JP5233478B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using a light emitting element, and more particularly to a thin light emitting device used for a backlight of a liquid crystal display.

  In recent years, light emitting elements with high brightness and high output and small light emitting devices have been developed and used in various fields. Such a light emitting device is utilized for, for example, a light source of a mobile phone and a liquid crystal backlight, a light source of various meters, various reading sensors, and the like, taking advantage of features such as small size, low power consumption and light weight.

For example, a light source used for a backlight is configured by placing a light emitting element in an opening of a package and filling a light-transmitting resin containing a phosphor so as to cover the light emitting element.
The resin used for the package of such a conventional light source (light emitting device) has low light resistance. For this reason, the light emitted from the light emitting element toward the side surface of the opening changes the color of the side surface of the opening, thereby reducing the light efficiency. Accordingly, there has been a problem that the product life is shortened.
In addition, the conventional light emitting device has a problem that the package is deformed or discolored by heat generated from the light emitting element because the resin used for the package has low heat resistance.

  Therefore, for example, as shown in FIG. 4, a part of the lead frame 400 is bent, and the portion where the discoloration of the package is remarkable is covered with the blade portions 401 and 403, thereby preventing discoloration due to light from the light emitting element. Heat generated from the light emitting element is dissipated (for example, Patent Document 1).

JP 2008-53726 A

  However, in the embodiment shown in FIG. 4, the above problem can be solved, but the heat of the metal blades 401 and 403 and the package 405 can be obtained only by covering the upper end surface 406 of the blades 401 and 403 with the package 405. There is a concern that peeling may occur at the interface between the blade portion and the package due to the difference in expansion coefficient.

  Therefore, the adhesion between the lead frame and the package is strengthened, the interface between the lead frame and the package is prevented from peeling, the discoloration of the package due to the light from the light emitting element is prevented, and the heat generated from the light emitting element is efficiently radiated. An object of the present invention is to provide a light-emitting device that can be used.

In order to achieve the above object, the present invention is a light emitting device including a package having an opening having a side surface and a bottom surface, and a lead frame exposed on the bottom surface, wherein the lead frame includes: A bent reflection part is provided on the side surface, and a part of the inner wall surface of the reflection part is located inside the package.
In the light-emitting device formed with such a structure, light from the light-emitting element is reflected by a reflective portion having a high reflectance, and the package can be prevented from being discolored. In addition, since a part of the inner wall surface of the reflecting portion is inside the package, the adhesion between the reflecting portion and the package can be further strengthened. Therefore, it is possible to prevent peeling at the interface between the reflective portion and the package.

In the present invention, the side surface of the opening has an inclination angle with respect to the bottom surface that is smaller than the inclination angle with respect to the bottom surface of the reflection portion on the upper surface side of the opening portion than the portion covering a part of the inner wall surface. It is preferable to have a surface.
With such a configuration, the light from the light emitting element can be prevented from being directly applied on the upper surface side of the opening, and the discoloration of the package can be further prevented.

Moreover, in this invention, it has a sealing member containing fluorescent substance in the said opening part, and it is preferable that the said fluorescent substance is arrange | positioned at the said bottom face side rather than the part which covers a part of said inner wall surface.
With such a configuration, heat generated from the phosphor can be radiated to the outside through the lead frame exposed on the bottom surface of the reflecting portion and the opening.

  According to the present invention, it is possible to further enhance the adhesion between the reflection part obtained by bending a part of the lead frame and the package, and prevent the peeling at the interface between the reflection part and the package, and the package by light from the light emitting element. It is possible to provide a light-emitting device that can prevent discoloration and efficiently dissipate heat generated from the light-emitting element and the phosphor.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below is an example and this invention does not limit a light-emitting device to the following light-emitting devices. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate.

