JP2009283654A - Light-emitting device and its fabrication process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device whose heat dissipation properties can be improved with its reliablity prevented from being deteriorated, and whose luminescence characteristics can be prevented from being deteriorated. <P>SOLUTION: A surface-mounting LED (a light-emitting device) 100 comprises a substrate 1 of a metal plate including a first portion 2, and a second portion 3 separated from the first portion 2, an LED device 20 fixed on the first portion 2 of the substrate 1 and electrically connected with the first portion 2 and second portion 3 of the substrate 1, respectively, and a reflective frame 10 consisting of metallic material and fixed onto the substrate 1 where the inner side surface 13a of an opening 13 serves as a reflective surface for reflecting light from the LED device 20. The substrate 1 is constituted in such a manner that the side end surface 3a of the second portion 3 is located on the inside of the side end surface 14 of the reflective frame 10 in the plan view. The second portion 3 of the substrate 1 is insulated and fixed to the reflective frame 10 by insulating adhesive (an insulating adhesive layer 42). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device and a method for manufacturing the same, and more particularly to a light emitting device including a light emitting element and a reflection frame that reflects light from the light emitting element, and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, a light emitting device including a reflection frame that reflects light from a light emitting element is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a light-emitting device in which a reflective frame is made of a metal material in order to dissipate heat generated by light emission of an LED (Light Emitting Diode) element (light-emitting element) from the reflective frame. Are listed. This light emitting device includes a printed circuit board on which an LED element is mounted and the above-described reflective frame, and the reflective frame is fixed on the printed circuit board through an adhesive layer.

  In addition, metal electrodes are formed on the upper surface of the printed board on which the LED elements are mounted, and electrode terminals are formed on the lower surface of the printed board. And the metal electrode and the electrode terminal are electrically connected by the connection part formed in the side surface of the printed circuit board. That is, the printed board is composed of a double-sided board. On the other hand, the LED element on the printed board is electrically connected to the metal electrode of the printed board through a wire.

Since the conventional light emitting device configured as described above is configured to be able to dissipate heat from the LED element from the reflecting frame, it is possible to improve the heat dissipation characteristics of the light emitting device. Note that, in the light emitting device as described above, generally a multiple simultaneous production method is employed in which a large number of light emitting devices are obtained at once by dicing the assembly.
JP 2005-229003 A

  However, the conventional light emitting device described in Patent Document 1 has a disadvantage that a metal burr (cutting burr) is generated in the reflection frame by dicing because the reflection frame is made of a metal material. Then, when this metal burr comes into contact with the metal electrode of the printed circuit board, one metal electrode (for example, cathode electrode) and the other metal electrode (for example, anode electrode) are electrically connected via the reflective frame. The inconvenience of short-circuiting occurs. Therefore, the above-described conventional light emitting device has a problem that although it is possible to improve heat dissipation characteristics, it is difficult to suppress a decrease in reliability.

  Moreover, in the conventional light emitting device described in Patent Document 1, a printed circuit board is used as a substrate. In this printed circuit board, since an insulating material such as glass epoxy or LCP (Liquid Crystal Polymer) is used as a base material, the base material portion is discolored (light deteriorated) by light from the LED element (light emitting element). There is an inconvenience. Further, the base material portion of the printed circuit board is discolored (light deteriorated), so that there is a disadvantage that the amount of light extracted from the light emitting device is reduced. Thereby, there also exists a problem that the light emission characteristic falls.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to suppress a decrease in reliability while improving heat dissipation characteristics, and It is an object to provide a light emitting device capable of suppressing a decrease in light emitting characteristics and a manufacturing method thereof.

  In order to achieve the above object, a light-emitting device according to a first aspect of the present invention includes a substrate made of a metal plate including a first portion, a second portion separated from the first portion, and a first portion of the substrate. A light emitting element fixed on top and electrically connected to at least the second portion, and made of a metal material and fixed on the substrate, and an inner peripheral surface is a reflective surface that reflects light from the light emitting element. And a reflective frame. The substrate is configured such that the side end surface of the second portion is located inside the side end surface of the reflection frame body in a plan view, and at least the second portion of the substrate is an insulating adhesive. The insulation frame is insulated and fixed by the above.

  In the light emitting device according to the first aspect, as described above, the substrate is formed from the metal plate including the first portion and the second portion separated from the first portion, and at least the first portion is in thermal contact with the first portion. By attaching the reflective frame on the substrate and fixing the light emitting element on the first part of the substrate as described above, the heat generated by the light emission of the light emitting element can be dissipated from the first part, and the first part Heat can also be dissipated from the reflective frame through one part. Here, as described above, since the first portion is made of the metal plate having excellent thermal conductivity, the heat from the light emitting element can be effectively dissipated from the first portion, and the reflective frame. Can effectively transfer heat to the body. Moreover, since the reflective frame is also made of a metal material having excellent thermal conductivity, heat from the light emitting element transmitted through the first portion can be effectively dissipated from the reflective frame. Accordingly, it is possible to effectively dissipate heat generated by the light emitting element emitting light, so that the heat dissipation characteristics of the light emitting device can be improved. Further, by improving the heat dissipation characteristics, the temperature of the light emitting element can be kept low even if the light emitting element generates heat due to light emission. As a result, it is possible to suppress the inconvenience that the light emission characteristics are deteriorated due to the temperature rise of the light emitting element, so that good light emission characteristics can be obtained.

  In the first aspect, the substrate is configured such that the side end surface of the second portion is located inside the side end surface of the reflection frame body in a plan view, and thus the side end surface of the reflection frame body is obtained by dicing. Even if metal burrs (cutting burrs) are generated, contact between the metal burrs and the second portion of the substrate can be suppressed. For this reason, since it can suppress that the reflective frame body which consists of metal materials, and the 2nd part of a board | substrate are electrically connected, the cathode and anode of a light emitting element are electrically connected via a reflective frame body. Short circuit can be suppressed. Accordingly, it is possible to suppress a decrease in reliability due to an electrical short circuit between the cathode and the anode of the light emitting element.

  Furthermore, in the first aspect, since the substrate is made of a metal plate, the substrate does not include the insulating material unlike a printed circuit board that includes an insulating material such as glass epoxy or LCP as a base material. For this reason, even when the light from a light emitting element is irradiated to a board | substrate for a long time, it can suppress that a board | substrate surface discolors (light degradation). Thereby, even when it is used for a long time, it can suppress that the light quantity of the light taken out from a light-emitting device falls, Therefore It can suppress that a light emission characteristic falls. Note that the lifetime of the light emitting device can be extended by suppressing the deterioration of the light emitting characteristics.

  In addition, in a printed circuit board including an insulating material such as glass epoxy or LCP as a base material, the insulating material easily contains moisture. For example, when the light emitting device is mounted on a circuit board, water vapor is generated, Inconvenience may be caused. On the other hand, in the light emitting device according to the first aspect, since the insulating material is not included in the substrate, it is possible to suppress the occurrence of the above disadvantages.

