WO2013084842A1 - Led package and production method for led package - Google Patents

Led package and production method for led package Download PDF

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Publication number
WO2013084842A1
WO2013084842A1 PCT/JP2012/081276 JP2012081276W WO2013084842A1 WO 2013084842 A1 WO2013084842 A1 WO 2013084842A1 JP 2012081276 W JP2012081276 W JP 2012081276W WO 2013084842 A1 WO2013084842 A1 WO 2013084842A1
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WO
WIPO (PCT)
Prior art keywords
led
conductive pattern
led package
insulator
package according
Prior art date
Application number
PCT/JP2012/081276
Other languages
French (fr)
Japanese (ja)
Inventor
加藤　宣和
林　耕司
Original Assignee
Kato Nobukazu
Hayashi Koji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kato Nobukazu, Hayashi Koji filed Critical Kato Nobukazu
Publication of WO2013084842A1 publication Critical patent/WO2013084842A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an LED package on which a plurality of LED (Light Emitting Diode) elements are mounted and a method for manufacturing the LED package.
  • LED Light Emitting Diode
  • LED packages equipped with LED elements are used for backlights of liquid crystal display devices such as television receivers and personal computers.
  • An LED package has a structure in which an LED chip is mounted on an LED package substrate.
  • an LED package is manufactured by an LED chip manufacturer and a backlight manufacturer. That is, an LED chip manufacturer mounts an LED element on a lead frame, covers the periphery of the lead frame with a resin that functions as an edge, arranges a lens on the LED element, and manufactures the LED chip.
  • Manufacturers manufacture LED packages by mounting LED chips on an insulating LED package substrate on which a conductive pattern is formed, and disposing lenses on the LED chips. Note that the structure of the LED chip is disclosed in, for example, Patent Document 1 and the like.
  • the conductive pattern of the LED chip lead frame and the LED package substrate, the resin covering the periphery of the LED chip lead frame, and the insulator of the LED package substrate have the same functions.
  • the substrate has the same functional configuration, and the manufacturing cost has been increased.
  • the LED chip is provided with a lens, and further, a backlight unit.
  • a lens is further provided on the LED package.
  • the lens is arranged on the LED package substrate using the alignment hole formed on the LED package substrate.
  • the alignment formed on the LED package substrate is used. Since the accuracy of the formation position of the hole for use is low, it takes time to adjust the arrangement position of the lens, and the manufacturing cost is increased.
  • the LED element since the LED element generates heat during light emission, it is necessary to efficiently dissipate heat.
  • the LED package substrate of the conventional LED package has a large thermal resistance, and thus it is difficult to efficiently dissipate heat. .
  • An object of the present invention is to provide an LED package and a manufacturing method of the LED package with reduced manufacturing costs.
  • An LED package on which a plurality of LED elements are mounted which is formed by pressing a metal plate, a mounting portion on which each of the plurality of LED elements is mounted, and a contact portion that contacts each of the plurality of LED elements
  • an insulator having a holding part that is mounted around each of the plurality of LED elements and holds the conductive pattern, and the conductive pattern is divided after the insulator is mounted It further has a parting part.
  • the LED package manufacturing method of the present invention is an LED package manufacturing method in which a plurality of LED elements are mounted, each of the plurality of LED elements being mounted by pressing a metal plate, A press working step for forming a conductive pattern having a contact portion in contact with each of the plurality of LED elements, and a division portion to be divided, and a holding portion for holding the conductive pattern around each of the plurality of LED elements A mounting step of mounting an insulator having a splitting step, a splitting step of splitting the splitting portion, and an LED element mounting step of mounting each of the plurality of LED elements on each of the mounting portions.
  • a thin metal plate for forming a conductive pattern is prepared.
  • the thin metal plate has a predetermined width and a shape extending in the arrangement direction of the LED elements so that a plurality of LED elements can be mounted in a row.
  • a copper alloy such as C5210 or an alloy such as Fe—Ni or Cu—Ni—Sn is used.
  • the conductive pattern 10 having a three-dimensional shape is formed by pressing a metal thin plate (pressing process).
  • pressing the metal thin plate the same shape is repeatedly formed on the metal thin plate with a mold while feeding the metal thin plate in the longitudinal direction.
  • the conductive pattern 10 is processed into a shape that can be pressed.
  • FIG. 1 is a perspective view of a conductive pattern 10 formed by pressing.
  • the conductive pattern 10 includes a mounting portion 11 on which each of the plurality of LED elements 30 (see FIG. 7) is to be mounted, a contact portion 12 on which each of the plurality of LED elements 30 is to contact, and an insulator 20 (see FIG. 4). 5), a plurality of dividing portions 13 that are to be divided after being mounted, and an auxiliary portion 15 that is connected by the dividing portions 13 and used for feeding the metal thin plate in the longitudinal direction during press working.
  • the mounting portion 11 also serves as a contact portion that comes into contact with the LED element 30 and a holding portion that holds an insulator 20 described later.
  • the mounting portion 11 serves as a base-side conductive portion (anode electrode portion), and the contact portion 12 serves as a terminal-side conductive portion (cathode electrode portion).
  • FIG. 2 is an enlarged perspective view of the mounting portion 11, the contact portion 12, and the dividing portion 13 of the conductive pattern 10 formed by pressing, as viewed from the front side
  • FIG. 3 is the mounting portion 11, the contact portion of the conductive pattern 10. It is the expansion perspective view which looked at 12 and the parting part 13 from the back surface side.
  • the mounting portion 11 and the contact portion 12 of the conductive pattern 10 formed by pressing are divided.
  • four L-shaped heat transfer portions 14 protruding from the back surface side of the mounting portion 11 are formed around the mounting portion 11.
  • the heat transfer section 14 is formed in an L shape, the heat generated in the LED element 30 mounted on the mounting section 11 is transferred to the heat radiating member such as the back chassis as an elastic body. It functions, the tip part of heat transfer part 14 can be made to contact heat dissipation members, such as a back chassis, reliably, and reliable and efficient heat dissipation can be performed.
  • the insulator 20 is mounted at a position covering the mounting portion 11, the contact portion 12, and the dividing portion 13 of the conductive pattern 10 formed by press working (mounting process).
  • the insulator 20 insulates between the conductive patterns 10 and between the conductive pattern 10 and another metal such as a back chassis.
  • the insulator 20 is mounted by three-dimensionally molding a white resin that functions as the insulator 20 on the conductive pattern 10.
  • the white resin for example, an epoxy resin or a silicone resin containing silica and titanium oxide is used.
  • the insulator 20 has a rectangular flat plate shape and holds the conductive pattern 10.
  • the insulator 20 is formed with a cylindrical opening 21 for exposing the mounting portion 11 and the contact portion 12, and further four rectangular openings 22 for exposing the dividing portion 13. . Therefore, when the LED element 30 is mounted on the mounting portion 11, the periphery of the LED element 30 is covered with the insulator 20.
  • the insulator 20 is formed of white resin, the inner wall surface of the cylindrical opening 21 functions as a reflector 21a (see FIGS. 6 and 7), and emits light emitted from the LED element 30. The light is reflected on the direction side, that is, on the upper side of the LED element 30.
  • an opening 23 is formed at a position corresponding to the opening 22 on the back side of the insulator 20, and a rectangular opening 24 that exposes the heat transfer section 14 is further formed. Further, positioning portions 25 used for positioning the completed LED package 50 (see FIGS. 9 and 10) are formed at the four corners on the back side of the insulator 20.
  • the dividing portion 13 connected to the auxiliary portion 15 is divided (a dividing step). Thereby, the unnecessary auxiliary
  • the LED element 30 is placed on the mounting portion 11 of each conductive pattern segment and fixed by die bonding (LED element mounting step).
  • the LED element 30 mounted on the mounting unit 11 is an LED element selected from an LED element group prepared in advance using an LED selection device (not shown) (LED element selection step).
  • LED element selection step As a specific procedure of the LED element selection process, first, the brightness, color tone, and the like of each LED element included in the LED element group are measured by the LED selection apparatus. Next, based on the measurement result, LED elements having brightness, color tone, etc. suitable for use as a backlight of a television receiver or the like are selected as LED elements 30.
  • the anode electrode of the LED element 30 is electrically connected to the conductive pattern divided piece mounting portion 11 by wire bonding, and the cathode electrode of the LED element 30 is electrically connected to the contact portion 12 of the adjacent conductive pattern divided piece by wire bonding. Connect. Thereby, each conductive pattern division piece is electrically connected via the LED element 30.
  • a phosphor and a transparent resin are prepared, and a phosphor resin is prepared by mixing the phosphor and the transparent resin at a predetermined mixing ratio.
  • the mixing ratio is determined in consideration of the characteristics of the LED element 30.