  FIG. 1A is a perspective view showing a light emitting device of the present invention. FIG. 1B is a perspective view of the lead frame of the light emitting device of the present invention. 1C is a cross-sectional view taken along line AA in FIG. 1A. FIG. 1D is a partially enlarged view of FIG. 1C. FIG. 1E is a partially enlarged view of FIG. 1B. FIG. 2A is a front view showing another light emitting device of the present invention. FIG. 2B is a rear view of FIG. 2A. FIG. 2C is a plan view of FIG. 2A. FIG. 2E is a right side view of FIG. 2A. FIG. 2D is a bottom view of FIG. 2A. FIG. 2F is a left side view of FIG. 2A. FIG. 2G is a perspective view of FIG. 1A viewed from obliquely above. FIG. 2H is a perspective view of FIG. 2A as viewed obliquely from behind. FIG. 2I is a cross-sectional view taken along line AA in FIG. 2A. FIG. 2J is a front view of the sealing member in FIG. 2A indicated by oblique lines. FIG. 2K is a front view showing a state where the sealing member of FIG. 2A is not filled. 3A to 3F are schematic cross-sectional views illustrating the method for manufacturing the light emitting device of the present invention.

As shown in FIG. 1, the light emitting device 1 of the present invention is a light emitting device having a package 4 having an opening 2 having a side surface and a bottom surface, and a lead frame 6 exposed on the bottom surface 7 of the opening 2. is there. In the present invention, the lead frame 6 has a bent reflecting portion 8 on the side surface of the opening, and a part of the inner wall surface 10 of the reflecting portion 8 is located inside the package 4.
Here, in the reflecting portion 8, the inner wall surface 10 is a surface that mainly reflects light emitted from the light emitting element, and refers to a surface that is exposed at the side surface of the opening.

(Opening 2)
The opening 2 is formed in the package 4. The bottom surface 7 of the opening 2 has an exposed lead frame 6.

In the present invention, the shape of the opening is rectangular, and on the side surface of the opening close to the light emitting element, the portion covering the inner wall surface of the reflecting portion is formed thicker than the other portions, and the light emission of the opening The side surface far from the element is formed with substantially the same thickness. However, it is not particularly limited, and the shape of the opening may be a circle, an ellipse, a triangle, a square, or the like, as long as a part of the surface of the lead frame 6 that is electrically connected to the bottom surface of the opening is exposed. Any of the shapes approximate to these may be used.
Further, the depth of the opening 2 can be adjusted as appropriate depending on the number of light-emitting elements 12 to be placed and the bonding method. The size of the opening 2 is preferably larger in order to obtain a wider light distribution. In addition, it is preferable that the bottom surface and / or the side surface of the opening 2 increase the adhesion surface area by embossing or plasma treatment, and improve the adhesion with the sealing member.

In the present embodiment, as shown in FIG. 1, a bent reflecting portion 8 is provided on the side surface of the opening, and a part of the inner wall surface 10 of the reflecting portion 8 is located inside the package 4.
Thereby, the light from a light emitting element can be reflected by the inner wall surface 10 of the reflection part 8 with high reflectance, and light can be extracted efficiently. At the same time, since the reflecting portion 8 made of a metal material is formed on the side surface of the opening, discoloration of the package 4 due to light emitted from the light emitting element 12 can be prevented. Further, since a part of the inner wall surface 10 of the reflecting portion 8 is located inside the package 4, the adhesion between the package and the reflecting portion can be strengthened, and peeling occurs at the interface between the package and the reflecting portion. Can be prevented.

The inner wall surface 10 is 10% or more of the entire inner wall surface from the upper end of the inner wall surface, and it is preferable that the inner wall surface 10 is covered with the package from the height of the light emitting element, and even a part of the entire inner wall surface may be covered with the package. More preferred.
As a result, the adhesion between the reflecting portion and the package can be increased, and peeling at the interface between the reflecting portion and the package can be prevented.
If the inner wall surface 10 is completely covered with the package, the side surface of the opening is covered with a package molding material having low light resistance, and deterioration due to light from the light emitting element cannot be prevented.