  The thermal contact of the present invention is a thermal contact in which air does not intervene, and includes a case where the substrate and the reflection frame body are in direct contact as well as a case where they are indirectly contacted via an adhesive layer or the like. The adhesive layer that fixes the reflective frame on the substrate includes an insulating adhesive layer, a conductive adhesive layer, and a high thermal conductive adhesive layer. Furthermore, in the present invention, the substrate includes one or more first portions and one or more second portions.

  In the light emitting device according to the first aspect, preferably, the light emitting device further includes a sealing body that seals the light emitting element, and the reflection frame body is fixed on the substrate via an adhesive layer made of a material different from the sealing body. ing. If configured in this way, the options for the adhesive layer can be expanded. For example, by selecting an adhesive layer whose fixing strength is higher than that of the constituent material of the sealing body, the reflective frame and the substrate are sufficiently fixed. Can be fixed with strength. On the other hand, since the material can be selected for the sealing body according to the optical characteristics of the light emitting device, the reflective frame and the substrate are fixed with sufficient strength without affecting the optical characteristics of the light emitting device. can do. As a result, it is possible to suppress a decrease in reliability.

  In the light emitting device according to the first aspect, the reflection frame is made of aluminum or an aluminum alloy, and the surface thereof may be anodized. With this configuration, since the insulating film is formed on the surface of the reflection frame, the first and second portions of the substrate are electrically connected even when the reflection frame is fixed on the substrate made of a metal plate. Can be prevented from being short-circuited. Thereby, it is possible to easily suppress a decrease in reliability while improving the heat dissipation characteristics. In addition, the reflectance of a reflective frame body can also be improved by performing an alumite process as described above.

  In the light emitting device according to the first aspect, preferably, a surface of the reflection frame that faces the substrate includes a first region corresponding to the first portion of the substrate and a second region corresponding to the second portion of the substrate. In addition, the second region is recessed from the first region, so that a step portion is formed on the surface of the reflective frame facing the substrate. If comprised in this way, since the insulation distance of the 2nd part of a board | substrate and a reflective frame body can be ensured widely, the 2nd part of a board | substrate and a reflective frame body will be electrically connected easily. Can be suppressed.

  In the light emitting device according to the first aspect, preferably, an insulating layer made of an insulating resin is formed in a bottom region of the stepped portion. If comprised in this way, it can suppress that the 2nd part of a board | substrate and a reflective frame body are electrically connected more easily.

  In the light emitting device according to the first aspect, preferably, the second portion of the substrate is smaller in thickness than the first portion. If comprised in this way, in the state in which the bottom face of the 1st part in a board | substrate and the bottom face of a 2nd part become the same surface, the thickness of the contact bonding layer interposed between a 2nd part and a reflective frame body is set to 1st. The thickness can be made larger than the thickness of the adhesive layer interposed between the portion and the reflective frame. For this reason, it is possible to further easily prevent the second portion of the substrate and the reflection frame body from being electrically connected by insulating and fixing at least the second portion of the substrate to the reflection frame body with an insulating adhesive. can do.

  In the light emitting device according to the first aspect, preferably, the reflection frame body is provided with a notch in a predetermined portion of a corner portion constituted by the side end surface and the bottom surface, and the notch is covered with a resin member. It has been broken. If comprised in this way, since the resin member which covers a notch part can suppress that a metal burr | flash (cut | disconnecting burr | flash) arises along the edge of the side end surface of a reflective frame, also by this, board | substrate (especially , The second portion) and the reflection frame body can be suppressed from being electrically connected.

  In the light emitting device according to the first aspect, preferably, the planar area of the second part is smaller than the planar area of the first part. If comprised in this way, the 2nd part of a board | substrate and a reflective frame body can be made hard to be electrically connected. In addition, by comprising as mentioned above, since the plane area of the 1st part to which a light emitting element is fixed can be enlarged, the thermal radiation amount from a 1st part can be increased. Thereby, the thermal radiation characteristic of a light-emitting device can be improved more.

  In the light emitting device according to the first aspect, preferably, the substrate is made of copper or a copper alloy. If comprised in this way, since heat dissipation can still be improved easily from a board | substrate, the heat dissipation characteristic of a light-emitting device can be improved easily.

  In the light emitting device according to the first aspect, it is preferable that the reflection frame body is configured so that the opening width widens upward.

  In the light emitting device according to the first aspect, the light emitting element can be a light emitting diode element.

  A method for manufacturing a light emitting device according to a second aspect of the present invention includes a step of forming a metal lead frame including a plurality of substrates, and a step of forming a reflection frame assembly including a plurality of reflection frames using a metal material. A step of fixing the reflection frame assembly on one main surface of the metal lead frame with an adhesive, a step of mounting a light emitting element in a region inside the reflection frame body in the metal lead frame, and a metal A step of sticking a sheet member on the other main surface of the lead frame, and a step of sealing the light emitting element with a sealing body made of a sealing material by filling the inner region of the reflective frame with a sealing material And a step of dicing the metal lead frame and the reflection frame assembly fixed to each other by dicing. Then, the step of forming the metal lead frame includes a step of configuring the substrate portion to have a first portion to which the light emitting element is fixed and a second portion spaced from the first portion by a predetermined distance, Forming the second portion so that the second portion and the other second portion adjacent to each other are arranged at a predetermined distance from each other, and the step of dividing into pieces by dicing is a second adjacent to each other. Dicing the region between the portions.

  In the method for manufacturing a light emitting device according to the second aspect, as described above, by using a metal lead frame including a plurality of substrates and a reflective frame assembly composed of a heat dissipation material, light emission having excellent heat dissipation characteristics. The device can be manufactured. In the method for manufacturing the light emitting device according to the second aspect, the second portion of the metal lead frame is formed such that one second portion and the other adjacent second portion are arranged at a predetermined distance from each other. In addition, by dicing the region between the second parts adjacent to each other, even if a metal burr (cut burr) is generated in the reflection frame when the aggregate is separated into pieces by dicing, this metal burr Can be prevented from coming into contact with the second portion of the substrate. For this reason, since it can suppress that the reflective frame body which consists of metal materials, and the 2nd part of a board | substrate are electrically connected, the cathode and anode of a light emitting element are electrically connected via a reflective frame body. Short circuit can be suppressed. Accordingly, it is possible to suppress a decrease in reliability due to an electrical short circuit between the cathode and the anode of the light emitting element. In the method for manufacturing the light emitting device according to the second aspect, as described above, the cathode and the anode of the light emitting element can be prevented from being electrically short-circuited (short-circuited) via the reflective frame, Manufacturing yield can be improved.

  Further, in the method for manufacturing a light emitting device according to the second aspect, by using a metal lead frame including a plurality of substrates, unlike a printed circuit board including an insulating material such as glass epoxy or LCP as a base material, the substrate includes the above-described substrate. Does not contain insulation. For this reason, even when the light from a light emitting element is irradiated to a board | substrate for a long time, it can suppress that a board | substrate surface discolors (light degradation). Thereby, even when it uses for a long time, it can suppress that the light quantity of the light taken out from a light-emitting device falls. Therefore, it is possible to manufacture a light-emitting device that can suppress a decrease in light-emitting characteristics.