  • an epoxy resin, a modified epoxy resin, a silicone resin, an acrylic resin, a polycarbonate resin, a polyphthalamide resin, or the like can be used as the transparent resin.
  • a resin obtained by mixing two or more of these resins may be used.
  • a primer solution for easily applying the fluorescent resin to the LED elements 30 is applied to each LED element 30.
  • a predetermined amount of fluorescent resin is applied and cured in the openings 21 on the respective LED elements 30 (fluorescent resin application step).
  • the opening 22 formed in the insulator 20 is used as an alignment hole, the alignment protrusion of the lens 40 is fitted into the opening 22, and the lens 40 is attached to the LED element 30. It arrange
  • FIG. 9 is a perspective view of the completed LED package 50 viewed from the front surface side
  • FIG. 10 is a perspective view of the LED package 50 viewed from the back surface side.
  • the LED package 50 has a plurality of LED elements 30 mounted in a row. Accordingly, the LED package 50 can be used as a backlight as it is by arranging it on the back side or the back side end of a liquid crystal display device of a television receiver or a personal computer, for example.
  • the LED package according to this embodiment can reduce the manufacturing cost. That is, when the conventional LED chip is used as a backlight of a television receiver or the like, the LED chip is mounted on an LED package substrate, and the LED chip and the LED package substrate are each made of a conductor or an insulator. Therefore, the LED chip and the LED package substrate are provided with the same functional configuration redundantly, and the manufacturing cost is increased, but the LED package according to this embodiment is redundant. Since there is no configuration, the manufacturing cost can be reduced. Further, since the conductive pattern is manufactured by pressing a metal thin plate, the manufacturing cost can be further reduced.
  • the fluorescent resin by directly applying the fluorescent resin to the LED elements 30 selected using the LED sorting device, it is possible to suppress the irregular reflection of the LED light due to the phosphor contained in the fluorescent resin, and the LED package as a backlight. When used, LED light can be emitted without unevenness.
  • the LED package manufacturing method in a conventional LED chip manufacturer, an LED element is mounted on a lead frame, and the periphery of the lead frame is covered with a resin that functions as an edge, The LED chip is manufactured by disposing the lens on the substrate, and then the backlight manufacturer manufactures the LED package by mounting the LED chip on the insulating LED package substrate on which the conductive pattern is formed. When used, a lens was further arranged on the LED chip.
  • the LED package that can be used as it is as a backlight can be manufactured as a series of steps. The process can be reduced and the manufacturing cost of the LED package can be reduced. Kill.
  • the opening 22 of the insulator 20 is used as an alignment hole for the lens 40.
  • a large lens 42 as shown in FIG. 11B, the hole 16 formed in the auxiliary portion 15 of the conductive pattern 10 shown in FIG. 11B is used as an alignment hole, and as shown in FIG.
  • the alignment protrusion 43 is fitted into the hole 16, and the large lens 42 is disposed on the LED element 30 that is the light emitting direction side of the LED element 30.
  • the LED package 60 shown in FIG. 13 in which the large lens 42 is arranged on the light emitting direction side of the LED element 30 is completed.
  • the reflector part 21a is formed in the inner wall of the opening part 21 of the insulator 20
  • the light emission of the LED element 30 is obtained by processing the conductive pattern 10 into a three-dimensional shape in the pressing process. You may make it form the reflector part which reflects the light inject
  • the heat transfer section 14 is formed in an L shape so that the heat transfer section 14 functions as an elastic body.
  • the heat transfer section 14 protrudes from the back surface side of the mounting section 11 by pressing. You may make it equip the front-end
  • the LED element 30 is mounted on the mounting portion 11, the anode electrode of the LED element 30 is wire-bonded to the mounting portion 11, and the cathode electrode is wire-bonded to the contact portion 12 of the adjacent conductive pattern segment.
  • the LED element 30 is mounted on the contact portion 12, and the anode electrode of the LED element 30 is wire-bonded to the contact portion 12, and the cathode electrode is wire-bonded to the mounting portion 11 of the adjacent conductive pattern segment. Good.
  • the reflector portion 21a has a cylindrical shape formed so as to surround the LED element 30 from the periphery, but is disposed so as to surround the LED element from the periphery, and is separated from the LED element 30. It may have a conical shape that expands according to the above.
  • the insulator 20 is formed of white resin, but thermoplastic resin such as LCP (liquid crystal polymer), PBT (polybutylene terephthalate), 6-6Ny (6,6-nylon), etc. May be formed.
  • LCP liquid crystal polymer
  • PBT polybutylene terephthalate
  • 6-6Ny 6,6-nylon
  • the insulator 20 is formed on the conductive pattern 10, but a tape-like insulator is attached to the front and back surfaces of the conductive pattern, and the conductive pattern is sandwiched between the tape-like insulators. You may make it.
  • FIG. 14 is a diagram showing the press-processed conductive pattern 110.
  • the conductive pattern 110 has a mounting part 111, a contact part 112, a dividing part 113, an auxiliary part 115, and a hole 116.
  • the conductive pattern 110 has a coating region 118 that is a region for applying a fluorescent resin to the mounting portion 111 and the contact portion 112.
  • the application region 118 is formed by providing a step on the surface of the conductive pattern 110 by pressing.
  • a first insulating sheet 120 having an opening 119 exposing the application region 118 is attached to the surface of the conductive pattern 110, and the second insulating sheet shown in FIG. 122 is attached to the back surface of the conductive pattern 110.
  • the first insulating sheet 120 and the second insulating sheet 122 have an alignment hole 124 for fitting an alignment protrusion of the lens 140 (see FIG. 17) and an opening 126 for exposing the dividing portion 113, respectively. Is formed.
  • the dividing step the dividing portion 113 exposed from the opening 119 of the first insulating sheet 120 is divided (see FIG. 14).
  • the LED element mounting step the LED element 30 is mounted on the mounting portion 111.
  • the LED element 30 mounted on the mounting unit 111 is an LED element selected using the LED selection apparatus described in the above embodiment in the LED selection apparatus step.
  • a fluorescent resin in which a phosphor and a transparent resin are mixed at a predetermined mixing ratio is prepared, and the fluorescent resin is applied to the application region 118 formed in the conductive pattern 110 and cured in the fluorescent resin application process.
  • the hole 116 (see FIG. 14) formed in the auxiliary portion 115 is used as an alignment hole, and the alignment protrusion of the lens 140 is fitted into the hole 116 so that the lens 140 is fixed.
  • the LED package 150 is disposed on the LED element 30 on the light emitting direction side of the LED element 30 and the LED package 150 in which the plurality of LED elements 30 are mounted in a row as shown in FIG.
  • the first insulating sheet 120 functions as a reflector. For this reason, it is not necessary to attach a reflecting member for reflecting the LED light to the conductive pattern 110, and the LED package 150 can be reduced in weight.
  • a film-like insulator may be used instead of the tape-like insulator.
  • the opening 119 is not formed in advance in the insulator, but an opening for exposing the application region 118 of the conductive pattern 110 is formed after a tape-like or film-like insulator is disposed on the conductive pattern 110. May be.
  • the fluorescent resin mixed with the fluorescent material and the transparent resin is applied to the application region 118, but the fluorescent material and the transparent resin may be applied separately.
  • the phosphor is sealed by applying a transparent resin over the phosphor.
  • the emission color and color temperature of the LED light are adjusted by the phosphor, and the strength of the LED element 30 is reinforced by the transparent resin.
  • a fluorescent substance can be apply
  • a resin-like phosphor may be applied to the LED element 30, and a sheet-like phosphor sheet may be attached to the surface of the LED element 30 instead of applying the phosphor.

Abstract

This LED package has a plurality of LED elements mounted thereon, and is provided with: a conductive pattern that is formed by press working a metal sheet, and has mounting parts on which each of the plurality of LED elements are mounted, and contact parts that are in contact with each of the plurality of LED elements; and insulators that are fitted around the periphery of each of the plurality of LED elements, and have a holding section that holds the conductive pattern. The conductive pattern also has a decoupling section that decouples after the insulator has been fitted.

Description

ＬＥＤパッケージ及びＬＥＤパッケージの製造方法LED package and method for manufacturing LED package
　本発明は、複数のＬＥＤ(Light Emitting Diode)素子を搭載するＬＥＤパッケージ及びＬＥＤパッケージの製造方法に関するものである。 The present invention relates to an LED package on which a plurality of LED (Light Emitting Diode) elements are mounted and a method for manufacturing the LED package.