Moreover, as shown in FIG. 1, it is preferable that the upper surface 24 adjacent to the inner wall surface 10 of the reflecting portion 8 and the outer wall surface 26 adjacent to the upper surface 24 and opposed to the inner wall surface 10 are each covered by the package. .
Thereby, the adhesiveness of a package and a reflection part can be strengthened, and it can prevent peeling at the interface of a package and a reflection part.

In addition, as shown in FIG. 1D, the side surface of the opening 2 is inclined with respect to the bottom surface of the opening 2 on the upper surface side of the opening rather than a portion that covers a part of the inner wall surface 10 (hereinafter also referred to as a locking portion). It is preferable that the angle θ ₁ has a surface 16 (hereinafter also referred to as an inclined surface) that is smaller than the inclination angle θ _{2 with} respect to the bottom surface of the opening 2 of the reflecting portion 8. Thereby, it is possible to prevent light from the light emitting element from being directly applied to the upper surface side of the opening, and to further prevent discoloration of the package.
Inclination angle theta ₁ is 30 degrees to 90 degrees relative to the bottom surface of the opening portion of the inclined surface 16 is preferred. And inclination-angle (theta) _{2 with} respect to the bottom face of the opening part of the reflection part 8 has preferable 60 to 90 degree | times. Thereby, the inner wall surface 10 can be supported without directly receiving light from the light emitting element.
Note that the inclined surface may have at least one surface and may have a plurality of surfaces.

(Package 4)
As shown in FIG. 1, the package 4 in the present invention has an opening 2 and a lead frame 6 on the bottom surface of the opening 2. Further, the package 4 functions as a support for fixing and holding the lead frame 6 on which the light emitting element 12 is placed, and also has a function of protecting the light emitting element 12 from the external environment.

The molding material for the package used in the present invention is not particularly limited, and any conventionally known thermoplastic resin such as liquid crystal polymer, polyphthalamide resin, polybutylene terephthalate (PBT), or the like can be used. In particular, when a semi-crystalline polymer resin containing a high melting point crystal such as polyphthalamide resin is used, a sealing member that can be provided inside the opening and a light guide plate that can be retrofitted with a large surface energy. Thus, a package having good adhesion with the above can be obtained. Thereby, in the process of filling and curing the sealing member, it is possible to suppress the occurrence of peeling at the interface between the package and the sealing member in the cooling process. Moreover, in order to reflect the light from a light emitting element efficiently, white pigments, such as a titanium oxide, can be mixed in a package shaping | molding member.
The front surface of the package 4 may not be flush and may have a stepped portion. In the present invention, as shown in FIG. 1A, the front surface of the package 4 has a stepped portion.

(Reflection part 8)
The reflection portion 8 is a part of the lead frame, and is formed by bending on the side surface of the opening. The reflecting portion 8 includes an inner wall surface 10, an upper surface 24 adjacent to the inner wall surface, and an outer wall surface 26 adjacent to the upper surface 24 and facing the inner wall surface 10. The upper surface 24 and the outer wall surface 26 of the reflecting portion 8 are each entirely covered with the package, and a part of the inner wall surface 10 is located inside the package 4.

In the present invention, the reflecting portion 8 is formed on both side surfaces closest to the light emitting element so as to sandwich the light emitting element and easily discolored by light from the light emitting element.
As a result, on both sides of the package, it is possible to cover the portions that are easily deteriorated by the light from the light emitting elements with the reflecting portions, and thus it is possible to prevent the package from being deteriorated.

Although at least one reflecting portion 8 may be formed, it is preferable to provide two reflecting portions 8. When two are provided, it is preferably formed symmetrically with respect to the light emitting element 12 such as an angle, a width, and a height. When the reflecting portion 8 is formed symmetrically with respect to the light emitting element, it is possible to obtain a symmetrical light distribution.
Also, two or more reflecting portions 8 can be formed symmetrically or asymmetrically with respect to the light emitting element.