  Furthermore, in the method for manufacturing a light emitting device according to the second aspect, after a sheet member is pasted on the other main surface of the metal lead frame, a sealing material for sealing the light emitting element is filled in an area inside the reflective frame By doing so, it is possible to prevent the sealing material from leaking from the gap portion of the metal lead frame with the sheet member. Thereby, a light-emitting device can be easily manufactured using a metal lead frame. In addition, it is possible to make the metal lead frame difficult to deform by fixing the metal lead frame and the reflection frame assembly in advance before carrying out the step of mounting the light emitting element, etc. The frame can be stably flowed by an automatic transfer machine or the like, and the process of mounting the light emitting element can be performed by an automated line.

  In the method of manufacturing the light emitting device according to the second aspect, preferably, the step of fixing the reflective frame assembly to the metal lead frame insulates and fixes at least the second portion of the metal lead frame and the reflective frame assembly. Process. If comprised in this way, the fall of reliability can be suppressed easily, improving a thermal radiation characteristic.

  In the method for manufacturing a light emitting device according to the second aspect, preferably, the step of forming the reflection frame assembly includes the step of forming a recess in a predetermined region of the surface of the reflection frame assembly that faces the metal lead frame. And forming an insulating layer made of an insulating resin in the bottom region of the recess. If comprised in this way, since it can suppress that the 2nd part of a board | substrate and a reflective frame body are electrically connected easily, the fall of reliability is suppressed more, improving a thermal radiation characteristic. can do.

  In the method for manufacturing a light emitting device according to the second aspect, preferably, the step of forming the reflection frame assembly includes a step of forming the reflection frame assembly from aluminum or an aluminum alloy, and a step of forming the reflection frame assembly. And a step of subjecting the surface to alumite treatment. If comprised in this way, since an insulating film is formed on the surface of a reflective frame (reflective frame aggregate), even when the reflective frame is fixed on a substrate made of a metal plate, An electrical short circuit with the second portion can be suppressed. Thereby, it is possible to easily suppress a decrease in reliability while improving the heat dissipation characteristics.

  The method for manufacturing a light emitting device according to the second aspect preferably further includes a sheet member removing step of removing the sheet member after forming the sealing body. If comprised in this way, it can suppress that a sealing material leaks from the clearance gap part of a metal lead frame easily.

  In this case, the sheet member removing step may be performed prior to the step of separating the aggregate.

  As described above, according to the present invention, it is possible to suppress a decrease in reliability while improving heat dissipation characteristics, and a light emitting device capable of suppressing a decrease in light emission characteristics, and a method for manufacturing the same. Can be easily obtained.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the following embodiments, a case where the present invention is applied to a surface-mounting LED (Light Emitting Diode) which is an example of a light emitting device will be described.

  FIG. 1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. FIG. 2 is a plan view of a surface-mounted LED according to an embodiment of the present invention as viewed from above. 3 is a cross-sectional view taken along line AA in FIG. 4 to 9 are views for explaining the structure of a surface-mounted LED according to an embodiment of the present invention. First, the structure of a surface-mounted LED 100 according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the surface-mounted LED 100 according to an embodiment is fixed to a substrate 1 (see FIG. 1), a reflective frame 10 fixed on the substrate 1, and a predetermined region on the substrate 1. The light-emitting diode element (LED element) 20 and a translucent member 30 that fills the inside of the reflection frame 10 and seals the LED element 20 are provided. The LED element 20 is an example of the “light emitting element” in the present invention, and the translucent member 30 is an example of the “sealing body” in the present invention.

  In the surface-mounted LED 100 according to the embodiment, the substrate 1 is made of a metal plate having a thickness of about 0.15 mm. As shown in FIGS. 3 and 4, the substrate 1 includes a first portion 2 on which the LED element 20 is mounted and a second portion 3 separated from the first portion 2. The substrate 1 is formed by cutting a predetermined portion of the metal lead frame. In addition, the metal plate which comprises the board | substrate 1 is comprised from the copper or copper alloy (for example, brass etc.) excellent in the thermal radiation characteristic (thermal conductivity). Further, as shown in FIG. 5, the substrate 1 has a substantially rectangular shape in plan view, and the first portion 2 of the substrate 1 is arranged on one end side in the longitudinal direction (X direction). On the other hand, the second portion 3 of the substrate 1 is disposed on the other end side in the longitudinal direction (X direction).

  Here, in this embodiment, the 1st part 2 and the 2nd part 3 which comprise the board | substrate 1 are each comprised so that it may function as an electrode for electrically feeding the LED element 20 from the external circuit which is not shown in figure. Specifically, as shown in FIGS. 2 to 4, the first portion 2 of the substrate 1 is configured to function as a cathode electrode, and the second portion 3 is configured to function as an anode electrode. It is configured. Then, as shown in FIG. 5, in order to prevent the first part 2 and the second part 3 from being electrically short-circuited, the first part 2 and the second part 3 are separated from each other by a predetermined distance d1. Is arranged. For this reason, a gap portion 4 is formed between the first portion 2 and the second portion 3.

  In the present embodiment, the second portion 3 of the substrate 1 is configured to have a smaller planar area than the first portion 2 of the substrate 1. The second portion 3 of the substrate 1 is configured such that the width W2 in the Y direction is smaller than the width W1 in the Y direction of the first portion 2.

  The reflection frame 10 is made of a metal material having excellent heat dissipation characteristics, and is formed in a substantially rectangular shape when viewed in plan, as shown in FIGS. 2 and 6. Specifically, the reflection frame 10 is made of aluminum or an aluminum alloy, and has a length L of about 4.5 mm in the X direction and a width W of about 2 mm in the Y direction. Moreover, the reflective frame 10 has a thickness t (see FIG. 3) of about 0.6 mm. As shown in FIGS. 3, 4, and 7, a cutout portion 12 is formed at a corner portion formed by the bottom surface and the side end surface (the side end surface 11 in the longitudinal direction (X direction)) of the reflection frame 10. The notch 12 is covered with a resin member 16 such as a resist (see FIG. 4).

  In addition, an opening 13 that penetrates in the thickness direction is formed at the center of the reflective frame 10. The inner side surface 13 a of the opening 13 is configured to function as a reflecting surface that reflects the light emitted from the LED element 20. As shown in FIGS. 3 and 4, the opening 13 is configured such that the opening width widens in a tapered shape (radially) upward. As described above, the inner side surface 13a of the opening 13 is configured to efficiently reflect the light emitted from the LED element 20 upward. The inner side surface 13a of the reflective frame 10 is an example of the “inner peripheral surface” and “reflective surface” in the present invention.