　従来、ＬＥＤ素子を搭載したＬＥＤパッケージは、テレビ受像機やパソコン等の液晶表示装置のバックライト等に用いられている。ＬＥＤパッケージは、ＬＥＤチップをＬＥＤパッケージ基板上に実装した構造を有しており、一般にＬＥＤパッケージの製造は、ＬＥＤチップメーカ及びバックライトメーカにより行なわれる。即ち、ＬＥＤチップメーカにおいて、リードフレーム上にＬＥＤ素子を実装し、リードフレームの周囲を縁体として機能する樹脂で覆い、ＬＥＤ素子上にレンズを配置してＬＥＤチップの製造を行い、その後バックライトメーカおいて、ＬＥＤチップを導電パターンが形成された絶縁体のＬＥＤパッケージ基板上に実装し、ＬＥＤチップ上にレンズを配置してＬＥＤパッケージの製造が行なわれている。なお、ＬＥＤチップの構造については、例えば特許文献１等に開示されている。 Conventionally, LED packages equipped with LED elements are used for backlights of liquid crystal display devices such as television receivers and personal computers. An LED package has a structure in which an LED chip is mounted on an LED package substrate. In general, an LED package is manufactured by an LED chip manufacturer and a backlight manufacturer. That is, an LED chip manufacturer mounts an LED element on a lead frame, covers the periphery of the lead frame with a resin that functions as an edge, arranges a lens on the LED element, and manufactures the LED chip. Manufacturers manufacture LED packages by mounting LED chips on an insulating LED package substrate on which a conductive pattern is formed, and disposing lenses on the LED chips. Note that the structure of the LED chip is disclosed in, for example, Patent Document 1 and the like.
特開２０１１－１７１５０８号公報JP 2011-171508 A
　ところで、ＬＥＤチップのリードフレームとＬＥＤパッケージ基板の導電パターン、ＬＥＤチップのリードフレームの周囲を覆う樹脂とＬＥＤパッケージ基板の絶縁体は、それぞれ同様の機能を有しているため、ＬＥＤチップとＬＥＤパッケージ基板とは、それぞれ同様の機能の構成を備えることとなり製造コストが増大していた。 By the way, the conductive pattern of the LED chip lead frame and the LED package substrate, the resin covering the periphery of the LED chip lead frame, and the insulator of the LED package substrate have the same functions. The substrate has the same functional configuration, and the manufacturing cost has been increased.
　またＬＥＤ素子から射出される光は直行性を有することから、光を拡散させるためのレズは不可欠であるが、従来のＬＥＤパッケージにおいては、ＬＥＤチップにレンズが備えられており、更にバックライトユニットを構成する際にはＬＥＤパッケージ上にも更にレンズを備える場合があった。また、ＬＥＤパッケージ上にレンズを備える場合には、ＬＥＤパッケージ基板に形成された位置合わせ用の孔を用いてレンズをＬＥＤパッケージ基板上へ配置しているが、ＬＥＤパッケージ基板に形成された位置合わせ用の孔は形成位置の精度が低いことから、レンズの配置位置調整に時間がかかり製造コストが増大していた。 In addition, since the light emitted from the LED element is orthogonal, a lesbian for diffusing the light is indispensable. However, in the conventional LED package, the LED chip is provided with a lens, and further, a backlight unit. In some cases, a lens is further provided on the LED package. When the lens is provided on the LED package, the lens is arranged on the LED package substrate using the alignment hole formed on the LED package substrate. However, the alignment formed on the LED package substrate is used. Since the accuracy of the formation position of the hole for use is low, it takes time to adjust the arrangement position of the lens, and the manufacturing cost is increased.
　またＬＥＤ素子は発光時に発熱することから、効率的に放熱を行なう必要があるが、従来のＬＥＤパッケージのＬＥＤパッケージ基板は、熱抵抗が大きいことから効率的な放熱を行うことが困難であった。 Further, since the LED element generates heat during light emission, it is necessary to efficiently dissipate heat. However, the LED package substrate of the conventional LED package has a large thermal resistance, and thus it is difficult to efficiently dissipate heat. .
　本発明の目的は、製造コストを低減したＬＥＤパッケージ及びＬＥＤパッケージの製造方法を提供することである。 An object of the present invention is to provide an LED package and a manufacturing method of the LED package with reduced manufacturing costs.
　複数のＬＥＤ素子が搭載されたＬＥＤパッケージであって、金属板をプレス加工することにより形成され複数の前記ＬＥＤ素子のそれぞれが搭載される搭載部及び複数の前記ＬＥＤ素子のそれぞれと接触する接触部を有する導電パターンと、複数の前記ＬＥＤ素子のそれぞれの周囲に装着され前記導電パターンを保持する保持部を有する絶縁体とを備え、前記導電パターンは、前記絶縁体が装着された後に分断された分断部を更に有することを特徴とする。 An LED package on which a plurality of LED elements are mounted, which is formed by pressing a metal plate, a mounting portion on which each of the plurality of LED elements is mounted, and a contact portion that contacts each of the plurality of LED elements And an insulator having a holding part that is mounted around each of the plurality of LED elements and holds the conductive pattern, and the conductive pattern is divided after the insulator is mounted It further has a parting part.
　また本発明のＬＥＤパッケージの製造方法は、複数のＬＥＤ素子が搭載されたＬＥＤパッケージの製造方法であって、金属板をプレス加工することにより複数の前記ＬＥＤ素子のそれぞれが搭載される搭載部、複数の前記ＬＥＤ素子のそれぞれと接触する接触部、及び分断予定の分断部を有する導電パターンを形成するプレス加工工程と、複数の前記ＬＥＤ素子のそれぞれの周囲に、前記導電パターンを保持する保持部を有する絶縁体を装着する装着工程と、前記分断部の分断を行なう分断工程と、複数の前記搭載部のそれぞれに複数の前記ＬＥＤ素子のそれぞれを搭載するＬＥＤ素子搭載工程とを含むことを特徴とする。 The LED package manufacturing method of the present invention is an LED package manufacturing method in which a plurality of LED elements are mounted, each of the plurality of LED elements being mounted by pressing a metal plate, A press working step for forming a conductive pattern having a contact portion in contact with each of the plurality of LED elements, and a division portion to be divided, and a holding portion for holding the conductive pattern around each of the plurality of LED elements A mounting step of mounting an insulator having a splitting step, a splitting step of splitting the splitting portion, and an LED element mounting step of mounting each of the plurality of LED elements on each of the mounting portions. And
　本発明によれば、製造コストを低減したＬＥＤパッケージ及びＬＥＤパッケージの製造方法を提供することができる。 According to the present invention, it is possible to provide an LED package with a reduced manufacturing cost and an LED package manufacturing method.
実施の形態に係る導電パターンの斜視図である。It is a perspective view of the conductive pattern which concerns on embodiment. 実施の形態に係る導電パターンを表面側から視た拡大斜視図である。It is the expansion perspective view which looked at the conductive pattern which concerns on embodiment from the surface side. 実施の形態に係る導電パターンを裏面側から視た拡大斜視図である。It is the expansion perspective view which looked at the conductive pattern which concerns on embodiment from the back surface side. 実施の形態に係る導電パターンに装着された絶縁体を表面側から視た斜視図である。It is the perspective view which looked at the insulator with which the electrically conductive pattern which concerns on embodiment was mounted | worn from the surface side. 実施の形態に係る導電パターンに装着された絶縁体を裏面側から視た斜視図である。It is the perspective view which looked at the insulator with which the conductive pattern which concerns on embodiment was mounted | worn from the back surface side. 実施の形態に係る分断部が分断された状態を示す図である。It is a figure which shows the state by which the parting part which concerns on embodiment was parted. 実施の形態に係る搭載部にＬＥＤ素子が搭載された状態を示す図である。It is a figure which shows the state by which the LED element was mounted in the mounting part which concerns on embodiment. 実施の形態に係る絶縁体に取付けられるレンズを示す図である。It is a figure which shows the lens attached to the insulator which concerns on embodiment. 実施の形態に係るＬＥＤパッケージを表面側から視た斜視図である。It is the perspective view which looked at the LED package which concerns on embodiment from the surface side. 実施の形態に係るＬＥＤパッケージを裏面側から視た斜視図である。It is the perspective view which looked at the LED package which concerns on embodiment from the back surface side. 実施の形態に係る導電パターンに取付けられる大型のレンズを示す図である。It is a figure which shows the large sized lens attached to the electrically conductive pattern which concerns on embodiment. 実施の形態に係る導電パターンに大型のレンズが取付けられた状態を示す図である。It is a figure which shows the state by which the large sized lens was attached to the electrically conductive pattern which concerns on embodiment. 実施の形態に係る大型のレンズが取付けられたＬＥＤパッケージの斜視図である。It is a perspective view of the LED package to which the large sized lens which concerns on embodiment was attached. 他の実施の形態に係る導電パターンを表面側から視た図である。It is the figure which looked at the conductive pattern which concerns on other embodiment from the surface side. 他の実施の形態に係る導電パターンの表面に貼付けられた絶縁シートを示す図である。It is a figure which shows the insulating sheet affixed on the surface of the conductive pattern which concerns on other embodiment. 他の実施の形態に係る導電パターンの裏面に貼付けられた絶縁シートを示す図である。It is a figure which shows the insulating sheet affixed on the back surface of the conductive pattern which concerns on other embodiment. 他の実施の形態に係るＬＥＤパッケージを表面側から視た図である。It is the figure which looked at the LED package which concerns on other embodiment from the surface side.