  Moreover, it is preferable to provide a groove or unevenness on the outer wall surface 26 of the reflecting portion 8 to increase the surface area where the package and the reflecting portion 8 come into contact. As a result, the adhesion between the package and the reflecting portion can be further improved, and the problem of peeling at the interface between the package and the reflecting portion can be solved.

  Moreover, it is preferable to provide a notch or a groove on the upper surface 24 side of the inner wall surface 10 and to cover the notch or groove with the package. As a result, it is possible to increase the surface area where the package 4 and the reflecting portion 8 are in contact with each other, and the adhesion between the package and the reflecting portion is further improved, and the problem of peeling at the interface between the package and the reflecting portion can be solved. It becomes possible.

  As shown in FIG. 1, the width W1 of the reflecting portion 8 is preferably 100% or more with respect to the width W2 of the light emitting element. As a result, the portion of the package that is likely to be discolored by light from the light emitting element can be covered by the reflecting portion, so that discoloration of the package can be prevented.

  Further, the height H1 of the reflecting portion is preferably about 50% to 90% with respect to the height H2 of the package, and from another viewpoint, it is preferably 100% or more with respect to the height H3 of the light emitting element. As a result, the portion that is likely to be discolored by the light from the light emitting element is covered by the reflecting portion, so that discoloration of the package can be prevented.

  In addition, the thickness T1 of the reflecting portion is preferably substantially the same as the thickness of the portion other than the reflecting portion of the lead frame, but is more preferably thinner than the thickness of the portion other than the reflecting portion of the lead frame. If the thickness T1 of the reflecting portion is made thinner than the thickness of the other lead frame, it becomes easy to bend and form when the reflecting portion is formed by bending a part of the lead frame.

Moreover, as shown to FIG. 1D, 60 degrees-90 degrees are preferable for inclination | tilt angle (theta) _{2 with} respect to the bottom face of the opening part of an inner wall surface. Thereby, discoloration of the package can be prevented by reflecting light from the light emitting element by the inner wall surface while realizing a desired light distribution characteristic.

(Lead frame 6)
The lead frame 6 is an electrode for electrically connecting to the light emitting element.
As described above, the lead frame 6 of the present invention has the bent reflecting portion 8 on the side surface of the opening 2.

The lead frame may be substantially plate-shaped, and may be plate-shaped having a corrugated plate shape. The film thickness may be uniform or partially thick or thin. The material is not particularly limited, and it is preferably formed of a material having a relatively large thermal conductivity. By forming with such a material, heat generated in the light emitting element can be efficiently released. For example, a material having a thermal conductivity of about 200 W / (m · K) or more, a material having a relatively large mechanical strength, or a material that can be easily punched or etched is preferable. Specific examples include metals such as copper, aluminum, gold, silver, tungsten, iron and nickel, and alloys such as iron-nickel alloys and phosphor bronze. Further, it is preferable that the surface of the lead frame is subjected to reflection plating in order to efficiently extract light from the light emitting element to be mounted.

Further, as shown in FIG. 1A, it is preferable to provide a notch 9 in the lead frame 6 on the bottom surface of the opening 2 so that the package is exposed on the bottom surface of the opening. Thereby, the adhesiveness of the sealing member mentioned later with which an opening part is filled, and a package improves. When the adhesion between the sealing member and the package is good, it is possible to prevent the entry of the sulfide gas from the outside of the light emitting device, and the effect of preventing the lead frame from being discolored by the sulfide gas can be obtained. It is also possible to prevent water from entering from the outside.
In addition, although it is preferable to provide one notch 9, as shown to FIG. 1A, it is more preferable to provide two or more. By providing the plurality of notches 9, the adhesion between the package exposed at the bottom surface of the opening and the sealing member is further improved.