  Moreover, in this embodiment, as shown in FIG. 7, the step part 10a is formed in the bottom face (surface facing the board | substrate 1) of the reflective frame body 10. As shown in FIG. Specifically, on the bottom surface of the reflective frame 10, the second region facing (corresponding) with the second portion 3 of the substrate 1 is recessed more than the first region facing (corresponding) with the first portion 2 of the substrate 1. As a result, the step 10 a is formed on the bottom surface of the reflective frame 10. That is, the reflection frame 10 has a stepped portion 10 a in a predetermined region including a region facing the second portion 3 of the substrate 1. The resin member 16 is formed on the step portion 10 a of the reflection frame 10 so as to cover the bottom surface of the step portion 10 a together with the notch portion 12. The resin member 16 is an example of the “insulating layer” in the present invention.

  Further, the surface of the reflective frame 10 including the inner side surface 13a of the opening 13 is anodized, whereby an insulating coating (not shown) having a predetermined thickness is formed on the surface of the reflective frame 10. ) Is formed. The insulating film is also formed on the bottom surface of the reflective frame 10.

  The reflection frame 10 configured as described above is fixed on the substrate 1 via the adhesive layer 40. The adhesive layer 40 is made of a material different from that of a translucent member 30 described later that seals the LED element 20. Specifically, for example, an adhesive composed of a main ingredient made of polyolefin and an epoxy curing agent is used. Thereby, when the reflective frame 10 is fixed on the substrate 1, sufficient adhesive strength and mechanical fixing strength can be obtained. The reflective frame 10 is fixed so as to be in thermal contact with the substrate 1 (indirectly).

  In the present embodiment, the reflective frame 10 and the first portion 2 of the substrate 1 are fixed to each other via the conductive adhesive layer 41 (40), while the reflective frame 10 and the second portion of the substrate 1 are used. The portion 3 is fixed to each other via an insulating adhesive layer 42 (40).

  Further, since the width W1 (see FIG. 5) of the first portion 2 of the substrate 1 is configured to be substantially the same as the width W (see FIG. 6) of the reflective frame 10, FIG. 1 and FIG. As shown in FIG. 3, in a state where the reflection frame 10 is fixed on the substrate 1, the side end face 14 of the reflection frame 10 in the short direction (Y direction) and the first portion 2 in the short direction (Y direction). It is comprised so that the side end surface 2a may become the same surface. On the other hand, since the width W2 (see FIG. 5) of the second portion 3 of the substrate 1 is smaller than the width W1 of the first portion 2, it is smaller than the width W (see FIG. 6) of the reflective frame 10. small. For this reason, as shown in FIGS. 4 and 8, the side end surface 3a of the second portion 3 in the short direction (Y direction) is viewed in a plan view with the reflecting frame 10 fixed on the substrate 1. Thus, the reflection frame body 10 is configured so as to be located on the inner side of the side end face 14. The side end surface of the substrate 1 in the longitudinal direction (X direction) is also located on the inner side of the side end surface 11 of the reflection frame body 14 in a plan view except for a part thereof.

  As shown in FIGS. 2, 4, and 5, the third region 5 exposed to the opening 13 of the reflective frame 10 when the reflective frame 10 is fixed to the upper surface of the substrate 1 and A fourth region 6 in which an adhesive layer 40 for fixing the reflective frame 10 is formed is provided. As shown in FIG. 6, the third region 5 is disposed at the center of the substrate 1, and the fourth region 6 is disposed outside the third region 5. The third region 5 is provided in each of the first portion 2 and the second portion 3 of the substrate 1, and the fourth region 6 is also formed of the first portion 2 and the second portion 3 of the substrate 1. It is provided for each.

  4 and 5, the portion where the opening edge 15 (see FIG. 4) on the bottom surface side of the reflection frame 10 is located when the reflection frame 10 is fixed on the substrate 1 is a two-dot chain line R. It is shown in That is, the region surrounded by the two-dot chain line R on the upper surface of the substrate 1 corresponds to the third region 5 exposed by the opening 13 of the reflection frame 10, and the region outside the two-dot chain line R (the hatched line in FIG. 5). Part) corresponds to the fourth region 6 where the adhesive layer 40 is formed.

  The LED elements 20 have a function of emitting blue light, and a plurality of LED elements 20 are mounted on the third region 5 of the substrate 1. Specifically, as shown in FIGS. 1 to 3, two LED elements 20 are respectively fixed by adhesives 43 on the third region 5 in the first portion 2 of the substrate 1. That is, the LED elements 20 are each fixed on the first portion 2 of the substrate 1 so as to be located in the region inside the reflection frame 10. In addition, one electrode portion (not shown) of the LED element 20 and the second portion 3 of the substrate 1 are electrically connected to each other via a bonding wire 44 and the other electrode portion of the LED element 20. (Not shown) and the first portion 2 of the substrate 1 are electrically connected to each other via a bonding wire 45. More specifically, as shown in FIGS. 2 and 4, one end of the bonding wire 44 is electrically connected to one electrode portion of the LED element 20, and the other end is the first end. The second portion 3 is electrically connected to the third region 5. The bonding wire 45 has one end electrically connected to one electrode portion of the LED element 20 and the other end electrically connected to the third region 5 of the first portion 2. ing. The two LED elements 20 are connected in parallel. The bonding wires 44 and 45 are made of fine metal wires such as Au, Ag, and Al.

  The translucent member 30 is made of a transparent resin material (sealing material) such as an epoxy resin or a silicone resin, and the LED element 20 and the bonding wires 44 and 45 are sealed in the opening 13 of the reflective frame 10. It is provided to stop. The translucent member 30 has a function of suppressing the LED element 20 and the bonding wires 44 and 45 from coming into contact with air or moisture by sealing the LED element 20 and the bonding wires 44 and 45. Yes. The translucent member 30 is formed by filling the transparent resin material into the opening 13 of the reflection frame 10 and then curing the transparent resin material. Since the transparent resin material before curing has fluidity, the transparent resin material filled in the opening 13 is also filled in the gap portion 4 of the substrate 1. Therefore, the translucent member 30 is formed not only in the opening 13 of the reflective frame 10 but also in a predetermined portion of the substrate 1 including the gap portion 4 of the substrate 1 as shown in FIG. .

  Further, as shown in FIG. 9, the translucent member 30 contains particles of a phosphor 31 that converts the wavelength of the blue light emitted from the LED element 20. Thereby, it is comprised so that the emitted light from surface mount type LED100 may turn into white light. Further, the phosphor 31 is settled in the translucent member 30 and is concentrated in a predetermined region including the gap portion 4 between the first portion 2 and the second portion 3 of the substrate 1. That is, the gap portion 4 between the first portion 2 and the second portion 3 of the substrate 1 is filled with a large number of particles of the phosphor 31. For this reason, the light that is about to leak from the gap portion 4 between the first portion 2 and the second portion 3 is reflected by the particles of the phosphor 31 filled in the gap portion 4, so that light leakage from the gap portion 4 is prevented. Effectively suppressed. Note that, by reducing the distance d1 (see FIG. 5) between the first portion 2 and the second portion 3, the light leakage suppression effect from the gap portion 4 is improved. It becomes easy for the 1 part 2 and the 2nd part 3 to electrically short-circuit. That is, it is difficult to ensure insulation between the first portion 2 and the second portion 3. For this reason, the distance d1 between the first portion 2 and the second portion 3 (the distance d1 of the gap portion 4) is preferably about 0.1 mm to 0.3 mm.