　以下、図面を参照して、本発明の実施の形態に係る複数個のＬＥＤ素子が搭載されたＬＥＤパッケージ及びＬＥＤパッケージの製造方法について説明する。 Hereinafter, an LED package on which a plurality of LED elements according to an embodiment of the present invention are mounted and a method for manufacturing the LED package will be described with reference to the drawings.
　ＬＥＤパッケージを製造する場合には、先ず導電パターンを形成する金属薄板を用意する。ここで金属薄板は、複数個のＬＥＤ素子を一列に搭載可能なように、所定の幅を有しＬＥＤ素子の配列方向に延びる形状を有している。導電パターン用金属薄板の金属材料としては、Ｃ５２１０等の銅合金や、Ｆｅ－Ｎｉ、Ｃｕ－Ｎｉ－Ｓｎ等の合金が用いられる。 When manufacturing an LED package, first, a thin metal plate for forming a conductive pattern is prepared. Here, the thin metal plate has a predetermined width and a shape extending in the arrangement direction of the LED elements so that a plurality of LED elements can be mounted in a row. As the metal material of the conductive pattern metal thin plate, a copper alloy such as C5210 or an alloy such as Fe—Ni or Cu—Ni—Sn is used.
　次に、金属薄板をプレス加工することにより立体的な形状を有する導電パターン１０を形成する（プレス加工工程）。金属薄板をプレス加工する際には、金属薄板を長手方向に送りながら金属薄板に金型で同一の形状を繰り返し形成する。なお、このプレス加工工程においては、導電パターン１０をプレス加工可能な形状で加工する。 Next, the conductive pattern 10 having a three-dimensional shape is formed by pressing a metal thin plate (pressing process). When pressing the metal thin plate, the same shape is repeatedly formed on the metal thin plate with a mold while feeding the metal thin plate in the longitudinal direction. In this pressing process, the conductive pattern 10 is processed into a shape that can be pressed.
　図１はプレス加工により形成された導電パターン１０の斜視図である。導電パターン１０は、複数のＬＥＤ素子３０（図７参照）のそれぞれが搭載される予定の搭載部１１、複数のＬＥＤ素子３０のそれぞれと接触する予定の接触部１２、絶縁体２０（図４、５参照）が装着された後に分断される予定の複数の分断部１３、分断部１３により接続されプレス加工時に金属薄板を長手方向に送る際に用いられた補助部１５を有している。ここで搭載部１１はＬＥＤ素子３０と接触する接触部、後述の絶縁体２０を保持する保持部としての役割も有する。また搭載部１１はベース側導電部（アノード電極部）としての役割を有し接触部１２は端子側導電部(カソード電極部)としての役割を有する。 FIG. 1 is a perspective view of a conductive pattern 10 formed by pressing. The conductive pattern 10 includes a mounting portion 11 on which each of the plurality of LED elements 30 (see FIG. 7) is to be mounted, a contact portion 12 on which each of the plurality of LED elements 30 is to contact, and an insulator 20 (see FIG. 4). 5), a plurality of dividing portions 13 that are to be divided after being mounted, and an auxiliary portion 15 that is connected by the dividing portions 13 and used for feeding the metal thin plate in the longitudinal direction during press working. Here, the mounting portion 11 also serves as a contact portion that comes into contact with the LED element 30 and a holding portion that holds an insulator 20 described later. The mounting portion 11 serves as a base-side conductive portion (anode electrode portion), and the contact portion 12 serves as a terminal-side conductive portion (cathode electrode portion).
　図２はプレス加工により形成された導電パターン１０の搭載部１１、接触部１２及び分断部１３を表面側から視た拡大斜視図であり、図３は、導電パターン１０の搭載部１１、接触部１２及び分断部１３を裏面側から視た拡大斜視図である。図２及び図３に示すようにプレス加工により形成された導電パターン１０の搭載部１１と接触部１２とは分断されている。また搭載部１１の周囲には搭載部１１の裏面側に突出した、４つのＬ字形状の伝熱部１４が形成されている。ここで伝熱部１４はＬ字形状に形成されていることから、搭載部１１に搭載されたＬＥＤ素子３０において発生した熱をバックシャーシ等の放熱部材に対して伝熱させる際に弾性体として機能し、伝熱部１４の先端部をバックシャーシ等の放熱部材に確実に接触させることができ、確実かつ効率的な放熱を行うことができる。 2 is an enlarged perspective view of the mounting portion 11, the contact portion 12, and the dividing portion 13 of the conductive pattern 10 formed by pressing, as viewed from the front side, and FIG. 3 is the mounting portion 11, the contact portion of the conductive pattern 10. It is the expansion perspective view which looked at 12 and the parting part 13 from the back surface side. As shown in FIGS. 2 and 3, the mounting portion 11 and the contact portion 12 of the conductive pattern 10 formed by pressing are divided. Further, around the mounting portion 11, four L-shaped heat transfer portions 14 protruding from the back surface side of the mounting portion 11 are formed. Here, since the heat transfer section 14 is formed in an L shape, the heat generated in the LED element 30 mounted on the mounting section 11 is transferred to the heat radiating member such as the back chassis as an elastic body. It functions, the tip part of heat transfer part 14 can be made to contact heat dissipation members, such as a back chassis, reliably, and reliable and efficient heat dissipation can be performed.
　次にプレス加工により形成された導電パターン１０の搭載部１１、接触部１２及び分断部１３を覆う位置に絶縁体２０が装着される（装着工程）。ここで絶縁体２０は、導電パターン１０間、導電パターン１０とバックシャーシ等の他の金属との絶縁を行なう。絶縁体２０の装着は、導電パターン１０上に絶縁体２０として機能する白樹脂を立体成型することにより行なう。白樹脂には、例えばシリカ及び酸化チタン等を含有したエポキシ樹脂またはシリコーン樹脂等が用いられる。 Next, the insulator 20 is mounted at a position covering the mounting portion 11, the contact portion 12, and the dividing portion 13 of the conductive pattern 10 formed by press working (mounting process). Here, the insulator 20 insulates between the conductive patterns 10 and between the conductive pattern 10 and another metal such as a back chassis. The insulator 20 is mounted by three-dimensionally molding a white resin that functions as the insulator 20 on the conductive pattern 10. As the white resin, for example, an epoxy resin or a silicone resin containing silica and titanium oxide is used.
　図４に示すように絶縁体２０は、矩形の平板形状を有しており、導電パターン１０を保持している。絶縁体２０には、搭載部１１及び接触部１２を露出させるための円筒状の開口部２１が形成され、更に分断部１３を露出させるための４つの矩形状の開口部２２が形成されている。従って、搭載部１１にＬＥＤ素子３０が搭載された場合には、絶縁体２０によりＬＥＤ素子３０の周囲が覆われることになる。ここで絶縁体２０は、白樹脂で形成されていることから円筒状の開口部２１の内壁面がリフレクター部２１ａ（図６、７参照）として機能し、ＬＥＤ素子３０から射出された光を発光方向側、即ちＬＥＤ素子３０の上方側に反射させる。 As shown in FIG. 4, the insulator 20 has a rectangular flat plate shape and holds the conductive pattern 10. The insulator 20 is formed with a cylindrical opening 21 for exposing the mounting portion 11 and the contact portion 12, and further four rectangular openings 22 for exposing the dividing portion 13. . Therefore, when the LED element 30 is mounted on the mounting portion 11, the periphery of the LED element 30 is covered with the insulator 20. Here, since the insulator 20 is formed of white resin, the inner wall surface of the cylindrical opening 21 functions as a reflector 21a (see FIGS. 6 and 7), and emits light emitted from the LED element 30. The light is reflected on the direction side, that is, on the upper side of the LED element 30.
　また図５に示すように絶縁体２０の裏面側の開口部２２に対応する位置に開口部２３が形成され、更に伝熱部１４を露出させる矩形状の開口部２４が形成されている。また絶縁体２０の裏面側の四隅には、完成したＬＥＤパッケージ５０（図９、１０参照）の位置決めを行なう際に用いられる位置決め部２５が形成されている。 Further, as shown in FIG. 5, an opening 23 is formed at a position corresponding to the opening 22 on the back side of the insulator 20, and a rectangular opening 24 that exposes the heat transfer section 14 is further formed. Further, positioning portions 25 used for positioning the completed LED package 50 (see FIGS. 9 and 10) are formed at the four corners on the back side of the insulator 20.