Moreover, it is preferable to provide the heat dissipation terminal 220 on the lead frame as shown in FIG. By providing the heat dissipation terminal, the heat generated from the light emitting element 212 and the phosphor (not shown) can be efficiently dissipated.
In addition, it is preferable to form a thermal radiation terminal in the surface by the side of mounting, when mounting.

(Light emitting element 12)
The light emitting element 12 placed in the opening 2 may be made of any semiconductor material as long as it is an element called a light emitting diode. For example, a laminated structure including an active layer is formed on a substrate by various semiconductors such as a nitride semiconductor such as InN, AlN, GaN, InGaN, AlGaN, and InGaAlN, a III-V group compound semiconductor, and a II-IV group compound semiconductor. What was formed is mentioned.

  In the present invention, not only one light emitting element 12 but also a plurality of light emitting elements 12 may be mounted. In this case, in order to improve luminous intensity, a plurality of light emitting elements that emit light of the same emission color may be combined. Further, for example, color reproducibility can be improved by combining a plurality of light emitting elements having different emission colors so as to correspond to RGB.

  As shown in FIG. 1, these light emitting elements 12 are mounted on a lead frame 6 on the bottom surface of the opening 2 of the package 4 by a joining member (not shown). In the case of a light emitting element formed by growing a nitride semiconductor on an insulating substrate (sapphire substrate), for example, an epoxy resin or silicone can be used as such a bonding member. In consideration of deterioration from light and heat from the light emitting element, the back surface of the light emitting element is plated with Al, solder such as Au-Sn eutectic, brazing material such as low melting point metal, conductive paste, etc. as a joining member. It may be used. Moreover, in the case of a light emitting device comprising a conductive substrate (such as GaAs) and having electrodes formed on both sides thereof, such as a light emitting device that emits red light, it is mounted with a conductive paste such as silver, gold, or palladium. Is done.

  In the light emitting device of the present invention, a protective element may be mounted in addition to the light emitting element. The protective element may be mounted in the opening where the light emitting element is placed, or may be mounted by forming another opening in the package. It may be mounted on the back surface of the lead frame on which the light emitting element is mounted, and covered with a package molding material to be formed integrally with the package. Further, the number of protective elements may be one, or two or more. Here, the protective element is not particularly limited, and may be any known element mounted on the light emitting device. Specifically, a Zener diode, a transistor diode, or the like can be used.

The light emitting element is usually connected to a positive electrode and a negative electrode formed on a substrate, respectively, by conductive wires.
The conductive wire is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrode of the light emitting element. The thermal ^{conductivity, 0.01cal / (s) (cm} 2) (℃ / cm) or more, is more preferably ^{0.5cal / (s) (cm 2} ) (℃ / cm) or more. In consideration of workability and the like, the diameter of the conductive wire is preferably Φ10 μm or more and Φ45 μm or less. The diameter of the conductive wire is more preferably 25 μm or more, and more preferably 35 μm or less from the viewpoint of securing the light emitting area of the light emitting element and ease of handling. Specific examples of such conductive wires include conductive wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof.
The light emitting element may be flip-chip bonded using a conductive adhesive member such as solder in addition to wire bonding.

(Sealing member 14)
The sealing member protects the light emitting element 12 from the external environment. The light emitting element 12 and the like are covered with the sealing member by curing the material of the sealing member filled in the opening 2 of the package so as to cover the light emitting element 12.
In the present invention, as shown in FIG. 1C, a sealing member 14 including a phosphor is formed in the opening, and the phosphor is located closer to the bottom surface 7 of the opening than a portion covering at least a part of the inner wall surface 10. It is preferable to have it.
Thereby, the heat generated from the phosphor can be transferred to the reflecting portion 8 and radiated to the outside through the lead frame 6.

