102 is reduced. End up. Conversely, if it is too small, the area functioning as the reflecting surface of the lead frames 101 and 102 can be increased, while the lead frames 101 and 102 cannot be securely sandwiched.

  That is, the height and width of the step of the lead frame 101 may be set within a range of 0.03 mm to 0.07 mm, and the height and width of the step of the lead frame 102 may be set within a range of 0.02 mm to 0.05 mm.

  Further, as shown in FIG. 4, the horizontal width of the step between the lead frames 101 and 102 is smaller (0.03 mm) when the lead frame 102 has a longer horizontal length than the lead frame. In the lead frame 101 whose lead frame has a short horizontal length, the horizontal width of the step is increased (0.05 mm).

  This is because the rotational torque for removing the lead frames 101, 102 and the insulating portion 103a is the same, and the other end of the lead frames 101, 102 is firmly fixed, so the end of the lead frame that hangs on the surface A or B This is because the forces generated in the are different. Here, the horizontal length of the lead frame is the distance from the portion fixed by the package member 103 to the insulating portion 103a. The lead frame 102 on which the LED element 110 is placed is longer.

  Note that the size of the step between the lead frames 101 and 102 may be the same (both steps are adjusted to a large value of 0.05 mm), but the lead frame is securely sandwiched and functions as a reflective surface. The above-described conditions are better for ensuring that the area to be reduced is not reduced.

  With the above configuration, a metal having good light reflectance and thermal conductivity (aluminum in the present embodiment) is used for the lead frames 101 and 102, and further, the function of the reflector is improved by utilizing the high light reflectance of the metal. It can also serve as a heat sink using high thermal conductivity. This eliminates the need for costly silver plating and a separate heat dissipating member.

  Due to this heat dissipation action, the LED element 110 is excellent in heat dissipation, can maintain high luminous efficiency, and can achieve a long life.

  Further, by providing the chamfered portions at the end portions of the lead frames 101 and 102, the insulating portion 103a that insulates the lead frame 101 and the lead frame 102 can be reliably sandwiched with a resin for molding. As a result, the lead frames 101 and 102 that affect the performance of the LED package 100 and the insulating portion 103a can be securely adhered, and the sealing member can be prevented from leaking.

  Further, the shape of the lead frames 101 and 102 does not need to be complicated, the cost of the members can be reduced, and unnecessary stress can be prevented from being applied to the lead frames 101 and 102, so that moisture can be prevented from entering, and the lead frame 101 can be prevented. , 102 can be prevented from degrading.

  That is, by using a light and inexpensive aluminum lead frame, the adhesion and the adhesion between the lead frame and the package (especially the insulating part that insulates between the two lead frames) with a simple structure, the performance and reliability of the LED package Can be improved.

  The LED package of the present invention is excellent in reliability and useful for use as a long-life light-emitting device having liquid leakage resistance of a sealing resin.

100 LED package 101, 102 Lead frame 103 Package member 103a Insulating portion 105 Cavity (LED mounting space)
110 LED element 111, 112 Bonding wire

Claims (4)

An LED element;
The one surface on the side on which the LED element is placed and the other surface opposite to the one surface, and a first reflector portion rising from the one surface to the one surface side, A first lead frame electrically connected to the LED element;
A second surface comprising a bonding surface that is spatially isolated from the first lead frame and electrically connected to the LED element, and a second reflector portion that rises from the bonding surface toward the bonding surface. Lead frame,
An insulating member that insulates and holds between the first lead frame and the second lead frame;
In the first lead frame, at least a part of the other surface is exposed from the insulating member, and the back surface of the end portion on the side facing the second lead frame is covered with the insulating member,
In the second lead frame, the back surface of the bonding surface is covered with the insulating member,
In the first reflector part and the second reflector part, the LED element side surface is exposed from the insulating member, and the back side of the LED element side surface is covered by the insulating member,
The first and second lead frames include a recess extending from the one surface and the bonding surface to an end on the insulating portion side facing the first and second lead frames,
The insulating portion sandwiches the recess and the other surface of the first lead frame and the back surface of the bonding surface of the recess and the second lead frame,
The LED package , wherein a size of the concave portion of the first lead frame is smaller than a size of the concave portion of the second lead frame . The LED package according to claim 1, wherein the lead frame is made of aluminum.   2. The LED package according to claim 1, wherein an upper surface of the first and second lead frames and an upper surface of the insulating portion are in the same plane. 1st provided with one surface of the side which mounts an LED element, the other surface on the opposite side to said one surface, and the 1st reflector part which rose from said one surface to said one surface side Lead frame,
A second surface comprising a bonding surface spatially isolated from the first lead frame and electrically connectable to the LED element, and a second reflector portion rising from the bonding surface to the bonding surface side. A lead frame;
An insulating member that insulates and holds between the first lead frame and the second lead frame;
In the first lead frame, at least a part of the other surface is exposed from the insulating member, and the back surface of the end portion on the side facing the second lead frame is covered with the insulating member,
In the second lead frame, the back surface of the bonding surface is covered with the insulating member,
In the first reflector part and the second reflector part, the LED side surface is exposed from the insulating member, and the back side of the LED side surface is covered by the insulating member,
The first and second lead frames include a recess extending from the one surface and the bonding surface to an end on the insulating portion side facing the first and second lead frames,
The insulating portion sandwiches the recess and the other surface of the first lead frame and the back surface of the bonding surface of the recess and the second lead frame,
The LED package frame , wherein a size of the concave portion of the first lead frame is smaller than a size of the concave portion of the second lead frame.