　次に、図６に示すように補助部１５と接続されている分断部１３の分断を行なう（分断工程）。これによりプレス加工により形成された導電パターン１０から不用な補助部１５が切断され、搭載部１１及び接触部１２を有する複数の導電パターン分割片が形成される。 Next, as shown in FIG. 6, the dividing portion 13 connected to the auxiliary portion 15 is divided (a dividing step). Thereby, the unnecessary auxiliary | assistant part 15 is cut | disconnected from the conductive pattern 10 formed by press work, and the some conductive pattern division | segmentation piece which has the mounting part 11 and the contact part 12 is formed.
　次に図７に示すように各導電パターン分割片の搭載部１１にＬＥＤ素子３０を載置しダイボンディングにより固定する（ＬＥＤ素子搭載工程）。ここで、搭載部１１に搭載されるＬＥＤ素子３０は、予め用意されたＬＥＤ素子群の中から図示しないＬＥＤ選別装置を用いて選別されたＬＥＤ素子である（ＬＥＤ素子選別工程）。ＬＥＤ素子選別工程の具体的な手順としては、ＬＥＤ選別装置により、まずＬＥＤ素子群に含まれるそれぞれのＬＥＤ素子の輝度、色調等を測定する。次に、測定結果に基づいて、テレビ受像機等のバックライトとして用いるのに適した輝度、色調等を有するＬＥＤ素子をＬＥＤ素子３０として選別する。 Next, as shown in FIG. 7, the LED element 30 is placed on the mounting portion 11 of each conductive pattern segment and fixed by die bonding (LED element mounting step). Here, the LED element 30 mounted on the mounting unit 11 is an LED element selected from an LED element group prepared in advance using an LED selection device (not shown) (LED element selection step). As a specific procedure of the LED element selection process, first, the brightness, color tone, and the like of each LED element included in the LED element group are measured by the LED selection apparatus. Next, based on the measurement result, LED elements having brightness, color tone, etc. suitable for use as a backlight of a television receiver or the like are selected as LED elements 30.
　次にＬＥＤ素子３０のアノード電極をワイヤーボンディングにより導電パターン分割片の搭載部１１に電気的に接続し、ＬＥＤ素子３０のカソード電極をワイヤーボンディングにより、隣接する導電パターン分割片の接触部１２に電気的に接続する。これにより各導電パターン分割片がＬＥＤ素子３０を介して電気的に接続される。 Next, the anode electrode of the LED element 30 is electrically connected to the conductive pattern divided piece mounting portion 11 by wire bonding, and the cathode electrode of the LED element 30 is electrically connected to the contact portion 12 of the adjacent conductive pattern divided piece by wire bonding. Connect. Thereby, each conductive pattern division piece is electrically connected via the LED element 30.
　次に、蛍光体及び透明樹脂を用意し、蛍光体と透明樹脂とを所定の混合比率で混合した蛍光樹脂を作成する。ここで、混合比率は、ＬＥＤ素子３０の特性を考慮して決定される。また、透明樹脂としては、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、アクリル樹脂、ポリカーボネート樹脂、ポリフタルアミド樹脂等を用いることができる。またこれらの樹脂を２種類以上混合した樹脂を用いてもよい。 Next, a phosphor and a transparent resin are prepared, and a phosphor resin is prepared by mixing the phosphor and the transparent resin at a predetermined mixing ratio. Here, the mixing ratio is determined in consideration of the characteristics of the LED element 30. As the transparent resin, an epoxy resin, a modified epoxy resin, a silicone resin, an acrylic resin, a polycarbonate resin, a polyphthalamide resin, or the like can be used. A resin obtained by mixing two or more of these resins may be used.
　次に、蛍光樹脂をＬＥＤ素子３０に塗布し易くするためのプライマー液をそれぞれのＬＥＤ素子３０に塗布する。次に、それぞれのＬＥＤ素子３０上の開口部２１内に所定量の蛍光樹脂を塗布し硬化させる（蛍光樹脂塗布工程）。 Next, a primer solution for easily applying the fluorescent resin to the LED elements 30 is applied to each LED element 30. Next, a predetermined amount of fluorescent resin is applied and cured in the openings 21 on the respective LED elements 30 (fluorescent resin application step).
　次に図８に示すように絶縁体２０に形成された開口部２２を位置合わせ用の孔として用い、レンズ４０の位置合わせ突起を開口部２２に嵌合させて、レンズ４０をＬＥＤ素子３０の発光方向側であるＬＥＤ素子３０の上部に配置する（レンズ配置工程）。これにより複数のＬＥＤ素子３０が一列に搭載されたＬＥＤパッケージ５０が完成する。 Next, as shown in FIG. 8, the opening 22 formed in the insulator 20 is used as an alignment hole, the alignment protrusion of the lens 40 is fitted into the opening 22, and the lens 40 is attached to the LED element 30. It arrange | positions at the upper part of the LED element 30 which is a light emission direction side (lens arrangement | positioning process). Thereby, the LED package 50 in which the plurality of LED elements 30 are mounted in a row is completed.
　図９は完成したＬＥＤパッケージ５０を表面側から視た斜視図、図１０はＬＥＤパッケージ５０を裏面側から視た斜視図である。図９及び図１０に示すように、ＬＥＤパッケージ５０には、複数のＬＥＤ素子３０が一列に搭載されている。従って、このＬＥＤパッケージ５０を、例えばテレビ受像機やパソコンの液晶表示装置等の裏面側または裏面側端部に配置することにより、そのままバックライトとして用いることができる。 FIG. 9 is a perspective view of the completed LED package 50 viewed from the front surface side, and FIG. 10 is a perspective view of the LED package 50 viewed from the back surface side. As shown in FIGS. 9 and 10, the LED package 50 has a plurality of LED elements 30 mounted in a row. Accordingly, the LED package 50 can be used as a backlight as it is by arranging it on the back side or the back side end of a liquid crystal display device of a television receiver or a personal computer, for example.
　この実施の形態に係るＬＥＤパッケージによれば、製造コストの低減を図ることができる。即ち、従来ＬＥＤチップをテレビ受像機等のバックライトとして用いる場合には、ＬＥＤチップをＬＥＤパッケージ基板に搭載して用いているが、ＬＥＤチップとＬＥＤパッケージ基板とは、それぞれ導電体や絶縁体を有していることから、ＬＥＤチップとＬＥＤパッケージ基板とは、それぞれ同様の機能の構成を重複して備えることとなり製造コストが増大していたが、この実施の形態に係るＬＥＤパッケージは、重複した構成を有さないことから製造コストの低減を図ることができる。また導電パターンを金属薄板のプレス加工により製造するため更に製造コストの低減を図ることができる。また、蛍光樹脂をＬＥＤ選別装置を用いて選別されたＬＥＤ素子３０に直接塗布することにより、蛍光樹脂に含まれる蛍光体によるＬＥＤ光の乱反射等を抑制することができ、ＬＥＤパッケージをバックライトとして用いた場合においてムラなくＬＥＤ光を発光させることができる。 The LED package according to this embodiment can reduce the manufacturing cost. That is, when the conventional LED chip is used as a backlight of a television receiver or the like, the LED chip is mounted on an LED package substrate, and the LED chip and the LED package substrate are each made of a conductor or an insulator. Therefore, the LED chip and the LED package substrate are provided with the same functional configuration redundantly, and the manufacturing cost is increased, but the LED package according to this embodiment is redundant. Since there is no configuration, the manufacturing cost can be reduced. Further, since the conductive pattern is manufactured by pressing a metal thin plate, the manufacturing cost can be further reduced. Further, by directly applying the fluorescent resin to the LED elements 30 selected using the LED sorting device, it is possible to suppress the irregular reflection of the LED light due to the phosphor contained in the fluorescent resin, and the LED package as a backlight. When used, LED light can be emitted without unevenness.
　また上述の実施の形態に係るＬＥＤパッケージの製造方法によれば、従来ＬＥＤチップメーカにおいて、リードフレーム上にＬＥＤ素子を実装し、リードフレームの周囲を縁体として機能する樹脂で覆い、ＬＥＤ素子上にレンズを配置してＬＥＤチップの製造を行い、その後バックライトメーカおいて、ＬＥＤチップを導電パターンが形成された絶縁体のＬＥＤパッケージ基板上に実装してＬＥＤパッケージの製造を行い、バックライトとして用いる場合には、ＬＥＤチップ上に更にレンズを配置していたが、この実施の形態によればバックライトとしてそのまま用いることができるＬＥＤパッケージの製造を一連の工程として実施することができるため、製造工程を削減することができＬＥＤパッケージの製造コストを低減させることができる。 Further, according to the LED package manufacturing method according to the above-described embodiment, in a conventional LED chip manufacturer, an LED element is mounted on a lead frame, and the periphery of the lead frame is covered with a resin that functions as an edge, The LED chip is manufactured by disposing the lens on the substrate, and then the backlight manufacturer manufactures the LED package by mounting the LED chip on the insulating LED package substrate on which the conductive pattern is formed. When used, a lens was further arranged on the LED chip. However, according to this embodiment, the LED package that can be used as it is as a backlight can be manufactured as a series of steps. The process can be reduced and the manufacturing cost of the LED package can be reduced. Kill.