As the sealing member, for example, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin including at least one kind of those resins can be used. The sealing member is not limited to an organic material, and an inorganic material having excellent light resistance such as glass and silica gel can also be used. Moreover, in this invention, all members, such as a viscosity extender, a light diffusing agent, and a pigment, can be added to a sealing member according to a use. Examples of the light diffusing agent include barium titanate, titanium oxide, aluminum oxide, silicon dioxide, calcium carbonate, and a mixture containing at least one of them. Furthermore, a lens effect can be given by making the light emission surface side of the sealing member a desired shape. Specifically, it can be a convex lens shape, a concave lens shape, an elliptical shape when viewed from the light emission observation surface, or a shape obtained by combining a plurality of them.

(Phosphor)
In this invention, the fluorescent substance which converts the wavelength of the light from a light emitting element can be contained. As an example of such a phosphor, there is a phosphor containing a rare earth element described below.

Specifically, a garnet having at least one element selected from the group of Y, Lu, Sc, La, Gd, Tb, and Sm, and at least one element selected from the group of Al, Ga, and In (Steorite) type phosphor. In particular, the aluminum garnet phosphor includes Al and at least one element selected from Y, Lu, Sc, La, Gd, Tb, Eu, Ga, In, and Sm, and is selected from rare earth elements. It is a phosphor activated by at least one element, and is a phosphor that emits light when excited by visible light or ultraviolet light emitted from a light emitting element. For example, in addition to yttrium-aluminum oxide phosphor (YAG phosphor), Tb _2.95 Ce _0.05 Al ₅ O ₁₂ , Y _2.90 Ce _0.05 Tb _0.05 Al ₅ O ₁₂ , Y _2.94 Ce _0.05 Pr _0.01 Al ₅ O ₁₂ , Y _2.90 Ce _0.05 Pr _0.05 Al ₅ O _{12 and the} like. Among these, particularly in the present invention, two or more kinds of yttrium / aluminum oxide phosphors containing Y and activated by Ce or Pr and having different compositions are used.

In addition, the nitride-based phosphor contains N and at least one element selected from Be, Mg, Ca, Sr, Ba, and Zn, and C, Si, Ge, Sn, Ti, Zr, and Hf And a phosphor activated by at least one element selected from rare earth elements. Examples of the nitride phosphor include (Sr _0.97 Eu _0.03 ) ₂ Si ₅ N ₈ , (Ca _0.985 Eu _0.015 ) ₂ Si ₅ N ₈ , (Sr _0.679 Ca _0.291). Eu _0.03 ) ₂ Si ₅ N ₈ , and the like.

Below, the manufacturing method of the light-emitting device 1 of this invention is demonstrated, referring FIG. 3A-FIG. 3F.
First, a metal flat plate is punched and subjected to metal plating to form a lead frame flat plate 201 that will later become a lead frame, as shown in FIG. 3A. Next, a portion that will later become a reflective portion is bent in the Z direction at the position of the solid line B to obtain a lead frame flat plate 201 shown in FIG. 3B. Subsequently, as shown in FIG. 3C, the lead frame 6 and the reflecting portion 8 which is a part of the lead frame are disposed between the mold 346 and 348 for molding a package divided into upper and lower parts and sandwiched therebetween. The upper mold is formed with a recess (not shown) for later covering a part of the inner wall surface 10 of the reflecting portion 8. Thereafter, as shown in FIG. 3D, the molding material is injected into the cavities of the molds 346 and 348 from the material injection gate of the lower mold 348. Next, as shown in FIG. 3E, the molding material in the molds 346 and 348 is cured, and as shown in FIG. 3F, the lower mold 348 is first removed, and the upper mold 346 is moved in the direction of the arrow. remove.

Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.
(Example 1)
The light emitting device 1 of the present embodiment is a light emitting device having a package 4 having an opening 2 and a lead frame 6 on the bottom surface of the opening 2 as shown in FIG. 1C. In this embodiment, the lead frame 6 has a bent reflection part 8 with a part of the lead frame on the side surface of the opening, and a part of the inner wall surface 10 of the reflection part 8 is located inside the package 4. . Then, the side surface of the opening portion has an inclination angle θ ₁ with respect to the bottom surface of the opening portion on the upper surface side of the opening portion rather than a portion covering a part of the inner wall surface 10 of the reflection portion 8. It has a smaller inclined surface 16 than theta _2.