  In the surface mounted LED 100 according to the embodiment configured as described above, bonding is performed by applying a voltage between the first portion 2 and the second portion 3 of the substrate 1 as shown in FIGS. A current flows through the LED elements 20 through the wires 44 and 45, and each LED element 20 emits blue light. The blue light from the LED element 20 is wavelength-converted by the phosphor 31 in the translucent member 30 and is emitted to the outside as white light. On the other hand, the heat generated by the light emission of the LED element 20 is dissipated from the first portion 2 of the substrate 1 and is also dissipated from the reflective frame 10 that is in thermal contact with the conductive adhesive layer 41 (40). The As described above, the surface-mounted LED 100 according to the embodiment is configured to be able to effectively dissipate the heat generated in the LED element 20, thereby suppressing a decrease in luminous efficiency due to a temperature rise of the LED element 20. In addition, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED 100 are obtained.

  In the present embodiment, as described above, the substrate 1 is constituted by the metal plate including the first portion 2 and the second portion 3 separated from the first portion 2, and at least is in thermal contact with the first portion 2. As described above, the reflective frame 10 is mounted on the substrate 1 and the LED element 20 is fixed on the first portion 2 of the substrate 1, so that the heat generated by the light emission of the LED element 20 is dissipated from the first portion 2. In addition, it is possible to dissipate heat from the reflection frame 10 via the first portion 2. Here, since the 1st part 2 is comprised from the metal plate excellent in heat conductivity as mentioned above, while being able to thermally radiate the heat from LED element 20 from the 1st part 2 effectively, The heat can be effectively transferred to the reflection frame 10. Moreover, since the reflective frame 10 is also comprised from the metal material excellent in heat conductivity, the heat | fever from the LED element 20 transmitted via the 1st part 2 can be effectively radiated from the reflective frame 10. Can do. Thereby, it is possible to effectively dissipate the heat generated by the LED element 20 emitting light, so that the heat dissipating characteristics of the surface-mounted LED 100 can be improved. Further, by improving the heat dissipation characteristics, even if the LED element 20 generates heat due to light emission, the temperature of the LED element 20 can be kept low. As a result, it is possible to suppress the inconvenience that the light emission characteristics are deteriorated due to the temperature rise of the LED element 20, so that good light emission characteristics can be obtained.

  In the present embodiment, the substrate 1 is configured so that the side end surface 3a of the second portion 3 is positioned inside the side end surface 14 of the reflection frame 10 in a plan view, thereby making it possible in a manufacturing process described later. Even if a metal burr (cutting burr) is generated on the side end surface 14 of the reflection frame 10 due to the dicing process, it is possible to prevent the metal burr and the second portion 3 of the substrate 1 from contacting each other. For this reason, since it can suppress that the reflective frame 10 which consists of metal materials, and the 2nd part 3 of the board | substrate 1 can be suppressed, the 1st part 2 of the board | substrate 1 via the reflective frame 10 can be suppressed. And the second portion 3 can be prevented from being electrically short-circuited. That is, it is possible to suppress an electrical short circuit (short circuit) between the cathode and the anode of the LED element 20. Accordingly, it is possible to suppress a decrease in reliability due to an electrical short circuit between the cathode and the anode of the LED element 20.

  Furthermore, in this embodiment, since the board | substrate 1 is comprised from the metal plate, unlike the printed circuit board etc. which contain insulating materials, such as glass epoxy and LCP, as a base material, the board | substrate 1 does not contain the said insulating material. For this reason, even when the light from the LED element 20 is irradiated to the board | substrate 1 for a long time, it can suppress that a board | substrate surface discolors (light degradation). Thereby, even when used for a long time, it is possible to suppress a decrease in the amount of light extracted from the surface-mounted LED 100, and thus it is possible to suppress a decrease in light emission characteristics.

  Further, in a printed circuit board including an insulating material such as glass epoxy or LCP as a base material, the insulating material is likely to contain moisture. For example, when mounting the surface-mounted LED 100 on a circuit board or the like, water vapor is generated. There may be inconveniences that cause failure. On the other hand, in the surface-mounted LED 100 according to one embodiment, since the substrate 1 does not contain an insulating material, it is possible to avoid the occurrence of the inconvenience as described above.

  In the present embodiment, the reflective frame 10 and the substrate 1 are sufficiently bonded by fixing the reflective frame 10 on the substrate 1 via the adhesive layer 40 made of a material different from the translucent member 30. Can be fixed with a fixed strength. On the other hand, since the material according to the optical characteristics of the surface-mounted LED 100 can be selected for the translucent member 30, the reflective frame 10 and the substrate can be used without affecting the optical characteristics of the surface-mounted LED 100. 1 can be fixed with sufficient strength.

  Moreover, in this embodiment, the heat from the LED element 20 can be effectively radiated from the reflective frame 10 by configuring the reflective frame 10 from aluminum or an aluminum alloy. Thereby, the heat dissipation characteristics of the surface-mounted LED 100 can be easily improved. Moreover, since an insulating film is formed on the surface of the reflective frame 10 by performing anodizing on the reflective frame 10, even when the reflective frame 10 made of a metal material is fixed on the substrate 1 made of a metal plate. The first portion 2 and the second portion 3 of the substrate 1 can be prevented from being electrically short-circuited through the reflection frame 10. In addition, the reflectance of the reflective frame body 10 can also be improved by performing an alumite process as described above.

  Moreover, in this embodiment, since the step part 10a is formed on the bottom surface of the reflection frame body 10, the insulation distance between the second portion 3 of the substrate 1 and the reflection frame body 10 can be secured widely, so that The second portion 3 of the substrate 1 and the reflection frame 10 can be suppressed from being electrically connected. Further, by forming the resin member 16 made of resist (insulating resin) or the like in the bottom surface region of the stepped portion 10a, the second portion 3 of the substrate 1 and the reflection frame body 10 are more easily electrically connected. Can be suppressed.

  In the present embodiment, a notch 12 is provided at a corner formed by the bottom surface of the reflecting frame 10 and a side end surface (side end surface 11 in the longitudinal direction (X direction)), and the notch 12 is registered as a resist. By covering with the resin member 16 such as a metal burr (cutting burr) along the edge of the side end surface 11 of the reflective frame body 10 can be suppressed in dicing processing in a manufacturing process to be described later. As a result, it is possible to suppress the electrical connection between the substrate 1 (particularly, the second portion 3) and the reflection frame 10.