　なお、上述の実施の形態においては、絶縁体２０の開口部２２をレンズ４０の位置合わせ用の孔として用いているが、図１１（ａ）に示すような大型のレンズ４２をＬＥＤ素子３０上に配置する場合には、図１１（ｂ）に示す導電パターン１０の補助部１５に形成されている孔１６を位置合わせ用の孔として用い、図１２に示すように、大型のレンズ４２の位置合わせ突起４３を孔１６に嵌合させて、大型のレンズ４２をＬＥＤ素子３０の発光方向側であるであるＬＥＤ素子３０の上部に配置する。これにより図１３に示す、大型のレンズ４２をＬＥＤ素子３０の発光方向側に配置したＬＥＤパッケージ６０が完成する。 In the above-described embodiment, the opening 22 of the insulator 20 is used as an alignment hole for the lens 40. However, a large lens 42 as shown in FIG. 11B, the hole 16 formed in the auxiliary portion 15 of the conductive pattern 10 shown in FIG. 11B is used as an alignment hole, and as shown in FIG. The alignment protrusion 43 is fitted into the hole 16, and the large lens 42 is disposed on the LED element 30 that is the light emitting direction side of the LED element 30. Thereby, the LED package 60 shown in FIG. 13 in which the large lens 42 is arranged on the light emitting direction side of the LED element 30 is completed.
　また上述の実施の形態においては、絶縁体２０の開口部２１の内壁にリフレクター部２１ａを形成しているが、プレス加工工程において導電パターン１０を立体形状に加工することにより、ＬＥＤ素子３０の発光方向側の周囲にＬＥＤ素子３０から射出された光を発光方向側に反射させるリフレクター部を形成するようにしてもよい。 Moreover, in the above-mentioned embodiment, although the reflector part 21a is formed in the inner wall of the opening part 21 of the insulator 20, the light emission of the LED element 30 is obtained by processing the conductive pattern 10 into a three-dimensional shape in the pressing process. You may make it form the reflector part which reflects the light inject | emitted from the LED element 30 to the light emission direction side around the direction side.
　また上述の実施の形態においては、伝熱部１４をＬ字状に形成することにより、伝熱部１４を弾性体として機能させているが、搭載部１１の裏面側にプレス加工により突出させて設けられた伝熱部１４の先端部に熱伝導性の樹脂を備えるようにしてもよい。これにより伝熱部１４の先端部をバックシャーシ等の放熱部材に更に確実に接触させることができ確実かつ効率的な放熱を行うことができる。 In the above-described embodiment, the heat transfer section 14 is formed in an L shape so that the heat transfer section 14 functions as an elastic body. However, the heat transfer section 14 protrudes from the back surface side of the mounting section 11 by pressing. You may make it equip the front-end | tip part of the provided heat-transfer part 14 with heat conductive resin. Thereby, the front-end | tip part of the heat-transfer part 14 can be made to contact further reliably to heat radiating members, such as a back chassis, and reliable and efficient heat dissipation can be performed.
　また、上述の実施の形態においては、ＬＥＤ素子３０を搭載部１１に搭載し、ＬＥＤ素子３０のアノード電極を搭載部１１に、カソード電極を隣接する導電パターン分割片の接触部１２にそれぞれワイヤーボンディングしているが、ＬＥＤ素子３０を接触部１２に搭載し、ＬＥＤ素子３０のアノード電極を接触部１２に、カソード電極を隣接する導電パターン分割片の搭載部１１にそれぞれワイヤーボンディングするようにしてもよい。 In the above-described embodiment, the LED element 30 is mounted on the mounting portion 11, the anode electrode of the LED element 30 is wire-bonded to the mounting portion 11, and the cathode electrode is wire-bonded to the contact portion 12 of the adjacent conductive pattern segment. However, the LED element 30 is mounted on the contact portion 12, and the anode electrode of the LED element 30 is wire-bonded to the contact portion 12, and the cathode electrode is wire-bonded to the mounting portion 11 of the adjacent conductive pattern segment. Good.
　また上述の実施の形態においては、リフレクター部２１ａがＬＥＤ素子３０を周囲から取り囲むように形成された円筒形状を有しているが、ＬＥＤ素子を周囲から取り囲むように配置され、ＬＥＤ素子３０から離れるに従って拡径する円錐形状を有していてもよい。 In the above-described embodiment, the reflector portion 21a has a cylindrical shape formed so as to surround the LED element 30 from the periphery, but is disposed so as to surround the LED element from the periphery, and is separated from the LED element 30. It may have a conical shape that expands according to the above.
　また上述の実施の形態においては、絶縁体２０を白樹脂により成形しているが、ＬＣＰ（液晶ポリマー）、ＰＢＴ（ポリブチレンテレフタレート）、６－６Ｎｙ（６，６－ナイロン）等の熱可塑性樹脂で形成してもよい。 In the above-described embodiment, the insulator 20 is formed of white resin, but thermoplastic resin such as LCP (liquid crystal polymer), PBT (polybutylene terephthalate), 6-6Ny (6,6-nylon), etc. May be formed.
　また上述の実施の形態においては、導電パターン１０上に絶縁体２０を成形しているが、導電パターンの表面及び裏面にテープ状の絶縁体を貼り付け、導電パターンをテープ状の絶縁体で挟むようにしてもよい。 In the above-described embodiment, the insulator 20 is formed on the conductive pattern 10, but a tape-like insulator is attached to the front and back surfaces of the conductive pattern, and the conductive pattern is sandwiched between the tape-like insulators. You may make it.
　この場合、まず金属薄板をプレス加工することにより導電パターンを形成する（プレス加工工程）。ここで、図１４は、プレス加工された導電パターン１１０を示す図である。導電パターン１１０は、搭載部１１１、接触部１１２、分断部１１３、補助部１１５、及び孔１１６を有している。また、導電パターン１１０は、搭載部１１１と接触部１１２に蛍光樹脂を塗布するための領域である塗布領域１１８を有している。なお、塗布領域１１８は、プレス加工により導電パターン１１０の表面に段差を設けることによって形成される。 In this case, a conductive pattern is first formed by pressing a thin metal plate (pressing process). Here, FIG. 14 is a diagram showing the press-processed conductive pattern 110. The conductive pattern 110 has a mounting part 111, a contact part 112, a dividing part 113, an auxiliary part 115, and a hole 116. In addition, the conductive pattern 110 has a coating region 118 that is a region for applying a fluorescent resin to the mounting portion 111 and the contact portion 112. The application region 118 is formed by providing a step on the surface of the conductive pattern 110 by pressing.
　次に、装着工程において、図１５に示すように、塗布領域１１８を露出させる開口部１１９が形成された第１絶縁シート１２０を導電パターン１１０の表面に貼り付け、図１６に示す第２絶縁シート１２２を導電パターン１１０の裏面に貼り付ける。なお、第１絶縁シート１２０及び第２絶縁シート１２２には、レンズ１４０（図１７参照）の位置合わせ用突起を嵌合させる位置合わせ用孔１２４、及び分断部１１３を露出させる開口部１２６がそれぞれ形成されている。 Next, in the mounting step, as shown in FIG. 15, a first insulating sheet 120 having an opening 119 exposing the application region 118 is attached to the surface of the conductive pattern 110, and the second insulating sheet shown in FIG. 122 is attached to the back surface of the conductive pattern 110. The first insulating sheet 120 and the second insulating sheet 122 have an alignment hole 124 for fitting an alignment protrusion of the lens 140 (see FIG. 17) and an opening 126 for exposing the dividing portion 113, respectively. Is formed.
　次に、分断工程において、第１絶縁シート１２０の開口部１１９から露出している分断部１１３を分断する（図１４参照）。次に、ＬＥＤ素子搭載工程において、ＬＥＤ素子３０を搭載部１１１に搭載する。ここで、搭載部１１１に搭載されるＬＥＤ素子３０は、ＬＥＤ選別装置工程において、上述の実施の形態で説明したＬＥＤ選別装置を用いて選別されたＬＥＤ素子である。 Next, in the dividing step, the dividing portion 113 exposed from the opening 119 of the first insulating sheet 120 is divided (see FIG. 14). Next, in the LED element mounting step, the LED element 30 is mounted on the mounting portion 111. Here, the LED element 30 mounted on the mounting unit 111 is an LED element selected using the LED selection apparatus described in the above embodiment in the LED selection apparatus step.