  In this embodiment, first, a lead frame flat plate is formed by applying silver plating to the surface of a metal plate made of iron-containing copper having a thickness of 0.11 mm. Then, a portion that will later become a reflective portion is bent and formed at 60 degrees with respect to the surface of the lead frame flat plate. The lead frame flat plate thus obtained is placed in a mold, polyphthalamide resin is injected as a molding material, and cured to remove the mold. Then, the light emitting element 12 made of a nitride semiconductor is bonded and fixed to the lead frame of the obtained package with an epoxy resin. Next, the electrode of the fixed light emitting element and the lead frame are connected by a conductive wire whose main material is Au.

  Next, a YAG phosphor is mixed at a predetermined ratio (5 to 30% by weight) with a modified silicone resin in which an epoxy resin and a silicone resin are mixed, filled in the opening 2, and cured in a hot air oven (curing conditions: 150 degreeC, 4 hours), and the sealing member 14 was formed.

In this example, the width W1 of the reflecting portion was 0.85 mm, the height H1 of the reflecting portion was 0.23 mm, and the thickness of the reflecting portion was 0.11 mm.
The width W2 of the light emitting element was 0.5 mm, and the height H3 was 0.12 mm.
The package height H2 was 1 mm.

The obtained light emitting device 1 has an opening 2, and has a lead frame 6 on the bottom surface of the opening. The lead frame 6 has a bent reflecting portion 8 on a side surface of the opening. A part of the inner wall surface 10 of the reflecting portion 8 is located inside the package 4. The inner wall surface 10 of the reflecting portion 8 covers 10% of the entire inner wall surface with the package from the upper end of the inner wall surface.
Thereby, the light from the light emitting element is reflected by the reflective portion 8 having a high reflectance, and the package 4 can be prevented from being discolored. In addition, since the inner wall surface 10 of the reflecting portion 8 is inside the package 4, the adhesion between the reflecting portion 8 and the package 4 can be further strengthened, and peeling at the interface between the reflecting portion 8 and the package 4 is prevented. It becomes possible to do.

Further, in the present embodiment, the side surface of the opening portion has an inclination angle θ ₁ with respect to the bottom surface of the opening portion on the upper surface side of the opening portion rather than the portion covering a part of the inner wall surface, and the inclination angle with respect to the bottom surface of the opening portion of the reflecting portion It has a corner theta ₂ is smaller than the inclined surface 16. The inclination angle θ _{1 with} respect to the bottom surface of the opening of the inclined surface was 30 degrees, and the inclination angle θ _{2 with} respect to the bottom surface of the opening of the reflecting section was formed with 60 degrees.
With such a configuration, it is possible to prevent light from the light emitting element from being directly applied to the upper surface side of the opening, and to further prevent discoloration of the package.

  Furthermore, in the present embodiment, it is preferable that a sealing member 14 including a phosphor is formed in the opening 2 and the phosphor is provided on the bottom side of the opening rather than a portion covering at least a part of the inner wall surface. Thereby, the heat generated from the phosphor can be transferred to the reflecting portion 8 and radiated to the outside through the lead frame.

(Example 2)
FIG. 2A is a front view showing another light emitting device of the present invention. FIG. 2B is a rear view of FIG. 2A. FIG. 2C is a plan view of FIG. 2A. FIG. 2E is a right side view of FIG. 2A. FIG. 2F is a left side view of FIG. 2A. FIG. 2G is a perspective view of FIG. 1A viewed from obliquely above. FIG. 2H is a perspective view of FIG. 2A as viewed obliquely from behind. FIG. 2I is a cross-sectional view taken along the line AA of FIG. 2A. FIG. 2J is a front view of the sealing member in FIG. 2A indicated by oblique lines. FIG. 2K is a front view showing a state where the sealing member of FIG. 2A is not filled.