  In the present embodiment, the second portion 3 of the substrate 1 and the reflection frame 10 are electrically connected by configuring the second portion 3 so that the plane area of the second portion 3 is smaller than the plane area of the first portion 2. Can be difficult. In addition, since the planar area of the 1st part 2 to which the LED element 20 is fixed can be enlarged by comprising as mentioned above, the heat dissipation from the 1st part 2 can be increased. Thereby, the heat dissipation characteristic of the surface-mounted LED 100 can be further improved.

  In the configuration of the surface-mounted LED 100 according to the above-described embodiment, since the reflective frame 10 is made of aluminum or an aluminum alloy and the substrate 1 is made of copper or a copper alloy, the reflective frame 10 The difference between the coefficient of thermal expansion and the coefficient of thermal expansion of the substrate 1 can be reduced. For this reason, even when the temperature of the reflective frame 10 and the substrate 1 is increased by the heat from the LED element 20, the reflection is caused by the difference between the thermal expansion coefficient of the reflective frame 10 and the thermal expansion coefficient of the substrate 1. It is possible to suppress the inconvenience that the fixation between the frame body 10 and the substrate 1 is released. Also by this, the fall of reliability can be suppressed.

  Further, the phosphor 31 is contained in the translucent member 30, and the phosphor 31 is allowed to settle in the translucent member 30 to form a predetermined region including the gap portion 4 between the first portion 2 and the second portion 3. By making it exist in a concentrated manner, the light from the LED element 20 can be reflected by the phosphor 31 in the gap portion 4, so that light leakage from the gap portion 4 can be effectively suppressed.

  FIGS. 10-19 is a figure for demonstrating the manufacturing method of surface mount type LED by one Embodiment of this invention. Next, with reference to FIG. 1, FIG. 4, and FIGS. 8-19, the manufacturing method of the surface mount type LED 100 by one Embodiment of this invention is demonstrated.

  First, a metal lead frame 50 as shown in FIG. 10 is formed by subjecting a copper plate or copper alloy plate having a thickness of about 0.1 mm to press working (punching) or etching. As shown in FIGS. 10 and 11, the metal lead frame 50 is formed so as to include a plurality of substrates 1, and each of the plurality of substrates 1 includes a first portion 2 and the first portion 2. And the second portion 3 arranged at a predetermined distance d1 (see FIG. 11). Here, the distance d1 between the first portion 2 and the second portion 3 is preferably set to about 0.1 mm to 0.3 mm. The second portion 3 of the substrate 1 is formed such that adjacent second portions are arranged with a predetermined distance d2 (see FIG. 10) therebetween. 10 and 11, the portion where the opening edge 15 (see FIG. 4) on the bottom surface side of the reflective frame 10 is located is indicated by a two-dot chain line R.

  Next, as shown in FIG. 12, a plurality of openings 13 serving as reflective surfaces are formed by pressing a plate member made of aluminum or an aluminum alloy. Thereby, the reflection frame assembly 60 having a thickness of about 0.6 mm and including the plurality of reflection frames 10 is formed. The reflection frame 10 included in the reflection frame assembly 60 is formed so that each of the reflection frames 10 has a substantially rectangular shape when viewed in plan when separated by the dicing line P in a later step. To do. In addition, a recess 12a extending in the Y direction is formed on the back surface of the reflection frame assembly 60 by pressing, and a stepped portion (recess) 10a (see FIG. 14) is formed in a region facing the second portion 3. To do. Then, an insulating film (not shown) is formed on the entire surface of the reflective frame assembly 60 by subjecting the reflective frame assembly 60 to alumite treatment.

  Subsequently, as shown in FIGS. 13 and 14, the reflection frame assembly 60 is fixed on the metal lead frame 50 via the adhesive layer 40 (see FIG. 14) (by an adhesive). At this time, it fixes so that the dicing line P (P11, P12) (refer FIG. 10) of the metal lead frame 50 and the dicing line P (P21, P22) of the reflective frame assembly 60 may overlap. Further, before fixing the reflection frame assembly 60 on the metal lead frame 50, the resin member 16 is filled in the recess 12 a and the stepped portion 10 a of the reflection frame assembly 60. The first portion 2 of the metal lead frame 50 and the reflection frame assembly 60 are fixed to each other via the conductive adhesive layer 41 (40), and the second portion 3 of the metal lead frame 50 and the reflection frame body. The assembly 60 is fixed to each other via the insulating adhesive layer 42 (40).

  Next, as shown in FIGS. 15 and 16, two LED elements 20 are respectively bonded to the first portion 2 of the metal lead frame 50 exposed by the opening 13 with an adhesive 43 (see FIG. 16). Fix it. And the LED element 20 and the board | substrate part of the metal lead frame 50 are electrically connected by performing wire bonding. Specifically, one electrode portion (not shown) of the LED element 20 and the first portion 2 of the metal lead frame 50 are electrically connected by the bonding wire 45, and the LED element 20 is connected by the bonding wire 44. The other electrode portion (not shown) is electrically connected to the second portion 3 of the metal lead frame 50.

  Then, as shown in FIG. 17, the metal lead frame 50 to which the reflective frame body 10 and the LED element 20 are fixed is attached on the adhesive sheet 70. The pressure-sensitive adhesive sheet 70 has a size equal to or larger than that of the metal lead frame 50 and is attached to the back surface of the metal lead frame 50 so as to cover the gap between the metal lead frames 50. The pressure-sensitive adhesive sheet 70 is an example of the “sheet member” in the present invention.

  Thereafter, as shown in FIG. 18, a transparent resin material (sealing material) made of silicone resin or the like is injected (filled) into the opening 13 of the reflection frame assembly 60. Here, the transparent resin material contains particles of phosphor 31 (see FIG. 9). Then, the injected transparent resin material is cured while the particles of the phosphor 31 are allowed to settle. In order to facilitate the sedimentation of the phosphor 31, it is preferable to use particles having a relatively large particle size of about 10 μm. Moreover, while using the transparent resin material with a comparatively low viscosity before hardening, the phosphor 31 can be effectively settled by ensuring a long time until hardening. Thereby, the translucent member 30 that seals the LED element 20 and the like is formed in the region inside the opening 13. The translucent member 30 is also formed in the gap between the metal lead frames 50. Further, as shown in FIG. 9, the phosphor 31 particles are configured to be concentrated in a predetermined region including the gap portion 4 between the first portion 2 and the second portion 3.