　次に、蛍光体と透明樹脂とを所定の混合比率で混合した蛍光樹脂を作成し、蛍光樹脂塗布工程において、導電パターン１１０に形成された塗布領域１１８に蛍光樹脂を塗布し硬化させる。次に、レンズ配置工程において、補助部１１５に形成されている孔１１６（図１４参照）を位置合わせ用の孔として用い、レンズ１４０の位置合わせ突起を孔１１６に嵌合させて、レンズ１４０をＬＥＤ素子３０の発光方向側であるＬＥＤ素子３０の上部に配置し、図１７に示すように、複数のＬＥＤ素子３０が一列に搭載されたＬＥＤパッケージ１５０を完成させる。 Next, a fluorescent resin in which a phosphor and a transparent resin are mixed at a predetermined mixing ratio is prepared, and the fluorescent resin is applied to the application region 118 formed in the conductive pattern 110 and cured in the fluorescent resin application process. Next, in the lens arrangement step, the hole 116 (see FIG. 14) formed in the auxiliary portion 115 is used as an alignment hole, and the alignment protrusion of the lens 140 is fitted into the hole 116 so that the lens 140 is fixed. The LED package 150 is disposed on the LED element 30 on the light emitting direction side of the LED element 30 and the LED package 150 in which the plurality of LED elements 30 are mounted in a row as shown in FIG.
　この場合、導電パターン１１０の表面に第１絶縁シート１２０を貼付けることにより、ＬＥＤ素子３０から射出され、レンズ１４０の内部で反射されたＬＥＤ光が更に第１絶縁シート１２０の表面で反射されるため、第１絶縁シート１２０がリフレクターとして機能する。このため、ＬＥＤ光を反射させるための反射部材を導電パターン１１０に取付ける必要がなく、ＬＥＤパッケージ１５０の軽量化を図ることができる。 In this case, by sticking the first insulating sheet 120 on the surface of the conductive pattern 110, the LED light emitted from the LED element 30 and reflected inside the lens 140 is further reflected on the surface of the first insulating sheet 120. Therefore, the first insulating sheet 120 functions as a reflector. For this reason, it is not necessary to attach a reflecting member for reflecting the LED light to the conductive pattern 110, and the LED package 150 can be reduced in weight.
　なおテープ状の絶縁体に代えてフィルム状の絶縁体を用いてもよい。また、絶縁体に予め開口部１１９を形成するのではなく、導電パターン１１０上にテープ状またはフィルム状の絶縁体を配置した後に、導電パターン１１０の塗布領域１１８を露出させるための開口部を形成してもよい。 A film-like insulator may be used instead of the tape-like insulator. In addition, the opening 119 is not formed in advance in the insulator, but an opening for exposing the application region 118 of the conductive pattern 110 is formed after a tape-like or film-like insulator is disposed on the conductive pattern 110. May be.
　また上述の各実施の形態の蛍光樹脂塗布工程においては、蛍光体と透明樹脂を混合した蛍光樹脂を塗布領域１１８に塗布しているが、蛍光体と透明樹脂を別々に塗布してもよい。例えば、それぞれのＬＥＤ素子３０に塗布されたプライマー液の上に蛍光体を塗布した後、蛍光体の上に重ねて透明樹脂を塗布して蛍光体を封止する。この場合、蛍光体によってＬＥＤ光の発光色や色温度等が調整され、透明樹脂によってＬＥＤ素子３０の強度が補強される。これにより、蛍光樹脂を塗布する場合よりも薄く蛍光体を塗布することができ、上述の実施の形態のＬＥＤパッケージ５０よりも効果的にＬＥＤ光の乱反射等を抑制することができる。 In the fluorescent resin application process of each of the above-described embodiments, the fluorescent resin mixed with the fluorescent material and the transparent resin is applied to the application region 118, but the fluorescent material and the transparent resin may be applied separately. For example, after applying a phosphor on the primer solution applied to each LED element 30, the phosphor is sealed by applying a transparent resin over the phosphor. In this case, the emission color and color temperature of the LED light are adjusted by the phosphor, and the strength of the LED element 30 is reinforced by the transparent resin. Thereby, a fluorescent substance can be apply | coated thinner than the case where a fluorescent resin is apply | coated, and irregular reflection of LED light etc. can be suppressed more effectively than the LED package 50 of the above-mentioned embodiment.
　なお、この場合、樹脂状の蛍光体をＬＥＤ素子３０に塗布してもよく、蛍光体を塗布することに代えてＬＥＤ素子３０の表面にシート状の蛍光シートを貼付けてもよい。 In this case, a resin-like phosphor may be applied to the LED element 30, and a sheet-like phosphor sheet may be attached to the surface of the LED element 30 instead of applying the phosphor.
　１０…導電パターン、１１…搭載部、１２…接続部、１３…分断部、１４…伝熱部、２０…絶縁体、２１，２２，２３，２４…開口部、２５…位置決め部、３０…ＬＥＤ素子、４０，４２…レンズ、５０，６０…ＬＥＤパッケージ DESCRIPTION OF SYMBOLS 10 ... Conductive pattern, 11 ... Mounting part, 12 ... Connection part, 13 ... Dividing part, 14 ... Heat-transfer part, 20 ... Insulator, 21, 22, 23, 24 ... Opening part, 25 ... Positioning part, 30 ... LED Element, 40, 42 ... lens, 50, 60 ... LED package

Claims (24)

  1. 　複数のＬＥＤ素子が搭載されたＬＥＤパッケージであって、
    　金属板をプレス加工することにより形成され複数の前記ＬＥＤ素子のそれぞれが搭載される搭載部及び複数の前記ＬＥＤ素子のそれぞれと接触する接触部を有する導電パターンと、
    　複数の前記ＬＥＤ素子のそれぞれの周囲に装着され前記導電パターンを保持する保持部を有する絶縁体と
    を備え、
    　前記導電パターンは、前記絶縁体が装着された後に分断された分断部を更に有することを特徴とするＬＥＤパッケージ。     An LED package having a plurality of LED elements mounted thereon,
    A conductive pattern formed by pressing a metal plate and having a mounting portion on which each of the plurality of LED elements is mounted and a contact portion in contact with each of the plurality of LED elements;
    An insulator having a holding part that is mounted around each of the plurality of LED elements and holds the conductive pattern;
    The LED package according to claim 1, wherein the conductive pattern further includes a divided portion that is divided after the insulator is attached.
  2. 　複数の前記ＬＥＤ素子は、所定の選別装置によって予め選別されたＬＥＤ素子であり、
    　前記導電パターンは、前記搭載部と前記接触部を含む領域に、複数の前記ＬＥＤ素子のそれぞれが搭載された後に蛍光体と封止樹脂が付加される付加領域を更に有することを特徴とする請求項１記載のＬＥＤパッケージ。     The plurality of LED elements are LED elements preliminarily sorted by a predetermined sorting device,
    The conductive pattern further includes an additional region to which a phosphor and a sealing resin are added after each of the plurality of LED elements is mounted in a region including the mounting portion and the contact portion. Item 1. The LED package according to Item 1.
  3. 　前記絶縁体は、前記導電パターン上に絶縁性を有する樹脂を立体成型して装着されることを特徴とする請求項１または２記載のＬＥＤパッケージ。 3. The LED package according to claim 1, wherein the insulator is mounted by three-dimensionally molding an insulating resin on the conductive pattern.
  4. 　前記絶縁体には、前記付加領域を露出させる開口部が形成されることを特徴とする請求項３記載のＬＥＤパッケージ。 4. The LED package according to claim 3, wherein an opening for exposing the additional region is formed in the insulator.
  5. 　前記絶縁体は、前記ＬＥＤ素子が搭載される方向に延びるシート状の絶縁体であり、前記導電パターンの表面に貼付けられる第１絶縁シート、及び前記導電パターンの裏面に貼付けられる第２絶縁シートを含むことを特徴とする請求項１または２記載のＬＥＤパッケージ。 The insulator is a sheet-like insulator extending in a direction in which the LED element is mounted, and includes a first insulating sheet that is attached to the surface of the conductive pattern, and a second insulating sheet that is attached to the back surface of the conductive pattern. The LED package according to claim 1 or 2, further comprising:
  6. 　前記第１絶縁シートには、前記付加領域を露出させる開口部が形成されることを特徴とする請求項５記載のＬＥＤパッケージ。 6. The LED package according to claim 5, wherein an opening for exposing the additional region is formed in the first insulating sheet.
  7. 　前記付加領域は、前記導電パターンの表面側に段差を設けることによって形成されていることを特徴とする請求項６記載のＬＥＤパッケージ。 The LED package according to claim 6, wherein the additional region is formed by providing a step on the surface side of the conductive pattern.