  In the light emitting device 201 according to the second embodiment, a heat radiating terminal 220 is formed. When the light emitting device 201 is mounted, the heat radiating terminal 220 is formed on the surface on the mounting side. High heat dissipation can be obtained by forming a heat dissipation terminal on the surface on the mounting side. Thereby, the heat generated from the light emitting element can be efficiently radiated, and discoloration can be prevented. In addition, since the center of gravity is provided on the surface where the heat dissipating terminal 220 is mounted, the mountability is improved.

Other parts are substantially the same as those of the light emitting device of Example 1.

  The semiconductor device of the present invention can be used for a liquid crystal backlight light source, various indicator light sources, panel meters, indicator lamps, surface emitting switches, optical sensors, and the like.

It is a perspective view which shows the light-emitting device of this invention. It is a perspective view of the lead frame of the light-emitting device of this invention. It is AA sectional drawing of FIG. 1A. It is a partially expanded view of FIG. 1C. It is a partially expanded view of FIG. 1B. It is a front view which shows the other light-emitting device of this invention. It is a rear view of FIG. 2A. It is a top view of FIG. 2A. It is a bottom view of Drawing 2A. It is a right view of FIG. 2A. It is a left view of FIG. 2A. It is the perspective view which looked at FIG. 2A from diagonally upward. It is the perspective view which looked at FIG. 2A from diagonally behind. It is AA sectional drawing of FIG. 2A. It is the front view which showed the sealing member of FIG. 2A by the oblique line. It is the front view which showed the state which is not filled with the sealing member of FIG. 2A. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light emitting device of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device of this invention. It is a figure which shows the light-emitting device of patent document 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Opening part 4 Package 6 Lead frame 8 Reflecting part 10 Inner wall surface 12 Light emitting element 14 Sealing member 16 Inclined surface 301 Lead frame flat plate

Claims (7)

A light emitting device comprising: a package having an opening having a side surface and a bottom surface; and a lead frame exposed on the bottom surface,
The lead frame has a bent reflecting portion on the side surface, and a part of an inner wall surface of the reflecting portion is covered with a molding material of the package.   The side surface of the opening has a surface whose inclination angle with respect to the bottom surface is smaller than an inclination angle with respect to the bottom surface of the reflection portion on the upper surface side of the opening portion with respect to a portion covering a part of the inner wall surface. The light emitting device according to 1.   The light emitting device according to claim 2, further comprising: a sealing member including a phosphor in the opening, wherein the phosphor is disposed closer to the bottom surface than a portion covering at least a part of the inner wall surface. A light emitting device comprising: a package having an opening having a side surface and a bottom surface; and a lead frame exposed on the bottom surface,
The lead frame has a bent reflecting portion on the side surface,
The side surface of the opening portion has a surface whose inclination angle with respect to the bottom surface is smaller than the inclination angle with respect to the bottom surface of the reflection portion on the upper surface side of the opening portion with respect to the interface between the package and the inner wall surface of the reflection portion. Light emitting device.   5. The light emitting device according to claim 4, further comprising a sealing member including a phosphor in the opening, wherein the phosphor is disposed on the bottom surface side at least with respect to an interface between the package and the inner wall surface of the reflection unit. . The light emitting device according to claim 1, wherein the inner wall surface has a notch or a groove, and the notch or the groove is covered with a molding material of the package. A light emitting device comprising: a package having an opening having a side surface and a bottom surface; and a lead frame exposed on the bottom surface,
The lead frame has a bent reflecting portion on the side surface,
The light emitting device, wherein the side surface of the opening portion has a surface with an inclination angle with respect to the bottom surface smaller than an inclination angle with respect to the bottom surface of the reflection portion on the upper surface side of the opening portion with respect to the reflection portion.

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