  Subsequently, as shown in FIG. 18 and FIG. 19, the reflecting frame assembly 60 and the metal lead frame 50 are cut (diced) along the dicing line P to divide the assembly into individual pieces. Specifically, the reflection frame assembly 60 and the metal leads are cut to a depth in the middle of the adhesive sheet 70 along the dicing lines P (P11, P21) in the X direction and the dicing lines P (P21, P22) in the Y direction. The frame 50 is cut. Here, as shown in FIG. 11, the dicing line P (P11) in the X direction passes through a region (region within the distance d2) between the adjacent second portions 3. For this reason, when separated into individual pieces by dicing, as shown in FIGS. 4 and 8, the side end surface 3a of the second portion 3 in the short direction (Y direction) is a reflection frame body as seen in a plan view. It is comprised so that it may be located inside the side end surface 14 of ten. Thereby, even if a metal burr | flash generate | occur | produces in the side end surface 14 of the reflective frame 10 (reflective frame assembly 60) by dicing, since a contact with a metal burr | flash and the 2nd part 3 is suppressed, the reflective frame 10 It is suppressed that the 1st part 2 and the 2nd part 3 are electrically short-circuited through. Further, as shown in FIG. 18, the dicing line P (P12, P22) in the Y direction passes through the recess 12a formed in the reflection frame assembly 60. For this reason, since generation | occurrence | production of a metal burr | flash is suppressed by the resin member 16 in the recessed part 12a, the 1st part 2 and the 2nd part 3 are electrically short-circuited resulting from the generation | occurrence | production of a metal burr | flash. Inconvenience is suppressed. Even if the first part 2 and the reflection frame 10 are in contact with each other by the metal burr, there is no problem, and the thermal resistance between the first part 2 and the reflection frame 10 is reduced by the metal burr. Rather preferred.

  Finally, the surface-mounted LED 100 according to the embodiment of the present invention shown in FIG. 1 is obtained by removing the adhesive sheet 70 from the singulated surface-mounted LED 100. Alternatively, after the transparent resin material is cured, the pressure-sensitive adhesive sheet 70 may be removed, and then the metal lead frame 50 may be attached to the pressure-sensitive adhesive sheet 70 again, and singulation may be performed. If comprised in this way, it will become possible to suppress effectively that the adhesive substance of the adhesive sheet 70 remains on the back surface of the substrate 1 of the surface-mounted LED 100.

  In the method for manufacturing the surface-mounted LED 100 according to the present embodiment, since the metal lead frame 50 is used as described above, a process of forming an electrode pattern, a through hole, or the like as in a printed board is not required. Man-hours can be reduced. In addition, the metal lead frame 50 and the reflection frame assembly 60 are fixed in advance before the step of mounting (fixing) the LED element 20 or the like, thereby making it difficult for the metal lead frame 50 to be deformed. Therefore, the metal lead frame 50 can be stably flowed by an automatic transfer machine or the like, and the process of mounting the LED element 20 can be performed by an automated line. As a result, the manufacturing process of the surface-mounted LED 100 can be simplified and applied to mass production.

  Moreover, in this embodiment, after sticking the adhesive sheet 70 on the back surface side of the metal lead frame 50, the transparent resin material for sealing the LED element 20 is filled (injected) into the region inside the opening 13. The adhesive sheet 70 can prevent the transparent resin material from leaking from the gap portion of the metal lead frame 50. Thereby, the surface-mounted LED 100 can be easily manufactured using the metal lead frame 50. In addition, by configuring the surface-mounted LED 100 using the metal lead frame 50, the structure of the surface-mounted LED 100 can be simplified.

  In the present embodiment, since the metal lead frame 50 is made of a copper plate or a copper alloy plate, dicing can be easily performed.

  FIG. 20 is a cross-sectional view of a surface-mounted LED according to a modification of one embodiment. FIG. 20 shows a cross section corresponding to FIG. Next, a surface-mounted LED 200 according to a modification of the present invention will be described with reference to FIG.

  In the surface-mounted LED 200 according to this modification, in the configuration of the surface-mounted LED 100 according to the above embodiment, the thickness of the second portion 3 of the substrate 1 is smaller than the thickness of the first portion 2 of the substrate 1 by pressing or the like. It is configured. For this reason, in the state where the bottom surface of the first portion 2 and the bottom surface of the second portion 3 in the substrate 1 are flush with each other, the adhesive layer 40 (insulating adhesion) interposed between the second portion 3 and the reflective frame 10 is used. The thickness of the layer 42) is larger than the thickness of the adhesive layer 40 (conductive adhesive layer 41) interposed between the first portion 2 and the reflective frame 10. Thereby, it is suppressed more that the 2nd part 3 of the board | substrate 1 and the reflective frame 10 are electrically connected.

  Other configurations of the surface-mounted LED 200 according to the modification are the same as those in the above embodiment. The other effects of the modification are the same as those of the above embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, an example in which the present invention is applied to a surface-mounted LED has been described.

  Moreover, although the example which formed the level | step-difference part in the bottom face of the reflective frame body was shown in the said embodiment, this invention is not limited to this, You may make it the structure which does not form a level | step-difference part in the bottom face of a reflective frame body. In addition, also in the surface mount type LED by a modification, it can be set as the structure which does not form a level | step-difference part in the bottom face of a reflective frame like the above. Moreover, in the said modification, it is good also as a structure which ensures insulation by covering the required area | region of the 2nd part of a board | substrate with resin members, such as a resist. Furthermore, in the above-described embodiment, the example using the conductive adhesive and the insulating adhesive has been described. However, only the conductive adhesive or the insulating adhesive may be used.

  Moreover, in the said embodiment, although comprised so that a reflective frame and the 1st part of a board | substrate may be thermally contacted indirectly via a conductive contact bonding layer, this invention is not limited to this, A reflective frame and a board | substrate You may comprise so that the 1st part of this may contact directly. For example, a convex portion may be provided on the bottom surface of the reflective frame, and the reflective frame may be fixed on the substrate such that the convex portion and the first portion of the substrate are in direct contact.

  Moreover, although the example which comprised the reflecting frame body from aluminum or aluminum alloy was shown in the said embodiment, this invention is not restricted to this, You may comprise a reflecting frame body from metal materials other than aluminum or aluminum alloy. . For example, you may comprise a reflective frame body from copper, magnesium, and another metal material.

  Moreover, in the said embodiment, although the example which performed the alumite process (surface treatment) on the surface of the reflective frame body was shown, this invention is not restricted to this, The alumite process (surface treatment) is performed on the surface of the reflective frame body You may make it the structure which is not.

Moreover, although the example which comprised the board | substrate from copper or a copper alloy was shown in the said embodiment, this invention is not restricted to this, You may comprise a board | substrate from materials other than copper or a copper alloy. In consideration of thermal conductivity, thermal expansion coefficient, workability (dicing difficulty, etc.), surface treatment suitability (anodite treatment, etc.), availability, etc., the construction material of the reflective frame and the construction of the substrate The following combinations are preferable for the combination with the material.
・ Reflective frame (aluminum or aluminum alloy + anodized), substrate (copper)
・ Reflective frame (aluminum or aluminum alloy + anodized), substrate (brass)
・ Reflective frame (copper + surface treatment), substrate (copper)
Combinations other than those described above are possible and can be optimized according to the purpose and application.

  Moreover, in the said embodiment, although the example which provided the notch part in the both ends (the edge part of the 1st part side of a board | substrate, and the edge part of the 2nd part side of a board | substrate) of the reflective frame body was shown, this invention shows this Not limited to this, as long as a notch is provided at the end on the second portion side of the substrate, a configuration may be adopted in which the notch is not provided at the end on the first portion side of the substrate.