  8. 　前記ＬＥＤ素子の発光方向側に配置されたレンズを備え、
    　前記導電パターンは、前記レンズとの位置合わせを行う位置合わせ部を有し、
    　前記レンズは前記位置合わせ部を用いて配置されていることを特徴とする請求項１～７の何れか一項に記載のＬＥＤパッケージ。     A lens disposed on the light emitting direction side of the LED element;
    The conductive pattern has an alignment portion that aligns with the lens,
    The LED package according to any one of claims 1 to 7, wherein the lens is disposed using the alignment portion.
  9. 　前記導電パターンは、前記搭載部の裏面側に突出して形成され、放熱部材に対して伝熱を行なう伝熱部を備えることを特徴とする請求項１～４の何れか一項に記載のＬＥＤパッケージ。 The LED according to any one of claims 1 to 4, wherein the conductive pattern includes a heat transfer portion that protrudes from a back surface side of the mounting portion and performs heat transfer to a heat radiating member. package.
  10. 　前記伝熱部は弾性体により形成されていることを特徴とする請求項９記載のＬＥＤパッケージ。 The LED package according to claim 9, wherein the heat transfer portion is formed of an elastic body.
  11. 　前記ＬＥＤ素子の発光方向側の周囲に前記ＬＥＤ素子から射出された光を前記発光方向側に反射させるリフレクター部を備えることを特徴とする請求項１～１０の何れか一項に記載のＬＥＤパッケージ。 The LED package according to any one of claims 1 to 10, further comprising a reflector that reflects light emitted from the LED element toward the light emitting direction side around the light emitting direction side of the LED element. .
  12. 　前記絶縁体は、該ＬＥＤパッケージの位置決めを行なう位置決め部を備えることを特徴とする請求項１～４の何れか一項に記載のＬＥＤパッケージ。 5. The LED package according to claim 1, wherein the insulator includes a positioning portion that positions the LED package.
  13. 　複数のＬＥＤ素子が搭載されたＬＥＤパッケージの製造方法であって、
    　金属板をプレス加工することにより複数の前記ＬＥＤ素子のそれぞれが搭載される搭載部、複数の前記ＬＥＤ素子のそれぞれと接触する接触部、及び分断予定の分断部を有する導電パターンを形成するプレス加工工程と、
    　複数の前記ＬＥＤ素子のそれぞれの周囲に、前記導電パターンを保持する保持部を有する絶縁体を装着する装着工程と、
    　前記分断部の分断を行なう分断工程と、
    　複数の前記搭載部のそれぞれに複数の前記ＬＥＤ素子のそれぞれを搭載するＬＥＤ素子搭載工程と
    を含むことを特徴とするＬＥＤパッケージの製造方法。     A method of manufacturing an LED package having a plurality of LED elements mounted thereon,
    Press working to form a conductive pattern having a mounting portion on which each of the plurality of LED elements is mounted, a contact portion in contact with each of the plurality of LED elements, and a part to be divided by pressing a metal plate Process,
    A mounting step of mounting an insulator having a holding portion that holds the conductive pattern around each of the plurality of LED elements;
    A dividing step of dividing the divided portion;
    And a LED element mounting step of mounting each of the plurality of LED elements on each of the plurality of mounting portions.
  14. 　複数のＬＥＤ素子の中から、前記ＬＥＤ素子搭載工程において前記搭載部に搭載するＬＥＤ素子を選別するＬＥＤ素子選別工程と、
    　前記ＬＥＤ素子搭載工程の後に、複数の前記ＬＥＤ素子に蛍光体と封止樹脂を付加する付加工程を更に含むことを特徴とする請求項１３記載のＬＥＤパッケージの製造方法。     Among a plurality of LED elements, an LED element sorting step for sorting LED elements to be mounted on the mounting portion in the LED element mounting step;
    14. The method of manufacturing an LED package according to claim 13, further comprising an additional step of adding a phosphor and a sealing resin to the plurality of LED elements after the LED element mounting step.
  15. 　前記装着工程において、前記絶縁体は、前記導電パターン上に絶縁性を有する樹脂を立体成型して装着されることを特徴とする請求項１３または１４記載のＬＥＤパッケージの製造方法。 15. The method of manufacturing an LED package according to claim 13, wherein in the mounting step, the insulator is mounted by three-dimensionally molding an insulating resin on the conductive pattern.
  16. 　前記絶縁体には、前記蛍光体と前記封止樹脂が付加される付加領域を露出させる開口部が形成され、
    　前記付加領域には、前記搭載部と前記接触部が含まれることを特徴とする請求項１５記載のＬＥＤパッケージの製造方法。     The insulator is formed with an opening that exposes an additional region to which the phosphor and the sealing resin are added,
    16. The method of manufacturing an LED package according to claim 15, wherein the additional region includes the mounting portion and the contact portion.
  17. 　前記絶縁体は、前記ＬＥＤ素子が搭載される方向に延びる第１絶縁シートと第２絶縁シートとを含み、
    　前記装着工程は、前記導電パターンの表面に前記第１絶縁シートを貼付ける第１絶縁シート貼付工程、及び前記導電パターンの裏面に前記第２絶縁シートを貼付ける第２絶縁シート貼付工程を含むことを特徴とする請求項１３または１４記載のＬＥＤパッケージの製造方法。     The insulator includes a first insulating sheet and a second insulating sheet extending in a direction in which the LED element is mounted,
    The mounting step includes a first insulating sheet sticking step for sticking the first insulating sheet to the surface of the conductive pattern, and a second insulating sheet sticking step for sticking the second insulating sheet to the back surface of the conductive pattern. 15. The method of manufacturing an LED package according to claim 13 or 14.
  18. 　前記第１絶縁シートには、前記蛍光体と前記封止樹脂が付加される付加領域を露出させる開口部が形成され、
    　前記付加領域には、前記搭載部と前記接触部が含まれることを特徴とする請求項１７記載のＬＥＤパッケージの製造方法。     The first insulating sheet is formed with an opening that exposes an additional region to which the phosphor and the sealing resin are added,
    18. The method of manufacturing an LED package according to claim 17, wherein the additional region includes the mounting portion and the contact portion.
  19. 　前記プレス加工工程において、前記導電パターンの表面側に段差を設けることによって前記付加領域を形成することを特徴とする請求項１８記載のＬＥＤパッケージの製造方法。 19. The method of manufacturing an LED package according to claim 18, wherein, in the pressing process, the additional region is formed by providing a step on the surface side of the conductive pattern.
  20. 　前記ＬＥＤ素子の発光方向側に前記レンズを配置する配置工程を更に含み、
    　前記プレス加工工程において、前記導電パターンに前記レンズとの位置合わせを行う位置合わせ部を形成し、
    　前記配置工程において、前記位置合わせ部を用いて前記レンズの配置を行なうことを特徴とする請求項１３～１９の何れか一項に記載のＬＥＤパッケージの製造方法。     Further comprising an arrangement step of arranging the lens on the light emitting direction side of the LED element;
    In the pressing process, forming an alignment portion for aligning the lens with the conductive pattern,
    The method of manufacturing an LED package according to any one of claims 13 to 19, wherein, in the arranging step, the lens is arranged using the alignment portion.
  21. 　前記プレス加工工程において、前記導電パターンに前記搭載部の裏面側に突出し放熱部材に対して伝熱を行なう伝熱部を形成することを特徴とする請求項１３～１６の何れか一項に記載のＬＥＤパッケージの製造方法。 A heat transfer portion that protrudes on the back surface side of the mounting portion and transfers heat to a heat radiating member is formed in the conductive pattern in the press working step. LED package manufacturing method.
  22. 　前記伝熱部は弾性体により形成されていることを特徴とする請求項２１記載のＬＥＤパッケージの製造方法。 The LED package manufacturing method according to claim 21, wherein the heat transfer section is formed of an elastic body.
  23. 　前記プレス加工工程において、前記導電パターンに前記ＬＥＤ素子の発光方向側の周囲に前記ＬＥＤ素子から射出された光を前記発光方向側に反射させるリフレクター部を形成することを特徴とする請求項１３～１６の何れか一項に記載のＬＥＤパッケージの製造方法。 In the press working step, a reflector portion that reflects light emitted from the LED element to the light emitting direction side is formed around the light emitting direction side of the LED element in the conductive pattern. The manufacturing method of the LED package as described in any one of 16.
  24. 　前記絶縁体は、該ＬＥＤパッケージの位置決めを行なう位置決め部を備えることを特徴とする請求項１３～１６の何れか一項に記載のＬＥＤパッケージの製造方法。 The LED package manufacturing method according to any one of claims 13 to 16, wherein the insulator includes a positioning portion for positioning the LED package.
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