  Moreover, although the example which used the LED element as an example of a light emitting element was shown in the said embodiment, this invention is not restricted to this, You may use light emitting elements other than an LED element.

  Moreover, although the example which mounted two LED elements on the board | substrate was shown in the said embodiment, this invention is not limited to this, You may mount one or three or more LED elements on a board | substrate.

  Moreover, in the said embodiment, although the example which connected the LED element in parallel was shown, this invention is not restricted to this, You may connect an LED element in series.

  In the above embodiment, an example is shown in which the first portion of the substrate is the cathode electrode and the second portion of the substrate is the anode electrode. However, the present invention is not limited to this, and the cathode electrode, the anode electrode, May be reversed.

  Moreover, in the said embodiment, although the example comprised so that the 1st part of a board | substrate functions also as an electrode was shown, this invention is not restricted to this, The 1st part of a board | substrate does not have a function as an electrode. It can also be configured as follows. For example, the substrate may be configured to include a plurality (two) of the second portions, and one of the second portions may function as a cathode electrode, and the other second portion may function as an anode electrode.

  In the above-described embodiment, for example, a resin material other than the translucent member can be filled in a gap portion of the substrate (metal lead frame) in advance. As this resin material, an insulating adhesive, a resist, or the like can be considered. The resin material is preferably opaque or translucent in order to obtain an effect of suppressing light leakage. Moreover, it is also possible to fill a white resin (for example, a molding resin such as Amodel (registered trademark: polyphthalamide)) instead of the insulating adhesive or the resist.

1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. It is the top view which looked at the surface mount type LED by one Embodiment of this invention from the upper side. It is sectional drawing along the AA line of FIG. It is a disassembled perspective view of the surface mount type LED by one Embodiment of this invention. It is a top view of the board | substrate of surface mount type LED by one Embodiment of this invention. It is a top view of the reflective frame of surface mount type LED by one Embodiment of this invention. It is the perspective view which looked at the reflective frame of surface mount type LED by one Embodiment of this invention from the back surface side (lower side). It is the top view which looked at the surface mount type LED by one Embodiment of this invention from the back surface side (lower side). It is the schematic sectional drawing which expanded and showed some surface mount type LED by one Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is the top view which expanded and showed a part of FIG. It is a top view for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by one Embodiment of this invention. It is sectional drawing of the surface mount type LED by the modification of one Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,401 Substrate 1a Convex part 2,402 First part 2a Side end face 2b One side 3,403 Second part 4, 4a Gap part 5 First area 6 Second area 10, 410 Reflective frame 10a Step part 13 Opening Part 13a Inner side surface (inner peripheral surface, reflective surface)
16 Resin member (insulating layer)
20, 420 LED element (light emitting element)
30, 430 Translucent member (sealed body)
40 Adhesive layer 44, 45, 440 Bonding wire 50 Metal lead frame 60 Reflective frame assembly 70 Adhesive sheet (sheet member)
100, 200 Surface mounted LED (light emitting device)

Claims (17)

A substrate made of a metal plate including a first portion and a second portion separated from the first portion;
A light emitting element fixed on the first portion of the substrate and electrically connected to at least the second portion;
A reflection frame that is made of a metal material and fixed on the substrate, and whose inner peripheral surface is a reflection surface that reflects light from the light emitting element;
The substrate is configured so that a side end surface of the second portion is located inside a side end surface of the reflection frame body in a plan view, and at least the second portion of the substrate is insulative. A light emitting device, wherein the light emitting device is insulated and fixed to the reflection frame by an adhesive. A sealing body for sealing the light emitting element;
The light emitting device according to claim 1, wherein the reflection frame is fixed on the substrate via an adhesive layer made of a material different from that of the sealing body.   The light-emitting device according to claim 1, wherein the reflective frame is made of aluminum or an aluminum alloy, and a surface thereof is anodized.   The surface of the reflective frame that faces the substrate includes a first region corresponding to the first portion of the substrate and a second region corresponding to the second portion of the substrate, and the second region is 4. The light emitting device according to claim 1, wherein a stepped portion is formed on a surface of the reflecting frame that faces the substrate by being recessed from the first region. 5. apparatus.   The light emitting device according to claim 4, wherein an insulating layer made of an insulating resin is formed in a bottom surface region of the stepped portion.   The light emitting device according to claim 1, wherein a thickness of the second portion of the substrate is smaller than that of the first portion. The reflection frame body is provided with a notch at a predetermined portion of a corner formed by a side end surface and a bottom surface,
The light emitting device according to claim 1, wherein the notch is covered with a resin member.   The light emitting device according to claim 1, wherein a planar area of the second part is smaller than a planar area of the first part.   The light emitting device according to any one of claims 1 to 8, wherein the substrate is made of copper or a copper alloy.   The light-emitting device according to claim 1, wherein the reflection frame is configured so that an opening width widens upward.   The light emitting device according to claim 1, wherein the light emitting element is a light emitting diode element. Forming a metal lead frame including a plurality of substrates;
Forming a reflection frame assembly including a plurality of reflection frames using a metal material;
Fixing the reflective frame assembly with an adhesive on one main surface of the metal lead frame; and
Thereafter, a step of mounting a light emitting element on the inner side of the reflective frame in the metal lead frame;
Attaching a sheet member on the other main surface of the metal lead frame;
Sealing the light emitting element with a sealing body made of the sealing material by filling the inner region of the reflective frame with a sealing material;
A step of dicing the metal lead frame and the reflection frame assembly fixed to each other by dicing,
The step of forming the metal lead frame includes a step of forming a substrate portion so as to have a first portion to which the light emitting element is fixed and a second portion spaced apart from the first portion by a predetermined distance. Forming the second part such that the second part and the other second part adjacent to each other are arranged at a predetermined distance from each other.
The method of manufacturing a light-emitting device, wherein the step of dividing into pieces by dicing includes a step of dicing a region between second portions adjacent to each other.   The step of fixing the reflection frame assembly to the metal lead frame includes a step of insulatingly fixing at least a second portion of the metal lead frame and the reflection frame assembly. The manufacturing method of the light-emitting device as described in any one of. The step of forming the reflection frame assembly includes
Forming a recess in a predetermined region of the surface of the reflective frame assembly facing the metal lead frame;
The method for manufacturing a light emitting device according to claim 12, further comprising: forming an insulating layer made of an insulating resin in a bottom region of the recess. The step of forming the reflection frame assembly includes
Forming the reflective frame assembly from aluminum or an aluminum alloy; and
The method for manufacturing a light emitting device according to claim 12, further comprising a step of performing alumite treatment on a surface of the reflection frame aggregate.   The method for manufacturing a light emitting device according to any one of claims 12 to 15, further comprising a sheet member removing step of removing the sheet member after the sealing body is formed.   The method for manufacturing a light emitting device according to claim 16, wherein the sheet member removing step is performed prior to the step of dividing into individual pieces.

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